JP2003043091A - Board inspection apparatus, board manufacturing method and board with bumps - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board inspection apparatus for inspecting electric resistance values, etc., of a wiring net on a printed wiring board such as boards with bumps at a high accuracy with a wide versatility, a high-quality board product having an accurate wiring net, using the inspection apparatus, and a method of manufacturing the board. SOLUTION: In the resistance value inspection apparatus 1, a plurality of first terminals two-dimensionally are arranged/formed on the backside of a board body 14 and solder bumps 6 are two-dimensionally arranged/formed on the surface of the board as second terminals corresponding to the first terminals. A first group 13 of measuring probes are brought into contact with the first terminal group and a second group of measuring probes 42 are selectively and removably brought into contact with the second terminals corresponding to a wiring net under test. With a measuring current fed to the wiring net, the resistance can be measured about the wiring net by the so-called four-terminal method, etc., based on the level of a voltage applied to the net under test. This eliminates the influence of the contact resistance, thereby the natural electric resistance value of the net is accurately knowable and hence a wiring net, where a failure is caused, can be reliably discriminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board such as a board with a bump, a board inspection method and apparatus for inspecting the electric resistance value thereof, and a board manufacturing method.

[0002]

2. Description of the Related Art In a printed circuit board, an electrical inspection is generally performed in which a constant voltage is applied between terminals of a wiring pattern, a conductive / insulated state is judged by a resistance value, and a disconnection / short circuit is inspected. . In such inspection, probes with needle-shaped contact pins are brought into close contact with each other from the top and bottom of the printed circuit board, and the resistance value of the wiring circuit between both probes is measured to determine whether disconnection or short circuit has occurred. Will be determined. At this time, when normal electrical continuity is obtained, that is, when a normal resistance value is obtained, it can be judged as a normal circuit state, and when an abnormal value is shown, an abnormal circuit state such as disconnection or short circuit It can be determined that

In the resistance value inspection, it is desired that the probe contacting the substrate is performed at an accurate inspection position and in an accurate contact state (a state in which the probe contacts the substrate with a load in an appropriate range). In order to solve some of such demands, conventionally, in a jig provided above and below corresponding to a substrate, a plurality of probes are arranged so that the probes (contact pins) are located at the inspection position. It is provided perpendicular to the substrate. The contact pin is housed in a plurality of holes formed in the jig, and is biased toward the substrate by a conductive spring to maintain the contact state and prevent the pin from sinking.

However, in such a method, the pitch of the holes (or the interval between the probes) provided in the jig is unavoidably set to a certain interval or more due to its structure. Therefore, it suffices that a jig or a plurality of probes come into contact with a PGA or LGA pad having a wide pitch, but a narrow pitch such as a C4 pad cannot provide a contact pin structurally, This method is extremely difficult. Further, according to this example, a so-called two-terminal resistance measuring method has been proposed. However, since this method adds contact resistance between the probe and the terminal, accurate resistance value measurement is difficult and highly accurate. It was not an inspection.

In particular, when it is desired to exclude a wiring having a slightly higher resistance value as a defect due to the influence of a via root or an incomplete disconnection, it is merely determined by the two-terminal method whether or not the resistance is higher than the threshold value. Then I cannot escape the inspection. In this case, it may be considered to reduce the threshold level, but the two-terminal method is likely to be subject to the state of contact resistance, so that the risk of deciding a non-defective product to be defective is increased. Further, in a package substrate in which a large number of wirings are incorporated, if the specific resistance value is different for each wiring, such correspondence is fundamentally impossible.

[0006]

SUMMARY OF THE INVENTION The problem to be solved by the present invention is to provide a board inspecting apparatus for inspecting the electric resistance value of a wiring net in a printed wiring board such as a board with a pump with high accuracy and versatility. Moreover, it is another object of the present invention to provide a high-quality board product having an accurate wiring net and a manufacturing method thereof by using the inspection apparatus.

[0007]

In order to solve the above problems, according to the present invention, a plurality of first terminal portions are arranged two-dimensionally on one plate surface of a substrate body. A plurality of second terminal portions corresponding to the first terminal portion are two-dimensionally arranged and formed on the other plate surface, and the first terminal portion and the second terminal portion correspond to each other. Each other
A substrate inspection device having a structure that is individually connected by a wiring net including a via, having a current-carrying probe element and a voltage-measuring probe element, which can be attached to and detached from a first terminal portion The abutting first measurement probe has a plurality of first measurement probe groups arranged corresponding to the two-dimensional array of the first terminal portion, a current conducting probe element and a voltage measuring probe element, In those probe elements, a second measurement probe that selectively and removably abuts on any of the plurality of second terminal portions, and a first measurement probe group abuts on the first terminal portion group, and a measurement target. The second measuring probe is brought into contact with the second terminal portion corresponding to the wiring net, and in that state, the current measuring probe element supplies the measuring current to the wiring net, and the voltage measuring probe element. Based on the voltage level applied to the wiring net measured by the specific electrical resistance value information generating means for generating information reflecting the specific electrical resistance value of the wiring net, and the generated specific electrical resistance value information, By comparing with the reference information individually set for each wiring net,
Inspection information generating means for generating inspection information regarding the quality of the wiring net.

One measuring probe group is brought into contact with the first terminal portion group, and a second measuring probe which is selectively and removably brought into contact with the second terminal portion corresponding to the wiring net to be measured is brought into contact. , In that state, while supplying the measuring current to the wiring net by the current-carrying probe element by the specific electric resistance value information generating means, based on the voltage level applied to the wiring net measured by the voltage measuring probe element. Information that reflects the specific electrical resistance value of the wiring net can be generated.

