JP2011163850A - Probe card, apparatus for measuring electric characteristics of electronic device, and method for measuring electric characteristics of electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card which can measure electric characteristics of each electronic device even if the layout of conduction terminals of a plurality of electronic devices and to provide an electric characteristics measuring apparatus and an electric characteristics measuring method. <P>SOLUTION: A large number of probe pines 6 which can contact a large number of conduction terminals 2b of a mounting body 1 to which a semiconductor device 2 is mounted are arranged in the probe card 4. The probe pins 6 are laid out in such a way as to being at least one probe pin in contact with each conduction terminal 2b of each mounting body 1 for measuring electric characteristics of two types of mounting bodies 1 or more having different arrangement layouts of conduction terminals 2b. The electric characteristics measuring apparatus and the electric characteristics measuring method use the probe card 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card used for measuring electric characteristics of an electronic device, an electric characteristic measuring device for an electronic device using the probe card, and an electric characteristic measuring method for the electronic device.

Generally, in order to measure the electrical characteristics of a semiconductor device mounted on a circuit board, probe pins of a probe card are brought into contact with a test pad arranged on the outer peripheral side of the circuit board.
In Patent Document 1, the input test pad 28 and the output test pad 29 connected to the terminals of the LSI 45 mounted on the TAB tape are brought into contact with the input terminal probe 53 and the output terminal probe 43 of the inspection probe, respectively. An electrical test is disclosed.

Patent Document 2 discloses that a plurality of probe pins 32 of a probe card 30 are brought into contact with a plurality of pads 22 of a semiconductor chip in order to inspect a semiconductor chip disposed on a wafer.

Japanese Patent Laying-Open No. 2006-228761 ([0038], [0039], FIG. 9 etc.) JP 2000-340620 A ([0031] to [0036], FIGS. 1 to 3)

Here, in Patent Document 1, the input terminal probe 53 and the output terminal probe 43 in the inspection probe are arranged at positions so as to be in contact with the input test pad 28 and the output test pad 29 formed in advance on the TAB tape. It is set in advance.
In Patent Document 2, a plurality of probe pins 32 of a probe card 30 are arranged corresponding to the arrangement layout of each pad 22 of a semiconductor chip arranged on a wafer.
Here, in the inspection probe of Patent Document 1, the input terminal probe 53 and the output terminal probe 43 are arranged and laid out so as to correspond to the arrangement layout of the input test pad 28 and the output test pad 29 arranged on the TAB tape. It is what. Therefore, the inspection probe needs to be prepared as a dedicated one corresponding to the semiconductor device to be inspected and the layout of the input test pad 28 and the output test pad 29.
Similarly, in Patent Document 2, the probe card 30 is prepared as a dedicated one because each probe pin 32 is arranged and laid out corresponding to the arrangement layout of the semiconductor chip and each pad 22 thereof. .
Accordingly, the dedicated inspection probe or probe card 30 takes a predetermined time to manufacture, and the electrical characteristics of many types of electronic devices cannot be measured immediately. In addition, the dedicated inspection probe and the probe card 30 are very expensive, and therefore, semiconductor mounted products and semiconductor chips are also expensive.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and is a versatile probe card capable of measuring electrical characteristics even if the electronic devices are different, an electrical property measuring device for an electronic device using the probe card, an electronic device It provides a method for measuring the electrical properties of a device.

The probe card according to the first embodiment of the present invention is a probe card in which a large number of probe pins capable of contacting a large number of conductive terminals of an electronic device are disposed, and the probe pins have different layouts of the conductive terminals 2 In order to be able to measure the electrical characteristics of the electronic devices of more than one type, the electronic devices are arranged in an arrangement layout in which at least one probe pin can contact each conductive terminal of each electronic device.

According to the configuration of the first embodiment of the present invention, it is possible to measure the electrical characteristics of two or more types of the electronic devices having different arrangement layouts of the conductive terminals using one probe card.
Therefore, it is not necessary to prepare an expensive dedicated probe card for each electronic device having a different layout of the conductive terminals, and the probe card can be shared, so that a cheap probe card can be obtained as a whole.
Also, the probe card itself can be inspected only once, and the inspection operation with the electrical property measuring device can be performed once, so that the running cost of electrical property measurement can be reduced and the reliability of electrical property measurement can be improved I can do it.
The above measurement includes inspections such as operation inspections and electrical characteristic inspections of the electronic device.
Further, the different arrangement layout of the conductive terminals means that the arrangement positions, the arrangement intervals, the number of arrangements, the sizes, etc. of the respective conduction terminals are different from each other.
Further, the electronic device may be a semiconductor device such as an IC or LSI mounted on a circuit board, or the semiconductor device itself. Another electronic device may be used instead of the semiconductor device.

As described above, at least one probe pin is provided on each conduction terminal of each electronic device so that the probe pin can measure the electrical characteristics of the two or more types of electronic devices having different layouts of the conduction terminals. Arrangement in an arrangement layout that allows contact includes at least the following various situations.
The first situation is that the probe pins are the two or more types of electronic devices, and the first number of probe pins are in contact with all the conductive terminals of one electronic device, and all the conductive terminals of the other electronic devices. Are arranged such that the second number of probe pins are in contact with each other.
In that case, the first number and the second number are different.
In the second situation, the probe pins are arranged so that the same number of probe pins are in contact with all the conductive terminals in all of the two or more types of electronic devices.
The same number of probe pins may be one or plural.
According to a third situation, the probe pins are arranged in the two or more types of electronic devices so that the number of probe pins contacting each conduction terminal is different in at least one electronic device.
The fourth situation is that, in all of the two or more types of electronic devices, the probe pin is arranged so that at least one probe pin is in contact with all the conductive terminals, but in at least one electronic device, One or more probe pins are also arranged in the conduction terminal non-arrangement region where the conduction terminals are not arranged.
Note that the fourth situation can coexist with all the situations from the first situation to the fourth situation.

