TWI775509B - Probe head and probe card - Google Patents
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- TWI775509B TWI775509B TW110124287A TW110124287A TWI775509B TW I775509 B TWI775509 B TW I775509B TW 110124287 A TW110124287 A TW 110124287A TW 110124287 A TW110124287 A TW 110124287A TW I775509 B TWI775509 B TW I775509B
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Abstract
Description
本發明實施例與探針頭及探針卡有關。The embodiments of the present invention are related to the probe head and the probe card.
半導體積體電路晶片通常採用探針卡來進行電性測試。探針卡包括印刷電路板、空間轉換器(Space Transformer, ST)以及探針頭(Probe Head, PH)。探針頭主要包含上導板、下導板以及複數探針。各探針分別包含依序銜接的針尾、針身及針尖。探針穿過上導板及下導板,探針的針尾穿出於上導板以與空間轉換器接觸以形成電性連接,探針的針尖穿出下導板以與待測物接觸以形成電性連接。Semiconductor ICs are usually tested electrically using probe cards. The probe card includes a printed circuit board, a space transformer (Space Transformer, ST) and a probe head (Probe Head, PH). The probe head mainly includes an upper guide plate, a lower guide plate and a plurality of probes. Each probe comprises a needle tail, a needle body and a needle tip which are connected in sequence. The probe passes through the upper guide plate and the lower guide plate, the needle tail of the probe passes through the upper guide plate to contact with the space transformer to form an electrical connection, and the needle tip of the probe passes through the lower guide plate to contact the object to be tested. Make electrical connections.
隨著探針頭應用的面積越來越大,探針頭的上導板之平行度也產生差異。因此,在將探針頭設置在空間轉換器時,由於上導板的平行度差異,各探針的針尾與空間轉換器之間的受壓力也產生變化,部分的探針在組裝過程中可能受到過壓。而當探針受到過壓時,將可能使得探針穿過上導板之處產生裂損,甚至是使得各探針沉入上導板而形成卡針的狀況。如此都將導致探針卡在後續使用上產生測試良率不如預期之缺失。As the application area of the probe head becomes larger and larger, the parallelism of the upper guide plate of the probe head also varies. Therefore, when the probe head is set on the space transformer, due to the difference in the parallelism of the upper guide plate, the pressure between the needle tail of each probe and the space transformer also changes, and some probes may be assembled during the assembly process. subject to overpressure. When the probes are over-pressed, cracks may occur where the probes pass through the upper guide plate, and even the probes may sink into the upper guide plate to form stuck pins. All of this will result in the failure of the probe card in subsequent use that the test yield is not as expected.
本案揭示一種探針頭,包含上導板、下導板及複數探針。上導板包含凸塊,且上導板具有相對的上表面、下表面及沿第一方向垂直貫穿上表面與下表面的複數針孔,凸塊設置於上表面,凸塊具有支撐面,在第一方向上,上表面位於支撐面與下表面之間。下導板設置於上導板並位於下表面的一側。探針具有依序銜接的針尾、針身及針尖,探針設置於針孔並圍繞凸塊或陣列式排列於凸塊圍繞的範圍內,且在第一方向上,針尾的端部位於支撐面與上表面之間。The present application discloses a probe head including an upper guide plate, a lower guide plate and a plurality of probes. The upper guide plate includes a bump, and the upper guide plate has an opposite upper surface, a lower surface, and a plurality of pinholes vertically penetrating the upper surface and the lower surface along the first direction, the bump is arranged on the upper surface, and the bump has a supporting surface, which is In the first direction, the upper surface is located between the support surface and the lower surface. The lower guide plate is arranged on the upper guide plate and is located on one side of the lower surface. The probe has a needle tail, a needle body and a needle tip that are connected in sequence. The probe is arranged in the pinhole and surrounds the bump or is arranged in an array in the range surrounded by the bump, and in the first direction, the end of the needle tail is located on the supporting surface. between the upper surface.
