CN113533929B - Probe card - Google Patents
Probe card Download PDFInfo
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- CN113533929B CN113533929B CN202010315653.4A CN202010315653A CN113533929B CN 113533929 B CN113533929 B CN 113533929B CN 202010315653 A CN202010315653 A CN 202010315653A CN 113533929 B CN113533929 B CN 113533929B
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- probes
- substrate
- probe card
- probe
- needle
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present application provides a probe card, comprising: a substrate; and the probes are respectively electrically connected with the substrate, wherein the projection of each probe of the probes on the substrate is positioned on the same straight line. The probe card, every probe of a plurality of probes is in projection on the base plate all falls on same straight line, and the probe contacts the bonding pad along the direction of cutting street, can not roll off the bonding pad, and probe and bonding pad have good contact, and the depth of pricking is darker, and wafer test ability is better to compare in conventional probe card, only need simply adjust the arrangement of probe, not big transformation, can not improve the probe card cost.
Description
Technical Field
The present application relates to the field of integrated circuit devices, and more particularly, to a probe card.
Background
The semiconductor manufacturing process typically includes integrated circuit design, wafer fabrication, wafer testing, and the like. Among them, wafer testing is particularly important for cost control of chips. In wafer testing, a probe card having a plurality of probes is generally used, and the probes of the probe card are electrically connected to chips on a wafer to perform electrical testing. Specifically, the dicing channels of the wafer are provided with test pads, and the probes and the pads need to be contacted with each other to complete the electrical test.
However, the conventional probe card still has the problems that the probe is easy to slip when the wafer test is carried out, the test problem is caused, and the yield is influenced. Accordingly, there is a need to provide a more reliable or efficient probe card.
Disclosure of Invention
The probe card can avoid the occurrence of sliding pins, and ensures good contact between the probe and a welding pad and deeper pricking depth.
One aspect of the present application provides a probe card comprising: a substrate; and a plurality of probes, which are respectively electrically connected with the substrate, wherein the projection of each probe of the plurality of probes on the substrate is on the same straight line.
In some embodiments of the present application, the plurality of probes are electrically connected to the substrate through needle arms, respectively, the needle arms including a first needle arm perpendicular to the substrate and a second needle arm perpendicular to the first needle arm.
In some embodiments of the present application, the first needle arms are respectively and uniformly arranged from two ends of the substrate to the center, and the length of the first needle arms is uniformly decreased from two ends of the substrate to the center.
In some embodiments of the present application, the first needle arms at both ends of the substrate have a length of 5000 to 6000 micrometers.
In some embodiments of the present application, the decreasing length of the first needle arm is from 150 microns to 250 microns.
In some embodiments of the present application, the second needle arms are equal in length.
In some embodiments of the present application, the second needle arm is located on a side of the first needle arm near a center of the base plate.
In some embodiments of the present application, the plurality of probes are angled from 30 degrees to 60 degrees with respect to the substrate.
In some embodiments of the present application, tips of the plurality of probes are at a distance of 8000 micrometers to 9000 micrometers from the substrate.
In some embodiments of the present application, the substrate is a printed circuit board.
The probe card, every probe of a plurality of probes is in projection on the base plate all falls on same straight line, and the probe contacts the bonding pad along the direction of cutting street, can not roll off the bonding pad, and probe and bonding pad have good contact, and the depth of pricking is darker, and wafer test ability is better to compare in conventional probe card, only need simply adjust the arrangement of probe, not big transformation, can not improve the probe card cost.
Drawings
The following drawings describe in detail exemplary embodiments disclosed in the present application. In which like reference numerals represent similar structures in more than one view of the figures. Those of ordinary skill in the art will understand that the present embodiments are non-limiting, exemplary embodiments and that the accompanying drawings are for illustrative and descriptive purposes only and are not intended to limit the scope of the present application, as other embodiments may equally fulfill the inventive intent of the present application. It should be understood that the drawings are not to scale. Wherein:
FIG. 1 is a schematic diagram of a cantilever probe card and its traces;
FIG. 2 is a schematic diagram of another cantilever probe card and its pin marks;
FIG. 3 is a schematic diagram of a vertical probe card and its needle marks;
FIG. 4 is a schematic diagram of a probe card according to some embodiments of the present application;
FIG. 5 is a top view of a probe card according to some embodiments of the present application;
FIG. 6 is a schematic diagram of a probe card according to some embodiments of the present application showing needle marks.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the present disclosure. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present application. Thus, the present application is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.
