JP3164542B2 - Probe and probe card using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a probe card used for measuring various electrical characteristics of an LSI chip and the like, and a probe used therein.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional probe card 800 has a substrate 81 on which a wiring pattern 811 is formed.
0, a plurality of probes 820 mounted vertically on the substrate 810, and a probe support member 830 mounted on the lower surface side of the substrate 810.

The probe 820 has a contact portion 821 at the front end which contacts the electrode pad 711 of the LSI chip 710 to be measured, and a connection portion 822 at the rear end for connecting the probe 820 to the wiring pattern 811. And an elastically deforming portion 823 which is provided between the contact portion 821 and the connecting portion 822 and which is curved in a substantially U-shape. The probes 820 are manufactured one by one by sharpening the tip of a thin wire such as tungsten or palladium, and bending the probe into a substantially U-shape so that the middle portion becomes the elastically deformable portion 823.

On the other hand, the probe support member 830 includes a plate-shaped first guide member 831 and the first guide member 83.
A plate-like second guide member 832 provided in parallel with the first guide member 832 at a predetermined interval, and an attachment for attaching the first guide member 831 and the second guide member 832 to the lower surface side of the substrate 810 And a member 833. The first guide member 831 and the second guide member 832 have through holes 831 corresponding to the electrode pads 711 of the LSI chip 710.
A, 832A. This through hole 831A,
The probe 820 is positioned by inserting the probe 820 into the 832A. Further, the substantially U-shaped elastic deformation portion 823 of the probe 820 is
Is located between the guide member 831 and the second guide member 832.

Further, the probe 820 is not provided with a substantially U-shaped elastically deforming portion 823, the middle portion is formed thinner than the contact portion or the connecting portion at the tip, and this portion is pressurized by bending in a bow shape. Some have done so.

[0006]

However, the conventional probe described above and the probe card using the same have the following problems. First, due to recent miniaturization of LSI chips, higher integration, larger wafers, higher performance of testers, etc., parallel processing for simultaneously measuring the electrical characteristics of a plurality (currently 64) of LSI chips. Began to take place. For this reason, the probe card can be attached with more probes.

For this reason, in a probe card using a probe having a substantially U-shaped elastically deformable portion, it is necessary to arrange the probes so as to face in the same direction so that the elastically deformable portions of adjacent probes do not come into contact with each other. Therefore, the operation of attaching the probe to the substrate is very troublesome.

In the case of a probe having a substantially U-shaped elastically deformable portion, the elastically deformable portion is located between the first guide member and the second guide member. Parts must be cut off. It is a very difficult task to cut only the probe to be replaced while many probes are adjacent.

Further, if a probe whose mid abdomen is made thinner than other portions is used, the first and second probes can be replaced when the probe is replaced.
It has the advantage of being able to be pulled out smoothly from the guide member of the above, and it is not necessary to consider the direction of arrangement of the probe when attaching the probe, but since the direction in which the thinned portion bends cannot be regulated in advance, the probe The problem of contact between them has not been solved. Further, in the case of a probe whose middle part is thinner than other parts, there is a certain limit in the amount of bending, so that a predetermined pressing force may not be applied to the electrode pad.

The present invention has been made in view of the above circumstances, and is easy to replace while attached to a substrate.
A probe that is not likely to touch adjacent objects,
It is intended to provide a probe card using the same.

A probe according to the present invention has an elastically deforming portion formed in a substantially semicircular shape projecting upward, and a connecting portion extending from one end of the elastically deforming portion to the outside of the elastically deforming portion. An extending portion extending from the other end of the elastic deforming portion toward the center of the elastic deforming portion, and a contact portion extending in a direction substantially orthogonal to the extending portion; The size of the extension is smaller than the diameter of the elastically deformable portion. When the connecting portion is fixed to the substrate constituting the probe card, the extension is in a state of floating from the substrate.

[0012]

The probe card according to the present invention is characterized in that the probe and the wiring pattern to which the connecting portion of the probe is connected are formed on the surface, and the substrate has an opening in which the contact portion of the probe is inserted. And the back of this board
A probe support provided on the surface side and having a through hole into which the contact portion is inserted.

