TWI509265B - Vertical probe card and test module using the same - Google Patents

Description

Vertical probe card and detection module using the same

The invention relates to a probe card and a detection module having the same, and particularly relates to a vertical probe card and a detection module having the probe card.

The driving chip of the liquid crystal display device is generally packaged by a tape and reel packaging technology, including a chip on-film (COF) package, a tape carrier package (TCP), and the like. The tape and reel type package electrically connects the semiconductor wafer to the flexible film substrate on which the surface is formed with conductive traces, wherein the wiring structure includes an input pin and an output pin, and the inner end of the pin The electrical terminals (eg, bumps) of the electrical connection are electrically connected, and the outer ends thereof extend outward and are formed with test pads for power supply testing.

Currently, vertical probe cards are often used for tape and reel packaging tests in response to the trend of increasingly narrower test pad spacing. The vertical probe card mounts multiple rows of probes vertically and densely on one of the probe heads to match the high pitch circuit test. However, in the current test machine, the vertical test probe image is blocked by the probe base and the circuit substrate, and the contact between the probe and the test pad cannot be directly observed through the image capture component, so the current test machine The table cannot be directly aligned with the test pad by the vertical probe to accurately and efficiently determine the contact between the probe and the test pad.

In order to perform accurate alignment prior to probe contact, conventional techniques utilize alignment protrusions or alignment guide pins disposed on the probe card, the alignment protrusions or pairs The position guiding needle is disposed at a position where the image capturing component can be read, wherein the alignment guiding needle is, for example, a cantilever probe, obliquely extending into the monitoring through hole of the probe card, and using the alignment protruding member or the alignment position The relative position of the guide pin and the probe is to align the alignment protrusion or the alignment guide with the alignment mark on the alignment tape. At this time, the probe is also aligned with the test pad on the tape. Since the alignment operation needs to be completed before the probe is formally contacted with the test pad, the length of the alignment guide pin should be smaller than the length of the probe, and the height of the alignment protrusion should also be higher than the tip of the probe. Thus, when the alignment protrusion or the alignment guide and the alignment mark are aligned, the alignment protrusion or the alignment guide does not contact the alignment mark and there is a distance, and the distance is likely to cause the alignment image. The angle of parallax of the components is taken, so the current test machine still cannot accurately position the probe and the test pad. Furthermore, the alignment protrusion or the alignment guide pin is susceptible to bending deformation or displacement due to an external force, thereby affecting the accuracy thereof. In addition, the alignment guide pin may also cause damage to the package to be tested (eg scratching the film or tape). Therefore, how to improve the above-mentioned shortcomings of the conventional probe card is one of the problems that the skilled person in the field would like to solve.

The invention provides a vertical probe card which can improve the alignment accuracy.

The invention provides a detection module, wherein the alignment accuracy of the vertical probe card is high.

The present invention provides a vertical probe card adapted to be coupled with an image capture device for electrically detecting a plurality of alignment marks and one of the plurality of test pads. The vertical probe card includes a circuit substrate, a probe holder and a plurality of light source devices. The circuit substrate has a monitoring through hole. The probe base is disposed on the circuit substrate, the probe base has an opening corresponding to the monitoring through hole and a plurality of vertical probes, wherein the vertical probes are adjacently arranged on at least two opposite sides of the opening, and the vertical probe is suitable In direct contact with the test pad. The light source device is disposed on the circuit substrate, wherein the light source device and the image capturing device are located on a side of the circuit substrate opposite to the vertical probe, and each of the light source devices respectively provides a light beam, and each of the light beams respectively passes through the monitoring through hole and the opening to project A pair of bit patterns are in one of the alignment marks.

The invention provides a detection module, which is suitable for electrically detecting an object to be tested having a plurality of alignment marks and a plurality of test pads. The detecting module comprises an image capturing device, a circuit substrate, a probe holder and a plurality of light source devices. The circuit substrate has a monitoring through hole. The probe holder is disposed on the circuit substrate and has an opening corresponding to the monitoring through hole and a plurality of vertical probes. Wherein the vertical probes are arranged adjacent to at least two opposite sides of the opening, and the vertical probes are adapted to be in direct contact with the test pads. The light source device is disposed on the circuit substrate, wherein the light source device and the image capturing device are located on a side of the circuit substrate opposite to the vertical probe, and each of the light source devices respectively provides a light beam, and each of the light beams respectively passes through the monitoring through hole and the opening to project A pair of bit patterns are in one of the alignment marks.

In an embodiment of the invention, each of the light source devices includes a laser source.

In an embodiment of the invention, the minimum distribution range of the alignment pattern in the alignment mark is less than or equal to a minimum size of each test pad.