This is an application of the so-called four-terminal method (or the five-terminal method or eight-terminal method in consideration of the shield of the measurement wiring) of the resistance measurement principle. The value can be accurately grasped by the absolute value level, for example, and the wiring net in which the abnormality has occurred can be accurately identified. In addition, there is an advantage that the wiring net to be measured can be selected only by moving the second measurement probe. Then, by comparing the generated specific electric resistance value information with the reference information individually determined for each wiring net, the inspection information regarding the quality of the wiring net can be generated by the inspection information generating means. As a result, even if the specific electrical resistance value is different for each wiring net, it is possible to reliably inspect and identify the quality of each wiring net by using the individual reference information.

On the side where the second terminal portion is formed, the second measuring probe is relatively movable in the plate surface direction of the substrate body in order to select the second terminal portion corresponding to the wiring net to be measured. Further, it can be provided so as to be able to approach and separate from the second terminal portion in the plate thickness direction.

By doing so, the second measurement probe can be moved in the plate surface direction of the substrate body, and the measurement probe can be moved two-dimensionally to the corresponding position of the second terminal portion in the wiring net to be measured. . Since the second measurement probe can be brought into contact with and separated from the selected second terminal portion, it is possible to generate information reflecting the specific electric resistance value. In addition, since they can be separated from each other, the selected position of the second terminal portion can be changed.

Further, there is provided a substrate supporting portion for detachably supporting the substrate substantially horizontally so that the first terminal portion side is the lower side, and the first measurement probe group is provided on the lower surface side of the supported substrate, respectively. While contacting the first terminal portion, the second measurement probe,
The upper surface side of the substrate can be selectively brought into contact with the second terminal portion.

With this arrangement, the board can be attached / detached and replaced during inspection, and the board is held substantially horizontally so that it can be stably held. In addition, since the second measurement probe is provided on the upper surface side, the devices, accessories and the like associated with the second measurement probe can be installed on the upper part of the substrate, which facilitates the installation and maintenance of these devices and accessories.

Further, the measurement wiring group led out downward from the first measurement probe group is stretched to a position laterally offset from the substrate position, and then held in a state where the end portion is turned upward. The auxiliary probe corresponding to the wiring net to be measured is brought into contact with the auxiliary terminal portion formed at the end portion, and the auxiliary probe and the corresponding measurement wiring and the first measurement probe are used. Then, the resistance of the wiring net can be measured with the second measurement probe.

The measurement wiring group led downward from the first measurement probe group is extended to a position laterally offset from the substrate position, and the auxiliary terminal portion formed at the end of the measurement wiring group is oriented upward. Therefore, equipment and accessories that accompany the auxiliary probe that performs selection and contact at the auxiliary terminal can be installed at the upper position of the auxiliary terminal, which facilitates measurement and facilitates installation and maintenance of them. Become.

An auxiliary terminal holding plate for holding the auxiliary terminal portion from each measurement wiring in a two-dimensional array corresponding to the first measurement probe group may be provided. With this configuration, the auxiliary terminal portions are two-dimensionally arranged, and therefore the auxiliary terminal selection mechanism associated with the auxiliary probe to be brought into contact may be configured corresponding to the two-dimensional arrangement (that is, the two-dimensional arrangement). Since the position of the auxiliary probe can be adjusted by a general-purpose mechanism or the like that allows the position to be adjusted dimensionally), the device configuration can be further simplified.

The respective measurement wirings from the first measurement probe group are current conduction wirings and voltage measurement wirings that are electrically connected to the corresponding current measurement probe elements and voltage measurement probe elements of the corresponding first measurement probe. One of the voltage measuring wiring and the current conducting wiring may be connected to the auxiliary terminal portion and the other may be a common connection. By doing this, one wiring can be commonly connected, and while simplifying the circuit configuration, it is possible to select the wiring net to be measured by the other wiring, and to achieve a sufficient purpose without taking a complicated circuit configuration. Can be achieved.

In the above structure, the voltage measuring wiring is connected to the auxiliary terminal portion, while the current conducting wiring is connected to the common measuring constant current power source. In this case, among the plurality of first measurement probes, the respective terminal portions of the current-carrying wires individually extending from those arranged adjacent to each other are connected at different connection points with respect to the common power-supply wire toward the measurement constant-current power supply. Wiring segments that are adjacently connected and located between the adjacent connection points of the common power supply wiring are connected to the wiring segment when the second measurement probe and the auxiliary probe are mistakenly connected to different wiring nets. Leakage current suppressing means for suppressing the leakage of the measuring current may be provided.

When the second measuring probe and the auxiliary probe are erroneously connected to different wiring nets, the leakage current suppressing means leaks the measuring current to the wiring segment. It is possible to reduce the probability of occurrence of inspection error due to erroneous connection.

The leakage current suppressing means may include a resistance element having a resistance value at least larger than the reference resistance value defined as the reference information. By doing so, the specific electrical resistance value information obtained when connecting to different wiring nets becomes information having an excessively large resistance value compared with the reference information and the information due to the failure of the wiring net. Incorrect connection can be identified.

In the first measuring probe, one of the current-carrying probe element and the voltage-measuring probe element is used as a first probe element and the other is used as a second probe element, and at least the first probe element is a first terminal portion. It is provided so as to be able to move forward and backward in the contact direction, and is elastically deformed as the first probe element retracts due to contact with the first terminal portion, and the elastic return force attaches the first probe element toward the first terminal portion. A first elastic biasing member for biasing may be provided.

