JP2007285882A - Board inspection contact, tool, and system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ensure reliable inspection functions by the four-terminal connection method, and to reduce the manufacturing cost. <P>SOLUTION: The board inspection contact comprises a pin 81 as one contact terminal, made of an electrically conductive material which is formed at its tip with a pointed section 814, which is brought into contact with a wiring pattern 21 within a land 2, and is formed with an insulating film 822 on its periphery, excluding the pointed section 814, a pipe 82 as the other contact terminal which is concentric with the pin 81, is fitted loosely so that it can undergo relative movement in the axial direction through a predetermined gap, and is brought into press contact with the wiring pattern 21, and a coil spring 83 which biases the pipe 82 toward the land 2 in the axial direction with being externally fitted on the pin 81. The pipe 82 is provided movably in the axial direction, while being in sliding contact with respect to a lower guide plate 411. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  According to the present invention, an inspection signal is transmitted between the substrate to be inspected and a substrate inspection unit for inspecting electrical characteristics of the substrate to be inspected, which is pressed against a predetermined inspection point set on the wiring pattern of the substrate to be inspected. The present invention relates to a substrate inspection contact, a substrate inspection jig, and a substrate inspection apparatus.

  Not only a printed wiring board, but also a flexible board, a multilayer wiring board, an electrode plate for a liquid crystal display and a plasma display, a package board for a semiconductor package, a film carrier, etc. The wiring patterns wired on the various substrates must accurately transmit electrical signals to electrical components such as semiconductors such as ICs and resistors mounted on the circuit boards. Therefore, conventionally, a printed wiring board before mounting a semiconductor or an electrical component, a circuit wiring board formed with a wiring pattern on a liquid crystal panel or a plasma display panel, or a wiring pattern formed on a substrate such as a semiconductor wafer, It is performed to measure the resistance value between inspection points provided in the wiring pattern to be inspected to inspect the quality.

  Here, the inspection of the resistance value of the wiring pattern is performed by bringing a measuring terminal into contact with each of the inspection points provided at two locations of the wiring pattern to be inspected, and measuring at a predetermined level between the measuring terminals. The pass / fail current is measured by measuring the voltage level generated between the measurement terminals and comparing the measured voltage level with a threshold value.

  However, as described above, when the measurement terminals brought into contact with each of the two inspection points of the wiring pattern are shared with the supply of the measurement current and the measurement of the voltage (this measurement method is the two terminals). The measurement method) has a disadvantage that the contact resistance between the measurement terminal and the inspection point affects the measurement voltage, the measurement accuracy of the resistance value is lowered, and the reliability of the inspection result is lowered.

  Therefore, the current supply terminal and the voltage measurement terminal are brought into contact with each inspection point, and the measurement current is supplied between the current supply terminals brought into contact with the respective inspection points. A method of measuring the resistance value with high accuracy by measuring the voltage generated between the voltage measuring terminals brought into contact with each other to suppress the influence of the contact resistance between the measuring terminal and the inspection point (so-called 4 A terminal measuring method or a Kelvin method is known, and as a substrate inspection apparatus for inspecting a wiring pattern using this method, for example, one disclosed in Patent Document 1 is known.

  The inspection apparatus disclosed in Patent Document 1 includes a probe (substrate inspection contact) that includes an inner pin that vertically faces an object to be inspected and a cylindrical outer pin in which the inner pin is fitted in the axial direction. And the pins inside and outside of the board inspection contact are brought into contact with the inspection point of the inspection object. In addition, two coil springs are attached to each of the inner and outer pins, and the inner and outer pins can be simultaneously pressed into contact with the object to be inspected by elastic compression deformation of each coil spring. Therefore, the board inspection contact configured as described above has a large number of parts, a complicated structure, and a high manufacturing cost.

Therefore, the applicant has proposed a contact for inspection of a substrate described in Patent Document 2. The substrate inspection contact described in Patent Document 2 is such that a plunger and a coil spring corresponding to the outer pin of Patent Document 1 are externally fitted to a pin corresponding to the inner pin of Patent Document 1, and only the plunger is attached to the coil spring. The number of coil springs is reduced so that it can move in the axial direction against the force, thereby reducing the number of parts, thereby simplifying the structure and reducing manufacturing costs.
JP-A-6-66832 JP-A-2005-321211

  However, since the structure of Patent Document 2 is a structure with a shape change that allows the plunger to expand and contract in the axial direction of the pin, the structure of the plunger is complicated and the number of parts is increased, and moreover, the parts are fine. Since fine processing has to be performed, there is a problem that there is a limit to further reducing the manufacturing cost.

  The present invention has been made in view of such a situation, and provides a substrate inspection contact, a substrate inspection jig, and a substrate inspection apparatus that can ensure reliable inspection performance by a four-terminal connection method while having a simple structure. It is intended to provide.

According to the first aspect of the present invention, one end is pressed against a predetermined inspection point set on the wiring pattern of the substrate to be inspected, and the other end has a predetermined substrate inspection portion for inspecting the electrical characteristics of the substrate to be inspected. A contact for inspecting a substrate pressed against an electrode as a contact for detecting signal transmission for transmitting an inspection signal to the first contact terminal having a conductive rod shape, and having conductivity, A cylindrical second contact terminal loosely fitted to the first contact terminal, and a biasing member that biases at least one of the first and second contact terminals in the axial direction toward the inspection point side The urging member is provided only on the electrode side.
It is a feature.

  According to such a configuration, the tip of the substrate inspection contact is brought into contact with the inspection point of the substrate to be inspected, and the inspection point is pressed by the tip of the substrate inspection contact (the pressing due to the movement of the substrate to be inspected). In this case, both the first and second connection terminals are brought into contact with the inspection point, and at least one of the first and second connection terminals is in a state where the urging force of the urging member is applied. Pressed against the inspection point. In this state, the board inspection unit detects a current value and a voltage value based on the current passed through the inspection point from the board inspection contact, and based on these detection values, determines the electrical characteristics of the board to be inspected. inspect.

  In this way, by moving the substrate inspection contact toward the substrate, at least one of the first and second contact terminals in a state where both the first and second contact terminals are in contact with the inspection point. Since the side is pressed against the inspection point of the substrate by the compression elastic deformation of the biasing member, even if the inspection point and its surroundings are not flush with each other and there is a height difference, the biasing member As a result, the first and second contact terminals can always properly press the inspection point with the required pressing force, and the inspection of the electrical characteristics is properly performed.

  In addition, since the second contact terminal does not expand and contract as in the conventional case, the structure of the contactor for board inspection is simplified, and the manufacturing cost is reduced by reducing the number of parts and the number of assembly steps. To contribute.

  Furthermore, a biasing member that biases at least one of the first and second contact terminals in the axial direction toward the inspection point side is provided only on the electrode side (specifically, the electrode and the first contact terminal). Since it is provided between either one or both of the first and second connection terminals), the manufacturing is higher than the conventional biasing member having a length over substantially the entire length of the contact for inspecting the substrate. It is possible to shorten an expensive coil spring that requires high accuracy, thereby contributing to simplification of the structure of the contact for substrate inspection and reduction of manufacturing cost.

