KR20070117452A - Substrate inspection tool and substrate inspection device - Google Patents

Abstract

A substrate inspecting tool and a substrate inspecting device are provided to transmit an electric signal detected by a substrate inspecting armature to the substrate inspecting device by changing first and second pins into a conductive state through a receiving unit. A substrate inspecting tool(24) is composed of a substrate inspecting armature(22) of which one end is pressed and contacted to an inspecting point set on a wire pattern of a substrate and the other end is pressed and contacted to an electrode unit of a substrate inspecting device, and a support body(60) supporting the substrate inspecting armature and having a first guide hole(61) guiding one end of the armature to the inspecting point and a second guide hole(62) guiding the other end of the armature to the electrode unit. The substrate inspecting armature comprises a first conductive pin(22a) pressed to the inspecting point and slidably inserted through the first guide hole; a second conductive pin(22b) disposed along a coaxial line of the first pin with making one end face toward the other end of the first pin, pressed to the electrode unit, and slidably inserted through the second guide hole; and an elastic unit(22c) disposed between the other end of the first pin and one end of the second pin to connect the other end of the first pin and one end of the second pin and expanded and contracted in the direction of a major axis of the first or second pin. The support body is made of conductive materials and provided with a receiving unit(63) connecting at least each portion of the first and second pins. The first and second pins are electrically conducted through the receiving unit.

Description

Substrate Inspection Tool and Substrate Inspection Device

1 is an internal configuration diagram of a substrate inspection apparatus to which a jig for substrate inspection according to an embodiment of the present invention is applied.

FIG. 2 is a plan view of the substrate inspection device shown in FIG. 1. FIG.

FIG. 3 is a block diagram showing an electrical configuration of the substrate inspection apparatus shown in FIG. 1. FIG.

4 is a block diagram showing an electrical configuration of the scanner unit shown in FIG. 3;

FIG. 5 is a diagram schematically showing a configuration of a substrate inspection jig applied to the substrate inspection apparatus shown in FIG. 1. FIG.

6 is an essential part cross sectional view showing in detail the configuration of a substrate inspection jig shown in FIG. 5;

The exploded front view of the board | substrate inspection contact which comprises the board | substrate inspection jig | tool shown in FIG.

Fig. 8 is an enlarged view showing the connection between the connection portion and the base portion, (a) shows a case where the connection cross section is formed flat, and (b) shows a case where the connection cross section is formed in a curved shape.

9 is an essential part cross-sectional view showing a state in which a substrate inspection contact of the substrate inspection jig shown in FIG. 6 is removed.

Fig. 10 is a sectional view showing a state in which a substrate inspection contact 22 of an embodiment of the present invention is supported on a support.

Fig. 11 is a view showing another embodiment of the substrate inspection jig according to the present invention, (a) is a sectional view of an essential part showing a state of accommodating a substrate inspection contact, and (b) a state in which a substrate inspection contact is removed. Sectional view of the main part.

12 is an essential part cross sectional view showing a configuration of a conventional jig for testing a substrate.

(Explanation of symbols for the main parts of the drawing)

22: contactor for board inspection

24: jig for board inspection

60 support

61: first guide hole

62: second guide hole

Field of technology

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate inspection jig and a substrate inspection device, and more particularly, a substrate inspection jig and a substrate inspection jig having reduced resistance values of the substrate inspection contactor, which can be suitably used even in a miniaturized wiring pattern. It is about.

The inspection "substrate" used in the present invention includes a printed wiring board, a flexible wiring board, a multilayer wiring board, an electrode plate such as a liquid crystal display or a plasma display, or a package substrate or film carrier for a semiconductor package. .

Prior art

In recent years, fine pitch of wiring patterns has been advanced in order to increase the degree of integration of electrical components such as semiconductor devices and resistors mounted on a substrate. In such a board | substrate, the quality of the board | substrate is checked by measuring the resistance of a wiring pattern in the state of a bare board, before mounting an electrical component on a board | substrate.

For example, the board | substrate inspection contactor is electrically contacted between two lands which are the inspection points of the wiring pattern which a board has, the electric current of a predetermined level is applied to this wiring pattern, and the voltage which arises between those lands is measured. By comparing with the threshold, the quality of the electrical characteristics of the substrate is examined.

As a board | substrate test fixture applied to the board | substrate test | inspection apparatus which inspects such a board | substrate, for example, as shown in FIG. 12, for the board | substrate test | inspection whose one end is against the land L of the test | inspection board | substrate B. It has been proposed to consist of a contactor 200 and a guide plate 202 which supports the plurality of substrate inspection contacts 200 and guides them to a desired land L (inspection point) (for example, a patent Document 1).

