KR101332588B1 - Film type probe card - Google Patents

Abstract

The present invention is related to a film type probe card testing a tap IC film. The film type probe card includes a first base block combined with one or more first bearings and one or more first elastic members, a second base block combined with one or more second bearings and one or more second elastic members, a pressurizing block vertically moving, having elasticity as the side of the block is combined with the first bearings and the first elastic members and the other side is combined with the second bearings and the elastic members, a first film attached to a top surface of the pressurizing block and having a plurality of electrode lines on an insulating film, a second film having a plurality of electrode lines on the insulating film, an end touching the side of the first film, and the other end touching a wafer, a printed circuit board combined with the second film so that the electrode lines are electrically connected with base pads, and a reinforcement plate placed on the opposite surface to a combination surface of the first base block and the second base block.

Description

Film Type Probe Card {FILM TYPE PROBE CARD}

The present invention relates to a probe card, and more particularly, to a film type probe card capable of testing a wafer by replacing a needle with a bump film so that bumps (projections) of the bump film are in direct contact with a test pad on the wafer.

In general, a semiconductor device includes a process of manufacturing a semiconductor wafer, a process of manufacturing a plurality of unit semiconductor chips from the semiconductor wafer, an electrical die sorting test process of a semiconductor chip for determining whether the semiconductor chip is defective, or a good semiconductor. A process for determining whether a series of semiconductor chips are in an electrically good state or in a bad state, such as a process of packaging or finally testing a packaged semiconductor chip. An inspection that determines an error by applying an electrical signal to a semiconductor chip on a wafer. Use the device.

Such an inspection apparatus includes a tester for generating an electrical signal and a probe card to which a plurality of needles are attached to send an electrical signal from the tester to an electrode formed on a semiconductor chip on a semiconductor wafer. The probe card serves to transfer electrical signals generated from the tester to the wafer or transfer electrical signals from the wafer to the tester through needles in contact with the wafer.

1 illustrates a needle 110 coupled to a conventional needle type probe card, and FIG. 2 illustrates a needle type probe card in which the needles 110 of FIG. 1 are coupled to a printed circuit board 130. to be.

1 and 2, after bending the portion of the needle 110 to be in contact with the wafer as shown in FIG. 1, the needle 110 is mounted on the frame, and a short circuit between the needles 110 is prevented as shown in FIG. 2. In order to insert the insulating tube 120 to the needle 110 to bond the needle 110 to the pad of the printed circuit board 130, such as by soldering the pad of the needle 110 and the printed circuit board 130 Is electrically connected. Then, the needle type probe card by sanding the pointed end portion of the needle 110 in contact with the pad of the chip (IC) in the wafer and aligning the needle 110 so that the pads of the wafer and the position of the needles 110 coincide with each other. Can be produced.

The needle-type probe card is manufactured by the above method, and all of these operations are performed by hand while looking at the microscope, which takes about two weeks to produce a single probe card, and when the needle contacts the wafer, It is difficult to adjust the value of the drive (overdrive), there was a problem that damage such as scratches on the pad of the wafer while the needle is in contact with the wafer. In addition, when the pads formed on the wafer had a narrow pitch, the needle type probe card was difficult to mount the needle to have the same pitch as the pads of the narrow pitch, which made it difficult to test the wafer of the narrow pitch.

In addition, the needle-type probe card is also used in the process of finally testing the packaged semiconductor chip, for example, also used in the process of testing a tab IC film of the COF (Chip On Film) method. The tab IC film has a driving IC mounted on the flexible circuit board, and lead wires connected to the electrode lines of the driving IC are formed on the flexible circuit board to form input terminals and output terminals on both sides. In this case, when the lead wire (test pad) on the flexible circuit board corresponding to the input terminal and the output terminal is tested with the needle type probe card as described above, the same problem as described above occurs.

Applicant has disclosed a patent No. 10-1272493 to solve this problem. 3 is a top perspective view of the film type probe card in the above patent, and FIG. 4 is a bottom perspective view of the film type probe card in the above patent.

