JP3944196B2 - Probe device and substrate inspection device - Google Patents

Description

  The present invention provides a probe apparatus for transmitting an inspection signal between a predetermined inspection point set on a wiring pattern on an inspection surface of a substrate to be inspected and an inspection control means for inspecting electrical characteristics of the substrate to be inspected, and The present invention relates to a substrate inspection apparatus. The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In this specification, these various wiring boards are collectively referred to as “substrates”.

  The wiring pattern on a circuit board needs to accurately transmit electrical signals to electrical components such as ICs and resistors mounted on the circuit board. Between wiring points to be inspected for printed wiring boards, circuit wiring boards with wiring patterns formed on liquid crystal panels and plasma display panels, or wiring patterns formed on substrates such as semiconductor wafers The resistance value is measured to determine whether it is good or bad.

  Here, for inspection such as disconnection and short circuit of the wiring pattern, a test contact that can be moved in three axial directions is pressed against the inspection points provided at two locations of the wiring pattern to be inspected. Measure the voltage level generated between the inspection contacts by passing a predetermined level of measurement current between the inspection contacts, and compare the measured voltage level with a threshold value to determine whether the test is good or bad. There is something to do. In addition, a movable contact is pressed against the inspection point of the wiring pattern on one surface of the board, and a multi-needle contact is pressed against the inspection point on the other surface to perform the above determination, or the movable contact Various board inspection apparatuses using a movable contact are known, such as one that measures the capacitance between a wiring pattern in which a child is pressed and a solid conductor.

  In such a substrate inspection apparatus using a movable contact, in order to improve the inspection accuracy, it is necessary to accurately position the inspection point. For example, a probe apparatus including the contact shown in FIG. A method of accurately positioning the probe by using a link mechanism has been proposed (see Patent Document 1). FIG. 12 is an explanatory view of the probe device, where (a) is a state before being pressed against the inspection point 301 on the wiring pattern formed on the substrate 3, and (b) is the inspection point. In this state, it is in pressure contact with 301. As shown in FIG. 12, the probe device 9 has a support member 92 (component member 923) that is moved in a direction (vertical direction in the figure) perpendicular to the inspection surface of the substrate by a drive mechanism (not shown), and a base end is And a contact 91 which is fixed to the support member 92 and whose tip is pressed against the inspection point 301.

Further, the support member 92 is composed of four structural members 921 to 924 made of resin or the like via elastic deformation portions 931 to 934, respectively, to form a so-called link mechanism. Since the link mechanism is provided, the support member 92 is configured when the constituent member 923 of the support member 92 is further moved to the substrate 3 side by the drive mechanism after the tip of the contact 91 contacts the inspection point 301. Due to the elastic deformation of the elastic deformation portions 931 to 934, the contact 91 moves in the direction opposite to the moving direction, and positioning is performed accurately.
JP-A-11-304835

  However, even when the link mechanism is configured as described above, when the constituent member 923 of the support member 92 is moved to the substrate 3 side by the drive mechanism and the tip of the contact 91 comes into contact with the inspection point 301, the contact Since the inertial force generated with respect to 91 and the support member 92 (excluding the component member 923) is concentrated on the tip of the contact 91, an indentation may occur at the inspection point 301. In particular, when the moving speed of the contact between inspection points is increased in order to increase the efficiency of inspection work, the above problem becomes more apparent. In order to prevent the generation of such indentations, the contact is braked before the contact is pressed against the inspection point. However, since the moving speed is reduced by the braking, the inspection efficiency is improved. descend.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a probe device and a substrate inspection apparatus capable of suppressing the occurrence of scratches such as indentations due to the probe at the inspection point of the substrate. .

The probe apparatus according to claim 1, wherein an inspection signal is transmitted between a predetermined inspection point set on a wiring pattern on an inspection surface of a substrate to be inspected and an inspection control means for inspecting an electrical characteristic of the substrate to be inspected. A probe device for transmission, wherein the holding member is configured to be movable, driving means for driving the holding member in a direction perpendicular to the inspection surface of the substrate to be inspected, and an elastic and linear conductive member A vertical portion made of a conductive material and a horizontal portion made of a conductive material having elasticity are formed integrally or connected to form a substantially L shape, and a base end of the horizontal portion is formed with the inspection control means. In order to connect the inspection point to the inspection point, the tip of the vertical portion is connected to the inspection point so that the inspection signal can be transmitted. Pressed in a direction perpendicular to the inspection surface of the substrate to be inspected And that contact is fixed to the holding member, has a cylindrical body whose inner diameter is larger than the outer diameter of the contactor, said by penetrating the vertical portion of the contact in the interior of the tubular body A support member that is supported substantially perpendicularly to the inspection surface of the substrate to be inspected and that is electrically insulated from the contact is provided.

  According to the above configuration, the driving member drives the holding member in a direction perpendicular to the inspection surface of the substrate to be inspected, and the tip of the contact whose base end is fixed to the holding member is set on the substrate. The inspection point and the inspection surface of the substrate to be inspected are pressed in a direction perpendicular to each other so that the inspection point and the inspection signal can be transmitted. The contactor is formed by integrally or connecting a vertical portion made of a linear conductive material having elasticity and a horizontal portion made of a conductive material having elasticity so as to form a substantially L shape. In addition, with the base end of the horizontal portion fixed to the holding member substantially parallel to the inspection surface of the substrate to be inspected, the tip of the vertical portion is pressed against the inspection surface of the substrate to be inspected in the vertical direction. Further, since the support member is electrically insulated from the contact, the inspection signal is prevented from propagating to the support member.

  A stress acts on the tip of the contact in a direction away from the inspection surface of the substrate to be inspected, but the contact is penetrated into the cylindrical body fixed to the holding member to inspect the substrate to be inspected. Because it is supported almost perpendicularly to the surface, the part of the contact that is supported by the cylindrical body including the tip (vertical part) is displaced in the direction perpendicular to the inspection surface without bending, according to the amount of push-in. In addition, the contact is securely connected to the inspection point so as to transmit the inspection signal. Note that, of the contact, a portion (horizontal portion) disposed substantially parallel to the inspection surface of the substrate to be inspected including the base end is deformed into a convex shape in a direction away from the inspection surface of the substrate to be inspected.

  Therefore, the stress generated when the tip of the contact is pressed in a direction perpendicular to the inspection surface of the substrate to be inspected is only a force corresponding to the inertial force of the contact. Since the stress generated when pushing in is only the restoring force corresponding to the deformation of the portion (horizontal portion) disposed substantially parallel to the inspection surface of the inspected substrate including the base end, the indentation at the inspection point of the substrate Is suppressed.

  Furthermore, since the support member is electrically insulated from the contact, the inspection signal is prevented from propagating to the support member, and the portion of the contact supported by the cylindrical body including the tip ( The vertical part) is displaced in the direction perpendicular to the inspection surface without bending, and the angle formed by the contact tip with respect to the inspection surface is held at a substantially right angle. The inspection signal is connected to be transmitted.