[0014]

FIG. 1 is a drawing of a probe according to an embodiment of the present invention. FIG. 1A is a schematic front view,
FIG. 1B is a schematic plan view, FIG. 2C is a schematic side view, FIG. 2 is a schematic enlarged view of a portion A in FIG. 1A, and FIG. 3 is an embodiment of the present invention. It is a schematic sectional drawing of a part of probe card.

Probe 100 according to an embodiment of the present invention
The elastically deformable portion 110 is formed in a substantially semicircular shape convex upward, a connecting portion 120 extending from one end of the elastically deformable portion 110 to the outside of the elastically deformable portion 110, An extending portion 140 extending from the other end of the deforming portion 110 toward the center of the elastic deforming portion 110;
0 and a contact portion 150 extending in a direction substantially perpendicular to the elastic deformation portion 11.
When the connecting portion 120 is fixed to the lower substrate 400 constituting the probe card A and has a diameter smaller than 0, the extending portion 140 is in a state of floating from the lower substrate 400.

The probe 100 is formed by bending a thin conductive wire, for example, a thin wire of tungsten, palladium or the like.

First, as shown in FIG. 1, the probe 100 has a connection part 120 on the right side and a contact part on the lower side with a substantially semicircular elastic deformation part 110 formed convexly upward. The part 150 is extended.

On the other hand, when used for a probe card A to be described later, the connection portion 120 is a wiring pattern 4 formed on the surface of the lower substrate 400 constituting the probe card A.
10 is a portion connected to The connecting portion 120 extends toward the outside of the elastic deformation portion 110.

An extension 140 connecting the elastic deformation portion 110 and the contact portion 150 extends toward the center of the elastic deformation portion 110. More specifically, the elastic deformation portion 110
From the center to the connecting portion 120 side.
Therefore, the dimension of the extending portion 140 is determined by the elastically transformed portion 110
Is set to be larger than the radius and smaller than the diameter dimension.

When the probe card A described later is used, the contact portion 150 is used to measure the LSI chip 71 as an object to be measured.
The portion which is in contact with the zero electrode pad 711 is sharpened at its tip. The contact portion 150 is suspended from the extending portion 140 in a direction orthogonal to the extending portion 140. Therefore, the contact portion 150 and the connection portion 120 are substantially orthogonal to each other.

Here, the position of the connection portion 120 and the extension portion 14
Compared with the position of 0, the extension 140 is at a higher position. That is, when the connecting portion 120 is fixed to the lower substrate 400 constituting the probe card A, the extending portion 140 is in a state where the extending portion 140 is floating from the lower substrate 400, that is, above the surface of the lower substrate 400. Will be located at

Next, the configuration of the probe card A using the probe 100 will be described with reference to FIG. The probe card A includes the probe 100,
A wiring pattern 410 to which the connection part 120 of the probe 100 is connected is formed on the surface, and the probe 1
00, a lower substrate 400 having an opening 420 into which the contact portion 150 is inserted, and a guide member provided on the back side of the lower substrate 400 and having a through hole 521 into which the contact portion 150 is inserted. Probe support member 50 including 520
0.

Next, the configuration of the probe card A using the probe 100 will be described with reference to FIG. The probe card A includes the probe 100,
A wiring pattern 410 to which the connection part 120 of the probe 100 is connected is formed on the surface, and the probe 1
00, a lower substrate 400 having an opening 420 into which the contact portion 150 is inserted, and a guide member provided on the back side of the lower substrate 400 and having a through hole 521 into which the contact portion 150 is inserted. Probe support member 50 including 520
0.

The lower substrate 400 has a plurality of openings 420 corresponding to the arrangement of the electrode pads 711 of the LSI chip 710 to be measured. A plurality of wiring patterns 410 to which the connection portions 120 are connected are formed around these openings 420. The opening 420 and the wiring pattern 410
When the contact portion 150 is inserted, the connection portion 120 of the probe 100 is placed on the wiring pattern 410 in a positional relationship.

Although not shown, the lower substrate 4
00 is divided into a plurality of layers.
Although 0 is formed, a portion to which the probe 100 is connected is always exposed on the surface of the lower substrate 400. The exposure of the probe 10
The connection with 0 is guaranteed. In addition, the terminal end of the wiring pattern 410 is a land 411 for contacting a contact portion 611 at the tip of a contact 610 described later.

In the probe 100, the contact portion 150 has the opening 4
20 and is connected to the wiring pattern 420 by soldering, thereby being attached to the lower substrate 400. Then, as shown in FIG. 3, the probe 100 attached to the lower fang 400 is in a state where the extension 140 is floated from the lower substrate 400, that is, located above the surface of the lower substrate 400. .