Here, the substrate inspection contact 200 includes a compression coil disposed between the first fin body 204, the second fin body 206, and the first fin body 204 and the second fin body 206. It is composed of a spring (208). The guide plate 202 includes two support bodies 210 and 212 for supporting the first fin body 204, a spacer 214 for maintaining a distance between the two support bodies 210 and 212, and a second fin body. Two supports 216 and 218 that support 206, a spacer 220 that maintains a gap between the two supports 216 and 218, and two supports 222 that support the compression coil spring 208. 224).

As for the board | substrate inspection jig comprised in this way, the to-be-tested board B is a guide board in the state in which the end of the 1st pin body 204 of the board | substrate test contact 200 was abutted against the land L of the test board B. The compression coil spring 208 is compressed by being relatively pressed against the 202, so that one end of the first fin body 204 is elastically opposed to the land L of the test substrate B.

Patent Document 1: Japanese Patent Application Laid-Open No. 2001-41977

However, in the above conventional substrate inspection jig, since the first fin body 204 and the second fin body 206 are electrically connected through the compression coil spring 208, the first fin body 204 is compressed. The fitting portion of the coil spring 208, the second fin body 206, and the compression coil spring 208 needs to be considered reliably and must be electrically connected reliably.

For this reason, one end side of the compression coil spring 208 is press-fitted to the stepped portion provided in the first fin body 204. In addition, although the other end side of the compression coil spring 208 is arrange | positioned in the form pressurized from the 2nd fin body 206, the compression coil spring 208 and each fin body are only connected by fitting, and electrical connection is carried out. It was not stable.

In particular, in order to measure the recent miniaturized wiring pattern, there is a problem that it is impossible to determine whether the wiring pattern of the inspection board can be determined due to a slight difference in resistance value.

SUMMARY OF THE INVENTION The present invention has been made in view of such a situation, and provides a substrate inspection jig having a reduced resistance value of the substrate inspection contactor itself, which can be suitably utilized by reducing the resistance value of the substrate inspection contactor itself even in a miniaturized wiring pattern. do.

The invention according to claim 1, wherein one end is pressed against an inspection point set on a wiring pattern of a test target substrate, and the other end is pressed against an electrode portion of an inspection apparatus for inspecting a test target substrate, A substrate inspection contact having a support for supporting a substrate inspection contact and having a first guide hole for guiding one end of the contact to the inspection point and a second guide hole for guiding the other end of the contact to the electrode portion. As the jig, the contact point for inspecting the substrate has a conductive first pin which is pressed against the inspection point and slidably inserted into the first guide hole, and one end thereof faces the other end of the first pin. A conductive second pin arranged coaxially and pressed against the electrode and slidably inserted into the second guide hole, the other end of the first pin and one of the second pins It is arrange | positioned between the stages, and connects the other end of the said 1st pin and the one end of the said 2nd pin, and has the elastic part which expands and contracts in the longitudinal direction of the said 1st or 2nd pin, The said support body consists of a conductive material, An accommodation portion is formed for accommodating at least a portion of the first fin and at least a portion of the second fin so as to be connectable thereto, wherein the first fin and the second fin are electrically connected through the accommodation portion. A jig for inspecting a substrate is provided.

The invention according to claim 2, wherein the elastic portion is formed of a conductive member. The jig for inspection of a substrate according to claim 1 is provided.

The invention according to claim 3, wherein the first pin and the second pin have a circumferential shape, the elastic portion is composed of a compression coil spring, and the first pin, the second pin, and the elastic portion have approximately the same diameter. Provided is a jig for inspection of a substrate according to claim 1 or 2.

The invention according to claim 4, wherein the elastic portion is made of a compression coil spring, and the first pin has a first fitting portion for inserting one side of the compression coil spring, and the second pin includes: The board | substrate inspection jig of any one of Claims 1-3 characterized by having the 2nd fitting part which penetrates the other side of a compression coil spring.

The invention according to claim 5, wherein the housing portion is formed in a cylindrical shape and is fixed at a predetermined position in the support. The substrate inspection jig according to claim 1 is provided.

Invention of Claim 6 is a board | substrate inspection apparatus which inspects the quality of a test | inspection board | substrate by measuring the electrical characteristic of a board | substrate to test, The jig for board | substrate inspection of any one of Claims 1-5. And a board | substrate test | inspection part which judges the quality of the said board | substrate to be tested based on the electrical signal detected from the board | substrate to be tested by the board | substrate test | inspection contact of the said board | substrate test jig.

BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described.

