099年07月29日 五、新型說明： 【新型所屬之技術領域】 [_] 本創作有關—種探針卡結構，尤指-種探針能維持 其平行度與平面度的探針卡結構β 【先前技術】 _2] +導體進行測試時，測試機須透過-探針卡（pr〇be d)接觸待測物（device⑽化厂test，簡稱別τ)， 並藉由傳輸、分㈣m讀得待卿的測試結果 。㈣十卡通常包含若干個尺寸精密的探針，該些探針在 未又相情況下，每一探針之針尖預設位於同-假想平 遺“平面平行印刷電路貧平面的程度“稱為平行度 ，而探針針尖位於該假想平,面:的程度則稱為平面度。= 此，理想的探針針线全數設置魏想平©，俾使探針 壓測試時’每一探針產生均勻的變形量與應力而 心測物上的對應銲墊，以確實傳遞來自％ $ & 試訊號π時#从機的測 時酉己δ探針卡明試機之控制、分析 ，達到量測待測物的目u:: [_ 請參閱「圖1」和「圖2」，其分別為不⑽田 卡的結構示音圖㈣ 其刀別為不同習用探針 含-探料Γ —探針卡1G的結構主要包 、、、-基板（substrate)12、一印刷電路k d Clrcuit boards，PCB)13以及一結 件（stiffene u · 構加強 、中，探針組11包含複數個探釺 該些探針11G —端心點觸 表單编號A0101 =該基板12;該基板12_為線路之空::電性 =該些輪⑽-噴科㈣印刷電路板 第3頁/共21頁 099年07月29日修正替_頁 13 ;該結構加強件14則固設於該印刷電路板13，藉以保 持整體的結構強度。習知基板12與印刷電路板13的電性 連接方式主要區分為二，第一種如「圖1」所示，係將基 板12面對印刷電路板1 3的金屬接點與印刷電路板1 3面對 基板12的金屬接點以迴流銲（ref 1 ow solder ing)技術 ’將兩者以錫球（solder balls)或錫膏（solder paste)予以固定銲接。然而，上述方式須對印刷電路板 13與基板12進行整體加熱，因此除製程的可控性、精密 - 度較差外，亦易造成不良的溫度效應，使得固接於基板 -July 29, 099 5, new description: [New technology field] [_] This creation is related to the probe card structure, especially the probe card structure that can maintain its parallelism and flatness. β [Prior Art] _2] + When the conductor is tested, the test machine must contact the object to be tested (device (10) chemical test, abbreviated as τ) through the probe card (pr〇be d), and read by transmission, sub (4) m I have to wait for the test results. (4) The ten-card usually contains a number of precision-sized probes. In the case where the probes are not in phase, the tip of each probe is preset to be in the same-imaginary level of "the degree of plane-parallel printed circuit lean plane". Parallelism, where the probe tip is located in the imaginary plane, and the degree of the surface is called flatness. = Therefore, the ideal probe needles are all set to Wei Xiangping©, so that when the probe is pressed, the tester produces a uniform amount of deformation and stress on the corresponding test pads on the heart tester to be surely passed from % $ & When the test signal is π, the control time of the slave δ 探针 probe card test machine is measured and analyzed, and the target of the test object is measured. u:: [_ Please refer to Figure 1 and Figure 2, They are respectively the structure of the sound map of the (10) field card (4). The cutters are different from the conventional probes. - Probe Γ - The main package of the probe card 1G, -, substrate 12, a printed circuit kd Clrcuit Boards, PCB) 13 and a junction (stiffene u), the probe set 11 includes a plurality of probes 11G - end point touch form number A0101 = the substrate 12; the substrate 12_ For the space of the line:: electrical = the wheel (10) - spray (4) printed circuit board page 3 / total 21 pages of July 29, 999 revised for the _ page 13; the structural reinforcement 14 is fixed in the printing The circuit board 13 is used to maintain the overall structural strength. The electrical connection between the conventional substrate 12 and the printed circuit board 13 is mainly divided into two, the first one is as follows. As shown in FIG. 1 ′, the metal contacts of the substrate 12 facing the printed circuit board 13 and the metal contacts of the printed circuit board 13 facing the substrate 12 are reflowed (ref wh soldering technology) Soldering by solder balls or solder paste. However, the above method requires integral heating of the printed circuit board 13 and the substrate 12, so that in addition to the controllability and precision of the process, Easy to cause undesirable temperature effects, making it fixed to the substrate -
