200804826 (1) 九、發明說明 【發明所屬之技術領域】 本發明，係爲有關於基板檢查用治具以及基板檢查裝 置，更詳細而言，係爲有關於一種就算是對被細微化之配 線圖案，亦能合適的使用，並減低了基板檢查用接觸子本 ^ 身之電阻値的基板檢查用治具以及基板檢查用治具。 另外，在本發明中之所謂的檢查『基板」，係爲包含 Φ 有印刷配線基板、可撓性配線基板、多層配線基板、液晶 顯示器或是電漿顯示器用等之電極板、或者是半導體封裝 用之封裝基板或是薄膜載體（film carrier )等者。 【先前技術】 近年來，由於被搭載於基板之半導體元件或是電阻器 等之電性構件的積體度之提昇，配線圖案之節距細微化係 在進行。在此種基板中，藉由在將電性構件搭載於基板上 φ 之前的裸板之狀態下，測定配線圖案之電阻，而檢查基板 之電性特性的良好與否。 例如，在身爲基板所具有之配線圖案的檢查點之2處 的銲墊間，使基板檢查用接觸子作電性接觸，並對此配線 圖案施加特定準位之電流，而對在此些銲墊之間所產生之 電壓作測定，並與臨界値作比較，藉由此來檢查基板之電 '性特性的良好與否。 作爲適用於進行此種基板之檢查的基板檢查裝置中之 基板檢查用治具，提案有例如如圖1 2所示，由其中一端 -4- 200804826 , · (2) 被抵接於檢查基板之銲墊L的複數之基板檢查用接觸子 200，和在將此複數之基板檢查用接觸子200作保持的同 時，將其導引至所期望之銲墊L (檢查點）的導引板202 所構成者（例如，專利文獻1 )。 ' 於此，基板檢查用接觸子200，係爲由第1銷體204 ' 、和第2銷體206、和被配設在第1銷體204與第2銷體 206之間的壓縮線圈彈簧208所構成者。導引板202，係 φ 爲由將第1銷體204作保持之2個的保持體210、212 ;和 將2個的保持體2 1 0、2 1 2之間隔作保持的間隔物2 1 4 ;和 將第2銷體206作保持之2個的保持體2 1 6、21 8 ;和將2 個的保持體2 1 6、2 1 8之間隔作保持的間隔物220 ;和將壓 縮線圈彈簧20 8作保持之2個的保持體222、224所構成 者。 此種構成之基板檢查用治具，係在基板檢查用接觸子 200之第1銷體204的其中一端被抵接於檢查基板B之銲 • 墊L的狀態下，藉由被檢查基板B之對於導引板202而相 對性的被推壓，使得壓縮線圈彈簧208被壓縮，藉由此， 使第1銷體207之其中一端成爲彈性抵接於檢查基板B之 銲墊L。 〔專利文獻1〕日本特開2001-41977號公報 然而，在上述之先前的基板檢查治具中，由於第1銷 體2 04與第2銷體206係經由壓縮線圈彈簧208而被電性 連接，因此係有必要將第1銷體204與壓縮線圈彈簧208 、以及第2銷體206與壓縮線圈彈簧208之嵌合部確實地 -5- 200804826 (3) 固定接著，同時確實地作電性連接。 因此，壓縮線圈彈簧208之其中一端側，係被壓入至 被設置於第1銷體204的階段差部分。又，壓縮線圈彈簧 2〇8之另外一端側，雖係以從第2銷體206而被推壓之形 ' 態而被配置，但是壓縮線圈彈簧208與各銷體係僅是藉由 * 嵌合而被連接，其電性連接係並非爲安定者。 特別是，爲了對近年之細微化的配線圖案作測定，會 φ 有無法藉由極小之些許的電阻値之差，而進行對檢查基板 之配線圖案的良好與否作判定的問題。 【發明內容】 〔發明所欲解決之課題〕 本發明，係爲有鑑於此種實情而進行者，其目的，係 在於提供一種：就算是對被細微化之配線圖案，亦能使基 板檢查用接觸子本身之電阻値減低並合適的使用的減低了 • 基板檢查用接觸子本身之電阻値的基板檢查用治具。 〔用以解決課題之手段〕 申請專利範圍第1項所記載之發明，係爲提供一種基 板檢查用治具，其係具備有：基板檢查用接觸子，其係將 一端壓接於被檢查基板之配線圖案上所設定的檢查點，並 將另一端壓接於對被檢查基板作檢查之檢查裝置的電極部 ;和保持體，其係將前述基板檢查用接觸子作保持，同時 具備有將該接觸子之其中一端導引至前述檢查點之第1導 -6- 200804826 (4) 引孔，以及將該接觸子之另外一端導引至前述電極部之第 2導引孔，其特徵爲：前述基板檢查用接觸子，係具備有 :在被壓接於前述檢查點的同時，被可滑動地插通於前述 第1導引孔內的導電性之第1銷；和將其中一端以朝向前 ^ 述第1銷之另外一端的方式而同軸狀地配置，並在壓接於 ' 前述電極部的同時，被可滑動地差通於前述第2導引孔內 的導電性之第2銷；和在被配置於前述第1銷的另外一端 φ 與前述第2銷的其中一端之間的同時，將該第1銷的另外 一端與該第2銷的其中一端相連接，而在前述第1又或是 第2銷之長軸方向作伸縮的彈性部，前述保持體，係由導 電性材料所成，並被形成有將至少前述第1銷之一部分與 至少前述第2銷之一部分可連接地作收納的收納部，前述 第1銷與前述第2銷，係經由前述收納部而被作電性導通 〇 申請專利範圍第2項所記載之發明，係爲提供一種如 φ 申請專利範圍第1項所記載之基板檢查用治具，其中，前 述彈性部，係爲以導電性構件所形成。 申請專利範圍第3項所記載之發明，係爲提供一種如 申請專利範圍第1項又或是第2項所記載之基板檢查用治 ' 具，其中，前述第1銷與第2銷係具有圓柱形狀，前述彈 性部係由壓縮線圈彈簧所成，前述第1銷、前述第2銷與 前述彈性部，係具備有略微相同之直徑。 申請專利範圍第4項所記載之發明，係爲提供一種如 申請專利範圍第1項乃至第3項中之任一項所記載之基板 200804826 (5) 檢查用治具，其中，前述彈性部係由壓縮線圈彈簧所成’ 前述第1銷，係具備有嵌入前述壓縮線圏彈簧之其中一方 的第1嵌入部，而前述第2銷，係具備有嵌入前述壓縮線 圈彈簧之另外一方的第2嵌入部。 ' 申請專利範圍第5項所記載之發明，係爲提供一種如 ' 申請專利範圍第1項所記載之基板檢查用治具，其中，前 述收納部，係被形成爲筒狀，並被固定於前述保持體之特 定位置內。 申請專利範圍第6項所記載之發明，係爲提供一種基 板檢查裝置，其係爲藉由測定被檢查基板之電性特性，而 對被檢查基板之良好與否作檢查的基板檢查裝置，其特徵 爲，具備有：如申請專利範圍第1項乃至第5項中之任一 項所記載之基板檢查用治具；和經由前述基板檢查用治具 之基板檢查用接觸子，根據由被檢查基板所檢測出之電性 訊號，而對該被檢查基板之良好與否作判定的基板檢查部 •。 藉由提供此些之發明，而解決上述的課題。 〔發明效果〕 若藉由申請專利範圍第1項所記載之發明，則由於第 1銷與第2銷係經由收納部而成爲導通狀態，因此係提供 一種能將基板檢查用接觸子所檢測出之電性訊號確實地傳 達至基板檢查裝置的基板檢查用治具。 若藉由申請專利範圍第2項所記載之發明，則由於彈 -8- (6) (6)200804826 性部係爲由導電性構件所形成，因此係提供一種能將基板 檢查用接觸子所檢測出之電性訊號更確實且更正確地傳達 至基板檢查裝置的基板檢查用治具。 若藉由申請專利範圍第3項所記載之發明，則由於第 1銷與第2銷係被形成爲圓柱形狀，且彈性部係藉由壓縮 線圈彈簧所形成，因此係能提供一種具備有滑動性高之基 板檢查用接觸子的基板檢查用治具。 若藉由申請專利範圍第4項所記載之發明，則由於在 第〗銷與第2銷，係被形成有可將身爲彈性部之壓縮線圈 彈簧作嵌入的嵌入部，因此係能提供一種具備有簡易之構 成的基板檢查用接觸子的基板檢查用治具。 若藉由申請專利範圍第5項所記載之發明，則由於收 納部係被形成爲筒狀，並被固定於保持體，因此能將基板 檢查用接觸子簡單的從保持體作裝著脫離。故而，舉例而 言，藉由將本實施形態之第1保持部又或是第5保持部從 保持體卸下，而成爲能容易地進行基板檢查用接觸子的交 換。 若藉由申請專利範圍第6項所記載之發明，則由於係 爲使用有申請專利範圍第1項乃至第4項中之任一項所記 載之基板檢查用治具的基板檢查裝置，而構成基板檢查用 接觸子之第1銷與第2銷係經由收納部而成爲導通狀態， 因此係提供一種能將基板檢查用接觸子所檢測出之電性訊 號確實且正確地作傳達的基板檢查裝置。 200804826 (7) 【實施方式】 對本發明之實施方式作說明。 圖1，係爲具備使用有本發明之其中一種實施形態的 基板檢查用接觸子之基板檢查用治具的基板檢查裝置之內 ' 部構成圖，圖2，係爲被檢查基板保持部附近之平面圖。 ' 另外，於圖中，爲了使方向更爲明確，故一倂記載有座標 軸。被適用有本發明之基板檢查用治具的基板檢查裝置1 〇 φ ，係具備有：檢查部1 4，其係在呈略長方體形狀之筐體的 內部中，被配設於前面側（一 γ方向）與後面側（+ Y方 向）之略中間位置，並進行被檢查基板B之良好與否的檢 查；和搬送機構部1 6，其係被配設於筐體1 2的前面側與 後面側之間，並一方面將被設置於前面側之檢查開始前的 被檢查基板B搬送至檢查部1 4，一方面將檢查結束後之 被檢查基板B從檢查部1 4而搬送至前面側。 檢查部1 4，係分別被配設於被檢查基板B之上方側 • (+Z方向）與下方側（一Z方向），並具備有對被設置 在被檢查基板B之表、背面的配線圖案之良好與否作檢查 的檢查單元20。此檢查單元20 ’係具備有：基板檢查用 治具24，其係具備有被抵接於被檢查基板B之配線圖案 的銲墊上之複數（例如’ 20〇根）的基板檢查用接觸子（ 探針）2 2 ;和治具驅動機構2 6，其係使基板檢查用治具 24在基板檢查裝置1〇之橫方向（X方向）、基板檢查裝 置1 〇之前·後方向（γ方向）、以及基板檢查裝置1 〇之上 下方向（Z方向）上作移動，同時使基板檢查用治具24 -10- 200804826 (8) 在沿著上下方向而延伸之軸周圍作旋轉。 搬送機構部16,係具備有：搬送平台3〇,其係載 被檢查基板B;和滾珠螺桿34,其係藉由將搬送平台 螺合於螺帽部32而使期於前後方向（γ方向）移動； 一對之導引軌36，其係與滾珠螺桿相平行地被配設，並 搬送平台3 0以使其因應於滾珠螺桿3 4的旋轉而移動的 式來作導引；和馬達38，其係爲將滾珠螺桿34作旋轉 φ 動者’並藉由後述之動作控制部40而被作驅動控制。 另外’在搬送平台30之適當場所，係被形成有用 使基板檢查用治具2 4之基板檢查用接觸子2 2與被檢查 板Β之背面的配線圖案之銲墊作接觸的貫通開口（省略 示）。 圖3，係爲展示基板檢查裝置10之電性構成的方塊 〇 基板檢查裝置1 〇，係具備有由CPU、ROM、RAM ® 所成之微電腦，並具備有：動作控制部4 0，其係根據預 被記憶於ROM中之程式，而控制裝置全體之動作；和 _ 描部42，其係一方面對被抵接於被檢查基板B之配線 案的銲墊L之複數的基板檢查用接觸子22作掃描，並 抵接在位置於應檢查之配線圖案的兩端之2個的銲墊上 2個的基板檢查用接觸子依序作選擇，一方面對所選擇 2個的基板檢查用接觸子22輸出檢查訊號；和檢測器控 器44，其係藉由接收從動作控制部40而來之檢查開始 令，而對掃描部42輸出掃描指令；和操作面板46，其 置 30 和 將 方 驅 以 基 圖 圖 等 先 掃 圖 將 之 之 制 指 係 -11 - 200804826 Ο) 具備有輸入從作業員而來之指令的輸入部，或是將配線圖 案之檢查結果作顯示的顯示器。另外，掃描部42與檢測 益控制益44，係構成貫行對被檢查基板b之電性特性的 檢查之基板檢查部4 8。 圖4，係爲展示掃描部42之電性構成的方塊圖^ 掃描部42，係具備有：電流產生部5 〇，其係由對被 連接於配設在被檢查基板B之配線圖案c的兩端之2個的 φ 銲墊L之間輸出特定準位的測定用電流之定電流源所成； 和電壓測定部5 2，其係測定當被輸出有特定準位之測定用 電流而在配線圖案C中流動有電流時之在銲墊l間所產生 的電壓；和切換開關5 4，其係用以在從基板檢查用治具 24所具備之複數的基板檢查用接觸子22中所被選擇之一 對的基板檢查用接觸子2 2之間，將電流產生部5 0以及電 壓測定邰5 2作連接；和檢查處理部5 6，其係對於該切換 開關5 4而輸出切換控制訊號。此檢查處理部5 6，係藉由 # 將以電壓測定部5 2所測定之電壓與特定之基準電壓作比 較，而判別成爲檢查對象之被檢查基板B的良好與否（配 線圖案C之導通狀態的良好與否），且亦具備有將該判別 結果送訊至檢測器控制器44之功能。 圖5，係爲槪略展示基板檢查用治具24之構成的重要 部分剖面圖。被配設於上方側與下方側之檢查單元20，由 於除了基板檢查用接觸子22之配置構成以外，係成爲相 同之構成，因此在此係針對被配設於下方側之檢查單元20 的基板檢查用治具24之構成作說明。 -12- 200804826 (10) 基板檢查用治具2 4，係爲將藉由導電性材料所形成的 複數之針狀的基板檢查用接觸子22，以藉由合成樹脂等的 絕緣性材料所形成之保持體60來作支持而被構成者。該 基板檢查用接觸子，係對應於成爲檢查對象之被檢查基板 B的配線圖案，而以特定之配列狀態來相互地作並列配設 ^ 的用以對被檢查基板B之電性特性作檢查者。 此保持體6 0，係被形成有：第1導引孔61，其係將 φ 基板檢查用接觸子22之其中一端導引至特定之被檢查基 板B的銲墊L ;和第2導引孔62，其係將此基板檢查用接 觸子22之另外一端，導引至特定之電極部7 0。藉由設置 第1導引孔與第2導引孔，而能使基板檢查用接觸子22 之兩端和特定之檢查點L與特定之電極部70相接觸。 各基板檢查用接觸子22之其中一端，係分別被彈性 的（或是壓接的）抵接於從保持體6〇而露出至外部的被 檢查基板B之銲墊L。又，各基板檢查用接觸子22之另 # 外一端，係分別被壓接的（或是彈性的）抵接於被配設在 與保持體60相對向配置所成之電極平板68的各電極部70 〇 另外，在各電極部70，係被連接有對應於各基板檢查 用接觸子22而配設的纜線72 ’並成爲能在經由基板檢查 用接觸子22而在特定之一對的銲墊L間供給測定用電流 的同時，對該一對之銲墊L間的電壓作測定。此纜線72 ，係被連接於基板檢查裝置。 針對此種構成之基板檢查裝置1 0的動作，一面參考 13- 200804826 (11) 圖3乃至圖5 —面作說明。首先，控制搬送機構部16以 及治具驅動機構26的動作，而使各基板檢查用接觸子22 之測定端，分別抵接（接觸）於被載置在搬送平台3 0之 被檢查基板B的各配線圖案之婷墊L。 ' 而後，根據從檢測器控制器44而來之掃描指令，掃 描部42係進行掃描，而選擇抵接於位置在被檢查基板B •之應檢查配線圖案的兩端之一對的銲墊L上之一對的基板 φ 檢查用接觸子22。 經由纜線72而與抵接於一對的銲墊L中之其中一方 的銲墊L之基板檢查用接觸子22相連接的切換開關54之 埠P1，和經由纜線72而與抵接於另外一方的銲墊L之基 板檢查用接觸子22相連接的切換開關54之埠P2係被選 擇，而在此些之埠P1與埠P2之間，被連接有電流產生部 50以及電壓測定部52。 接下來，從電流產生部5 0，經由埠P1與埠P2而對 • 被檢查基板B之一對的銲墊L之間的配線圖案施加測定用 電流I，並藉由電壓測定部52來測定在此一對之銲墊L間 的電壓V。此電壓V，當將配線圖案之電阻設爲R時，係 可表示爲V = R XI。以此電壓測定部5 2所測定之電壓V， 係在檢查處理部56中被與特定之基準電壓vf作比較，當 電壓V超過基準電壓V f時（v > V f)，判定配線圖案之 導通狀態係爲不良（於途中導體的一部份有缺陷），而當 電壓V爲基準電壓V f以下時（V $ V f)，判定配線圖案 之導通狀態係爲良好。此判別結果，係被送訊至檢測器控 •14- 200804826 (12) 制器44。 而，當判別結果係爲良好時，爲了進行接下來的配線 圖案之檢查，根據從檢測器控制器44而來之掃描指令， 掃描部42係進行掃描，而選擇抵接於位置在被檢查基板 • B之下一個應檢查配線圖案的兩端之一對的銲墊L上之一 對的基板檢查用接觸子22，並與上述相同地進行接下來的 配線圖案之檢查。另一方面，當判別結果係爲不良時，從 φ 檢測器控制器44，對動作控制部40輸出顯示檢查對象之 被檢查基板B係爲不良的訊號，並在操作面板46之顯示 器上，顯示被檢查基板B係爲不良的內容。此被檢查基板 B，係在此時結束其檢查。 