CN103400238A - Wafer test probe card management system and using method thereof - Google Patents
Wafer test probe card management system and using method thereof Download PDFInfo
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- CN103400238A CN103400238A CN2013103547398A CN201310354739A CN103400238A CN 103400238 A CN103400238 A CN 103400238A CN 2013103547398 A CN2013103547398 A CN 2013103547398A CN 201310354739 A CN201310354739 A CN 201310354739A CN 103400238 A CN103400238 A CN 103400238A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention provides a wafer test probe card management system and a using method thereof. Probe cards are classified through a classification unit; various states of the probe cards are monitored and managed in real time through a state management unit; to-be-processed probe cards are checked through a distribution unit, if the to-be-processed probe cards are suitable for use, the to-be-processed probe cards are conveyed into a wafer production line and the states of the to-be-processed probe cards are switched into the use states, and if the to-be-processed probe cards are not suitable for use, the to-be-processed probe cards are conveyed into specified flows via the states of the to-be-processed probe cards, and the states of the to-be-processed probe cards are switched. Therefore, the invention essentially provides a management scheme about the process including establishing, use, use ending and scrapping of the probe cards, in the management process, the system automatically determines the conditions of the probe cards and then starts production, which replaces the manual management manner, so that the problems about time consumption and labor consumption as well as easiness in mistake making due to human judgment are solved, and the industrial efficiency is improved.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to a kind of wafer test probe card management system and using method thereof.
Background technology
The purpose of wafer sort, be that every on wafer crystal grain is carried out testing electrical property, to eliminate the defective crystal grain on wafer.The routine techniques of wafer sort is to test with a kind of wafer probe cards, can use dissimilar probe during wafer sort, and probe is at present main by manually completing with management, the risk that this labor management mode certainly will exist low, the artificial judgement of efficiency to make mistakes.
Therefore, need a kind of new management system of probe timely and effectively and using method thereof to manage probe, to meet the needs of efficient Foundry industry.
Summary of the invention
The object of the present invention is to provide a kind of wafer test probe card management system and using method thereof, replace the mode of labor management, the risk of avoiding artificial judgement to make mistakes, improve industrial efficiency.
For addressing the above problem, the present invention proposes a kind of wafer test probe card management system, comprising:
Taxon, be used for according to the predefine mode classification each probe classification;
The condition managing unit, be used for monitoring and manage the various states of each probe;
Dispatching Unit, be used for according to the classified information of described taxon and the state of condition managing unit, check whether described pending probe is fit to use on wafer production line,, if pending probe be fit to be used, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.
Further, described Dispatching Unit also is used for each state of the distribution procedure of described pending probe is updated in described condition managing unit.
Further, described various state comprises: use, test, idle, wait to maintain, maintain, treat maintenance, maintenance, examine, check, deposit, put in storage, scrap.
Further, described appointment flow process comprise test, wait to maintain, maintain, wait to keep in repair, maintenance, examine, at least a in checking, deposit, put in storage, scrapping.
Further, described condition managing unit is provided with administration authority, and described administration authority is used for the different interest fields to the open probe card state management of different user.
Further, described administration authority comprises process engineer's authority and production line operation work authority, and described process engineer's authority comprises the test of switching probe, waits to maintain, maintains, treats maintenance, maintenance, examine, checks, deposits, scraps state; Described operative employee's authority comprises use, free time of switching probe, waits to maintain, maintains, treats maintenance, maintenance, examine state, checks, deposits, the warehouse-in state.
Further, described Dispatching Unit checks that the step whether pending probe is fit to use on wafer production line comprises: judge whether described wafer production line board state is available; Whether the type that judges pending probe meets the type of wafer production line appointment and judges whether the state of pending probe is idle.
Further, described wafer test probe card management system also comprises the historical information query unit, for the inquiry of the history management information that each probe is provided.
Further, described wafer test probe card management system also comprises alarm unit, is used for being not suitable for using alarm in described pending probe.
The present invention also provides a kind of using method of one of above-mentioned wafer test probe card management system, comprising:
Adopt described taxon to each probe classification;
Adopt the various states of condition managing unit Real Time Monitoring and each probe of management;
Adopt Dispatching Unit to check pending probe,, if pending probe is fit to use, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.
