JP2006329998A - Substrate inspecting tool, and inspection probe used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspecting tool capable of easily bringing a measuring terminal into contact with a fine electrode part, and an inspection probe used therefor. <P>SOLUTION: The substrate inspecting tool 42 comprises a base part 46 having an electrode 113 and a head part 45 arranged between a substrate 2 and the base part 46 and retaining a needle pin 107. The head part 45 includes a first constraining member 101 having a first insert through-hole 104 for guiding a tip portion 109 of the needle pin 107 to a land 21 and a second constraining member 117 having a second insert through-hole 106 for guiding a base end portion 110 of the needle pin 107 to the electrode 113. The needle pin 107 comprises an elastic linear conductor part and a coating layer 111 insulating and coating the circumference of the conductor part except the tip portion 109 and the base end portion 110, the boundary of the coating layer 111 with the base end portion 109 being located within the second insert hole 106. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate inspection jig used for inspecting a wiring pattern on a substrate, and an inspection probe used therefor.

  Conventionally, a wiring pattern on a circuit board has a low resistance in order to transmit an electric signal to an IC or other semiconductor or electric component mounted on the circuit board, or to give an electric signal to liquid crystal or plasma. Printed circuit board before placing semiconductors and electrical components, circuit wiring board with wiring pattern formed on liquid crystal panel or plasma display panel, or wiring pattern formed on a substrate such as semiconductor wafer The resistance value is measured to check its quality. The resistance value of the wiring pattern is determined by bringing a measuring terminal into contact with each of the inspection points provided at two locations of the wiring pattern to be inspected and passing a predetermined level of measuring current between the measuring terminals. It is measured using Ohm's law by measuring the voltage generated between the measuring terminals.

However, as described above, when a measurement terminal brought into contact with each of the two inspection points of the wiring pattern is commonly used for supplying the measurement current and measuring the voltage, the contact resistance between the measurement terminal and the inspection point Affects the measurement voltage, and the measurement accuracy of the resistance value is lowered. Therefore, the current supply terminal and the voltage measurement terminal are brought into contact with each inspection point, the measurement current is supplied between the current supply terminals brought into contact with the respective inspection points, and the respective inspection points are contacted. By measuring the voltage generated between the measured voltage measuring terminals, the method of measuring the resistance value with high accuracy by suppressing the influence of the contact resistance between the measuring terminal and the inspection point is a four-terminal measuring method or Known as the Kelvin method or the like (hereinafter referred to as the four-terminal method or the like), and a substrate inspection apparatus for inspecting a wiring pattern using the four-terminal measurement method is known (see, for example, Patent Document 1). ).
JP-A-6-66832

  As described above, when a wiring pattern is inspected, it is necessary to bring the measuring terminal into contact with each inspection point. On the other hand, in recent years, miniaturization of circuit boards has progressed, and as a result of the reduction in the number of lands serving as inspection points, the measurement terminals brought into contact with the lands have also been miniaturized. Therefore, as a result of miniaturizing the electrode part that inputs and outputs signals to and from the measurement terminal by contacting the other end of the measurement terminal with one end in contact with the inspection point, it is difficult to bring the measurement terminal into contact with the electrode part It has become.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate inspection jig in which a measurement terminal can be easily brought into contact with a fine electrode portion and an inspection probe using the same.

  A jig for substrate inspection according to the present invention includes a needle pin in conductive contact with an inspection point of a substrate whose tip portion is an object to be inspected, and an electrode portion in conductive contact with a base end portion opposite to the tip portion of the needle pin. A substrate inspection jig including a base portion having a head portion that is disposed between the substrate and the base portion and holds the needle pin, wherein the head portion is connected to the inspection point. A first restraining member in which a first insertion hole for guiding the distal end portion of the needle pin is formed; and a second restraining member in which a second insertion hole for guiding the proximal end portion of the needle pin to the electrode portion is formed; The needle pin has the distal end portion and the proximal end portion, and has a linear conductor portion made of an elastic material and an outer periphery of the conductor portion excluding the distal end portion and the proximal end portion. It consists of an insulating part with insulation coating and the front Boundary of the base end portion and said insulating portion, characterized in that existing inside the second through hole.

