CN201897468U - Probe card detecting system - Google Patents
Probe card detecting system Download PDFInfo
- Publication number
- CN201897468U CN201897468U CN2010206363294U CN201020636329U CN201897468U CN 201897468 U CN201897468 U CN 201897468U CN 2010206363294 U CN2010206363294 U CN 2010206363294U CN 201020636329 U CN201020636329 U CN 201020636329U CN 201897468 U CN201897468 U CN 201897468U
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- probe
- displacement mechanism
- detection system
- shaft displacement
- coordinate
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Abstract
The utility model relates to a probe card detecting system which comprises a machine station, a carrying seat, a database, an image capturing device, a three-axis optical ruler and a controller, wherein an upward three-axis displacement mechanism is arranged on the machine station; the carrying seat is erected on the machine station; a data file is memorized in the database; the data file comprises multiple groups of benchmark data corresponding to XY coordinate information of a plurality of probes in a plurality of regions on a probe card; the image capturing device and the three-axis optical ruler are fixed on the upward three-axis displacement mechanism; and the controller is electrically connected with the database, the image capturing device and the three-axis optical ruler. Therefore, the probe card detecting system can achieve the aim that deformation displacement and flatness of the probes of the probe card can be measured in a noncontact way.
Description
Technical field
The utility model is about a kind of probe detection system, refers to the system that a kind of detector probe card may expenditure especially.
Background technology
After the integrated circuit component on the silicon wafer is finished making, before carrying out follow-up encapsulation flow process, need through the silicon wafer testing process, to eliminate bad integrated circuit component, the yield of encapsulation is improved.Generally speaking, the method for silicon wafer test is to utilize many probes to contact electric contact (Pad) on the integrated circuit component accordingly, measures the electric characteristics of integrated circuit component thus, to differentiate the very corrupt of integrated circuit.Whether after probe is used a period of time probe deformations, wear problems can take place inevitably, therefore need carry out probe in detecting and need repair to differentiate.
Probe physical data measurement at present has manually/automatic dual mode, and hand inspection only can be measured every probe by tool microscope: probe location variation, probe tip length (Tiplength), flatness (Planarity) etc.The shortcoming of existing probe detection mode is to measure length consuming time, measured value can not be got rid of the individual collimation error.And at present the automatic checkout equipment shortcoming be can not measuring probe tip length, need with the hand inspection complementation, form the conversion of multitask position, waste of manpower and supervision time.
Especially measuring about flatness is to adopt contact to measure, that is slides on a detection tool plane with probe, can cause the tool material deterioration inside, packed particle in the groove that also causes forming, thereby measured flatness is underestimated.
The utility model content
In order to solve prior art problems, the purpose of this utility model provides a kind of probe detection system.
Probe detection system of the present utility model is used to detect the expenditure of bearing of a probe, and detection system comprises that a board, puts seat, a database, an image capture unit, one or three optics chis and a controller.
Above-mentioned board is provided with a top three-shaft displacement mechanism, puts mounting and is located at board.Above-mentioned database has a data file, and data file includes many groups reference data of the many probe XY coordinate informations in a plurality of zones on the corresponding probe.
Image capture unit and three optics chis are fixed in top three-shaft displacement mechanism, and controller is electrically connected at database, image capture unit and three optics chis.
Above-mentioned put the seat can be to be hubbed at board.Detection system can also comprise the electrical measuring head in a top, the electrical measuring head of a below three-shaft displacement mechanism and a below that electrically connects with controller, wherein the electrical measuring head in top is fixed in top three-shaft displacement mechanism, and the electrical measuring head in below is fixed in below three-shaft displacement mechanism.Thus, can measure simultaneously probe upper contact group whether unusually.
Detection system can also comprise an attention device, electrically connects with controller.Attention device for example is a hummer or a light-emitting device, to allow the staff learn that in real time probe measures abnormal results.
The beneficial effects of the utility model: the utility model is by this system design, can avoid existing and cause tool loss and the inaccurate situation of measurement result, also exempt the time-consuming and unreliable work pattern of measuring with the manually-operated microscope because of contact measures the probe flatness.The utility model can reach noncontact and measure the probe deformations displacement of probe and the purpose of flatness.
Description of drawings
Fig. 1 is the probe detection system stereographic map of the utility model one preferred embodiment.