  The probe device according to a second aspect is characterized in that the vertical portion and the horizontal portion are formed by bending one linear conductive material in the contact.

  According to the above configuration, since the linear conductive material having one contact is bent to form the vertical portion and the horizontal portion, the contact is easily and inexpensively manufactured.

  The probe device according to a third aspect is characterized in that the contact is formed such that the horizontal portion is plate-shaped and the vertical portion and the horizontal portion are connected.

  According to the above configuration, the contact is formed when the contact is pushed in in order to ensure contact because the horizontal part is formed of a plate-like member and the vertical part and the horizontal part are connected to each other. The stress to be changed changes according to the elastic coefficient of the horizontal part and the elastic coefficient of the vertical part. Therefore, by appropriately selecting the elastic coefficient of the horizontal part and the elastic coefficient of the vertical part, it is possible to set the stress generated when the contactor is pushed in to ensure contact with the desired value. Furthermore, the generation of indentations at the inspection point of the substrate is suppressed.

  The probe device according to claim 4 is characterized in that the cylindrical body of the support member is configured such that the end surface on the inspection substrate side is tapered.

  According to said structure, since the end surface by the side of to-be-inspected board is formed in the tapered shape about the cylindrical body of a supporting member, the front-end | tip of a contactor is supported in a more exact position, As a result, a contactor The tip of is pressed against the exact position of the inspection point.

  The probe device according to claim 5 is characterized in that the contact is formed so that a bending angle which is an angle formed by the vertical portion and the horizontal portion is in a range of 105 ° to 130 °.

  According to said structure, since the bending angle which is an angle | corner which the perpendicular | vertical part and horizontal part of a contactor make is in the range of 105 degrees-130 degrees, the front-end | tip of a contactor is an inspection surface in an inspection point. The contact is connected to the inspection point so as to be able to reliably transmit the inspection signal. In addition, since the bending angle of the contact is in the range of 105 ° to 130 °, the portion (horizontal portion) disposed substantially parallel to the inspection surface of the substrate to be inspected including the base end of the contact, The convex shape is stably deformed (with reproducibility) in a direction away from the inspection surface of the substrate to be inspected, and the tip of the contact is pressed to the inspection point side by its elastic restoring force, and it is more reliable between the inspection points. Are connected to transmit the inspection signal.

  The probe device according to claim 6, wherein an angle formed by the cylindrical body of the support member with respect to the inspection surface of the substrate to be inspected and an angle formed by the tip of the contact with respect to the inspection surface of the substrate to be inspected In order to make it larger, the support member is arranged on the holding member.

  According to the above configuration, the support member is configured so that the angle formed by the cylindrical body of the support member with respect to the inspection surface of the substrate to be inspected is larger than the angle formed by the tip of the contact with respect to the inspection surface of the substrate to be inspected. Is disposed on the holding member, the point where the tip of the contact comes into contact with the inspection point is included in the range of the orthogonal projection image on the inspection surface of the end surface on the inspection surface side of the cylindrical body.

  Accordingly, after the tip of the contactor comes into contact with the inspection point, when the support member moves by the pushing amount in the direction approaching the inspection surface, the end of the contactor is brought into contact with the inspection surface by the end surface on the inspection surface side of the cylindrical body. Since it is not pressed in the horizontal direction, the tip of the contact is prevented from moving after contacting the inspection point, and the generation of scratches at the inspection point of the substrate is prevented.

  The probe device according to claim 7 is characterized in that the vertical portion of the contact is made of a metal wire having a wire diameter of 50 to 100 μm.

  According to the above configuration, since the vertical portion of the contact is made of a wire having a wire diameter of 50 to 100 μm, even when the mass of the vertical portion of the contact is small and the moving speed of the contact between inspection points is increased. When the tip of the contact comes into contact with the inspection point, the inertial force received by the inspection point is reduced, and the generation of indentations at the inspection point is suppressed. Further, although the contact is repeatedly deformed, since the vertical portion of the contact is made of a metal wire, the contact is less likely to be damaged due to fatigue or the like, and the life can be extended.

  The probe device according to an eighth aspect is characterized in that the end portion of the tip of the vertical portion of the contactor is a part of a spherical surface.

  According to the above configuration, since the end face of the tip of the vertical portion of the contact is a part of a spherical surface, when the tip of the contact comes into contact with the inspection point, the tip of the contact is elastically deformed, Surface contact. Therefore, since the stress (pressure per unit area) that the inspection point of the substrate receives from the tip of the contact becomes small, the generation of indentation is further suppressed.

  The probe device according to claim 9 is provided with a regulating member that contacts the horizontal portion of the contact and regulates deformation of the contact toward the side away from the substrate to be inspected. .

  According to said structure, a control member is contacted with the horizontal part of a contactor, and a deformation | transformation of the contactor to the side spaced apart with respect to a to-be-inspected board | substrate is controlled by a control member. Therefore, since the deformation of the horizontal portion of the contact to the side away from the substrate to be inspected is restricted by the regulating member, the elastic restoring force generated with the deformation of the contact is increased, and the tip of the contact is An inspection signal can be transmitted between the inspection point and the inspection point more reliably.

  Therefore, for example, when using a wire with a small wire diameter as the contact, the elastic restoring force of the contact is small, and the contact between the tip of the contact and the inspection point (transmission of the inspection signal) tends to be unstable. Since the elastic restoring force generated with the deformation of the contact is increased by the regulating member, the contact between the tip of the contact and the inspection point is stabilized.

  The probe device according to claim 10 is configured such that a position at which the restricting member restricts deformation of the contact to the side opposite to the substrate to be inspected can be changed in the horizontal portion of the contact. It is characterized by that.

  According to said structure, since the control member is comprised so that the position which controls the deformation | transformation to the opposite side to a to-be-inspected board | substrate of a contactor can be changed in the horizontal part of a contactor, the to-be-inspected board | substrate of a contactor It is possible to change the elastic restoring force of the contact by changing the position that restricts the deformation to the opposite side.

  Therefore, for example, when the wire diameter, material, etc. of the contact disposed on the holding member changes, the position of the contact is changed by changing the position of the contact that restricts the deformation of the contact to the opposite side of the substrate to be inspected. It becomes possible to set the elastic restoring force to an appropriate magnitude. For example, when it is desired to increase the elastic restoring force, the position regulated by the contactor may be moved away from the base end.

  The probe device according to an eleventh aspect is characterized in that the regulating member is made of an elastic material.

  According to said structure, since a control member consists of elastic materials, when the front-end | tip of a contactor contacts an inspection point, the force which an inspection point receives becomes still smaller, and generation | occurrence | production of an indentation is suppressed more reliably.

  The probe device according to a twelfth aspect is characterized in that the support member is made of a conductive material and is grounded.

  According to the above configuration, since the support member is made of a conductive material and is grounded, a portion (vertical portion) penetrating through the cylindrical body of the support member among the contacts is electrostatically shielded. As a result, the disturbance signal associated with the stray capacitance is eliminated, and a more accurate inspection can be performed.