圖6，係爲將圖5所示之A部作擴大而顯示的重要部 分剖面圖，圖7，係爲展示被使用於本發明的基板檢查用 治具中之基板檢查用治具，（a )係爲分解圖，（b )係爲 組裝圖。圖8，係爲當取下基板檢查用接觸子時之保持體 φ 的重要部分剖面圖。 另外，在此實施形態中，保持體60，雖係以由第1乃 至第5保持部60a乃至60e所成之5枚的板狀構件所形成 ，但是亦可以更多之枚數來形成，又，若是能在內部具備 後述之收納部而將基板檢查用接觸子作保持，則亦可以較 少之枚數來形成。 此保持體6 0，詳細雖係於後在述，但是係具備有將基 板檢查用接觸子22作導引之第1導引孔61與第2導引孔 6 2，且有必要具備將基板檢查用接觸子2 2收納於內部之 -15- 200804826 (13) 收納部63。 此第1導引孔61之口徑，例如，係被形成爲〇 · i〜 0.2 5mm，此第1導引孔61之口徑，只要是具備有能使後 述之第1銷滑動的口徑，則並不特別限定。 在圖6所示之基板檢查用治具2 4中，基板檢查用接 觸子22，係被插通於形成在保持體60上的第1導引孔61 與第2導引孔62中。 φ 針對此基板檢查用接觸子22作說明。 如圖7所示，在本發明之基板檢查治具2 4中，係具 備有第1銷22a、第2銷22b以及彈性部22c。 第1銷22a，係具備有由與銲墊L接觸（被壓接）的 其中一端，和被連接於彈性部22c的另外一端，所構成的 細棒狀之形狀。第1銷22a之抵接於銲墊L的其中一端， 係如圖7所示，以具備有前端較細之形狀爲理想。此係爲 了在銲墊L具備有氧化膜時，成爲能夠穿破此氧化膜而與 # 銲墊L確實作接觸之故。 第1銷22a，係在具備有與銲墊L相抵接之前端的同 時，被可滑動的插通在第1導引孔61內。第1銷22a，係 藉由鎢（W)或是鈹銅（BeCu)等的導電性之素材所形成 〇 在圖7所示之第1銷22a，係具備有在第1導引孔61 內作滑動之滑動部2 2 e，和基部2 2 f，和嵌入於彈性體2 2 c 之其中一端並被連接的嵌入部22d。 .此滑動部22e，係以被形成爲具有相較於第1導引孔 -16- 200804826 (14) 6 1而僅較些許小之口徑的圓柱形狀，而其前端爲具備有能 夠將銲墊L之氧化膜穿破的前端較細之形狀爲理想。 基部22f，係被形成爲在進行使第1銷22a成爲所期 望之長度的長度調整之同時，具有較滑動部22e更大之口 ' 徑的圓柱形狀。經由如此這般地被形成，在滑動部22e與 基部22f之間，係成爲被形成有階段差。其結果，經由使 用此階段差，而能防止基板檢查用接觸子22被從保持體 φ 6 0而朝向外側被拔出的事態。 嵌入部22d，係具備有較基部22f之口徑爲更小的口 徑。此嵌入部22d，係成爲可依照彈性部22c之形狀與材 質，而對該連接方法作適當的變更。 例如，當彈性部22c係爲如圖7所示之壓縮線圏彈簧 的情況時，係被形成爲與此壓縮線圈彈簧之內徑爲相同又 或是僅些許大的口徑，並藉由將壓縮線圈彈簧嵌入至嵌入 部22d內，而將兩者作連接。當將壓縮線圈彈簧嵌合於此 • 嵌入部22d時，可以將嵌入部22d之口徑形成爲較大以使 壓縮線圈彈簧可固定接著於嵌入部22d，亦可以使壓縮線 圈彈簧成爲遊嵌於嵌入部22d的方式來形成嵌入部22d的 口徑。 此嵌入部22d與基部22f之連接部分B，係如圖8 ( a )所示一般，將基部22f之連接端面fa形成爲平坦且與嵌 入部22d成爲直角。此時，例如，可使彈性部22c之端部 與此連接端面fa相接觸。 又，如圖8 ( b )所示，亦可將基部22f之連接端面fb -17- 200804826 (15) 形成爲彎曲，而將其與嵌入部22d平滑地連續形成。此時 ，例如，可以降低當彈性部22c之端部接觸時的彈性部22 之摩擦損耗。 此第1銷22a之尺寸，由於係依存於成爲檢查對象之 基板的大小或是銲墊L之大小，故並不特別作限定，但是 ，例如，滑動部22e，係被形成爲長度 3〜4mm、口徑 0.05〜0.2mm，基部22f，係被形成爲長度5〜8mm而口徑 φ 爲0.15〜0.25mm，而嵌入部22d，當被連接於彈性部時， 係以不會較基部22i之口徑爲更大，而長度上則儘可能使 其變長的方式而被形成。 第2銷22b，係以使其中一端朝向第1銷之另外一端 的方式而被配置爲同軸狀，並在第2導引孔62內滑動。 第2銷22b亦與第1銷22a相同，係藉由鎢（W )或是鈹 銅（Be Cu)等的導電性之素材所形成。 在圖7所示之第2銷22b，係具備有在具有與基板檢 • 查裝置之電極部70相接觸（被壓接）之前端的同時，被 可滑動的插通在第2導引孔62內之滑動部22g，和基部 22i，和被連接於彈性部22c之嵌入部22h。 此滑動部22g，係以被形成爲具有相較於第2導引孔 62而僅較些許小之口徑的圓柱形狀，而其前端爲具備有能 夠將電極部70之氧化膜穿破的前端較細之形狀爲理想。 基部22i，係被形成爲在對第2銷22b之長度作調整 的同時，具有較滑動部22g更大之口徑的圓柱形狀。經由 如此這般地被形成，在滑動部22g與基部22i之間，係成 -18- 200804826 (16) 爲被形成有階段差。其結果，經由使用此階段差，而能防 止基板檢查用接觸子22被從保持體60而朝向外側被拔出 的事態。 此第2銷22b之尺寸，由於係依存於成爲檢查對象之 基板的大小或是銲墊L之大小，故並不特別作限定，但是 ' ，例如，滑動部22g，係被形成爲長度0.5〜2mm、口徑 0.05〜0.2mm，基部22i，係被形成爲長度2〜4mm而口徑 φ 爲0.15〜0.25mm，而嵌入部22h，當被連接於彈性部時， 係以不會較基部22i之口徑爲更大，而長度上則儘可能使 其變長的方式而被形成。 在本實施形態所展示之第1銷22a與第2銷22b，係 如圖7所示，第1銷22a被形成爲較第2銷22b更長。雖 然亦可採用上述所示之尺寸，但是第1銷22a與第2銷 22b之長度，係爲因應於保持體60之長度而作了適當調整 之長度，而並非特別被限定者。 • 彈性部22c，係在被配置於第1銷22a與第2銷22b 之間的同時，分別被連接於第1銷22a之嵌入部22d與第 2銷22b之嵌入部22h。進而，此彈性部22c，係沿著基板 檢查用接觸子22之長軸方向而作伸縮。因此當由於被檢 查基板B之銲墊L與電極部70而使得第1銷22a與第2 銷22b被推壓時，係成爲被作用有朝向外側之附加力。其 結果，基板檢查用接觸子22係成爲對銲墊L與電極部70 作推壓，而能作確實的接觸。 此彈性部2 2 c，只要是能如上述一般的在長軸方向作 -19- 200804826 (17) 伸縮，則並未被特別限定，但是，係以使用如圖7 壓縮線圈彈簧爲理想。此係因爲，經由使用壓縮線 ，藉由將其分別嵌入至第1銷2 2 a與第2銷2 2 b之 嵌入部，而能容易地作嵌合之故。 另外，除了壓縮線圏彈簧之外，作爲此彈性部 ' 亦可使用具有彈性之合成樹脂或是橡膠。 此彈性部22c，係以由導電性之構件來形成爲 φ 此係因爲，經由將此彈性部2 2 c以導電性構件來形 成爲能將第1銷22a與第2銷22b作電性連接之故 如圖7 ( b )所示，在本發明中所使用之基板檢 觸子22，係具備有第1銷22a、第2銷22b以及 2 2 c所成，經由將彈性部2 2 c配置於第1銷2 2 a與 22b之間，當從第1銷22a之銲墊L與第2銷22b 部7〇而被朝向內側推壓時，彈性部22c係成爲被 力的狀態。因此，彈性部22c係成爲對銲墊L以及 • 7〇作推壓的狀態。 另外，此彈性部22c，係可形成爲外徑0.15〜 而內徑爲〇·1〜0.2mm，長度爲4〜5mm，但是並不 限定。 圖9’係爲展示保持體的槪略構成圖。如此圖 ’在保持體6 0中，係具備有收納部63。此收納部 可將基板檢查用接觸子22收納於內部（參考圖6 ) 納部63’係藉由具備有導電性之構件，或是藉由於 面施加具有導電性之膜（金電鍍處理），而具備有 所示之 圈彈簧 各別的 22c， 理想。 成，而 〇 查用接 彈性部 第2銷 之電極 施加有 電極部 0.25mm 被特別 9所示 63，係 。此收 內側表 導電性 20- 200804826 (18) 。進而，此收納部63，係收納第1銷22a與第2銷 至少一部份。 如此這般，在將第1銷22a與第2銷22b之至 份作收納的同時，經由收納部63係爲具有導電性 * 第1銷22a與第2銷22b作電性連接。 ' 其結果，成爲可將第1銷22a之滑動部22e的 檢測出之電性訊號，經由收納部63而傳導至第2 φ 之滑動部22g的前端。 此收納部63，係在被形成爲筒狀的同時，具備 於基板檢查用接觸子22之外徑而僅爲些許大的內 ，如圖6所示一般，此收納部63，係在第3保持部 第4保持部60d上被配置，且。以收納第1銷22a 部與彈性部22c與第2銷22b之上方部的方式而被 形成。 另外，此收納部63與基板檢查用接觸子22間 ^ ( clearance )，係以被形成爲1〜1 〇从m爲理想。 爲，藉由形成有此範圍內之間隙，在能容易地將基 用接觸子22從收納部63作插拔的同時，在將基板 接觸子22收納於收納部63中時，第1銷22a與〜 22b係會成爲與收納部63之內側表面相接觸之故。 此圖9中所示之收納部63，係被配置於第3 60c與第4保持部60d。此時，例如，係在第3保持 與第4保持部60d中形成能夠配置收納部63的空 將收納部63安裝於第3保持部60c又或是第4保持 22b之 少一部 ，可將 前端所 銷22b 有相較 徑。又 60c與 之下方 配置並 之間隙 此係因 板檢查 檢查用 寒2銷 保持部 部6 0c 間，並 部6 0d -21 - 200804826 (19) 中之任一者，而後，經由使其重疊於第4保持部60d又或 是第3保持部60c，而能將收納部63配置於保持體60內 〇 如上述一般，第1導引孔6 1，係將基板檢查用接觸子 " 22之其中一端導引至特定的銲墊L。此圖9中所示之第j * 導引孔61 ’係被形成於第1保持部60a。此第1導引孔61 之長度，雖係依照第1保持部6 0 a之厚度而被作適當設定 φ ，但是並非被特別限定者，而只要能將基板檢查用接觸子 22之其中一端確實的導引至特定的銲墊L處即可。 圖9中所示之第2導引孔62，係被形成於第5保持部 6 〇 e。此第2導引孔62之長度，雖係依照第5保持部60e 之厚度而被作適當設定，但是並非被特別限定者，而只要 能將基板檢查用接觸子22之另外一端確實的導引至特定 的電極部70處即可。 另外，此些之第1導引孔61與第2導引孔62之口徑 • ，由於係如上述所說明一般爲用以將基板檢查用接觸子22 導引至特定位置者，因此係以盡可能地形成爲與基板檢查 用接觸子22成爲相同之口徑，且在保持體60之厚度方向 的長度係以盡可能的形成爲較短爲理想。藉由如此這般地 形成，由於第1導引孔61與第2導引孔62之厚度方向的 長度係被形成爲較短，因此能減少基板檢查用接觸子2 2 與保持體6 0間相接觸之場所’而能防止因接觸所致之摩 擦所造成的基板檢查用接觸子22以及/又或是保持體60 之摩擦損耗。 -22- 200804826 (20) 第2保持部60b，係如圖9所示，被形成有具 1導引孔6 1之口徑爲更大之口徑的空間，而基板檢 觸子22，就算在使用時藉由滑動部22c而作滑動， 止因接觸所致的摩擦損耗。此空間之大小或長度， 於基板檢查用接觸子22之大小或形狀而被變更。 可設置數處之具備有與基板檢查用接觸子22之口 相同又或是僅些許大之口徑的突起，並作爲對基板 接觸子22之滑動方向作導引的導引部（未圖示）。 此空間，係並非爲僅形成於第2保持部60b者 可形成於第1保持部60a，亦可形成於第3保持部 又，亦可形成爲第4保持部60d或第5保持部60e。 圖1 〇，係爲展示將本發明之實施例的基板檢查 子22保持於保持體上之狀態的剖面圖。如圖1 0所 基板檢查用治具2 4之其中一方係被載置有被檢查 ，而在基板檢查用治具24之另外一方，係被連接 性連接於基板檢查裝置之電極板68的電極部70。 此時，基板檢查用接觸子22之其中一端係被 銲墊L，而基板檢查用接觸子22之另外一端係被 電極部70，進而，基板檢查用接觸子22係從兩側 。因此，彈性部2 2 c係縮小而成爲被施加有力之狀 結果，第1銷22 a與第2銷22b，係成爲作用有朝 方向之反作用力’而第1銷22a係被推壓至銲墊L 銷22b係被推壓至電極部70。 又，就算是在此種狀態下，由於收納部63與f 備較第 查用接 亦能防 係因應 又，亦 徑略微 檢查用 ，而亦 6 0 c ° 用接觸 示，在 基板B 有被電 抵接於 抵接於 被推壓 態。其 向外側 '，第2 有1銷 -23- 200804826 (21) 2 2 a之間隙（c 1 e ar anc e )係僅有些許’因此第1銷2 2 a的 一部份係與收納部63接觸並成爲導通狀態。又，由於收 納部63與第2銷22b之間隙（clearance )係僅有些許， 因此第2銷22b的一部份係與收納部63接觸並成爲導通 狀態。其結果，第1銷22a與第2銷22b，係經由收納部 63而成爲導通狀態。 另外，當實際使用基板檢查用治具2 4時，在電極平 板6 8上載置基板檢查用治具2 4，並以使各電極部7 0與第 2銷22b相接觸的方式而對位，之後，以使身爲被檢查基 板B之檢查點的銲墊1與第1銷22&相接觸的方式而對位 〇 圖11，係爲展示基板檢查治具之其他實施形態的圖， 圖1 1 ( a )係爲展不收納有基板檢查用接觸子的狀態，（b )係爲展示將基板檢查用接觸子取下的狀態。 在圖1 1所示之基板檢查用治具24 ’中，收納部63 ’， 係從第2保持部60b起一直被形成至第4保持部60d爲止 。藉由如此地將收納部63 ’在保持體60之厚度方向上較長 的形成，能夠使第1銷22a與第2銷22b之接觸面積變大 【圖式簡單說明】 〔圖1〕適用有本發明之其中一種實施形態的基板檢 查用治具之基板檢查裝置的內部構成圖。 〔圖2〕圖1所示之基板檢查裝置的平面圖。 -24 - 200804826 (22) 〔圖3〕展示圖1所示之基板檢查裝置的電性構成之 區塊圖。 〔圖4〕展示圖3所示之掃描部的電性構成之區塊圖 〇 ^ 〔圖5〕槪略展示被適用於圖1所示之基板檢查裝置 ' 中的基板檢查用治具之構成的圖。 〔圖6〕詳細展示圖5所示之基板檢查用治具的構成 φ 之重要部分剖面圖。 〔圖7〕構成圖6所示之基板檢查用治具的基板檢查 用接觸子之分解正面圖。 〔圖8〕展示連接部與基部之連接的擴大圖，（a)係 爲展示連接端面被形成爲平坦的情況，（b )係爲展示連 接端面被形成爲彎曲狀的情況。 〔圖9〕展示將圖6所示之基板檢查用治具的基板檢 查用接觸子卸下之狀態的重要部分剖面圖。 Φ 〔圖10〕展示將本發明之實施例的基板檢查用接觸子 22保持於保持體上之狀態的剖面圖。 〔圖1 1〕展示本發明之基板檢查治具的其他實施形態 之圖，（a )係爲展示收納有基板檢查用接觸子的狀態之 重要部分剖面圖，（b )係爲展示將基板檢查用接觸子取 下的狀態之重要部分剖面圖。 〔圖12〕展示先前之基板檢查用治具的構成之重要部 分剖面圖。 -25- 200804826 (23) 【主要元件符號說明】 22 :基板檢查用接觸子 24 :基板檢查用治具 60 :保持體 61 :第1導引孔 62 :第2導引孔200804826 (1) EMBODIMENT OF THE INVENTION [Technical Fields of the Invention] The present invention relates to a jig for substrate inspection and a substrate inspection device, and more particularly to a wiring that is even finer. The pattern can also be suitably used, and the jig for the substrate inspection and the jig for the substrate inspection can be reduced. In addition, the "substrate" in the present invention is an electrode plate including a printed wiring board, a flexible wiring board, a multilayer wiring board, a liquid crystal display, or a plasma display, or a semiconductor package. A package substrate or a film carrier or the like is used. [Prior Art] In recent years, the degree of integration of an electrical component such as a semiconductor element or a resistor mounted on a substrate has been improved, and the pitch of the wiring pattern has been reduced. In such a substrate, the electrical resistance of the wiring pattern is measured in a state where the electric member is mounted on the bare board before the substrate φ, and the electrical characteristics of the substrate are checked for goodness or not. For example, between the pads which are the inspection points of the wiring pattern which the substrate has, the contact for the substrate inspection is electrically contacted, and a current of a specific level is applied to the wiring pattern, and The voltage generated between the pads is measured and compared with the critical enthalpy, thereby checking whether the electrical characteristics of the substrate are good or not. As a jig for the substrate inspection in the substrate inspection apparatus which is used for the inspection of such a substrate, for example, as shown in FIG. 12, one end -4-200804826, (2) is abutted on the inspection substrate. The substrate inspection contact 200 of the pad L and the guide plate 202 for guiding the plurality of substrate inspection contacts 200 to the desired pad L (check point) The constituents are (for example, Patent Document 1). Here, the substrate inspection contact 200 is a first pin body 204' and a second pin body 206, and a compression coil spring disposed between the first pin body 204 and the second pin body 206. 208 constitutes the person. The guide plate 202 is a holder 210 and 212 which are held by the first pin body 204, and a spacer 2 1 for holding the interval between the two holders 2 1 0 and 2 1 2 4; and two holding bodies 2 1 6 and 21 8 holding the second pin body 206; and a spacer 220 for holding the interval between the two holding bodies 2 16 and 2 18; and compressing The coil spring 208 is composed of two holding bodies 222 and 224 which are held. In the jig for inspecting the substrate, the one end of the first pin body 204 of the substrate inspection contact 200 is in contact with the pad L of the inspection substrate B, and the substrate B to be inspected is inspected. The guide plate 202 is relatively pressed so that the compression coil spring 208 is compressed, whereby one end of the first pin body 207 is elastically abutted against the pad L of the inspection substrate B. However, in the above-described substrate inspection jig, the first pin body 206 and the second pin body 206 are electrically connected via the compression coil spring 208. Therefore, it is necessary to fix the first pin body 204 and the compression coil spring 208, and the fitting portion of the second pin body 206 and the compression coil spring 208 to be -5 - 200804826 (3), and to reliably perform electrical power. connection. Therefore, one end side of the compression coil spring 208 is pressed into the step portion provided in the first pin body 204. Further, the other end side of the compression coil spring 2〇8 is disposed in a state of being pressed from the second pin body 206, but the compression coil spring 208 and each pin system are only fitted by * When connected, the electrical connection is not stable. In particular, in order to measure the wiring pattern which has been fined in recent years, there is a problem that it is impossible to determine the quality of the wiring pattern of the inspection substrate by the difference of the resistance 値 which is extremely small. [Problem to be Solved by the Invention] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate inspection even for a wiring pattern that is miniaturized. The resistance of the contactor itself is reduced and the proper use is reduced. • The substrate inspection fixture for the substrate inspection is used for the resistance of the contact itself. [Means for Solving the Problem] The invention according to the first aspect of the invention provides a substrate inspection jig, which is provided with a substrate inspection contact, which is one end crimped to the substrate to be inspected The inspection point set on the wiring pattern, and the other end is crimped to the electrode portion of the inspection device for inspecting the substrate to be inspected; and the holder for holding the substrate inspection contact, and One end of the contact is guided to the first guide -6-200804826 (4) of the inspection point, and the other end of the contact is guided to the second guide hole of the electrode portion, which is characterized by The contact for substrate inspection includes a conductive first pin that is slidably inserted into the first guide hole while being pressed against the inspection point; and one end thereof is Coaxially disposed so as to face the other end of the first pin, and pressed to the 'electrode portion, and slidably passed through the second guide hole Pin; and being placed in the aforementioned first pin The other end φ is connected to one end of the second pin, and the other end of the first pin is connected to one end of the second pin, and the long axis of the first or second pin is An elastic portion that expands and contracts in a direction, the holding body is made of a conductive material, and is formed with a housing portion that at least one of the first pins and at least one of the second pins are connected to each other. The first pin and the second pin are electrically connected by the accommodating portion, and the invention described in claim 2 is provided for the substrate inspection according to the first item of the φ application. The elastic portion is formed of a conductive member. The invention according to claim 3, wherein the first and second pin systems have the first and second pin systems according to the first or second aspect of the invention. In the cylindrical shape, the elastic portion is formed by a compression coil spring, and the first pin, the second pin, and the elastic portion have slightly the same diameter. The invention according to claim 4, wherein the substrate of the invention of claim 1 or claim 3, wherein the elastic portion is The first pin formed by the compression coil spring includes a first fitting portion that is fitted into one of the compression coil springs, and the second pin includes a second one that is fitted to the other of the compression coil springs. Embedding department. The invention according to claim 5, wherein the storage unit is formed in