The film type probe card in the patent serves to test the tab IC film by contacting the films 350 a and 350 b to a film package, that is, a COB type TAB IC film, and the base block 310 and the base block 310. The pressing block 320, the film (350a, 350b) and the printed circuit board 360 is provided.

Base block 310 is coupled to at least one bearing (330: 333, 335) and at least one elastic member, the base block 310 is coupled to the printed circuit board 360 is fixed, the most block 320 It is configured to move vertically with elasticity by combining with at least one bearing 330 and at least one elastic member coupled to the base block 310.

The films 350a and 350b are adhered to and fixed to the base pads of the printed circuit board 360 by the fastening member 370.

The film type probe card having the above structure is transparent but has an advantage of easily aligning when testing the film by adopting the glass block 380. However, since the structures such as the base block 310 and the fastening member 370 are fixedly coupled to the printed circuit board 360, the base block in the case where the printed circuit board 360 is bent finely by an external force. Since the bonding position of the 310 and the fastening member 370 is also changed finely, there is a problem in that the alignment is misaligned to test the tab IC film on the wafer having a very fine pitch.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a film type probe card that can accurately align the panel test by preventing the micro deformation of the printed circuit board during the panel test. .

To this end, the film type probe card of the present invention includes: a first base block to which at least one first bearing and at least one first elastic member are coupled; A second base block to which at least one second bearing and at least one second elastic member are coupled; One side is coupled to the at least one first bearing and the at least one first elastic member, and the other side is coupled to the at least one second bearing and the at least one second elastic member to move vertically while having elasticity. A pressure block; A plurality of electrode lines are formed on the insulating film, one end of the first film is bonded to the upper surface of the pressure block, a plurality of electrode lines are formed on the insulating film, one end is in contact with the other end of the first film A second film connected to the wafer at the other end; A plurality of base pads are formed, including a printed circuit board on which electrode lines formed at the other end of the second film and the second film are coupled so that the base pads are electrically connected. A film and the first-B film, the second film is composed of the second-A film and the second-B film, one end of the first-A film is made of one side upper surface of the pressing block 1 is bonded by an elastic adhesive, the other end of the 1-A film is bonded to one end of the second 2-A film, one end of the first-B film by the second elastic adhesive on the other upper surface of the pressure block Bonded to the other end of the first-B film is bonded to one end of the second-B film, one end of the second-A film is joined to the other end of the first-A film, and the other end of the base pad Of the first 2-B film is connected to the other end of the first-B film. The other end is connected to the base pads, the upper surface of the pressing block is formed with a hole penetrating through the center, the upper surface of the pressing block is seated to cover the hole, the glass block formed of a transparent material The first-A film and the first-B film are further attached to the glass block seated on the upper surface of the pressing block by the first elastic adhesive and the second elastic adhesive, respectively, The first elastic adhesive and the second elastic adhesive are formed of a transparent material, one end of the first-A film and the first-B film is formed with an alignment mark to facilitate alignment, and the printed circuit Reinforcing plates are coupled to opposite surfaces of surfaces of the substrate to which the first base block and the second base block are coupled, and fastening holes and images formed in the first base block and the second base block. Whereby the fastening member is fixed to the fastening hole formed in the reinforcing plate may be the first base block, the second base block, and said reinforcing plate is fixed to the printed circuit board.

The glass block may be formed of a glass material.

The first elastic adhesive and the second elastic adhesive may be silicone adhesives.

A first fixing plate for pressing a portion at which the other end of the first-A film and one end of the second-A film are coupled, and a portion at which the other end of the second-A film and the base pads are coupled; And a second fixing plate for pressing and fixing a portion at which the other end of the 1-B film and one end of the 2-B film are coupled and a portion at which the other end of the 2-B film and the base pads are coupled. The first fixing plate, the second fixing plate and the reinforcing plate are coupled to the printed circuit board by coupling the fixing member to the fastening hole formed in the fixing plate and the second fixing plate and the fastening hole formed in the reinforcing plate. Can be fixed.