  In particular, a conductive reference surface provided to cover the entire wiring pattern of the substrate separately from the solid conductor portion or the substrate formed in a planar shape for the purpose of supplying power and ground to almost the entire substrate and inspection When performing a capacitance inspection to check that there is no short circuit between the wiring pattern to be inspected and other wiring patterns based on the capacitance between the wiring pattern and the target wiring pattern, Since it is easily affected, the above effect is further increased.

  The probe device according to a thirteenth aspect is characterized in that the holding member is made of a conductive material and is grounded.

  According to the above configuration, since the holding member is made of a conductive material and is grounded, a portion (horizontal portion) of the contact disposed along the holding member is statically moved by the holding member. As a result, the disturbance signal associated with the stray capacitance is eliminated, and a more accurate inspection is possible. In particular, when the above-described capacitance inspection is performed, the above-described effect is further increased because it is easily affected by disturbances due to stray capacitance.

  The probe device according to claim 14, wherein the contact is provided with an insulating coating on a surface excluding a base end and a tip, and the cylindrical body of the support member passes through the plurality of contacts simultaneously. It is a feature that can be supported.

  According to the above configuration, the contact is provided with an insulating coating on the surface excluding the base end and the tip, and the cylindrical body of the support member is configured to be able to penetrate and support the plurality of contacts simultaneously. Therefore, it becomes possible to press-contact a plurality of contacts simultaneously to the adjacent inspection points.

  Accordingly, the current supply contact and the voltage measurement contact are pressed against the two inspection points, respectively, and the measurement current is supplied between the current supply contacts press-contacted to the respective inspection points. A four-terminal measurement method that measures the resistance value with high accuracy by measuring the voltage generated between the voltage measuring contacts that are in pressure contact with each other to suppress the influence of the contact resistance between the measurement terminal and the inspection point. A probe device that is suitably used when performing the above is realized.

  The probe device according to claim 15 is characterized in that the support member is formed integrally with a plurality of cylindrical bodies capable of penetrating and supporting one contact.

  According to said structure, since the several cylindrical body which can respectively support and support the contact member of 1 support member is comprised integrally, a some contactor can be press-contacted to the test point which adjoins simultaneously. It becomes. Therefore, a probe device that is suitably used when implementing the above-described four-terminal measurement method is realized.

  A substrate inspection apparatus according to a sixteenth aspect is a substrate inspection apparatus for inspecting electrical characteristics of a substrate to be inspected, and the probe apparatus according to any one of claims 1 to 15 and the probe apparatus through the probe apparatus. Inspection control means for transmitting an inspection signal to a predetermined inspection point set on the wiring pattern on the inspection surface of the substrate to be inspected and inspecting electrical characteristics of the substrate to be inspected. Yes.

  According to said structure, since the probe apparatus in any one of Claims 1-15 is provided, generation | occurrence | production of the indentation in the test | inspection point of a board | substrate is suppressed, and it test | inspects reliably between a contactor and a test | inspection point. A substrate inspection apparatus connected to be able to transmit signals is realized.

  According to the first aspect of the present invention, the inertia force generated when contacting the inspection surface of the substrate to be inspected in the vertical direction and the stress generated when the contactor is pushed in after being contacted are reduced. Therefore, it is possible to suppress the generation of indentation at the inspection point of the substrate. Furthermore, the part (vertical part) supported by the cylindrical body including the tip of the contact is displaced in a direction perpendicular to the inspection surface without bending, and the tip of the contact is substantially perpendicular to the inspection surface. Since the contact is moved, the contact tip is accurately positioned with respect to the inspection point, and the inspection signal can be reliably transmitted between the contact and the inspection point.

  According to the second aspect of the present invention, since the linear conductive material having one contact is bent to form the vertical portion and the horizontal portion, the contact can be manufactured easily and inexpensively.

  According to the third aspect of the present invention, by appropriately selecting the elastic coefficient of the horizontal part and the elastic coefficient of the vertical part, the stress generated when the contact is pushed in to ensure contact with the desired value. Since it becomes possible to set, generation | occurrence | production of the impression in the test | inspection point of a board | substrate can further be suppressed.

  According to the fourth aspect of the present invention, since the end surface on the inspected substrate side of the cylindrical member of the support member is formed in a tapered shape, the tip of the contact is supported at a more accurate position. As a result, the tip of the contact can be pressed to the exact position of the inspection point.

  According to the fifth aspect of the present invention, the part (horizontal portion) of the contact that is disposed substantially parallel to the inspection surface of the substrate to be inspected including the base end is separated from the inspection surface of the substrate to be inspected. Stablely deformed in a convex shape (with reproducibility), and the tip of the contact is pressed toward the inspection point by its elastic restoring force, so that inspection signals can be transmitted more reliably between inspection points. Can connect.

  According to the invention described in claim 6, when the tip of the contactor contacts the inspection point, the end surface on the inspection surface side of the cylindrical body when the support member moves by the pushing amount in the direction approaching the inspection surface. Since the tip of the contact is not pressed in the direction parallel to the inspection surface, the tip of the contact is prevented from moving after contacting the inspection point, and the generation of scratches at the inspection point of the substrate can be prevented. .

  According to the invention described in claim 7, since the mass of the vertical part of the contact is small, even when the moving speed of the contact between the inspection points is increased, the inspection is performed when the tip of the contact contacts the inspection point. The inertial force received by the point is reduced, and the generation of indentation at the inspection point can be suppressed. Further, although the contact is repeatedly deformed, since the vertical portion of the contact is made of a metal wire, the contact is less likely to be damaged due to fatigue or the like, and the life of the contact can be prolonged.

  According to the eighth aspect of the present invention, since the stress that the inspection point of the substrate receives from the tip of the contact is reduced, the generation of indentation can be further suppressed.

  According to the ninth aspect of the present invention, since the elastic restoring force generated with the deformation of the contact is increased by the regulating member, the contact between the tip of the contact and the inspection point can be stabilized.

  According to the tenth aspect of the present invention, the elastic restoring force of the contact can be set to an appropriate magnitude by changing the position for restricting the deformation of the contact to the side opposite to the substrate to be inspected. .

  According to the eleventh aspect of the invention, since the regulating member is made of an elastic material, when the tip of the contact comes into contact with the inspection point, the force received by the inspection point is further reduced, and the generation of the indentation is more reliably performed. Can be suppressed.

  According to the twelfth aspect of the present invention, since the support member is made of a conductive material and is grounded, the portion (vertical portion) of the contact that is penetrated by the cylindrical body of the support member is As a result, the disturbance signal associated with the stray capacitance is eliminated, and a more accurate inspection can be performed.

  According to the invention of claim 13, since the holding member is made of a conductive material and is grounded, a portion (horizontal portion) disposed along the holding member in the contact is The holding member is electrostatically shielded. As a result, a disturbance signal associated with the stray capacitance is eliminated, and a more accurate inspection can be performed.

  According to the fourteenth and fifteenth aspects of the present invention, it is possible to realize a probe device that is suitably used when performing the four-terminal measurement method.