Fig. 2 is that the probe detection system element of the utility model one preferred embodiment electrically connects synoptic diagram.
Fig. 3 is the probe detection method process flow diagram of the utility model one preferred embodiment.
Fig. 4 is the probe area dividing synoptic diagram of the utility model one preferred embodiment.
Fig. 5 is that the probe detection system of the utility model one preferred embodiment measures probe tip length synoptic diagram.
Fig. 6 is that the probe detection system of the utility model one preferred embodiment measures the probe contact group synoptic diagram that electrically conducts.
The main element symbol description
Controller 12, comparing unit 121,
Computing unit 122 electrically measures unit 123,
Database 13, image capture unit 14,
Three optics chis 15, X-axis optics chi 151,
Y-axis optics chi 152, Z axle optics chi 153,
Top three-shaft displacement mechanism 16, X-axis shifter 161,171,
Y-axis shifter 162,172, Z axial translation device 163,173,
Below three-shaft displacement mechanism 17, the electrical measuring head 18 in top,
The below is measuring head 19 electrically, probe 50,
Below contact 504b, attention device 51,
Zone A1, A2, A3, A4, probe tip point P1,
Probe turning point P2.
Embodiment
With reference to figure 1 and Fig. 2, be respectively probe detection system stereographic map and element thereof and electrically connect synoptic diagram.The utility model is to utilize a detection system to detect the expenditure of bearing of a probe, and detection system shown in the figure comprises that a board 10, puts seat 11, one controller 12, a database 13,14,1 optics chis 15 of an image capture unit, the electrical measuring head 19 of an electrical measuring head 18 in a top and a below.Put seat and 11 be set up in board 10, use in this example a kind of can controlled upset put seat 11.Board 10 is provided with a top three-shaft displacement mechanism 16 and a below three-shaft displacement mechanism 17, lays respectively at the opposition side that puts seat 11.
Each three-shaft displacement mechanism 16,17th by an X-axis shifter 161,171, a Y-axis shifter 162,172,163,173 formations of a Z axial translation device, is responsible for the displacement task of X-axis, Y-axis, Z axle three directions respectively.And three optics chis 15 are made of an X-axis optics chi 151, a Y-axis optics chi 152, a Z axle optics chi 153, are responsible for the displacement measurement task of X-axis, Y-axis, Z axle three directions respectively.
Controller 12 includes a comparing unit 121, a computing unit 122 and electrically measures unit 123.Database 13 has data file, and content data file includes many groups reference data of the many probe XY coordinate informations in a plurality of zones on the corresponding probe 50, and measured conduct is with reference to the triaxial coordinate information of benchmark under the intact probe card state that may use of its expression.
With reference to figure 1～3, desire the detector probe card and may expenditure can carry out according to the following step flow process.In steps A, earlier probe 50 to be measured is seated in and puts seat 11 and locate, and probe 50 is to put up to have probe 503 one sides (claiming probe face 502).
Among the step B, involution image capture unit 14 to one true origin just see through basic pre-set programs and do the action that system coordinates makes zero.Herein simultaneously in addition with reference to figure 4, among the step C, utilize top three-shaft displacement mechanism 16 in XY plane movable image capture device 14 to first regional A1, to capture many probe tip images in the zone.Because the area dividing of probe 50 is ready-made in advance, for example be divided into N zone, then each zone is labeled as in regular turn A1～AN and (four regional A1 only is shown among the figure, A2, A3, A4 is as representative), so each regional location action of image capture unit 14 migrations is can be easy to reach in controller 12 through designing program.
Among the step D, see through top three-shaft displacement mechanism 17 and (aim at probe tip point P1 operation to obtaining first clear probe tip image in Z-direction movable image capture device 14, see Fig. 5), then move to the probe (graticule with the image capture unit camera lens is aimed at probe tip) of corresponding clear probe tip image along the XY plane, write down one group of actual measurement coordinate data that three optics chis show this moment, promptly comprise X-axis coordinate figure, Y-axis coordinate figure, Z axial coordinate value.In this step, also move this image capture unit 14 to obtaining first clear probe turning point image and writing down a probe turning point Z coordinate figure, aim at probe turning point P2 operation, as shown in Figure 5 in Z-direction.
In step e, to all the other probe image repeating step D of first area A1, to obtain all group actual measurement coordinate datas of single area.In step F,, obtain all group actual measurement coordinate datas of All Ranges A1～AN to all probe repeating step C～E of all the other regional A2～AN.