In an embodiment of the invention, the direction of transmission of the beam is orthogonal to the plane in which the alignment mark is located.

In an embodiment of the invention, the plane in which the alignment mark is located has a normal vector, and the angle between the direction in which the beam is transmitted and the normal vector is not zero.

Based on the above, the present invention provides a light source device on the circuit substrate of the detecting module to project a pair of bit patterns on the object to be tested through the monitoring through hole, and then adjust the space between the object to be tested and the vertical probe card. The relative position, the alignment pattern is overlapped with the alignment mark on the object to be tested, or the size of the alignment pattern is less than or equal to the size of the alignment mark and the two conform to the preset specific relationship, thereby completing the vertical probe card The alignment with the object to be tested for subsequent electrical testing. In this way, by the principle of the linear transmission of light, the problem that the alignment guide pin may be bent or displaced may be avoided, and the light may be directly projected on the alignment mark of the object to be tested, so the alignment guide pin and There is no distance between the alignment marks, so that the angular disparity of the image capturing elements when the alignment of the alignment guide and the alignment mark is caused can be avoided, thereby avoiding the error generated during the alignment. therefore. The invention can improve the accuracy of the alignment between the detection module and the object to be tested.

The above described features and advantages of the present invention will be more apparent from the following description.

FIG. 1 is a schematic diagram showing the configuration of a detection module and an object to be tested according to an embodiment of the present invention, and FIG. 2 is a side view of the detection module and the object to be tested in a state of alignment. Referring to FIG. 1 and FIG. 2 simultaneously, the detecting module 100 of the embodiment includes an image capturing device 110 and a vertical probe card 120. The vertical probe card 120 is adapted to cooperate with the image capturing device 110 to electrically detect the object to be tested 200 having a plurality of alignment marks 210 and a plurality of test pads 220. In this embodiment, the object to be tested 200 is, for example, a film flip chip package or a tape package component, and the test pad 220 is an electrical test pad on a film flip chip package or a tape package component. The image capturing device 110 is, for example, a charge coupled device (CCD) camera.

In this embodiment, the vertical probe card 120 includes a circuit substrate 122, a probe holder 124, and a plurality of light source devices 126. The circuit substrate 122 has a monitoring through hole 122a. The probe holder 124 is disposed on the circuit substrate 122 and has an opening 124a corresponding to the monitoring through hole 122a and a plurality of vertical probes 124b. In addition, the vertical probes 124b are adjacently disposed on at least two opposite sides of the opening 124a, and the vertical probes 124b are adapted to be in direct contact with the test pad 220.

FIG. 3 is a schematic diagram showing the relative relationship between a alignment pattern and a registration mark according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 3 simultaneously, the light source device 126 of the embodiment is disposed on the circuit substrate 122. For example, the light source device 126 is a laser light source, but the invention is not limited thereto. The light source device 126 and the image capturing device 110 are located on one side of the circuit substrate 122 opposite to the vertical probe 124b. When the detecting module 100 is to perform electrical detection on the object to be tested 200, the light source device 126 respectively provides a light beam 126a, and each of the light beams 126a passes through the monitoring through hole 122a and the opening 124a to project a pair of bit patterns 128 to one of them. The alignment mark 210 is inside. In the present embodiment, the direction of transmission of the light beam 126a is, for example, orthogonal to the plane in which the alignment mark 210 is located, that is, the light beam 126a is linearly transmitted and vertically projected on the alignment mark 210. In addition, since the number of the test pads 220 on the object to be tested 200 is large, the size of each test pad 220 is adjusted according to the layout space on the object to be tested 200, that is, the test pad 220 on the object to be tested 200. The dimensions are not exactly the same. Therefore, for alignment accuracy, the minimum distribution of the alignment patterns 128 within the alignment mark 210 should be less than or equal to the minimum size of each test pad 220. It should be particularly noted here that due to the process of aligning the alignment pattern 128 with the alignment mark 210, the object to be tested 200 and the vertical probe card (such as the vertical probe card 120 shown in FIG. 1) The distance should be adjusted from far to near. Therefore, the distribution range in which the alignment patterns 128 are projected in the alignment mark 210 also gradually becomes smaller as the distance is narrowed. When the alignment pattern 128 and the alignment mark 210 are aligned, the distribution pattern of the alignment pattern 128 in the alignment mark 210 is the smallest, and the minimum distribution range of each alignment pattern 128 in the alignment mark 210 should be less than or It is equal to the minimum size of each test pad 220.