  According to the invention described in claim 16, a substrate inspection apparatus is realized in which the generation of indentations at the inspection point of the substrate is suppressed and the inspection signal is reliably connected between the contact and the inspection point. it can.

  A substrate inspection apparatus to which the probe apparatus according to the present invention is applied will be described with reference to FIGS. FIG. 1 is a front view showing an example of the configuration of the substrate inspection apparatus 1, and FIG. 2 is a side view thereof. In the substrate inspection apparatus 1 according to the present embodiment, the substrate 3 that is an inspection object is fixed on the table 200 and contacts the inspection points on the upper surface side of the substrate 3 to transmit inspection signals. The children (hereinafter referred to as probes) 11A and 11B move (hereinafter referred to as a moving operation) in directions parallel to the substrate surface (X-axis direction and Y-axis direction) and in a direction perpendicular to the substrate surface (Z-axis direction). It is configured.

  As shown in FIG. 1, probe driving devices 100A and 100B for moving the probes 11A and 11B are provided substantially symmetrically on the left and right (X axis direction) when viewed from the front. ing. Each of the probe driving devices 100A and 100B includes X-axis driving mechanisms 101A and 101B that drive the probes 11A and 11B in the X-axis direction, and Y-axis driving mechanisms 102A and 102B (see FIG. 2) that drive the Y-axis direction, respectively. And Z-axis drive mechanisms 103A and 103B for driving in the Z-axis direction.

  As shown in FIG. 2, the Y-axis drive mechanisms 102A and 102B are fixed on a fixed frame 201 supported so as to be parallel to the substrate mounting surface 200A of the table 200, and the first movable frames 202A and 202B. Are moved in the Y-axis direction. The X-axis drive mechanisms 101A and 101B are fixed on the first movable frames 202A and 202B, respectively, and are translated in the Y-axis direction together with the first movable frames 202A and 202B by the Y-axis drive mechanisms 102A and 102B.

  The Z-axis drive mechanisms 103A and 103B are fixed to the second movable frames 203A and 203B driven in the X-axis direction by the X-axis drive mechanisms 101A and 101B, and are parallel to the substrate placement surface 200A of the table 200. Driven two-dimensionally in the axial direction and the Y-axis direction.

  As the X-axis drive mechanisms 101A and 101B, the Y-axis drive mechanisms 102A and 102B, and the Z-axis drive mechanisms 103A and 103B, for example, a motor such as a servo motor or a stepping motor, and its rotational motion are converted into a linear motion. A ball screw mechanism, a belt driving mechanism using a motor, a pulley, a belt, or the like can be used.

  As shown in FIG. 2, on the lower and upper portions of the table 200, a substrate 3 for placing the substrate 3 to be inspected at a predetermined inspection position on the table 200 and taking out the substrate 3 that has been inspected is provided. A tray 211 to be mounted and a substrate transport mechanism 210 (see FIG. 4) for transporting the tray 211 are provided.

  A rectangular through opening 200B (see FIG. 4) corresponding to the shape of the substrate 3 is formed at a predetermined inspection position of the table 200 so that the probe can be brought into contact with the back surface of the substrate 3 from below the table 200. Has been. Below the table 200, a lower probe unit 230 (a so-called multi-needle type) in which a plurality of probes are integrally formed is brought into contact with the back surface of the substrate 3, or the lower probe unit 230 is retracted when the substrate 3 is replaced. A lift mechanism 220 is provided.

  Next, details of the holding structure of the substrate 3 on the Z-axis drive mechanisms 103A and 103B and the table 200 in the substrate inspection apparatus 1 of the present embodiment will be described with reference to FIGS.

  FIG. 3 is an enlarged view of FIG. 1 showing an example of the Z-axis drive mechanisms 103A and 103B in the substrate inspection apparatus 1. As shown in FIG. 3, the Z-axis drive mechanisms 103A and 103B (corresponding to a part of the drive means) are fixed to the second movable frames 203A and 203B, respectively, and the probes 11A and 11B are attached to the surface of the substrate 3. Actuators 15A and 15B (corresponding to a part of driving means) using a step motor for generating a driving force for driving in a vertical direction (Z-axis direction), and Z-axis direction by actuators 15A and 15B Probe holders 13A and 13B (corresponding to holding members) driven by

  In addition, a position sensor 205 (see FIG. 5) is provided in the vicinity of the probe holders 13A and 13B and the second movable frames 203A and 203B, and while monitoring the output from the position sensor 205, the probe holders 13A and 13B, The positions of the probes 11A and 11B in the Z-axis direction (that is, the height) are detected, and feedback control is performed so that the driving of the actuators 15A and 15B is stopped when a predetermined height is reached.

  FIG. 4 is a top view showing an example of a structure for holding the substrate 3 on the tray 211. As shown in FIG. 4, the tray 211 includes a substrate placement unit 212 on which the substrate 3 is placed. The substrate platform 212 has an urging means (not shown) that urges the substrate 3 from a direction facing the engagement pins 213 while the substrate 3 placed is engaged with the three engagement pins 213. ), The substrate 3 is urged toward the engagement pin 213, and the substrate 3 can be held on the substrate platform 212. Further, in order to bring the probe of the lower probe unit 230 into contact with the inspection point of the wiring pattern formed on the lower surface of the substrate 3 held in this way, a through opening 200B is formed in the substrate mounting portion 212. .

  Next, an example of a block configuration of the substrate inspection apparatus 1 of the present embodiment is shown in FIG. As shown in FIG. 5, the X-axis drive mechanisms 101A and 101B (see FIG. 1), the Y-axis drive mechanisms 102A and 102B (see FIG. 1), and the Z-axis drive mechanisms 103A and 103B of the probe drive devices 100A and 100B. Each actuator, such as a stepping motor, is connected to the driving device 7. The X-axis drive mechanisms 101A and 101B, the Y-axis drive mechanisms 102A and 102B, and the Z-axis drive mechanisms 103A and 103B detect movement amounts (or positions) in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. The position sensor 205 which consists of a linear scale etc. for this is provided, and the output of each position sensor 205 is each input into the drive device 7, and feedback control is performed. The control device 6 (corresponding to a part of the inspection control means) calculates the position of the inspection point to which the probes 11A and 11B are moved and outputs it to the drive device 7.

  The tester controller 5 (corresponding to a part of the inspection control means) receives the inspection start command from the control device 6, and in accordance with a program stored in advance, the probe 11A abutted on the inspection point of the wiring pattern on the board 3 , 11B and the probes 230A of the lower probe unit 230, two probes that respectively contact two inspection points located at both ends of the wiring pattern to be inspected are sequentially selected as targets for transmitting and receiving inspection signals. . The tester controller 5 outputs a scan command to the scanner 4 (corresponding to a part of the inspection control means) so as to perform inspection between the two selected probes.

  The scanner 4 is connected to the probes 230A of the probes 11A and 11B and the lower probe unit 230. From the tester controller 5, the scanner 4 sequentially inspects the conduction state between the inspection points on the substrate 3 (front surface and back surface). In accordance with the scan command, the switch 11A and 11B and the probe 230A of the lower probe unit 230 are switched to turn on / off sequentially.