The technical solution of the present invention will be described in detail below with reference to the embodiments and the accompanying drawings.
Fig. 1 is a schematic structural diagram of a cantilever probe card and a schematic diagram of a pin mark thereof.
Referring to fig. 1, in which fig. 1(a) is a cross-sectional view of the cantilever probe card 100, the cantilever probe card 100 includes a printed circuit board 110 and a plurality of probes 120, and the plurality of probes 120 are electrically connected to the printed circuit board 110. The tips of the probes 120 are located on the same horizontal plane. Fig. 1(b) is a top view of the cantilever probe card 100, the plurality of probes 120 are distributed around the center of the printed circuit board 120, and tips of the plurality of probes 120 are located on a same straight line. It should be noted that the distribution of the probes 120 is only schematically illustrated in the drawings, and the number of the probes 120 is not limited.
Fig. 1(c) is a schematic diagram of a probe card 100, in which a pad 130 is disposed on a scribe line of a wafer, a direction a is a length direction of the scribe line, a direction B is a width direction of the scribe line, and a dimension of the pad 130 in the direction a is greater than a dimension in the direction B. Referring to fig. 1(B), since the probe 120 extends from the outer edge of the pcb 110 to the center line, when testing a wafer, the probe 120 contacts the pad 130 along the direction B, the formed pin mark 140 is elliptical, and the size of the pin mark 140 in the direction B is larger than that in the direction a.
To obtain more chips on the same area of the wafer, the size of the scribe line is usually reduced. Since the pad 130 is disposed on the scribe line, the size of the pad 130 also needs to be reduced, and specifically, the size of the pad 130 in the direction B needs to be further reduced. Referring to fig. 1(c), if the size of the pad 130 in the direction B is reduced and the probe 120 still contacts the pad in the direction B, a sliding pin may easily occur, even the probe slides out of the pad and enters the chip, damaging the chip and affecting the yield of the chip.
In order to solve the above problems, another cantilever probe card has been designed. Fig. 2 is a schematic diagram of a cantilever probe card and its pin marks. Referring to fig. 2, a probe card 200 includes a printed circuit board 210 and probes 220. The structure of the probe card 200 is the same as that of the probe card 100, and is not described herein. However, the probe card 200 is different in that the tips of the probes 220 are formed by a special process, and the tip sizes of the probes 220 are smaller than those of the probes 120. Therefore, as shown in fig. 2(c), since the tip size is small, the probe mark 240 formed by the probe 200 is also small, and the probe can be used continuously while the size of the pad 230 is reduced. However, since a special process is used, the manufacturing cost of the probe card 200 becomes high, and the cost increases; and the small pin mark means the small contact area between the probe and the pad, which may affect the testing effect.
In addition to the above probe card 200, there is a vertical probe card. Fig. 3 is a schematic diagram of a vertical probe card and a diagram of a needle mark thereof. Referring to fig. 3(a), the probe card 300 includes a printed circuit board 310 and probes 320 perpendicular to the printed circuit board 310. Referring to fig. 3(b), the probes 320 are arranged on the central line of the pcb 310, and since the probes 320 are perpendicular to the pcb 310, only one tip is seen from the top view along the central line. Referring to fig. 3(c), since the probe 320 penetrates the pad 330 vertically instead of obliquely, the pin mark 340 is smaller and can be used continuously with the reduced size of the pad 330. However, since the probe 320 is vertically inserted into the pad, the probe is stressed greatly and is easy to damage; and the small pin mark means that the contact area between the probe and the pad is small, which may affect the testing effect.
In order to overcome the above problems, the present application provides a cantilever probe card, in which a probe is brought into contact with a pad from a direction a, the size of a pin mark is not changed, but the probe card can be continuously used while the size of the pad is reduced by using the characteristic that the size of the pad in the direction a is larger than that in the direction B. According to the probe card, on one hand, the probe contacts the welding pad along the direction of the cutting channel, so that the sliding needle can be avoided; on the other hand, the area of the pin mark is unchanged, which means that the contact area of the probe and the welding pad is unchanged, thereby ensuring good contact between the probe and the welding pad and deeper depth of the pin insertion and not influencing the test effect; in addition, a special process is not needed for manufacturing the probe, and the manufacturing cost of the probe is not influenced.