BRIEF DESCRIPTION OF THE DRAWINGS It is an internal block diagram of the board | substrate inspection apparatus with which the board | substrate inspection jig | tool using the board | substrate inspection contact which concerns on one Embodiment of this invention is shown, and FIG. In addition, the drawing has shown the coordinate axis for clarifying a direction. The board | substrate test | inspection apparatus 10 to which the board | substrate inspection jig which concerns on this invention was applied is in the roughly intermediate position of the front side (-Y direction) and the back side (+ Y direction) in the inside of the body 12 which shows roughly rectangular parallelepiped shape. The inspection part 14 which inspects both parts of the test | inspection board | substrate B which were arrange | positioned, and the test | inspection board | substrate B before the test start set in front side and the back side of the main body 12 are arrange | positioned, The conveyance mechanism part 16 which conveys to the test | inspection part 14 and the board | substrate B after test | inspection after completion | finish of inspection from the test | inspection part 14 to the front side side is provided.

The inspection part 14 is arrange | positioned in each of the upper side (+ Z direction) and the lower side (-Z direction) of the to-be-tested board B, and inspects the quality of the wiring pattern provided in the front and back of the board | substrate B to be tested. The inspection unit 20 is provided. This inspection unit 20 is a substrate inspection jig provided with a plurality of (eg 200) substrate inspection contacts (probes) 22 which abut against the land of the wiring pattern of the inspection target board B ( 24 and the jig | tool 24 for board | substrate test | inspection, the horizontal direction (X direction) of the board | substrate test apparatus 10, the front-back direction (Y direction) of the board | substrate test apparatus 10, and the up-down direction of the board | substrate test apparatus 10 ( And a jig drive mechanism 26 for rotating the substrate inspection jig 24 around the axis extending in the vertical direction.

The conveyance mechanism part 16 is a ball screw which moves the conveyance table 30 on which the test | inspection board | substrate B is mounted, and the conveyance table 30 in the front-back direction (Y direction) by screwing the nut part 32 ( 34 and a pair of guide rails 36 arranged parallel to the ball screw 34 to guide the conveying table 30 to move in accordance with the rotation of the ball screw 34 and the ball screw 34. By rotationally driving, the motor 38 which is drive-controlled by the operation control part 40 mentioned later is provided.

In addition, through-opening of the illustration not shown for making the board | substrate test contact 22 of the board | substrate test jig 24 contact the land of the wiring pattern on the back surface of the board | substrate B to a suitable place of the conveyance table 30. FIG. (開口) is formed.

3 is a block diagram showing the electrical configuration of the substrate inspection apparatus 10.

The board | substrate test | inspection apparatus 10 is equipped with the microcomputer which consists of CPU, ROM, RAM, etc., The operation control part 40 which controls the operation | movement of the whole apparatus in accordance with the program previously memorize | stored in ROM, and the test board B Two substrate inspection contacts abutting the two lands L positioned at both ends of the wiring pattern to be inspected by scanning a plurality of substrate inspection contacts 22 abutted against the lands L of the wiring pattern (). 22 is sequentially selected, and the scanner unit 42 receives the inspection start command from the operation control unit 40 and the scanner unit 42 for outputting an inspection signal to the selected two substrate inspection contacts 22. And a tester controller 44 for outputting a scan command to the control panel, and an operation panel 46 having an input unit for inputting a command from an operator, a display for displaying a test result of a wiring pattern, or the like. Moreover, the scanner part 42 and the tester controller 44 comprise the board | substrate test | inspection part 48 which test | inspects the electrical characteristic of the board | substrate B to be tested.

4 is a block diagram showing the electrical configuration of the scanner section 42.

The scanner section 42 generates a current that serves as a constant current source for outputting a predetermined level of measurement current between two lands L connected to both ends of the wiring pattern C disposed on the inspection target board B. A voltage measuring unit 52 for measuring a voltage generated between the unit 50, a predetermined level of the current for measurement, and the land L when a current flows in the wiring pattern C, and a jig for testing a substrate ( 24 includes a switch array for connecting the current generating unit 50 and the voltage measuring unit 52 between a pair of substrate inspecting contacts 22 selected from the plurality of substrate inspecting contacts 22 included in the substrate. A changeover switch 54 and an inspection processor 56 for outputting a changeover control signal to the changeover switch 54 are provided. The inspection processing section 56 compares the voltage measured by the voltage measuring section 52 with a predetermined reference voltage to determine whether or not the inspection target substrate B to be inspected (the conduction state of the wiring pattern C in the conducting state). It also has a function of determining the, and transmits the result of the determination to the tester controller 44.