<First Embodiment>
The probe apparatus according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a front view (see FIGS. 1 and 3) showing an example of the configuration of the probe device according to the first embodiment of the present invention. (A) is a figure of a probe, (b) is a whole figure of a probe apparatus. In the front view of the substrate inspection apparatus 1 shown in FIGS. 1 and 3, the probe devices are arranged symmetrically, and the configuration thereof is substantially the same. Therefore, for the sake of convenience, in the following description, FIGS. The probe device 10B disposed on the right side (probe device including the probe 11B) will be described.

  The probe device 10B includes a probe 11B made of a substantially L-shaped linear conductive material having elasticity, and a support member that penetrates the probe 11B inside the cylindrical body and supports the probe 11B substantially perpendicularly to the inspection surface of the substrate 3. 12B, a probe holder 13B that holds the probe 11B and the support member 12B, and a regulating member 14B that regulates deformation of the probe 11B in a direction away from the substrate 3.

  The probe 11B has a base end 111B connected to the scanner 4 so as to be able to transmit an inspection signal, and is fixed to the probe holder 13B substantially parallel to the inspection surface of the substrate 3 (in the X-axis direction), and the distal end 112B has an inspection point 301. And in contact with the inspection surface of the substrate 3 in a direction perpendicular to the inspection surface (in the Z-axis direction) so that the inspection signal can be transmitted.

  The probe 11B is made of a metal (for example, copper (Cu)) wire having a wire diameter of 50 to 100 μm (for example, 70 μm), and has a bending angle Θ1 of 105 ° as shown in FIG. Bending or the like is performed as much as possible within a range of ˜130 ° (here, 110 °). Further, the probe 11B is subjected to cutting or the like so that the end surface of the tip 112B becomes a part of a spherical surface, and the base end 111B and the tip 112B are made of an alloy of gold (Au) and nickel (Ni), or In addition, a plating treatment (rust prevention treatment) is performed with an alloy of nickel (Ni) and rhodium (Rh), etc., and an insulating coating such as Teflon (registered trademark) is provided on the surface excluding the base end 111B and the tip 112B. Is formed. The probes 11A and 11B are arranged so as to be inclined by a predetermined angle so that the lower ends can approach each other (here, 70 ° with respect to the inspection surface). Also, it is possible to make contact with each other suitably (without interference of the probe holders 13A, 13B, etc.).

  As shown in FIG. 6B, the support member 12B is a cylindrical body (here, a cylindrical body) made of metal such as aluminum (Al) fixed to the probe holder 13B. The probe 11B is penetrated inside and supported substantially perpendicular to the inspection surface of the substrate 3 (Z-axis direction), and is electrically insulated from the probe 11B. Further, the support member 12B is formed in a tapered shape (here, a truncated cone shape) at the tip 121B on the substrate 3 side.

  Furthermore, an angle Θ20 (60 ° in this case) formed by the support member 12B with respect to the inspection surface of the substrate 3 and an angle Θ10 (here 70 °) formed by the tip 112B of the probe 11B with respect to the inspection surface of the substrate 3 are. In order to make it smaller, the arrangement position of the support member 12B on the probe holder 13B is set. That is, the support member 12B is disposed on the probe holder 13B so that an angle Θ2 formed by the support member 12B and the positive direction of the horizontal X axis with the inspection surface of the substrate 3 is equal to or larger than the angle Θ1 (here, 120 °). Yes.

  The probe holder 13B includes a base portion 131B made of a conductive material such as aluminum (Al), a base end holding portion 134B made of an insulating material fixed to the right upper portion of the base portion 131B, and a base end holding portion 134B. And a connecting portion 132B made of a conductive material such as copper (Cu). A base end 111B of the probe 11B and one end of a signal line 41B through which an inspection signal is transmitted between the scanner 4 and the scanner 11 are connected to the upper surface of the connecting portion 132B by soldering or the like. The support member 12B is fixed to the left end portion of the base portion 131B by welding or the like.

  The regulating member 14B comes into contact with an appropriate portion in the range in which the position of the base end 122B on the side away from the substrate 3 of the support member 12B and the base end 111B in both ends of the probe 11B, and the base end 111B. The deformation of the probe 11B toward the separating side is restricted. The restricting member 14B is made of an elastic material such as rubber, and a position 113B (see FIG. 8) that restricts deformation of the probe 11B to the side opposite to the substrate 3 is supported by the base end 122B of the support member 12B of the probe 11B. It is comprised so that change is possible between the made position and the base end 111B.

  FIG. 7 is a front view (see FIGS. 1 and 3) showing an example of the operation of the probe apparatus according to the first embodiment of the present invention. (A) is a state before the tip 112B of the probe 11B is pressed against the inspection point 301 of the substrate 3, and (b) is a state where the tip 112B of the probe 11B is pressed against the inspection point 301 of the substrate 3. Is shown. The probe 15B is driven in a direction (Z-axis direction) perpendicular to the inspection surface of the substrate 3 by the actuator 15B, and the distal end 112B of the probe 11B having the base end 111B fixed to the probe holder 13B is placed on the substrate 3. The tip of the probe 11B is brought into pressure contact with the inspection point 301 of the substrate 3 by being moved in the direction perpendicular to the inspection surface of the substrate 3 (Z-axis direction) so as to connect the set inspection point 301 and the inspection signal so as to be transmitted.

  Stress is applied to the tip 112B of the probe 11B in a direction away from the inspection surface of the substrate 3 (here, the positive direction of the Z axis), but the probe 11B is a cylindrical body fixed to the probe holder 13B. Since the inside of the (support member 12B) is penetrated and supported substantially perpendicularly to the inspection surface of the substrate 3, the portion of the probe 11B supported by the support member 12B including the tip 112B is not bent. The probe 11 </ b> B is displaced in a direction perpendicular to the direction (Z-axis direction) in accordance with the pushing amount of the probe holder 13 </ b> B, and the probe 11 </ b> B is securely connected to the inspection point 301 so as to be able to transmit an inspection signal. A portion of the probe 11B that is disposed substantially parallel to the inspection surface of the substrate 3 including the base end 111B is convex in a direction away from the inspection surface of the substrate 3 (here, the positive direction of the Z axis). Transforms into

  Therefore, the stress generated when the tip 112B of the probe 11B is pressed in the direction perpendicular to the inspection surface of the substrate 3 (in this case, the Z-axis direction) is only the inertial force of the probe 11B, and is reliably brought into contact. Therefore, the stress generated when the probe 11B is pushed in is only a restoring force corresponding to the deformation of a portion disposed substantially parallel to the inspection surface of the substrate 3 including the base end 111B. Generation of indentation is suppressed.

  Further, since the support member 12B is electrically insulated from the probe 11B, the inspection signal is prevented from propagating to the support member 12B, and a cylindrical body (support member) including the tip 112B of the probe 11B. 12B) is displaced in the direction perpendicular to the inspection surface (here, the positive direction of the Z-axis) without bending, and the angle formed by the tip 112B of the probe 11B with respect to the inspection surface is maintained at a substantially right angle. Therefore, the probe 11B is connected to the inspection point 301 so that the inspection signal can be reliably transmitted.

