KR100707878B1 - Vertical probe card - Google Patents

Abstract

The present invention relates to a vertical probe card, and more particularly, to a probe card capable of inspecting 8 "to 12" wafers at a time.

In the vertical probe card according to the present invention, the probe block bars are respectively mounted in a plurality of mounting holes formed in the main body having a wafer-like shape.

An upper probe block and a lower probe block are interposed in the mounting hole, and insertion holes are formed at positions where the upper probe block and the lower probe block are vertically inconsistent, and a probe having a lower end vertically contacting the electrode pad of the wafer is inserted. Is supported, the probe block bar is made of a structure in which the upper probe block is fixed by a cover located on the upper surface of the main body,

The upper surface of the cover and the upper probe block is characterized in that the PCB is electrically connected to the upper end of the probe to supply a test signal to the probe.

Vertical probe card, double bent, wafer

Description

Vertical Probe Card {Vertical Probe Card}

1 is a cross-sectional view showing a cantilever probe card according to the prior art,

2 is a plan view of a vertical probe card according to an embodiment of the present invention;

3 is a cross-sectional view taken along line AA ′ of FIG. 2;

4 is an enlarged view of the probe shown in FIG. 2;

<Description of the symbols for the main parts of the drawings>

10: probe card 12: fastening member

14: Probe block bar 16: Mounting hole

20: PCB 30: upper probe block

34, 44: insertion hole 40: lower probe block

50: cover 60: main body

70: probe 80: wafer

92: first space 94: second space

The present invention relates to a vertical probe card, and more particularly to a probe card capable of inspecting 8 "-12" wafers at a time.

In general, in the process of manufacturing a semiconductor integrated circuit device such as a memory device, a non-memory device, or a logic device, each chip is manufactured on a wafer, and then each chip is cut before the chips of the wafer are cut into each chip. Wafer tests are performed to determine if they are good or bad.

In other words, the semiconductor chip manufactured in a wafer state is an electrical tester that inspects electrical characteristics before assembling into a semiconductor package constituting a liquid crystal display (LCD) or a plasma display panel (PDP). Electrical Die Sorting (EDS) (hereinafter referred to as "EDS") inspection is performed.

As a result of the inspection, the semiconductor chips of good products are sent to the assembling process in which the good quality semiconductor chips are assembled into a liquid crystal display device or a semiconductor package and used as parts, and the semiconductor chips determined to be defective are disposed of without being sent to the assembly process. .

The EDS uses a prober station equipped with a probe card for electrically contacting a tester in which various measuring devices are built into a computer and a unit semiconductor chip of a wafer under test. In this case, the probe card may include a pad and a tester of the semiconductor chip to inspect the characteristics of the fine patterns and electrodes of the semiconductor chip on the wafer during the manufacturing process of the semiconductor device. It is a means used as an intermediate medium to connect.

According to the purpose of use, a plurality of probe cards are used at the same time, each probe of the probe card is in direct contact with the pads of the semiconductor chip, the electronic equipment such as a monitor or oscilloscope connected to the circuit by the characteristics of the electrical function of the semiconductor chip Appears on the screen, the inspector checks it and determines whether the semiconductor chip is defective.

As an example of a conventional cantilever type probe card using such a probe, a tungsten probe 5 is radially disposed at an opening 3 of a printed circuit board 1 as shown in FIG. 1. The probe 5 is provided in the form of a cantilever on the bottom of the printed circuit board 1.

In addition, a contact portion for connecting a connector (not shown) provided at the end of the printed circuit board 1 is connected to the base of the probe 5 via interconnection wiring.

The probe card of FIG. 1 can measure 32 pads at the same time using the pro part 5, but there is a limited space for the contactor configuration, so that the entire chips of the wafer cannot be tested all at once and many times. The test must be split over, which leads to high test time and cost per wafer.

In addition, the conventional cantilever-type probe card has a problem that it is not easy to replace the probe due to damage and wear.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and can test any type of wafer at a time by inserting a probe after machining an insertion hole by a drill 1: 1 with a test pad of a chip formed on a wafer in an insulator. The aim is to provide a vertical probe card that can reduce test time and cost per wafer.

Another object of the present invention is to provide a vertical probe card which can minimize the damage of the chip pad by contacting the probe vertically to the chip pad of the wafer, and anyone can easily replace the probe due to damage and wear. .

Vertical probe card according to an embodiment of the present invention for achieving the above object, the bar is mounted in each of a plurality of mounting holes formed in the main body of the wafer-like shape,

The upper probe block and the lower probe block are interposed therebetween, and insertion holes are formed at vertically inconsistent positions of the upper probe block and the lower probe block so that a probe having a lower end vertically contacting the electrode pad of the wafer is inserted and supported. The upper probe block is fixed by a cover located on an upper surface of the main body to form the probe block bar.

The upper surface of the cover and the upper probe block is characterized in that the PCB is electrically connected to the upper end of the probe to supply a test signal to the probe.

Hereinafter, the configuration and operation of the present invention will be described with reference to the accompanying drawings.

2 is a plan view of a vertical probe card according to an exemplary embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line AA ′ of FIG. 2.

As shown, the vertical probe card 10 according to the present invention is a PCB 20, the upper probe block 30, the lower probe block 40, the main body 60, the probe 70 and the cover 50 It is configured to include).

A mounting hole 16 is formed in the main body 60 made of an insulator made of machineable ceramic or engineering plastic material, and the mounting block 16 is equipped with a probe block bar 14 and the main body by the fastening member 12. 60 is fastened.

The PCB 20 supplies an inspection signal to the probe 70, and an integrated circuit (IC) for controlling the inspection signal supplied to the probe 70 is mounted.