本案另外揭示一種探針卡,包含電路板、空間轉換器及前述探針頭。空間轉換器具有複數電接觸點並設置於電路板。探針頭設置於空間轉換器,探針頭的探針之針尾分別面對電接觸點,支撐面貼靠於空間轉換器,電接觸點與針尾的端部在第一方向上具有間隙。The present application further discloses a probe card including a circuit board, a space converter and the aforementioned probe head. The space transformer has a plurality of electrical contacts and is arranged on the circuit board. The probe head is arranged on the space transformer, the needle tails of the probes of the probe head respectively face the electrical contact points, the supporting surface is abutted against the space transformer, and the electrical contact point and the end of the needle tail have a gap in the first direction.
參閱圖1,圖1為本發明探針卡之一實施例的示意圖,本實施例之探針卡為垂直式探針卡。圖1實施例繪示之探針卡是由電路板PCB、空間轉換器ST(Space Transformer)與探針頭PH(Probe Head)組裝而成。藉此使探針頭PH得以電性連接至待測物(Device under test)進行電性測試。其中,電路板PCB與空間轉換器ST是藉由錫球(圖未繪示)回焊,或者使用異方性導電膠、彈性接觸元件等方式(圖未繪示)作為電路板PCB與空間轉換器ST的中介導體,使電路板PCB的內部線路與空間轉換器ST的內部線路進行電性連接。Referring to FIG. 1 , FIG. 1 is a schematic diagram of an embodiment of a probe card of the present invention. The probe card of this embodiment is a vertical probe card. The probe card shown in the embodiment of FIG. 1 is assembled from a circuit board PCB, a space transformer ST (Space Transformer) and a probe head PH (Probe Head). Thereby, the probe head PH can be electrically connected to the device under test for electrical testing. Among them, the circuit board PCB and the space converter ST are reflowed by solder balls (not shown in the figure), or using anisotropic conductive glue, elastic contact elements, etc. (not shown in the figure) as the circuit board PCB and the space converter. The intermediate conductor of the transformer ST electrically connects the internal circuit of the circuit board PCB with the internal circuit of the space transformer ST.
繼續參閱圖1,探針頭PH主要包含上導板10、下導板20及複數探針30。探針30具有針尾31、針身32及針尖33。探針30穿過上導板10及下導板20,且探針30的針尾31位於上導板10的一側,而針尖33穿出下導板20。探針頭PH適於組裝於空間轉換器ST或者電路板PCB,使探針頭PH設置於空間轉換器ST上,本發明之探針頭PH設置於空間轉換器ST後,各探針30的針尾31之端部能保持與空間轉換器ST之間具有間隙F(或稱浮動間隙,Floating Gap),在針測過程中,探針頭PH的探針30與空間轉換器ST之間發生過壓時,能避免探針30的針尾31異常地陷入上導板10的針孔13或造成針孔13的裂損。Continuing to refer to FIG. 1 , the probe head PH mainly includes an
進一步地,由於探針30在針測過程中係朝向空間轉換器ST的方向移動,因此,於此實施例中,探針30的針身32為挫曲(bucking)狀,藉以使探針30能具有彎曲變形的區域,也就是說,探針30的針尾31及針尖33不位於同一線性延伸方向上。除此之外,各探針30彎曲變形的方向可被控制。Further, since the probe 30 moves toward the direction of the space transformer ST during the needle measurement, in this embodiment, the
為使探針頭PH設置在空間轉換器ST後保持具有間隙F,可以透過以下各具體實施例來達成。In order to maintain the gap F after the probe head PH is arranged on the space transformer ST, it can be achieved through the following specific embodiments.