  According to a second aspect of the present invention, in the first aspect of the present invention, the biasing member is interposed between the electrode and one or both of the first and second contact terminals. It is characterized by this. By doing so, the urging member is provided only on the electrode side with the simplest configuration.

  According to a third aspect of the present invention, in the first aspect of the present invention, the biasing member biases the second contact terminal.

  According to such a configuration, the effect of the invention of claim 1 can be enjoyed after only one urging member is used for the second contact terminal.

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, further comprising an insulating layer on at least one of an outer peripheral surface of the first contact terminal and an inner peripheral surface of the second contact terminal. It is characterized by this.

  According to this configuration, since the insulating layer is provided on at least one of the outer peripheral surface of the first contact terminal and the inner peripheral surface of the second contact terminal, the outer peripheral surface of the first contact terminal and the second contact terminal are temporarily provided. Even if it contacts the inner peripheral surface, short circuit between the two is prevented.

  The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the first contact terminal is tapered at a tip on the inspection point side. It has a tapered portion.

  According to such a configuration, since the second contact terminal has a tapered portion that is tapered toward the tip, the second contact terminal is located between the tapered portion at the inspection point and the tip of the first contact terminal. This makes it possible to make the first and second contact terminals contact the inspection point in a narrow area, and can cope with a fine wiring pattern. become.

  The invention described in claim 6 is a substrate inspection jig for simultaneously pressing a plurality of substrate inspection contacts according to any one of claims 1 to 5 against the substrate to be inspected. A first plate provided with a predetermined number of support holes through which the contact for use is passed, a second plate provided with the same number of fitting holes through which the contact for inspection of the substrate is passed, and the first And a base having a second plate and a support member arranged in parallel with a predetermined distance therebetween.

  According to such a configuration, a plurality of substrate inspection contacts are supported on the substrate to be inspected simultaneously by supporting a plurality of substrate inspection contacts on the first plate and the second plate. A substrate inspection jig is provided. By using the substrate inspection jig thus obtained, a plurality of wiring patterns formed on a plurality of substrates to be inspected can be efficiently inspected.

  The invention described in claim 7 is a substrate inspection apparatus for inspecting electrical characteristics of the substrate to be inspected, wherein the substrate inspection jig according to claim 6, and the inner conductor and the outer conductor at one end include the substrate. The substrate inspection contact, which is connected to the base end surfaces of the first contact terminal and the second contact terminal of the substrate inspection contact supported by the inspection jig, and the other end is connected to the substrate inspection section. It is characterized by comprising a child and a corresponding lead wire.

  According to this invention, the board inspection apparatus is provided on the end surfaces of the first contact terminal and the second contact terminal of the board inspection contact in which the inner conductor and the outer conductor at one end are supported by the board inspection jig, respectively. Since the lead wire is connected and the other end is connected to the board inspection apparatus, the board inspection apparatus and the board inspection contact are easily connected.

  According to an eighth aspect of the present invention, in the seventh aspect of the present invention, conductive rubber is interposed between the lead wire and each base end surface of the first contact terminal and the second contact terminal. It is characterized by being.

  According to this configuration, since the conductive rubber is interposed between the lead wire and the respective base end surfaces of the first and second contact terminals, the first and second are caused by the compression elastic deformation of the conductive rubber. It is possible to deal with dimensional errors and assembly errors of the contact terminals, and a more reliable energization state between the two is ensured.

  According to the first aspect of the invention, the biasing member that biases at least one of the first and second contact terminals in the axial direction toward the inspection point is provided only on the electrode side. Compared to a conventional biasing member having a length that extends over substantially the entire length of the first and second contact terminals, the expensive coil spring that requires high manufacturing accuracy is shortened due to its small size. Therefore, it is possible to contribute to the simplification of the structure of the contact for inspecting the substrate and the reduction of the manufacturing cost.

  According to the invention described in claim 2, the biasing member is interposed between the electrode and one or both of the first and second contact terminals, whereby the biasing member according to claim 1 is provided. The requirement that the member be provided only on the electrode side can be realized with the simplest configuration.

  According to the invention described in claim 3, it is possible to receive the effect of the invention of claim 1 while contributing to the reduction in the number of parts by using only one urging member for the second contact terminal. it can.

  According to the fourth aspect of the present invention, since the insulating layer is provided on at least one of the outer peripheral surface of the first contact terminal and the inner peripheral surface of the second contact terminal, even if the first contact is present due to the presence of the insulating layer. Even if the outer peripheral surface of the terminal and the inner peripheral surface of the second contact terminal come into contact with each other, a short circuit between them can be prevented.

  According to the invention described in claim 5, since the second contact terminal has a tapered portion that is tapered toward the tip, the tapered portion at the inspection point and the first contact terminal are It becomes possible to make the distance between the tips close to each other, thereby making it possible to make the substrate inspection contact capable of handling a fine wiring pattern.

  According to the sixth aspect of the present invention, a plurality of substrate inspection contacts are simultaneously supported on the substrate to be inspected by supporting a plurality of substrate inspection contacts on the first plate and the second plate. A substrate inspection jig to be press-contacted can be easily manufactured. Then, by using the board inspection jig obtained in this way, a plurality of wiring patterns formed on a plurality of substrates to be inspected by setting the base at an inspection position with respect to the substrate to be inspected at a time. It is possible to carry out inspections at once.

  According to the seventh aspect of the present invention, the substrate inspection apparatus includes the first contact terminal and the second contact terminal of the substrate inspection contact in which the inner conductor and the outer conductor at one end are supported by the substrate inspection jig. Since the plurality of coaxial cables are connected to the respective end faces and the other end is connected to the board inspection apparatus, the board inspection apparatus and the board inspection contact can be easily connected.

  According to the eighth aspect of the present invention, since the conductive rubber is interposed between the lead wire and each base end surface of the first and second contact terminals, the first elastic compression deformation of the conductive rubber causes the first. In addition, it becomes possible to cope with dimensional errors and assembly errors of the second contact terminals, and a more reliable energization state between them can be ensured.

  FIG. 1 is a side sectional view illustrating an embodiment of a substrate inspection apparatus to which a substrate inspection contact according to the present invention is applied, and FIG. 2 is a plan view illustrating the same. 3 is an explanatory diagram for explaining an example of the electrical configuration of the board inspection apparatus shown in FIGS. 1 and 2, and FIG. 4 is an explanatory diagram for explaining an example of the configuration of the scanner. . 1 to 4, the XX direction is referred to as the left-right direction, the YY direction is referred to as the front-rear direction, the ZZ direction is referred to as the up-down direction, and in particular, the -X direction is leftward, the + X direction is rightward, and -Y. The direction is referred to as the front, the + Y direction as the rear, the − direction as the lower side, and the + Z direction as the upper side.

  First, as shown in FIGS. 1 and 2, a substrate inspection apparatus 10 to which a substrate inspection contact 80 according to the present invention is applied has various related devices mounted inside and outside the apparatus main body 1 having a substantially rectangular parallelepiped shape. It is configured by being.