FIG. 5 is a sectional view of principal parts schematically showing the configuration of the substrate inspection jig 24. In addition, since the test | inspection unit 20 arrange | positioned at the upper side and the lower side is made into the same structure except the arrangement structure of the board | substrate test | inspection contact 22, here, of the test | inspection unit 20 arrange | positioned below, The structure of the board | substrate inspection jig | tool 24 is demonstrated.

The board | substrate inspection jig | tool 24 is arrange | positioned in parallel with each other in the predetermined | prescribed arrangement state corresponding to the wiring pattern of the board | substrate B to test | inspection, and electroconductivity for testing the electrical characteristics of the board | substrate B to be tested. The plurality of needle-like substrate inspection contacts 22 formed of the material are supported by the support 60 formed of an insulating material such as synthetic resin.

The support body 60 includes a first guide hole 61 for guiding one end of the substrate inspection contact 22 to the land L of the predetermined inspection target board B, and the substrate inspection contact 22. A second guide hole 62 is formed to guide the other end of the to the predetermined electrode portion 70. By providing the first guide hole 61 and the second guide hole 62, both ends of the substrate inspection contact 22 can be brought into contact with the predetermined inspection point L and the predetermined electrode portion 70. .

One end of each of the substrate inspection contacts 22 is exposed to the outside from the support 60, and is elastically (or pressure-contacted) to the land L of the substrate B to be inspected, respectively. Moreover, the other end of each board | substrate test | inspection contact 22 is pressed against (or elastically) abuts each electrode part 70 arrange | positioned at the electrode plate 68 arrange | positioned facing the support body 60. As shown in FIG.

Moreover, the cable 72 arrange | positioned corresponding to each board | substrate inspection contact 22 is connected to each electrode part 70, and is predetermined between a predetermined pair of lands L through the board | substrate inspection contact 22. As shown in FIG. While supplying a current for measurement, the voltage between the pair of lands L can be measured. This cable 72 is connected to the board | substrate inspection apparatus.

The operation of the substrate inspection apparatus 10 configured as described above will be described with reference to FIG. 3 or FIG. 5. First, the operation | movement of the conveyance mechanism part 16 and the jig | drive tool 26 is controlled, and each board | substrate test | inspection contactor 22 is connected to the land L of each wiring pattern of the to-be-tested board | substrate B mounted in the conveyance table 30. FIG. The measuring stages of) are butted together.

Then, based on the scan command from the tester controller 44, as long as the scanner portion 42 is scanned and abuts on the pair of lands L located at both ends of the wiring pattern to be inspected of the inspection target board B. The pair of substrate inspection contacts 22 is selected.

The port P1 of the changeover switch 54 to which the substrate inspection contactor 22, which abuts on one of the lands L of the pair of lands L, is connected via the cable 72, and the other land ( The port P2 of the changeover switch 54 in which the substrate-contacting contact 22 contacting L) is connected via the cable 72 is selected, and current is generated between these ports P1 and P2. The unit 50 and the voltage measuring unit 52 are connected.

Subsequently, the measurement current I is applied from the current generating unit 50 to the wiring pattern between the pair of lands L of the substrate B to be inspected through the port P1 and the port P2. The voltage V between the pair of lands L is measured by the voltage measuring unit 52. This voltage V is represented by V = R × I when the resistance of the wiring pattern is set to R. FIG. When the voltage V measured by this voltage measuring part 52 is compared with the predetermined reference voltage Vf in the test | inspection process part 56, and the voltage V exceeds the reference voltage Vf (V > The conduction state of the wiring pattern is good when it is determined that the conduction state of the wiring pattern is poor (some of the conductors fall off) at Vf and the voltage V is less than or equal to the reference voltage Vf (V≤Vf). Is determined. This determination result is transmitted to the tester controller 44.

Then, when the determination result is good, the scanner unit 42 is scanned and inspected next to the inspection target board B based on a scan command from the tester controller 44 to inspect the next wiring pattern. A pair of board | substrate test | inspection contactors 22 which contact | connects a pair of land L located in the both ends of the wiring pattern to be made are selected, and the following wiring pattern is examined as mentioned above. On the other hand, when the determination result is defective, a signal indicating that the inspection target substrate B to be inspected is defective is output from the tester controller 44 to the operation controller 40, and the inspection is performed on the display of the operation panel 46. The indication that the board | substrate B is defective is performed. The test | inspection board | substrate B will be test | included by this time point.