參閱圖1,於一實施例中,圖1繪示之探針頭PH的上導板10包含凸塊B。在此,上導板10為板狀結構並具有平行相對的上表面11及下表面12。且上導板10沿第一方向D1垂直貫穿上表面11與下表面12設置複數針孔13,凸塊B具有支撐面S1並設置於上表面11。在第一方向D1上,上表面11位於支撐面S1與下表面12之間。於此,下導板20設置於上導板10並位於下表面12的一側。Referring to FIG. 1 , in one embodiment, the
繼續參閱圖1並配合圖2,在此實施例中,上導板10的針孔13圍繞凸塊B排列,藉此,當探針30設置於針孔13時亦成為圍繞凸塊B排列之狀態。在一具體實施態樣中,例如當凸塊B為實心矩形塊體時,探針30即可沿著凸塊B的矩形外輪廓形狀以周圍式的方式排列為矩形。然而,探針30的排列方式並不以此為限,而可以是符合待測物的測試接點之排列形狀或位置而定。Continuing to refer to FIG. 1 in conjunction with FIG. 2 , in this embodiment, the
此外,在第一方向D1上,各探針30的針尾31之端部位於支撐面S1與上表面11之間,也就是說,凸塊B在第一方向D1上的高度大於各探針30的針尾31長度。在此,各探針30的針尾31之端部係指針尾31遠離針尖33的一端。藉此,當各探針30設置於上導板10時,各探針30的針尾31之端部不凸出於凸塊B。也就是說,當探針頭PH以上導板10設置於空間轉換器ST時,能夠確保探針頭PH能以上導板10接觸空間轉換器ST,而避免在組裝的過程中非預期地接觸各探針30的針尾31,避免各探針30的針尾31受到過壓而異常地陷入針孔13或造成針孔13的裂損。In addition, in the first direction D1, the end of the
進一步地,繼續參閱圖1,於一實施例中,由於空間轉換器ST面對探針30的一面具有電接觸點P以在針測過程中接觸探針30形成電性連接,因此,為使各探針30的針尾31之端部能與空間轉換器ST之間保持具有間隙F。探針頭PH的上表面11至凸塊B的支撐面S1之間在第一方向D1上的距離大於針尾31之端部與電接觸點P在第一方向D1上的長度總和。藉此,當探針頭PH設置於空間轉換器ST而尚未進行針測工作時,空間轉換器ST仍能保持貼靠於各凸塊B的支撐面S1,而空間轉換器ST的電接觸點P與探針30的針尾31之端部在第一方向D1上具有間隙F。各電接觸點P會分別連接空間轉換器ST的內部線路。Further, referring to FIG. 1 , in an embodiment, since the side of the space transformer ST facing the probe 30 has an electrical contact point P to contact the probe 30 to form an electrical connection during the needle test, therefore, in order to make the A gap F can be maintained between the end of the
由此可知,由於探針頭PH設置在空間轉換器ST時是以大面積的上導板10上的凸塊B的支撐面S1與空間轉換器ST接觸,如此一來,探針頭PH的上導板10與空間轉換器ST間的接觸面積增加,而能在組裝的過程中,降低上導板10形變的可能。藉此,除了得以確保空間轉換器ST設置在探針頭PH後的平行度之外,更能確保各探針30的針尾31不因上導板10的變形而受到壓迫而損壞。此外,探針頭PH的探針30之針尾31與之間保持具有間隙F,則又能避免探針頭PH的探針30在組裝的過程中或針測過程中與空間轉換器ST產生撞擊而損壞。It can be seen from this that when the probe head PH is installed in the space transformer ST, the support surface S1 of the bump B on the large-area