  The substrate inspection apparatus 10 includes an opening / closing door 11 that is openable and closable with respect to the apparatus body 1 on the upper wall surface on the front side (−Y side), and a substrate (inspected) on the rear side of the opening / closing door 11. A loading / unloading section 3 for loading / unloading the substrate (B) to / from the apparatus main body 1 is provided. Then, with the open / close door 11 opened, a substrate B such as a printed circuit board on which a wiring pattern to be inspected is formed is carried into and out of the apparatus main body 1 via the carry-in / out unit 3. Further, on the rear side (+ Y side) of the loading / unloading unit 3, a plurality of (for example, 200) substrate inspection contacts 80 for transmitting an inspection signal are provided, and a land (inspection point) of the wiring pattern of the substrate B is provided. ) Is provided with an inspection jig driving mechanism 43 (to be described later) for moving a substrate inspection jig 41 (to be described later) in order to bring the substrate inspection contact 80 into contact therewith.

  Further, an instruction signal for moving the substrate inspection contact 80 to contact the inspection point and an inspection signal output to the inspection point via the substrate inspection contact 80 are output to the inspection unit 4. A scanner 74 that receives an inspection signal or the like via the inspection unit 4 and sequentially switches a pair selected from among a large number of contacts to determine the quality of the substrate using the inspection signal (in this case, in the apparatus main body 1). At the top). And the board | substrate B which the test | inspection (namely, quality determination) by the test | inspection part 4 and the scanner 74 was complete | finished is returned to the carrying in / out part 3, and is carried out by the operator in the state in which the opening / closing door 11 was open | released.

  In such a substrate inspection apparatus 10, in order to transfer the substrate B between the carry-in / out unit 3 and the inspection unit 4, the transfer table 5 is provided so as to be movable in the Y direction, and the transfer table 5 has a transfer table driving mechanism. 6 is moved and positioned in the Y direction. In other words, the transport table driving mechanism 6 has two guide rails 61 that extend in the Y direction and are spaced apart from each other in the X direction by a predetermined distance. The transport table 5 extends along these guide rails 61. Can be slid back and forth.

  A ball screw 62 is disposed in parallel with the guide rails 61. The front (−Y side) end of the ball screw 62 is pivotally supported by the apparatus main body 1, and the rear (+ Y side) end is used for driving the transport table. The motor 63 is concentrically connected to the drive shaft 64 so as to be integrally rotatable. Further, a nut member 65 fixed to the conveyance table 5 is screwed onto the ball screw 62, and when the motor 63 is driven to rotate in response to a command from a control unit 71 (see FIG. 3) described later, the amount of rotation is increased. Accordingly, the transfer table 5 moves back and forth between the carry-in / out unit 3 and the inspection unit 4 in the front-rear direction.

  As shown in FIG. 2, the transfer table 5 includes a substrate platform 51 for placing the substrate B thereon. The substrate placement unit 51 has three positioning pins 53 for positioning the placed substrate B. Then, the substrate B is urged between the positioning pins 53 and the urging means on the substrate platform 51 by urging the substrate B by the urging means (not shown) from the direction facing the positioning pins 53. It is positioned and held. Further, a substrate inspection contact 80 (corresponding to a substrate inspection contact) of a lower inspection unit 4D (FIG. 1) described later is brought into contact with the wiring pattern formed on the lower surface of the substrate B held in this manner. For this purpose, the substrate mounting portion 51 is provided with an opening (not shown).

  The inspection unit 4 includes an upper inspection unit 4U for inspecting a wiring pattern formed on the upper surface side of the substrate B on the upper side (+ Z side) across the moving path of the transport table 5, and a lower side (−Z side). And a lower inspection unit 4D for inspecting the wiring pattern formed on the lower surface side of the substrate B. The inspection units 4U and 4D are vertically symmetrical and substantially the same, and are arranged substantially symmetrically across the movement path of the transport table 5. Each of the inspection units 4U and 4D includes a substrate inspection jig 41 and an inspection jig driving mechanism 43.

  As shown in FIG. 3, the board inspection apparatus 10 includes a CPU 71, a ROM, a RAM, a motor driver, and the like, and controls the operation of the entire apparatus according to a program stored in the ROM in advance. A tester controller 73 that controls operations for inspection, a scanner 74 that scans on the substrate B, and an operation panel 75 that receives commands from an operator and displays inspection results of wiring patterns are provided. .

  The tester controller 73 receives an inspection start command from the control unit 71 and inspects the plurality of substrate inspection contacts 80 in contact with the lands of the wiring pattern of the substrate B according to a program stored in advance. Two board inspection contacts 80 respectively contacting the two lands located at both ends of the power wiring pattern are sequentially selected. Further, the tester controller 73 outputs a scan command to the scanner 74 so as to perform inspection between the two selected substrate inspection contacts 80.

  The board inspection unit according to the present invention includes the control unit 71, the tester controller 73, the scanner 74, and the operation panel 75.

  On the other hand, as shown in FIG. 3, the inspection jig driving mechanism 43 includes an X jig driving unit 43X that moves the substrate inspection jig 41 in the X direction with respect to the apparatus body 1, and an X jig driving unit 43X. Connected to the Y jig driving portion 43Y for moving the substrate inspection jig 41 in the Y direction, and θ treatment for rotating the substrate inspection jig 41 about the Z axis connected to the Y jig driving portion 43Y. A tool driving unit 43θ and a Z jig driving unit 43Z connected to the θ jig driving unit 43θ and moving the board inspection jig 41 in the Z direction. The jig 41 is positioned relative to the transfer table 5, or the board inspection jig 41 is moved up and down (Z direction) to bring the board inspection contact 80 into a wiring pattern formed on the board B. Be able to abut against or separate from It has been.

  As shown in FIG. 4, the scanner 74 includes a current generator 125 including a constant current source that outputs a predetermined level of measurement current, a voltage measurement unit 126 that measures a voltage at a predetermined level of measurement current, Between the two substrate inspection contacts 80 selected by the tester controller 73 (see FIG. 3) from among the plurality of substrate inspection contacts 80 included in the substrate inspection jig 41, the current generator 125 and the voltage A changeover switch 128 including a switch array for connecting the measurement unit 126 and an inspection processing unit (substrate inspection unit) 127 for outputting a control signal for switching to the changeover switch 128 are provided.

  In response to the scan command from the tester controller 73, the inspection processing unit 127 sends the current generation unit 125 and the voltage measurement unit 126 between the two substrate inspection contacts 80 to be inspected to the changeover switch 128. A control signal is output. The inspection processing unit 127 compares the voltage value measured by the voltage measuring unit 126 with a predetermined reference voltage to determine whether the wiring pattern to be inspected is good or bad, and uses the determination result as a tester controller. 73 is also transmitted.

  Hereinafter, the substrate inspection jig 41 will be described with reference to FIG. 5 showing a state in which the substrate inspection jig 41 is disposed in the upper inspection unit 4U in a side view. The lower inspection unit 4D is vertically symmetrical and substantially the same as the upper inspection unit 4U, and therefore the description of the lower inspection unit 4D is omitted. As shown in FIG. 5, the substrate inspection jig 41 is configured to simultaneously press a plurality of substrate inspection contacts 80 against the substrate B in order to inspect the wiring pattern formed on the substrate B.