FIG. 6 is an enlarged cross-sectional view of an essential part shown in FIG. 5, and FIG. 7 illustrates a substrate inspection contact used as a substrate inspection jig according to the present invention, (a) is an exploded view, and (b) ) Is an assembly diagram. 8 is a sectional view of an essential part of a support when a contact for a substrate inspection is removed;

In addition, in this embodiment, the support body 60 is formed with five plate-shaped members which consist of the 1st or 5th support part 60a or 60e, However, you may form more sheets, and the accommodating part mentioned later As long as it is provided in the inside and can support a contactor for board | substrate inspection, you may form in small numbers.

Although the support body 60 will mention later in detail, this support body 60 has the 1st guide hole 61 and the 2nd guide hole 62 which guide the contactor 22 for board | substrate inspection, and also the board | substrate test | inspection contact 22 is carried out. It is necessary to have the accommodating part 63 accommodated inside.

Although the diameter of this 1st guide hole 61 is formed, for example from 0.1 to 0.25 mm, if the diameter of this 1st guide hole 61 has the diameter which a 1st pin mentioned later can slide, It is not specifically limited.

In the board | substrate inspection jig | tool 24 shown in FIG. 6, the board | substrate inspection contact 22 is inserted into the 1st guide hole 61 and the 2nd guide hole 62 formed in the support body 60. As shown in FIG.

This board | substrate inspection contact 22 is demonstrated.

As shown in FIG. 7, in the board | substrate test fixture 24 of this invention, it has the 1st pin 22a, the 2nd pin 22b, and the elastic part 22c.

The 1st pin 22a has the shape of a thin rod shape which has the one end which contacts (press-contacts) the land L, and the other end connected to the elastic part 22c. It is preferable that the one end which abuts on the land L of the 1st pin 22a has a thin shape as shown in FIG. This is because when the land L has an oxide film, the oxide film can be destroyed and reliably contacted with the land L.

The first pin 22a has a tip that abuts on the land L and is slidably inserted into the first guide hole 61. The first fin 22a is formed of a conductive material such as tungsten (W) or beryllium copper (BeCu).

The first pin 22a shown in FIG. 7 is fitted into one end of the slide portion 22e, the base portion 22f, and the elastic portion 22c that slide in the first guide hole 61. And the fitting part 22d connected.

The sliding portion 22e is formed in a cylindrical shape having a diameter slightly smaller than that of the first guide hole 61, and the tip thereof has a shape that is thin so that the oxide film of the land L can be destroyed. Do.

The base portion 22f is formed in a cylindrical shape having a diameter larger than the sliding portion 22e while adjusting the length so that the first pin 22a has a desired length. By being formed in this way, a step | step is formed between the slide part 22e and the base part 22f. As a result, by using this step | step, it can prevent that the board | substrate inspection contact 22 escapes outward from the support body 60. As shown in FIG.

The fitting part 22d has a diameter smaller than the diameter of the base part 22f. The connection method is appropriately changed depending on the shape and the material of the elastic part 22c.

For example, in the case where the elastic portion 22c is the compression coil spring shown in Fig. 7, it is formed to have a diameter equal to or slightly larger than the inner diameter of the compression coil spring, and the compression coil spring is fitted to the fitting portion 22d. Both are connected. In the case where the compression coil spring is inserted into the fitting part 22d, the diameter of the fitting part 22d may be large so that the compression coil spring may be considered in the fitting part 22d, and the compression coil spring may be loosely fitted. The diameter of the fitting part 22d may be formed.

As shown in Fig. 8A, the connection portion B between the fitting portion 22d and the base portion 22f has a flat connection end face fa of the base portion 22f, and the fitting portion B is flattened. It is formed to be perpendicular to the portion 22d. In this case, the edge part of the elastic part 22c can be made to contact this connection end surface fa, for example.

In addition, as shown in Fig. 8B, the connection end face fb of the base portion 22f may be formed to be bent, and may be formed to be smoothly continuous with the fitting portion 22d. In this case, for example, wear of the elastic portion 22c when the end portion of the elastic portion 22c is in contact with each other can be reduced.

Since the dimension of this 1st pin 22a depends on the magnitude | size of the board | substrate used as the test object, and the magnitude | size of the land L, it is not specifically limited, For example, the sliding part 22e is 3-4 lengths in length. Mm and a diameter of 0.05 to 0.2 mm, the base portion 22f is a length of 5 to 8 mm and a diameter of 0.15 to 0.25 mm, and the fitting portion 22d is formed of the base portion 22f when the elastic portion is connected. It is formed so that it will not become larger than diameter and length will be as long as possible.

The second pin 22b is disposed coaxially with one end facing the other end of the first pin, and slides inside the second guide hole 62. Similarly to the first fin 22a, the second fin 22b is formed of a conductive material such as tungsten (W) or beryllium copper (BeCu).