  The inspection probe according to the present invention is held by the head portion of a substrate inspection jig that electrically connects a substrate to be inspected and an inspection apparatus for inspecting the electrical characteristics of the substrate, The substrate to be inspected and the inspection by being inserted into the first insertion hole that is provided in the head portion and guided to the inspection point of the substrate and the second insertion hole that is guided to the electrode portion of the inspection substrate jig. An inspection probe for electrically connecting an electrode portion of a substrate jig, comprising a linear conductor portion having elasticity, a tip portion in electrical contact with an inspection point of the substrate, and an inspection substrate jig An insulating portion that covers the outer periphery of the conductor portion excluding a base end portion that is in conductive contact with the electrode portion, and when held by the head portion, the boundary between the base end portion and the insulating portion is It is located inside the second insertion hole.

  In the substrate inspection jig having such a configuration, since the boundary between the base end portion and the insulating portion is located inside the second insertion hole, at least the portion where the outer periphery of the conductor portion is insulated and thickened is formed. As a result of the part being located inside the second insertion hole, it becomes easy to bring the proximal end portion of the needle pin into contact with the fine electrode.

  Further, the inspection probe having such a configuration is inserted into the second insertion hole that guides to the electrode portion of the inspection substrate jig, so that the boundary between the base end portion and the insulating portion is the second insertion hole. Since it is located inside, at least a part of the portion where the outer diameter of the conductor portion is insulated and thickened is located inside the second insertion hole. Can be easily brought into contact with each other.

  FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, and FIG. 2 is a plan view of the substrate inspection apparatus of FIG. In order to clarify the directional relationship with each drawing described later, XYZ rectangular coordinate axes are shown.

  As shown in these drawings, in this board inspection apparatus, an opening / closing door 11 is attached to the apparatus main body 1 so as to be openable / closable on the front side (−Y side) of the apparatus, and the opening / closing door 11 is opened to be inspected. A board 2 such as a printed board on which a wiring pattern is formed can be carried into a carry-in / out section 3 provided at the central portion on the front side of the apparatus. Further, an inspection unit 4 for inspecting the substrate 2 is provided on the rear side (+ Y side) of the loading / unloading unit 3, and the substrate is inspected by a scanner 74 electrically connected to the inspection unit 4. After the pass / fail judgment is made, the inspected substrate 2 is returned to the carry-in / out section 3 again, and can be carried out by the operator via the open / close door 11.

  In this substrate inspection apparatus, in order to transport the substrate 2 between the loading / unloading unit 3 and the inspection unit 4, the transport table 5 is provided movably in the Y direction and is moved in the Y direction by the transport table driving mechanism 6. It is comprised so that it may be positioned. In other words, in the transport table drive mechanism 6, two guide rails 61, 61 extending in the Y direction are arranged apart from each other in the X direction by a predetermined interval, and the transport table 5 is slidable along these guide rails 61, 61. It has become. In addition, a ball screw 62 is arranged in parallel with the guide rails 61, 61. One end side (−Y side) of the ball screw 62 is pivotally supported by the apparatus main body 1 and the other end side (+ Y side) is conveyed. The rotary shaft 64 of the table driving motor 63 is connected. Further, a bracket 65 to which the transport table 5 is fixed is screwed onto the ball screw 62, and when the motor 63 is rotationally driven in accordance with a command from a control unit described later, the transport table 5 is moved in the Y direction according to the rotation amount. It moves to reciprocate between the loading / unloading unit 3 and the inspection unit 4.

  With reference to FIG. 2, the transfer table 5 includes a substrate platform 51 for placing the substrate 2 thereon. The substrate placement portion 51 engages the substrate 2 with a biasing means (not shown) from the direction facing the engagement pins 53 while the placed substrate 2 engages with the three engagement pins 53. The substrate 2 can be held on the substrate platform 51 by being biased toward the mating pin 53 side. Further, in order to bring the needle pin pair 44 of the lower inspection unit 4D into contact with the wiring pattern formed on the lower surface of the substrate 2 held in this way, a through opening (not shown) is formed in the substrate mounting portion 51. ing.

  In the inspection unit 4, an upper inspection unit 4 </ b> U for inspecting a wiring pattern formed on the upper surface side of the substrate 2 is disposed on the upper side (+ Z side) across the moving path of the transport table 5, while the lower side ( The lower inspection unit 4D for inspecting the wiring pattern formed on the lower surface side of the substrate 2 is disposed on the −Z side).