12之探針組11的平面度與平行度表現不佳，進而影響測 I 試的可靠性與精確度》 [0004] 另一種電性連接方式則如「圖2丄所示，其中該基板 12兩端各以一固定件（cover)i5抵掣固定，該些固定件 15則鎖固於印刷電路板13及結構加強件14 ;基板12與印 刷電路板13之間則以複數個彈簧針i6(p〇g〇 pin)作為電 性連接，為了使彈簧針16兩端有良好的電性接觸，彈簧 針16係受壓力而壓縮設置於基板丨2與印刷電路板丨3之間 | 。當探針卡10未接觸待測物時，由於基板12藉固定件15 ' 固定其兩端’因此基板12中心部分會受該些彈簧針16的 彈力作用而產生極大的内應力，因此朝探針組丨丨側外凸 變形。是故，此結構不單製造成本較高，亦劣化探針組 11中複數探針110的平行度與平面度，進而影響測試結果 。再者’當探針卡10點觸待測物時，由於基板12兩端固 定’故當基板12受到來自於待測物的反向作用力時，基 板12非兩固定端的區域會因缺乏支承力量而朝印刷電路 表單編號A0101 第4頁/共21頁 [0005] [0005] 099年07月29日修正替换頁 板13侧内凹變形，如 不但無法破保每根探針準碟點觸 待測物，亦可能加迷按 針110的耗損與破壞。 【新型内容】 综上所述，本創作之— 免探針卡之基板受力而彎曲 與平面度。 目的在於解決上述問題，避 變形’而影響探針的平行度 [0006] [0007] [0008] [0009] 為了達成前述目的’本_減㈣電轉輸盘受 力區域分關立於針聊與抵制件，透過抵制件—端抵制 於基板，以提供基板—承靠力量避免基板受力變形。 在-貫施例中’本創作提紅探教士結構包含：一 基板、㈣1路板、複數_¥^數她制件；其 中.玄些針腳焊接固定於該印翁電·之一表面並貫穿 該印刷電路板而電輯_基板之—表面，料抵制件 則貫穿該印刷電路板而接觸該基板之表面，藉以提供該 基板受力時之一承靠力量。：二. 承上，在上述一實施例中，旱少有一抵制件設置於 該基板的職^，以獲得抑赌板變料㈣效果。本 創作的製程可控性高且成本低，並能_探針卡之探針 的平行度與平面度，而增加職的精確、可靠性。 在本創作之另-實施例中，提出之探針卡結構包含 .一基板、一印刷電路板、複數個針腳以及至少一抵制 件’·其中，該抵制件兩側分別承抵於該基板與該印刷電 路板之間；該些針腳焊接SJ定於該印刷電路板的一表面 ，並貫穿料刷電路板及她制件，致使基板與印刷電 表單编號A0101 第5頁/共21頁 M392351 099年07月29日修正替&頁 路板電性固接，該抵制件用以提供該基板受力時之一承 靠力量。有關本創作的詳細技術内容及較佳實施例，配 合圖式說明如後。 【實施方式】 [0010] 有關本創作之洋細說明及技術内容，現就配合圖式說明 如下： [0011] 請參閱「圖3」所示’其為本創作一實施例之結構示意圖 ，如圖所示：本創作提出一種探針卡20結構，用以提供The flatness and parallelism of the probe set 11 of 12 is not good, which affects the reliability and accuracy of the test I [0004] Another electrical connection is as shown in Fig. 2, where the substrate 12 The two ends are fixed by a fixing member i5, and the fixing members 15 are locked to the printed circuit board 13 and the structural reinforcing member 14; between the substrate 12 and the printed circuit board 13, a plurality of spring pins i6 are used. (p〇g〇pin) as an electrical connection, in order to make good contact between the two ends of the pogo pin 16, the spring pin 16 is compressed and placed between the substrate 丨2 and the printed circuit board 丨3. When the probe card 10 is not in contact with the object to be tested, since the substrate 12 is fixed at both ends thereof by the fixing member 15', the central portion of the substrate 12 is subjected to the elastic force of the spring pins 16 to generate a great internal stress, so that the probe is directed toward the probe. Therefore, the structure is not convexly deformed, and the structure is not only expensive to manufacture, but also deteriorates the parallelism and flatness of the plurality of probes 110 in the probe set 11, thereby affecting the test results. When the object to be tested is touched, since both ends of the substrate 12 are fixed, the substrate 12 is received from When the reverse force of the object to be tested is applied, the area of the substrate 12 other than the two fixed ends may be corrected to the printed circuit form number A0101 due to lack of supporting force. Page 4 of 21 [0005] [0005] Corrected on July 29, 099 Replace the concave deformation on the side of the page board 13, if not only can not break the probe to touch the object to be tested, it may also add to the loss and damage of the needle 110. [New content] In summary, the creation of this - The substrate of the probe card is