A probe card according to Embodiment 2 of the present invention is the probe card according to Embodiment 1, wherein the probe card includes a probe base, and the probe pin passes through the probe base. One end protrudes from the lower surface of the probe base, and the other end of the probe pin protrudes from the upper surface of the probe base.

According to the configuration of the second embodiment of the present invention, it is ensured that one end of the probe pin contacts a large number of conduction terminals of the electronic device, and the electrical characteristic of the electronic device is measured at the other end of the probe pin. Can be easily connected to the control device.

The metal member probe card according to Embodiment 3 of the present invention is the probe card according to any one of Embodiments 1 and 2, wherein the probe pin is detachable from the probe base. It is characterized by that.

According to the configuration of the third embodiment of the present invention, in the two or more types of electronic devices having different conductive terminal arrangement layouts, the probe pins can be increased or decreased even if the conductive terminal arrangement layouts are greatly different. It becomes easy to use the shared.
In addition, when the two or more types of electronic devices, for example, semiconductor devices such as LSIs, have different planar sizes and external shapes, the probe pins in the arrangement-corresponding plane portions of the electronic devices may become an obstacle. At that time, the probe pin can be brought into contact with the conduction terminal of the electronic device by removing the probe pin at the plane corresponding to the arrangement of the electronic device.
Further, by newly inserting and arranging a probe pin on the outer edge side of the probe card, it can also be used for an electronic device in which the conduction terminal is arranged at a distance far from the center side.

In the electronic device electrical property measuring apparatus according to Embodiment 4 of the present invention, the electrical characteristics of the two or more electronic devices are measured using the probe card described in any of Embodiments 1 to 3. It is structured.

  According to the configuration of the embodiment 4 of the present invention, electrical characteristics that can easily measure electrical characteristics of two or more types of electronic devices that share one probe card and have different arrangement layouts of the conductive terminals. A measuring device can be provided.

An electronic device electrical property measurement apparatus according to Embodiment 5 of the present invention is the electrical property measurement device for an electronic device described in Embodiment 4, wherein the electrical property measurement device supports the electronic device. Arranged on the side opposite to the arrangement side of the electronic device with reference to the probe card arranged on the opposite side to the arrangement side of the electronic device support base with respect to the stand and the supported electronic device A probe pin contact plate, and a moving base that moves the probe card and the probe pin contact plate relative to the electronic device, the probe pin contact plate facing the probe card. A probe pin contact terminal is disposed on the probe card facing surface, and the probe pin contact terminal is disposed in a layout similar to the layout of the conduction terminals. In addition, the probe pin is electrically connected to a control device that transmits or receives a signal for measuring the electrical characteristics of the electronic device, and one end of the probe pin can contact the conductive terminal of the electronic device, and the other end of the probe pin It is possible to contact the probe pin contact terminal of the probe pin contact plate.

According to the configuration of the fifth embodiment of the present invention, it is possible to easily measure the electrical characteristics of two or more types of electronic devices having different arrangement layouts of the conduction terminals by sharing one probe card.

In the method for measuring electrical characteristics of an electronic device according to Embodiment 6 of the present invention, the electrical characteristics of the two or more types of electronic devices are measured using the probe card described in any of Embodiments 1 to 3. It is characterized by.

  According to the configuration of the embodiment 6 of the present invention, it is possible to easily measure the electrical characteristics of two or more types of the electronic devices having different arrangement layouts of the conduction terminals by sharing one probe card.

The mounting body used by 1st Embodiment of this invention is shown, (1) is the top view, (2) is sectional drawing in the AA position of (1). The probe card of 1st Embodiment of this invention is shown, (1) is the top view, (2) is sectional drawing in the BB-position of (1). The probe pin contact board is shown in 1st Embodiment of this invention, (1) is the principal part sectional drawing, (2) is a back view of (1). The electrical property measuring apparatus in 1st Embodiment of this invention is shown, (1) is the principal part sectional drawing, (2) is the plane arrangement | positioning figure in CC position of (1). The top view which shows the state which the probe pin of the probe card of 1st Embodiment of this invention is contacting the conduction | electrical_connection terminal of another mounting body. The electrical property measuring apparatus in 2nd Embodiment of this invention is shown, (1) is the principal part sectional drawing, (2) is the principal plane arrangement | positioning figure in the DD position of (1). The probe card in 3rd Embodiment of this invention is shown, Sectional drawing of the probe card in each form is shown to (1), (2), (3).

  Hereinafter, the present invention will be described based on specific embodiments.

[First Embodiment]
In the first embodiment of the present invention, the probe pin 6 is brought into contact with the conductive terminal 2b that is electrically connected to the electrode of the semiconductor device 3 mounted on the mounting substrate 2 having a predetermined outer shape. The probe card 4 is used to measure the electrical characteristics of the semiconductor device 3 using the probe card 4.
This electronic device electrical property measuring device 8 includes at least a mounting body 1 in which the semiconductor device 3 is mounted on a mounting substrate 2, a probe card 4, and a probe pin contact plate 7. In order to measure the electrical characteristics of the semiconductor device 3 using the electrical property measuring device 8, the electrodes of the semiconductor device 3 and the electrical power of the semiconductor device 3 are connected via the probe pins 6 and the probe pin contact plate 7 of the probe card 4. It is necessary to establish conduction with a control device that transmits and receives a signal for measuring characteristics.
Hereinafter, the mounting body 1, the probe card 4, the probe pin contact plate 7, and the electrical property measuring device 8 will be described in detail.
In the present invention, the measurement includes inspecting the operation of the semiconductor device 3 and inspecting whether the electrical characteristic value is appropriate.

