JP2000074990A - Method for inspecting whether semiconductor chip package is good or not, and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make correctly testable a continuity even when the distance between adjacent patterns is narrow by using a positioning insulating plate and bringing one probe pin into touch with a pattern element via a corresponding guide hole. SOLUTION: The apparatus for inspecting whether a semiconductor chip package 1 is good or not has a rotary table 11 movable in the longitudinal, lateral and up-down directions where a package 1 is stationed, a positioning insulating plate 15 used for covering a predetermined position of the package 1, and a pair of probe pins 21, 21 movable in the longitudinal, lateral and up- down directions to the package 1. After the insulating plate 15 is mechanically fixed in position, the rotary table 11 is moved and rotated to make a pad part of the package 1 butt with a specific area of the insulating plate 15. Each guide hole formed at the specific area individually correctly faces each pattern element constituting the pad part. One of the probe pins 21 is brought in touch with the pattern element through the guide hole to carry out a predetermined test.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip package in which probe pins can be reliably mounted on a predetermined pattern piece even if the arrangement density of the pad section having a large number of pattern pieces increases and the arrangement density increases. The present invention relates to a method and an apparatus for inspecting the quality of a package for a semiconductor chip, wherein the quality of the package can be correctly inspected by contacting the package.

[0002]

2. Description of the Related Art Semiconductor chips such as integrated circuits (ICs)
Since the miniaturization and the high integration are progressing, the wiring is processed into a semiconductor chip package after performing a required wiring process, so that the semiconductor chip can be handled by a human.

In addition, as the miniaturization and high integration of such semiconductor chips progress, the external shape of the semiconductor chip package itself has to be inevitably miniaturized.

FIG. 6 is a schematic explanatory view showing an arrangement relationship between a semiconductor chip package and a pair of probe pins used for inspecting the quality of the package.

In this case, the semiconductor chip package 1
Is a mounting unit 2 on which a semiconductor chip (not shown) is to be mounted.
And a mounting portion 2 for soldering an open end of a wire drawn from the side of the semiconductor chip mounted on the mounting portion 2.
And a printed circuit board (not shown) at a peripheral position separated from the pad portion 3 by a plurality of pattern pieces 4 arranged in a matrix in parallel with each other so as to be in non-contact with each other. ) Side and multiple contacts 6 soldered separately
And a board soldering portion 5 made of

A pair of probe pins 7, 8, which are disposed so as to be movable in the vertical and horizontal directions and the vertical direction with respect to the fixed semiconductor chip package 1, have one probe pin 7 connected to one pattern piece 4. And the other probe pin 8 is brought into contact with one contact 6 that should be in a conductive relationship with the pattern piece 4, and such a continuity test is repeatedly performed on a necessary portion, so that the quality of the semiconductor chip package 1 is determined. It can be inspected.

[0007]

However, in the present situation where the external shape of the semiconductor chip package 1 itself is also miniaturized in response to miniaturization and high integration of the semiconductor chip, the individual The pattern piece 4 is also inevitably miniaturized, and in such a situation, there is a problem that it is gradually difficult to accurately contact one probe pin 7 with a predetermined pattern piece 4.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems encountered in the prior art, and it is an object of the present invention to accurately inspect the quality of a package by reliably contacting probe pins individually with pattern pieces having a high array density. It is an object of the present invention to provide a method and an apparatus for inspecting the quality of a package which can be performed.

[0009]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and the structural features of the method according to the present invention include a mounting portion on which a semiconductor chip is mounted, and a mounting portion. A pad portion composed of a large number of pattern pieces arranged in a matrix in parallel toward the mounting portion side for soldering an open end of a wire drawn from the side of the semiconductor chip mounted on the pad portion; Is placed horizontally on a semiconductor chip package provided with a printed circuit board side and a board soldering part to be individually soldered at a separated peripheral position, and the vertical and horizontal directions and the vertical direction with respect to the surface of the package. Of the pair of probe pins separately arranged so as to be freely moved to one, one probe pin is on one pattern piece and the other probe pin is a board soldering portion to be electrically connected to the pattern piece. In the method for inspecting the quality of a package for a semiconductor chip, which is simultaneously brought into contact with one contact, the pad portion of the package for a semiconductor chip is provided with guides each facing a large number of the pattern pieces constituting the pad portion. A positioning insulating plate formed by drilling holes is positioned by moving each guide hole relatively to each other so as to directly face the corresponding pattern pieces, and is covered. Is to contact one pattern piece through one corresponding guide hole.