free from bending and flatness. The purpose is to solve the above problem and avoid the deformation and affect the parallelism of the probe. [0006] [0008] [0009] In order to achieve the aforementioned purpose, the present_minus (4) The force transfer area of the electric transfer disc is divided into the needle chat and the resisting parts, and the resisting part-end is resisted on the substrate to provide the substrate-bearing force to avoid the deformation of the substrate. In the case of the example, the creation red The structure of the priest includes: a substrate, (four) 1 way board, a plurality of _ ¥ ^ number of her parts; wherein. Xuan some stitches are fixed on one surface of the printed electric circuit and penetrate the printed circuit board and the electric _ substrate - The surface, the material resisting member is in contact with the printed circuit board The surface of the substrate is used to provide one of the bearing forces when the substrate is stressed. 2. In the above embodiment, a resist is placed on the substrate to obtain a slab change. (4) Effect. The process of the creation is highly controllable and low in cost, and can increase the parallelism and flatness of the probe of the probe card, thereby increasing the accuracy and reliability of the job. In another embodiment of the present invention, The proposed probe card structure comprises: a substrate, a printed circuit board, a plurality of pins, and at least one resisting member'. wherein the resisting members are respectively supported between the substrate and the printed circuit board; the stitches Soldering SJ is set on one surface of the printed circuit board, and runs through the brush circuit board and her parts, so that the substrate and printed circuit form number A0101 page 5 / 21 pages M392351 099 July 29 correction andamp; The page board is electrically fixed, and the resisting member is used to provide one of the bearing forces when the substrate is stressed. Detailed technical content and preferred embodiments of the present invention are described in conjunction with the drawings. [Embodiment] [0010] The details of the creation and the technical content of the present invention are as follows: [0011] Please refer to the structure shown in FIG. 3 for the creation of an embodiment of the present invention, such as Figure: This creation proposes a probe card 20 structure to provide
基板22—支承力量，進而改善探針210於測試時的平行度 與平面度。本創作所提出的探針卡2〇包含：一探針組21 、一基板2 2、一印刷電路板2 3、一結構加強件2 4、複數 個針腳25(male pin)以及複數個I抵制件26。其中，該基 板22包含一第一表面221和一第二表面222，該第一表面 221與該第二表面222各自設置有複數個金屬接點（圖中未 示）’且位於該第一表面221和該第；表面222的對應金屬 接點藉該基板22内的預設金屬佈線2 2 3而相互對應並導通 ;該探針組21包含複數個探針2ί〇，其中每一探針21〇之 一端用以接觸待測物（圖中未示），另一端則電性連接於 該第一表面221對應的金屬接點；該第二表面222之金屬 接點則電性連接於該印刷電路板23，致使來自測試機的 電氣訊號能由印刷電路板23傳遞至對應探針210。 [0012] 進一步地’當探針卡2〇進行測試而點觸待測物時，來自 於待測物的接觸作用力會使基板22受力變形，因此為維 持基板22保有較佳的平行度，同時讓複數探針21〇保持較 佳的平面度，本創作係藉該些抵制件26提供基板22受力 表單編號Α0101 « β百/丘91百 099年07月29日俊正替換頁 後的一抵制效果’俾使基板22獲得一承靠力量，藉以減 少基板22受力後的變形程度。請參閱「圖3」，該些抵制 件26係貫穿印刷電路板23設置，每一抵制件26之一端固 疋於該印刷電路板2 3或該結構加強件2 4，另一端則接觸 或固定於於該基板22，以下將有詳細說明。基板22與印 刷電路板23的電性連接則藉該些針腳25來達成，其中， 每一針腳25之一端電性固接於基板22第二表面222對應的 金屬接點，另一端貫穿該印刷電路板23而焊接固定於該 印刷電路板23之一表面’使其電性連接於印刷電路板23 上對應的金屬銲墊，該些針腳25用以電性連接基板22與 印刷電路板23，致使來自測試機的電氣訊號/能自印刷電 路板23傳遞至對應探針210。本創作將，基板的電性傳輸 與受力區域分別獨立，由針腳2 5與抵制伴2 6分別達成， 因此該些針腳25可於探針210點觸待測物時不致受力變形 ，亦可於探針卡20離開待測物時，保持基板22與印刷電 路板23間的穩固支撐效果，該些針脚〗5德以非受壓的方 式固設於基板2 2與印刷電路板2 3之間。