進一步地,參閱圖4,在一實施例中,為了避免各探針30在第一方向D1上朝向下導板20的方向隨意位移,各探針30的針尾31被限位於上導板10異於下導板20的一側。於此,各探針30的針尾31截面形狀為非圓形,各探針30的針身32截面形狀為圓形,如此一來,當各探針30設置於上導板10時,各探針30的針尾31無法穿過針孔13而被保持位於上導板10的一側,於此狀態下,各探針30的針尾31成為可以限制探針30於第一方向D1位移的制止部(Stopper),針尾31形成的制止部可以防止探針30從上導板10的針孔13及下導板20的針孔掉落出探針頭PH。具體而言,各探針30的針尾31可以但不限於是由凸出於上導板10的針身32之一端被施壓而變形所構成,並使得針尾31成為寬度大於針孔13外徑的扁平形狀。Further, referring to FIG. 4 , in an embodiment, in order to avoid random displacement of the probes 30 in the direction of the first direction D1 toward the
在一些實施例中,上導板10可以由單一材質、不同材質、一體成形或分體結合所構成。參閱圖1及圖2,圖1及圖2實施例繪示之上導板10與凸塊B是由單一材質一體成形。於此實施例中,上導板10與凸塊B是由陶瓷材料一體成形。In some embodiments, the
進一步地,為了避免上導板10上的各探針30發生旋轉的動作而導致探針30干涉的問題,探針頭PH更包含止轉結構A,止轉結構A具有複數非圓形孔H1,各非圓形孔H1分別與各針孔13連通。在此,探針30的針尾31之截面為非圓形,且探針30的針尾31分別容置於非圓形孔H1內,藉由針尾31與非圓形孔H1彼此干涉,非圓形孔H1可以限制探針30相對上導板10轉動,亦即探針30不會相對上導板10、下導板20轉動。Further, in order to avoid the problem of interference of the probes 30 caused by the rotation of the probes 30 on the
進一步地,參閱圖3,圖3實施例係基於圖2實施例的結構基礎進一步設置止轉結構A。於此,上導板10與凸塊B是由單一材質一體成形,且上導板10包含止轉結構A。此外,於此實施例中,上導板10上的止轉結構A與凸塊B是一體成形的止轉區塊14,止轉區塊14上設置複數非圓形孔H1以限止探針30的旋轉。在此,探針30的針尾31截面形狀為非圓形,當探針30的針尾31容置入非圓形孔H1時,探針30的針尾31之轉動動量將會被非圓形孔H1限制而止轉。舉例而言,探針30的針尾31截面可以但不限於是方圓形,即兩對應邊相互平形另外兩對應邊呈圓弧形,而非圓形孔H1為長方形孔,則針尾31容置於非圓形孔H1而能受到非圓形孔H1的止轉。在其他實施例中,探針30的針尾31截面形狀為方圓形,而非圓形孔H1可為方圓形孔、橢圓孔,探針30的針尾31截面形狀與非圓形孔H1的形狀沒有特別的限制,只要尺寸配置得宜(例如非圓形孔H1相較於針尾31不得過大),當探針30的針尾31容置入非圓形孔H1時,探針30的針尾31便能受到非圓形孔H1的止轉。Further, referring to FIG. 3 , the embodiment of FIG. 3 is further provided with an anti-rotation structure A based on the structural basis of the embodiment of FIG. 2 . Here, the
具體地,止轉區塊14設置於上表面11,於一實施例中,止轉結構A更具有階面S2,階面S2與支撐面S1不共平面而成為階梯狀。在此實施例中,止轉區塊14具有階面S2,階面S2鄰接非圓形孔H1及凸塊B,在第一方向上,階面S2位於支撐面S1與上表面11之間。藉此,透過階面S2的設置而能更適於具有各種不同相對位置的凸塊B及針孔13配置。Specifically, the
在此實施例中,當各探針30由上導板10穿至下導板20時,各探針30的針尖33得以通過非圓形孔H1及針孔13進而穿過下導板20,各探針30的針身32則通過非圓形孔H1及針孔13並能容置於針孔13內以及上導板10、下導板20之間的容置空間,而各探針30的針尾31則容置於非圓形孔H1內,藉此,各探針30的針尾31可以受到非圓形孔H1的限制而能限制探針30的轉動。In this embodiment, when each probe 30 passes through the