  The mounting body 1 is illustrated in FIG. 1, the probe card 4 is illustrated in FIG. 2, and the probe pin contact plate 7 is illustrated in FIG. The electrical property measuring device 8 is shown in FIG.

[Mounted body]
The mounting body 1 is illustrated in FIG.
(1) of FIG. 1 is a plan view of the mounting body 1, and (2) of FIG. 1 is a cross-sectional view taken along the line AA of (1) and viewed in the direction of the arrow.
The mounting body 1 is obtained by mounting a semiconductor device 3 such as an LSI or an IC on a mounting substrate 2 such as a flexible substrate.
A large number of conductive patterns 2a are formed on the surface of the mounting substrate 2 so as to be electrically connected to the electrodes of the semiconductor device 3, and conductive terminals 2b serving as output pads formed in a wide rectangular shape at the outer ends of the conductive patterns 2a. ing. The conduction terminal 2b is for contact with a probe pin, which will be described later.
Further, the mounting board 2 has sprocket holes 2c arranged at equal intervals on the left and right ends.
The sprocket holes 2c are originally used when the mounting substrate 2 is in the form of a tape and transported in the longitudinal direction. As will be described later, the sprocket hole 2c is added to the electrical property measuring device 8 for measuring the electrical properties of the semiconductor device 3. It is also used when positioning.
The semiconductor device 3 is an electronic device in which the electrode forming surface is placed on the surface of the mounting substrate 2 and the electrodes of the semiconductor device 3 and the inner ends of the conductive patterns 2a are conductively bonded with a conductive bonding material.
A resin sealing portion is formed around the semiconductor device 3 mounted on the mounting substrate 2 so as to cover the sealing resin, but the resin sealing portion is not shown.

Note that the mounting substrate 2 may be a rigid substrate such as an epoxy resin substrate containing glass fibers, in addition to the flexible substrate.
Further, the structure for mounting the semiconductor device 3 on the mounting substrate 2 may be other than the above. For example, an opening is provided in the center of the mounting substrate 2, the semiconductor device 3 is disposed in the opening, and the inside of the opening is reached. The inner end of the extended conductive pattern 2 a may be conductively joined to the electrode of the semiconductor device 3.
After the mounting body 1 is set in an electrical property measuring device 8 to be described later and the measurement of electrical properties is finished, the electronic device as a mounting module that cuts the surroundings, for example, the sprocket and the hole 2c region and leaves all the conductive terminals 2b. It will be incorporated into the circuit board.

[Probe card]
The probe card 4 is illustrated in FIG. 2A is a plan view of the probe card 4, and FIG. 2B is a cross-sectional view taken along the BB position in FIG.
The probe card 4 includes a plate-like probe base 5 and probe pins 6.
The probe base 5 is made of an insulating material such as ceramic and has a probe pin arrangement region 5a in which a large number of probes 6 are implanted in the vicinity of the center, and a probe opened to the left and right outer ends of the probe pin arrangement region 5a. And a probe card guide hole 5b for determining a planar position of the base 5.
In addition, a semiconductor device corresponding region 5c in which the probe pin 6 is not disposed is formed on the center side of the probe pin placement region 5a.
In the semiconductor device corresponding region 5c, the probe pin 6 is not arranged so that the probe pin 6 does not hit the upper surface of the semiconductor device 3 when the electrical property measuring apparatus 8 described later measures the electrical characteristics of the semiconductor device 3. This is a region that is slightly larger than the semiconductor device 3.

The probe pin 6 is a thin linear pin, penetrates the probe base 5 from the front and back (up and down of (2) in FIG. 2), and the lower end 6a is the surface of the probe base 5 (of (2) in FIG. 2). The upper end 6b protrudes upward by a predetermined amount from the back surface (the upper surface of (2) in FIG. 2) of the probe base 5 and is fixed to the probe base 5.
The lower end 6a comes into contact with each conduction terminal 2b when the electrical characteristic measuring device 8 measures the electrical characteristics of the semiconductor device 3. The upper end 6b comes into contact with a probe pin contact terminal 7a of a probe pin contact plate 7 to be described later when the electrical characteristic measuring device 8 measures the electrical characteristics of the semiconductor device 3.
The probe pin 6 is fixed to the probe base 5 by various methods. For example, a hole is made in the probe base 5 in advance and the probe pin 6 is penetrated, and then a metal bonding material (for example, solder) is used. Or the like, or the probe pin 6 may be pushed into the probe base 5 and fixed.
The probe pin 6 uses a high-hardness metal wire (for example, steel material) subjected to conductive plating such as gold plating coating or copper plating.

Many of the probe pins 6 in the probe pin arrangement region 5a are regularly arranged in a predetermined arrangement layout.
The arrangement layout of the probe pins 6 is arranged at equal intervals in the probe pin arrangement area 5a on the left and right and front and rear. The interval between the probe pins 6 is set to be narrower than the interval between the conducting terminals 2b shown in FIG. 1, and is about ½ of the interval between the conducting terminals 2b. In that case, the probe pins 6 are positioned so as to be positioned near the center position of the conduction terminal 2b and the center position of the adjacent conduction terminal 2b as shown in FIG. Another probe pin 6 is arranged between the conduction terminal 2b and the adjacent conduction terminal 2b so as not to contact each conduction terminal 2b, 2b.
If the interval between the lobe pins 6 is set to be narrower than the interval between the conductive terminals 2b, it is not limited to about ½ of the interval between the conductive terminals 2b as described above. In consideration of this, it may be made narrower or wider. Details regarding this point will be described later.