  The inspection units 4U and 4D have the same configuration, and are arranged symmetrically with the movement path of the transport table 5 in between. The inspection units 4U and 4D include an inspection jig 41 and an inspection jig driving mechanism 43.

  As shown in FIG. 3, the inspection jig driving mechanism 43 is connected to the X jig driving unit 43 </ b> X for moving the inspection jig 41 in the X direction with respect to the apparatus main body 1 and the X jig driving unit 43 </ b> X for inspection. Y jig driving unit 43Y for moving the jig 41 in the Y direction, θ jig driving unit 43θ connected to the Y jig driving unit 43Y for rotating the inspection jig 41 around the Z axis, and θ jig driving The Z jig driving unit 43Z is connected to the portion 43θ and moves the inspection jig 41 in the Z direction. The control unit 71 positions the inspection jig 41 relative to the transport table 5 or the like. The inspection jig 41 is moved up and down (Z direction) so that the needle pin pair 44 can be brought into contact with or separated from the wiring pattern formed on the substrate 2.

  The inspection jig 41 (see FIG. 4) is for inspecting a substrate in which lands of wiring patterns serving as inspection points are relatively regularly arranged in a lattice pattern, and inspects the probe 42 and the multipolar connector 41C. A probe base 41 </ b> F for attaching to the jig driving mechanism 43.

  The probe 42 includes a plurality of needle pin pairs 44 arranged in a lattice pattern at a predetermined pitch. FIG. 5 is a partial perspective view for explaining the structure of the probe 42. The probe 42 shown in FIG. 5 includes a head portion 45 for holding the needle pin pair 44 and a base portion 46 for inputting and outputting a resistance measurement signal between the needle pin pair 44 and the scanner 74. The

  The head unit 45 includes a needle pin pair 44 and plate-shaped guide plates 101, 102, 103 that restrain and hold the needle pin pair 44. The guide plates 101 and 102 are respectively formed with oval insertion holes 104 and 105, and the guide plate 103 is formed with a substantially circular insertion hole 106. Then, when the needle pin pair 44 is inserted into the insertion holes 104, 105, 106, the needle pin pair 44 is restrained in the rotational direction by the oval insertion holes 104, 105.

  The tip portion of the needle pin pair 44 protrudes from the insertion hole 104 of the guide plate 101 so that the top of the tip portion can contact the land 21 (inspection point) formed on the substrate 2. Further, the proximal end portion of the needle pin pair 44 is made contactable with electrodes 113a and 113b described later.

  The insertion holes 104 and 105 are not limited to an oval shape, but may be any shape that restricts the rotation of the needle pin pair 44, such as a rectangle or an ellipse.

  The needle pin pair 44 is formed by, for example, bonding the substantially cylindrical current supply needle pin 107a and the voltage measurement needle pin 107b, and holding the current supply needle pin 107a and the voltage measurement needle pin 107b in parallel in the axial direction. Holding member 108 made of an agent or the like.

  FIG. 6 is a view showing the structure of the current supply needle pin 107a. A substantially elliptical tip surface 109a that is inclined and intersects with the axis of the current supply needle pin 107a is formed at the tip portion of the current supply needle pin 107a shown in FIG. In addition, a substantially elliptical base end surface 110a that is inclined in the direction opposite to the front end surface 109a and intersects the axis of the current supply needle pin 107a is formed at the base end portion of the current supply needle pin 107a. Thereby, since the top part of the front end surface 109a which contacts the land 21 is curved, it is suppressed that the land 21 is damaged by contacting with the top part of the front end surface 109a.

  In this case, the inclination angle A, which is the narrow angle of the intersection angle between the distal end surface 109a and the axis, and the inclination angle B, which is the narrow angle of the intersection angle between the proximal end surface 110a and the axis, exceed 90 degrees and are 90 degrees. However, it is desirable that the angle be 45 degrees or more and 60 degrees or less.

  Further, a coating layer 111a covered with an insulating material such as Teflon (registered trademark) is formed on the surface of the current supply needle pin 107a at a predetermined position. The current supply needle pin 107a is preferably made of an elastic material such as tungsten steel, beryllium steel, SKH (JIS G4403), or SK (JIS G4401). As a result, when the current supply needle pin 107a is brought into contact with the land 21 and a load is applied in the axial direction of the current supply needle pin 107a, the current supply needle pin 107a is elastically brought into contact with the land 21, The current supply needle pin 107a and the land 21 are in better contact with each other.