a tubular shape and is fixed to the substrate inspection tool according to the first aspect of the invention. Within the specific position of the aforementioned retaining body. The invention described in claim 6 is a substrate inspection apparatus which is a substrate inspection apparatus for inspecting the quality of an inspection substrate by measuring the electrical characteristics of the substrate to be inspected. The substrate inspection jig according to any one of the first to fifth aspects of the invention, and the substrate inspection contactor through the substrate inspection jig, which is inspected according to A substrate inspection unit that determines the electrical signal detected by the substrate and determines whether the substrate to be inspected is good or not. The above problems are solved by providing such inventions. According to the invention described in the first aspect of the invention, since the first pin and the second pin are electrically connected via the accommodating portion, it is possible to detect the contact for the substrate inspection. The electrical signal is reliably transmitted to the substrate inspection jig of the substrate inspection apparatus. According to the invention described in the second paragraph of the patent application, since the elastic portion 8-(6)(6)200804826 is formed of a conductive member, it is possible to provide a contact holder for the substrate inspection. The detected electrical signal is more reliably and more accurately transmitted to the substrate inspection jig of the substrate inspection apparatus. According to the invention described in claim 3, since the first pin and the second pin are formed in a cylindrical shape and the elastic portion is formed by a compression coil spring, it is possible to provide a slide. A jig for inspection of a substrate for contact with a substrate for high-performance substrate inspection. According to the invention described in the fourth aspect of the patent application, since the first pin and the second pin are formed with an insert portion into which the compression coil spring as the elastic portion can be inserted, it is possible to provide a type. A jig for inspection of a substrate having a contact for substrate inspection having a simple configuration. According to the invention described in the fifth aspect of the invention, since the receiving portion is formed in a tubular shape and is fixed to the holder, the substrate inspection contact can be easily detached from the holder. For example, the first holding portion or the fifth holding portion of the present embodiment is detached from the holder, and the contact for the substrate inspection contact can be easily performed. The invention is based on the substrate inspection device for the substrate inspection jig according to any one of the first to fourth aspects of the application of the patent application. Since the first pin and the second pin of the contact member for substrate inspection are electrically connected via the accommodating portion, a substrate inspection device capable of reliably and accurately transmitting the electrical signal detected by the substrate inspection contact is provided. . 200804826 (7) [Embodiment] An embodiment of the present invention will be described. 1 is a view showing a configuration of a portion of a substrate inspection device including a substrate inspection jig using a substrate inspection contact according to an embodiment of the present invention, and FIG. 2 is a view of the vicinity of the substrate holding portion to be inspected. Floor plan. In addition, in the figure, in order to make the direction clearer, the coordinate axis is described in one place. The substrate inspection device 1 〇φ to which the jig for substrate inspection of the present invention is applied is provided with an inspection portion 14 which is disposed inside the casing having a substantially rectangular parallelepiped shape and is disposed on the front side (a The γ direction is slightly intermediate between the rear side (+Y direction) and the inspection of the substrate B to be inspected; and the transport mechanism unit 1 6 is disposed on the front side of the casing 1 2 and On the other hand, the inspected substrate B before the start of the inspection on the front side is transported to the inspection unit 14 on the one hand, and the inspected substrate B after the inspection is transferred from the inspection unit 14 to the front side. side. The inspection unit 14 is disposed on the upper side (+Z direction) and the lower side (one Z direction) of the substrate B to be inspected, and is provided with wiring for the front and back surfaces of the substrate B to be inspected. The inspection unit 20 is inspected for the goodness of the pattern. The inspection unit 20 ′ is provided with a substrate inspection jig 24 that includes a plurality of substrate inspection contacts (for example, '20 〇 roots) that are abutted on the pads of the wiring pattern of the inspection substrate B ( The probe 2 2 and the jig drive mechanism 2 6 are used to make the substrate inspection jig 24 in the lateral direction (X direction) of the substrate inspection device 1 and the front and rear directions (γ direction) of the substrate inspection device 1 And the substrate inspection device 1 is moved in the up-down direction (Z direction), and the substrate inspection jig 24 -10- 200804826 (8) is rotated around the axis extending in the vertical direction. The transport mechanism unit 16 includes a transport platform 3 that carries the substrate B to be inspected, and a ball screw 34 that is screwed to the nut portion 32 so as to be in the front-rear direction (γ direction). Moving; a pair of guide rails 36, which are arranged in parallel with the ball screw, and transporting the platform 30 to guide it in response to the movement of the ball screw 34; and the motor 38, in which the ball screw 34 is rotated φ, and is driven and controlled by the operation control unit 40 which will be described later. In addition, in the appropriate place of the transfer platform 30, a through opening for making contact between the substrate inspection contact 2 2 for the substrate inspection jig 24 and the wiring pattern of the back surface of the inspection plate is formed (omitted) Show). 