TWI472771B - Probe card and welding methond thereof - Google Patents

Description

Probe card and welding method thereof

The present invention relates to a detecting device and a method of manufacturing the same, and more particularly to a probe card and a welding method therefor.

The electrical testing of an integrated circuit chip (IC chip) is quite important in all stages of the semiconductor process. Each IC wafer must be tested in both wafer and package form to ensure its electrical function.

The wafer test is to make the test machine and the probe card form a test loop, and the probe on the probe card is directly in contact with the pad or bump on the wafer. The probe is used to detect each wafer on the wafer, thereby extracting the wafer signal, and sending the wafer signal data to the testing machine for analysis and judgment. In this way, the electrically and functionally defective wafer can be filtered out before the packaging step to avoid an increase in defective products and increase the package manufacturing cost.

As the integration of semiconductor processes and packages increases, so does the requirement for the accumulation of probe cards. That is to say, future probe cards must increase the number of probes and the number of components on the printed circuit board without changing the size of the printed circuit board. Therefore, how to effectively use the space of printed circuit boards will be an important issue in probe card technology.

The invention provides a probe card, which can effectively improve the integration of the probe and the component.

The invention provides a welding method of a probe card, which can effectively reduce the complexity of the process.

The invention provides a probe card comprising a substrate, a solder pad, a probe and an element. The pad is disposed in the substrate, the pad has a through hole, and the through hole penetrates the pad. The probe passes through the through hole, and the portion of the probe bit in the through hole is insulated from the pad. The component is connected to the pad and the probe, and the length direction of the component is parallel to the vertical direction of the substrate.

According to an embodiment of the invention, in the probe card described above, the bonding pad may extend onto the surface of the substrate.

According to an embodiment of the invention, in the probe card, an insulating sleeve is further included, and the insulating sleeve is disposed in the through hole. The probe passes through the insulating sleeve such that the portion of the probe bit in the through hole is insulated from the pad.

According to an embodiment of the invention, in the probe card described above, the connection between the component and the pad and the probe is, for example, soldering.

According to an embodiment of the invention, in the probe card described above, the component is, for example, a passive component, and the passive component is, for example, a resistor, a capacitor or an inductor.

According to an embodiment of the invention, in the probe card described above, the substrate is, for example, a printed circuit board.

According to an embodiment of the invention, in the probe card described above, the material of the probe is, for example, tungsten, tantalum, beryllium copper alloy, gold, silver or platinum.

The invention provides a welding method of a probe card. Providing a substrate There are solder pads in the middle. The pad has a through hole through which the through hole passes. The probe is passed through the through hole and the portion of the probe in the through hole is insulated from the pad. The component is soldered to the pad and the probe, and the length direction of the component is parallel to the vertical direction of the substrate.

According to an embodiment of the invention, in the soldering method of the probe card described above, the bonding pad may extend onto the surface of the substrate.

According to an embodiment of the present invention, in the soldering method of the probe card, the step of insulating the portion of the probe in the through hole from the bonding pad includes disposing the insulating sleeve in the through hole, and The probe passes through the insulating sleeve.

Based on the above, in the probe card of the present invention, since the components are connected to the pads, and the probes are connected to the same pad by the components, the number and configuration of the pads to be used can be reduced. area. Therefore, in the case where the substrate size is constant, the degree of integration of the probe and the component can be improved, and the design flexibility is better.

In addition, since the probe card of the present invention is soldered by connecting the components to the pads, and the probes are connected to the same pad by the components, the number of times of soldering can be greatly reduced, thereby effectively reducing the number of solders. Process complexity.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a cross-sectional view of a probe card in accordance with an embodiment of the present invention.

Referring to FIG. 1 , the probe card 10 includes a substrate 100 , a solder pad 102 , and a probe Needle 106 and element 108. The substrate 100 is, for example, a printed circuit board.