The structural features of the device of the present invention include: a rotary table arranged to be movable vertically and horizontally and vertically with respect to a horizontal plane; a mounting portion on which a semiconductor chip is mounted; A pad portion composed of a large number of pattern pieces arranged in a matrix parallel to the mounting portion side for soldering an open end of a wire drawn from the side of the semiconductor chip mounted on the portion; A package for a semiconductor chip which is fixed on the turntable with a printed circuit board side and a board soldering portion to be individually soldered at a peripheral position separated from the package, and a large number of the pattern pieces; A positioning insulating plate having guide holes facing each other so as to freely cover the pad portion, and a vertical and horizontal direction and a vertical direction with respect to the fixed semiconductor chip package. A pair of probe pins disposed separately in the freely moving in that it is at least provided.

The probe pin according to the present invention is provided with a sharpened portion on the tip side of a flexible pin body having an appropriate length, and each guide hole of the insulating plate has an inner portion substantially matching the sharpened portion. A taper having a peripheral surface shape can be suitably used.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic explanatory view showing an example of the apparatus according to the present invention. The whole of the apparatus is a rotary table 11 capable of moving vertically and horizontally and vertically with respect to a horizontal plane, and a rotary table 11 on the rotary table 11. Semiconductor package 1 to be fixed
A positioning insulating plate 15 used to cover a predetermined position of the semiconductor chip package 1, and a positioning insulating plate 15 which can be freely moved vertically and horizontally and vertically with respect to the fixed semiconductor chip package 1. It is provided with at least a pair of probe pins 21 and 21 provided with a sharpened portion 23 on the distal end side of a pin main body 22 having an appropriate length and having flexibility.

Among them, a rotary table 11 provided in the apparatus main body has a table section 12 on which a semiconductor chip package 1 is fixedly fixed by an appropriate jig, and the table section 12 is vertically and horizontally and vertically. It is formed by a rotation support shaft portion 13 that freely supports the movement.

As shown in FIG. 2 (the basic configuration is the same as in FIG. 6), the semiconductor chip package 1 includes a mounting portion 2 on which a semiconductor chip (not shown) is mounted, and a mounting portion 2. It consists of a number of pattern pieces 4 arranged in a matrix in parallel with each other so as to be in non-contact with the periphery of the mounting portion 2 for soldering the open end of the wire drawn out from the side of the semiconductor chip mounted on the semiconductor chip. A pad portion 3 and a board soldering portion 5 including a large number of contacts 6 that are individually soldered to a side of a printed circuit board (not shown) at a peripheral position separated from the pad portion 3. It is formed.
The individual pattern pieces 4 and the contacts 6 in a corresponding relationship are provided in a mutually conductive relationship.

Further, the insulating plate 15 is provided with a guide hole 16 that is accurately positioned and drilled so as to face each of the individual pattern pieces 4 so that each individual semiconductor chip to be inspected can be inspected. It is prepared to be used corresponding to the type of the application package 1. Therefore, the insulating plate 15 having the guide holes 16 determined by the arrangement of the pattern pieces 4 in the pad portion 3 of the specific semiconductor chip package 1 to be inspected is selected and used each time. Will be.

This will be described in more detail with reference to FIGS. 2 and 3. The insulating plate 15 made of a relatively hard insulating material such as a ceramic material or a synthetic resin material is shown in FIG. As shown, a probe pin 2 is placed in a specific region 16 that is in contact with the pad portion 3 of the semiconductor chip package 1.
The tapered shape of the inner peripheral surface 17a substantially matching the sharpened portion 23 of FIG.
It has a large number of guide holes 17 formed so as to have the cross-sectional shape shown in FIG.

FIG. 4 is an explanatory view exemplifying the arrangement relationship between the pattern pieces 4 and the guide holes 17 in this case. For example, a total of 15 pattern pieces 4 are provided on the side of the mounting portion 2 with an appropriate interval therebetween. Assuming that the guide plates 17 are arranged in a matrix parallel to each other, the insulating plate 15 has a total of 15 guide holes 17 obliquely arranged so as to be individually positioned on the upper surfaces of the pattern pieces 4, respectively. It is formed so as to cover the entire upper surface under the positional relationship.