The second pin 22b shown in FIG. 7 has a tip that comes in contact with (presses) the electrode portion 70 of the substrate inspection apparatus, and a slide portion slidably inserted into the second guide hole 62. 22g), the base part 22i, and the fitting part 22h connected with the elastic part 22c.

The slide portion 22g is formed in a circumferential shape with a diameter slightly smaller than that of the second guide hole 62, and the tip thereof has a thin end shape so that the oxide film of the electrode portion 70 can be destroyed. desirable.

The base portion 22i is formed in a cylindrical shape having a diameter larger than the slide portion 22g while adjusting the length of the second pin 22b. By being formed in this way, a step | step difference is formed between the slide part 22g and the base part 22i. As a result, by using this step | step, it can prevent that the board | substrate inspection contact 22 escapes outward from the support body 60. As shown in FIG.

Since the size of the second fin 22b depends on the size of the substrate to be inspected and the size of the land L, the size is not particularly limited. For example, the slide portion 22g has a length of 0.5 to 2 mm. And a diameter of 0.05 to 0.2 mm, the base portion 22i is a length of 2 to 4 mm and a diameter of 0.15 to 0.25 mm, and the fitting portion 22h is larger than the diameter of the base portion 22i when the elastic portion is connected. It does not become large and the length is formed to be as long as possible.

As shown in FIG. 7, the 1st pin 22a and the 2nd pin 22b which are shown in this Example are formed longer than the 2nd pin 22b. In addition, although the dimension can be employ | adopted as mentioned above, the length of the 1st pin 22a and the 2nd pin 22b is the length adjusted suitably according to the length of the support body 60, and is not specifically limited.

The elastic part 22c is arrange | positioned between the 1st pin 22a and the 2nd pin 22b, and the fitting part 22d of the 1st pin 22a and the fitting part 22h of the 2nd pin 22b. ), Respectively. Moreover, this elastic part 22c expands and contracts along the longitudinal direction of the board | substrate inspection contact 22. As shown in FIG. For this reason, when the 1st pin 22a and the 2nd pin 22b are pressed by the land L of the test | inspection board | substrate B, and the electrode part 70, the force which acts toward an outer side will act. As a result, the board | substrate inspection contact 22 presses the land L and the electrode part 70, and can contact reliably.

The elastic portion 22c is not particularly limited as long as it can be expanded and contracted in the long axis direction as described above, but it is preferable to use a compression coil spring as shown in FIG. 7. This is because by using the compression coil spring, it can be easily latched by inserting into the respective fitting portions of the first pin 22a and the second pin 22b.

In addition to the compression coil spring, as the elastic portion 22c, a synthetic resin or rubber having elasticity can be used.

It is preferable that this elastic part 22c is formed of an electroconductive member. This is because the elastic part 22c is formed of a conductive member, so that the first pin 22a and the second pin 22b can be electrically connected.

As shown in Fig. 7B, the substrate inspection contact 22 used in the present invention has a first pin 22a, a second pin 22b, and an elastic portion 22c, and is elastic The portion 22c is disposed between the first pin 22a and the second pin 22b, so that the land 22c of the first pin 22a and the electrode portion 70 of the second pin 22b are inward. At the time of pressurization, the elastic portion 22c is brought into a biased state. For this reason, the elastic part 22c presses the land L and the electrode part 70.

The elastic portion 22c is formed with an outer diameter of 0.15 to 0.25 mm and an inner diameter of 0.1 to 0.2 mm, and can be formed with a length of 4 to 5 mm, but is not particularly limited.

9 is a schematic cross-sectional view showing the support. As shown in FIG. 9, the support 60 is provided with a housing portion 63. This accommodating part 63 can accommodate the board | substrate inspection contact 22 inside (refer FIG. 6). This accommodating part 63 has electroconductivity by giving an electroconductive member or an electroconductive film (gold plating process) to an inner surface. Moreover, this accommodating part 63 accommodates at least one part of the 1st pin 22a and the 2nd pin 22b.

In this manner, the accommodating portion 63 is conductive while accommodating at least a portion of the first fin 22a and the second fin 22b, and thus the first fin 22a and the second fin 22b. Can be electrically connected.

As a result, the electrical signal which the front end of the sliding part 22e of the 1st pin 22a detects is transmitted to the front end of the sliding part 22g of the 2nd pin 22b via the accommodating part 63. FIG. It becomes possible.

This accommodating part 63 is formed in cylindrical shape, and has the inner diameter slightly larger than the outer diameter of the board | substrate inspection contact 22. As shown in FIG. 6, this accommodating part 63 is arrange | positioned at the 3rd support part 60c and the 4th support part 60d, and also the lower part of the 1st pin 22a, and the elastic part ( It is arrange | positioned so that the upper part of 22c and the 2nd pin 22b may be accommodated.