在設置止轉結構A限制探針30轉動的實施例中,也可以是使用不同材質的分體式結構配置。具體而言,參閱圖5,圖5實施例同樣是基於圖2實施例的結構基礎進一步設置止轉結構A。在此實施例中,上導板10與凸塊B以陶瓷材料一體製成,而止轉結構A為可分離於上導板10及凸塊B的止轉件40。於此,止轉件40可以是設置於上導板10上的薄膜材料,且止轉件40上設置複數非圓形孔H1。在此實施例中,止轉件40設置於上表面11上,且止轉件40的非圓形孔H1與上導板10的針孔13連通。如此一來,當各探針30由上導板10穿至下導板20時,各探針30的針尖33得以通過非圓形孔H1及針孔13進而穿過下導板20,各探針30的針身32則通過非圓形孔H1及針孔13並能容置於針孔13內,而各探針30的針尾31則容置於非圓形孔H1內,藉此,各探針30的針尾31可以受到非圓形孔H1的限制而能限制探針30的轉動。於一實施例中,止轉件40也可以具有階面S2,且階面S2鄰接非圓形孔H1及凸塊B。In the embodiment in which the rotation stop structure A is provided to limit the rotation of the probe 30, it may also be a split structure configuration using different materials. Specifically, referring to FIG. 5 , the embodiment of FIG. 5 is also based on the structural basis of the embodiment of FIG. 2 and further provides the anti-rotation structure A. In this embodiment, the
進一步地,在一些實施例中,止轉件40可以是單一片的薄膜材料,同樣參閱圖5,止轉件40除了具有階面S2及非圓形孔H1之外,止轉件40更對應上導板10上的凸塊B配置位置設置穿孔H2,穿孔H2的形狀對應凸塊B的外輪廓形狀。於此,非圓形孔H1相對於穿孔H2的位置配置對應於探針30相對於凸塊B的位置配置,在此實施例中,穿孔H2圍繞非圓形孔H1。如此一來,止轉件40設置於上導板10的上表面11上,且穿孔H2穿套於凸塊B,而非圓形孔H1連通針孔13,即止轉件40形成的凸塊B設置在穿孔H2上,放置於上導板10的上表面11上。於此,各探針30先穿過止轉件40再穿過上導板10,探針30的針尾31得以容置於止轉件40的非圓形孔H1內而受到非圓形孔H1的止轉。止轉件40可以透過剪裁薄膜上的多個圖案結構並以拼貼的方式將這多個圖案結構排佈於上導板10的上表面11上,並據此提供各探針30止轉的功能。Further, in some embodiments, the
在其他實施例中,參閱圖6,圖6實施例亦為基於圖2實施例之結構基礎,也就是圖6實施例同樣為上導板10上設置凸塊B的結構基礎。於此實施例中,上導板10是不同材質的三件式分體結構。具體地,上導板10的凸塊B係可分離於上導板10,且凸塊B又可分為兩個可分離部件。於此實施例中,凸塊B包含止轉結構A及高度設定層B2,且止轉結構A為可分離於高度設定層B2的止轉層B1。在此實施例中,止轉層B1設置於上表面11並具有中介面S3及複數非圓形孔H1,而高度設定層B2設置於中介面S3的局部並具有支撐面S1,在第一方向D1上中介面S3位於支撐面S1與上表面11之間。在此,由於高度設定層B2設置於中介面S3的局部而使得中介面S3的其餘部位成為裸露狀態,如此使得止轉層B1與高度設定層B2成為階梯結構,而前述中介面S3的其餘部分(裸露的中介面S3部分)則成為相當於前述各實施例的階面S2。In other embodiments, referring to FIG. 6 , the embodiment in FIG. 6 is also the structural basis based on the embodiment in FIG. 2 , that is, the embodiment in FIG. In this embodiment, the
同樣地,在此實施例中,止轉層B1的非圓形孔H1與針孔13連通。當各探針30由上導板10穿至下導板20時,各探針30的針尖33得以通過非圓形孔H1及針孔13進而穿過下導板20,各探針30的針身32則通過非圓形孔H1及針孔13並能容置於針孔13內,而各探針30的針尾31則容置於非圓形孔H1內,藉此,各探針30的針尾31可以受到非圓形孔H1的限制而能限制探針30的轉動。Likewise, in this embodiment, the non-circular hole H1 of the anti-rotation layer B1 communicates with the