In addition, the film type probe card according to an embodiment of the present invention may further include an alignment camera positioned in a hole under the glass block.

Further, bumps are formed at one end of the first-A film and one end of the first-B film to electrically contact the lead wires formed on the wafer, and the other end of the second-A film and the 2-B film. The other end of the bump may be formed in electrical contact with the base pads of the printed circuit board.

The pressure block may include: a first body coupled to the at least one first bearing and the at least one first elastic member to have elasticity and vertically move; A second body coupled to the at least one first bearing and the at least one second elastic member and vertically moving while being elastic; It may be composed of a connecting portion for connecting the upper side of the first body and the second body.

The bearing is a cross roller guide or a cross ball guide, each of the first elastic member and the second elastic member, one of the upper end and the lower end is coupled to the pressure block by the first fastening means, the upper and lower ends The other one of the may be coupled to the base block by a second fastening means.

The film type probe card according to the present invention has a merit in that the manufacturing process is simple and the manufacturing period is shortened because it is not necessary to form a needle as in the prior art by directly contacting the wafer with the film.

In addition, the film-type probe card according to the present invention can be tested while using the bearing and the elastic member for accurate vertical movement, and by selecting the elastic member according to the elastic modulus to facilitate the overdrive value when contacting the film and wafer. There is an advantage that you can adjust.

In addition, the film-type probe card according to the present invention by bonding the film to the upper surface of the pressing block by using an elastic adhesive, the film is adhered to the upper surface of the pressing block while maintaining a flat state and have a stable film and There is an advantage that the lead wire formed on the wafer may contact.

In addition, the film-type probe card according to the present invention forms a rectangular hole in the upper surface of the pressure block, seat the transparent glass block thereon, and adhere the film thereon to align the camera under the hole of the glass block Through this there is an advantage that can be easily performed alignment.

In addition, the film-type probe card according to the present invention, by fixing the base block to the printed circuit board by using a reinforcement plate to prevent minute distortion of the printed circuit board during the wafer test, formed on the lead wires and the wafer during the test The error of one-to-one contact between the leads can be reduced.

1 is a view showing a needle coupled to a conventional needle type probe card.
FIG. 2 illustrates a needle type pro card in which the needles of FIG. 1 are coupled to a printed circuit board.
3 is a top perspective view of a film type probe card conventionally proposed by the present applicant.
Figure 4 is a bottom perspective view of a film type probe card conventionally proposed by the present applicant.
5 is a top perspective view of a film type probe card according to an embodiment of the present invention.
6 is a bottom perspective view of a film type probe card according to an embodiment of the present invention.
7 is an enlarged view illustrating an enlarged central portion of FIG. 6.
8 is an enlarged view illustrating an enlarged central portion of FIG. 7.
9A to 9C are views illustrating the forms of a film formed on a film type probe card and a film formed on a wafer.
10 is a bottom exploded perspective view of a film type probe card according to an embodiment of the present invention.
11 is a cross-sectional view of a film type probe card proposed by the present applicant.
12 is a cross-sectional view of a film type probe card according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the following embodiments. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an," and "the" include plural forms unless the context clearly dictates otherwise. Also, " comprise " and / or " comprising " as used herein specify the presence of stated shapes, numbers, steps, operations, elements, elements, and / , But does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups. As used herein, the term " and / or " includes any and all combinations of any of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, regions and / or regions, it should be understood that these elements, components, regions, layers and / Do. These terms do not imply any particular order, top, bottom, or top row, and are used only to distinguish one member, region, or region from another member, region, or region. Thus, the first member, region or region described below may refer to a second member, region or region without departing from the teachings of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the present invention should not be construed as limited to any particular shape of the regions illustrated herein, but should include variations in shape resulting from, for example, manufacture.

