JPH02206765A - Probe card - Google Patents
Probe cardInfo
- Publication number
- JPH02206765A JPH02206765A JP1026948A JP2694889A JPH02206765A JP H02206765 A JPH02206765 A JP H02206765A JP 1026948 A JP1026948 A JP 1026948A JP 2694889 A JP2694889 A JP 2694889A JP H02206765 A JPH02206765 A JP H02206765A
- Authority
- JP
- Japan
- Prior art keywords
- probe card
- contactor
- tip
- terminal
- measured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 53
- 239000000919 ceramic Substances 0.000 abstract description 17
- 238000005259 measurement Methods 0.000 abstract description 6
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000007373 indentation Methods 0.000 abstract 3
- 238000012360 testing method Methods 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、集積回路素子、フラットパネルデイスプレ
ィなどのプローブテストに使用するプロ−ブカードに関
し、詳しくは、多ビンであって、被測定端子の端子間距
離が微小な、集積回路素子。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a probe card used for probe testing of integrated circuit devices, flat panel displays, etc. An integrated circuit element with a very small distance between terminals.
フラットパネルデイスプレィなどのテストに使用する、
新規な構造のプローブカードに関する。Used for testing flat panel displays, etc.
This invention relates to a probe card with a new structure.
［従来の技術］
従来、集積回路素子などのプローブテストに使用するプ
ローブカードとしては、例えば、特公昭５４−４３３５
４号に開示されているテストプローブ組立体が用いられ
ている。このテストプローブ組立体は、第６図、第７図
に示すように、支持体６４と固着層６５とにより、プリ
ント基板６１にプローブ針６２を円錐放射状に固定した
ものである。プリント基板６１にはプリント配線６６が
設けられており、プローブ針６２はこのプリント配線６
６に半田６７で接続される。プローブカードはテスト装
置と電気的に接続されるが、これはスルーホール６８に
ピンを挿入し、このピンをテスト装置と電気的に接続す
ること：こよって行なわれる。テスト時には、プローブ
針６２の先端部６３が被測定端子部分に押し当てられる
。[Prior Art] Conventionally, as a probe card used for probe testing of integrated circuit elements, etc., for example, the
The test probe assembly disclosed in No. 4 is used. As shown in FIGS. 6 and 7, this test probe assembly has probe needles 62 fixed to a printed circuit board 61 in a conical radial manner by means of a support 64 and a fixing layer 65. A printed wiring 66 is provided on the printed circuit board 61, and the probe needle 62 is connected to this printed wiring 6.
6 with solder 67. The probe card is electrically connected to the test equipment by inserting pins into the through holes 68 and electrically connecting the pins to the test equipment. During testing, the tip 63 of the probe needle 62 is pressed against the terminal to be measured.
［解決しようとする課題］
このような従来のプローブカードは、その構造上、プロ
ーブ針（接触子）の間隔をあまり小さくすることは困難
であり、最近の多ビンの集積回路では対応出来ないとい
う問題がある。さらに、この従来の構造のプローブ針は
、被測定端子の上面を針先でひっかくため、針の痕が深
く残り、その後のボンディング不良の原因となる。その
ために、金のような柔らかい金属を使用した被測定端子
では、とくにその使用が困難である。[Problems to be solved] Due to the structure of such conventional probe cards, it is difficult to reduce the distance between the probe needles (contactors), and it is said that recent multi-bin integrated circuits cannot cope with this problem. There's a problem. Furthermore, since the probe needle of this conventional structure scratches the upper surface of the terminal to be measured with the tip of the probe, deep traces of the needle remain, which causes subsequent bonding failures. For this reason, it is particularly difficult to use the test terminal using a soft metal such as gold.