The pad 102 is disposed in the substrate 100, and the pad 102 has a through hole 104 through which the through hole 104 passes. The material of the pad 102 is, for example, aluminum or copper. Pad 102 is formed in substrate 100, for example, by electroplating or other suitable method. In addition, the pad 102 may extend onto the surface of the substrate 100 such that the pad 102 may cover a portion of the surface of the substrate 100, although the invention is not limited thereto. In other embodiments, the pad 102 may also be disposed only in the substrate 100.

The probe 106 passes through the through hole 104, and the portion 106a of the probe 106 located in the through hole 104 is insulated from the pad 104. In the present embodiment, the probe card 10 may further include an insulating sleeve 110. The insulating sleeve 110 is disposed in the through hole 104, and the probe 106 passes through the insulating sleeve 110 such that the portion 106a of the probe 106 positioned in the through hole 104 is insulated from the pad 102. The material of the insulating sleeve 110 is, for example, polyimide. The material of the probe 106 is, for example, tungsten, tantalum, beryllium copper alloy, gold, silver or platinum. In addition, although the embodiment is to insulate the portion 106a of the probe 106 in the through hole 104 from the pad 104 by the insulating sleeve 110, the present invention is not limited thereto as long as the probe 106 can be positioned. The method of insulating the portion 106a in the through hole 104 from the pad 104 is within the scope of the present invention.

The component 108 is connected to the pad 102 and the probe 106 such that the probe 106 is electrically connected to the pad 102 by the component 108. In the present embodiment, the connection of the component 108 to the pad 102 and the probe 106 is, for example, soldering. Element 108 is, for example, a passive component such as a resistor, capacitor or inductor. In the present embodiment, the element 108 is, for example, strip-shaped. The length direction D _{2 of the} element 108 is, for example, parallel to the vertical direction D _{1 of the} substrate 100. In other words, the component 108 can be soldered between the pad 102 and the probe 106 in an upright configuration, further conserving the configuration area of the component 108.

Based on the above embodiments, since the component 108 is connected to the pad 102 and the probe 106 is connected to the same pad 102 by the component 108, the number and arrangement area of the pad 102 can be reduced, thereby improving the substrate 100. Area utilization. That is, the probe card 10 can more efficiently utilize the area of the substrate 100 to configure more probes 106 and elements 108, thereby improving the integration and design flexibility of the probes 106 and 108.

It should be noted that, in the present embodiment, the probe card 10 has a probe 106 as an example for convenience of description, but the invention is not limited thereto. In other embodiments, the probe card 10 can also have a plurality of probes 106, that is, as long as it has at least one probe 106, it is within the scope of the present invention.

2A to 2C are flow charts showing a method of soldering a probe card in an embodiment of the present invention.

First, referring to FIG. 2A, a substrate 200 is provided, and a pad 202 is disposed in the substrate 200. The substrate 200 is, for example, a printed circuit board. The material of the pad 202 is, for example, aluminum or copper. The pad 202 may extend onto the surface of the substrate 200 such that the pad 202 may cover a portion of the surface of the substrate 200. The pad 202 has a through hole 204 through which the through hole 204 passes.

Subsequently, the insulating sleeve 210 is disposed in the through hole 204. The material of the insulating sleeve 210 is, for example, polyamine.

Next, referring to FIG. 2B, the component 208 is soldered to the pad 202. Element 208 is, for example, a passive component such as a resistor, capacitor or inductor. It is worth mentioning that if the element 208 is strip-shaped, the strip-shaped element 208 can be welded by means of the longitudinal direction D _{2 of the} element 208 being parallel to the vertical direction D ₁ of the substrate 200, whereby the element can be further reduced The required configuration area of 208, thereby increasing the area utilization of the substrate 200.