[Probe pin contact plate]
The probe pin contact plate 7 is illustrated in FIG.
3A is a cross-sectional view of the main part of the probe pin contact plate 7, and FIG. 3B is a back view of FIG.
The probe pin contact plate 7 is the side on which the mounting body 1 (semiconductor device 3) is arranged with the probe card 4 in between (reference) when measuring the electrical properties of the semiconductor device 3 in the electrical property measuring device 8. Arranged on the opposite side. Accordingly, the back surface of the probe pin contact plate 7 is the surface facing the probe card 4, that is, the surface facing the probe card 4.
The probe pin contact plate 7 includes a plate-like probe pin contact plate 7a, a probe pin contact terminal 7b formed on the back surface of the probe pin contact plate 7a, and an external connection formed on the surface opposite to the probe pin contact plate 7a. A conducting member 7e that conducts the terminal 7d, the probe pin contact terminal 7b, and the external connection terminal 7d, and positioning probe pin contact plate guide holes 7c that are disposed on both right and left ends are provided.
The probe pin contact plate substrate 7a is made of an insulating material such as ceramic or synthetic resin.
The back surface of the probe pin contact plate 7a corresponds to the lower surface in FIG.
The probe pin contact terminals 7b on the back surface are arranged and formed as shown in (2) of FIG.

The layout (arrangement position) of the probe pin contact terminal 7b is substantially the same as that of the conduction terminal 2b of (1) in FIG. That is, the interval between the center positions of the probe pin contact terminals 7b and the arrangement relationship of the probe pin contact terminals 7b are set to be substantially the same as the interval between the center positions of the conduction terminals 2b and the arrangement relationship of the conduction terminals 2b. .
Furthermore, an external connection terminal 7d is formed on the surface of the probe pin contact plate 7 (the upper surface of (1) in FIG. 3) at the same arrangement position as the probe pin contact terminal 7b.
As described above, the probe pin contact terminal 7b formed on the back surface of the probe pin contact plate 7 and the external connection terminal 7d formed on the front surface are electrically connected to each other by the conductive member 7e. The conductive member 7e is configured by electroplating or the like in a through hole formed in advance so as to penetrate the back surface and the front surface.
The probe pin contact terminal 7b comes into contact with the upper end 6b of the probe pin 6. Each of the external connection terminals 7d is connected to a conductive wire 14, and each of the conductive wires 14 is connected to the electronic device. It becomes conductive to a control device (not shown) that transmits or receives a signal for measuring the electrical characteristics of the device.

[Structure of electrical characteristics measuring device]
The electrical property measuring device 8 is shown in FIG.
4A is a cross-sectional view of the main part of the electrical characteristic measuring device 8, and FIG. 4B is a plan view of related members when viewed in the direction of the arrow cut along the CC position in FIG. It is. In addition, in the plan layout view of the related members in (2) of FIG. 4, hidden members are also indicated by solid lines for convenience.
In FIG. 4, reference numeral 9 denotes an electronic apparatus holding base, which is fixed to the floor so as not to move.
A measured object placement surface 9a is formed on the center upper side of the electronic device holding base 9, and the mounting body 1 as a measured object is placed on the measured object placement surface 9a.
At that time, in order to determine the planar position of the mounting body 1 with respect to the electronic apparatus holding base 9, position guide pins 10 are implanted in two places on the left and right of the measurement object mounting surface 9a.

A moving base 11 made of an elastic material such as hard rubber is disposed above the electronic device holding base 9 so as to be movable in the vertical direction.
Above the movable base 11, a movable base guide base 12 whose plane position is adjusted and fixed to the electronic device holding base 9 is disposed.
A guide hole 12 a is formed near the center of the movable base guide stand 12. The guide hole 12a guides the movable base guide pipe 11a fixed to the central portion of the movable base 11 so as to be vertically movable. Moving means such as a motor is disposed above the moving base guide pipe 11a (the moving means is not shown), and the moving base guide pipe 11a is moved up and down. The lower end of the movement base guide pipe 11a is fixed to the movement base 11, and when the movement base guide pipe 11a moves up and down, the movement base 11 also moves up and down in the same manner.
A coil spring 13 is inserted between the moving base 11 and the moving base guide 12. The coil spring 13 presses the moving base 11 toward the electronic device holding base 9 side.

The mounting body 1 is placed on the workpiece placing surface 9a. At this time, the position guide pins 10 and 10 are inserted into the sprocket holes 2c and 2c, thereby positioning the mounting body 1 in the plane direction. Is done. The mounting body 1 is mounted so that the semiconductor device 3 to be mounted is on the upper side in FIG. 4A, that is, the conductive terminal 2b is on the upper side.
Further, a probe card 4 is disposed above the mounting body 1, and a probe pin contact plate 7 is disposed above the probe card 4. That is, after the mounting body 1 is placed on the measurement object placing surface 9a, the probe card guide holes 5b and 5b of the probe card 4 are inserted into the position guide pins 10 and 10, and the probe pins of the probe pin contact plate 7 are inserted. The contact plate guide holes 7c and 7c are inserted into the position guide pins 10 and 10, respectively. For this reason, the position guide pins 10 and 10 determine the planar positions of the mounting body 1, the probe card 4, and the probe pin contact plate 7 with respect to the electronic device holding base 9.