本発明は、このような従来技術の問題点を解決するもの
であり、端子数が数１００本以上の集積回路素子、フラ
ットパネルデイスプレィであって、被測定端子の各々の
間隔が数１０μｍ以下であっても、そのプローブテスト
を容易に行なうことが出来るプローブカードを提供しよ
うとするものである。The present invention solves the problems of the prior art, and is directed to an integrated circuit device or a flat panel display having several hundred or more terminals, where the distance between the terminals to be measured is several tens of micrometers or less. However, the present invention aims to provide a probe card that can easily perform the probe test.
［課題を解決するための手段］
すなわち、本発明のプローブカードの特徴は、おのおの
独立に動く多数の接触子が、被測定端子に対して垂直も
しくはほぼ垂直に接触することにある。しかも、この先
端部にかかる横方向の力が、はぼゼロになるようにして
いる。[Means for Solving the Problems] That is, the probe card of the present invention is characterized in that a large number of contacts that each move independently are in contact with the terminal to be measured perpendicularly or almost perpendicularly. Moreover, the lateral force applied to this tip is made to be almost zero.
しかして、前記のような目的を達成するためのこの発明
のプローブカードにおける手段は、複数の接触子が被測
定端子に対向するように配置されたプローブカードにお
いて、この接触子は被測定端子に実質的に垂直に接触す
る先端部と、この先端部の長さ方向を軸としてこの軸か
ら外れた位置に設定された支点と、先端部と支点との間
に設けられた湾曲部とを含んで構成され、この湾曲部の
頂点は先端部の長さ方向の軸をはさんで支点のある側の
反対側に位置するものである。また、被測定端子の設け
られた集積回路素子チップなどが小さい場合で、四角形
の各辺におのおの複数の接触子が被測定端子に対向する
ように配置されたプローブカードを用いる場合において
は、先端部の長さ方向を軸としてこの軸から四角形の内
側方向へ外れた位置に支点を設定し、軸をはさんでこの
四角形の外側方向に湾曲部の頂点を位置すればよい。Therefore, the means in the probe card of the present invention for achieving the above-mentioned object is a probe card in which a plurality of contacts are arranged to face the terminal to be measured, and the contacts are arranged to face the terminal to be measured. It includes a tip that contacts substantially perpendicularly, a fulcrum set at a position offset from the axis with the longitudinal direction of the tip as an axis, and a curved portion provided between the tip and the fulcrum. The apex of this curved portion is located on the opposite side of the fulcrum across the longitudinal axis of the tip. In addition, when the integrated circuit element chip with the terminal under test is small, and when using a probe card with multiple contacts on each side of a rectangle facing the terminal under test, the tip of the The fulcrum may be set at a position deviating from this axis toward the inside of the rectangle with the length direction of the section as an axis, and the apex of the curved portion may be positioned toward the outside of the quadrangle across the axis.
なお、接触子にはバネ性のある金属、例えば、ベリリウ
ム銅線が良いが、耐摩滅性が要求される場合には、タン
グステンやチタンを使用することも出来るし、被測定端
子と接触する先端部の端部に耐摩滅性のメツキした金属
線を使用することもできる。Note that a springy metal such as beryllium copper wire is good for the contact, but if abrasion resistance is required, tungsten or titanium can also be used, and the tip that contacts the terminal under test Abrasion-resistant plated metal wire can also be used at the end of the section.
［作用］
本発明によれば、各接触子は被測定端子表面に垂直な方
向にのみ変位するので、被測定端子表面に沿った方向の
各接触子の位置が測定中正確に保たれ、微細な接触子で
あっても互いに隣接した接触子どうしが短絡することが
ない。したがって、従来の構造では全く不可能であった
、被測定端子間が８０μｍで端子数が１０００ピン以上
の集積回路素子などにも使用することができる。[Function] According to the present invention, each contact is displaced only in the direction perpendicular to the surface of the terminal to be measured, so the position of each contact in the direction along the surface of the terminal to be measured is maintained accurately during measurement, and fine details are maintained. Even if the contacts are small, adjacent contacts will not short-circuit. Therefore, it can be used for integrated circuit elements having a distance of 80 μm between terminals to be measured and 1000 pins or more, which was completely impossible with conventional structures.