Next, referring to FIG. 2C, the probe 206 is passed through the through hole 204, and the portion 206a of the probe 206 located in the through hole 204 is insulated from the pad 202. The material of the probe 206 is, for example, tungsten, tantalum, beryllium copper, gold, silver or platinum. In the present embodiment, since the insulating sleeve 210 is disposed in the through hole 204, the portion 206a of the probe 206 in the through hole 204 and the pad 202 can be made by passing the probe 206 through the insulating sleeve 210. Insulation, but the invention is not limited thereto. That is, the portion 206a of the probe 206 in the through hole 204 may be insulated from the pad 202 by other suitable methods.

Next, the probe 206 is soldered to the component 208, and the component 208 is soldered to the pad 202, thereby electrically connecting the probe 206 to the pad 202 by the component 208. However, the present invention does not limit the method of soldering the component 208 and the probe 206. That is to say, in addition to the above-described soldering method, the component 208 may be soldered to the probe 206, and then the probe 206 may be bent to solder the component 208 to the pad 202.

Based on the above embodiments, since the component 208 is connected to the pad 202 and the probe 206 is connected to the same pad 202 by the component 208, the number of pads 202 can be greatly reduced, thereby greatly reducing the number of pads 202. The number of times of welding can effectively reduce the complexity of the process.

In summary, the above embodiment has at least the following features. The probe card proposed in the above embodiment can effectively increase the integration degree and design flexibility of the probe and the component. In addition, the welding process of the probe card proposed in the above embodiments can effectively reduce the process complexity.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10, 20‧‧ ‧ probe card

100, 200‧‧‧ substrate

102, 202‧‧‧ solder pads

104, 204‧‧‧through holes

106, 206‧‧ ‧ probe

106a‧‧‧The portion of the probe 106 in the through hole 104

108, 208‧‧‧ components

110, 210‧‧‧Insulation casing

206a‧‧‧The portion of the probe 206 in the through hole 204

D ₁ ‧‧‧Vertical direction

D ₂ ‧‧‧ Length direction

1 is a cross-sectional view of a probe card in accordance with an embodiment of the present invention.

2A to 2C are flow charts showing a method of soldering a probe card in an embodiment of the present invention.

10‧‧‧ probe card

100‧‧‧Substrate

102‧‧‧ solder pads

104‧‧‧through holes

106‧‧‧Probe

106a‧‧‧The portion of the probe 106 in the through hole 104

108‧‧‧ components

110‧‧‧Insulation casing

D ₁ ‧‧‧Vertical direction

D ₂ ‧‧‧ Length direction

Claims (10)

A probe card comprising: a substrate; a solder pad disposed in the substrate, the solder pad having a uniform through hole, the through hole penetrating the pad; a probe passing through the through hole, and the probe bit A portion of the through hole is insulated from the pad; and an element is connected to the pad and the probe, and a length direction of the element is parallel to a vertical direction of the substrate. The probe card of claim 1, wherein the bonding pad extends onto a surface of the substrate. The probe card of claim 1, further comprising an insulating sleeve disposed in the through hole, the probe passing through the insulating sleeve, such that the probe is located in the The portion of the through hole is insulated from the pad. The probe card of claim 1, wherein the component is soldered to the solder pad and the probe. The probe card of claim 1, wherein the component is a passive component, and the passive component comprises a resistor, a capacitor or an inductor. The probe card of claim 1, wherein the substrate is a printed circuit board. The probe card of claim 1, wherein the material of the probe comprises tungsten, tantalum, beryllium copper alloy, gold, silver or platinum. A welding method of a probe card, comprising: Providing a substrate having a pad disposed therein, the pad having a uniform through hole extending through the pad; passing a probe through the through hole and positioning the probe in the through hole Insulating the pad; and soldering an element to the pad and the probe, and the length direction of the element is parallel to the vertical direction of the substrate. The method of soldering a probe card according to claim 8, wherein the pad extends to a surface of the substrate. The method of soldering a probe card according to claim 8, wherein the step of insulating the portion of the probe in the through hole from the bonding pad comprises disposing an insulating sleeve in the through hole, And passing the probe through the insulating sleeve.