Therefore, the mounting body 1, the probe card 4, and the probe pin contact plate 7 are arranged in this order above the measurement object placement surface 9 a.
At that time, the probe pin 6 of the probe card 4 has a lower end 6a protruding downward contacting each of the conduction terminals 2b of the mounting body 1, and an upper end 6b protruding upward is the back surface of the probe pin contact plate 7. The probe pin contact terminal 7b formed on (the lower surface of (1) in FIG. 4) comes into contact. Each contact is reliably performed by pressing the moving base 11 downward by the coil spring 13 and pressing the probe card 4 and the probe pin contact plate 7 downward on each step surface of the lower end of the moving base 11. To be made. In addition, if the movement base 11 is comprised with an elastic material, said each contact will be made more reliably.
Conductive wires 14 are joined to the external connection terminals 7d arranged on the surface of the probe pin contact plate 7 (the upper surface in (1) of FIG. 4). It passes through the hollow portion of the pipe 11a and is connected to the upper control device. This control device transmits and receives signals for measuring (inspecting) the electrical characteristics of the semiconductor device 3.

[Contact between probe pin and conduction terminal]
Here, a state where the probe pin 6 of the probe card 4 is in contact with each of the conduction terminals 2b of the mounting body 1 will be described.
In FIG. 4B, the probe pin 6 of the probe card 4 is not disposed in the semiconductor device corresponding region 5c corresponding to the central portion where the semiconductor device 3 of the mounting body 1 is disposed, but the conduction terminal 2b. A large number are arranged in the probe pin arrangement region 5a corresponding to the region where the are arranged.
Since the probe pin 6 is not disposed in the semiconductor device corresponding region 5c, the probe pin 6 is moved when the moving base 11 is lowered toward the electronic device holding base 9 as shown in FIG. Does not hit the semiconductor device 3, so that the probe pin 6 in the probe pin arrangement region 5a can be lowered to the conduction terminal 2b and can contact the conduction terminal 2b.

In the probe pin arrangement region 5a, any one of the probe pins 6 is always in contact with each of the conduction terminals 2b, and many probe pins 6 are arranged so that the contact is possible. In (2) of FIG. 4, a probe pin that does not come into contact with any conduction terminal 2b between one conduction terminal 2b and the conduction terminal 2b adjacent in the vertical direction, and between the conduction terminals 2b adjacent in the horizontal direction at the same time. 6 is arranged. That means that the arrangement density of the probe pins 6 is higher (darker) than the arrangement density of the conduction terminals 2b.
The probe pin 6 in contact with the conduction terminal 2 b passes through the probe base 5 of the probe card 4, and the upper end 6 b at the leading end contacts the probe pin contact terminal 7 b of the probe pin contact plate 7. The probe pin contact terminal 7b is electrically connected to the external connection terminal 7d by the conductive member 7e, and is connected to the control device by the conductive wire 14 joined to the external connection terminal 7d.
On the other hand, the probe pin 6 that is not in contact with any conduction terminal 2b is not brought into contact and conduction as described above.

An example in which the probe pin 6 is used for another mounting body in which another semiconductor device is arranged will be specifically described.
FIG. 5 is a plan layout diagram illustrating a state in which the probe pin 6 is in contact with a conduction terminal 102b which is a conduction terminal of another mounting body using the same probe card 4 used in FIG. .
The conductive terminal 102b shown in FIG. 5 has a larger area than the conductive terminal 2b shown in (2) of FIG. 4 and has a smaller number of arrangements, so that the arrangement density is low. Although the conduction terminal 102b is illustrated in FIG. 5, the illustration of the semiconductor device is omitted, and the illustration of the conductive pattern that conducts the conduction terminal 102b and the semiconductor device is also omitted. However, the semiconductor device and the conductive pattern are configured in the same manner as in FIG.
Four probe pins 6 are in contact with one conduction terminal 102b, and two and four probe pins 6 are arranged between the conduction terminal 102b and the adjacent conduction terminal 102b. .

The four probe pins 6 that are in contact with the one conduction terminal 102b penetrate the probe base 5 in the same manner as described above, and the upper end 6b at the tip thereof is connected to the probe pin contact terminal 107b of the probe pin contact plate. Contact. The probe pin contact terminal 107b is electrically connected to the external connection terminal in the same manner as described above, and the probe pin contact terminal 107b is connected to the control device by the conductive wire bonded to the external connection terminal as described above.
In this case, the probe pin contact terminal 107b of the probe pin contact plate is formed in the same layout, the same outer diameter shape and the same width as each conduction terminal 102b corresponding to each conduction terminal 102b. The four upper ends 6b of 6 come into contact with each probe pin contact terminal 107b. That is, each conducting terminal 102b and the probe pin contact terminal 107b are conducted by the set of four probe pins 6.
As described above, the same probe card 4 is mounted on the mounting body 1 having the layout of the conductive terminals 2b illustrated in FIG. 4A and the mounting body having the layout of the different conductive terminals 102b illustrated in FIG. The electrical characteristics measuring device 8 shown in FIG. 4 can measure electrical characteristics of each different semiconductor device.
Therefore, the expensive probe card 4 can be commonly used for different mounting bodies, and a dedicated probe card is not prepared for each mounting body as in the prior art. The apparatus 8 can be obtained, and the electrical characteristics of different mounting bodies can be measured using the probe card 4.

The other conductive terminals 102b are not limited to the layout, shape, and size shown in FIG. 5, but may be applied in various layouts, shapes, and sizes depending on the mounting body. For example, in FIG. 4 and FIG. 5, the conduction terminals 2b and 102b are laid out in a quadrangular single enclosure, but a double enclosure inside and a triple enclosure inside the double enclosure. The present invention can also be applied even if they are arranged, and can be applied even if the interval between the conductive terminals 102b is long or short.
On the other hand, the layout of the probe pins 6 may be determined according to the layout of the conductive terminals 2b and 102b of a plurality of different mounting bodies 1.
For example, in (2) of FIG. 4, the probe pins 6 that are not in contact with any conduction terminal 2b provided a layout in which the arrangement density of the conduction terminals 2b is higher (the interval between the conduction terminals 2b is narrower). It can be applied to other implementations. The high arrangement density of the conductive terminals 2b means that the interval between the conductive terminals 2b is narrow, but the probe pins 6 that are not in contact with any of the conductive terminals 2b in the case of (2) in FIG. It can be made to contact the conductive terminal 2b arranged narrower in another electronic device.
In any case, the probe pin has at least one probe pin on each conductive terminal of each semiconductor device so that the electrical characteristics of two or more types of semiconductor devices having different layouts of the conductive terminals can be measured. It is important that they are arranged in an arrangement layout that can be touched.