在上述一實施例 中，該針腳25可為一防鏽防*仡之金屬導線，例如表面 锻有金（Au)薄膜的銅線。 [0013] 「圖4」顯示針腳25電性固接於印刷電路板23之一實施例 。該些針腳25之一端可藉由錫球點銲的方式，固接於該 印刷電路板23的對應銲墊。更進一步地，在某些情況下 ，針腳25可能會受到壓力的影響，使得針腳25銲固於印 刷電路板23上表面的焊點被破壞《故，為了加強針腳25 銲接後的穩固效果，針腳25銲固於印刷電路板23後，可 表單編號A0101 第7頁/共21頁 〇99^n7q ?9 日後正_1 於銲固區域上方設置一絕緣支撐物27，該絕緣支撐物27 上可再加設一加強板28，該加強板28固定於結構加強件 24而壓抵該絕緣支撐物27，可提供針腳25—支承力，加 強針腳25的結構穩定。該絕緣支撐物27例如由一絕緣膠 固化而形成’藉以緊密接合於固設針腳25的銲點。 [0014]Substrate 22 - supports the force, thereby improving the parallelism and flatness of the probe 210 during testing. The probe card 2〇 proposed by the present invention comprises: a probe set 21, a substrate 2, a printed circuit board 23, a structural reinforcement member 24, a plurality of pins 25 (male pin), and a plurality of I resists. Item 26. The first surface 221 and the second surface 222 are respectively provided with a plurality of metal contacts (not shown) and located on the first surface. The corresponding metal contacts of the surface 222 and the surface 222 are corresponding to each other and are turned on by the predetermined metal wiring 2 2 3 in the substrate 22; the probe set 21 includes a plurality of probes 2, wherein each of the probes 21 One end of the crucible is for contacting the object to be tested (not shown), and the other end is electrically connected to the corresponding metal contact of the first surface 221; the metal contact of the second surface 222 is electrically connected to the printing The circuit board 23 causes electrical signals from the test machine to be transferred from the printed circuit board 23 to the corresponding probes 210. [0012] Further, when the probe card 2 is tested and touches the object to be tested, the contact force from the object to be tested causes the substrate 22 to be deformed by force, thereby maintaining a better parallelism for maintaining the substrate 22. At the same time, the plurality of probes 21〇 maintain a good flatness, and the creation of the substrate 22 by the resists 26 is provided by the force sheet form number Α0101 «β百/丘9,91,9999, on July 29, after the replacement of the page A resisting effect '俾 causes the substrate 22 to obtain a bearing force, thereby reducing the degree of deformation of the substrate 22 after being stressed. Referring to FIG. 3, the resisting members 26 are disposed through the printed circuit board 23. One end of each resisting member 26 is fixed to the printed circuit board 23 or the structural reinforcing member 24, and the other end is contacted or fixed. The substrate 22 will be described in detail below. The electrical connection between the substrate 22 and the printed circuit board 23 is achieved by the pins 25, wherein one end of each of the pins 25 is electrically fixed to the corresponding metal contact of the second surface 222 of the substrate 22, and the other end runs through the printing. The circuit board 23 is soldered and fixed to one surface of the printed circuit board 23 to be electrically connected to the corresponding metal pad on the printed circuit board 23, and the pins 25 are electrically connected to the substrate 22 and the printed circuit board 23, The electrical signals from the test machine can be transferred from the printed circuit board 23 to the corresponding probe 210. In this creation, the