［実施例］
以下、本発明のプローブカードの実施例を、図面を用い
て詳細に説明する。[Example] Hereinafter, an example of the probe card of the present invention will be described in detail using the drawings.
第１図は、本発明のプローブカードの第１の実施例の外
観図であって、第２図はそのＡ−Ｂ面での断面図である
。FIG. 1 is an external view of a first embodiment of the probe card of the present invention, and FIG. 2 is a cross-sectional view taken along the line A-B.
セラミック支持体１は、配線を引出しさらにこのプロー
ブカード自体を支持するためのものである。このセラミ
ック支持体１には、下側へ突出した接触子支持部が設け
られており、表面には２゜Ｏμｍ厚のメタライズ層２が
設けられている。セラミック支持体１の表面に設けられ
たメタライズ層２の部分には、接触子支持部の先端から
２００μｍピッチで、垂直に２．０ｍｍ突出した１００
μｍ径のベリリウム銅線の接触子３の一端が溶着しであ
る。The ceramic support 1 is for drawing out the wiring and supporting the probe card itself. This ceramic support 1 is provided with a contact support portion projecting downward, and a metallized layer 2 with a thickness of 2.0 μm is provided on the surface. On the part of the metallized layer 2 provided on the surface of the ceramic support 1, there are 100 layers protruding vertically by 2.0 mm at a pitch of 200 μm from the tip of the contact support.
One end of the contact 3 is made of beryllium copper wire with a diameter of μm and is welded.
接触子支持部の内壁面には、凹み５が設けられており、
接触子３は湾曲して成型されて、この湾曲部が凹み５内
に格納される。接触子には、後述するように第３図（ａ
）乃至第３図（ｆ）の各種の形状があるが、本実施例で
は第３図（ａ）の形状を用いた。接触子３は、セラミッ
ク支持体１と十分なる接着力を得るために、接着剤４に
よって強固に固定される。測定時のコンタクト圧は、被
測定端子（図示せず）に接触子３が押しつけられた時に
この凹み５内に格納された湾曲部が弾性変形し、この反
力として得られる。A recess 5 is provided on the inner wall surface of the contact support part,
The contactor 3 is molded in a curved manner, and this curved portion is housed in the recess 5. The contacts are shown in Figure 3 (a) as described below.
Although there are various shapes shown in ) to FIG. 3(f), the shape shown in FIG. 3(a) was used in this embodiment. The contactor 3 is firmly fixed to the ceramic support 1 by an adhesive 4 in order to obtain a sufficient adhesive force. The contact pressure during measurement is obtained as a reaction force caused by elastic deformation of the curved portion housed in the recess 5 when the contactor 3 is pressed against a terminal to be measured (not shown).
本発明のプローブカードでは、被測定端子と接触する接
触部分６とが、従来のプローブカードのように摺動じな
いので、被測定端子にほとんど傷がつかない。この第一
の実施例の場合、プローブカードの最大オーバードライ
ブ値（被測定端子に接触部分６が最初に接触してから、
さらに押しつけることが出来る最大ストローク値）は、
約５００μｍあり、通常の使用ではオーバードライブ値
は５０μｍ以下であるから、全く問題なく使用できる。In the probe card of the present invention, the contact portion 6 that comes into contact with the terminal to be measured does not slide unlike the conventional probe card, so the terminal to be measured is hardly scratched. In the case of this first embodiment, the maximum overdrive value of the probe card (after the contact portion 6 first contacts the terminal under test,
The maximum stroke value that can be pressed further is
It is approximately 500 μm, and in normal use, the overdrive value is 50 μm or less, so it can be used without any problem.
このオーバードライブによる接触圧力によって、接触子
の接触部分６と被測定端子とは確実にオーム性接触する
。The contact pressure caused by this overdrive ensures ohmic contact between the contact portion 6 of the contact and the terminal to be measured.