  The substrate inspection jig 41 is a base plate according to the present invention in which a plurality of support holes 411a that respectively support one end (here, the lower end) of the substrate inspection contact 80 are formed. A plurality of fitting holes 412a are formed to support the lower guide plate (first plate) 411, which is a part, and the other end portion (here, the upper end portion) of the substrate inspection contact 80, respectively. For supporting the cable as a part of the base of the present invention that supports the upper guide plate (second plate) 412 that is a part of the base according to the present invention and one end of the coaxial cable (lead wire) 124. The plate 413 is configured to include a plurality of support members 414 made of rod-like stainless steel or the like that are arranged in parallel with a predetermined distance between guide plates 411 and 412 that are vertically opposed to each other.

  Further, the substrate inspection contact 80 has a sharp point 814 (FIG. 6) at its lower end protruding from the support hole 411a of the lower guide plate 411 so that it can contact a land (inspection point) 2 formed on the substrate B. Has been made. Further, the upper end portion of the board inspection contact 80 can contact the end surface of the coaxial cable 124 that is supported by penetrating the mounting hole 413a of the guide plate 413 while being penetrated by the fitting hole 412a of the guide plate 412. Has been made. The guide plates 411 and 412 and the cable support plate 413 are formed in a plate shape from an insulating material such as glass, epoxy resin, or other resin.

  In the present embodiment, the end face of the coaxial cable 124 functions as an electrode according to the present invention, which is a contact for transmitting a detection signal, as shown in FIGS. .

  Next, the operation of the substrate inspection apparatus 10 configured as described above will be described based on FIGS. 3 and 4 with reference to other drawings as necessary. First, the control unit 71 drives and controls the transport table drive mechanism 6 and the inspection jig drive mechanism 43 so that a plurality of substrate inspection contacts 80 are substantially simultaneously formed on the circuit pattern formed on the substrate B on the transport table 5. Make contact. As a result, the plurality of substrate inspection contacts 80 included in the substrate inspection jig 41 are brought into contact with the land of the wiring pattern of the substrate B integrally. Here, a case where a continuity test (inspection for disconnection) between two predetermined lands 2 and 2 set in one wiring pattern 21 is described. Further, as will be described later with reference to FIGS. 6 and 7, the board inspection contact 80 is in contact with the land of the wiring pattern of the board B so as to be able to be energized with two contacts (that is, in contact with the land). It functions as two contact terminals (the sharpened portion 814 of the inner pin (first contact terminal) 81 and the tapered portion 823 of the outer pipe (second contact terminal) 82 in this embodiment).

  When the contact of the board inspection contact 80 with the wiring pattern is completed as described above, an inspection start command is transmitted from the control unit 71 to the tester controller 73. Then, the tester controller 73 selects the wiring pattern 21 as an inspection target, for example. Next, the port P1 of the changeover switch 128 to which the board inspection contact 80 that contacts the land 2 at one end of the wiring pattern 21 is connected, and the board inspection contact that contacts the land 2 at the other end of the wiring pattern 21. A scan command for designating the port P2 of the changeover switch 128 to which the child 80 is connected to perform inspection is output from the tester controller 73 to the scanner 74.

  Then, in response to a scan command from the tester controller 73, the changeover switch 128 is switched from the scanner 74 to connect the current generator 125 (FIG. 4) and the voltage measuring unit 126 (FIG. 4) between the ports P1 and P2. A control signal is output, and the switch 128 connects the current generator 125 and the voltage measuring unit 126 between the port P1 and the port P2.

  Next, a current I for measurement is output by the current generation unit 125, and the external conductor 124 b of the coaxial cable 124 and the sharpened portion 814 (FIG. 6) of the board inspection contact 80 are output from the port P 1 of the changeover switch 128. Then, the current I (FIG. 4) is supplied to the land 2. Further, the current I flows from the land 2 on the port P1 side to the land 2 on the port P2 side through the wiring pattern 21, and the sharp portion 814 of the inner pin 81 as a current supply terminal in contact with the land 2 is externally connected. A current loop reaching the current generator 125 via the conductor 124b and the port P2 of the changeover switch 128 is formed. Thereby, for example, when the resistance value of the wiring pattern 21 is R, the voltage V generated between the lands 2 and 2 is V = R × I.

  Next, the substrate inspection contact 80 (the tapered portion 823 of the pipe 82 as a voltage measurement terminal (FIG. 6)), the inner conductor 124a of the cable 124, and the switching are made. The voltage is measured by the voltage measurement unit 126 via the port P1 of the switch 128. Further, the potential of the land 2 on the port P2 side is guided to the voltage measuring unit 126 through the internal conductor 124a in contact with the land 2 and the port P2 of the changeover switch 128. The voltage measuring unit 126 measures the voltage V between the lands 2 and 2.

  Then, the inspection processing unit 127 compares the voltage V measured by the voltage measuring unit 126 with a predetermined reference voltage. As a result, when the voltage V exceeds the reference voltage, the conductive state of the wiring pattern 21 is defective. On the other hand, when the voltage V is equal to or lower than the reference voltage, it is determined that the electrical connection of the wiring pattern 21 is good. However, when performing a short circuit inspection (inspection for the presence or absence of a short circuit) between two lands set in two wiring patterns, when the voltage V is equal to or higher than the reference voltage, the insulation between the wiring patterns is good. Determined. Then, the inspection processing unit 127 transmits a signal indicating the determination result to the tester controller 73. In this way, the conductive state of the wiring pattern 21 is inspected using the four-terminal measurement method.

  Note that the inspection processing unit 127 calculates the resistance value R of the wiring pattern 21 from the voltage V measured by the voltage measuring unit 126 by executing a calculation process of R = V / I, and the resistance value R and a predetermined value are calculated. The configuration may be such that the quality of the conductive state of the wiring pattern 21 is determined by comparing with a reference resistance value.

  Next, when the tester controller 73 receives a signal indicating that the continuity of the wiring pattern 21 is good, a scan command is output from the tester controller 73 to the scanner 74 to inspect a new wiring pattern. The On the other hand, when the tester controller 73 receives a signal indicating that the continuity of the wiring pattern 21 is defective, the tester controller 73 outputs a signal indicating that the inspection target board B is defective to the control unit 71. The controller 71 displays on the operation panel 75 that the substrate B is defective. In this way, the circuit board wiring pattern can be inspected by the four-terminal measurement method.

  6 is an enlarged exploded perspective view showing a first embodiment of the substrate inspection contact, and FIG. 7 is an assembled perspective view thereof. 8 is a cross-sectional view taken along line II of the contact shown in FIG. 7. FIG. 8A is a state immediately before the contact is pressed against the land, and FIG. 8B is a contact. FIG. 8C shows a state immediately after the pin is pressed against the land, and a state in which the top of the pin is in contact with the pin electrode. 6 to 8 is used for the upper inspection unit 4U, but the one used for the lower inspection unit 4D is also simply symmetrical in the vertical direction. Since it is the same structure, the description about the board | substrate test | inspection contact 80 for lower test | inspection unit 4D is abbreviate | omitted.

  First, as shown in FIG. 6, the board inspection contact 80 according to the first embodiment includes a rod-shaped (columnar in this embodiment) pin 81 having elasticity as one contact terminal, and the pin 81. Are concentrically loosely fitted, and the pipe 82 that functions as the other contact terminal with respect to the pin 81 and the axial position of the pipe 82 are urged so as to be changeable (that is, urged so as to move up and down). A coil spring (biasing member) 83 made of a conductive material (for example, piano wire SWP-A) is provided.