  Further, it is desirable that the distal end portion of the current supply needle pin 107a in contact with the land 21 and the proximal end portion of the current supply needle pin 107a in contact with the electrode 113a are surface-treated with gold, nickel or the like. Thereby, the contact state between the current supply needle pin 107a, the land 21 and the electrode 113a is improved.

  The voltage measuring needle pin 107b has the same structure as the current supply needle pin 107a, and includes a distal end surface 109b, a proximal end surface 110b, and a coating layer 111b.

  The current supply needle pin 107a and the voltage measurement needle pin 107b are not limited to a cylindrical shape, and may have a columnar shape such as an ellipse or a polygon. Further, the distal end surfaces 109a and 109b and the proximal end surfaces 110a and 110b are not limited to an ellipse, and may be a shape such as a circle or a polygon.

  FIG. 7 is a side view for explaining the structure of the needle pin pair 44 in detail. 8 is a cross-sectional view showing an XX cross section of the needle pin pair 44 shown in FIG. The current supply needle pin 107a and the voltage measurement needle pin 107b shown in FIG. 7 are bundled by the holding member 108 so that the top of the front end surface 109a and the top of the front end surface 109b are adjacent to each other, and the base end surfaces 110a and 110b are It is made to face each other.

  Further, since the coating layers 111a and 111b are respectively formed on the surfaces of the current supply needle pin 107a and the voltage measurement needle pin 107b, the top of the tip surface 109a and the top of the tip surface 109b are The coating layer 111a and the coating layer 111b are separated from each other by a very small distance C. In this case, for example, when the thickness of the coating layer 111a and the thickness of the coating layer 111b are each 0.015 mm, the minute interval C is 0.03 mm.

  As a result, the current supply needle pin 107a and the voltage measurement needle pin 107b are integrated together with the top of the tip surface 109a contacting the land 21 and the top of the tip surface 109b spaced apart by a small distance C. 21, it becomes easy to bring the top of the tip surface 109a and the top of the tip surface 109b into contact with the miniaturized land 21 having a diameter of, for example, 100 μm.

  Note that only one of the coating layer 111a and the coating layer 111b may be formed.

  Moreover, the broken line part of FIG. 8 has shown the insertion holes 104,105,106. As shown in FIG. 8, since the insertion hole 106 is made larger than the outer periphery of the holding member 108, the needle pin pair 44 can be inserted from the guide plate 103 side of the head portion 45. Moreover, since the inner dimension of the short method of the insertion holes 104 and 105 is made smaller than the diameter of the holding member 108, the needle pin pair 44 is prevented from falling off the head portion 45.

  FIG. 9 is a partial cross-sectional view for explaining an example of a schematic configuration of the head unit 45. In the needle pin pair 44 shown in FIG. 9, the current supply needle pin 107a side is arranged in front. The head portion 45 shown in FIG. 9 includes plate-like plates 114, 115, 116, 117 having guide holes 101 through which the needle pin pairs 44 are inserted, and guide plates 101, 102, 103. The plates 114, 115, 116 are integrally laminated in the order of the plates 114, 115, 116 from the distal end direction of the needle pin pair 44, and the guide plate 103 is laminated next to the plate 116. The plates 114, 115, 116 and the guide plate 103 are integrally fixed by a fixing member 118. Further, the guide plate 103, the plate 117, and the guide plate 102 are stacked in this order from the base end direction of the needle pin pair 44, and are fixed integrally by a fixing member 119.

  As the guide plate 103 and the plates 114 and 117, for example, a resin material having a thickness of about 1.5 mm may be used. Further, as the plates 115 and 116, for example, a resin material having a thickness of about 0.8 mm may be used. Further, as the guide plates 101 and 102, for example, SUS (JIS G4303 or the like) stainless steel having a thickness of about 0.1 mm or the like formed with the insertion holes 104 and 105 using photolithography may be used.

  As a result, the plates 114, 115, 116, and 117 maintain the strength of the head portion 45 and the guide plates 101, 102, and 103. Further, the tip portion of the needle pin pair 44 inserted through the insertion holes of the plates 114, 115, 116, 117 and the guide plates 101, 102, 103 is only 0.5 mm from the surface of the plate 114. The top of the tip portion can be brought into contact with a land 21 (inspection point) that protrudes and is formed on the substrate 2.