Specifically, after the insulating plate 15 shown in FIG. 1 is mechanically fixed by supporting it on the side of the apparatus main body, the semiconductor chip package 1 fixed on the table 12 is moved to the insulating plate 15. The rotary table 11 is moved up and down so as to be able to abut while ensuring a predetermined correct positional relationship with respect to
Further, by controlling the position by rotating the rotating shaft 13, the position of each guide 17 hole can be fixed while individually facing the corresponding pattern piece 4 individually. If the pattern piece 4 and the guide hole 17 can be directly opposed, the semiconductor chip package 1 side is fixed and the insulating plate 15 is moved, or the semiconductor chip package 1 and the insulating plate 15 are moved. 15 may be adopted.

On the other hand, a pair of probe pins 21 and 21
The pair of movable arms 25, 25, which are arranged so as to be able to move independently in the vertical and horizontal directions, are individually mounted so as to be able to move up and down freely.

In addition, in this case, each probe pin 21 is preferably formed of a needle-shaped conductive metal material having a smaller diameter than the maximum diameter of the guide hole 17 and having an appropriate length which is flexible. be able to.

Next, the inspection method according to the present invention will be described together with its operation, taking the apparatus shown in FIG. 1 as an example.

First, an insulating plate 15 for positioning is mechanically fixed to an apparatus main body (not shown) so that the surface thereof is horizontal, and then the rotary table 11 is raised while moving vertically and horizontally. Further, by rotating the rotation shaft 13 to control the position, the pad portion 3 of the semiconductor chip package 1 on the table portion 12 and the specific region 16 of the insulating plate 15 are brought into contact with each other while ensuring a face-to-face match. Let it.

By bringing the semiconductor chip package 1 and the insulating plate 15 into contact with each other in this manner, the insulating plate 15 is configured such that each of the guide holes 17 formed in the specific region 16 forms the pad portion 3. Thus, the entire pad portion 3 of the semiconductor chip package 1 is covered under the positional relationship individually facing each of the pattern pieces 4.

Thereafter, a pair of probe pins 21 and 21
One of the probe pins 21 is brought into contact with one of the pattern pieces 4 through the corresponding one of the guide holes 17, and the other probe pin 21 is connected to the board soldering portion to be electrically connected to the pattern piece 4. The inspection is carried out by simultaneously contacting each one of the contacts 6 of each of the devices 5 and conducting a continuity test between them.

By conducting such a continuity test using a pair of probe pins 21 and 21 individually and sequentially on all of the required pattern pieces 4 and contacts 6, the semiconductor chip package 1 is manufactured. The quality can be inspected.

In this case, one of the probe pins 2
1 has a sharpened portion 23 on the tip end side of a pin body 22 formed of a needle-shaped conductive metal material having a smaller diameter than the maximum diameter of the guide hole 17 and having an appropriate length which is flexible. If each of the 15 guide holes 15 is formed with a taper having an inner peripheral surface 17a shape substantially matching the sharp portion 23, and each is formed, as shown in FIG. The portion 23 is slightly displaced and the guide hole 17
5 may be automatically corrected while being guided by its inner peripheral surface 17a.
As shown in (b), a predetermined pattern piece 4 can be accurately contacted.

Therefore, even if the interval between the adjacent pattern pieces 4 and 4 becomes narrow, the probe pin 21 can always contact the predetermined pattern piece 4 accurately via the insulating plate 15.

[0028]

As described above, according to the present invention, in the pad portion of the semiconductor chip package, a guide hole facing each of a number of pattern pieces constituting the pad portion is formed. After positioning and insulating the positioning insulating plate so that each guide hole is individually positioned so as to directly face the corresponding pattern piece, and covered, and one probe pin is passed through the corresponding one guide hole. Since it can be brought into contact with one pattern piece, even if the interval between adjacent pattern pieces becomes narrower, it is possible to conduct a continuity test by making accurate contact with a predetermined pattern piece via the insulating plate. it can.