5 is a top perspective view of a film type probe card according to an embodiment of the present invention, FIG. 6 is a bottom perspective view of a film type probe card according to an embodiment of the present invention, and FIG. 7 is an enlarged center portion of FIG. 6. 8 is an enlarged view illustrating an enlarged view of a central portion of FIG. 7, and FIGS. 9A to 9C are views illustrating shapes of a film formed on a film type probe card and a film formed on a wafer, and FIG. Bottom exploded perspective view of a film type probe card according to an embodiment of the.

5 to 10, a film type probe card for testing a tab IC film by contacting the film 450 formed on a wafer with a film package, that is, a COB type TAB IC film (not shown) ( 400 may include a base block 410, a pressure block 420, a film 450, a printed circuit board 460, and a reinforcing plate 405.

The base block 410 may be coupled to at least one bearing 430 and at least one elastic member 440. The base block 410 may be fixedly coupled to the printed circuit board 460. The pressure block 420 may be vertically moved with elasticity by being combined with at least one bearing 430 and at least one elastic member 440 coupled to the base block 410.

The base block 410 exists in two pairs, and includes a first base block located at one side and a second base block located at the other side. The pressure block 420 is composed of one body, the first body coupled to the first base block by at least one bearing 430 and at least one elastic member 440, the bearing 430 and the elastic member The second body is coupled to the second base block by 440, and the first body and the connecting portion connecting the second body. The bearing 430 and the elastic member 440 may be configured with at least one to couple the first base block and the second base block to the pressure block 420.

The bearing 430 may have a cross guide structure including a first cross roll bearing 433 and a second cross roll bearing 435. For example, the second cross roll bearing 435 is coupled to and fixed to the base block 410, and the first cross roll bearing 433 is coupled to the pressure block 420 to move vertically, so that the pressure block 420 is moved. Can move vertically. For example, the bearing 430 having a cross guide structure may be a cross roller guide or a cross ball guide. When the bearing 430 is the cross roller guide, rollers protrude from the second cross roll bearing 435 and the protruding rollers are inserted into or separated from the grooves formed in the first cross roll bearing 433. The cross roll bearing 433 can move vertically.

In addition, when the bearing 430 is the cross ball guide, as the balls protrude from the second cross roll bearing 435 and the protruding balls are inserted into or separated from the groove formed in the first cross roll bearing 433. The first cross roll bearing 433 can move vertically. Since the structure and operation of the cross roller guide and the cross ball guide are obvious to those skilled in the art, detailed descriptions thereof will be omitted below. In addition, the bearing 430 of the present invention is not necessarily limited to a cross roller guide or a cross ball guide, and other devices may be used as long as the pressing block 420 can move vertically.

At least one elastic member 440 may be coupled between the pressure block 420 and the base block 410 to provide elasticity in the vertical movement direction. For example, the elastic member 440 may have an upper end coupled to the pressure block 420 by the first fastening means 343 and the lower end coupled to the base block 410 by the second fastening means 445. . However, the present invention is not limited to this case, and the lower end of the elastic member 440 may be coupled to the pressure block 420 and the upper end of the elastic member 440 may be coupled to the base block 410. 10 illustrates a case in which the elastic member 440 has a spring shape, but the present invention is not limited thereto, and the elastic member 440 may have another shape if the elastic member 440 may provide elasticity in the vertical movement direction. .

That is, the probe card 400 according to the embodiment of the inventive concept may accurately move vertically while the pressing block 420 has elasticity by using the bearing 430 and the elastic member 440. In addition, since the elastic member 440 can be easily attached to and detached from the base block 410 and the pressure block 420, the elastic member 440 having an appropriate modulus of elasticity may be replaced with the base block 410 and the pressure block (as needed). By coupling to 420, an overdrive value can be easily adjusted when the first film 450 contacts the tab IC film on the wafer. Here, the overdrive value represents a vertical displacement as the vertical pressure is applied when the first film 450 and the tab IC film contact each other, and a constant overdrive value must be ensured without loss of conduction for each electrode line. The electrical signal can be tested.