electrical transmission of the substrate is independent of the force-receiving region, and is achieved by the pin 25 and the resisting partner 26 respectively. Therefore, the pins 25 can be deformed without being deformed when the probe 210 touches the object to be tested. The stable supporting effect between the substrate 22 and the printed circuit board 23 can be maintained when the probe card 20 leaves the object to be tested, and the pins are fixed to the substrate 2 2 and the printed circuit board 2 in a non-pressurized manner. Between 3 In the above embodiment, the stitch 25 may be a rust-proof metal wire such as a copper wire surface-forged with a gold (Au) film. [0013] FIG. 4 shows an embodiment in which the pins 25 are electrically fixed to the printed circuit board 23. One of the pins 25 can be fixed to the corresponding pad of the printed circuit board 23 by solder ball spot welding. Further, in some cases, the stitches 25 may be affected by the pressure, so that the solder joints of the stitches 25 soldered to the upper surface of the printed circuit board 23 are broken. Therefore, in order to enhance the stabilizing effect of the stitches 25 after soldering, the stitches are 25 soldered to the printed circuit board 23, form number A0101, page 7 / 21 pages 〇 99^n7q ? 9 days later _1 an insulating support 27 is placed above the soldering area, the insulating support 27 can be Further, a reinforcing plate 28 is attached. The reinforcing plate 28 is fixed to the structural reinforcing member 24 and pressed against the insulating support 27 to provide the pin 25-supporting force, and the structural rigidity of the reinforcing pin 25 is stabilized. The insulating support 27 is cured, for example, by an insulating glue to form a solder joint which is tightly bonded to the fixing stitch 25. [0014]
另一方面，若將基板22周緣處不包括針腳25的區域定義 為一非測試區，相對該非測試區定義為一測試區，則在 本創作之一實施例中，至少有一抵制件26設置於該測試 區的範圍内。例如「圖3」所示意，其中三個抵制件26中 ，位於基板22兩端緣的抵制件26係位於非測試區，位於 中間之抵制件2 6則位於測試區，因此棠:^板2 2受力而自 中心處内凹時，位於測試區的淑1鋤件26可提供承靠，同 時減少基板22的變形，維持基板22的平行度與平面度。 [0015] 此外’「圖5-1」至「圖5-3」分別顯示該抵制件26接觸 或固定於基板22第二表面2 2 2的不周實施例。其中，「圖 5-1」顯示該抵制件26係單純接觸基板％的第二表面222 ’藉由頂住基板22而提供一招;射力量；「圖5-2」和「圖 5-3」則顯示該抵制件26接觸該基板22端係固定於該基板 22。其中，「圖5-2」之抵制件26—端包含螺牙261，該 基板22對應該抵制件26尺寸設置有螺孔224，致使該抵制 件26可螺合於該基板22而固定於第二表面222; 「圖5-3 」則顯示該抵制件26係以黏膠或銲錫262銲接或黏接等方 式接觸該第二表面222。「圖5-2」和「圖5-3」之實施 例中’抵制件26係固接於基板22，如此可使基板22受壓 力而保持不變形外’亦可保持基板22受一拉力時的穩定 表單編號A0101 第8頁/共21頁 [0016] I 099年07月29日核正替 狀態。另-方面’該抵制件26固定於讀印電路板㈡或 該結構加強件24的方式，舉例可為螺絲鎖合固定，在此 並無特別限定。 「圖6」顯示本創作另一實施例的結構示意圖為求方便 理解’以下僅針對相異於上述實施例處作說明。本實施 例之探針卡20結構包含：-基板22、1㈣路板23、 複數個針腳25以及至少-抵制件26 ;其中，抵制件邮 側分別承抵於基板22與印刷電路板23之間◊該些針腳25 可穿越抵制件26和印刷電路板23，使其電性固接於該印 刷電路板23，致使基板22與印刷電路板23互相電性連接 。利用該抵制件26接合基板印席f電路板23，可提升 基板22¾力後的承靠面積，而保’持基板22的平面度與平 行度。 [0017] 在上述一實施例中，該抵制件26可為一絕緣填充物，例 如為一墊高片或一絕緣膠像煮製程上可於基板22與印 刷電路板23之間灌注一絕緣夢」y接合基板22與印刷電 路板23並同時包覆針腳25丨錢絕緣膠固化便可形成該抵 制件26，提供該基板22受力時的一承靠力量。 [0018] 本創作以針腳25電性連接基板22與印刷電路板23，可較 先前技術中用迴流銲技術者有較低的溫度效應影響；同 時，配合抵制件26提供基板22受力時的抵制支承效果， 不僅製造成本較低，製程的可控性佳，亦可避免基板22 產生多餘的内應力’維持基板22平整，使得探針組21的 複數探針210保有較佳的平行度與平面度。 表單編號A0101 第9頁/共21頁 M392351 099年07月29日修正替#頁 [0019] 惟以上所述者，僅為本創作之較佳實施例，非欲侷限本 新型專利之專利保護範圍，故舉凡運用本創作說明書及 圖式内容所為之等效變化與修飾，均同理包含於本創作 之權利保護範圍，合予陳明。 