Fig. 4 is a schematic structural diagram of a probe card according to some embodiments of the present application.
Embodiments of the present application provide a probe card 400, and referring to fig. 4, the probe card 400 includes: a substrate 410; and a plurality of probes 420, wherein the plurality of probes 420 are respectively electrically connected with the substrate 410, and the projection of each probe of the plurality of probes 420 on the substrate 410 is on the same straight line. "projection" refers to the projection of the shape of an object onto a plane with a set of rays, the resulting image on the plane, also referred to as a "projection". The "projection" of each of the plurality of probes 420 on the substrate 410 in the embodiment of the present application refers to an image obtained by projecting the shape of each of the plurality of probes 420 on the substrate 410 with a set of light rays perpendicular to the substrate 410.
The probe card 400 is described in detail below.
Referring to fig. 4, the substrate 410 is, for example, a printed circuit board. The substrate 410 is provided with a circuit diagram for electrically connecting the probes 420 and electrically connecting the test pads on the wafer through the probes 420, so as to detect the circuits of the wafer.
In some embodiments of the present application, the material of the substrate 410 includes ceramic or plastic.
With continued reference to fig. 4, the plurality of probes 420 are electrically connected to the base plate 410 through needle arms 430, respectively, and the needle arms 430 include a first needle arm 431 perpendicular to the base plate 410 and a second needle arm 432 perpendicular to the first needle arm 431.
The first needle arm 431 is vertically connected to the substrate 410, and compared with a connection mode inclined to the substrate 410, the connection mode has the advantages of small stress and high stability.
Since the projection of each probe 420 of the plurality of probes 420 on the substrate 410 is on the same straight line, that is, all the probes 420 are located on the same plane perpendicular to the substrate 410, the plurality of probes 420 need to be arranged in a hierarchy in order to keep the plurality of probes 420 from affecting each other. Therefore, the arms of each probe 420 are also arranged in layers.
Referring to fig. 4, in some embodiments of the present disclosure, the first needle arms 431 are respectively and uniformly arranged from two ends of the substrate 410 to the center, and meanwhile, the lengths of the first needle arms 431 are uniformly decreased from two ends of the substrate 410 to the center.
In some embodiments of the present application, the length of the first needle arm 431 farthest from the two ends of the substrate 410 is 5000 micrometers to 6000 micrometers, such as 5200 micrometers, 5500 micrometers, 5800 micrometers, and the like.
In some embodiments of the present application, the decreasing length of the first needle arm 431 is 150 to 250 micrometers. Since the probes 420 are slightly deformed when contacting the pad, if the decreased length is too small, the intervals between the plurality of probes 420 are too small and may affect each other; if the tapered length is too large, the overall height of the probe card 400 may be relatively large, which may result in more material consumption and a too large size, which may also be inconvenient. The decreasing length may be set according to specific situations, for example, the decreasing length may be 200 micrometers, the length of the first needle arm 431 farthest from the two ends of the substrate 410 is 5500 micrometers, the length of the first needle arm 431 sequentially arranged from the two ends of the substrate 410 to the center is 5500 micrometers, 5300 micrometers, 5100 micrometers, 4900 micrometers, and the like, and so on.
With continued reference to fig. 4, since the lengths of the first needle arms 431 are sequentially decreased, the second needle arms 432 vertically connected to the first needle arms 431 are also arranged in layers in the vertical direction, and the spacing between the second needle arms 432 in the vertical direction is equal to the decreased length, such as 150 microns, 200 microns or 250 microns. In other embodiments of the present application, the second needle arms 432 may not be perpendicular to the first needle arms 431, but the second needle arms 432 are not crossed to avoid the mutual influence between the probes 420.
In some embodiments of the present application, the second needle arms 432 are equal in length.
In some embodiments of the present application, the second needle arm 432 is located on a side of the first needle arm 431 near the center of the base plate 410.