The pressure block 420 may be formed through a rectangular hole formed in the upper surface. That is, the pressure block 420 may be composed of the first body, the second body and the connecting portion, by the edge of the connecting portion, the upper side of the first body and the second body can take the form of a rectangular window frame shape. have. Of course, at this time, the first body, the second body and the connecting portion may be formed separately, coupled or integrally formed.

Specifically, the first body and the second body is coupled by the front base block 410 and the bearing 430 and the elastic member 440, and has a vertical flat plate shape, the connecting portion of the first body and the first 2 Both ends of the upper side of the body has a form in which two rods are connected.

7 and 8, an enlarged view of the upper portion of the pressure block 420 formed in such a structure is shown. The upper portion of the pressure block 420 is seated on the rim around the hole is covered with a glass block 480 of a transparent material to cover the hole. The first-A film 450a and the first-B film 450b are adhered to the upper portion of the glass block 480 by an elastic adhesive on both edges of the glass block 480. The first-A film 450a and the first-B film 450b may include a plurality of electrode lines formed on an insulating film, and one end of the electrode lines may contact the lead wires of the tab IC film. Bonded to the upper portion, the reinforcing plate 405 is coupled to the printed circuit board 460 through the fastening member 407.

When the first-A film 450a and the first-B film 450b are bonded to the upper portion of the pressure block 420 by the elastic adhesive, the first-A film 450a and the first as the elastic adhesive solidifies. An elastic layer having a uniform flatness is formed between the 1-B film 450b and the upper portion of the glass block 480. Since the elastic layer has a uniform flatness, one end of the electrode lines and the lead wires of the tab IC film may be contacted at the same time, and the elastic layer provides elasticity, so that when the pressure is applied downward, the tab is contacted more stably at the contact point. Damage to the lead wires of the IC film can be prevented.

The elastic adhesive may be a silicone adhesive. However, the elastic adhesive in the present invention is not limited to the case of the silicone adhesive, and if the elastic layer can be formed while adhering the first film 450 on the glass block 480, other various kinds of adhesives can be used. have. In addition, as will be described later, the elastic adhesive is transparent or translucent for pitch photographing by an alignment camera (not shown) positioned on the opposite side of the first film 450 based on the glass block 480 through the glass block 480. It is preferably formed of a material.

10, it can be seen that the bottom exploded perspective view of the film type probe card 400 of the present invention is shown. Referring to FIG. 10, the pressure block 420 is coupled to two pairs of base blocks 410 by a bearing 430 and an elastic member 440.

Each film is composed of a pair, one end of which is adhered to the first film 450, the other end of the first film 450 and the first pad in contact with the base pad of the printed circuit board 460 It consists of two films 451. The reason for separating and configuring the first film 450 and the second film 451 as described above will be described with reference to FIGS. 11 and 12.

In this case, the first film 450 is composed of a first-A film 450a and a first-B film 450b, and the second film is a second-A film 451a and a second-B film 451b. It is composed of One end of the first 1-A film is bonded to the upper surface of the one side of the pressure block 420 by a first elastic adhesive, the other end of the first 1-A film is bonded to the one end of the 2-A film, the first 1-B One end of the film 450b is bonded to the other upper surface of the pressure block 420 by a second elastic adhesive, and the other end of the first-B film 450b is coupled to one end of the second-B film 451b. .

One end of the second-A film 451a is coupled to the other end of the first-A film 450a, and the other end is connected to the base pad 463 formed on the printed circuit board 460, and the second-B film ( One end of 451b is coupled to the other end of the first-B film 450b and the other end is connected to the base pads 463.

The first film 450 and the second film 451 are fixed to the printed circuit board 460 by the fixing plate 470. At this time, the fixing plate 470 and the base block 410 is coupled to the printed circuit board 460 by being coupled by the reinforcing plate 405 and the fastening member.