3 is a block 〇 substrate inspection device 1 that exhibits an electrical configuration of the substrate inspection device 10, and includes a microcomputer composed of a CPU, a ROM, and a RAM®, and includes an operation control unit 40. The operation of the entire device is controlled based on the program pre-stored in the ROM; and the scanning portion 42 is a substrate inspection contact for a plurality of pads L that are in contact with the wiring substrate of the substrate B to be inspected. The sub-22 scans and contacts two substrate inspection contacts on the two pads located at both ends of the wiring pattern to be inspected, and selects the contact for the selected two substrates. The sub-22 outputs a check signal; and the detector controller 44 outputs a scan command to the scan unit 42 by receiving an inspection start command from the operation control unit 40; and an operation panel 46, which sets the 30 and the square It is a display unit that inputs a command from the operator or a display that displays the inspection result of the wiring pattern. Further, the scanning unit 42 and the detection control benefit 44 constitute a substrate inspection unit 48 that checks the electrical characteristics of the substrate under test b. 4 is a block diagram showing the electrical configuration of the scanning unit 42. The scanning unit 42 is provided with a current generating unit 5 that is connected to the wiring pattern c disposed on the substrate B to be inspected. The φ pad L at both ends outputs a constant current source for measuring current at a specific level; and the voltage measuring unit 52 measures the current for measurement at a specific level. The voltage generated between the pads 1 when a current flows in the wiring pattern C; and the changeover switch 54 for use in the plurality of substrate inspection contacts 22 provided in the substrate inspection jig 24 The pair of substrate inspection contacts 2 2 are selected to connect the current generating unit 50 and the voltage measuring unit 252, and the inspection processing unit 5 6 outputs switching control for the switching switch 5 4 . Signal. The inspection processing unit 506 compares the voltage measured by the voltage measuring unit 52 with a specific reference voltage, and determines whether the substrate B to be inspected is good or not (the wiring pattern C is turned on). The state is good or not, and the function of transmitting the determination result to the detector controller 44 is also provided. Fig. 5 is a cross-sectional view showing an essential part of the configuration of the jig 24 for substrate inspection. Since the inspection unit 20 disposed on the upper side and the lower side has the same configuration except for the arrangement of the substrate inspection contact 22, the substrate is disposed on the inspection unit 20 on the lower side. The configuration of the jig 24 for inspection will be described. -12- 200804826 (10) The substrate inspection jig 24 is formed of a plurality of needle-shaped substrate inspection contactors 22 formed of a conductive material, and is formed of an insulating material such as synthetic resin. The holder 60 is configured to be supported. The contact for substrate inspection corresponds to the wiring pattern of the substrate B to be inspected to be inspected, and is arranged side by side in a specific arrangement state to check the electrical characteristics of the substrate B to be inspected. By. The holder 60 is formed with a first guide hole 61 for guiding one end of the φ substrate inspection contact 22 to the pad L of the specific inspection substrate B; and the second guide The hole 62 guides the other end of the substrate inspection contact 22 to the specific electrode portion 70. By providing the first guiding hole and the second guiding hole, both ends of the substrate inspection contact 22 and the specific inspection point L can be brought into contact with the specific electrode portion 70. One end of each of the substrate-inspecting contactors 22 is elastically (or crimped) abutting against a pad L of the substrate B to be inspected which is exposed from the holder 6 to the outside. Further, the other end of each of the substrate inspection contactors 22 is pressed (or elastically) to abut against each electrode of the electrode flat plate 68 disposed opposite to the holder 60. In the respective electrode portions 70, the cable 72' disposed corresponding to each of the substrate inspection contactors 22 is connected to the contact portion 22 via the substrate inspection contactor 22. The voltage between the pair of pads L was measured while supplying a current for measurement between the pads L. This cable 72 is connected to the substrate inspection device. The operation of the substrate inspection apparatus 10 having such a configuration will be described with reference to FIGS. 13-200804826 (11), FIG. 3, and FIG. First, the operation of the transport mechanism unit 16 and the jig drive mechanism 26 is controlled, and the measurement ends of the substrate inspection contactors 22 are brought into contact with each other (contact) on the substrate B to be inspected placed on the transport platform 30. Ting pad L of each wiring pattern. Then, based on the scan command from the detector controller 44, the scanning unit 42 performs scanning to select a pad L that is in contact with one of the two ends of the substrate to be inspected to be inspected. The substrate φ of the upper pair is inspected by the contact 22 .埠P1 of the changeover switch 54 connected to the substrate inspection contact 22 that is in contact with one of the pair of pads L via the cable 72, and abutting via the cable 72 The other side of the switch L of the bonding pad L of the bonding pad L is connected to the switching switch 54, and the P2 is selected, and between the P1 and the P2, the current generating unit 50 and the voltage measuring unit are connected. 52. Then, the current generating unit 50 applies a measurement current I to the wiring pattern between the pads L of one of the substrates B to be inspected via the 埠P1 and 埠P2, and is measured by the voltage measuring unit 52. The voltage V between the pair of pads L. This voltage V, when the resistance of the wiring pattern is set to R, can be expressed as V = R XI. The voltage V measured by the voltage measuring unit 52 is compared with the specific reference voltage vf in the inspection processing unit 56, and when the voltage V exceeds the reference voltage Vf (v > V f), the wiring pattern is determined. The conduction state is defective (a part of the conductor is defective in the middle), and when the voltage V is equal to or lower than the reference voltage Vf (V$Vf), it is determined that the conduction state of the wiring pattern is good. The result of this discrimination is sent to the detector control unit 1414200804826 (12). On the other hand, when the discrimination result is good, in order to perform the inspection of the next wiring pattern, the scanning unit 42 performs scanning based on the scanning command from the detector controller 44, and selectively contacts the substrate on the substrate to be inspected. • Under the B, the substrate inspection contact 