在此實施例中,止轉層B1及高度設定層B2可以分別由陶瓷材料或薄膜材料製成。在此,上導板10、止轉層B1及高度設定層B2為三件式的分體結構是指在加工階段為三件式結構,一旦上導板10、止轉層B1及高度設定層B2分別加工後便結合成為不可分離的單一結構體。而由於上導板10、止轉層B1及高度設定層B2在加工階段為三件式的分體結構,因此,上導板10、止轉層B1及高度設定層B2可以同時異地進行加工,進而縮短加工所需時間。此外,也由於上導板10、止轉層B1及高度設定層B2係分別加工後再進行結合,因此,當探針頭PH的探針30形式有所不同時,基於探針30的針身32或針尾31的尺寸、形狀具有差異,本實施例便能在上導板10、止轉層B1及高度設定層B2加工時分別改變上導板10的針孔13形式、止轉層B1的非圓形孔H1形式後再行結合,可以更便於適用不同的探針30形式。In this embodiment, the anti-rotation layer B1 and the height setting layer B2 can be respectively made of ceramic material or thin film material. Here, the three-piece split structure in which the
此外,在前述各實施例中,支撐面S1的面積佔上導板10在垂直第一方向D1的方向上之截面積之佔比越大越好。在此實施例中,支撐面S1的面積佔上導板10在第二方向D2上的截面積之佔比較佳是大於50%。藉此得以確保探針頭PH設置於空間轉換器ST時,上導板10能夠受到空間轉換器ST穩定的支撐而不產生形變,而能維持上導板10與空間轉換器ST之間的平行度,也進一步地能夠確保各探針30不會發生異常陷入針孔13或使針孔13裂損之狀況。In addition, in the foregoing embodiments, the larger the ratio of the area of the support surface S1 to the cross-sectional area of the
在另一實施例中,請配合參閱圖7及圖8,圖7及圖8係顯示上導板10包含凹槽15之結構態樣。於此實施例中,凹槽15係由上表面11凹陷,且凹槽15具有槽底面151,在第一方向D1上,槽底面151位於上表面11與下表面12之間。在此實施例中,探針30是設置於凹槽15內,且探針30可以但不限於是陣列式或周圍式地排列於凹槽15內。當各探針30設置於凹槽15內時,在第一方向D1上,各探針30的針尾31之端部是位於槽底面151與上表面11之間,針尾31長度小於凹槽15的高度。In another embodiment, please refer to FIG. 7 and FIG. 8 . FIG. 7 and FIG. 8 show the structure of the
進一步地,在此實施例中,探針30在凹槽15內的排列方式可以視不同的凹槽15形狀而有所不同。在一實施例中,上導板10的凹槽15可以但不限於是矩形或圓形(圖中未示)。在此,基於上導板10的凹槽15形狀,槽底面151為平整的平面,因此,探針30得以呈矩陣式地排列於凹槽15內。例如當上導板10的凹槽15形狀為矩形時,探針30可以呈矩陣式地排列於凹槽15內。Further, in this embodiment, the arrangement of the probes 30 in the
在一實施例中,參閱圖7,上導板10的凹槽15也可以是網格形。在此,基於凹槽15形狀為網格形,槽底面151亦對應成為網格形。如此一來,探針30得以沿著網格形的凹槽15排列,進而成為周圍式的排列。In one embodiment, referring to FIG. 7 , the
進一步地,參閱圖9,圖9實施例與圖7、圖8實施例相同為上導板10設置凹槽15、且探針30周圍式排列的相同結構基礎。於此實施例中,探針30設置於凹槽15內,且上導板10更包含止轉結構A。且於此實施例中,止轉結構A為與上導板10相同材質一體製成的止轉區塊14,止轉區塊14的結構態樣與前述實施例相同而具有連通針孔13的非圓形孔H1且可以具有階面S2。差異在於,本實施例之止轉區塊14係設置於凹槽15的槽底面151。因此,在此實施例中,止轉區塊14的階面S2鄰接非圓形孔H1及上導板10,且止轉區塊14的階面S2係與上表面11不共平面而成為階梯狀,且階面S2位於上表面11與槽底面151之間。而探針30的針尾31同樣地能夠容置於非圓形孔H1內受到非圓形孔H1止轉。Further, referring to FIG. 9 , the embodiment of FIG. 9 is the same as the embodiment of FIG. 7 and FIG. 8 . The