In other embodiments of the present application, the first needle arm 431 and the second needle arm 432 may be arranged in other structures as long as the needle arms 430 of the probes 420 are not affected by each other. For example, the first needle arms 431 are respectively and uniformly arranged from the center of the base plate 410 to both ends, meanwhile, the lengths of the first needle arms 431 are uniformly decreased from the center of the base plate 410 to both ends, and the second needle arm 432 is vertically connected with the first needle arms 431 and is located on one side of the first needle arms 431 away from the center of the base plate 410.
With continued reference to fig. 4, the plurality of probes 420 are electrically connected to the second needle arm 432. Since the test pads on the wafer are all located on a plane, the tips of the probes 420 all fall on the same plane parallel to the substrate 410. In fig. 4, the tips of the probes 420 are all located on a straight line parallel to the substrate 410.
In some embodiments of the present application, the number of the plurality of probes 420 may be set according to the requirement of the test wafer, for example, may be 6, 10, or 22.
In some embodiments of the present application, the tips of the plurality of probes 420 are spaced from the substrate 410 at a distance of 8000 micrometers to 9000 micrometers, such as 8200 micrometers, 8500 micrometers, 8800 micrometers, or the like. The size of the plurality of probes 420 in the vertical direction cannot be too large, otherwise the height of the whole probe card 400 is large, more consumables are consumed, and the size is too large and inconvenient to use; the size of the plurality of probes 420 in the vertical direction cannot be too small, otherwise the proportion of the plurality of probes 420 in the entire probe card 400 is too small to be conveniently used.
In some embodiments of the present disclosure, the plurality of probes 420 and the substrate 410 are included at an angle of 30 degrees to 60 degrees, such as 35 degrees, 45 degrees, or 55 degrees. Since the size of the probes 420 in the vertical direction is fixed, if the included angle is too small, the size of the probes 420 in the horizontal direction is large, which affects the distribution density of the probes 420, and the probes 420 are too long and easily damaged; the included angle should not be too large, otherwise the contact area between the probe 420 and the pad becomes small, which may affect the testing effect.
FIG. 5 is a top view of a probe card according to some embodiments of the present application. Referring to fig. 5, since the projection of each of the plurality of probes 420 on the substrate 410 is on the same line, the plurality of probes 420 are connected in a straight line in a top view.
FIG. 6 is a schematic diagram of a probe card according to some embodiments of the present application showing needle marks. Referring to fig. 6, since the plurality of probes 420 in the probe card 400 are all located on the same plane and the plurality of probes 420 are arranged from both ends of the substrate 410 toward the center, the probes 420 may contact pads 440 from a direction a to form needle marks 450. The size of the needle mark 450 in the direction a is larger than that in the direction B.
Compared with the conventional cantilever probe card, the size of the pin mark 450 is not changed, but the characteristic that the dimension of the direction A of the bonding pad 440 is larger than the dimension of the direction B is utilized, so that the pin mark 450 rotates 180 degrees on the bonding pad 440, and the sliding pin can be avoided when the bonding pad 440 is reduced in size. Because the area of the pin mark is unchanged, the contact area between the probe and the welding pad is unchanged, the good contact between the probe and the welding pad and the deeper depth of the pin insertion are ensured, and the test effect is not influenced. In addition, a special process is not needed for manufacturing the probe, and the manufacturing cost of the probe is not influenced.
The probe card, every probe of a plurality of probes is in projection on the base plate all falls on same straight line, and the probe contacts the bonding pad along the direction of cutting street, can not roll off the bonding pad, and probe and bonding pad have good contact, and the depth of pricking is darker, and wafer test ability is better to compare in conventional probe card, only need simply adjust the arrangement of probe, not big transformation, can not improve the probe card cost.
In view of the above, it will be apparent to those skilled in the art upon reading the present application that the foregoing application content may be presented by way of example only, and may not be limiting. Those skilled in the art will appreciate that the present application is intended to cover various reasonable variations, adaptations, and modifications of the embodiments described herein, although not explicitly described herein. Such alterations, improvements, and modifications are intended to be within the spirit and scope of the exemplary embodiments of the application.
It should be understood that the term "and/or" as used in this embodiment includes any and all combinations of one or more of the associated listed items. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present.