  The diameter of the pin 81 is set to 50 μm to 120 μm. The pin 81 is formed integrally with a pin main body 811 made of a conductive material, an insulating film (insulating layer) 812 laminated on the peripheral surface of the pin main body 811, and concentrically at an appropriate position of the insulating film 812. An annular projection 813 is provided to prevent it from coming off. In the present embodiment, the pin body 811 is formed of a conductive material such as tungsten or beryllium copper.

  The tip end portion (lower end portion in the example shown in FIG. 6) of the pin main body 811 is formed to be tapered, and a sharp pointed portion 814 is provided at the tip end. The tip angle of the sharp portion 814 (the angle formed by the tip portion of the sharp portion 814 when the pin 81 is viewed from a direction orthogonal to the direction in which the axis extends) is set to an acute angle. By adopting such an acute angle as the tip angle of the sharp part 814, even if a film is formed on the surface of the land 2, the tip of the sharp part 814 breaks through this film and reliably reaches the wiring pattern 21. be able to.

  The insulating film 812 is formed of a fluororesin (for example, PTFE (polytetrafluoroethylene)) that is a tough synthetic resin material. The insulating film 812 is entirely laminated on the peripheral surface of the pin main body 811 except for the base end side (the upper end side in the example shown in FIG. 6) of the pin main body 811 and the sharp portion 814.

  The pipe 82 is configured such that the pin 81 is concentrically loosely fitted, has an inner diameter dimension d1 slightly larger than a diameter dimension d0 of the pin body 811 and a length dimension slightly shorter than the pin 81. Is formed by. The pipe 82 includes a cylindrical pipe main body 821, an insulating coating (insulating layer) 822 laminated on substantially the upper half of the pipe main body 821, and a tip end portion (lower end portion in the example shown in FIG. 6). A tapered portion 823 formed into a truncated cone shape and a ring-shaped crimped portion 824 formed by caulking a portion slightly below the insulating coating 822 in the pipe body 821 over the entire circumference. And is configured.

  The insulating film 822 of the pipe 82 is formed of PTFE similarly to the insulating film 812 of the pin 81.

  The annular caulking portion 824 has an inner diameter dimension d2 set smaller than an outer diameter dimension d3 of the annular protrusion 813 of the pin 81, whereby the annular protrusion 813 is inserted into the pipe 82 from the sharpened portion 814 side. By interfering with the annular caulking portion 824, the pin 81 is prevented from coming out of the pipe 82 downward.

  In addition, the length dimension L1 between the lower edge portion of the annular protrusion 813 and the tip of the sharp portion 814 in the pin 81 is such that the upper edge portion of the annular caulking portion 824 that has entered the pipe main body 821 and the tapered portion 823. The tip of the sharp portion 814 of the pin 81 is set to be slightly longer than the length L2 between the lower end surface and the pin 81 is inserted into the pipe 82 from above and the annular protrusion 813 interferes with the annular caulking portion 824. However, as shown in FIG. 8A, the pin 81 protrudes from the lower edge portion of the tapered portion 823 to the outside by a predetermined protrusion amount ΔL1 (where ΔL1 = L1-L2), and the pin 81 is prevented from coming off in this state. It has become so.

  When the board inspection contact 80 is mounted on the lower inspection unit 4D, the board inspection contact 80 is upside down from the state shown in FIG. Thus, the pipe 82 falls into the pipe 82 due to gravity, and therefore, the sharp portion 814 does not protrude outward from the tapered portion 823.

  Then, in a state where the pin 81 is prevented from being removed from the pipe 82, a gap dimension is formed between the base end (upper end) surface of the pin 81 and the lower end surface of the coaxial cable 124 that is penetrated through the through hole of the cable support plate 413. A gap of ΔL2 is formed. The length dimension L3 from the annular protrusion 813 to the upper end surface of the pin 81 is set so that the gap dimension ΔL2 is slightly longer than the protrusion amount ΔL1 of the sharp portion 814 (that is, ΔL2> ΔL1).

  The coil spring 83 is formed in a coil shape by a spring material such as a conductive Piano wire. The coil spring 83 is not covered with an insulating film, and therefore, the coil spring 83 itself functions as an electric signal transmission function in the board inspection contact 80.

  As shown in FIG. 8A, the coil spring 83 has the lower end surface of the coaxial cable 124 and the upper edge surface of the pipe 82 in a state where the annular protrusion 813 of the pin 81 interferes with the annular caulking portion 824 of the pipe 82. The length dimension is set to be the same as or slightly longer than the distance L4 between the two. The coil spring 83 has an average diameter dimension ((inner diameter dimension + outer diameter dimension) / 2) of the inner diameter dimension and the outer diameter dimension, and the inner diameter dimension d1 (FIG. 6) and the outer diameter dimension d1 ′ of the pipe body 821. The average diameter dimension ((d1 + d1 ′) / 2) is set to be equal to the upper end edge surface of the pipe main body 821 and can be mounted on the pipe main body 821 in a stable state.

  6, the pin 81 is inserted into the pipe 82 via the coil spring 83, and in this state, the pipe 82 is fitted into the support hole 411a of the lower guide plate (first plate) 411 from above. By inserting, the board inspection contact 80 is mounted between the lower guide plate 411 and the upper guide plate 412 (see FIG. 8A).

  Hereinafter, the operation of the substrate inspection contact 80 according to the first embodiment will be described with reference to FIG. 8 and other drawings as necessary. First, in a state in which the substrate inspection contact 80 is mounted between the lower guide plate 411 and the upper guide plate 412, the pipe 82 has an upper edge portion as shown in FIGS. Is inserted into the fitting hole 412a of the upper guide plate 412 in a sliding contact state, and the lower end edge surface of the insulating coating 822 interferes with the edge of the support hole 411a of the lower guide plate 411, thereby stabilizing the state. Are supported by the guide plates 411 and 412.

  In this state, the upper end surface of the pipe 82 is brought into contact with the coil spring 83 that is slightly compressed and elastically deformed, and thereby the pipe 82 is urged downward by the urging force of the coil spring 83.

  In this state, as shown in FIGS. 7 and 8A, the pin 81 is set at a lower position H1 where the annular protrusion 813 interferes with the annular caulking portion 824 of the pipe 82 in the pipe 82. As a result, the sharp portion 814 of the pin 81 protrudes downward from the tapered portion 823 at the lower end of the pipe 82 by ΔL1.

  In this state, when the land 2 of the substrate B is positioned immediately below the substrate inspection contact 80 and subsequently the substrate inspection jig 41 is lowered toward the land 2, first, the sharp portion 814 of the pin 81 is moved to the land 2. It abuts on the upper surface. When the lowering of the substrate inspection jig 41 is continued, only the pipe 82 is lowered, whereby the pin 81 is relatively immersed in the pipe 82, and as shown in FIG. Both the lower end of the tapered portion 823 and the sharp portion 814 of the pin 81 are in contact with the land 2, whereby the pin 81 is set at the upper position H <b> 2.