Compared with prior art, wafer test probe card management system of the present invention and using method thereof, classify to each probe by taxon; Various states by condition managing unit Real Time Monitoring and each probe of management; By Dispatching Unit, pending probe is checked,, if pending probe be fit to be used, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.Thereby wafer test probe card management system of the present invention and using method thereof, a kind of foundation from probe is provided in fact, has used to use and finish even to scrap the Managed Solution of process, start again after system automatic decision probe condition in management process to produce, the mode that has replaced labor management, the problem of having avoided artificial judgement to take time and effort and easily make mistakes, improved industrial efficiency.
Description of drawings
Figure 1 shows that the Organization Chart of the wafer test probe card management system of the specific embodiment of the invention;
Figure 2 shows that the probe card state schematic diagram of the specific embodiment of the invention;
Figure 3 shows that probe card state switching and the rights management figure of the specific embodiment of the invention;
Figure 4 shows that the using method process flow diagram of the wafer test probe card management system of the specific embodiment of the invention;
Whether the pending probe that Figure 5 shows that the specific embodiment of the invention is fit to the decision flow chart of using.
Specific embodiment party
Core concept of the present invention is to propose a kind of wafer test probe card management system and using method thereof, replaces the mode of labor management, and the risk of avoiding artificial judgement to make mistakes, improve industrial efficiency.Described wafer test probe card management system comprises: taxon is used for according to the predefine mode classification each probe classification; The condition managing unit, be used for monitoring and manage the various states of each probe; Dispatching Unit, be used for according to the classified information of described taxon and the state of condition managing unit, check whether described pending probe is fit to use on wafer production line,, if pending probe be fit to be used, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.The using method of described wafer test probe card management system comprises: adopt described taxon to each probe classification; Adopt the various states of condition managing unit Real Time Monitoring and each probe of management; Adopt Dispatching Unit to check pending probe,, if pending probe is fit to use, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.
, for purpose of the present invention, feature are become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is further described, yet the present invention can realize with different forms, should just not be confined to described embodiment.
Please refer to Fig. 1, the invention provides a kind of wafer test probe card management system, comprising:
Dispatching Unit 13, be used for according to the classified information of described taxon 11 and the state of condition managing unit 12, check whether described pending probe is fit to use on wafer production line,, if pending probe be fit to be used, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe;
Historical information query unit 14, for the inquiry of the history management information that each probe is provided;
In the present embodiment, the classification of taxon 11 can be carried out the name of probe according to the predefine naming rule at the beginning of each probe is set up, just completed the classification of this new probe after namely a new probe is named according to the predefine naming rule, and should new probe typing wafer probe card management system of the present invention, described predefine naming rule can be " probe name=classification code+serial code ", for example: " IS12WM01 "=" IS12W "+" M01 ".
Please refer to Fig. 2, in the present embodiment, the various states of described probe comprise: use, test, idle, wait to maintain, maintain, treat maintenance, maintenance, examine, check, deposit, put in storage, scrap.Wherein upstate comprises: deposit, idle, test; Down state comprises: examine, check, wait to maintain, maintain, treat maintenance, maintenance, warehouse-in etc.
Please refer to Fig. 3, described condition managing unit 12 is provided with administration authority, and described administration authority is used for the different interest fields to the open probe card state management of different user.For example: described administration authority comprises process engineer's authority (PE) and production line operation work authority (MFG), and described process engineer power (PE) comprises the test of switching probe, waits to maintain, maintains, treats maintenance, maintenance, examine, checks, deposits, scraps state; Described operative employee's authority (MFG) comprises use, free time of switching probe, waits to maintain, maintains, treats maintenance, maintenance, examine state, checks, deposits, the warehouse-in state.Thereby process engineering and/or operative employee can change by condition managing unit 12 state to each probe in its administration authority separately, human-computer interaction function is provided, according to the state blocked operation, probe is sent into the appointment flow process, specify that flow process comprises test, waits to maintain, maintains, waits to keep in repair, maintenance, examine, at least a in checking, deposit, put in storage, scrapping.For example in Fig. 3, after the operative employee logins wafer probe card management system of the present invention, the state of the probe that can will put in storage according to its administration authority (MFG) in state management module switches to be waited to maintain, and then this probe will be admitted to flow process to be maintained and maintenance flow process successively.
owing in taxon 11, classified information being arranged, status information and state blocked operation information are arranged in condition managing unit 12, fox message and minute photos and sending messages are arranged in Dispatching Unit 13, these are all the management information to probe, can there be repeatedly classification in a probe simultaneously, state switching and inspection and distribution, and the user may be to certain subseries of probe, the state switching, the information that checks or distribute is interested, so just need to provide the history management information inquiry, historical information query unit 14 namely is used for providing to the user query function of the history management information of each probe.