Specifically, the reinforcement plate 405 is disposed on the opposite side of the printed circuit board 460 to which the first base block 410 and the second base block 410 are coupled, and the first base block 410. And a fastening member coupled to a fastening hole formed in the fastening hole formed in the second base block 410 and the fastening hole formed in the reinforcing plate 405, and thus, the first base block 410 and the second base block 410 and The reinforcement plate 405 may be fixed to the printed circuit board 460.

In addition, one end of the first-A film 450a and the first-B film 450b is bonded to the glass block 480 disposed on the upper surface of the pressure block 420, and the other end of the first-A film 450a and the first-B film 450b is attached to the second 2-A film ( 451a) and one end of the second-B film 451b, and the other ends of the second-A film 451a and the second-B film 451b are formed on the printed circuit board 460. Is in contact with.

In this case, the at least one fixing plate 470 is coupled to the fixing plate 405 and the fastening hole which are disposed on the opposite side of the printed circuit board 460, so that the first film 450 and the second film ( 451).

Likewise, the pair of base blocks 410 are also fixedly fixed by the fixing member 405 and the fastening member disposed on the opposite side of the printed circuit board 460. In this case, a hole may also be formed at a position corresponding to the fastening hole formed in the fixing plate 470, the base block 410, and the fixing plate 470 of the printed circuit board 460.

Features and effects of such a structure will also be described later with reference to FIGS. 11 and 12.

5 and 6 it can be seen in the film type probe card 400 is stably coupled to this structure.

Referring to FIGS. 7 and 8, the contact portions of the first-A film 450a and the first-B film 450b which are in contact with each other during the wafer test of the film type probe card 400 of FIG. You can check the magnification.

The first-A film 450a and the first-B film 450b may be connected to input terminals and output terminals of the tab IC film formed on the wafer, respectively, to perform a test. In general, since the pitch of the output terminal is relatively narrow compared to the input terminal, the pitch of the electrode line of the first-B film 450b is more precisely formed than the pitch of the electrode line of the first-A 450a. It is.

One end of the first-A film 450a and the first-B film 450b is adhered to each of the upper sides of the glass block 480 by the elastic adhesive 490, and the lead wire of the tab IC film is at the end. A bump 455 is formed for electrical contact with the fields. The bump 455 may have various shapes depending on the tab IC film to be tested. At this time, of course, the bump 455 is formed to have the same pattern and pitch as the lead wires of the input terminal and the output terminal of the tab IC film.

In addition, although not shown in FIG. 8, bumps are also formed at the other ends of the second-A film 451a and the second-B film 451b, and the bumps are formed on the back of the printed circuit board 460. It is formed to be in electrical contact with the pad 463.

9A to 9C are diagrams showing examples of the tab IC film to be tested and the first film of the film type probe card of the present invention.

9A shows the tab IC film A to be tested. It can be seen that test pads are formed at the ends of the tab-cylindrical A, and alignment keys AK1 are formed at left and right sides of the pad ends.

9B illustrates a specific shape of the first film 450 of the present invention. It can be seen that the test pad is also formed in an area corresponding to the test pad formed on the tabish film A, and the alignment key AK2 is also formed on the left and right sides of the pad end. For convenience, the lead wires and the pads are shown in dashed lines.

FIG. 9C is a view illustrating a state where the tab IC film A of FIG. 9A and the first film 450 of FIG. 9B overlap. At this time, the alignment may be aligned by aligning the alignment key AK1 and the alignment key AK2 formed to facilitate the alignment as shown in FIG. 9C. In this case, the position and shape of the alignment key AK1 and the alignment key AK2 of FIG. 9C are exemplary, and may be formed in other positions in various other shapes.

In addition, although not shown in the drawings, the film type probe card 400 according to the present invention may further include an alignment camera to facilitate alignment by adopting a transparent glass block 480.

That is, the tab IC film is fixed on the upper portion of the film type probe card 400 in the state shown in Figure 5 is fixed by a separate device is lowered to be seated on the upper portion of the glass block 480, at this time, It is necessary to confirm that the electrode lines of the input terminal and the output terminal are aligned.