【圖式簡單說明】 [0020] 本創作的實施方式係結合圖式予以描述： [0021] 「圖1」為習用探針卡的結構示意圖； [0022] 「圖2」為另一習用探針卡的結構示意圖；On the other hand, if the area not including the stitch 25 at the periphery of the substrate 22 is defined as a non-test area, and the non-test area is defined as a test area, in one embodiment of the present invention, at least one resist 26 is disposed on Within the scope of the test area. For example, as shown in FIG. 3, among the three resist members 26, the resisting member 26 located at both end edges of the substrate 22 is located in the non-test area, and the resisting member 26 located in the middle is located in the test area, so that: 2: 2 2 When the force is recessed from the center, the member 26 located in the test area can provide the bearing while reducing the deformation of the substrate 22 and maintaining the parallelism and flatness of the substrate 22. [0015] Further, "Fig. 5-1" to "Fig. 5-3" respectively show an example in which the resisting member 26 is in contact with or fixed to the second surface 2 2 2 of the substrate 22. Here, "Fig. 5-1" shows that the resisting member 26 is a second surface 222' that simply contacts the substrate % by providing a stroke against the substrate 22; the firing force; "Fig. 5-2" and "Fig. 5-3" It is shown that the resisting member 26 is fixed to the substrate 22 at the end of the substrate 22 . The end of the resisting member 26 of the "FIG. 5-2" includes a thread 261. The substrate 22 is provided with a screw hole 224 corresponding to the resisting member 26, so that the resisting member 26 can be screwed to the substrate 22 and fixed to the second portion. The second surface 222; "Fig. 5-3" shows that the resisting member 26 contacts the second surface 222 by soldering or soldering 262. In the embodiment of "Fig. 5-2" and "Fig. 5-3", "the resisting member 26 is fixed to the substrate 22 so that the substrate 22 can be kept under pressure without being deformed", and the substrate 22 can be kept under tension. Stable form number A0101 Page 8 of 21 [0016] I July 29, 2009, the nuclear replacement status. Further, the manner in which the resisting member 26 is fixed to the printed circuit board (2) or the structural reinforcing member 24 may be, for example, a screw-locking fixing, and is not particularly limited herein. Fig. 6 shows a schematic structural view of another embodiment of the present invention for convenience of understanding. The following description is only for differences from the above embodiments. The structure of the probe card 20 of the present embodiment includes: a substrate 22, a (four) way board 23, a plurality of stitches 25, and at least a resisting member 26; wherein the resisting member mail side is respectively supported between the substrate 22 and the printed circuit board 23 The pins 25 can pass through the resisting member 26 and the printed circuit board 23 to be electrically fixed to the printed circuit board 23, so that the substrate 22 and the printed circuit board 23 are electrically connected to each other. By bonding the substrate board f to the circuit board 23 by the resisting member 26, the bearing area of the substrate 223⁄4 can be increased, and the flatness and the flatness of the substrate 22 can be maintained. [0017] In the above embodiment, the resisting member 26 can be an insulating filler, for example, a pad or an insulating rubber image can be filled with an insulating dream between the substrate 22 and the printed circuit