On the other hand, the probe support member 500 includes a hanging member 510 hanging from the back surface of the lower substrate 400, a plate-like guide member 520 made of silicon nitride or the like attached to the hanging member 510, And a spacer 530 for hanging the 400 from an upper substrate 600 described later.

The guide member 520 is provided with the opening 42.
A through hole 521 corresponding to 0 is opened. That is, the through-holes 521 have an arrangement corresponding to the arrangement of the electrode pads 711 of the LSI chip 710 to be measured.

The guide member 520 supports the lower end portion of the contact portion 150 of the probe 100.
Therefore, the sharpened tip, which is the lower end portion of the contact portion 150, projects from the through hole 521 of the guide member 520.

Further, the lower substrate 400 is attached to the upper substrate 600 via a spacer 530.
The upper substrate 600 has a through hole 601 corresponding to the land 411 of the lower substrate 400. Also, a wiring pattern 602 covering a plurality of layers is formed on the upper substrate 600. The probe 100 and the wiring pattern 602 of the upper substrate 600 are electrically connected by inserting the connector 610 into the through-hole 601 so that the tip is in contact with the land 411 and the rear end is connected to the wiring pattern 602 of the upper substrate 600. Connection.

As the contact 610, the middle abdomen 612 described in the section of the prior art is used.
One that is thinner than the connection portion 613 at the rear end is used. However, the present invention is not limited to the contact 610, and may be another contact, for example, a contact generally called a pogo pin. In addition, the contact called this pogo pin,
It has a cylindrical sleeve, a contact needle member housed inside the sleeve so as to be able to advance and retreat, and a spring loaded inside the sleeve and pressing the contact needle member outward.

Then, the wiring pattern 602 of the upper substrate 600 is connected to a test computer (not shown) via a connector (not shown).

The measurement of the electrical characteristics of the LSI chip 710 by the probe card A configured as described above will be described. First, a wafer 700 on which a plurality of LSI chips 710 are formed is sucked on a table 750. The table 750 or the probe card A moves to bring the contact portion 150 of the probe 100 into contact with the electrode pad 711.

Then, the contact portion 150 is attached to the electrode pad 711.
Is applied, an overdrive of 50 to 100 μm is applied, and 10 μm is applied between the contact portion 150 and the electrode pad 711.
g of contact pressure. By applying this overdrive, the elastically deforming portion 110 of the probe 100 is elastically deformed, and an appropriate contact pressure is secured. Here, the term “overdrive” means that pressure is applied after the contact portion 150 of the probe 100 contacts the electrode pad 711 of the LSI chip 710.

At this time, the elastic deformation portion 1 of the probe 100
10 is elastically deformed by an amount corresponding to the overdrive, but the extension 140 of the probe 100 is
The lower substrate 400 has no relation to the deformation of the probe 100 because it is floating from the probe 100. That is, when the extending portion 140 is in a state of being in close contact with the lower substrate 400,
Since the extension 140 hits the lower substrate 400 when the overdrive is released, even if there is a slight dimensional error in the probe 100, interference between the lower substrate 400 and the probe 100 may occur as the probe 100 is used repeatedly. However, if the extension 140 is in a state of floating from the lower substrate 400, there is no possibility that such interference will occur.

In this state, signals are exchanged with a test computer (not shown) to measure various electrical characteristics of the LSI chip 710.

When the measurement of one LSI chip 710 is completed, the table 750 or the probe card A is moved, and the measurement of the next LSI chip 710 is performed in the same manner.

When the probe 100 needs to be replaced for some reason, the upper substrate 600 is removed, and the connection portion 120 and the wiring pattern 410 are soldered with the elastic deformation portion 110 of the probe 100 exposed. The probe 100 can be pulled out from the lower substrate 400 only by removing it. At this time, since the pull-out can be performed with the elastically deforming portion 110 formed to project upward, there is also an effect that the work becomes very easy.

When attaching a new probe 100, the contact portion 150 is inserted into the opening 420 of the lower substrate 400 and the through hole 521 of the guide member 520, and
Is soldered to the wiring pattern 410.