22 on one of the pads L of one of the two ends of the wiring pattern should be inspected, and the subsequent wiring pattern inspection is performed in the same manner as described above. On the other hand, when the determination result is defective, the φ detector controller 44 outputs a signal indicating that the inspection target substrate B is defective to the operation control unit 40, and displays it on the display of the operation panel 46. The substrate B to be inspected is a defective content. The substrate B to be inspected ends its inspection at this time. 6 is a cross-sectional view of an essential part showing an enlarged portion A shown in FIG. 5, and FIG. 7 is a view showing a jig for a substrate inspection used in the jig for substrate inspection of the present invention, (a) ) is an exploded view, and (b) is an assembled view. Fig. 8 is a cross-sectional view showing an important part of the holder φ when the contact for substrate inspection is removed. Further, in this embodiment, the holding body 60 is formed of five plate-shaped members formed of the first to fifth holding portions 60a to 60e, but may be formed in a larger number. In addition, it is also possible to form a contact portion for substrate inspection by providing a housing portion to be described later. Although the holder 60 is described in detail later, the first guide hole 61 and the second guide hole 62 are guided by the substrate inspection contact 22, and it is necessary to provide the substrate. The inspection contact unit 2 2 is housed inside the -15-200804826 (13) storage unit 63. The diameter of the first guiding hole 61 is, for example, formed as 〇 · i~ 0. In the case of the diameter of the first guide hole 61, the diameter of the first guide hole 61 is not particularly limited as long as it has a diameter that allows the first pin to be slid to be described later. In the substrate inspection jig 24 shown in Fig. 6, the substrate inspection contact 22 is inserted into the first guide hole 61 and the second guide hole 62 formed in the holder 60. φ This substrate inspection contact 22 will be described. As shown in Fig. 7, in the substrate inspection jig 24 of the present invention, the first pin 22a, the second pin 22b, and the elastic portion 22c are provided. The first pin 22a has a shape of a thin rod formed by one end of the contact with the pad L (pressure-bonded) and the other end connected to the elastic portion 22c. It is preferable that the first pin 22a is in contact with one end of the pad L as shown in Fig. 7 and has a shape having a narrow tip. In this case, when the pad L is provided with an oxide film, the oxide film can be pierced and the contact pad L is surely brought into contact with each other. The first pin 22a is slidably inserted into the first guide hole 61 while being provided with the front end abutting against the pad L. The first pin 22a is formed of a conductive material such as tungsten (W) or beryllium copper (BeCu). The first pin 22a shown in FIG. 7 is provided in the first guiding hole 61. The sliding portion 2 2 e is slid, and the base portion 2 2 f, and an insertion portion 22d that is fitted to one end of the elastic body 2 2 c and connected thereto. . The sliding portion 22e is formed in a cylindrical shape having a smaller diameter than that of the first guiding hole-16-200804826 (14) 61, and the front end is provided with a soldering pad L The shape of the thin end of the oxide film pierced is ideal. The base portion 22f is formed to have a cylindrical shape having a larger diameter than the sliding portion 22e while adjusting the length of the first pin 22a to have a desired length. By thus being formed in this manner, a step difference is formed between the sliding portion 22e and the base portion 22f. As a result, by using this step difference, it is possible to prevent the substrate inspection contact 22 from being pulled out from the holder φ 60 toward the outside. The fitting portion 22d is provided with a smaller diameter than the base portion 22f. The fitting portion 22d is appropriately changed in accordance with the shape and material of the elastic portion 22c. For example, when the elastic portion 22c is in the case of a compression coil spring as shown in FIG. 7, it is formed to be the same as the inner diameter of the compression coil spring or only a small diameter, and is compressed by The coil spring is embedded in the embedded portion 22d to connect the two. When the compression coil spring is fitted to the insertion portion 22d, the diameter of the insertion portion 22d can be formed to be large so that the compression coil spring can be fixed to the insertion portion 22d, and the compression coil spring can be embedded in the insertion portion. The portion of the portion 22d forms the diameter of the fitting portion 22d. The connecting portion B of the fitting portion 22d and the base portion 22f is generally flat as shown in Fig. 8(a), and the connecting end surface fa of the base portion 22f is formed flat and at right angles to the fitting portion 22d. At this time, for example, the end portion of the elastic portion 22c can be brought into contact with the connection end surface fa. Further, as shown in Fig. 8 (b), the connecting end faces fb -17 - 200804826 (15) of the base portion 22f may be formed to be curved, and formed smoothly with the fitting portion 22d. At this time, for example, the friction loss of the elastic portion 22 when the end portions of the elastic portion 22c are in contact can be reduced. The size of the first pin 22a is not particularly limited as it depends on the size of the substrate to be inspected or the size of the pad L. However, for example, the sliding portion 22e is formed to have a length of 3 to 4 mm. Caliber 0. 05~0. 2mm, the base 22f is formed to have a length of 5 to 8 mm and a diameter φ of 0. 15~0. 25 mm, and the fitting portion 22d is formed to be connected to the elastic portion so as not to be larger than the diameter of the base portion 22i, and to be as long as possible in length. The second pin 22b is disposed coaxially so that one end thereof faces the other end of the first pin, and slides in the second guide hole 62. Similarly to the first pin 22a, the second pin 22b is formed of a conductive material such as tungsten (W) or beryllium copper (Be Cu). The second pin 22b shown in Fig. 7 is provided with a front end that is in contact with (adhered to) the electrode portion 70 of the substrate inspection device, and is slidably inserted into the second guide hole 62. The inner sliding portion 22g, and the base portion 22i, and the fitting portion 22h connected to the elastic portion 22c. The sliding portion 22g is formed in a cylindrical shape having a smaller diameter than that of the second guiding hole 62, and the tip end thereof is provided with a front end capable of piercing the oxide film of the electrode portion 70. The fine shape is ideal. The base portion 22i is formed in a cylindrical shape having a larger diameter than the sliding portion 22g while adjusting the length of the second pin 22b. By being formed in this manner, between the sliding portion 22g and the base portion 22i, -18-200804826 (16) is formed with a step difference. As a result, by using this step difference, it is possible to prevent the substrate inspection contact 22 from being pulled out from the holder 60 toward the outside. The size of the second pin 22b is not particularly limited depending on the size of the substrate to be inspected or the size of the pad L, but ', for example, the sliding portion 22g is formed to have a length of 0. 