In step G, in case obtain the actual measurement coordinate information of probe 50 all probes, the computing unit 122 that just can see through controller 12 calculates all actual measurement coordinate datas and corresponding reference data about the difference of X coordinate figure and the difference of Y coordinate figure, and calculates all and organize the meta Z coordinate figures of surveying coordinate datas and the difference of other Z coordinate figure.The difference of the difference of X coordinate figure and Y coordinate figure promptly represent probe the X coordinate with at the variable quantity of Y coordinate direction.
In step H, when the X of all probes coordinate and Y changes in coordinates amount are all learnt, also the whole Displacements Distribution overview of probe on the probe 50 has been grasped in expression, just can see through comparing unit 121 this moment sets with regard to the judgement of comparing of the allowable tolerance of X coordinate figure aspect and Y coordinate figure aspect according to database 13, if have arbitrary X coordinate difference or Y coordinate difference to exceed the allowable tolerance value, just judge defectively, promptly can't bear to use.
On the other hand, with regard to the probe flatness detects, be to get in all probe actual measurement coordinate datas, the meta coordinate figure of Z coordinate figure is used as a benchmark, calculate other probe Z coordinate figure difference of benchmark Z coordinate figure therewith, if there is arbitrary difference to surpass the allowable tolerance value that database 13 sets, just judge defectively, promptly can't bear to use.
In addition, in the cantalever type probe card occasion, the Z coordinate figure that is obtained to survey coordinate data by above-mentioned optics chi is based on each probe tip top, if also each probe turning point is carried out the image focusing to obtain the step of clear probe image simultaneously, and writing down this 2nd Z coordinate figure, the computing unit 122 of controller 12 calculates and just can utilize two Z coordinate figures to obtain probe tip length (tip length) according to simple geometry calculating.
Also can install an attention device 51 additional at board 10, itself and controller 12 electrically connect.When probe is determined when defective, just control attention device 51 and send alerting.For example attention device 51 is that a hummer then sends sound alerting; Attention device 51 is that a light-emitting device then sends the light alerting, can present flicker or permanent bright light state.
Herein in addition also simultaneously with reference to figure 6.After step H, more can will put seat 11 upsets, become contact (side of deserving to be called contact 504a) that probe 50 do not have probe 503 one sides (claiming circuit board face 501 again) towards image capture unit 14, i.e. step I.
Then in step J, see through top three-shaft displacement mechanism 16 and move the electrical measuring head 18 in the top that is fixed thereon, and see through below three-shaft displacement mechanism 17 and move the electrical measuring head 19 in the below that is fixed thereon, simultaneously with two electrical measuring heads 18, one contact group of 19 difference contact probe cards 50 (comprising top contact 504a and corresponding below contact 504b) is carried out the test that electrically conducts of this contact group.Certainly, in this example, the electrical measuring head 19 in below also can be to contact on probe 503, can reach electrical measurement purpose equally.
In step K,, carry out the testing electrical property of next contact group if this contact group test result is normal; If this contact group test result is undesired, carry out outcome record and start image capture unit 14 taking this contact group.Step L is at probe 50 all the other contact group repeating step J～K.
Because being aided with to take, electrical bad contact judges whether outward appearance obviously damage or dirty oxidation, will easier very first time affirmation problem points place.
The foregoing description only is to give an example for convenience of description, and the interest field that the utility model is advocated should be as the criterion so that claim is described certainly, but not only limits to the foregoing description.
Claims (6)
1. a probe detection system is characterized in that, is used to detect the expenditure of bearing of a probe, and this detection system comprises:
One board is provided with a top three-shaft displacement mechanism;
One puts seat, is set up in this board;
One database has a data file, and this data file includes the many groups reference data to the many probe XY coordinate informations in a plurality of zones on should probe;
One image capture unit is fixed in this top three-shaft displacement mechanism;
One or three optics chis are fixed in this top three-shaft displacement mechanism; And
One controller is electrically connected at this database, this image capture unit and this three optics chis.
2. detection system as claimed in claim 1 is characterized in that, this puts seat is to be hubbed at this board.
3. detection system as claimed in claim 2, it is characterized in that, also comprise the electrical measuring head of an electrical measuring head in a top and a below and the below three-shaft displacement mechanism that electrically connect with this controller, this top three-shaft displacement mechanism is fixed in this top electrically measuring head, and this below three-shaft displacement mechanism is fixed in this below electrically measuring head.