In the present embodiment, Dispatching Unit 13 checks that the step whether pending probe is fit to use on wafer production line comprises: judge whether described wafer production line board state is available; Whether the type that judges pending probe meets the type of wafer production line appointment and judges whether the state of pending probe is idle.Also be provided with the standard of scrapping in Dispatching Unit 13, also judge whether pending probe reaches the standard of scrapping when checking pending probe, if, pending probe is sent into and scrapped flow process, if not, pending probe is sent into other flow processs.
Please refer to Fig. 4, the present invention also provides a kind of using method of above-mentioned wafer test probe card management system, comprising:
S1, adopt described taxon to each probe classification;
S2, adopt condition managing unit Real Time Monitoring and manage the various states of each probe;
S3, adopt Dispatching Unit to check pending probe, and carry out the distribution of S31, S32 according to check result;
S31,, if pending probe be fit to be used, send into described pending probe wafer production line and also the state of described pending probe switched to the use state;
S32, if the state of specifying flow process and switching described pending probe is sent into described pending probe according to the state of described pending probe in the improper use of pending probe.
Please refer to Fig. 5, in step S3, adopt Dispatching Unit to comprise the process that pending probe checks:
Judge whether described wafer production line board state is available, judge namely whether described wafer production line board state is normal, if continue follow-up judgement; If not, by alarm unit, report to the police, and with pending probe send into examine, deposit, idle, wait to maintain or put in storage flow process;
Whether the state that judges pending probe is available, judges namely whether the state of pending probe is normal, if continue follow-up judgement; If not, by alarm unit, report to the police, and pending probe is sent into deposit, idle, treat that maintenance, maintenance, warehouse-in etc. specify flow processs;
Judge whether the type of pending probe meets the type of wafer production line appointment, whether the type that namely judges pending probe is correct, if described pending probe is sent into wafer production line and the state of described pending probe is switched to the use state; If not, by alarm unit, report to the police, and with pending probe send into examine, check, deposit, idle, the flow process such as wait to maintain, maintain, put in storage or scrap.
In sum, wafer test probe card management system provided by the invention and using method thereof, classify to each probe by taxon; Various states by condition managing unit Real Time Monitoring and each probe of management; By Dispatching Unit, pending probe is checked,, if pending probe be fit to be used, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.Thereby wafer test probe card management system of the present invention and using method thereof, a kind of foundation from probe is provided in fact, has used to use and finish even to scrap the Managed Solution of process, start again after system automatic decision probe condition in management process to produce, the mode that has replaced labor management, the problem of having avoided artificial judgement to take time and effort and easily make mistakes, improved industrial efficiency.
Obviously, those skilled in the art can carry out various changes and modification and not break away from the spirit and scope of the present invention invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. a wafer test probe card management system, is characterized in that, comprising:
Taxon, be used for according to the predefine mode classification each probe classification;
The condition managing unit, be used for monitoring and manage the various states of each probe;
Dispatching Unit, be used for according to the classified information of described taxon and the state of condition managing unit, check whether described pending probe is fit to use on wafer production line,, if pending probe be fit to be used, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.
2. wafer test probe card management system as claimed in claim 1, is characterized in that, described Dispatching Unit also is used for each state of the distribution procedure of described pending probe is updated in described condition managing unit.
3. wafer test probe card management system as claimed in claim 1 or 2, is characterized in that, described various states comprise: test, use, idle, wait to maintain, maintain, treat maintenance, maintenance, examine, check, deposit, put in storage, scrap.
4. wafer test probe card management system as claimed in claim 3, is characterized in that, described appointment flow process comprises test, wait to maintain, maintain, wait to keep in repair, maintenance, examine, at least a in checking, deposit, put in storage, scrapping.