[Second Embodiment]
The first embodiment of the present invention is a probe card 4 applied to a semiconductor device 3 mounted on a mounting substrate 2 having a predetermined outer shape, and electrical characteristics of the semiconductor device 3 using the probe card 4. The present invention relates to an electrical characteristic measuring apparatus 8 for measuring the electrical characteristics and a method for measuring the electrical characteristics.
The second embodiment of the present invention is different from the first embodiment in that a tape-shaped mounting substrate is used instead of a mounting substrate having a predetermined outer shape. A large number of semiconductor devices 3 are arranged on the tape-shaped mounting substrate. In addition, the present invention provides an electrical property measuring apparatus that can use the tape-shaped mounting substrate.
Others are basically the same as in the first embodiment.

An electrical property measuring apparatus 208 according to the second embodiment of the present invention is shown in FIG. 6, (1) is a cross-sectional view of the main part thereof, and (2) is cut at the DD position of (1) in the direction of the arrow FIG. In FIG. 6 (2), for the sake of convenience, the invisible main members are indicated by solid lines.
6 (1), reference numeral 209 denotes an electronic device support base, 209a denotes an object mounting surface, 201 denotes a tape-like mounting body including a tape-like mounting substrate 202, 4 denotes a probe card, and 7 denotes a probe. A pin contact plate, 211 is a moving base, 211a is a moving base guide pipe, 12 is a moving base guide, 13 is a coil spring, and 14 is a conductive wire.
Among the above, the probe card 4, the probe pin contact plate 7, the moving base guide 12, the coil spring 13, and the conductive wire 14 are the same as those in the first embodiment.
Note that the position guide pin 7 used in the first embodiment is not used.
Although the position guide pin 7 is not used, the tape-shaped mounting body 201 is aligned in the width direction by the left and right walls of the measured object placement surface 209a of the electronic device support base 209.

The mounting body 201 is in the form of a tape as shown in the plan view of FIG. 6 (2). The semiconductor device 3 is mounted on the surface of the mounting body 201, and an output pad is provided on the outer peripheral side of the semiconductor device 3. The conductive pattern 202a that connects the conductive terminal 202b and the electrode of the semiconductor device 3 to the conductive terminal 202b is formed. A sealing resin may be molded around the semiconductor device 3 so as to seal the semiconductor device 3.
In this case, the semiconductor device 3 is the same as that of the first embodiment, and the conductive terminals 202b and the conductive patterns 202a are formed in the same layout as the conductive terminals 2b and the conductive patterns 2a of the first embodiment.
In the mounting body 201 of FIG. 6B, one semiconductor device 3, a conductive terminal 202 b formed around the semiconductor device 3, the one semiconductor device 3 and a conductive pattern 202 a around the semiconductor device 3 are a set of mounting modules 205. When the electrical characteristic measurement of the semiconductor device 3 is completed, the surrounding tape portion is cut under a predetermined dimension, and the obtained individual mounting modules 205 are mounted on each electronic device. Will come to be.
In the mounting body 201 shown in FIG. 6B, a plurality of the mounting modules 205 are sequentially arranged in the longitudinal direction of the tape.
The mounting body 201 has sprocket holes 202c at both ends in the width direction so that the tape-shaped mounting body 201 can be conveyed to a predetermined position. This transport device is not shown.

The electrical property measuring apparatus 208 illustrated in FIG. 6A is configured by placing a tape-like mounting body 201 on the measurement object mounting surface 209a of the electronic apparatus support base 209 and placing a probe above the mounting body 201. A probe pin contact plate 7 is disposed above the card 4.
The probe card 4 and the probe pin contact plate 7 thereabove are also held in the cross-sectional direction while being guided by the left and right walls and the front and rear walls of the movable base 211 in the horizontal direction and the front and rear direction in the plane direction. For example, the probe card 4 and the probe pin contact plate 7 are held at the lower end of the movable base 211 by evacuating the movable base guide pipe 211 a from above.
The moving base 211 moves up and down by moving means (not shown), the moving base guide 12 guides the vertical movement of the moving base 211, and the coil spring 13 moves the moving base 211 to the electronic device support base. The pressing down to the 209 side is the same as in the first embodiment.

Whether or not the reference position (for example, a predetermined sprocket hole 202c position) of the mounting body 201 matches the current planar position of the probe card 4 and the probe pin contact plate 7 is set on the moving base guide stand 12, for example. The plane position correcting means may be provided so that the images are confirmed by the camera and the two match.
For example, the plane position correcting means is configured to place the moving base guide base 12 on a flat surface so that the reference position (predetermined sprocket hole 202c position) of the mounting body 201 matches the reference position of the mobile base guide base 12 by the camera. The X-axis motor and the Y-axis motor move in the X-axis direction and the Y-axis direction, and both these motors are installed on the moving base guide base 12. Or you may move the tape-shaped mounting body 201 to a conveyance direction or a reverse conveyance direction by a conveyance means so that the said agreement may be made.