In addition, it is preferable that the clearance (gap) of this accommodating part 63 and the board | substrate inspection contact 22 is formed in 1-10 micrometers. By forming the gap within this range, the substrate inspection contact 22 can be easily detached from the accommodating portion 63, and the substrate inspecting contact 22 is accommodated in the accommodating portion 63. This is because the first fin 22a and the second fin 22b come into contact with the inner surface of the receiving portion 63.

The accommodating part 63 shown in this FIG. 9 is arrange | positioned at the 3rd support part 60c and the 4th support part 60d. In this case, for example, a space in which the housing portion 63 can be disposed is formed in the third support portion 60c and the fourth support portion 60d, and the third support portion 60c or the fourth support portion 60d is formed. The accommodating part 63 can be attached to any one of, and the accommodating part 63 can be arrange | positioned in the support body 60 by overlapping the 4th support part 60d or the 3rd support part 60c after that.

As mentioned above, the 1st guide hole 61 guides the one end of the board | substrate inspection contact 22 to the predetermined land L. As shown in FIG. The 1st guide hole 61 shown in this FIG. 9 is formed in the 1st support part 60a. Although the length of this 1st guide hole 61 is suitably set by the thickness of the 1st support part 60a, it is not specifically limited, The predetermined land L reliably secures one end of the board | substrate inspection contact 22. It does not matter if I can guide you to.

The 2nd guide hole 62 shown in FIG. 9 is formed in the 5th support part 60e. Although the length of this 2nd guide hole 62 is suitably set by the thickness of the 5th support part 60e, it is not specifically limited, The predetermined electrode part 70 ensures the other end of the board | substrate inspection contact 22 reliably. It does not matter if I can guide you to.

In addition, the hole diameter of these 1st guide hole 61 and the 2nd guide hole 62 is a board | substrate inspection contact as much as possible, in order to guide the board | substrate inspection contact 22 as mentioned above to a predetermined position. It is preferable to be formed to be the same as 22) and to be as short as possible in the thickness direction of the support 60. By forming in this way, since the length in the thickness direction of the 1st guide hole 61 and the 2nd guide hole 62 is formed short, the place where the board | substrate inspection contact 22 contacts with the support body 60 is reduced. It is possible to prevent the wear of the substrate inspection contact 22 and / or the support 60 due to the friction caused by the contact.

As shown in FIG. 9, the 2nd support part 60b has the space which has a diameter larger than the diameter of the 1st guide hole 61, and the board | substrate inspection contact 22 is elastic at the time of use. Even if sliding by the part 22c prevents contact and wear. The size and length of this space change depending on the size and shape of the substrate inspection contact 22. Further, a plurality of protrusions having a diameter substantially the same as or slightly larger than the diameter of the substrate inspection contact 22 may be provided at a plurality of positions, and may be a guide portion (not shown) for guiding the sliding direction of the substrate inspection contact 22. have.

This space is not only formed in the second support part 60b, but may be formed in the first support part 60a or may also be formed in the third support part 60c. Moreover, you may provide in the 4th support part 60d and the 5th support part 60e.

10 is a cross-sectional view showing a state in which the substrate inspection contact 22 of the embodiment of the present invention is supported on a support. As shown in FIG. 10, an inspection plate B is placed on one side of the substrate inspection jig 24 and an electrode plate electrically connected to the substrate inspection device on the other side of the substrate inspection jig 24. The electrode portion 70 of 68 is connected.

In this case, one end of the substrate inspection contact 22 is against the land L, and the other end of the substrate inspection contact 22 is against the electrode portion 70 and is pressed from both sides. For this reason, the elastic part 22c is reduced and it is in a pseudo state. As a result, the repulsive force in the outward direction acts on the first fin 22a and the second fin 22b, the first fin 22a is the land L, and the second fin 22b is the electrode portion ( 70) is pressed.

Moreover, even in such a state, a part of the 1st pin 22a is in contact with the accommodating part 63 because there is little clearance (clearance) between the accommodating part 63 and the 1st pin 22a, and it becomes a conduction state. . Moreover, since the clearance gap between the accommodating part 63 and the 2nd pin 22b is also small, a part of 2nd pin 22b contacts with the accommodating part 63, and becomes a conduction state. As a result, the 1st pin 22a and the 2nd pin 22b will be in the conductive state through the accommodating part 63. FIG.