5. wafer test probe card management system as claimed in claim 3, is characterized in that, described condition managing unit is provided with administration authority, and described administration authority is used for the different interest fields to the open probe card state management of different user.
6. wafer test probe card management system as claimed in claim 5, it is characterized in that, described administration authority comprises process engineer's authority and production line operation work authority, and described process engineer's authority comprises the test of switching probe, waits to maintain, maintains, treats maintenance, maintenance, examine, checks, deposits, scraps state; Described operative employee's authority comprises use, free time of switching probe, waits to maintain, maintains, treats maintenance, maintenance, examine state, checks, deposits, the warehouse-in state.
7. wafer test probe card management system as claimed in claim 1, is characterized in that, described Dispatching Unit checks that the step whether pending probe is fit to use on wafer production line comprises: judge whether described wafer production line board state is available; Whether the type that judges pending probe meets the type of wafer production line appointment and judges whether the state of pending probe is idle.
8. wafer test probe card management system as described in claim 1 or 6, is characterized in that, described wafer test probe card management system also comprises the historical information query unit, for the inquiry of the history management information that each probe is provided.
9. wafer test probe card management system as claimed in claim 1, is characterized in that, described wafer test probe card management system also comprises alarm unit, is used for being not suitable for using alarm in described pending probe.
10. the using method of the described wafer test probe card management system of any one in a claim 1 to 9, is characterized in that, comprising:
Adopt described taxon to each probe classification;
Adopt the various states of condition managing unit Real Time Monitoring and each probe of management;
Adopt Dispatching Unit to check pending probe,, if pending probe is fit to use, described pending probe is sent into wafer production line and also the state of described pending probe is switched to the use state; If the improper use of pending probe, send into described pending probe according to the state of described pending probe the state of specifying flow process and switching described pending probe.
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| CN2013103547398A CN103400238A (en) | 2013-08-14 | 2013-08-14 | Wafer test probe card management system and using method thereof |
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| CN2013103547398A CN103400238A (en) | 2013-08-14 | 2013-08-14 | Wafer test probe card management system and using method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109901056A (en) * | 2019-04-09 | 2019-06-18 | 苏州通富超威半导体有限公司 | Chip test system and its method |
| CN114002576A (en) * | 2020-07-28 | 2022-02-01 | 长鑫存储技术有限公司 | Needle measuring card abnormity judgment method and device |
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| US5444386A (en) * | 1992-01-17 | 1995-08-22 | Tokyo Seimitsu Co., Ltd. | Probing apparatus having an automatic probe card install mechanism and a semiconductor wafer testing system including the same |
| CN1665011A (en) * | 2004-03-02 | 2005-09-07 | 旺矽科技股份有限公司 | Multifunctional probe card |
| CN101441625A (en) * | 2007-11-23 | 2009-05-27 | 上海华虹Nec电子有限公司 | Probe card tester in silicon wafer characteristic test and method for counting use amount of probe card |
| CN101924795A (en) * | 2010-08-25 | 2010-12-22 | 广东省建筑科学研究院 | Management system for detecting mechanism apparatus |
| CN201897468U (en) * | 2010-11-26 | 2011-07-13 | 京隆科技(苏州)有限公司 | Probe card detecting system |
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2013
- 2013-08-14 CN CN2013103547398A patent/CN103400238A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444386A (en) * | 1992-01-17 | 1995-08-22 | Tokyo Seimitsu Co., Ltd. | Probing apparatus having an automatic probe card install mechanism and a semiconductor wafer testing system including the same |
| CN1665011A (en) * | 2004-03-02 | 2005-09-07 | 旺矽科技股份有限公司 | Multifunctional probe card |
| CN101441625A (en) * | 2007-11-23 | 2009-05-27 | 上海华虹Nec电子有限公司 | Probe card tester in silicon wafer characteristic test and method for counting use amount of probe card |
| CN101924795A (en) * | 2010-08-25 | 2010-12-22 | 广东省建筑科学研究院 | Management system for detecting mechanism apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109901056A (en) * | 2019-04-09 | 2019-06-18 | 苏州通富超威半导体有限公司 | Chip test system and its method |
| CN114002576A (en) * | 2020-07-28 | 2022-02-01 | 长鑫存储技术有限公司 | Needle measuring card abnormity judgment method and device |
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