By doing so, when the first probe element is in contact with the first terminal portion, the first elastic urging member urges the first probe element in the contact direction, so that a good electrical contact state can be maintained. Becomes This can stabilize the contact resistance between the first probe element and the first terminal portion at a low value.

The second probe element is provided so as to be movable back and forth independently of the first probe element in the contact direction with the first terminal portion, and the first measurement probe and the first terminal portion are relatively close to each other in the contact direction. Accordingly, the contact state can be formed between the first probe element and the first terminal portion at substantially the same time or after the first probe element. A second elastic biasing member that elastically deforms as the second probe element retracts due to contact with the first terminal portion, and biases the second probe element toward the first terminal portion by its elastic return force. Can be provided.

By doing so, the first probe element and the second probe element can be independently biased to the first terminal portion, so that both probe elements (first probe element, second probe element) ) Is urged in the contact direction in a state of being in contact with the first terminal portion. Therefore, the contact state between both probe elements and the first terminal portion becomes good, and the contact resistance accompanying it can be stabilized at a low value.

The first measurement probe includes a tubular probe element and a pin-shaped probe element coaxially arranged inside the tubular probe element, one of the probe elements being the first probe element, The other can be the second probe element.

By doing so, when the first terminal portion has a pin shape like the PGA (pin grid array) substrate in the opening of the cylindrical probe element, the pin as the first terminal portion is provided. It can be inserted and positioned within the barrel of the tubular probe element. Therefore, accurate positioning can be performed even when some vibration or the like is involved.

The second coil spring is coaxially arranged in the tubular probe element, and biases the pin-shaped probe element from the rear side, and the second coil spring is coaxially arranged outside the second coil spring. It includes a first coil spring for urging the probe element from the rear side, one of the first coil spring and the second coil spring functions as a first elastic urging member, and the other functions as a second elastic urging member. You can

As described above, by biasing the tubular probe element and the pin-shaped probe element by the first coil spring and the second coil spring, the contact state between both probe elements and the first terminal portion can be kept good. it can. In addition, since the probe is biased by the coil spring, the probe has a cushioning property at the time of contact. Therefore, the impact generated on the substrate or the like is reduced, which contributes to quality improvement. In addition, since the first coil spring is housed in the tubular probe element, it is compact and can be easily used for probe thinning.

The pin-shaped probe element may be the first probe element, and the tip end portion of the pin-shaped probe element may be arranged so as to protrude by a predetermined amount from the tip edge of the cylindrical probe element that is the second probe element. By doing so, the load can be concentrated on the pin tip when the pin-shaped probe element is in contact, and the contact state of the pin-shaped probe element can be ensured.

On the other hand, when the pin-shaped probe element is used as the first probe element, the tip end surface of the cylindrical probe element, which is the second probe element, is a tapered surface that retracts toward the center of the axial cross section, and the pin-shaped probe element is used. The tip edge position of can be configured so as to project in the axial direction from the inner edge position of the tapered surface.

By doing so, when the first terminal portion is a pin-shaped terminal, the pin is easily inserted because the tip end side of the cylindrical probe element is formed wide, and the positioning accuracy (tube Accuracy of contact between the probe element and the protruding terminal) is improved. Further, since the tip end position of the needle-shaped probe element is located so as to project in the axial direction from the inner edge position of the tapered surface, the abutting contact between the inserted protruding terminal and the pin-shaped probe element located inside the cylinder is ensured. Can be made. Further, since the tip edge of the pin-shaped terminal forms a linear contact shape in the circumferential direction with the tapered surface of the cylindrical probe element, contact failure is less likely to occur.

The tip edge position of the pin-shaped probe element can be set to be more recessed in the axial direction than the outer edge position of the tapered surface. By doing this, when the first terminal portion that becomes the protruding terminal (for example, a pin) is targeted, the protruding terminal is inserted into the cylinder, and after the positioning by the cylindrical probe, the pin-shaped probe element is It comes into contact. Therefore, at the time of contact, the first terminal portion and the first measurement probe can be surely brought into contact with each other once.

The second measuring probe is sharpened on the tip side with the direction of contact with the second terminal portion as the tip side, and one is a current-carrying probe element and the other is a voltage-measuring probe element. And a pair of needle-shaped probe elements that are arranged in a state in which the needle-shaped probe elements are inclined in opposite directions with respect to the abutting direction so that the arrangement interval becomes narrower toward the distal end side. Can be used. By doing so, the space between the needle-like probes at the tip of the second measurement probe can be set to be a narrow width, so that the contact range (contact width) of the second measurement probe can be made small and a minute second terminal portion is provided. Or
The contact is possible even when the distance between the second terminal portions is narrow.

Further, according to the present invention, a plurality of second terminal portions each composed of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and each second terminal is formed on the other plate surface. A plurality of first terminal portions corresponding to each part are arranged and formed two-dimensionally, and those corresponding to each other of the second terminal portion and the first terminal portion are individually connected by a wiring net including a via. A substrate forming step of obtaining a substrate with bumps having the structure described above, and using the above-mentioned substrate inspection device, with respect to the second terminal portion composed of solder bumps corresponding to the wiring net to be inspected, the solder bumps having a predetermined depth As the measurement hole is formed, the tip of the second measurement probe is brought into contact with it in such a manner as to bite into it, and the second measurement probe is brought into contact with the second terminal portion corresponding to the wiring net, In that state, the second measurement probe and the first An electric resistance value information generating step of supplying a measurement current to the wiring net through the measurement probe to generate electric resistance value information of the wiring net, and the wiring net based on the generated electric resistance value information. There is provided a substrate manufacturing method characterized by including an inspection information generating step of generating inspection information regarding the quality of and a selecting step of selecting only substrates whose generated inspection information satisfies a predetermined condition.