In addition, when actually using the board | substrate inspection jig | tool 24, the board | substrate inspection jig | tool 24 is mounted on the electrode plate 68, and the position is placed so that each electrode part 70 and the 2nd pin 22b may contact. After matching, the position is adjusted so that the land L which is the test | inspection point of the test | inspection board | substrate B contacts the 1st pin 22a.

Fig. 11 is a view showing another embodiment of the substrate inspection jig, Fig. 11 (a) shows a state where the substrate inspection contact is accommodated, and (b) shows a state where the substrate inspection contact is removed. In the board | substrate inspection jig | tool 24 'shown by FIG. 11, the accommodating part 63' is formed from the 2nd support part 60b to the 4th support part 60d. Thus, by forming the accommodating part 63 'elongate in the thickness direction of the support body 60, the contact area of the 1st pin 22a and the 2nd pin 22b can be enlarged.

By providing these inventions, the following effects are produced.

According to the invention as set forth in claim 1, since the first pin and the second pin are brought into a conductive state through the housing, the substrate inspection jig capable of reliably transmitting the electrical signal detected by the substrate inspection contactor to the substrate inspection device. To provide.

According to the invention of claim 2, since the elastic portion is formed of a conductive member, the jig for inspection of the substrate can be transmitted to the substrate inspection apparatus more reliably and more accurately.

According to the invention as set forth in claim 3, since the first pin and the second pin are formed in a circumferential shape, and the elastic portion is formed by the compression coil spring, the jig for testing a substrate having a highly flexible substrate inspection contact is provided. Can provide.

According to the invention as set forth in claim 4, since the fitting part which can insert the compression coil spring which is an elastic part is formed in the 1st pin and the 2nd pin, for board | substrate inspection provided with the board | substrate inspection contact which has an easy structure. Jig can be provided.

According to invention of Claim 5, since the accommodating part is formed in cylindrical shape and is fixed to the support body, the contactor for board | substrate test | inspection can be attached and detached easily from a support body. For this reason, for example, by separating the 1st support part or 5th support part of a present Example from a support body, it becomes possible to perform the exchange | exchange of the board | substrate inspection contact | exchange easily.

According to invention of Claim 6, since it is a board | substrate inspection apparatus using the board | substrate inspection jig of any one of Claims 1-4, the 1st pin and 2nd pin which comprise a board | substrate inspection contact are Since it is brought into a conductive state through the receiving portion, a substrate inspection apparatus capable of reliably and accurately transmitting electrical signals detected by the substrate inspection contact is provided.

Claims (6)

One end is pressed against the inspection point set on the wiring pattern of the inspection target board, the other end is pressed against the substrate inspection contactor which is pressed against the electrode portion of the inspection apparatus for inspecting the inspection target board, and the substrate inspection contactor is supported. And a support having a first guide hole for guiding one end of the contact to the inspection point and a second guide hole for guiding the other end of the contact to the electrode portion. The contact for the substrate inspection, A conductive first pin squeezed to the inspection point and slidably inserted into the first guide hole; A conductive second pin disposed coaxially with one end facing the other end of the first pin and being squeezed into the electrode and slidingly inserted into the second guide hole; An elastic part disposed between the other end of the first pin and one end of the second pin, and connecting the other end of the first pin and one end of the second pin, and an elastic part to stretch in the longitudinal direction of the first or second pin; Has, The support, An accommodation portion made of a conductive material and configured to receive at least a portion of the first fin and at least a portion of the second fin so as to be connectable thereto; And the first pin and the second pin are electrically conducting through the housing portion. The method of claim 1, The said elastic part is formed with an electroconductive member, The board | substrate inspection jig characterized by the above-mentioned. The method according to claim 1 or 2, The first pin and the second pin has a cylindrical shape, the elastic portion is made of a compression coil spring, The said 1st pin, the said 2nd pin, and the said elastic part have the substantially same diameter, The board | substrate inspection jig | tool. The method according to any one of claims 1 to 3, The elastic portion is made of a compression coil spring, The said 1st pin has a 1st fitting part which presses in one side of the said compression coil spring, and the said 2nd pin has a 2nd fitting part which presses in the other side of the said compression coil spring. Jig. The method of claim 1, The receiving portion is formed in a cylindrical shape, and is fixed to a predetermined position in the support, the substrate inspection jig. A substrate inspection apparatus for inspecting the quality of a substrate under test by measuring electrical characteristics of the substrate under test, The jig for inspection of a substrate according to any one of claims 1 to 5, The board | substrate test | inspection apparatus which has a board | substrate test | inspection part which determines the quality of the said board | substrate to be inspected by the board | substrate test | inspection contact of the said board | substrate test jig, based on the electrical signal detected from the board | substrate to test.

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