[0040]

[0041]

[0042]

[0043]

[0044]

[0045]

[0046]

[0047]

[0048]

[0049]

Although the probe card using the above-described probe 100 uses the upper substrate 600, the lower substrate 400 can be used without using the upper substrate 600.
May be directly treated as equivalent to the upper substrate 600.

Further, according to the length dimension of the contact portion 150,
The news and configuration of the probe support member 500 can be changed. For example, when the contact portion 150 or the like is long, the probe 100 or the like can be more reliably supported by providing a plurality of guide members 520 of the probe support member 500.

[0052]

According to a first aspect of the present invention, there is provided an elastically deforming portion formed in a substantially semicircular shape protruding upward, and extending from one end of the elastically deforming portion toward the outside of the elastically deforming portion. A connection portion, an extension portion extending from the other end of the elastic deformation portion toward the center of the elastic deformation portion, and a contact portion extending in a direction substantially orthogonal to the extension portion. The dimension of the extending portion is smaller than the diameter of the elastically deforming portion. When the connecting portion is fixed to the substrate constituting the probe card, the extending portion floats from the substrate.

Therefore, when this probe is used for a probe card, the probe can be replaced without cutting the probe as in the related art. Further, since the elastically deformable portions do not protrude in the lateral direction, there is no possibility that the elastically deformable portions of adjacent probes come into contact with each other. Therefore, more probes can be arranged than conventional probes. Further, the extension of the probe has a dimension smaller than the diameter of the elastically deformable portion, and when the connecting portion is fixed to the substrate constituting the probe card, the extension is in a state of floating from the substrate. (Lower substrate) is independent of probe deformation. That is, if the extension portion is in close contact with the substrate (lower substrate), the extension portion contacts the substrate (lower substrate) when overdrive is released. Interference may occur between the substrate (lower substrate) and the probe as it is used repeatedly. However, if the extension is floating above the substrate (lower substrate), such interference may occur. It is not.

The probe card according to claim 2 is
A probe according to claim 1, wherein a wiring pattern to which a connection portion of the probe is connected is formed on a surface, and a substrate having an opening for inserting a contact portion of the probe is provided,
A probe support provided on the back side of the substrate and having a through-hole into which the contact portion is inserted.

For this reason, this probe card has the same effects as the above-mentioned probe, that is, it can be replaced without cutting the probe, there is no contact between the elastically deformed portions, and more probes can be arranged. A probe card having an effect that interference with a substrate (lower substrate) does not occur can be provided.

[0056]

[0057]

[0058]

[0059]

[Brief description of the drawings]

1A and 1B are drawings of a probe according to an embodiment of the present invention, wherein FIG. 1A is a schematic front view, FIG. 1B is a schematic plan view, and FIG. 1C is a schematic side view. FIG.

FIG. 2 is a schematic enlarged view of a portion A in FIG. 1 (A).

FIG. 3 is a schematic sectional view of a part of the probe card according to the embodiment of the present invention.

FIG. 4 is a schematic sectional view of a conventional probe card of this type.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 probe 110 elastic deformation part 120 connection part 140 extension part 150 contact part

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hiroshi Iwata 2-5-113 Nishi-Nagasu-cho, Amagasaki-shi, Hyogo Japan Electronic Materials Co., Ltd. (56) References JP-A-6-21168 (JP, A) JP-A-64-35382 (JP, A) JP-A-48-101884 (JP, A) JP-A-6-62370 (JP, U) JP-A-7-2975 (JP, U) (58) Fields surveyed (58) Int.Cl. ⁷ , DB name) G01R 1/06-1/073 H01L 21/66

Claims (2)

(57) [Claims] An elastically deforming portion formed in a substantially semicircular shape protruding upward; a connecting portion extending from one end of the elastically deforming portion toward the outside of the elastically deforming portion; An extending portion extending from the other end of the portion toward the center of the elastically deformable portion, and a contact portion extending in a direction substantially orthogonal to the extending portion; A probe having a dimension smaller than a diameter dimension of the elastically deformable portion, wherein when the connecting portion is fixed to a substrate constituting the probe card, the extending portion floats from the substrate. 2. A substrate according to claim 1, wherein a wiring pattern to which a connection portion of the probe is connected is formed on a surface, and a substrate having an opening through which a contact portion of the probe is inserted is provided. probe card of provided on the rear surface side, wherein the contact portion is provided with a probe support portion in which a through hole is opened to be inserted.