As described above, the electric resistance value information generated in the electric resistance value information generating step is compared with the reference information to generate the inspection information in the inspection information generating step, and the inspection information selects only a predetermined substrate. By including the sorting step, it is possible to easily and accurately distinguish good products from defective products and to realize a substrate manufacturing method capable of obtaining high-quality products.

Further, when the depth of the measurement hole is d1 and the height of the solder bump is H, the second measurement probe is solder bump so that d1 / H is in the range of 0.1 to 0.9. It is possible to use a method for manufacturing a substrate that is cut into.

In the electric resistance value information generating step, when the second measurement probe bites into the solder bump and the ratio of the hole depth to the solder bump height d1 / H is smaller than this range, sufficient contact is achieved. The state may not be maintained and the contact resistance may increase or become unstable, and if it is larger than this range, the load generated on the solder bumps increases and the load on the board increases (solder bump collapse, board wiring It leads to disconnection, etc.). Therefore, by making the second measurement probe bite into the solder bump so as to form the measurement hole in this range, it becomes possible to perform the resistance value measurement with high accuracy, and thus to provide a substrate with bumps of high quality. Becomes

The ratio S1 / S0 to the bottom area S0 of the bump is S1, where S1 is the area of the hole opening of the measurement hole in plan view.
May be set to 0.002 to 0.45 so that the second measurement probe bites into the solder bump.

When the ratio S1 / S0 is smaller than this range, the second measuring probe and the solder bump are not in good contact with each other, and the contact resistance increases or becomes unstable. Also,
When the ratio is larger than this range, not only the appearance is not good, but the possibility that the bumps may be broken or the wiring of the substrate may be broken due to the crushing of the solder bumps or the measurement holes. Therefore, by using the substrate manufacturing method in which the second measurement probe is digged into the solder bumps so that the ratio S1 / S0 falls within this range, it is possible to provide a good product while maintaining inspection accuracy.

The second measuring probe includes a pair of needle-like probe elements whose tip ends are sharply formed with the contact direction with the solder bumps as the tip end side, and these needle-like probe elements are directed toward the tip end side. As the arrangement interval becomes narrower, the ones are arranged in a state in which they are inclined in opposite directions with respect to the contact direction, one is used as a current-carrying probe element, and the other is used as a voltage-measuring probe element. A pair of probe elements, the distance between the tip of the current-carrying probe element in the contact direction with the second terminal portion and the tip of the voltage-measuring probe element with the second terminal portion in the contact direction is L. The ratio L / R to the diameter R of the bump is 0.2 to
The substrate manufacturing method may be 0.85.

The second measuring probe includes a pair of needle-like probe elements whose tip ends are sharply formed with the contact direction with the solder bumps on the tip side, and thus the second measurement probe uses two terminals such as the four-terminal method. It is possible to measure the resistance value (measurement of the resistance value where the influence of contact resistance is extremely small). When the ratio L / R of the pair of needle-shaped probe elements serving as these terminals is smaller than this range, for example, when the tip end distance L is short, both probe elements (current conducting probe element,
There is a high possibility that insulation failure (conduction) of the voltage measurement probe element) will occur, and if it is larger than this range, either or both probe elements may come off from the solder bumps to which they should contact. The resistance value inspection is highly effective. Therefore, by setting the ratio L / R in such a range, a specific electric resistance information generating step or the like can be performed in a good contact state, and a high quality product can be manufactured.

In the above-mentioned substrate manufacturing method, the second measurement probe bites into the surface layer portion of at least a part of the solder bump to open on the surface of the solder bump 1 respectively.
A pair of measurement holes is formed, and the ratio r / R of the pair of measurement holes to the diameter R of the solder bump is r, where r is the inter-hole distance defined as the geometric center of gravity distance of the hole openings in plan view. The second measuring probe may be made to bite into the solder bump so that the value becomes 0.2 to 0.85.

Ratio of interhole distance to solder bump diameter r /
If R is smaller than this range, it is difficult to completely insulate the current-carrying probe element from the voltage measuring probe element (it becomes easy for both probe elements to contact due to vibration etc.), and if R is larger than this range, There is a high possibility that one terminal of the two-measurement probe will come off the solder bump. Therefore, by forming the measurement hole so as to fall within this range, the electrical resistance value information generation step and the like can be performed in a favorable contact state between the second measurement probe and the solder bump.

By the biting of the second measuring probe, a pair of measuring holes respectively opening on the surface of the solder bump are formed in the surface layer portion of at least a part of the solder bump.
When the depth of each pair of measurement holes is d2 and the height of the solder bump is H, the second measurement probe is bited into the solder bump so that d2 / H is 0.1 to 0.9. You can also

For example, when two terminals are brought into contact with the solder bumps to measure the resistance value by the four-terminal method or the like, the ratio of the depth of the pair of measurement holes to the height of the solder bumps d2 / H.
Is less than this range, a sufficient contact state cannot be maintained at both terminals that are in contact, and the contact resistance may increase or become unstable. If it is larger than this range, the load generated on the solder bumps increases and the load on the substrate increases (leads to crushing of the solder bumps, disconnection of the wiring of the substrate, etc.). Therefore, by forming the measurement holes in this range, it is possible to perform the electrical resistance value information generation process (eg, the resistance value inspection process by the 4-terminal method) in a good state on the bumped substrate, In that process, the shape change of the solder bump can be made minute and the quality can be maintained.