  However, immediately after the lower end edge of the pipe 82 contacts the land 2, as shown in FIG. 8B, the top of the pin 81 has not yet contacted the internal conductor 124a. It is not electrically connected to 124a. Accordingly, the substrate inspection jig 41 continues to descend to ensure this electrical connection. By doing so, the pipe 82 is relatively inserted into the fitting hole 412a against the urging force of the coil spring 83, and finally, as shown in FIG. The surface comes into contact with the lower surface of the inner conductor 124a, and the pin 81 is electrically connected to the inner conductor 124a.

  As described in detail above, the board inspection contact 80 according to the first embodiment is brought into pressure contact with a predetermined inspection point set on the wiring pattern 21 in the land 2 of the board B, and the electrical characteristics of the board B are improved. An inspection signal is transmitted to a substrate inspection apparatus to be inspected, and a sharp pointed portion 814 that is brought into contact with the wiring pattern 21 in the land 2 is formed at the tip, and the sharp portion 814 and the top portion are formed. Except for a pin 81 made of a conductive material as one contact terminal having an insulating coating 822 formed on the peripheral surface, and loosely fitted to the pin 81 so as to be relatively movable in the axial direction through a predetermined annular gap. In addition, a pipe 82 serving as the other contact terminal pressed against the wiring pattern 21 and a coil spring 83 that urges the pipe 82 toward the land 2 in the axial direction while being fitted on the pin 81 are provided. The pipe 82 is It is provided movably toward the axial direction in a sliding contact state with respect to the lower guide plate 411.

  Accordingly, when inspecting the land 2 provided on the upper surface (lower surface) of the substrate B, the substrate inspection jig 41 is lowered (raised) with the substrate inspection contact 80 facing the land 2. By doing so, the pipe 82 moves toward the land 2 against the urging force of the coil spring 83 in a state where the pointed portion 814 of the pin 81 is in contact with the inspection point of the land 2, thereby causing the pin 81 to move. Since both the sharpened portion 814 and the tapered portion 823 of the pipe 82 are pressed against the land 2, either one of the pin 81 or the pipe 82 is used for current inspection, and the other is used for voltage inspection. The current value and the voltage value are detected with respect to the wiring pattern 21 in the land 2, whereby the quality of the land 2 can be determined.

  In this way, by lowering (raising) the board inspection jig 41 toward the board B, the sharp portion 814 of the pin 81 is pressed against the inner conductor 124a and the electrical connection is ensured. 82, since the lower end surface of the tapered portion 823 as a connection terminal is pressed and abutted against the land 2 by compressive elastic deformation of the coil spring 83 while ensuring an electrical connection state with the outer conductor 124b. The coil spring 83 absorbs the height difference even if there is a height difference because the two are not flush with each other, so that the board inspection contact 80 is connected to the coaxial cable 124 regardless of the state of the land 2. The electrical connection state is ensured.

  Since the natural length of the coil spring 83 is shorter than that of the pin 81, the coil spring 83 is more expensive than the conventional case where the coil spring 83 is set to the same length as the pin 81. The spring 83 can be shortened, which can contribute to a reduction in manufacturing cost of the substrate inspection contact 80.

  FIG. 9 is a side sectional view showing a second embodiment of the substrate inspection contact. FIG. 9A is a state immediately before the substrate inspection contact is pressed against the land. B) shows a state in which the board inspection contact is pressed against the land.

  The substrate inspection contact 80 ′ of the second embodiment has a basic configuration including a pin 81 ′, a pipe 82 ′, and a coil spring 83 ′. However, the coil spring 83 urges the pin 81 ′ in that the coil spring 83 urges the pipe 82. It is different from the child 80. Other configurations of the substrate inspection contact 80 'are the same as those of the substrate inspection contact 80 of the first embodiment.

  That is, the pin 81 ′ is formed so as to protrude concentrically from the pin body 815 configured in the same manner as the previous pin 81 and the base end side (upper end side in the example shown in FIG. 9) of the pin body 815. And a small-diameter portion 816 having a smaller diameter than the pin body 815. The coil spring 83 'is fitted on the small diameter portion 816 and is loosely fitted on the pipe 82'. The coil spring 83 'is not covered with a film like the coil spring 83 of the first embodiment, and functions as a conductive member in the board inspection contact 80'.

  As shown in FIG. 9A, the pipe 82 ′ has a pipe body 821 ′ set to be longer than that of the first embodiment and the insulating coating 822 is in contact with the lower guide plate 411. In addition, the base end face is in contact with the outer conductor 124 b of the coaxial cable 124.

  Then, as shown in FIG. 9A, when the pin 81 ′ is set at the lower position H1, the space between the upper end surface of the small diameter portion 816 of the pin 81 ′ and the lower surface of the internal conductor 124a. The clearance dimension ΔL2 is larger than the distance (projection amount ΔL1) between the lower end of the sharp portion 814 of the pin 81 ′ and the lower end edge of the tapered portion 823 of the pipe 82 ′ (ΔL2> ΔL1). 81 'and pipe 82' are dimensioned.

  According to the substrate inspection contact 80 ′ of the second embodiment, the state before the tip of the substrate inspection contact 80 ′ is brought into contact with the land 2 of the substrate B is shown in FIG. As described above, the sharp portion 814 of the pin 81 ′ protrudes from the lower end portion of the pipe 82 ′ with a protrusion amount ΔL 1, and the upper end portion of the pipe body 821 ′ is in contact with the outer conductor 124 b of the coaxial cable 124. .

  By lowering the substrate inspection jig 41 in this state, first, the tip of the sharp portion 814 of the pin 81 ′ is pressed against the land 2. By continuing the lowering of the substrate inspection jig 41, the sharp portion 814 of the pin 81 'is moved upward relative to the pipe 82' by the land 2 and is set at the upper position H2. As a result, the coil spring 83 ′ is compressed and elastically deformed, and the lower end edge surface of the tapered portion 823 of the pipe 82 ′ is pressed against the land 2 (FIG. 9B).

  In the state shown in FIG. 9B, the land 2 and the internal conductor 124a are electrically connected via the pin 81 'and the coil spring 83', and the land 2 and the external conductor are connected. 124b is electrically connected through a pipe 82 '. In this state, the height difference of the surface of the land 2 is absorbed by the compression elastic deformation of the coil spring 83 ′, so that the electrical connection state of the board inspection contact 80 ′ to the land 2 is always ensured. Can do.

  FIG. 10 is a side sectional view showing a third embodiment of the substrate inspection contact. FIG. 10A is a state immediately before the substrate inspection contact is pressed against the land. B) shows a state in which the board inspection contact is pressed against the land.

  In the substrate inspection contact 80 ″ of the third embodiment, the pin 81 ′ is the same as that of the second embodiment, and the pin 81 is the same as that of the first embodiment. Both of the springs 82 'are urged by the respective coil springs 83' and 83, so that the coil spring 83 'of the pin 81' and the coil spring 83 of the pipe 82 are independent of each other according to the height difference of the surface of the land 2. By compressing and elastically deforming, the height difference can be absorbed more effectively. The other configuration of the substrate inspection contact 80 ″ is the same as that of the previous embodiment.

  Incidentally, since the pin 81 ′ and the pipe 82 of the board inspection contact 80 ″ of the third embodiment have already been described in detail, description thereof is omitted here.