本実施例では、接触子３を１００μｍ径のベリリウム銅
線で作成したので、被測定端子へのコンタクト力は１本
あたり約３ｇであり、このコンタクト力によって十分な
るオーム性接触を得ることが出来る。In this example, since the contact 3 is made of beryllium copper wire with a diameter of 100 μm, the contact force to the terminal to be measured is approximately 3 g per wire, and sufficient ohmic contact can be obtained with this contact force. .
なお、本実施例では接触子３にベリリウム銅線を使用し
たが、タングステン線、リン青銅線なども使用できる。In this embodiment, a beryllium copper wire is used for the contactor 3, but a tungsten wire, a phosphor bronze wire, etc. can also be used.
また、被測定端子が金の場合、これらの線材の表面に他
の金属をメツキすると良い特性が得られる。本実施例の
接触子３に、白金パラジウムまたは白金ロジウムをメツ
キして、経年変化に対する有効性を確認している。Furthermore, when the terminal to be measured is gold, good characteristics can be obtained by plating the surface of these wires with another metal. The contactor 3 of this example was plated with platinum palladium or platinum rhodium, and its effectiveness against aging was confirmed.
第４図は、本発明のプローブカードの第２の実施例の断
面図である。FIG. 4 is a sectional view of a second embodiment of the probe card of the present invention.
カードの本体は、セラミック支持体１１，１２゜１３の
３つの部分によって構成され、上部のセラミック支持体
１１および下部のセラミック支持体って保持されており
、さらに接触子１７はセラミック支持体１１の表面に設
けられた２００μｍ厚のにメタライズ層１６に一端が溶
着しである。接触子１７は、セラミック支持体１３の表
面から２００μｍピッチで、垂直に２，０ｍｍ突出し゛
ている。接触子には、後述するように第３図（ａ）乃至
第３図（ｆ）の各種の形状があるが、本実施例でも第１
の実施例と同様に第３図（ａ）の形状を用いた。この第
２の実施例の場合も、第１の実施例の場合とほぼ同様の
特性が得られる。本実施例の場合、各接触子の位置が貫
通孔によって正確に規定されるので、接触子の位置精度
は第１の実施例よりもよいが、組立はかなり難しく、さ
らに使用中に１つの接触子が破損した場合等に、部分的
な接触子の交換はかなり困難である。The main body of the card is made up of three parts: ceramic supports 11, 12 and 13, which are held by the upper ceramic support 11 and the lower ceramic support, and the contacts 17 are held by the ceramic supports 11, 12 and 13. One end is welded to the 200 μm thick metallized layer 16 provided on the surface. The contacts 17 vertically protrude 2.0 mm from the surface of the ceramic support 13 at a pitch of 200 μm. The contact has various shapes as shown in FIGS. 3(a) to 3(f) as described later, but in this example, the first shape is also used.
The shape shown in FIG. 3(a) was used as in Example 2. Also in the case of the second embodiment, almost the same characteristics as in the case of the first embodiment can be obtained. In the case of this embodiment, the position of each contact is precisely defined by the through hole, so the positioning accuracy of the contact is better than that of the first embodiment, but assembly is considerably difficult, and furthermore, one contact during use It is quite difficult to partially replace the contactor in the event that the contactor is damaged.
第５図は、本発明のプローブカードの第３の実施例の断
面図である。FIG. 5 is a sectional view of a third embodiment of the probe card of the present invention.
カードの本体は、セラミック支持体２１およびセラミッ
クカバー２２の２つの部分によって構成され、セラミッ
ク支持体２１およびセラミックカバー２２の対向する面
には、おのおの接触子２４を保持する溝２５，２６，２
７．２８が設けられている。これらの溝はおのおの円柱
を立てに半分に割ったような形状をしており、溝２５．
２６ならびに溝２７．２８が合せられて貫通孔の様な形
状となる。したがって、セラミックカバーが組合された
状態では本発明の第２の実施例と同様な効果が得られる
。さらに、本実施例の場合、組立が容易であり、また使
用中に１つの接触子が破損した場合等の部分的な接触子
の交換も容易である。The main body of the card is constituted by two parts: a ceramic support 21 and a ceramic cover 22, and on opposite sides of the ceramic support 21 and ceramic cover 22 there are grooves 25, 26, 2, each holding a contact 24.