The pair of measurement holes each have a substantially V-shaped vertical cross-sectional shape whose axial cross-sectional area decreases toward the bottom, and are inclined in the depth direction so as to approach each other on the V-shaped bottom side. The method of manufacturing a substrate formed by

By forming a substantially V-shaped axial cross-sectional shape in which the axial cross-sectional area is reduced at the bottom of the measurement hole, scratches on the solder bumps become minor at the bottom of the hole, and the wiring to the board wiring is reduced. The influence of the measurement hole can be reduced, which leads to protection of the wiring. Further, by forming them so as to be inclined toward each other on the V-shaped bottom side in the depth direction, the hole interval can be narrowed and can be kept within an appropriate range. Therefore, the quality of the solder bumps can be maintained while reliably performing the resistance value inspection and the like in the electric resistance value information generating step.

In the above substrate manufacturing method, the ratio S2 / S0 to the bump bottom area S0 is 0.002 to 0.4, where S2 is the total area of the hole openings of the pair of measurement holes in plan view.
It is also possible to make the second measurement probe bite into the solder bump so as to be 5.

When the ratio S2 / S0 is smaller than this range, for example, in the four-terminal method or the like, the two terminals are not in good contact with the solder bumps (the two terminals are good with the solder bumps). It is not possible to secure a sufficient contact area for electrical continuity.) The contact resistance increases or becomes unstable. Also,
When the ratio is larger than this range, not only the appearance is not good, but the possibility that the bumps may be broken or the wiring of the substrate may be broken due to the crushing of the solder bumps or the measurement holes. Therefore, by making the second measurement probe bite into the solder bump so as to take this range in the electric resistance value information generation step, it is possible to provide a high-quality bumped substrate with a reliable inspection.

Further, according to the present invention, by using the continuity inspection probe as the second measurement probe and contacting the solder bump while forming the second measurement hole, the probe can be contacted with the electrical resistance information at that time. A first inspection information generating step for generating first inspection information relating to the conduction state of the corresponding wiring net based on the above, and a first selection for selecting only a board whose generated first inspection information satisfies a predetermined condition as a non-defective product Process and a pair of needle-shaped probe elements as second measurement probes for the substrates selected as non-defective products in the first selection process, and a pair of solder bumps each having an opening on the surface of the solder bump. While forming the first measurement hole,
These probes bite into contact, and in that state, one of the needle-shaped probes is used as a current-conducting probe element to supply a measuring current to the wiring net, while the other needle-shaped probe is used as a voltage-measuring probe element. By measuring the applied voltage level to the wiring net, and generating specific electric resistance value information generating means for generating information reflecting the specific electric resistance value of the wiring net, and the generated specific electric resistance value information. By comparing with the reference information individually determined for each, the second inspection information generation step regarding the quality of the wiring net, and the second inspection information generated is selected only the substrate that satisfies the predetermined condition A substrate manufacturing method including a sorting step is provided.

As described above, by having the first inspection information generating step and the second inspection information generating step, it is possible to synergistically prevent the inspection failure of the defective product, and it is possible to remove the defective product with extremely high accuracy. . In addition, a first inspection information generation step of generating first inspection information relating to the conduction state (for example, a conduction inspection step as a step of inspecting whether or not the wiring net is conducted)
And a second inspection information generation step regarding the quality of the wiring net (for example, a resistance value inspection as a step of measuring a resistance value unique to each wiring net) is separated, and defective products are removed independently in each step. As a result, duplicate inspection of defective products can be reduced. For example, the defective product detected in the continuity inspection process may be removed in the first screening process, and the resistance value inspection process and the second screening process may be performed only on the remaining products, so the inspection time of the resistance value inspection process is shortened. It will be possible.

In the second inspection information generating step, the second measuring probe can be brought into contact with the surface of the solder bump other than the second measuring hole. When the second measurement probe is brought into contact with the second measurement hole portion by the first inspection information generation step (for example, when one probe element of the second measurement probe is inserted into the second measurement hole), Since the contact surface is not flat, the second measurement probe is tilted and abutted, resulting in an unstable contact state. Therefore, when abutting on a flat bump surface on which the second measurement hole is not formed, a stable contact is maintained and a good contact state is achieved, which is a second inspection information generation step capable of highly accurate resistance value measurement. .

Further, according to the present invention, a plurality of second terminal portions each composed of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and each second terminal portion is formed on the other plate surface. Are arranged and formed in a two-dimensional manner, and corresponding ones of the first terminal portion and the second terminal portion are individually connected by a wiring net including a via. Provided is a substrate with bumps, which has a structure described above, and in which a measurement hole having a predetermined depth that opens to the surface of the solder bump is formed in the surface layer portion of at least a part of the solder bump. .

As described above, by setting the measurement hole formed in the solder bump to a predetermined depth, it can be used as an index for confirming whether or not the unique electrical information generating step is normally performed in the solder bump. For example, after the measurement holes are formed, the bump surface is inspected (for example, the inspection method shown in Japanese Patent No. 2881146 is used), and if the measurement holes are not formed, it is determined that the measurement is abnormal, or the product is removed again. In addition, it is also possible to detect defects in the inspection state (it has been found that there is a cause that causes an abnormality in the inspection in any of the elements related to the inspection, such as the inspection device, the board, the inspection environment, etc.). Will be). If the measurement hole to be formed is not formed to a predetermined depth, it can be judged to be abnormal.