Each member is arranged as shown in FIG. 6 (1), the lower end 6 a of the probe pin 6 of the probe card 4 contacts the conduction terminal 202 b, and the upper end 6 b of the probe pin 6 is the probe pin contact terminal of the probe pin contact plate 7. By contacting 7b, the electrical characteristics of the semiconductor device 3 can be measured, and this is also the same as in the first embodiment.
The rectangular shape indicated by a two-dot chain line in (2) of FIG. 6 represents the outer diameter shape of the probe card 4.
The probe pin contact plate 7 has a probe pin contact terminal 7b that contacts the upper end 6b of the probe pin 6 formed on the back surface and an external connection terminal 7d to which the conductive wire 14 is joined. The layout of the terminal 7b and the external connection terminal 7d is the same as (1) of FIG.
Further, when using a mounting body in which conductive terminals having a layout different from the layout of the conductive terminals in (2) of FIG. 6 are used, for example, when using a mounting body of the conductive terminals 102b configured in the layout of FIG. Although the same probe card 4 is used, the arrangement relationship of the probe pins 6 with respect to the conduction terminal 102b is as shown in FIG. In that case, the layout of the probe pin contact terminal 7b and the external connection terminal 7d of the probe pin contact plate 7 is the same as in the first embodiment, the conduction terminal 102b, the probe pin connection terminal 107b, the external contact terminal shown in FIG. The same layout as 107d.
As described above, the probe card can be used in common even when a plurality of mounting bodies having different layouts of the conductive terminals are used when the tape-shaped mounting body is used.

[Third Embodiment]
In the first embodiment and the second embodiment, the probe pins of the probe card are fixed to the probe base.
In the third embodiment, the probe pin of the probe card is detachably held with respect to the probe base.
There are various types of electronic devices, particularly semiconductor devices, whose electrical characteristics are to be measured, and there are various types of conductive terminals on the mounting substrate on which the semiconductor device is mounted. In that case, there are various layouts, numbers, places, and the like of the conductive terminals of the mounting substrate, and there are cases where the arrangement area of the conductive terminals is relatively narrow or relatively wide. There are various types and sizes of semiconductor devices. It is almost impossible to arrange the probe pins on the probe card so as to be in contact with all the conducting terminals in all these cases.
Therefore, the probe pin can be added to the probe base when the conductive terminal arrangement area is relatively wide, and the probe pin can be attached to and detached from the probe base by pulling out the probe pin near the center when the area of the semiconductor device is large. By making it possible, it is possible to provide a probe card that can be applied to many different mounting bodies.

In the above case, all the probe pins may be configured to be detachable from the probe base, or the probe pins in the region where the probe pins are expected to be attached / detached relatively frequently are attached / detached as described above. The probe pins that are configured so as to be relatively detachable may be fixed to the probe base so as not to be detachable.
The detachable area is, for example, the center part and the outer peripheral part of the probe pin arrangement area. The central part is detachable to make it easier to accommodate mounting bodies with different sizes and shapes of semiconductor devices, and the outer peripheral part is made easier to handle when the arrangement, number, size, etc. of conductive terminals are different. It is.

Specifically, the probe pin can be inserted into or removed from a number of holes formed in advance with respect to the probe base.
An example of a suitable structure is shown in FIG.
(1) in FIG. 7 shows that the probe base 305 of the probe card is made of an elastic material such as hard synthetic rubber, a probe pin guide hole 305d is opened in the probe base 305, and the probe pin guide hole 305d is probed. The pin 306 is pushed in and fixed.
The probe pin guide hole 305d has a lower diameter small hole portion 305da and an upper diameter large hole portion 305db. The probe pin 306 constitutes a lower diameter portion 306a and an upper diameter portion 306b.
When the probe pin 306 is inserted into the probe pin guide hole 305d from above, the lower diameter small portion 306a is pushed into the small diameter hole portion 305da, and the upper large diameter portion 306b is simultaneously pushed into the large diameter hole portion 305db. Therefore, the planar position of the probe pin 306 is determined. The cross-sectional direction of the probe pin 306 is determined by pushing the upper large diameter portion 306b to the bottom of the large diameter hole portion 305db.
At this time, in the probe pin guide hole 305d, a portion between the small-diameter hole portion 305da and the large-diameter hole portion 305db is formed to have an intermediate hole diameter, and the intermediate-hole diameter portion is in the radial direction with the small-diameter portion 306a. Since there is a gap, it can be pushed in without difficulty even when there is no large pushing force.

In (2) of FIG. 7, the probe base 405 of the probe card is made of hard synthetic rubber in a similar manner, and a probe pin guide hole 405d is opened in the probe base 405, and the probe pin is inserted into the probe pin guide hole 405d. 406 is pushed in and fixed.
The probe pin guide hole 405d has a lower diameter small hole portion 405da and an upper large diameter hole portion 405db. The probe pin 406 constitutes a lower diameter portion 406a and an upper diameter portion 406b.
When the probe pin 406 is inserted into the probe pin guide hole 405d from above, when the upper large diameter portion 406b is pushed into the large diameter hole portion 405db, the large diameter portion 406b comes into contact with the large diameter hole portion 405db. Since the length is long, the planar position of the probe pin 406 is determined. In the cross-sectional direction of the probe pin 406, the large-diameter portion 406b is pushed to the bottom of the large-diameter hole portion 405db, so that the position in the cross-sectional direction is determined.
At this time, in the probe pin guide hole 405d, there is a gap in the radial direction between the small-diameter hole portion 405da and the small-diameter portion 406a. Can prevent damage.