The present invention provides a rectangular hole in the center of the pressing block 420, the transparent glass block 480 is seated thereon, and the contact portion of the first film 450, that is, the bump terminal is positioned thereon. Accordingly, alignment may be facilitated while confirming that the pitch between the lead wires of the tab IC film and the electrode lines of the first film 450 coincides with the alignment camera positioned at the lower hole of the glass block 480. It becomes possible. Of course, as mentioned above, the elastic adhesive is preferably selected from a transparent material so as not to interfere with the alignment, for example, may be a transparent silicone adhesive. Of course, aligning can be performed more easily by aligning the align key as mentioned above.

In addition, although not shown in the drawing, by forming two or more block structures of the structure on the printed circuit board 460, it will be possible to test a plurality of tab IC film at the same time.

By adopting such a structure, the film type probe card 400 according to the present invention enables the driving IC to effectively test the tab IC film packaged on the flexible circuit board without damaging the lead wire with a simple structure. In addition, there is no need to place a test terminal (test pad) for testing on the tab IC film, so that the test can be performed by directly contacting the OLB line, so that the tab IC film can be miniaturized and the material cost can be reduced. It also has an effect.

11 is a cross-sectional view of a film type probe card proposed by the present applicant.

In the case of the conventional film type probe card of FIG. 11, the base block and the fixing plate are directly coupled to the printed circuit board 360, and it can be seen that a pair of films 350a and 350b are used. That is, as shown in the 11A region, the bump formed at the other end of the film 350a contacts the printed circuit board 360 as the other end of the film 350a is in the C region, and one end of the film 350a is in the 11B region. As in the film 350a is bonded to the glass block 380 through the elastic adhesive 390.

At this time, the printed circuit board 360 may be minutely deformed at the time of film test. At this time, the position of the base block directly fixed to the printed circuit board 360 and the fixing position of the fixing plate may be changed. This can interfere with, and in extreme cases, pin miss.

In addition, in the above structure, since the films 350a and 350b are made of one, when the test target of the film type probe card is changed, the specifications of the films 350a and 350b are also changed. Since it had to be manufactured again, there was a disadvantage that the common use of the printed circuit board was impossible.

12 is a cross-sectional view of a film type probe card according to an embodiment of the present invention.

 In the case of the film type probe card of FIG. 12, as described above, a reinforcing plate 405 is disposed on one side of the printed circuit board 460, and a fixing plate 470 and a base block are disposed on the other side. . In this state, as described above, the fixing plate 470 and the base block are directly coupled to and fixed to the reinforcing plate 405 through a fastening member such as a screw.

Through the above structure, the deformation of the printed circuit board 460 is prevented in the first place, so that alignment or misalignment can be prevented during film testing.

In addition, as in the 12A region, the other end of the first film 450a contacts one end of the second film 451a, and the other end of the second film 451a is the base of the printed circuit board 460 as in the D region. Make contact with the pad. Meanwhile, as in area 12B, one end of the first film 450a is in contact with the glass block 480 by the elastic adhesive 490, and a bump 455 is formed on the end of the first film 450a.

Since the first film 450 and the second film 451 are configured as described above, only the second film 451 capable of adjusting the arrangement between the electrode lines according to the first film 450 may be manufactured. There is an advantage that can be shared (460).

The embodiment of the present invention has been described above with reference to the drawings. However, this is only for the purpose of describing the present invention and is not described to limit or limit the contents of the present invention. Therefore, those skilled in the art can make various modifications and equivalents therefrom. It will be possible to implement one other embodiment, therefore, the true technical protection scope of the invention should be defined by the technical details of the appended claims.