In the substrate with bumps, the depth of the measurement hole is d
1. When the height of the bump from the substrate surface is H, d
You may make it adjust 1 / H in the range of 0.1-0.9. Ratio of hole depth to solder bump height d1 /
If H is smaller than this range, a sufficient contact state may not be maintained and contact resistance may increase or become unstable. Load increases (leads to collapse of solder bumps, disconnection of board wiring, etc.). Therefore, if a measurement hole in this range is formed, it indicates that the inspection was performed in a good inspection state, and if not, it indicates an abnormality in the inspection state. can do.

Supposing the area of the hole opening of the measurement hole in plan view to be S1, the ratio S1 / S0 to the bump bottom area S0.
You may form a board | substrate with a bump so that it may become the range of 0.002-0.45.

If the ratio S1 / S0 is smaller than this range, the second measuring probe and the solder bump are not in good contact with each other, and the contact resistance increases or becomes unstable. Also,
When the ratio is larger than this range, not only the appearance is not good, but the possibility that the bumps may be broken or the wiring of the substrate may be broken due to the crushing of the solder bumps or the measurement holes. Therefore, if the ratio S / S0 is within this range, it indicates that a good inspection has been performed, and thus the quality of the inspection can be determined by the measurement hole.

Further, in the above-mentioned substrate with bumps, the measurement holes may be formed with a pair of measurement holes each opening on the surface of the solder bump. in this way,
By using a substrate with bumps in which a pair of measurement holes are formed, for example, when a resistance measurement method of contacting two terminals with a solder bump such as a four-terminal method is used, the two terminals are well It can be determined whether or not they have come into contact with each other. For example, when a pair of measurement holes is not formed in the bump to be formed when the resistance value measurement is completed, it can be confirmed that the resistance value measurement is in an abnormal state, and the bump is subjected to the resistance value measurement inspection. It turns out to be inadequate. Therefore, it is possible to re-inspect that the measurement is abnormal, remove the product, etc., and also detect the defect in the inspection state (inspection device, board, inspection environment, etc. It turns out that there is a cause that induces abnormal inspection).

Further, the depth d of each of the pair of measurement holes
2. When the height of the solder bump is H, d2 / H can be adjusted in the range of 0.1 to 0.9. Four
When the resistance value is measured by bringing two terminals into contact with the solder bumps by a terminal method or the like, and the ratio d2 / H of the depth of the pair of measurement holes to the height of the solder bumps is smaller than this range, There is a possibility that a sufficient abutting state cannot be maintained at both abutting terminals and the contact resistance increases or becomes unstable.
If it is larger than this range, the load generated on the solder bumps increases and the load on the substrate increases (leads to crushing of the solder bumps, disconnection of the wiring of the substrate, etc.). Therefore, by forming the measurement holes in this range, it is possible to prove that the resistance value measurement (four-terminal method or the like) was accurately performed on the substrate with bumps (the proof mark is formed on the solder bump). It can be useful in quality control.

Supposing that the total area of the hole openings of the pair of measurement holes in plan view is S2, the bump bottom area S0
The substrate with bumps may be formed so that the ratio S2 / S0 to 0.002 to 0.45 is 0.002 to 0.45. When the ratio S2 / S0 is smaller than this range, for example, in the four-terminal method or the like, a good contact state between the two terminals and the solder bump is not obtained (the two terminals have good conduction with the solder bump). Therefore, a sufficient contact area cannot be secured) and the contact resistance increases or becomes unstable. Further, if the ratio is larger than this range, not only the appearance is not good, but also the possibility that the bumps may break the wiring of the substrate due to the collapse of the solder bumps or the measurement holes. Therefore, the measurement hole in this range is a proof that a good inspection condition was performed,
The solder bump having such a measurement hole contributes to quality control.

Further, the measurement hole includes a first measurement hole as a pair of measurement holes and a second measurement hole different from the first measurement hole.
Can be included. In this way, by forming a pair of measurement holes and a second measurement hole that is different from the pair of measurement holes, separate inspection steps (for example, an inspection step of the conductive state of the wiring net and a specific resistance in the wiring net) are performed. This proves that the value inspection process) was performed with solder bumps. Therefore, on the other hand, if the formation of the measurement hole is insufficient, it can be determined that the solder bump does not normally pass through the inspection process, and the first measurement hole and the second measurement hole are used as an index for the determination. Will have value.

The second measuring hole can be formed on the substrate with bumps so that the area and the depth of the opening of the second measuring hole are both larger than those of the first measuring hole. By forming them with such a difference, the first measurement hole and the second measurement hole can be clearly distinguished after the inspection is completed, and the contact state of each process can be grasped.

Assuming that the total area of the hole openings of the first measurement hole and the second measurement hole in plan view is S3, the ratio S3 / S0 to the bump bottom area S0 is 0.002 to 0.002.
You may form a board | substrate with a bump so that it may become 0.45. When the ratio S3 / S0 is smaller than this range,
This indicates that abnormal contact has occurred in at least one of the steps of forming the first measurement hole and the second measurement hole, and an abnormality in the inspection can be detected by the measurement hole. Further, if the ratio is larger than this range, not only the appearance is not good, but also the possibility that the bumps may break the wiring of the substrate due to the collapse of the solder bumps or the measurement holes. Therefore, the measurement holes in this range prove that a good inspection state has been performed, and the inspection can be confirmed by the solder bumps having such measurement holes.