7.28 is provided. Each of these grooves is shaped like a cylinder cut in half vertically, and grooves 25.
26 and grooves 27 and 28 are combined to form a through hole-like shape. Therefore, when the ceramic cover is combined, the same effects as in the second embodiment of the present invention can be obtained. Furthermore, in the case of this embodiment, it is easy to assemble, and it is also easy to partially replace a contactor when one contactor is damaged during use.
なお、本発明実施例に使用される接触子は、第３図（ａ
）乃至第３図（ｆ）に示すような形状が考えられる。第
３図（ａ）は本発明の第１乃至第３の実施例に使用した
もので、先端部３１と湾曲部３２の取り付は部分がほぼ
９０度の角度をなし、先端部３１の長さ方向を軸として
見た時に支点３３と湾曲部３２の頂点とがほぼ同一のオ
フセット値を持つ形状の接触子である。この接触子は、
先端部３１が接触時に少し横方向へ移動するが、製造が
容易であり、多数の接触子を備えたプローブカードが容
易に生産可能である。第３図（ｂ）の接触子は、先端部
３１と湾曲部３２の取り付は部分がほぼ１２０度の角度
をなし、先端部３１の長さ方向を軸として見た時に支点
３３が湾曲部３２の頂点のほぼ２倍のオフセット値を持
つ形状の接触子である。先端部３１と湾曲部３２の取り
付は部分の角度は、横方向の変位を無くするためには１
３５度±１５度または４５度±１５度程度に設定するの
が好ましい。この接触子は、先端部３１の横方向の移動
がほとんど無く、極めて高性能な接触子が得られるが、
第３図（ａ）の接触子に比べてプローブカードの組立が
難しい。第３図（Ｃ）は、先端部３１と湾曲部３２の取
り付は部分がほぼ６０度の角度をなし、先端部３１の長
さ方向を軸として見た時に支点３３が湾曲部３２の頂点
のほぼ１／２のオフセット値を持つ形状の接触子である
。この形状でも、第３図（ｂ）とほぼ同様な性能が得ら
れる。第３図（ｄ）は、第３図（ａ）とほぼ同様な形状
で、先端部３１と湾曲部３２の取り付は部分がほぼ９０
度の角度をなして清らかに変化しており、先端部３１の
長さ方向を軸として見た時に支点３３と湾曲部３２の頂
点とがほぼ同一のオフセット値を持つ形状の接触子であ
る。The contacts used in the embodiments of the present invention are shown in Figure 3 (a).
) to FIG. 3(f) are conceivable. FIG. 3(a) shows an example used in the first to third embodiments of the present invention, in which the distal end portion 31 and the curved portion 32 are attached at an angle of approximately 90 degrees, and the length of the distal end portion 31 is approximately 90 degrees. The contact has a shape in which the fulcrum 33 and the apex of the curved portion 32 have substantially the same offset value when viewed with the horizontal direction as the axis. This contact is
Although the tip portion 31 moves slightly laterally upon contact, it is easy to manufacture, and a probe card with a large number of contacts can be easily produced. In the contact shown in FIG. 3(b), the tip portion 31 and the curved portion 32 are attached at an angle of approximately 120 degrees, and when viewed with the length direction of the tip portion 31 as the axis, the fulcrum 33 is at the curved portion. This contact has a shape that has an offset value that is approximately twice as large as the 32 vertices. The angle of attachment of the tip part 31 and the curved part 32 should be 1 in order to eliminate lateral displacement.
It is preferable to set the angle to about 35 degrees ± 15 degrees or 45 degrees ± 15 degrees. In this contact, there is almost no lateral movement of the tip 31, and an extremely high-performance contact can be obtained.