400: film type probe card 405: reinforcement plate
410: base block 420: pressure block
430: bearing 440: elastic member
450: first film 451: second film

Claims (8)

In the film type probe card for testing the wafer by contacting the film to the wafer,
A first base block to which at least one first bearing and at least one first elastic member are coupled;
A second base block to which at least one second bearing and at least one second elastic member are coupled;
One side is coupled to the at least one first bearing and the at least one first elastic member, and the other side is coupled to the at least one second bearing and the at least one second elastic member to the first base block and the A pressing block vertically moving while being fastened to the second base block;
A first film having a plurality of electrode lines formed on the insulating film and having one end adhered to an upper surface of the pressing block;
A second film having a plurality of electrode lines formed on the insulating film, one end of which is in contact with the other end of the first film, and the other end of which is in contact with the wafer;
A printed circuit board having a plurality of base pads formed thereon, the electrode lines formed at the other end of the second film and the second film coupled to the base pads electrically connected thereto;
The first film is composed of a first-A film and a first-B film,
The second film is composed of a second-A film and a second-B film,
One end of the first-A film is bonded to the upper surface of the one side of the pressing block by a first elastic adhesive, the other end of the first-A film is bonded to one end of the second-A film,
One end of the first-B film is bonded to the other upper surface of the pressure block by a second elastic adhesive, the other end of the first-B film is bonded to one end of the second-B film,
One end of the second 2-A film is coupled to the other end of the first A-film, the other end is connected to the base pads,
One end of the second 2-B film is coupled to the other end of the first-B film, and the other end is connected to the base pads.
The upper surface of the pressing block is formed with a hole through the center,
The upper surface of the pressing block is seated to cover the hole, and further provided with a glass block formed of a transparent material,
The first-A film and the first-B film are attached to the glass block seated on the upper surface of the pressure block by the first elastic adhesive and the second elastic adhesive, respectively.
The first elastic adhesive and the second elastic adhesive is formed of a transparent material,
Align marks are formed at one ends of the first-A film and the first-B film to facilitate alignment.
A reinforcing plate is coupled to a surface opposite to a surface on which the first base block and the second base block are coupled among the printed circuit boards.
The first base block, the second base block and the reinforcement plate are coupled to and fixed to the fastening holes formed in the first base block and the second base block and the fastening holes formed in the reinforcement plate. Film type probe card, characterized in that coupled to the fixed. The method of claim 1,
The glass block is a film type probe card, characterized in that formed of a glass material. The method of claim 1,
The first elastic adhesive and the second elastic adhesive film type probe card, characterized in that the silicone adhesive. The method of claim 1,
A first fixing plate for pressing and fixing a portion at which the other end of the 1-A film and one end of the 2-A film are coupled, and a portion at which the other end of the 2-A film and the base pads are coupled;
And a second fixing plate for pressing and fixing a portion to which the other end of the 1-B film and one end of the 2-B film are coupled and a portion to which the other end of the 2-B film and the base pads are coupled.
The first fixing plate, the second fixing plate and the reinforcing plate are coupled to and fixed to the fastening hole formed in the first fixing plate and the second fixing plate and the fastening hole formed in the reinforcing plate. Film type probe card, characterized in that coupled to the fixed. The method of claim 1,
And an alignment camera positioned in the hole under the glass block. The method of claim 1,
One end of the first-A film and one end of the first-B film have bumps in electrical contact with the lead wires formed on the wafer,
And a bump in electrical contact with the base pads of the printed circuit board at the other end of the second-A film and the second end of the second-B film. The method of claim 1,
The pressure block,
A first body coupled to the at least one first bearing and the at least one first elastic member and vertically moving with elasticity;
A second body coupled to the at least one first bearing and the at least one second elastic member and vertically moving while being elastic; And
Film type probe card, characterized in that consisting of a connecting portion for connecting the upper side of the first body and the second body. The method of claim 1,
The first bearing and the second bearing are cross roller guides or cross ball guides,
Each of the first elastic member and the second elastic member,
One of the upper and lower ends is coupled to the pressure block by a first fastening means, and the other of the upper and lower ends is coupled to the first base block and the second base block by a second fastening means. Film type probe card.

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