The ratio r / R to the diameter R of the solder bump is 0.2 to 0, where r is the inter-hole distance defined as the geometric center-of-gravity distance of each hole opening of the first measurement hole in plan view. You may form so that it may take the range of 0.85.

Ratio of interhole distance to solder bump diameter r /
If R is smaller than this range, it is difficult to completely insulate the current-carrying probe element from the voltage measuring probe element (it becomes easy for both probe elements to contact due to vibration etc.), and if R is larger than this range, There is a high possibility that one terminal of the two-measurement probe will come off the solder bump. Therefore, the measurement holes in this range prove that a good inspection state has been performed, and the inspection can be confirmed by the solder bumps having such measurement holes.

Each of the pair of measurement holes has a substantially V-shaped vertical cross-sectional shape whose axial cross-sectional area decreases toward the bottom, and is inclined in the depth direction so as to approach each other on the V-shaped bottom side. The bumped substrate can be formed as described above.

By forming a substantially V-shaped axial cross-sectional shape in which the axial cross-sectional area is reduced at the bottom of the measurement hole, the scratches on the solder bumps at the bottom of the hole become slight, and the wiring to the substrate wiring is reduced. The influence of the measurement hole can be reduced, which leads to protection of the wiring. Further, by forming them so as to be inclined toward each other on the V-shaped bottom side in the depth direction, the hole interval can be narrowed and can be kept within an appropriate range. Therefore, the measurement hole formed in this way proves that a good inspection state has been performed, and the inspection can be confirmed by the solder bump having such a measurement hole.

[0068]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below with reference to the examples shown in the drawings. Resistance value inspection device 1
(Hereinafter, also simply referred to as the inspection apparatus 1) is a plurality of first terminals on one plate surface (the back surface of the substrate in FIG. 1) of the substrate body 14 (hereinafter, also simply referred to as the substrate 14) as the object to be inspected. Parts are arranged and formed two-dimensionally, and solder bumps 6 as second terminal parts corresponding to the first terminal parts are arranged and formed two-dimensionally on the other plate surface (the substrate surface in FIG. 1). Has been prepared. The corresponding ones of the first terminal portions and the solder bumps 6 serving as the second terminal portions are individually connected by a wiring net including vias formed in the substrate. As the plurality of first terminal portions, for example, a land is provided in a land grid array (hereinafter, simply referred to as LGA) and a pin is provided in a pin grid array (hereinafter, simply referred to as PGA).

Examples of the structure of the substrate body 14 to be inspected include those shown in FIGS. 22 and 23. A plan view is shown in FIG. 22 and a sectional structure is shown in FIG. 23. The structure will be described below. The substrate 14 is, for example, about 25 mm square and has a plate thickness of about 1 mm, and has the following structure. That is, the core material 80 formed of a heat resistant resin plate (for example, a bismaleimide-triazine resin plate), a fiber reinforced resin plate (for example, a glass fiber reinforced epoxy resin), or the like.
The core wiring pattern layer 7 is formed in a predetermined pattern on both surfaces of the
3, 74 are formed respectively. These core wiring pattern layers 73 and 74 are formed so as to cover most of the surface of the core material 80 and are used as a power supply layer or a ground layer. On the other hand, a through hole 78 is formed in the core material 80 by a drill or the like, and a through hole 7 conductor 76 for electrically connecting the core wiring pattern layers 73 and 74 to each other is formed on the inner wall surface thereof. The through holes 78 are filled with a resin filling material such as epoxy resin.

On the upper layers of the core wiring pattern layers 73 and 74, first buildup layers made of a resin such as a photosensitive epoxy resin are formed. Further, first wiring pattern layers 70 and 71 are formed on the surface by Cu plating, respectively. The core wiring pattern layer 7
The layers 3, 74 and the first wiring pattern layers 70, 71 are interconnected by via conductors. Similarly, a second resin buildup layer is formed on the upper layer of the first wiring pattern by a resin such as a photosensitive epoxy resin. Further, second wiring pattern layers 82 and 84 are formed on the surface thereof by Cu plating. The first wiring pattern layers 70 and 71 and the second wiring pattern layer 8
Layers 2 and 84 are interconnected by via conductors. The surface of each of the core wiring pattern, the first wiring pattern layers 70, 71, and the second wiring pattern layers 82, 84 is subjected to a surface roughening treatment (for example, a chemical treatment to increase the adhesion strength with the upper resin layer). Based on) has been applied.

Further, on the second resin buildup layer, a large number of base conductive pads 90 which are electrically connected to the second wiring pattern layers 82 and 84 are provided. These underlying conductive pads 90 are arranged in a square shape in the substantially central portion of the substrate 14 by electroless Ni—P plating and Au plating, and form the chip mounting portion together with the solder bumps 6 formed on each of them. The solder bump 6 has a diameter of 133 μm and a height of 33 μm. The second wiring pattern layer 84 is used as a land as an external connection terminal. As described above, in the package substrate in which a large number of wirings are incorporated, a wiring net is formed with a specific resistance value for each wiring (for example, the wiring inside the board from the solder bump 6 to the corresponding land). Therefore, the inspection apparatus 1 inspects whether or not the wiring net is normally formed.