The probe card is more difficult to assemble than the contact shown in FIG. 3(a). FIG. 3(C) shows that the distal end portion 31 and the curved portion 32 are attached at an angle of approximately 60 degrees, and the fulcrum 33 is the apex of the curved portion 32 when viewed from the longitudinal direction of the distal end portion 31. The contact has a shape that has an offset value of approximately 1/2 of that of . Even with this shape, almost the same performance as that shown in FIG. 3(b) can be obtained. FIG. 3(d) has almost the same shape as FIG. 3(a), and the mounting portion of the tip portion 31 and the curved portion 32 is approximately 90°.
The contact has a shape in which the fulcrum 33 and the apex of the curved portion 32 have substantially the same offset value when viewed with the longitudinal direction of the tip portion 31 as the axis.
この形状の接触子は、先端部３１と湾曲部３２との取り
付は部分にストレスが加わりにくいので、接触子にチタ
ンやタングステンのような脆弱な材料を使用した場合に
最適である。第３図（ｅ）は、第３図（ｂ）の接触子を
先端部３１と湾曲部３２の取り付は部分がほぼ９０度の
角度をなすように変形したもので、先端部３１の長さ方
向を軸として見た時に支点３３と湾曲部３２の頂点とが
ほぼ同一のオフセット値を持つ形状の接触子である。A contact of this shape is most suitable when a fragile material such as titanium or tungsten is used for the contact because stress is hardly applied to the attachment between the tip portion 31 and the curved portion 32. FIG. 3(e) shows the contact shown in FIG. 3(b) modified so that the tip portion 31 and the curved portion 32 are attached at an angle of approximately 90 degrees, and the length of the tip portion 31 is The contact has a shape in which the fulcrum 33 and the apex of the curved portion 32 have substantially the same offset value when viewed with the horizontal direction as the axis.
この形状は、湾曲部３２の弾性変形が最も安定に起るが
、先端部３１と湾曲部３２との取り付は部分にストレス
が集中するので、チタンやタングステンのような脆弱な
材料にはあまり向がない構造である。第３図（ｆ）は、
第３図（Ｃ）の接触子部３１の長さ方向を軸として見た
時に支点３３が湾曲部３２の頂点のほぼ１／２のオフセ
ット値を持つ形状の接触子である。この形状も、湾曲部
３２の弾性変形が安定に起るが、支点３３にストレスが
集中するので、チタンやタングステンのような脆弱な材
料にはあ′まり向がない構造である。This shape allows the elastic deformation of the curved part 32 to occur most stably, but since stress is concentrated in the attachment of the tip part 31 and the curved part 32, it is not suitable for fragile materials such as titanium or tungsten. It is a structure with no direction. Figure 3(f) is
The contact is shaped such that the fulcrum 33 has an offset value of approximately 1/2 of the apex of the curved portion 32 when viewed from the longitudinal direction of the contact portion 31 in FIG. 3(C). This shape also allows stable elastic deformation of the curved portion 32, but since stress is concentrated on the fulcrum 33, this structure is not suitable for use with brittle materials such as titanium or tungsten.
なお、実施例では断面が円形の１００μｍの金属線を使
用したが、線材の断面形状は四角形であってもよい。５
０μｍ以下の細い接触子の場合は、金属板をフォトエツ
チングして精度の良い接触子を作ることが出来る。In addition, in the example, a 100-μm metal wire with a circular cross section was used, but the cross-sectional shape of the wire may be square. 5
In the case of thin contacts of 0 μm or less, highly accurate contacts can be made by photo-etching a metal plate.