Thus, by adjusting the relative position between the object to be tested 200 and the vertical probe card 120, the alignment pattern 128 projected by the light beam 126a overlaps with the alignment mark 210 on the object to be tested 200, thereby completing the object to be tested 200. The alignment with the vertical probe card 120 causes the vertical probe 124b to contact the corresponding test pad 220 for subsequent related electrical testing.

In this embodiment, the relative position and/or shape of the alignment pattern 128 projected by the light beam 126a and the alignment mark 210 on the object to be tested 200 can be used to determine the test pad 220 and the vertical probe card on the object to be tested 200. Whether the vertical probe 124b on 120 is aligned. In addition, in this embodiment, the size and/or shape of the alignment pattern 128 projected by the light beam 126a can also be used to determine whether the test pad 220 on the test object 200 and the vertical probe 124b on the vertical probe card 120 are Already in contact.

4 to 6 are schematic diagrams showing the relative relationship between the alignment pattern and the alignment mark in three different embodiments of the present invention. As shown in FIG. 4, the alignment pattern 428 projected by the light source device 126 can be designed as other circular shapes as shown in FIG. 3, and can be designed into other shapes according to actual needs. In this embodiment, the alignment pattern is used. 428 and its corresponding alignment mark 410 are pentagonal or may be other shapes. In other words, the present invention does not limit the shape of the alignment pattern 428 and its corresponding alignment mark 410 as long as the size of the alignment pattern 428 is smaller than Or equal to the size of the alignment mark 410, so that the alignment pattern 428 can be completely located within the alignment mark 410. In addition, the alignment mode of the detection module provided by the present invention may be overlapped with the alignment mark 210 on the object to be tested 200, as shown in FIG. The projected alignment pattern 128 is adjusted to conform to a predetermined relative relationship with the alignment mark 210 to complete the alignment between the two. Specifically, as shown in FIG. 5, the operator can also make the light source device 126 by adjusting the relative position between the object to be tested 200 and the vertical probe card (the vertical probe card 120 shown in FIG. 1). The projected alignment pattern 528 is the same size as the alignment mark 510 on the object to be tested 200 and is separated by a predetermined distance D, that is, the alignment between the object to be tested 200 and the vertical probe card 120 is completed. In addition, as shown in FIG. 6, the alignment pattern 628 and the alignment are adjusted by adjusting the relative positions between the object to be tested 200 and the vertical probe card (the vertical probe card 120 shown in FIG. 1). The area of the mark 610 is a predetermined ratio and the size of the alignment pattern 628 is smaller than or equal to the size of the alignment mark 610, and is separated from each other by a predetermined distance D, that is, the pair between the object to be tested 200 and the vertical probe card 120 is completed. Bit. As described above, the size, shape and position of the alignment mark on the object to be tested can be adjusted by themselves, and the alignment pattern projected by the light source device is designed to meet the layout restrictions or design requirements of various objects to be tested.

FIG. 7 is a schematic diagram of a detection module according to another embodiment of the present invention. Referring to FIG. 7, in another embodiment of the present invention, in order to meet specific design requirements, the direction of transmission of the light beam 726a provided by the light source device 726 may not be orthogonal to the plane in which the alignment mark 710 is located. That is, the plane in which the alignment mark 710 is located has a normal vector N, and the angle α between the transmission direction of the light beam 726a and the normal vector N is not zero. With this configuration, the image capturing device 110 can not observe the alignment between the alignment pattern 728 and the alignment mark 710 under the visual shielding of the light source device 726, and the configuration flexibility between the components of the detection module 700 is also improve. The fixing manner of the light source device 726 is not shown in FIG. 7. Any one of ordinary skill in the art can make design choices by themselves, and the present invention does not limit this. However, it is worth noting that since the direction of transmission of the beam 726a is non-orthogonal to the plane in which the alignment mark 710 is located, the shape and position of the alignment pattern 728 projected thereon may also vary due to the angle α, and thus, The detection module 700, the design of its related components and the alignment mark 710 needs to be calculated, and the precision of the design is also high.