  According to the substrate inspection contact 80 ″ of the third embodiment, the state before the tip of the substrate inspection contact 80 ″ contacts the land 2 of the substrate B is shown in FIG. As described above, the sharp portion 814 of the pin 81 ′ protrudes from the lower end portion of the pipe 82 by the protrusion amount ΔL 1, and the upper end portion of the pipe body 821 ′ is in contact with the outer conductor 124 b of the coaxial cable 124.

  By lowering the substrate inspection jig 41 in this state, first, the tip of the sharp portion 814 of the pin 81 ′ is pressed against the land 2. By continuing the lowering of the substrate inspection jig 41, the sharp portion 814 of the pin 81 'moves upward relative to the pipe 82 by the land 2 and is set at the upper position H2. As a result, the coil spring 83 ′ is compressed and elastically deformed, and the lower end edge surface of the tapered portion 823 of the pipe 82 is pressed against the land 2 (FIG. 10B).

  In the state shown in FIG. 10B, the land 2 and the internal conductor 124a are electrically connected via the pin 81 'and the coil spring 83', and the land 2 and the external conductor are connected. 124b is electrically connected through the pipe 82 and the coil spring 83. In this state, the difference in height of the surface of the land 2 is absorbed by the compression elastic deformation of the two coil springs 83 and 83 ', so that the electrical connection state of the board inspection contact 80 "with respect to the land 2 is always higher. It can be surely secured.

  The substrate inspection jig 41 according to the present invention is based on the assumption that the substrate inspection contacts 80, 80 ′, 80 ″ of the first to third embodiments are employed, and the substrate inspection contacts 80, A plurality of support holes 411a are configured so that a plurality of 80 'and 80 "are pressed against the substrate B at the same time, and support through one end of each of the substrate inspection contacts 80, 80' and 80". The formed lower guide plate 411, the upper guide plate 412 formed with a plurality of fitting holes 412a that respectively support the other end portions of the board inspection contacts 80, 80 ', 80 ", and the lower and The upper guide plates 411 and 412 are provided with support members 414 arranged in parallel with a predetermined distance therebetween.

  According to the thus configured substrate inspection jig 41, a plurality of substrate inspection contacts 80, 80 ', 80 "are supported on the lower guide plate 411 and the upper guide plate 412, thereby inspecting the substrate. The board inspection jig 41 for simultaneously pressing a plurality of contactors 80, 80 ′, 80 ″ against the board B can be easily manufactured. And by using the board | substrate inspection jig | tool 41 obtained in this way, the test | inspection of the some wiring pattern 21 formed in the some board | substrate B can be performed simultaneously, and it contributes to the improvement of test | inspection efficiency. Can do.

  Further, the substrate inspection apparatus 10 for inspecting the electrical characteristics of the substrate B according to the present invention includes a substrate inspection jig 41 and a substrate in which one end of the inner conductor and the outer conductor are supported by the substrate inspection jig 41. A plurality of coaxial cables 124 connected to the pins 81 and 81 ′ of the inspection contacts 80, 80 ′ and 80 ″ and the end faces of the pipes 82 and 82 ′ and the other ends thereof to the board inspection apparatus 10, respectively. Since it is configured, the board inspection apparatus 10 and the board inspection contacts 80, 80 ′, 80 ″ can be easily connected, and the board inspection apparatus 10 can be easily manufactured.

  The present invention is not limited to the above embodiment, and includes the following contents.

  (1) In the above embodiment, the coil springs 83, 83 are made of a metal material such as a piano wire, but instead of the metal material, a strong material such as a fluorine resin or a silicon resin is used. A coil spring made of a synthetic resin, in which a conductive material is laminated on the surface by sputtering or the like, may be employed.

  (2) In the above embodiment, cylindrical pins are employed as the pins 81, 81 ', but the present invention is not limited to the pins 81, 81' being cylindrical, Other shapes such as an elliptical column shape and a rectangular column shape may be used. In the above embodiment, the pipes 82 and 82 'are cylindrical, but the present invention is not limited to the pipes 82 and 82' being cylindrical. (For example, a cylindrical shape having a polygonal cross section).

  (3) In the above embodiment, the substrate inspection apparatus 10 includes the upper inspection unit 4U and the lower inspection unit 4D. However, in the present invention, the substrate inspection apparatus 10 includes the upper inspection unit 4U and the lower inspection unit. It is not limited to providing both with 4D, You may provide at least one side of these.

  (4) In the above embodiment, the coil springs 83 and 83 'are not covered with a film made of an insulating material, but may be covered with an insulating material except for the upper and lower end faces. By doing so, the coil springs 83 and 83 ′ are not short-circuited even if the peripheral surface is in contact with the other party while ensuring electrical conductivity, so that the reliability of the board inspection contact 80 can be improved. .

  (5) In the board inspection contact 80 ′ of the second embodiment, the base end face (upper end face) of the pipe 82 ′ is in contact with the outer conductor 124 b of the coaxial cable 124 in the example shown in FIG. 9. However, in a state in which the board inspection contact 80 'is separated from the land 2 of the board B (FIG. 9A), there is a slight gap between the upper end surface of the pipe 82' and the outer conductor 124b. It doesn't matter. Even if there is a slight gap, the tip of the pipe 82 ′ is in contact with the land 2 in the state where the substrate inspection jig 41 is lowered and the tip of the substrate inspection contact 80 ′ is pressed against the land 2. Since the pipe 82 ′ rises relative to the board inspection jig 41 by the contact, the gap is filled and the upper end surface of the pipe 82 ′ contacts the outer conductor 124 b.

  (6) In the board inspection contact 80 ″ of the third embodiment described above, the sharp part 814 of the pin 81 ′ protrudes outward from the tapered part 823 of the pipe 82. The portion 814 is not limited to projecting to the outside from the tapered portion 823, but the sharp portion 814 may be stored in the tapered portion 823, or the height level of the tip of the sharp portion 814 and the tip You may set the height level of the front-end | tip edge surface of the constriction part 823 to the same height level. That is, in the board | substrate test | inspection contact 80 "of 3rd Embodiment, both pin 81 'and the pipe 82 are used. Are urged independently of each other by the coil springs 83 'and 83, so that the substrate inspection contact 80 "regardless of the relative positional relationship between the sharp portion 814 and the tapered portion 823. The tip of the pin is pressed against the land 2 The state, so that both of the pointed portion 814 and the tapered-off portion 823 is brought into contact with the land 2 in a state of absorbing the difference in height between the land 2.

  Incidentally, depending on the shape of the land 2, there is a case where either the pin 81 ′ or the pipe 82 is protruded more than the other. That is, the land 2 mainly includes two types of so-called non-coining that is hemispherical like a polka dot dropped on the surface of a water-repellent member, and coining that has a flat surface by pressing. When the land 2 is non-coining, the pin 81 ′ protrudes from the pipe 82, while when the land 2 is coining, the tapered portion 823 of the pipe 82 protrudes from the pin 81 ′ (that is, the pin 81 ′ is protruded from the pipe 82). In most cases).