board 23. The y-bonding substrate 22 and the printed circuit board 23 are simultaneously covered with the pins 25 and the insulating glue is cured to form the resisting member 26, thereby providing a bearing force when the substrate 22 is stressed. [0018] The present invention electrically connects the substrate 22 and the printed circuit board 23 with the pins 25, which can be affected by the lower temperature effect of the prior art in the reflow soldering technique; meanwhile, the matching resisting member 26 provides the substrate 22 when the force is applied. Resisting the support effect, not only the manufacturing cost is low, the controllability of the process is good, but also the excess internal stress of the substrate 22 can be avoided. The substrate 22 is maintained flat, so that the plurality of probes 210 of the probe set 21 maintain better parallelism and Flatness. Form No. A0101 Page 9 of 21 M392351 Revised July 29, 2009, Revision # Page [0019] However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent protection of this new patent. Therefore, the equivalent changes and modifications made by the use of this creation manual and the contents of the drawings are included in the scope of protection of this creation and are combined with Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS [0020] The embodiment of the present invention is described in conjunction with the drawings: [0021] FIG. 1 is a schematic structural view of a conventional probe card; [0022] FIG. 2 is another conventional probe. Schematic diagram of the card;
[0023] 「圖3」為本創作一實施例的結構示意圖； [0024] 「圖4」為本創作針腳電性固接於印刷電路板一實施例的 結構示意圖； [0025] 「圖5-1」至「圖5-3」為本創作一抵制件接觸第二表面 的不同實施例；以及 [0026] 「圖6」為本創作另一實施例的結構示意圖。[0023] FIG. 3 is a schematic structural view of an embodiment of the present invention; [0024] FIG. 4 is a schematic structural view of an embodiment in which an artificial stitch is electrically fixed to a printed circuit board; [0025] FIG. 1" to "Fig. 5-3" are different embodiments of the creation of a resisting member contacting the second surface; and [0026] "Fig. 6" is a schematic structural view of another embodiment of the present invention.
【主要元件符號說明】 [0027] 10, 20 · · .....探針卡 [0028] 11， 21 · · .....探針組 [0029] 12, 22 · · .....基板 [0030] 13, 23 .. .....印刷電路板 [0031] 14, 24 · · .....結構加強件 [0032] 15 _ ••固定件 表單編號A0101 第10頁/共21頁 M392351[Description of main component symbols] [0027] 10, 20 · · ..... Probe card [0028] 11, 21 · · ..... Probe set [0029] 12, 22 · · .... .Substrate [0030] 13, 23 .. ..... Printed circuit board [0031] 14, 24 · ..... Structural reinforcement [0032] 15 _ •• Fixture form number A0101 Page 10 / Total 21 pages M392351
[0033] 16..... ••彈簧針 [0034] 110， 210 · · • ••探針 [0035] 25..... ..針腳 [0036] 26..... ••抵制件 [0037] 27..... ••絕緣支撐物 [0038] 28..... [0039] 221..... [0040] 222 ..... •.第二表面 [0041] 223 ..... ••金屬佈線 [0042] 224 ..... •.螺孔 [0043] 261..... ..螺牙 [0044] 262 ..... 099年07月29日按正替換頁[0033] 16..... ••Spring Needle [0034] 110, 210 · · • • Probe [0035] 25... .. Pin [0036] 26..... ••Resist [0037] 27..... ••Insulation support [0038] 28..... [0039] 221..... [0040] 222 ..... •. Second surface [0041] 223 ..... ••Metal wiring [0042] 224 ..... •. Screw hole [0043] 261..... .. thread [0044] 262 ..... July 29, 2009 Day by day replacement page
表單編號A0101 第11頁/共21頁Form No. A0101 Page 11 of 21