  Further, the cylindrical body of the support member 12B is formed in a tapered shape (here, a truncated cone shape) at the tip 121B on the side of the substrate 3, so that the tip 112B of the probe 11B is supported at a more accurate position, As a result, the tip 112 </ b> B of the probe 11 </ b> B is pressed against the exact position of the inspection point 301.

  Further, since the bending angle Θ1 of the probe 11B is in the range of 105 ° to 130 ° (here, 110 °), the tip 112B of the probe 11B is pressed in a direction substantially perpendicular to the inspection surface at the inspection point 301, and the probe 11B is connected to the inspection point 301 so that the inspection signal can be reliably transmitted. In addition, since the bending angle Θ1 of the probe 11B is in the range of 105 ° to 130 °, the portion of the probe 11B that is disposed substantially parallel to the inspection surface of the substrate 3 including the base end 111B (the support member 12B A region in the range from the position of the base end 122B to the base end 111B: corresponding to a horizontal portion) is stably convex in a direction away from the inspection surface of the substrate 3 (in this case, the Z-axis positive direction) (reproducibility). The tip 112B of the probe 11B is pressed toward the inspection point 301 by the elastic restoring force, and is connected to the inspection point 301 so that the inspection signal can be transmitted more reliably.

  In addition, an angle Θ20 (here, 60 °) formed by the cylindrical body of the support member 12B with respect to the inspection surface of the substrate 3 and an angle Θ10 (here) formed by the tip 112B of the probe 11B with respect to the inspection surface of the substrate 3 In this case, the position where the support member 12B is disposed on the probe holder 13B is set to be smaller than 70 °), and the point where the tip 112B of the probe 11B contacts the inspection point 301 is the point of the tip 121B of the cylindrical body. It is included in the range of the orthogonal projection image to the inspection surface of the end surface.

  Therefore, after the tip 112B of the probe 11B comes into contact with the inspection point 301, when the support member 12B moves by the pushing amount in the direction approaching the inspection surface, the end 112B of the probe 11B is moved by the end surface of the tip 121B of the cylindrical body. Since it is not pressed in the direction parallel to the inspection surface (in the X and Y axis directions), the tip 112B of the probe 11B is prevented from moving after contacting the inspection point 301, and scratches at the inspection point 301 of the substrate 3 are prevented. Is prevented from occurring.

  Further, since the probe 11B is made of a wire having a wire diameter of 50 to 100 μm, even if the mass of the probe 11B is small and the moving speed of the probe 11B between the inspection points 301 is increased, the tip 112B of the probe 11B is connected to the inspection point 301. When the contact point is touched, the inertial force received by the inspection point 301 is reduced, and the generation of indentations at the inspection point 301 is suppressed. Although the probe 11B is repeatedly deformed, the probe 11B is made of a metal wire, so that the probe 11B is hardly damaged due to fatigue or the like, and the life can be extended.

  Furthermore, since the end surface of the tip 112B of the probe 11B is a part of a spherical surface, when the tip 112B of the probe 11B comes into contact with the inspection point 301, the tip 112B of the probe 11B is elastically deformed and comes into surface contact with the inspection point 301. Therefore, since the stress (pressure per unit area) that the inspection point 301 of the substrate 3 receives from the tip 112B of the probe 11B is reduced, generation of indentation is further suppressed.

  FIG. 8 is an explanatory diagram for explaining an example of the operation of the regulating member 14B. (A) is a case where the regulating member 14B is close to the proximal end 111B of the probe 11B, and (b) is a case where the regulating member 14B is far from the proximal end 111B of the probe 11B. The probe 11B between the end point 113B and the base end 111B of the probe 11B whose upward movement is restricted by the lower surface of the restriction member 14B is restricted from moving upward by the restriction member 14B. A range from the end 122B to the end point 113B (here, referred to as a deformation range DF) is a range in which the probe 11B is deformed when the support member 12B is moved by the pushing amount in a direction close to the inspection surface.

  As shown in (a), when the regulating member 14B is close to the base end 111B of the probe 11B, the deformation range DF is widened, and the amount of deformation per unit length of the probe 11B is small, whereas the regulating member When 14B is far from the base end 111B of the probe 11B, the deformation range DF becomes narrow, and the deformation amount per unit length of the probe 11B increases. Therefore, as the restricting member 14B is moved away from the base end 111B of the probe 11B (here, moved in the negative direction of the X-axis), the probe 11B becomes difficult to deform and the restoring force of the probe 11B increases.

  For example, when a wire having a small wire diameter is used as the probe 11B, the elastic restoring force of the probe 11B is small, and the contact (transmission of the inspection signal) between the tip 112B of the probe 11B and the inspection point 301 tends to be unstable. By separating the regulating member 14B from the base end 111B of the probe 11B, the elastic restoring force generated with the deformation of the probe 11B is increased, so that the contact between the tip 112B of the probe 11B and the inspection point 301 is stabilized. .

  FIG. 9 is an explanatory diagram illustrating an example of a grounding state of the probe device according to the first embodiment. (A) is a side view, (b) is a front view. As shown in the figure, a signal line 41B for transmitting an inspection signal between the probe 11B and the scanner 4 is a coaxial cable, and the inspection signal is transmitted via an internal conductor. The outer conductor 152B made of a conductive material such as copper, which is insulated by the body, is grounded via the ground line 153B.

  Further, the outer conductor 152B is configured to have the same potential (grounded state) via the base portion 131B of the probe holder 13B and the ground wire 151B, and the probe holder 13B and the support member 12B have the same potential ( Grounded state). That is, the support member 12B and the probe holder 13B are grounded via the ground wires 151B and 153B and the external conductor 152B.

  As described above, since the support member 12B and the probe holder 13B are grounded, a portion of the probe 11B penetrating the cylindrical body of the support member 12B and a portion disposed along the probe holder 13B are provided. Is shielded electrostatically, and as a result, disturbance signals associated with stray capacitance are eliminated, and more accurate inspection is possible.

  In particular, a conductive standard provided so as to cover all of the wiring pattern of the substrate 3 separately from the solid conductor portion or the substrate 3 formed in a planar shape for the purpose of supplying power and ground to almost the entire substrate 3. When performing a capacitance inspection to check that there is no short circuit between the wiring pattern to be inspected and another wiring pattern based on the electrostatic capacitance between the surface and the wiring pattern to be inspected, it accompanies stray capacitance. Since it is easily affected by disturbance, the above effect is further increased.

Second Embodiment
FIG. 10 is an explanatory diagram illustrating an example of the configuration of the probe device according to the second embodiment. (A) is a side view, (b) is a front view. In the following description of the probe apparatus 10C according to the second embodiment, only the configuration different from the probe apparatus 10B according to the first embodiment will be described, and the description of the same configuration will be omitted. The probe device 10 </ b> C includes a probe 11 </ b> C made of a substantially L-shaped linear conductive material having elasticity, and supports two probes 11 </ b> C inside the cylindrical body so as to be substantially perpendicular to the inspection surface of the substrate 3. 12C, a probe holder 13C that holds the probe 11C and the support member 12C, and a regulating member 14C that regulates deformation of the probe 11C in a direction away from the substrate 3.