  Further, since the current supply needle pin 107 a and the voltage measurement needle pin 107 b are bundled by the holding member 108, the current supply needle pin 107 a and the voltage measurement needle pin 107 b bend up and down the holding member 108. And the elastic contact when contacting the land 21 is maintained. Further, due to the bending between the holding member 108 and the distal end portions of the current supply needle pin 107a and the voltage measuring needle pin 107b, either the distal end portion or the proximal end portion of these needle pins is worn and shortened. Even if it is a time, it is suppressed that it is not elastically contacted when contacting the land 21.

  Returning to FIG. 5, the base portion 46 includes a plate-like base plate 112 made of an insulating material such as glass epoxy, bake, or other resin material, and substantially cylindrical electrodes 113 a and 113 b embedded through the base plate 112. With. The electrode 113a is connected to the scanner 74 via the cable 124a and the multipolar connector 41C, and the electrode 113b is connected to the scanner 74 via the cable 124b and the multipolar connector 41C.

  FIG. 10 is a diagram illustrating an example of the structure of the base portion 46. The base portion 46 shown in FIG. 10 is configured by stacking and integrating a base plate 112 and plate-like plates 120, 121, and 122. For example, the base plate 112 and the plate 120 are made of a resin material, the plate 121 is made of glass epoxy, and the plate 122 is made of black bake. Then, an electrode 113 made of, for example, an enamel wire is inserted through an insertion hole penetrating the base plate 112 and the plate-like plates 120, 121, 122, and the electrode 113 is fixed by an ultraviolet curing agent 123. The surface of the base plate 112 that faces the head portion 45 is polished and flattened.

  FIG. 11 is a cross-sectional view for explaining the structure of the joint portion between the head portion 45 and the base portion 46. When the guide plate 103 of the head portion 45 and the base plate 112 of the base portion 46 are brought into close contact with each other at the joint portion between the head portion 45 and the base portion 46, the top portion of the proximal end portion of the current supply needle pin 107a becomes the electrode 113a. The top of the proximal end portion of the voltage measuring needle pin 107b comes into contact with the electrode 113b. As a result, the scanner 74 can input / output a resistance measurement signal to / from the needle pin pair 44 via the cables 124 a and 124 b and the head portion 45.

  In this case, since the base end faces 110a and 110b are arranged so as to face each other, the distance between the top of the base end face 110a and the top of the base end face 110b is such that the current supplying needle pin 107a and the voltage measuring needle pin It becomes longer than the distance between the axis lines with 107b. Accordingly, the distance between the electrode 113a and the electrode 113b can be increased, or the diameters of the electrode 113a and the electrode 113b can be increased. It becomes easy to bring the needle pin 107a and the voltage measuring needle pin 107b into contact with each other.

  Next, returning to FIG. 3, the electrical configuration of the substrate inspection apparatus configured as described above will be described. The board inspection apparatus includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a motor driver, and the like, and a control unit 71 that controls the entire apparatus according to a program stored in the ROM in advance. A tester controller 73, a scanner 74, and an operation panel 75 for receiving instructions from the operator and displaying the inspection result of the wiring pattern.

  The tester controller 73 receives the inspection start command from the control unit 71, and in accordance with a program stored in advance, the wiring pattern to be inspected from among the plurality of needle pin pairs 44 that are in contact with the land of the wiring pattern on the substrate 2 The two needle pin pairs 44 respectively contacting the two lands located at both ends of the two are sequentially selected. Then, the tester controller 73 transmits a scan command to the scanner 74 so as to perform an inspection between the two selected needle pin pairs 44.

  FIG. 12 is a conceptual diagram for explaining an example of the configuration of the scanner 74. The scanner 74 shown in FIG. 12 includes a current generation unit 125 that is a constant current source that outputs a predetermined level of measurement current, a voltage measurement unit 126 that measures a voltage at a predetermined level of measurement current, and the probe 42. Between two needle pin pairs 44 selected from the plurality of needle pin pairs 44, a changeover switch 128 including a switch array or the like for connecting the current generating unit 125 and the voltage measuring unit 126 is provided.

  The inspection processing unit 127 sends a control signal to the changeover switch 128 to connect the current generation unit 125 and the voltage measurement unit 126 between the two needle pin pairs 44 to be inspected in response to the scan command from the tester controller 73. Output. The inspection processing unit 127 compares the voltage value measured by the voltage measuring unit 126 with a predetermined reference voltage to determine whether the wiring pattern to be inspected is good or bad, and uses the determination result as a tester controller. 73.

