JPH0921828A - Vertical actuation type probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a fine adjustment between probes and to prevent a short from being brought about even when a gap between the probes is made small. SOLUTION: This is a vertical actuation type probe card in which probes 100 are vertically disposed to electrode pads 711 of LSI chips 710 which are a measured object. It is provided with a base board 200 on which a plurality of probes 100 are vertically mounted, spacers 300 mounted on an under surface of the base board 200, a needlepoint guide member 400 which has an insulation property and is mounted on the spacers 300 and disposed in parallel with the base board 200 and an adjustment member 500 which has an insulation property and is disposed between the needlepoint guide member 400 and the base board 200 in parallel with both of them In the needlepoint guide member 400, through holes 411, 421 through which the tip of the probes 100 passes are perforated and in the adjustment member 500, through hole 510 for adjustment through which the probes pass is perforated.

Description

Detailed Description of the Invention

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a probe card used for measuring various electrical characteristics of an LSI chip or the like to be measured.

[0002]

2. Description of the Related Art A conventional probe card will be described with reference to FIGS. As shown in FIG. 6, a probe card for measuring various electrical characteristics of the LSI chip 710 has a so-called horizontal type in which a so-called probe 100 is oriented horizontally. The horizontal probe card includes a substrate 200 made of an insulating synthetic resin, a ring 250 attached to the substrate 200,
Probes 10 attached to the inclined surface 251
0, and the rear end of the probe 100 is
0 in the pattern wiring 260 formed in the
0 and the like. The substrate 20
At 0, a connector 280 to which the pattern wiring 260 is connected is provided. The probe card is fixedly attached to the fixed table 900 with the attachment screws 910.

On the other hand, an LSI chip 71 which is an object to be measured
Numeral 0 is vacuum-adsorbed to the movable table 800 as the wafer 700 before being diced into the individual LSI chips 710. Then, by bringing the contact portion 110 at the tip of the probe 100 into contact with the electrode pad 711 of each LSI chip 710, each LSI is
The electrical characteristics of the chip 710 are measured.

The probe 100 is connected to each LSI chip 71
The contact with the zero electrode pad 711 is performed by moving the movable table 800. That is, first, the movable table 800 is raised, and the contact portion 11 of the probe 100 is moved.
0 contacts one or more of the electrode pads 711 of the LSI chip 710. In this state, the LSI chip 710
Are measured.

Next, the wafer 700 is lowered by the movable table 800, moved laterally by one or a plurality of LSI chips 710, and then the movable table 800 again rises at that position to measure an unmeasured value. LSI chip 7
10 electrical characteristics are measured.

In recent years, as shown in FIG. 7, there is also a vertically operated probe card in which a probe 100 is mounted vertically to a substrate 200. Such a vertically actuated probe card includes a substrate 200 on which a plurality of probes 100 are mounted vertically, a spacer 300 mounted on the lower surface side of the substrate, and a needle mounted on a tip of the spacer 300 in parallel with the substrate 200. Point guide member 40
0.

The needle tip guide member 400 includes an upper plate member 41.
0 and the lower plate 420 are arranged in parallel at a predetermined interval. As shown in FIGS. 8A and 8B, the tip of the probe 100 penetrates through both plates 410 and 420. Holes 411 and 421 are provided. In such a vertically operated probe card, the movable table 800
8 rises to bring the probe 100 into contact with the electrode pad 711 of the LSI chip 710.
Buckling as shown in (B). Here, the probe 100
As shown by α in FIG. 8A, the portion curved by the buckling generated on the lower surface of the substrate 200 and the needle point guide member 40
0 and the upper plate 410.

In this vertically actuated probe card, the probe 100 comes into perpendicular contact with the electrode pad 711, so that the probe 100 and the electrode pad 711 come into accurate contact with each other, and the probe 100 has Even if the probe 100 is brought into pressure contact with the pad 711, the displacement of the probe 100 is less likely to occur. Therefore, there is an advantage that the wear of the probe 100 is reduced and the life is prolonged. Further, since the degree of freedom in the arrangement of the probe 100 is greater than that of the horizontal probe card shown in FIG. 6, it is particularly suitable for a large probe card for simultaneously measuring various electrical characteristics of a large number of LSI chips.

[0009]

However, the above-mentioned vertical operation type probe card has the following problems. First, with the recent increase in the speed of LSI chips, it has become necessary to minimize the routing of wiring in a probe card. That is, when the speed of the signal is increased, the attenuation is increased unless the conduction path is shortened as much as possible, and crosstalk occurs with other signals. For this reason, in the conventional vertically actuated probe card, the probe is dealt with by making it as short as possible, but when the probe becomes short, the contact pressure to the electrode pad of the probe becomes large with a slight overstroke. There is a problem that it becomes difficult to finely adjust the intervals.