此外,參閱圖10,圖10實施例與圖7、圖8實施例相同為上導板10設置凹槽15、且探針30周圍式排列的相同結構基礎。於此實施例中,上導板10上更設置止轉結構A,且止轉結構A為止轉件40。於此實施例中,止轉件40係設置於槽底面151。另外,在凹槽15中的探針30是以陣列式排列時,設置不具有穿孔H2的止轉件40。而凹槽15形狀為網格形時,設置具有穿孔H2的止轉件40,並讓止轉件40的穿孔H2穿套於網格形狀的凹槽15之間的凸起部上。In addition, referring to FIG. 10 , the embodiment of FIG. 10 is the same as the embodiment of FIG. 7 and FIG. 8 . The
再者,在探針30設置於凹槽15的各實施例中,如圖7至圖10,由於止轉區塊14或止轉件40係設置在低於上表面11的槽底面151上,因此,探針30的針尾31之端部是位於上表面11與槽底面151之間。也就是說,當探針頭PH設置在於空間轉換器ST之後,探針頭PH是以上導板10的上表面11接觸空間轉換器ST。因此,在探針30設置於凹槽15的各實施例中,上表面11的面積佔上導板10在第二方向D2上的截面積之佔比越大越好。在此,上表面11的面積佔上導板10在第二方向D2上的截面積之佔比大於50%。如此一來,在探針30設置於凹槽15的各實施例均得以確保探針頭PH設置於空間轉換器ST時,上導板10能夠受到空間轉換器ST穩定的支撐而不產生形變,而能維持上導板10與空間轉換器ST之間的平行度,也進一步地能夠確保各探針30不會發生異常陷入針孔13或使針孔13裂損之狀況。Furthermore, in each embodiment in which the probe 30 is disposed in the
參閱圖11,在一實施例中,與圖1實施例相同的是上導板10上同樣包含凸塊B,且探針30的針尾31之端部同樣位於支撐面S1與上表面11之間。差異在於,本實施例之探針30係呈陣列式地排列設置於凸塊B圍繞的範圍內。在一具體實施態樣中,上導板10上的凸塊B可以但不限於是封閉的輪廓形狀,例如空心方形。如此一來,在探針頭PH設置於空間轉換器ST之後,探針30的針尾31之端部與空間轉換器ST之間同樣可以保持具有間隙F。Referring to FIG. 11 , in an embodiment, the same as the embodiment of FIG. 1 , the
當然,與前述上導板10包含有凸塊B的圖1實施例相同的是,上導板10可以是與凸塊B及止轉區塊14皆以相同材質一體成形。也可以是上導板10與凸塊B以相同材質一體成形,並再分體設置不同材質的止轉件40。也可以是上導板10以單一材質製成,而包含有止轉層B1及高度設定層B2的凸塊B以不同材質分體製成。Of course, the
綜合以上,本案前述各實施例之探針頭PH在設置於空間轉換器ST時總是能夠以支撐面S1或上表面11貼靠於空間轉換器ST,藉此使得上導板10得以被支撐而降低變形的狀況。進一步地,基於上導板10能夠維持穩定而不變形的狀態,則設置於上導板10的各探針30便能保持與空間轉換器ST間的平行度以及保持具有間隙F,藉此而能在針測過程中避免探針30及上導板10的損壞。In summary, when the probe head PH of the aforementioned embodiments of the present application is disposed on the space transformer ST, the support surface S1 or the
雖然本揭露已以一些實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露之精神及範圍內,當可作些許更動及潤飾。因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed above with some embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.