5~2mm, caliber 0. 05~0. 2mm, the base 22i is formed to have a length of 2 to 4 mm and a diameter φ of 0. 15~0. 25 mm, and the fitting portion 22h is formed to be connected to the elastic portion so as not to be larger than the diameter of the base portion 22i, and to be as long as possible in the length. In the first pin 22a and the second pin 22b shown in the present embodiment, as shown in Fig. 7, the first pin 22a is formed to be longer than the second pin 22b. Although the dimensions shown above may be employed, the lengths of the first pin 22a and the second pin 22b are appropriately adjusted in accordance with the length of the holder 60, and are not particularly limited. The elastic portion 22c is disposed between the first pin 22a and the second pin 22b, and is connected to the fitting portion 22d of the first pin 22a and the fitting portion 22h of the second pin 22b, respectively. Further, the elastic portion 22c is expanded and contracted along the longitudinal direction of the substrate inspection contact 22 . Therefore, when the first pin 22a and the second pin 22b are pressed by the pad L and the electrode portion 70 of the substrate B to be inspected, an additional force acting outward is applied. As a result, the substrate inspection contact 22 is pressed against the pad L and the electrode portion 70, and can be reliably contacted. The elastic portion 2 2 c is not particularly limited as long as it can be expanded and contracted in the long axis direction as described above in the range of -19-200804826 (17). However, it is preferable to use a compression coil spring as shown in Fig. 7. This is because the compression line can be easily inserted into the fitting portion of the first pin 2 2 a and the second pin 2 2 b by using a compression wire. Further, in addition to the compression coil spring, an elastic synthetic resin or rubber may be used as the elastic portion '. The elastic portion 22c is formed of a conductive member because the elastic portion 2 2 c is formed of a conductive member so that the first pin 22a and the second pin 22b can be electrically connected. As shown in Fig. 7 (b), the substrate detecting member 22 used in the present invention is formed by the first pin 22a, the second pin 22b, and the 2 2 c, and the elastic portion 2 2 c is formed. When the first pin 2 2 a and 22 b are disposed between the first pin 22 a and the second pin 22 b and are pressed inward, the elastic portion 22 c is in a forced state. Therefore, the elastic portion 22c is in a state of pressing the pads L and 7〇. In addition, the elastic portion 22c can be formed as an outer diameter of 0. 15~ and the inner diameter is 〇·1~0. 2mm, length is 4~5mm, but it is not limited. Fig. 9' is a schematic view showing the structure of the holder. In the figure, the storage unit 63 is provided in the holder 60. In the accommodating portion, the substrate inspection contact 22 can be housed inside (see FIG. 6). The intermediate portion 63' is provided with a conductive member or a conductive film (gold plating treatment). It is ideal to have 22c each with the illustrated ring spring. The electrode of the second pin is applied to the electrode of the second pin. 25mm is shown by special 9 63, is. This is the inner side of the conductivity conductivity 20- 200804826 (18). Further, the accommodating portion 63 accommodates at least a part of the first pin 22a and the second pin. In this manner, the first pin 22a and the second pin 22b are housed together, and the storage portion 63 is electrically conductive. * The first pin 22a and the second pin 22b are electrically connected. As a result, the electrical signal that can detect the sliding portion 22e of the first pin 22a is transmitted to the distal end of the sliding portion 22g of the second φ via the accommodating portion 63. The accommodating portion 63 is formed in a tubular shape and is provided in the outer diameter of the substrate inspection contact 22, and is only slightly large. As shown in FIG. 6, the accommodating portion 63 is the third. The holding portion is disposed on the fourth holding portion 60d. The first pin 22a and the upper portion of the elastic portion 22c and the second pin 22b are housed. Further, between the accommodating portion 63 and the substrate inspection contact 22, it is preferably 1 to 1 〇 from m. By forming the gap in this range, the base contact 22 can be easily inserted and removed from the accommodating portion 63, and when the substrate contact 22 is housed in the accommodating portion 63, the first pin 22a The ～22b is brought into contact with the inner surface of the accommodating portion 63. The accommodating portion 63 shown in Fig. 9 is disposed on the third 60c and the fourth holding portion 60d. In this case, for example, the third holding portion and the fourth holding portion 60d are formed in the third holding portion 60c or the fourth holding portion 22b. The front end pin 22b has a relatively large diameter. In addition, the gap between the 60c and the lower side of the board is checked by the cold check 2 pin holding portion 60c, and the part is 60d-21-200804826 (19), and then overlapped by The fourth holding portion 60d or the third holding portion 60c can be disposed in the holding body 60. As described above, the first guiding hole 161 is a contact for the substrate inspection. One end is guided to a specific pad L. The j*th guide hole 61' shown in Fig. 9 is formed in the first holding portion 60a. Although the length of the first guide hole 61 is appropriately set to φ in accordance with the thickness of the first holding portion 60 a, it is not particularly limited as long as one end of the substrate inspection contact 22 can be surely It can be guided to a specific pad L. The second guide hole 62 shown in Fig. 9 is formed in the fifth holding portion 6 〇 e. Although the length of the second guide hole 62 is appropriately set in accordance with the