Further, even if the probe is not shortened, the LSI
When the degree of integration of the chip is improved, the interval between the probes becomes smaller, and there is a problem that a portion bent at the time of buckling comes into contact with an adjacent probe to cause a short circuit.

There is no problem if the tips of all the probes are located on the same plane, which is also a plane parallel to the LSI chip. The degree of bending and the angle with respect to the LSI chip may be different. This means that the contact pressure of the probe with respect to the electrode pad cannot be the same for all the probes, which hinders accurate measurement of the electrical characteristics of the LSI chip.

Further, even if the lengths of all the probes are the same, if the needle tip guide member is not parallel to the LSI chip, the plane including the plurality of through holes formed in the needle tip guide member may be an LSI. It is not parallel to the chip.
As a result, the length dimension (indicated by α in FIG. 8A) of the portion that bends due to buckling differs depending on each probe. This means that the contact pressure differs depending on each probe, and it becomes impossible to measure the electrical characteristics of the LSI chip accurately.

The present invention has been made in view of the above circumstances, and in order to cope with the speeding up of an LSI chip, fine adjustment between each probe is possible even if the probes are shortened, and the interval between the probes is reduced. It is an object of the present invention to provide a vertically operated probe card which does not cause a short circuit even when the probe card is used. Also,
Even if there is a slight difference in length between each probe, and even when the needle tip guide member is not parallel to the LSI chip, vertical operation that can make the contact pressure of each probe against the electrode pad as equal as possible It is intended to provide a probe card of the type.

[0014]

A vertically actuated probe card according to a first aspect of the present invention is a vertically actuated probe card in which the probes are arranged vertically with respect to an electrode pad of an object to be measured. A substrate mounted vertically, a spacer mounted on the lower surface of the substrate, a needle tip guide member attached to the spacer and arranged in parallel with the substrate, a needle tip guide member, and An adjusting member having an insulating property is arranged between the substrate and the both in parallel with each other, the needle tip guide member has a through hole through which the tip of the probe penetrates, and the adjusting member has a probe. Adjustment through holes are formed therethrough.

Further, the adjusting member in the vertically actuated probe card according to the second aspect is movable in the horizontal direction and can be fixed to the spacer, the substrate or the needle tip guide member at an arbitrary position. There is.

Further, a stopper whose tip is set lower than the tip of the probe is provided on the needle tip guide member in the vertically actuated probe card according to claim 3;
The stopper has an elastic body that contracts when the tip contacts the object to be measured.

[0017]

FIG. 1 is a schematic sectional view showing a schematic structure of a vertically operated probe card according to a first embodiment of the present invention, and FIG. 2 is a schematic enlarged view of a portion A in FIG. ,
FIG. 3 is a schematic explanatory view of a means for fixing the adjusting member to the spacer, FIG. 4 is a schematic sectional view showing a schematic configuration of a vertically operated probe card according to a second embodiment of the present invention, and FIG. FIG. 7 is a schematic sectional view showing a schematic configuration of a vertically operated probe card according to a third embodiment of the present invention.

The vertically actuated probe card according to the first embodiment is a vertically actuated probe card in which the probe 100 is arranged perpendicular to an electrode pad 711 of an LSI chip 710 to be measured, A substrate on which a plurality of probes 100 are vertically mounted;
A spacer 300 attached to the lower surface of the substrate 200; a needle guide member 400 having an insulating property attached to the spacer 300 and arranged in parallel with the substrate 200;
An adjusting member 50 having an insulating property, which is arranged between the needle tip guide member 400 and the substrate 200 in parallel with the two.
0 and a stopper 6 provided on the needle tip guide member 400.
00.

The probe 100 has a pointed tip of a tungsten wire rod, and the diameter of the portion other than the pointed tip is set to about 0.08 mm.

The board 200 is a multi-layer board similar to that used in a conventional vertically operated probe card, and has a through hole 2 corresponding to the probe 100 to be mounted.
01 has been established. Further, a wiring pattern (not shown) for connecting the probe 100 is formed on the substrate 200.

A mounting block 210 is mounted on the lower surface of the substrate 200. This mounting block 21
0, a through hole 211 is formed at the same position as the through hole 201 of the substrate 200.

Therefore, the rear end of the probe 100 is made to penetrate the through hole 211 of the mounting block 210 and the through hole 201 of the substrate 200, and the rear end is soldered to the wiring pattern of the substrate 200, so that not only the electric connection but also the electric connection is obtained. It is structurally attached to the substrate 200.

The spacer 300 is mounted on the mounting block 210. Such spacers 300 are four rods, all of which have the same length.