(3) in FIG. 7 is for fixing the probe pin 506 by screwing to the probe base 505 of the probe card. The probe base 505 may be a rigid body.
A screw portion 506a is formed in the middle portion in the longitudinal direction of the probe pin 506, and the probe base 505 is screwed into the screw portion similarly formed.
If the lower pin portion and the upper pin portion of the screw portion 506a are configured to be thinner than the thread valley diameter of the screw portion 506a, no screw groove is formed in the lower pin portion and the upper pin portion, and their strengths are reduced. Can be prevented.
In each of the drawings (1) to (3) in FIG. 7, the probe pins 306, 406, 506 are inserted into the probe bases 305, 405, 505, and the position in the height direction is confirmed as necessary. You may make it fix by. In that case, since it is difficult to remove the probe pins 306, 406, and 506 from the probe bases 305, 405, and 505, in many cases, the probe pins 306, 406, and 506 are limited to cases where it is determined that removal is not necessary.

[Modification 1]
In each of the above embodiments, the mounting substrate is a flexible substrate. However, a rigid substrate may be used, and the mounting structure of the semiconductor device on the mounting substrate may be other than the above structure. For example, the electrode formation surface of the semiconductor device may be The front side may be bonded to the mounting substrate, and the electrode and the conductive pattern of the mounting substrate may be made conductive by wire bonding.

[Modification 2]
In each of the embodiments described above, the object to which the probe pin of the probe card contacts is a conductive terminal formed at the tip of the conductive pattern that is conductive to the electrode of the semiconductor device, but other portions may be used.
For example, an electrode formed on the surface of a semiconductor device mounted on a mounting substrate may be an object to which probe pins of a probe card come into contact. Since each probe pin is in direct contact with the electrode, the interval between the probe pins needs to be narrowed.
Alternatively, a semiconductor device in which a plurality of probe pins are arranged on the surface of the silicon wafer may be used. Each probe pin is in contact with the electrode of each semiconductor device in this state. In this case, since the electrical characteristics can be measured before each semiconductor device is cut out from a wafer such as silicon, the waste of cutting out unnecessary semiconductor devices can be omitted.

[Modification 3]
In the first embodiment and the second embodiment, as shown in FIGS. 4 and 6, the probe pin contact plate is used facing the probe card, but each of the electronic devices can be used without using the probe pin contact plate. You may make it make each probe pin which is contacting the conduction | electrical_connection terminal electrically connected to the control apparatus which transmits / receives the signal for measuring the electrical property of a semiconductor device. For example, a conductive wire may be bonded to the upper end of each probe pin, and the conductive wire may be conducted to the control device.

The probe card of the present invention and the electrical property measuring apparatus for an electronic device using the probe card may be used by contacting the probe pin with the conduction terminal of the mounting body on which the electronic device is mounted. It may be used in direct contact.
It should be noted that the present invention includes adopting a structure and electrical property measuring method other than those described above, if the features of the present invention are used.

1, 201: mounted body, 2, 202: mounting substrate, 2a, 202a: conductive pattern, 2b, 102b, 202b: conductive terminal (output pad), 2c, 202c: sprocket hole, 3: semiconductor device, 4: probe card 5, 305, 405, 505: probe base, 5a, probe pin arrangement area, 5b: probe card guide hole, 5c: semiconductor device corresponding area, 6, 306, 406, 506: probe pin, 6a: lower end, 6b : Upper end, 7: probe pin contact plate, 7a: probe pin contact plate substrate, 7b, 107b: probe pin contact terminal, 7c: probe pin contact plate guide hole, 7d: external connection terminal, 7e: conducting member, 8, 208 : Electrical characteristic measuring device, 9, 209: Electronic device support base, 9a, 209a: Object mounting surface, 10: Position guide pin, 11, 211: Moving base, 11a, 211a: Moving base guide pipe, 12: Moving base guide, 12a: Guide hole, 13: Coil spring, 14: Conductive wire, 205: Mounting module, 305d, 405d: Probe pin guide hole, 305da, 405da: Small hole portion, 305db, 405db: Large hole portion, 306a, 406a: Small diameter portion, 306b, 406b: Large diameter portion, 506a: Screw portion

Claims (6)

A probe card in which a large number of probe pins capable of contacting a large number of conducting terminals of an electronic device are disposed,
An arrangement layout in which at least one probe pin can contact each conduction terminal of each electronic device so that the electrical characteristics of two or more types of the electronic devices having different arrangement layouts of the conduction terminals can be measured. A probe card characterized by being arranged in. The probe card according to claim 1,
The probe card includes a probe base,
The probe pin passes through the probe base,
One end of the probe pin protrudes from the lower surface of the probe base,
The other end of the probe pin protrudes from the upper surface of the probe base. The probe card according to claim 1 or 2, wherein
The probe card, wherein the probe pin is detachable from the probe base. An electrical property measuring apparatus for an electronic device, wherein the electrical property of the two or more types of electronic devices is measured using the probe card according to any one of claims 1 to 3. . An electrical property measuring apparatus for an electronic device according to claim 4,
The electrical property measuring device is:
An electronic device support base for supporting the electronic device;
A probe disposed on the side opposite to the arrangement side of the electronic device with respect to the probe card arranged on the opposite side of the arrangement side of the electronic device support base with respect to the supported electronic device. A pin contact plate;
A moving base that moves the probe card and the probe pin contact plate relative to the electronic device;
The probe pin contact plate has a probe pin contact terminal disposed on a probe card facing surface facing the probe card,
The probe pin contact terminal is arranged in an arrangement layout substantially similar to the arrangement layout of the conduction terminal, and is conducted to a control device that transmits or receives a signal for measuring the electrical characteristics of the electronic device,
One end of the probe pin can contact the conduction terminal of the electronic device, and the other end can contact the probe pin contact terminal of the probe pin contact plate.
A device for measuring electrical characteristics of an electronic device. Using the probe card according to any one of claims 1 to 3,
A method for measuring electrical characteristics of an electronic device, comprising measuring electrical characteristics of the two or more types of electronic devices.

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