Similarly, it will be understood that when an element such as a layer, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, the term "directly" means that there are no intervening elements. It will be further understood that the terms "comprises," "comprising," "includes" or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It will also be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first element in some embodiments may be termed a second element in other embodiments without departing from the teachings of the present application. The same reference numerals or the same reference characters denote the same elements throughout the specification.
Further, the present specification describes example embodiments with reference to idealized example cross-sectional and/or plan and/or perspective views. Thus, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have rounded or curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of exemplary embodiments.
Claims (10)
1. A probe card, comprising:
a substrate; and
the probes are respectively electrically connected with the substrate, wherein the projection of each probe of the probes on the substrate is on the same straight line, and the probes contact with the welding pads along the direction of the cutting path during operation.
2. The probe card of claim 1, wherein the plurality of probes are electrically connected to the substrate through needle arms, respectively, the needle arms including a first needle arm perpendicular to the substrate and a second needle arm perpendicular to the first needle arm.
3. The probe card of claim 2, wherein the first needle arms are respectively and uniformly arranged from two ends of the substrate to the center, and the length of the first needle arms decreases from two ends of the substrate to the center.
4. The probe card of claim 3, wherein the first needle arms at the two ends of the substrate have a length of 5000 microns to 6000 microns.
5. The probe card of claim 3, wherein the first arm tapers to a length of 150 microns to 250 microns.
6. The probe card of claim 3, wherein the second needle arms are equal in length.
7. The probe card of claim 3, wherein the second needle arm is located on a side of the first needle arm near a center of the substrate.
8. The probe card of claim 1, wherein the plurality of probes are angled from 30 degrees to 60 degrees with respect to the substrate.
9. The probe card of claim 1, wherein tips of the plurality of probes are spaced from the substrate at a distance of 8000 microns to 9000 microns.
10. The probe card of claim 1, wherein the substrate is a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010315653.4A CN113533929B (en) | 2020-04-21 | 2020-04-21 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010315653.4A CN113533929B (en) | 2020-04-21 | 2020-04-21 | Probe card |
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| Publication Number | Publication Date |
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| CN113533929A CN113533929A (en) | 2021-10-22 |
| CN113533929B true CN113533929B (en) | 2022-07-19 |
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| CN202010315653.4A Active CN113533929B (en) | 2020-04-21 | 2020-04-21 | Probe card |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103675368A (en) * | 2013-10-23 | 2014-03-26 | 上海华力微电子有限公司 | Method for improving pricking effect of probe card |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1052904A1 (en) * | 1982-07-30 | 1983-11-07 | Горьковский Ордена Трудового Красного Знамени Политехнический Институт Им.А.А.Жданова | Contactless prod for leak detector |
| CN1940572A (en) * | 2005-09-30 | 2007-04-04 | 思达科技股份有限公司 | Integrated circuit testing card |
| JP5448675B2 (en) * | 2009-09-25 | 2014-03-19 | パナソニック株式会社 | Probe card and semiconductor wafer inspection method using the same |
| TWI509265B (en) * | 2012-04-18 | 2015-11-21 | Chipmos Technologies Inc | Vertical probe card and test module using the same |
| CN103036070A (en) * | 2012-11-20 | 2013-04-10 | 江苏安特耐科技有限公司 | 5.8 gigahertz (G) double-unit vertical and horizontal dual-polarized antenna element |
| CN204269692U (en) * | 2014-12-18 | 2015-04-15 | 中芯国际集成电路制造(北京)有限公司 | A kind of probe |
| CN106935524B (en) * | 2015-12-24 | 2020-04-21 | 台湾积体电路制造股份有限公司 | Probe card, wafer test system and wafer test method |
| CN107525952A (en) * | 2016-06-22 | 2017-12-29 | 致茂电子(苏州)有限公司 | Current probe and the tool suitable for changing this current probe |
| CN110261755B (en) * | 2019-05-28 | 2022-04-19 | 常州纵慧芯光半导体科技有限公司 | Probe card, detection device and wafer detection method |
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2020
- 2020-04-21 CN CN202010315653.4A patent/CN113533929B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103675368A (en) * | 2013-10-23 | 2014-03-26 | 上海华力微电子有限公司 | Method for improving pricking effect of probe card |
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