The needle tip guide member 400 attached to the tip of the spacer 300 includes an upper plate 410 and a lower plate 420 parallel to the upper plate 410 at a predetermined interval from the upper plate 410. Have. In addition, this needle point guide member 400 has a through hole 411 described later.
It is formed of an insulating member so that a short circuit does not occur even if the probe 100 that penetrates through the contact.

The upper plate 410 has a plurality of 0.085 mm diameter through holes 411 corresponding to the arrangement of the electrode pads 711.
Has been established. On the other hand, the lower plate 420 has a plurality of through holes 421 corresponding to the arrangement of the electrode pads 711. As shown in FIG. 2, the diameter of the through hole 421 is set to be larger than the probe 100 but smaller than the diameter of the through hole 411. In addition, both through holes 411, 421
Among them, those corresponding to the upper and lower sides are set such that the same vertical line passes through the respective centers.

Further, the upper plate 410 is connected to the lower plate 420.
It is set one size larger. This is the upper member 4
This is because a stopper 600 to be described later is attached to 10.

On the other hand, the adjusting member 500 which is one feature of the present invention is a plate-shaped insulating member,
The same number of through holes 510 for adjustment are provided. The adjusting through-hole 510 is a portion through which the probe 100 penetrates, and has a diameter of 0.16 mm, which is slightly larger than the diameter of the probe 100. The positional relationship between the adjustment through holes 510 is determined by the electrode pad 711.
It corresponds to the arrangement of.

At the four corners of the adjusting member 500, openings 520 larger than the spacer 300 are opened.
The adjusting member 500 has a structure in which the spacer 30 is provided in the opening 520.
By penetrating the zero point, it is positioned approximately at the middle between the substrate 200 and the needlepoint guide member 400.

When the probe 100 buckles,
The displacement amount is the largest at a substantially intermediate position between the substrate 200 and the needle point guide member 400. Therefore, the degree of buckling can be adjusted by adjusting the mutual positional relationship between each probe 100 and each adjustment through-hole 510 of the adjustment member 500.

The reason why the opening 520 is set to be larger than the spacer 300 is that the adjusting member 500 can be moved in the horizontal direction. That is, the adjusting member 50
0 in the horizontal direction, the adjustment member 500
By changing the degree of contact between the adjustment through hole 510 and the probe 100, the difference in contact pressure based on the difference in the length of the probe 100 is adjusted.

For example, the adjusting member 500 is
In a free state, each probe 100 is made to protrude from the through-hole 421 of the lower plate 420 of the needle point guide member 400 by about 0.5 mm.
Is moved horizontally. The horizontal movement of the adjustment member 500 causes the probe 100 and the adjustment through-hole 51 to move.
The distance to the zero edge changes.

When the probe 100 is buckled and the probe 100 comes into contact with the edge of the adjusting through hole 510,
No further buckling occurs. By adjusting the distance between the probe 100 and the edge of the adjustment through-hole 510,
The degree of buckling occurring in the probe 100 is adjusted.

Further, by bringing the edge of the adjustment through hole 510 into contact with the probe 100, the irregular probe 100
Can be adjusted equally.

When the above adjustment is completed, for example, an epoxy resin 530 or the like is injected into the opening 520 to fix the adjusting member 500 to the spacer 300, as shown in FIG. Further, as shown in FIG. 3B, it is also possible to form a male screw 310 on the peripheral surface of the spacer 300 and fix the adjusting member 500 with two nuts 540 screwed to the male screw 310.

As shown in FIG. 2, the stopper 600 includes a shaft 610 attached to the upper plate 410 so as to be able to advance and retreat in a vertical direction, and an elastic contact portion 620 attached to the tip of the shaft 610. Is wound around the shaft 610, and the upper plate 410 and the contact portion 6
Spring 63 as an elastic body interposed between
0.

The contact portion 620 is 0.5 mm from the tip of the probe 100 when no external force is applied, that is, when the spring 630 is not contracted at all.
It is set so that it is located about below. For this reason, the contact portion 620 of the stopper 600 comes into contact with the LSI chip 710 prior to the probe 100.

The stopper 600 is provided with the needle tip guide member 40.
This is for ensuring parallelism with respect to the LSI chip 710. The needle guide member 400 is an LSI chip 710
If not parallel, the plurality of through holes 411 and 421 opened in the needle point guide member 400 and the LSI chip 710
Are different from each other, so that a portion where buckling occurs differs depending on the probe 100. this is,
This means that the contact pressure with respect to the electrode pad 711 is changed by the probe 100, and it is difficult to accurately measure various electrical characteristics.