The probe block bar 14 includes a cover 50 positioned at an upper portion of the main body 60 with an upper probe block 30 and a lower probe block 40 interposed between the mounting holes 16 formed in the main body 60. It is fixed by).

The upper probe block 30, the lower probe block 40, and the cover 50 are made of an insulator made of ceramic or engineering plastic material, such as the main body 60.

The upper probe block 30 is positioned below the PCB 20, and insertion holes 34 are formed at both sides of the upper part, so that the upper part of the probe 70 is inserted into and supported in the insertion hole 34. Electrically connected with 20.

The lower probe block 40 positioned below the upper probe block 30 has insertion holes 44 formed at both sides thereof, and the lower portion of the probe 70 is inserted into and supported by the insertion hole 44.

At this time, the insertion hole 34 of the upper probe block 30 is formed inside the insertion hole 44 of the lower probe block 40 so that the probe 70 inserted into the insertion holes 34 and 44 is located at the inside of the upper part. It should be bent to the outside of the lower part.

Thus, the upper probe block 30 and the lower probe block 40 in which the probe 70 is inserted are inserted into the mounting holes 16 formed in the main body 60, and the lower probe block 40 is the main body. In the state of contact with the inner surface of the 30, the upper probe block 30 is pressed inward by the cover 50 is fixed.

In this case, a first space 92 and a second space 94 are formed based on the lower probe block 40. In the first space 92, upper and bent portions of the probe 70 are formed in the second space ( The lower portion of the probe 70 is located at 94, and the upper side of the upper probe block 30 and the cover 50 is a PCB 20 for supplying a test signal to the probe 70.

In the first space 92 and the second space 4, a support film (not shown) of an insulator such as a polyethylene film may be interposed, and an insertion hole may be formed in the support film to insert and support the probe.

The wafer 80, which is a test object, is positioned under the probe card 10 so that the unit semiconductor chip of the wafer 80 and the lower end of the probe 70 are electrically contacted with each other.

4 is an enlarged view of the probe shown in FIG. 2.

As shown in FIG. 4, the probe 70 according to the present invention bends a fine line of 60 μm or less in double, so that the upper vertical portion 72 and the middle bent portion 74 and the lower vertical portion are bent. It is configured to be separated into (76), wherein the angle (θ) bent at this time is preferably 90 ~ 150 °.

The insulator such as ceramic or engineering plastic, that is, the lower probe block 40 is drilled to be in the same position as that of the electrode pad formed on the wafer 80 to be inspected, and the insertion hole 44 is drilled. The probe 70 is inserted into the hole 44 to inspect the wafer 80.

As a result, the probe 70 is bent in double so that the vertical portion 72 of the upper portion is inserted into the upper probe block 30 after the upper end of the probe 70 is electrically connected to the PCB 20 and is supported. The bent portion 74 is located in the first space 92, and the lower vertical portion 76 protrudes into the second space 94 after being inserted into the lower probe block 40.

In the configuration of the probe card 10 described above, the probe 80 of the probe card 10 is perpendicular to the electrode pad of the wafer 80 because the wafer 80 to be inspected is raised or the probe card 10 is lowered. Contact is made.

When a difference in height occurs between the plurality of probes 70 provided in the probe card 10 or a thickness difference between the electrode pads formed on the wafer 10 is not constant, some of the probes 70 may be electrode pads. Cannot be contacted.

In order to prevent this, the wafer 80 causes the probe 70 of the probe card 10 to be pressed, and the double bent probe 70 is deformed by pressing so that the probe 70 is applied to the wafer 10. By being in full contact, the characteristics of the electrical function of the semiconductor chip can be examined.

In the above inspection, the lower probe block 30 drills the insertion hole 44 at the same position as the electrode pad formed on the wafer 80 to be inspected and drills the insertion hole 44, and the probe 70 is inserted into the insertion hole 44. By inspecting the wafer 80 by inserting the wafer 80, any type of wafer 80 can be tested at a time, and test time and cost per wafer can be reduced.

In addition, when the probe 70 needs to be replaced due to damage and wear of the probe 70, anyone can easily replace the probe 70 by detaching the probe block bar 14 from the mounting hole 16.

As described above, according to the present invention, any type of wafer can be tested at one time by inserting a probe after machining an insertion hole formed by a drill 1: 1 with the test electrode pad of the chip formed on the wafer in the insulator. Reduce test time and costs.

In addition, since the probe is vertically contacted with the electrode pad of the wafer, damage of the chip pad can be minimized and anyone can easily replace the probe due to damage and wear.

Claims (3)

Probe block bars 14 are each mounted in a plurality of mounting holes 16 formed in the main body 60 of the wafer-like shape, An upper probe block 30 and a lower probe block 40 are interposed in the mounting hole 16, and insertion holes 34 and 44 are formed in the upper probe block 30 and the lower probe block 40, respectively. And a probe 70 having a lower end vertically contacted with an electrode pad of the wafer 80 is inserted and supported, and the upper probe block 30 is fixed by a cover 50 positioned on an upper surface of the main body 60. As the probe block bar 14 is made, Vertical probes, characterized in that the upper surface of the cover 50 and the upper probe block 30 is a PCB 20 electrically connected to the upper end of the probe 70 to supply a test signal to the probe 70 Card. The method of claim 1, The probe 70 is configured to be bent into a micro fine line in a double to be separated into a vertical portion 72 of the upper portion, a bending portion 74 and the vertical portion 76 of the lower portion, the bending angle is 90 ~ 150 Vertical probe card, characterized in that °. The method according to claim 1 or 2, The insertion hole 44 formed in the lower probe block 40 is drilled to be in the same position as the electrode pad of the wafer 80 and the lower portion of the probe 70 is inserted into the insertion hole 44. Vertical probe card.

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