  The two probes 11C penetratingly supported inside the cylindrical body of the support member 12C have an insulating coating made of Teflon (registered trademark) or the like on the surface except the base end 111C and the tip 112C so as to be insulated from each other. Is formed. In particular, on the tip 112C side of the probe 11C, an insulating film is formed with Teflon (registered trademark) or the like up to the limit tip where the inspection signal can be transmitted to the inspection point 301 except for the end face contacting the inspection point 301. Yes.

  The support member 12C is a cylindrical body (here, an elliptical cylindrical body) made of metal such as aluminum (Al) fixed to the probe holder 13C, and the two probes 11C are placed inside the cylindrical body. It penetrates and is supported substantially perpendicular to the inspection surface of the substrate 3 (Z-axis direction). The probe holder 13C includes a base portion 131C, a connection portion 132C, and a base end holding portion 134C. On the upper surface of the connecting portion 132C, the base ends 111C of the two probes 11C and one ends of the two signal lines 41C and 42C through which an inspection signal is transmitted between the scanner 4 are respectively soldered. It is connected so that it can be energized.

  As described above, the probe 11C is provided with an insulating coating on the surface excluding the base end 111C and the tip 112C, and the cylindrical body of the support member 12C is configured to be able to penetrate and support the two probes 11C simultaneously. Therefore, the two probes 11C can be pressed against the adjacent inspection point 301 at the same time.

  Accordingly, the current supply contact and the voltage measurement contact are brought into pressure contact with the two inspection points 301, and the measurement current is supplied between the current supply contacts respectively brought into pressure contact with the respective inspection points 301. By measuring the voltage generated between the voltage measuring contacts brought into pressure contact with the inspection point 301, the influence of the contact resistance between the measurement terminal and the inspection point 301 is suppressed, and the resistance value is measured with high accuracy. A probe device 10C that is suitably used when performing the four-terminal measurement method is realized.

<Third Embodiment>
FIG. 11 is an explanatory diagram illustrating an example of the configuration of the probe device according to the third embodiment. (A) is a side view, (b) is a front view. In the following description of the probe device 10D according to the third embodiment, only the configuration different from the probe device 10C according to the second embodiment will be described, and the description of the same configuration will be omitted. The probe device 10D includes a probe 11D made of a substantially L-shaped linear conductive material having elasticity, and one probe 11C penetrating through each of the two cylindrical bodies 121D and 122D. A support member 12D that is supported substantially perpendicularly to the inspection surface, a probe holder 13D that holds the probe 11D and the support member 12D, and a regulation member 14D that regulates deformation of the probe 11D in a direction away from the substrate 3 are provided. .

  Further, the support member 12D is two cylindrical bodies (here, cylindrical bodies) made of metal such as aluminum (Al) fixed to the probe holder 13D, and each of the supporting members 12D is provided inside the cylindrical body. The probe 11D penetrates and is supported substantially perpendicularly (in the Z-axis direction) to the inspection surface of the substrate 3. The two cylindrical bodies are disposed in the probe holder 13D so that the tip 121D side is close (that is, the tips 112D of the two probes 11D that are penetrated and supported by the cylindrical bodies 121D and 122D are close to each other). .

  The probe holder 13D includes a base portion 131D, a connection portion 132D, and a base end holding portion 134D. On the upper surface of the connecting portion 132D, the base ends 111D of the two probes 11D and one ends of the two signal lines 41D and 42D through which the inspection signal is transmitted between the scanner 4 are respectively soldered. It is connected so that it can be energized.

  As described above, the probe 11D is provided with an insulating coating on the surface except the base end 111D and the tip 112D, and the cylindrical body of the support member 12D is configured to be able to pass through and support one probe 11D. Therefore, the two probes 11D can be pressed against the adjacent inspection point 301 at the same time. Therefore, the probe apparatus 10D that is suitably used when the terminal measurement method is performed is realized.

  In addition, since the two probes 11D are respectively supported by the cylindrical bodies, the arrangement positions of the cylindrical bodies on the probe holder 13D can be set separately. Therefore, the inspection points of the two probes 11D The direction with respect to 301 can be set separately.

  In addition, this invention can take the following forms.

  (A) In the first to third embodiments, the substrate inspection apparatus 1 includes probes 11A and 11B (11C and 11D) on the upper surface side of the substrate 3, and a multi-needle lower probe unit 230 on the lower surface side of the substrate 3. However, it is sufficient that the substrate inspection apparatus 1 has at least one probe that can move in the Z-axis direction on the upper surface side or the lower surface side of the substrate 3. For example, a plurality of (for example, two) probes that can move in the Z-axis direction may be provided on the upper surface side and the lower surface side of the substrate 3, or a plurality (for example, 2 respectively) may be provided only on the upper surface side of the substrate 3. May have a probe movable in the Z-axis direction.

  (B) In the first to third embodiments, the probe 11B (11C, 11D) has been described with respect to the case where the end surface of the tip 112B (112C, 112D) is a part of a spherical surface, but the tip 112B (112C, 112D). ) May have a different shape. For example, the end surface of the tip 112B (112C, 112D) of the probe 11B (11C, 11D) may be sharply processed into a needle shape (needle shape). In this case, the tip 112B (112C, 112D) of the probe 11B (11C, 11D) can be easily pressed against the inspection point 301 even when the area of the inspection point 301 on the substrate 3 is small.

  (C) In the first to third embodiments, the case where the cylindrical body of the support member 12B (12C, 12D) is cylindrical (or elliptical cylindrical) has been described. However, the cylindrical section has a polygonal shape. The form which is a body may be sufficient. In this case, the position where the cylindrical body supports the tip 112B (112C, 112D) of the probe 11B (11C, 11D) is further stabilized. In particular, when it is supported at the position of the apex of the polygon which is the cross section of the cylindrical body, it is further stabilized.

  (D) In the first to third embodiments, the case where the tip 121B (121C, 121D) of the cylindrical body of the support member 12B (12C, 12D) has a tapered shape has been described. The cylindrical body which support member 12B (12C, 12D) has may have the form which has a shape gradually tapered toward tip 121B (121C, 121D). For example, the inner surface of the cylindrical body may have a truncated cone shape. In this case, since the entire penetrating portion of the probe 11B (11C, 11D) is substantially uniformly supported by the cylindrical body, the probe 11B (11C, 11D) is further stably supported.

  (E) In the first to third embodiments, the case where the base portion 131B (131C, 131D) of the probe holder 13B (13C, 13D) is made of a conductive material has been described. However, the base portion 131B (131C, 131D) may be made of an insulating material. . In this case, it becomes possible to manufacture the base end holding part 134B (134C, 134D) and the base part 131B (131C, 131D) as a unit.