4. detection system as claimed in claim 1 is characterized in that, comprises that also an attention device and this controller electrically connect.
5. detection system as claimed in claim 4 is characterized in that, this attention device is a hummer.
6. detection system as claimed in claim 4 is characterized in that, this attention device is a light-emitting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206363294U CN201897468U (en) | 2010-11-26 | 2010-11-26 | Probe card detecting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206363294U CN201897468U (en) | 2010-11-26 | 2010-11-26 | Probe card detecting system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201897468U true CN201897468U (en) | 2011-07-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206363294U Expired - Lifetime CN201897468U (en) | 2010-11-26 | 2010-11-26 | Probe card detecting system |
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| Country | Link |
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| CN (1) | CN201897468U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478385A (en) * | 2010-11-26 | 2012-05-30 | 京隆科技(苏州)有限公司 | Probe card detection method and system |
| CN102878974A (en) * | 2012-10-19 | 2013-01-16 | 上海华岭集成电路技术股份有限公司 | Probe card evenness detecting method |
| CN103017646A (en) * | 2012-12-10 | 2013-04-03 | 上海电力学院 | Large-range crack length measurement device |
| CN103376341A (en) * | 2012-04-18 | 2013-10-30 | 南茂科技股份有限公司 | Vertical probe card and detection module applying same |
| CN103400238A (en) * | 2013-08-14 | 2013-11-20 | 上海华力微电子有限公司 | Wafer test probe card management system and using method thereof |
| CN103869270A (en) * | 2012-12-12 | 2014-06-18 | 颀中科技（苏州）有限公司 | Automatic maintenance equipment of probe card and method thereof |
| CN110230989A (en) * | 2018-03-06 | 2019-09-13 | 均豪精密工业股份有限公司 | Probe card adjusts needle maintenance system and its method online |
| CN110736860A (en) * | 2018-07-18 | 2020-01-31 | 均豪精密工业股份有限公司 | Method for correcting position of mechanism after probe card replacement and measuring device thereof |
-
2010
- 2010-11-26 CN CN2010206363294U patent/CN201897468U/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478385B (en) * | 2010-11-26 | 2014-04-16 | 京隆科技(苏州)有限公司 | Probe card detection method and system |
| CN102478385A (en) * | 2010-11-26 | 2012-05-30 | 京隆科技(苏州)有限公司 | Probe card detection method and system |
| CN103376341A (en) * | 2012-04-18 | 2013-10-30 | 南茂科技股份有限公司 | Vertical probe card and detection module applying same |
| CN103376341B (en) * | 2012-04-18 | 2016-02-03 | 南茂科技股份有限公司 | Vertical probe card and detection module applying same |
| CN102878974B (en) * | 2012-10-19 | 2015-10-07 | 上海华岭集成电路技术股份有限公司 | Probe measurement method of planeness |
| CN102878974A (en) * | 2012-10-19 | 2013-01-16 | 上海华岭集成电路技术股份有限公司 | Probe card evenness detecting method |
| CN103017646A (en) * | 2012-12-10 | 2013-04-03 | 上海电力学院 | Large-range crack length measurement device |
| CN103869270A (en) * | 2012-12-12 | 2014-06-18 | 颀中科技（苏州）有限公司 | Automatic maintenance equipment of probe card and method thereof |
| CN103869270B (en) * | 2012-12-12 | 2016-09-28 | 颀中科技（苏州）有限公司 | The automatic maintenance of equipment of probe card and method |
| CN103400238A (en) * | 2013-08-14 | 2013-11-20 | 上海华力微电子有限公司 | Wafer test probe card management system and using method thereof |
| CN110230989A (en) * | 2018-03-06 | 2019-09-13 | 均豪精密工业股份有限公司 | Probe card adjusts needle maintenance system and its method online |
| CN110736860A (en) * | 2018-07-18 | 2020-01-31 | 均豪精密工业股份有限公司 | Method for correcting position of mechanism after probe card replacement and measuring device thereof |
| CN110736860B (en) * | 2018-07-18 | 2021-11-26 | 均豪精密工业股份有限公司 | Method for correcting position of mechanism after probe card replacement and measuring device thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110713 |
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| CX01 | Expiry of patent term |