thickness of the fifth holding portion 60e, it is not particularly limited as long as the other end of the substrate inspection contact 22 can be reliably guided. It suffices to the specific electrode portion 70. In addition, since the diameters of the first guide hole 61 and the second guide hole 62 are generally used to guide the substrate inspection contact 22 to a specific position as described above, the system is exhausted. It may be formed to have the same diameter as the substrate inspection contact 22, and the length in the thickness direction of the holder 60 is preferably as short as possible. Since the length of the first guiding hole 61 and the second guiding hole 62 in the thickness direction is formed to be short, the contact between the substrate inspection contact 2 2 and the holder 60 can be reduced. The contact point is 'to prevent the friction of the substrate inspection contact 22 and/or the holder 60 caused by the friction caused by the contact. -22- 200804826 (20) As shown in FIG. 9, the second holding portion 60b is formed with a space having a larger diameter of the guide hole 61, and the substrate detecting member 22 is used. At the time of sliding by the sliding portion 22c, the friction loss due to the contact is stopped. The size or length of this space is changed by the size or shape of the substrate inspection contact 22 . A plurality of protrusions having the same or only a small diameter as the mouth of the substrate inspection contact 22 can be provided, and a guide portion (not shown) for guiding the sliding direction of the substrate contact 22 can be provided. . This space may be formed not only in the second holding portion 60b but also in the first holding portion 60a, or in the third holding portion, or in the fourth holding portion 60d or the fifth holding portion 60e. Fig. 1 is a cross-sectional view showing a state in which a substrate inspection member 22 of an embodiment of the present invention is held on a holder. One of the substrate inspection jigs 24 of FIG. 10 is placed and inspected, and the other of the substrate inspection jigs 24 is connected to the electrode of the electrode plate 68 of the substrate inspection device. Department 70. At this time, one end of the substrate inspection contact 22 is the pad L, and the other end of the substrate inspection contact 22 is the electrode portion 70, and the substrate inspection contact 22 is provided on both sides. Therefore, the elastic portion 2 2 c is reduced and the force is applied. The first pin 22 a and the second pin 22 b act to have a reaction force in the direction, and the first pin 22 a is pressed to the welding. The pad L pin 22b is pressed to the electrode portion 70. Moreover, even in this state, since the accommodating portion 63 and the f are prepared for comparison, it is also possible to prevent the reaction, and it is also slightly inspected, and the contact is shown at 60 ° °, and the substrate B is The electrical contact abuts against the pushed state. It is the outer side, the second has a pin -23- 200804826 (21) 2 2 a gap (c 1 e ar anc e ) is only a little 'so the first pin 2 2 a part of the department and the storage part 63 contacts and becomes conductive. Further, since the clearance between the receiving portion 63 and the second pin 22b is only slightly different, a part of the second pin 22b is in contact with the accommodating portion 63 and is in an ON state. As a result, the first pin 22a and the second pin 22b are electrically connected via the accommodating portion 63. In addition, when the jig for inspection of the substrate 2 is actually used, the jig for inspection of the substrate 2 is placed on the electrode plate 68, and the electrode portion 70 is aligned with the second pin 22b. Then, the alignment of the pad 1 which is the inspection point of the substrate B to be inspected is in contact with the first pin 22& FIG. 11 is a view showing another embodiment of the substrate inspection jig, FIG. 1 ( a ) is a state in which the contact for substrate inspection is not accommodated, and (b) is a state in which the contact for substrate inspection is removed. In the jig for inspection of the substrate inspection shown in Fig. 11, the accommodating portion 63' is formed from the second holding portion 60b to the fourth holding portion 60d. By forming the accommodating portion 63' in the thickness direction of the holding body 60 as described above, the contact area between the first pin 22a and the second pin 22b can be increased. [Simplified description of the drawing] [Fig. 1] An internal configuration diagram of a substrate inspection device for a substrate inspection jig according to one embodiment of the present invention. Fig. 2 is a plan view of the substrate inspection apparatus shown in Fig. 1. -24 - 200804826 (22) Fig. 3 is a block diagram showing the electrical configuration of the substrate inspecting apparatus shown in Fig. 1. [Fig. 4] A block diagram showing the electrical configuration of the scanning portion shown in Fig. 3 (Fig. 5) schematically showing the constitution of the substrate inspection jig applied to the substrate inspection device shown in Fig. 1. Figure. Fig. 6 is a cross-sectional view showing an essential part of the configuration φ of the jig for substrate inspection shown in Fig. 5 in detail. Fig. 7 is an exploded front view showing a contact for forming a substrate for the substrate inspection jig shown in Fig. 6. Fig. 8 is an enlarged view showing the connection between the connecting portion and the base portion, wherein (a) shows a case where the connecting end surface is formed flat, and (b) shows a case where the connecting end surface is formed in a curved shape. (Fig. 9) is a cross-sectional view of an essential part showing a state in which the substrate inspection contact of the jig for substrate inspection shown in Fig. 6 is removed. Φ [Fig. 10] A cross-sectional view showing a state in which the substrate inspection contact 22 of the embodiment of the present invention is held on a holder. Fig. 11 is a view showing another embodiment of the substrate inspection jig of the present invention, wherein (a) is a cross-sectional view showing an important part of a state in which a substrate inspection contact is accommodated, and (b) is a display for inspecting the substrate. A cross-sectional view of an important part of the state with the contact removed. Fig. 12 is a cross-sectional view showing an essential part of the structure of the conventional substrate inspection jig. -25- 200804826 (23) [Description of main component symbols] 22 : Contact for substrate inspection 24 : Fixture for substrate inspection 60 : Holder 61 : First guide hole 62 : Second guide hole
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