  (F) In the second and third embodiments, the case where the restricting members 14C and 14D are integrally formed has been described. However, the restricting members 14C and 14D may be provided for each of the probes 11C and 11D. In this case, the positions of the regulating members 14C and 14D can be adjusted for each of the probes 11C and 11D, and the probe devices 10C and 10D capable of performing more accurate measurement are realized.

  (G) In the first to third embodiments, the probe 11B (11C, 11D) is disposed substantially parallel to the inspection surface of the substrate 3 including the horizontal portion (see FIG. 7, including the base end 111B (111C, 111D)). In the above description, the case where the support member 12B (12C, 12D) is formed in a substantially straight line from the position of the base end 122B (122C, 122D) to the base end 111B (111C, 111D) has been described. The horizontal part of the probe 11B (11C, 11D) may be formed in a curved shape.

  For example, when the horizontal portion of the probe 11B (11C, 11D) is formed in an arc shape convex in a direction away from the inspection surface of the substrate 3 (here, the positive direction of the Z axis), the curvature of the arc By changing the radius, it is possible to freely change the elastic coefficient representing the ease of deformation of the probe 11B (11C, 11D).

  (H) In the first to third embodiments, the case where the probe 11B (11C, 11D) is formed by bending a single wire has been described, but the probe 11B (11C, 11D) has a vertical position. The portion corresponding to the portion (that is, the range from the bent portion to the distal end (112B (112C, 112D)) in the first to third embodiments) is formed by the wire, and the horizontal portion (that is, the bent portion to the proximal end (111B ( 111C, 111D)) is formed by a plate-like elastic material such as a leaf spring, and the two are connected by welding or soldering at a position corresponding to the bent portion. Form may be sufficient.

  In this case, since the elastic coefficients of the vertical and horizontal parts can be set independently, it is possible to freely change the elastic coefficient representing the ease of deformation of the probe 11B (11C, 11D). It becomes.

It is a front view which shows an example of a structure of a board | substrate inspection apparatus. It is a side view which shows an example of a structure of a board | substrate inspection apparatus. It is an enlarged view of FIG. 1 which shows an example of the Z-axis drive mechanism in a board | substrate inspection apparatus. It is a top view which shows an example of the holding structure of the board | substrate on a tray. It is a block diagram which shows an example of the block configuration of a board | substrate inspection apparatus. It is a front view which shows an example of a structure of the probe apparatus which concerns on 1st Embodiment of this invention. It is a front view which shows an example of operation | movement of the probe apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing for demonstrating an example of an effect | action of a control member. It is explanatory drawing which shows an example of the grounding state of the probe apparatus which concerns on 1st Embodiment. It is explanatory drawing which shows an example of a structure of the probe apparatus which concerns on 2nd Embodiment. It is explanatory drawing which shows an example of a structure of the probe apparatus which concerns on 3rd Embodiment. It is explanatory drawing of the conventional probe apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 10B, 10C, 10D Probe apparatus 11A, 11B, 11C, 11D Probe (contact)
111B, 111C, 111D Base end 112B, 112C, 112D Tip 12B, 12C, 12D Support member 13A, 13B, 13C, 13D Probe holder (holding member)
14B, 14C, 14D Restriction member 15A, 15B Actuator (part of drive means)
101A X-axis drive mechanism 102A Y-axis drive mechanism 103A Z-axis drive mechanism (part of drive means)
3 Substrate 4 Scanner 5 Tester Controller 6 Control Device 7 Drive Device

Claims (16)

A probe device for transmitting an inspection signal between a predetermined inspection point set on a wiring pattern on an inspection surface of a substrate to be inspected and an inspection control means for inspecting electrical characteristics of the substrate to be inspected,
A holding member configured to be movable;
Driving means for driving the holding member in a direction perpendicular to the inspection surface of the substrate to be inspected;
A vertical portion made of a linear conductive material having elasticity and a horizontal portion made of a conductive material having elasticity are formed integrally or connected to form a substantially L shape. An end is connected to the inspection control means so as to be able to transmit an inspection signal, and is fixed to the holding member substantially parallel to the inspection surface of the substrate to be inspected, and the tip of the vertical portion is inspected with the inspection point. A contact that is pressed in a direction perpendicular to the inspection surface of the substrate to be inspected so as to be able to transmit a signal;
A cylindrical body fixed to the holding member and having an inner diameter larger than the outer diameter of the contactor, and a vertical portion of the contactor is passed through the cylindrical body to inspect the substrate to be inspected. A probe apparatus comprising: a support member that is supported substantially perpendicularly to a surface and that is electrically insulated from the contact.   2. The probe device according to claim 1, wherein the contact portion is formed by bending one linear conductive material to form the vertical portion and the horizontal portion.   The probe device according to claim 1, wherein the contact portion is formed by connecting the vertical portion and the horizontal portion to each other.   The probe apparatus according to any one of claims 1 to 3, wherein the cylindrical body of the support member is formed in a tapered shape at an end surface on the inspected substrate side.   5. The contact according to claim 1, wherein the contact is formed so that a bending angle, which is an angle formed by the vertical portion and the horizontal portion, is within a range of 105 ° to 130 °. Probe device.   In order to make the angle formed by the cylindrical body of the support member with respect to the inspection surface of the substrate to be inspected smaller than the angle formed by the tip of the contact with respect to the inspection surface of the substrate to be inspected, the support member is The probe device according to claim 1, wherein the probe device is disposed on a holding member.   The probe device according to claim 1, wherein the vertical portion of the contact is made of a metal wire having a wire diameter of 50 to 100 μm.   The probe device according to claim 1, wherein an end surface of a tip of the vertical portion of the contact is a part of a spherical surface.   The contact member according to claim 1, further comprising a regulating member that contacts a horizontal portion of the contact and regulates deformation of the contact toward a side away from the substrate to be inspected. Probe device.   The said regulating member is comprised so that the position which regulates the deformation | transformation to the opposite side to the said to-be-inspected board | substrate of the said contactor can be changed in the said horizontal part of the said contactor, It is characterized by the above-mentioned. Probe device.   The probe device according to claim 9, wherein the restriction member is made of an elastic material.   The probe device according to claim 1, wherein the support member is made of a conductive material and is grounded.   The probe device according to claim 12, wherein the holding member is made of a conductive material and is grounded. The contact has an insulating coating on the surface except the base end and the tip,
The probe apparatus according to claim 1, wherein the cylindrical body of the support member is configured to be able to pass through and support the plurality of contacts at the same time.   The probe device according to claim 1, wherein the support member is formed integrally with a plurality of cylindrical bodies capable of penetrating and supporting one of the contacts. A substrate inspection apparatus for inspecting the electrical characteristics of a substrate to be inspected,
The probe device according to any one of claims 1 to 15,
Inspection control means for inspecting the electrical characteristics of the substrate to be inspected by transmitting an inspection signal to and from a predetermined inspection point set on the wiring pattern of the inspection surface of the substrate to be inspected via the probe device A board inspection apparatus comprising:

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