  Next, the operation of the substrate inspection apparatus configured as described above will be described. First, the control unit 71 drives and controls the transport table drive mechanism 6 and the inspection jig drive mechanism 43 to bring the probe 42 into contact with the circuit pattern formed on the substrate 2 on the transport table 5. As a result, the plurality of needle pin pairs 44 included in the probe 42 are integrally brought into contact with the land of the wiring pattern of the substrate 2.

  Next, when the contact of the needle pin pair 44 with the wiring pattern is completed as described above, an inspection start command is transmitted from the control unit 71 to the tester controller 73. Then, the tester controller 73 selects the wiring pattern 23 as an inspection target, for example. Then, the port P1 of the changeover switch 128 to which the needle pin pair 44 that contacts the land 21 at one end position of the wiring pattern 23 is connected and the needle pin pair 44 that contacts the land 22 at the other end position of the wiring pattern 23 connects. A scan command for performing inspection by designating the port P 2 of the changeover switch 128 is transmitted from the tester controller 73 to the scanner 74.

  Next, a control signal is output from the scanner 74 to the changeover switch 128 in order to connect the current generation unit 125 and the voltage measurement unit 126 between the port P1 and the port P2 in response to a scan command from the tester controller 73. The current generation unit 125 and the voltage measurement unit 126 are connected between the port P1 and the port P2 by the changeover switch 128.

  Next, a current I for measurement is output by the current generator 125, and the multipolar connector 41C, the cable 124a, the electrode 113a, and the needle pin 107a for current supply are connected from the port P1 of the changeover switch 128 with reference to FIG. A current I is supplied to the land 21 through the via. Further, referring to FIG. 12, current I flows from land 21 to wiring pattern 23 and land 22, and referring to FIG. 5, current supply needle pin 107a, electrode 113a, cable 124a, A current loop reaching the current generator 125 via the pole connector 41C and the port P2 of the changeover switch 128 of FIG. 12 is formed. Thereby, for example, when the resistance value of the wiring pattern 23 is R, the voltage V generated between the land 21 and the land 22 is V = R × I.

  Next, with reference to FIG. 5, the potential of the land 21 is passed through the voltage measuring needle pin 107b, the electrode 113b, the cable 124b, the multipolar connector 41C, and the port P1 of the changeover switch 128 of FIG. To the voltage measuring unit 126. Further, the potential of the land 22 is set via the voltage measuring needle pin 107b, the electrode 113b, the cable 124b, the multipolar connector 41C, and the port P2 of the changeover switch 128 of FIG. It is guided to the voltage measuring unit 126. Then, the voltage measurement unit 126 measures the voltage V between the land 21 and the land 22.

  Next, as a result of comparing the voltage V measured by the voltage measuring unit 126 with a predetermined reference voltage by the inspection processing unit 127, when the voltage V exceeds the reference voltage, the conductive state of the wiring pattern 23 is defective. On the other hand, when the voltage V is equal to or lower than the reference voltage, it is determined that the conduction of the wiring pattern 23 is good. Then, the inspection processing unit 127 transmits a signal indicating the determination result to the tester controller 73.

  Thereby, the conduction | electrical_connection state of the wiring pattern 23 is test | inspected using 4 terminal methods. Note that the inspection processing unit 127 calculates the resistance value R of the wiring pattern 23 from the voltage V measured by the voltage measuring unit 126 by executing an arithmetic process of R = V / I, and the resistance value R and a predetermined value The configuration may be such that the quality of the conductive state of the wiring pattern 23 is determined by comparing with a reference resistance value.

  Next, when the tester controller 73 receives a signal indicating that the continuity of the wiring pattern 23 is good, a scan command is transmitted from the tester controller 73 to the scanner 74 to inspect a new wiring pattern. The On the other hand, when the tester controller 73 receives a signal indicating that the continuity of the wiring pattern 23 is defective, the tester controller 73 transmits a signal indicating that the substrate 2 to be inspected is defective to the control unit 71. The control unit 71 displays on the operation panel 75 that the substrate 2 is defective.

  Thereby, it is possible to inspect the circuit pattern of the circuit board that is miniaturized and has a small land as an inspection point by a four-terminal method or the like.