  (7) In the above embodiment, the contact operation of the substrate inspection contact 80 with the land 2 of the substrate B is performed by moving the substrate inspection contact 80, but instead of this, the substrate A configuration may be adopted in which B is moved toward the substrate inspection contact 80.

  (8) In the above embodiment, the coaxial cable 124 is adopted as the lead wire. However, the present invention is not limited to the coaxial cable 124 being used as the lead wire. A so-called litz wire composed of a plurality of stranded wires that are independently insulated from each other may be employed, or a so-called pair wire composed of two conductive wires insulated from each other may be employed.

  (9) In the above embodiment, conductive rubber may be interposed between the end face of the coaxial cable 124 and the substrate inspection contact 80. This conductive rubber has a large number of conductive particle arrays in which predetermined conductive particles are arranged in series in the thickness direction across the front and back surfaces, and each conductive particle array is insulated from each other by rubber. Is secured. By interposing such conductive rubber between the end face of the coaxial cable 124 and the substrate inspection contact 80, the conductive rubber is compressed and elastically deformed when the tip of the substrate inspection contact 80 is pressed against the land 2. This makes it possible to absorb dimensional errors and assembly errors of the board inspection contact 80 or the coaxial cable 124, so that the electrical connection state of the board inspection contact 80 to the coaxial cable 124 can be ensured more reliably. can do.

  (10) In the above-described embodiment, the end of the outer conductor 124b of the coaxial cable 124 opposite to the end facing the end of the board inspection contact 80 is cut obliquely, and this obliquely cut portion You may make it solder the front end side to a predetermined conducting wire. By doing so, it is possible to secure a connection surface for connecting the conductor to the outer conductor of the coaxial cable 124 which is a fine member. Furthermore, by using the cross section of the outer conductor as the connection surface with the conductor, the conductor does not exceed the width of the coaxial cable even when the conductor is connected, and the conductor is connected with the minimum width that does not require an extra width. It is attached. For this reason, even if it connects conducting wire, it does not have the influence which interferes with the other adjacent coaxial cable. This also secures a space for the soldering work, and improves the workability of the work.

  (11) In the above embodiment, the base end surface of the pin body 811 (the end surface opposite to the sharpened portion 814) is a flat surface. Instead of this, the base end surface is tapered and sharpened, or is made spherical. May be. By doing so, the contact state of the pin main body 811 with respect to the inner conductor 124a in the coaxial cable 124 becomes substantially point contact. Therefore, even if an oxide film is formed on the end face of the inner conductor 124a, this oxide film can be contacted by point contact. It is possible to break through, and a reliable electrical connection state of the pin body 811 to the coaxial cable 124 can be obtained. Further, it is possible to prevent the end surface of the inner conductor 124a from being worn.

It is explanatory drawing of the side surface sectional view which shows one Embodiment of the board | substrate inspection apparatus with which the contactor for board | substrate inspection concerning this invention was applied. It is explanatory drawing of planar view of the board | substrate inspection apparatus shown in FIG. It is explanatory drawing for demonstrating an example of the electrical structure of the board | substrate inspection apparatus shown to FIG. 1 and FIG. It is explanatory drawing for demonstrating an example of a structure of a scanner. It is explanatory drawing of the side view which shows the state by which the said board | substrate test | inspection jig | tool is arrange | positioned by the upper test | inspection unit. It is a partial notch expansion exploded perspective view showing a 1st embodiment of a contact for board inspection. FIG. 7 is an assembled perspective view of the board inspection contact shown in FIG. 6. It is the II sectional view taken on the line of the contact shown in FIG. 7, (A) is a state immediately before the contact is pressed against the land, (B) is a state immediately after the contact is pressed against the land, (C) has shown the state which the top part of the pin contact | abutted to the electrode for pins. FIG. 9A is a side cross-sectional view showing a second embodiment of the substrate inspection contact, FIG. 9A is a state immediately before the substrate inspection contact is pressed against the land, and FIG. The state where the board inspection contact is pressed against the land is shown. FIG. 10A is a side cross-sectional view illustrating a third embodiment of a substrate inspection contact, FIG. 10A is a state immediately before the substrate inspection contact is pressed against the land, and FIG. The state where the board inspection contact is pressed against the land is shown.

Explanation of symbols

1 Device body 2 Land (inspection point)
21 Wiring pattern 4 Inspection unit 4D Lower inspection unit 4U Upper inspection unit 5 Transport table 6 Transport table drive mechanism 10 Board inspection device 124 Coaxial cable (lead wire)
124a Inner conductor 124b Outer conductor 127 Inspection processing section (board inspection section)
41 Substrate inspection jig 411 Lower guide plate (first plate)
412 Upper guide plate (second plate)
413 Cable support plate 414 Support member 71 Control unit 73 Tester controller 74 Scanner 80 Board inspection contact 81 Pin (first contact terminal)
811 Pin body 812 Insulating film 813 Annular projection 814 Sharp part 815 Pin body 816 Small diameter part 82 Pipe (second contact terminal)
821 Pipe body 822 Insulating coating (insulating layer)
823 Tapered portion 824 Annular caulking portion 83 Coil spring (biasing member)
B board (board to be inspected)

Claims (8)

One end is pressed against a predetermined inspection point set on the wiring pattern of the substrate to be inspected, and the other end is used to transmit an inspection signal to a predetermined substrate inspection unit to inspect the electrical characteristics of the substrate to be inspected. A contact for inspecting a substrate pressed against an electrode as a contact for detecting signal transmission,
A conductive rod-shaped first contact terminal;
A cylindrical second contact terminal that has electrical conductivity and is loosely fitted to the first contact terminal;
A biasing member that biases at least one of the first and second contact terminals in the axial direction toward the inspection point side;
The urging member is made of a conductive material and is provided only on the electrode side.   The contact member for board inspection according to claim 1, wherein the biasing member is interposed between the electrode and one or both of the first and second contact terminals.   The contact member for board inspection according to claim 1, wherein the biasing member biases the second contact terminal.   4. The contact for inspection of a substrate according to claim 1, further comprising an insulating layer on at least one of an outer peripheral surface of the first contact terminal and an inner peripheral surface of the second contact terminal. 5.   5. The substrate inspection contact according to claim 1, wherein the second contact terminal has a tapered portion that is tapered at a tip on the inspection point side. 6. . A substrate inspection jig for simultaneously pressing a plurality of substrate inspection contacts according to any one of claims 1 to 5 against the substrate to be inspected,
A first plate provided with a predetermined number of support holes through which each of the substrate inspection contacts is passed, and a second plate provided with the same number of fitting holes through which the substrate inspection contacts are passed. A substrate inspection jig comprising a base having a support member disposed in parallel with a predetermined distance between the first and second plates. A substrate inspection apparatus for inspecting electrical characteristics of the substrate to be inspected,
A substrate inspection jig according to claim 6,
The inner conductor and the outer conductor at one end are respectively connected to the respective base end surfaces of the first contact terminal and the second contact terminal of the substrate inspection contact supported by the substrate inspection jig, and the other end is A substrate inspection apparatus comprising the substrate inspection contact and a corresponding lead wire connected to a substrate inspection section.   8. The substrate inspection apparatus according to claim 7, wherein conductive rubber is interposed between the lead wire and each base end face of the first contact terminal and the second contact terminal.

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