PH:探針頭 ST:空間轉換器 PCB:電路板 10:上導板 11:上表面 12:下表面 13:針孔 14:止轉區塊 15:凹槽 151:槽底面 20:下導板 30:探針 31:針尾 32:針身 33:針尖 40:止轉件 A:止轉結構 F:間隙 B:凸塊 B1:止轉層 B2:高度設定層 P:電接觸點 S1:支撐面 S2:階面 S3:中介面 H1:非圓形孔 H2:穿孔 D1:第一方向 D2:第二方向PH: Probe head ST: Space Transformer PCB: circuit board 10: Upper guide plate 11: Upper surface 12: Lower surface 13: pinhole 14: Stop block 15: Groove 151: Bottom of groove 20: Lower guide plate 30: Probe 31: pin tail 32: Needle body 33: Needle Tip 40: Anti-rotation parts A: Anti-rotation structure F: Clearance B: bump B1: anti-rotation layer B2: Height setting layer P: electrical contact point S1: Support surface S2: Step surface S3: Intermediate Surface H1: non-circular hole H2: perforated D1: first direction D2: Second direction
圖1為本發明探針卡之一實施例的示意圖。 圖2為本發明探針頭的上導板具有凸塊且探針周圍式排列之實施例的示意圖。 圖3為本發明探針卡之上導板、凸塊與止轉區塊一體成形之實施例的示意圖。 圖4為設置於本發明探針頭上的止轉件之示意圖。 圖5為本發明探針卡之上導板與凸塊一體成形並另設置止轉件之實施例的示意圖。 圖6為本發明探針卡之上導板為三件式之實施例的示意圖。 圖7為本發明探針頭的上導板具有網格狀凹槽之實施例的示意圖。 圖8為本發明探針頭的上導板具有凹槽之實施例的示意圖。 圖9為本發明探針卡的上導板具有凹槽及止轉區塊之實施例的示意圖。 圖10為本發明探針卡的上導板具有凹槽並另設置止轉件之實施例的示意圖。 圖11為本發明探針卡具有凸塊且探針陣列設置於凸塊內之實施例的示意圖。FIG. 1 is a schematic diagram of an embodiment of a probe card of the present invention. 2 is a schematic diagram of an embodiment of the present invention in which the upper guide plate of the probe head has bumps and the probes are arranged around the probe. FIG. 3 is a schematic diagram of an embodiment in which the upper guide plate, the bump and the anti-rotation block are integrally formed on the probe card according to the present invention. FIG. 4 is a schematic diagram of a rotation-stop member disposed on the probe head of the present invention. FIG. 5 is a schematic diagram of an embodiment of the present invention in which the upper guide plate and the protruding block of the probe card are integrally formed and an anti-rotation member is additionally provided. FIG. 6 is a schematic diagram of an embodiment in which the upper guide plate of the probe card is three-piece according to the present invention. FIG. 7 is a schematic diagram of an embodiment in which the upper guide plate of the probe head of the present invention has grid-shaped grooves. FIG. 8 is a schematic diagram of an embodiment in which the upper guide plate of the probe head of the present invention has grooves. FIG. 9 is a schematic diagram of an embodiment in which the upper guide plate of the probe card of the present invention has grooves and anti-rotation blocks. FIG. 10 is a schematic diagram of an embodiment in which the upper guide plate of the probe card of the present invention has a groove and is provided with a rotation preventing member. FIG. 11 is a schematic diagram of an embodiment of the present invention in which the probe card has bumps and the probe array is disposed in the bumps.
PH:探針頭 PH: Probe head
ST:空間轉換器 ST: Space Transformer
PCB:電路板 PCB: circuit board
10:上導板 10: Upper guide plate
11:上表面 11: Upper surface
12:下表面 12: Lower surface
13:針孔 13: pinhole
15:凹槽 15: Groove
151:槽底面 151: Bottom of groove
20:下導板 20: Lower guide plate
30:探針 30: Probe
31:針尾 31: pin tail
32:針身 32: Needle body
33:針尖 33: Needle Tip
F:間隙 F: Clearance
P:電接觸點 P: electrical contact point
D1:第一方向 D1: first direction
D2:第二方向 D2: Second direction
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US20100231249A1 (en) * | 2009-03-12 | 2010-09-16 | Dang Son N | Probe Head Structure For Probe Test Cards |
TW201423112A (en) * | 2012-10-31 | 2014-06-16 | Formfactor Inc | Probes with spring mechanisms for impeding unwanted movement in guide holes |
TW201632891A (en) * | 2014-11-26 | 2016-09-16 | 日本麥克隆尼股份有限公司 | Contact inspection device |
TW201629494A (en) * | 2014-12-30 | 2016-08-16 | 技術探測股份有限公司 | Manufacturing method of contact probes for a testing head |
WO2018190194A1 (en) * | 2017-04-12 | 2018-10-18 | 株式会社日本マイクロニクス | Electrical connection apparatus |
WO2018193832A1 (en) * | 2017-04-21 | 2018-10-25 | 株式会社日本マイクロニクス | Electrical connection apparatus |
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