  In addition, although the example of the board | substrate inspection apparatus of the structure with which the several needle pin pair 44 with which the probe 42 is provided is made to contact the land of the wiring pattern of the board | substrate 2 was shown, the board | substrate inspection apparatus is using the needle pin pair 44. A configuration may be adopted in which two probes 42 are provided, and the two probes 42 are moved to a wiring pattern on the board as programmed in advance and inspected. Further, the probe 42 may be configured not to include the guide plates 101, 102, and 103. Further, the base end portions 110a and 110b may not be formed at the base end portion of the needle pin pair 44.

  The above-described substrate inspection probe is a substrate inspection probe including a current supply needle pin and a voltage measurement needle pin for contacting an inspection point on a wiring pattern provided on the substrate, and the current supply needle A holding member that integrally holds the pin and the voltage measuring needle pin, and the current supply needle pin and the voltage measuring needle pin are inclined with respect to the axis of each needle pin at a tip portion that contacts the inspection point. Crossing front end surfaces are respectively formed, and the holding member holds the current supply needle pin and the voltage measurement needle pin in parallel with a minute interval, and the current supply needle pin and the voltage measurement needle. The top of the tip portion with the pin is held adjacent to each other.

  According to this, a needle pin for current supply and a voltage measurement each having a tip surface inclined and intersecting with the axis of each needle pin at a tip portion for contacting an inspection point on a wiring pattern provided on the substrate The needle pin for holding is integrally held by the holding member in parallel with a minute interval. The tops of the tip surfaces of the current supply needle pin and the voltage measurement needle pin are oriented adjacent to each other. Thereby, it becomes possible to make the space | interval of the top part of the front end surface of the needle pin for current supply and the needle pin for voltage measurement which are in contact with a test | inspection point minute. Since the distance between the tops of the tip surfaces of the current supply needle pin and the voltage measurement needle pin that are in contact with the inspection point can be made minute, the two terminals of the current supply needle pin and the voltage measurement needle pin can be made fine. It is possible to facilitate contact with various inspection points.

  In the above-described substrate inspection probe, the current supply needle pin and the voltage measurement needle pin may further have a base end surface inclined and intersecting with the axis in the direction opposite to the front end surface. It is characterized in that it is formed at the base end portion on the opposite side. According to this, in the needle pin for current supply and the needle pin for voltage measurement, the base end surface that is inclined and intersects with the axis line in the direction opposite to the front end surface is at the base end portion opposite to the front end portion, respectively. It is formed. As a result, the top of the base end face is provided on the extension line of the line connecting the axis lines of the current supply needle pin and the voltage measurement needle pin so as to be spaced outward from the axis line. Further, the top of the base end face is provided on the extension line of the line connecting the axis of the current supply needle pin and the voltage measurement needle pin so as to be spaced outside the axis, so that the current supply needle pin and voltage The distance for separating the electrode for inputting / outputting a signal from / to the measuring needle pin can be increased, and the top of the base end face can be easily brought into contact with the electrode.

  In the substrate inspection probe described above, at least one of the current supply needle pin and the voltage measurement needle pin has a surface at a predetermined position covered with an insulating material. According to this, since the surface of at least one predetermined position of the current supply needle pin and the voltage measurement needle pin is covered with the insulating material, the current supply needle pin and the voltage measurement needle pin are made of the insulating material. It is held with a small interval depending on the thickness. Since the current supply needle pin and the voltage measurement needle pin are held with a minute interval depending on the thickness of the insulating material, the interval between the current supply needle pin and the voltage measurement needle pin is made minute. Easy to do.

  The substrate inspection probe may further include a restraining member having an insertion hole through which the current supply needle pin and the voltage measurement needle pin are inserted, and the insertion hole is inserted into the current supply needle. The pin and the voltage measuring needle pin are characterized by being constrained in the rotational direction. According to this, the current supply needle pin and the voltage measurement needle pin inserted through the insertion hole are restrained in the rotation direction. Since the current supply needle pin and the voltage measurement needle pin are prevented from rotating, the current supply needle pin and the voltage measurement needle pin can be prevented from being twisted or coming out of contact with the electrode.