In summary, the present invention provides a light source device on the circuit substrate of the detecting module to project a pair of bit patterns on the object to be tested through the monitoring through hole, and then adjust the object to be tested and the vertical probe card. The relative position between the two places, the alignment pattern and the alignment mark overlap, or the size of the alignment pattern is less than or equal to the size of the alignment mark and the two conform to the preset specific relationship, and the vertical probe card and the test are completed. The alignment between the objects for subsequent electrical testing. In this way, by the principle of the linear transmission of light, the problem that the alignment guide pin may be bent or displaced may be avoided, and the light may be directly projected on the alignment mark of the object to be tested, so the alignment guide pin and There is no distance between the alignment marks, so that the angular disparity of the image capturing elements when the alignment of the alignment guide and the alignment mark is caused can be avoided, thereby avoiding the error generated during the alignment. therefore. The invention can improve the accuracy of the alignment between the detection module and the object to be tested.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 700. . . Detection module

110. . . Image capture device

120. . . Vertical probe card

210, 410, 510, 610, 710. . . Alignment mark

220‧‧‧Test pad

200‧‧‧Test object

122‧‧‧Line substrate

124‧‧‧ probe holder

126, 726‧‧‧ light source device

122a‧‧‧Monitoring through holes

124a‧‧‧ openings

124b‧‧‧Vertical probe

126a, 726a‧‧‧ beams

128, 428, 528, 628, 728‧‧‧ alignment pattern

FIG. 1 is a schematic diagram of a configuration of a detection module and an object to be tested according to an embodiment of the invention.

2 is a side view of the detection module and the object to be tested in a aligning state.

FIG. 3 is a schematic diagram showing the relative relationship between a alignment pattern and a registration mark according to an embodiment of the present invention.

4 to 6 are schematic diagrams showing the relative relationship between the alignment pattern and the alignment mark in three different embodiments of the present invention.

FIG. 7 is a schematic diagram of a detection module according to another embodiment of the present invention.

100. . . Detection module

110. . . Image capture device

120. . . Vertical probe card

210. . . Alignment mark

220. . . Test pad

200. . . Analyte

122. . . Circuit substrate

126. . . Light source device

Claims (10)

A vertical probe card is adapted to be combined with an image capturing device for electrically detecting a plurality of alignment marks and one of the plurality of test pads, the vertical probe card comprising: a circuit substrate Having a monitoring through hole; a probe holder disposed on the circuit substrate, the probe holder having a pair of openings for monitoring the through hole and a plurality of vertical probes, wherein the vertical probes are adjacent to each other And the plurality of light source devices are connected to the circuit substrate and fixed on the circuit substrate, wherein the light source devices are connected to the circuit substrate; The image capturing device is located on a side of the circuit substrate opposite to the vertical probes, and each of the light source devices respectively provides a light beam, and each of the light beams respectively passes through the monitoring through hole and the opening to project a pair of bit patterns In the one of the alignment marks, by adjusting the relative position between the object to be tested and the vertical probe card, and transmitting the alignment pattern projected by each of the light beams and the object to be tested These alignment marks And the relative position of one of the / or shapes to determine the plurality of test pads on the DUT is aligned with the plurality of vertical probes of the probe card is vertical. The vertical probe card of claim 1, wherein each of the light source devices comprises a laser light source. The vertical probe card of claim 1, wherein a minimum distribution range of each of the alignment patterns in the alignment mark is less than or equal to a minimum size of each of the test pads. The vertical probe card of claim 1, wherein the light beams are transmitted in a direction orthogonal to a plane in which the alignment marks are located. The vertical probe card of claim 1, wherein the planes of the alignment marks have a normal vector, and the angle between the transmission directions of the beams and the normal vector is not zero. The invention is characterized in that: the detection module is configured to electrically detect one of the plurality of alignment marks and the plurality of test pads, the detection module comprises: an image capturing device; and a circuit substrate having a monitoring through hole a probe holder disposed on the circuit substrate, the probe holder having a pair of openings for monitoring the through hole and a plurality of vertical probes, wherein the vertical probes are adjacent to at least two of the openings On the opposite side, the vertical probes are adapted to be in direct contact with the test pads; and a plurality of light source devices are connected to the circuit substrate and fixed to the circuit substrate, wherein the light source devices are located with the image capturing device The circuit board is opposite to one side of the vertical probes, and each of the light source devices respectively provides a light beam, and each of the light beams respectively passes through the monitoring through hole and the opening to project a pair of bit patterns on the alignment marks. In one of the above, the relative position between the object to be tested and the vertical probe card is adjusted, and the alignment pattern projected by each of the light beams and the alignment marks on the object to be tested are One of the relative Counter and / or shapes to determine the plurality of vertical probe on the plurality of test pads on the DUT and the probe card is aligned vertically. The detection module of claim 6, wherein each of the light source devices comprises a laser light source. The detection module of claim 6, wherein a minimum distribution range of each of the alignment patterns in the alignment mark is less than or equal to a minimum size of each of the test pads. The detection module of claim 6, wherein the light beams are transmitted in a direction orthogonal to a plane in which the alignment marks are located. The detection module of claim 6, wherein the planes of the alignment marks have a normal vector, and the angle between the transmission directions of the beams and the normal vector is not zero.