In particular, one of the probe pins has a sharpened portion on the tip side of a flexible pin main body having a diameter smaller than the maximum diameter of the guide hole, and each guide hole of the insulating plate substantially matches the sharpened portion. When each is formed with a taper exhibiting an inner peripheral surface shape, even if the interval between adjacent pattern pieces is narrower, the sharpened portion is bent while bending the probe pin. By automatically correcting the contact position by being guided on the peripheral surface, it is possible to always accurately contact a predetermined pattern piece.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view showing an example of the device of the present invention.

FIG. 2 schematically shows a package for a semiconductor chip to be inspected in the present invention.
(A) is a plan view, (B) is an enlarged view of a portion A in (A), and (C) is an enlarged view of a B portion.

FIGS. 3A and 3B schematically show an insulating plate used in the present invention, wherein FIG. 3A is a plan view, FIG. 3B is a plan view of a guide hole obtained by enlarging a portion C in FIG. (C) shows the cross-sectional shape of the guide hole corresponding to (b).

FIG. 4 is an explanatory diagram showing a mutual arrangement relationship between a guide hole provided in an insulating plate and a pattern piece in a pad portion of a semiconductor chip package in the present invention.

FIGS. 5A and 5B are explanatory diagrams showing a mutual relationship between a guide hole provided in an insulating plate and a probe pin in the present invention, as FIGS.

FIG. 6 is an overall perspective view showing an outline of a semiconductor chip package inspected by the method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package for semiconductor chips 2 Mounting part 3 Pad part 4 Pattern piece 5 Solder part for boards 6 Contact 11 Rotary table 12 Table part 13 Rotation support shaft part 15 Insulation plate 16 Specific area 17 Guide hole 17a Inner peripheral surface 21 Probe pin 22 Pin body part 23 Sharp part 25 Movable arm part

Claims (4)

[Claims] 1. A mounting portion on which a semiconductor chip is mounted, and an open end of a wire drawn from a side of the semiconductor chip mounted on the mounting portion are parallel to the mounting portion for soldering. A semiconductor chip having a pad portion composed of a large number of pattern pieces arranged in a matrix and a board soldering portion that is individually soldered to a printed board side at a peripheral position separated from the pad portion Place the package horizontally, and freely move vertically and horizontally and up and down with respect to the surface of the package.
In the method for inspecting the quality of a package for a semiconductor chip, the other probe pin simultaneously and separately contacts one contact of a soldering portion for a substrate to be electrically connected to the pattern piece, the pad portion of the package for a semiconductor chip includes the pad The positioning insulating plate formed by piercing the guide holes facing each other with a large number of the pattern pieces constituting the part, so that each guide hole individually faces the corresponding pattern piece individually. The semiconductor chip package is characterized in that it is moved relative to each other, positioned and covered, and one probe pin is brought into contact with one pattern piece through a corresponding one guide hole. Pass / fail inspection method. 2. The probe pin according to claim 1, wherein said probe pin has a sharpened portion at a tip end of a flexible pin body having an appropriate length, and each guide hole of said insulating plate has an inner periphery substantially matching said sharpened portion. 2. The method according to claim 1, wherein a taper having a surface shape is provided. 3. A rotary table arranged to be movable vertically and horizontally and vertically with respect to a horizontal plane, a mounting portion on which a semiconductor chip is mounted, and a side of the semiconductor chip mounted on the mounting portion. A pad portion composed of a large number of pattern pieces arranged in a matrix parallel to the mounting portion side for soldering an open end of a wire drawn out from the pad portion, and printing at a peripheral position separated from the pad portion A semiconductor chip package fixed on the turntable with a substrate side and a board soldering portion to be individually soldered, and a plurality of the pattern pieces and guide holes individually facing each other. An insulating plate for positioning, which is freely positioned and fixed to cover the pad portion, and one separately provided so as to be freely movable in the vertical and horizontal directions and the vertical direction with respect to the fixed semiconductor chip package. Quality inspection device package semiconductor chips, characterized in that is at least and a probe pin. 4. The probe pin has a sharpened portion on the distal end side of a flexible pin body of an appropriate length, and each guide hole of the insulating plate has an inner periphery substantially matching the sharpened portion. 4. The semiconductor chip package quality inspection apparatus according to claim 3, wherein a taper having a surface shape is provided.