The stopper 600 is provided in consideration of this point. If the needle tip guide member 400 is not parallel to the LSI chip 710, the stopper 60
0, the one that comes in contact with the LSI chip 710 (or the movable table 800) first gives an external force to the needle tip guide member 400, so that the needle tip guide member 400 slightly bends, and the needle tip guide member 400 It approaches more parallel to the chip 710. Thereby, the contact pressure of each probe 100 becomes more equal.

In the first embodiment described above, the adjusting member 500 is attached to the spacer 300, but the present invention is not limited to this. For example,
As shown in FIG. 4, the adjusting member 500 may be attached to the attaching member 220 which is hung from the attaching block 210 of the board 200, or as shown in FIG. The adjustment member 500 may be attached to the attachment member 230 erected on the upper surface.

[0040]

The vertically actuated probe card according to the first aspect is a vertically actuated probe card in which the probes are vertically arranged with respect to the electrode pads of the object to be measured, and a plurality of probes are vertically attached. A substrate, a spacer attached to the lower surface of the substrate, a needle tip guide member attached to the spacer and arranged in parallel with the substrate, and a space between the needle tip guide member and the substrate And an adjusting member having an insulating property arranged in parallel to both of them, a through hole through which the tip of the probe penetrates the needle tip guide member, and an adjusting member through which the probe penetrates the adjusting member. Each through hole is opened.

For this reason, since the buckling portion of each probe is located inside the adjusting through hole of the adjusting member,
Each probe has no risk of contacting an adjacent probe even if buckling occurs. For this reason, a short circuit does not occur between the probes, and it is possible to always accurately measure various electrical characteristics.

Further, in the vertically actuated probe card according to the second aspect, the adjustment member is movable in the horizontal direction and can be fixed to the spacer, the substrate or the needle tip guide member at an arbitrary position. ing.

For this reason, according to the vertically actuated probe card, the degree of buckling that may occur in each probe can be adjusted by the adjusting member, so that a difference in contact pressure due to a slight difference in length can be reduced. Since this can be eliminated and the contact pressure of each probe with respect to the electrode pad can be made equal, it is possible to measure more accurate electrical characteristics.

Further, in the vertically actuated probe card according to the third aspect, the needle point guide member is provided with a stopper whose tip is set lower than the tip of the probe, and the tip of the stopper has an object to be measured. And has an elastic body that contracts when it comes into contact with.

For this reason, even if the needle point guide member is not parallel to the LSI chip, the needle point guide member becomes closer to parallel by the stopper contacting the LSI chip.
Accordingly, even when the needle tip guide member is not parallel to the LSI chip, the contact pressure of each probe with respect to the electrode pad can be equalized, so that more accurate measurement of electrical characteristics can be performed.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a schematic configuration of a vertically actuated probe card according to a first embodiment of the present invention.

FIG. 2 is a schematic enlarged view of a portion A in FIG.

FIG. 3 is a schematic explanatory view of means for fixing an adjusting member to a spacer.

FIG. 4 is a schematic cross-sectional view illustrating a schematic configuration of a vertically operated probe card according to a second embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view illustrating a schematic configuration of a vertically operated probe card according to a third embodiment of the present invention.

FIG. 6 is a schematic sectional view showing a schematic configuration of a conventional horizontal probe card.

FIG. 7 is a schematic cross-sectional view showing a schematic configuration of a conventional vertical operation type probe card.

FIG. 8 is a schematic cross-sectional view showing a problem of a conventional vertically operated probe card.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 probe 200 substrate 300 spacer 400 needle tip guide member 411 through hole 421 through hole 500 adjustment member 510 adjustment through hole 600 stopper 710 LSI chip (measurement target) 711 electrode pad

Front page continued (72) Inventor Hiroshi Iwata 2-5-13 Nishi-Nagasu-cho, Amagasaki-shi, Hyogo Nihon Electronics Materials Co., Ltd.

Claims (3)

[Claims] 1. A vertically actuated probe card in which probes are vertically arranged with respect to an electrode pad of a measurement object, a substrate on which a plurality of probes are vertically attached, a spacer attached to a lower surface of the substrate, and An insulating needle tip guide member attached to a spacer and arranged in parallel to the substrate, and an insulating piece arranged in parallel between the needle tip guide member and the substrate. An adjusting member, wherein the needle tip guide member has a through hole through which the tip of the probe penetrates, and the adjusting member has an adjusting through hole through which the probe penetrates. Vertical actuation probe card. 2. The adjusting member is horizontally movable and can be fixed to a spacer, a substrate or a needle guide member at an arbitrary position. Vertically operated probe card. 3. The needle tip guide member is provided with a stopper having a tip set below the tip of the probe, and the stopper has an elastic body that contracts when the tip contacts the object to be measured. 3. The vertically actuated probe card according to claim 1, wherein