［発明の効果］
以上の説明から理解できるように、この発明にによれば
、各接触子は被測定端子表面に垂直な方向にのみ変位す
るので、被測定端子表面に沿った方向の各接触子の位置
が測定中正確に保たれ、微細な接触子であっても互いに
隣接した接触子どうしが短絡することがない。したがっ
て、従来の構造では困難であった、被測定端子間が８０
μｍで端子数が１０００ピン以上の集積回路素子などに
も使用することができる。したがって、多ビンの集積回
路素子、フラットパネルデイスプレィなどの進歩に大き
く貢献するものである。[Effects of the Invention] As can be understood from the above explanation, according to the present invention, each contact is displaced only in the direction perpendicular to the surface of the terminal to be measured, so that each contact in the direction along the surface of the terminal to be measured is The position of the contacts is maintained accurately during measurement, and even if the contacts are minute, adjacent contacts will not short-circuit. Therefore, the distance between the terminals to be measured is 80 mm, which was difficult with the conventional structure.
It can also be used for integrated circuit elements having 1000 or more pins in μm. Therefore, it will greatly contribute to the advancement of multi-bin integrated circuit devices, flat panel displays, etc.
第１図は本発明のプローブカードの第１の実施例の外観
図、第２図はそのＡ−Ｂ面での断面図、第３図（ａ）乃
至第３図（ｆ）はおのおの本発明実施例に使用される接
触子、第４図は本発明のプローブカードの第２の実施例
の断面図、第５図は、本発明のプローブカードの第３の
実施例の断面図、第６図は従来のプローブカードの平面
図（一部分）、第７図はその断面図である。
１．１１，１２，１３．２１・・・セラミック支持体、
２，１６．２３・・・メタライズ層、３．１７．２４・
・・接触子、４・・・接着剤、５・・・凹み、６・・・
接触部分、１４．１５・・貫通孔、２２・・・セラミッ
クカバー２５．２６，２７．２８・・・溝、３１・先端
部、３２・・・湾曲部、３３・・・支点、６１・・・プ
リント基板、６２・・・プローブ針、６３・・・プロー
ブ針の先端部、６４・支持体、６５・・・固着層、６６
・・・プリント配線、６７・ ・半田、６８・・・スル
ーホール。
特許出願人 ギガプローブ株式会社
第３因
′！４図
乾固
第５図FIG. 1 is an external view of the first embodiment of the probe card of the present invention, FIG. 2 is a cross-sectional view taken along the A-B plane, and FIGS. 3(a) to 3(f) each represent the present invention. 4 is a sectional view of the second embodiment of the probe card of the present invention; FIG. 5 is a sectional view of the third embodiment of the probe card of the present invention; FIG. The figure is a plan view (partially) of a conventional probe card, and FIG. 7 is a sectional view thereof. 1.11, 12, 13.21... ceramic support,
2,16.23...metalized layer, 3.17.24...
...Contact, 4...Adhesive, 5...Dent, 6...
Contact portion, 14.15... Through hole, 22... Ceramic cover 25.26, 27.28... Groove, 31... Tip, 32... Curved part, 33... Fulcrum, 61... - Printed circuit board, 62... Probe needle, 63... Tip of probe needle, 64 - Support body, 65... Fixed layer, 66
...Printed wiring, 67...Solder, 68...Through hole. Patent applicant: Giga Probe Co., Ltd. Third Cause! Figure 4: Dryness Figure 5
Claims (6)
されたプローブカードにおいて、前記接触子は前記被測
定端子に実質的に垂直に接触する先端部と、該先端部の
長さ方向を軸として該軸から外れた位置に設定された支
点と、前記先端部と前記支点との間に設けられた湾曲部
とを含んで構成され、該湾曲部の頂点は前記軸をはさん
で前記支点の反対側に位置することを特徴とするプロー
ブカード。(1) In a probe card in which a plurality of contacts are arranged to face a terminal to be measured, the contact has a tip that contacts the terminal to be measured substantially perpendicularly, and a longitudinal direction of the tip. a fulcrum set at a position away from the axis, and a curved part provided between the tip and the fulcrum, and the apex of the curved part is located on both sides of the axis. A probe card located on the opposite side of the fulcrum.
られていることを特徴とする特許請求の範囲第１項記載
のプローブカード。(2) The probe card according to claim 1, wherein a groove for accommodating the curved portion is provided in the probe card main body.