  Further, in the substrate inspection apparatus using the above-described substrate inspection probe, the first probe and the second probe, which are any of the above-described substrate inspection probes, correspond to the two inspection points of the wiring pattern, respectively. A current generation unit configured to pass a measurement current between the current supply needle pins provided in the first probe and the second probe which are in contact with each other; and the first probe and the second at the predetermined level of the measurement current The voltage measuring unit for measuring the voltage between the voltage measuring needle pins provided in each of the probes, and the conduction state between the two inspection points using the current value of the predetermined level and the voltage value measured by the voltage measuring unit And an inspection processing unit for determining whether the product is good or bad. According to this, the first probe and the second probe made of any of the above-described substrate inspection probes are brought into contact with the two inspection points of the wiring pattern, respectively, and the current supply needle of the first probe A measurement current of a predetermined level is caused to flow between the pin and the current supply needle pin of the second probe, and a voltage generated between the voltage measurement needle pin of the first probe and the voltage measurement needle pin of the second probe. Is measured, and the quality of the conduction state between the two inspection points is determined using the current value at a predetermined level and the voltage value measured by the voltage measuring unit. And since the quality of the electrical connection state between two inspection points can be determined using the board inspection probe described in any of the above, the circuit board wiring pattern miniaturized using this board inspection probe Can be easily inspected by the four-terminal method or the like.

It is a sectional side view which shows an example of the board | substrate inspection apparatus which concerns on one Embodiment of this invention. It is a top view of the board | substrate inspection apparatus shown in FIG. It is a schematic diagram which shows schematic structure which mounted | wore the test | inspection jig | tool with respect to the board | substrate inspection apparatus shown in FIG. It is a perspective view which shows the upper test | inspection unit and lower test | inspection unit of the board | substrate test | inspection apparatus shown in FIG. It is a fragmentary perspective view for demonstrating the structure of the probe shown in FIG. It is a figure which shows the structure of the needle pin for electric current supply shown in FIG. It is a side view for demonstrating in detail the structure of the needle pin pair shown in FIG. It is sectional drawing which shows the XX cross section of the needle pin pair shown in FIG. It is a fragmentary sectional view for demonstrating an example of schematic structure of the head part shown in FIG. It is a figure which shows an example of the structure of the base part shown in FIG. It is sectional drawing for demonstrating the structure of the junction part of the head part shown in FIG. 5, and a base part. FIG. 4 is a conceptual diagram for explaining an example of the configuration of the scanner shown in FIG. 3.

Explanation of symbols

21 and 22 Land 23 Wiring pattern 42 Probe 44 Needle pin pair 45 Head portion 46 Base portion 71 Control portion 73 Tester controller 74 Scanner 75
103 Guide plate 104, 105, 106 Insertion hole 107a Current supply needle pin 107b Voltage measurement needle pin 108 Holding member 109a, 109b Front end surface 110a, 110b Base end surface 111a, 11b Coating layer 112 Base plate 113, 113a, 113b Electrode 114, 115, 116, 117 Plate 125 Current generator 126 Voltage measurement unit 127 Inspection processing unit

Claims (2)

A base part having a needle pin in conductive contact with an inspection point of a substrate whose tip part is an inspection object, an electrode part in conductive contact with a base end part opposite to the tip part of the needle pin, the substrate and the base A substrate inspection jig provided with a head portion that is disposed between the head portion and the needle pin,
The head portion is
A first restraining member formed with a first insertion hole for guiding the tip portion of the needle pin to the inspection point;
A second restraining member formed with a second insertion hole for guiding the proximal end portion of the needle pin to the electrode portion;
The needle pin is
A linear conductor portion made of an elastic material having the distal end portion and the proximal end portion;
It consists of an insulating part that is insulated and coated on the outer periphery of the conductor part excluding the tip part and the base part,
A substrate inspection jig, wherein a boundary between the base end portion and the insulating portion is located inside the second insertion hole. While being held by the head portion of a substrate inspection jig for electrically connecting a substrate to be inspected and an inspection apparatus for inspecting the electrical characteristics of the substrate, inspection points of the substrate provided on the head portion The test substrate and the electrode part of the inspection board jig are electrically connected to each other by being inserted into the first insertion hole that guides to the electrode part and the second insertion hole that guides to the electrode part of the inspection board jig. An inspection probe connected to
A linear conductor having elasticity;
It comprises an insulating part that insulates the outer periphery of the conductor part excluding a tip part that is conductively contacted with the inspection point of the substrate and a base end part that is conductively contacted with the electrode part of the inspection board jig,
The inspection probe, wherein when held by the head portion, a boundary between the base end portion and the insulating portion is located inside the second insertion hole.

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