表面に突起部が設けられていることを特徴とする特許請
求の範囲第１項記載のプローブカード。(3) The probe card according to claim 1, wherein a protrusion is provided on the main surface of the probe card main body portion between the plurality of contacts.
されていることを特徴とする特許請求の範囲第１項記載
のプローブカード。(4) The probe card according to claim 1, wherein the tip portion is passed through a hole provided in the probe card main body.
つて構成され、先端部が通されている穴が前記２つの部
分に設けられた半円柱状の溝を合せて構成されているこ
とを特徴とする特許請求の範囲第４項記載のプローブカ
ード。(5) The probe card main body is composed of at least two parts, and the hole through which the tip is passed is formed by matching semi-cylindrical grooves provided in the two parts. A probe card according to claim 4.
子に対向するように配置されたプローブカードにおいて
、前記接触子は前記被測定端子に実質的に垂直に接触す
る先端部と、該先端部の長さ方向を軸として該軸から前
記四角形の内側方向へ外れた位置に設定された支点と、
前記先端部と前記支点との間に設けられた湾曲部とを含
んで構成され、該湾曲部の頂点は前記軸をはさんで前記
四角形の外側方向に位置することを特徴とするプローブ
カード。(6) In a probe card in which a plurality of contacts are arranged on each side of a rectangle so as to face a terminal to be measured, each of the contacts has a tip portion that contacts the terminal to be measured substantially perpendicularly; a fulcrum set at a position deviating from the longitudinal direction of the tip toward the inside of the rectangle from the axis;
A probe card comprising: a curved portion provided between the tip portion and the fulcrum, the apex of the curved portion being located on the outer side of the quadrangle across the axis.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1026948A JPH02206765A (en) | 1989-02-06 | 1989-02-06 | Probe card |
| US07/859,245 US5214375A (en) | 1989-02-06 | 1992-03-26 | Multi-point probe assembly for testing electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1026948A JPH02206765A (en) | 1989-02-06 | 1989-02-06 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02206765A true JPH02206765A (en) | 1990-08-16 |
Family
ID=12207378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1026948A Pending JPH02206765A (en) | 1989-02-06 | 1989-02-06 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02206765A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03180769A (en) * | 1989-12-11 | 1991-08-06 | Kobe Steel Ltd | Probe for examination |
| JPH06253791A (en) * | 1993-03-01 | 1994-09-13 | Urashima:Kk | Packaged oden (japanese hodgepodge) and its production |
| JPH06256662A (en) * | 1993-03-01 | 1994-09-13 | Shin Etsu Chem Co Ltd | Conductive polymer |
| JPH0729838U (en) * | 1993-11-08 | 1995-06-02 | 日本電子材料株式会社 | Vertical motion probe card with buckling stress reduction mechanism |
| JPH0729839U (en) * | 1993-11-08 | 1995-06-02 | 日本電子材料株式会社 | Vertical spring type probe card |
| TWI395953B (en) * | 2009-02-05 | 2013-05-11 | King Yuan Electronics Co Ltd | Socket and test probe thereof |
-
1989
- 1989-02-06 JP JP1026948A patent/JPH02206765A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03180769A (en) * | 1989-12-11 | 1991-08-06 | Kobe Steel Ltd | Probe for examination |
| JPH06253791A (en) * | 1993-03-01 | 1994-09-13 | Urashima:Kk | Packaged oden (japanese hodgepodge) and its production |
| JPH06256662A (en) * | 1993-03-01 | 1994-09-13 | Shin Etsu Chem Co Ltd | Conductive polymer |
| JPH0729838U (en) * | 1993-11-08 | 1995-06-02 | 日本電子材料株式会社 | Vertical motion probe card with buckling stress reduction mechanism |
| JPH0729839U (en) * | 1993-11-08 | 1995-06-02 | 日本電子材料株式会社 | Vertical spring type probe card |
| TWI395953B (en) * | 2009-02-05 | 2013-05-11 | King Yuan Electronics Co Ltd | Socket and test probe thereof |
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