The device 1 has a probe (first measurement probe, second probe Measurement probe).
Then, the position is adjusted by the position adjusting means described later,
Position adjusting means that can be set at a specific position on the substrate 14 (any solder bump 6 on the substrate 14) is provided on one side (upper side in FIG. 1). As the inspection position, any one of the plurality of solder bumps 6 as second terminal portions formed on the upper surface of the substrate and connected to the wiring net is selected by the position adjusting means, and the selected solder bumps 6 and the second measurement probe 42 are selected. Will be abutted.

On the other side (the lower surface side of the substrate 14 in FIG. 1), there is provided a first measuring probe 10 which can be brought into contact with a first terminal portion (for example, land, pin, etc.) provided on the substrate 14. Multiple are arranged. Each first measurement probe 1
0 is provided so as to project to the substrate side at a position corresponding to the first terminal portion (eg, land, pin, etc.) formed on one side of the substrate (first measurement probe 10 side), and the first measurement probe group 13 is provided. Is forming. Then, a part or all of the first measurement probes 10 in the first measurement probe group 13 and the corresponding first terminal portions are brought into contact with each other by the approaching / contacting means described later, and the first terminals at the contacting position. It is possible to establish electrical continuity between the wiring inside the substrate having a portion at the end and the first measurement probe 10.

Then, in the state where the first measuring probe 10 and a part or all of the first terminal portion are in contact with each other, the second terminal portion position (corresponding solder bump) corresponding to the contact position of part or all of the first terminal portion 6 position) is selected and brought into contact with the second measurement probe 42, the second measurement probe 42 and the wiring in the substrate corresponding thereto are electrically connected via the first measurement probe 10, and the two probes are electrically connected. It becomes possible to be electrically conducted, and the resistance value inspection as the second inspection information generating step can be performed.

Further, the second measuring probe 42 and the first measuring probe 10 sandwich the substrate 14 to be the resistance measurement object as either the positive terminal or the negative terminal and the other terminal in the four-terminal resistance measuring method. Will be placed in. Each of the upper and lower probes has a source terminal as a current conducting probe element and a sense terminal as a voltage measuring probe element. The two probes are insulated from each other by being subjected to insulation treatment such as coating with an insulator. The source terminal and the sense terminal provided on each of the upper and lower probes have a current-carrying wiring 21 and a voltage measuring wiring 2, respectively.
The lead wire 2 is connected to the upper and lower sides, respectively, so that a circuit configuration that enables 4-terminal resistance measurement and the like is obtained. In this circuit configuration, the source terminals provided on the upper and lower sides are connected to the constant current source for measurement 48 (see FIG. 14) provided inside the measuring device 26 via the current-carrying wiring, and the sense terminals are for voltage measurement. It is connected to the voltage measuring device 50 (FIG. 14) in the measuring device 26 via wiring to perform resistance measurement such as 4-terminal resistance measurement.

When the first measuring probe 10 is moved by the approaching / contacting means described later and comes into contact with the substrate, the first measuring probe 10 corresponds to the land 9 as the first terminal portion as shown in FIG. Located in the land 9
Will come into contact with. And at the start of contact,
The tip of the first sense terminal 10b is pressed by the substrate 14 at the position of the land 9 and moves into the first source terminal 10a against the biasing force of the biasing means described later. When pressed down for a predetermined distance, the tip position of the first sense terminal 10b reaches the opening end of the first source terminal 10a, and at that time point, the first source terminal 10a comes into contact with the land 9.
That is, the land 9 as the first terminal portion on the substrate 14
Individually and simultaneously contact two probes (first source terminal 10a and first sense terminal 10b) that are electrically insulated from each other by applying a biasing force in the contact direction by the biasing means. It becomes possible to conduct electricity. The internal configuration of the first measurement probe 10 that brings about such an action will be described below.

FIG. 4 shows an enlarged view of an example of the first measuring probe 10, and FIG. 5 (a) shows a sectional view thereof.
The first measuring probe 10 of FIG. 4 is formed in a tubular shape with a first sense terminal 10b as a pin-shaped probe element having conductivity, the tip of which protrudes like a needle, and is slidably fitted to the first sense terminal 10b. A first source terminal 10a is provided as a cylindrical probe element having a combined conductivity. And
The first sense terminal 10b and the first source terminal 10a are electrically insulated from each other by being subjected to an insulating treatment such as coating at their contact portions with an insulator. Then, the first sense terminal 10b is provided with a second coil spring 17 as a second elastic biasing member having conductivity as a biasing means capable of biasing in the substrate direction, and further, the first source terminal 10a is also provided. A first coil spring 16 serving as a first elastic biasing member having conductivity is provided as a biasing unit capable of biasing in the substrate direction. The first sense terminal 10b is electrically connected to the second coil spring 17, and the second coil spring 17 is electrically connected to the terminal 18 electrically insulated from the conductive base portion 28. . Therefore, the first sense terminal 10b and the voltage measuring wiring 22 can be electrically connected, and the elements (the second elastic biasing member 17, the terminal 18, etc.) electrically connected to the first sense terminal 10b can be electrically connected to the voltage measuring wiring 22. Will form part of.

Further, at the lower end of the first source terminal 10a, a first coil spring 16 as a first elastic biasing member having conductivity as a biasing means is conductively connected, and the first coil spring 26 is The other end is conductively connected to a conductive base portion 28 formed of a conductive material (eg, copper). Therefore, the first source terminal can also be electrically connected to the current-carrying wiring 21 through the base portion 28. Further, the first coil spring 16 and the second coil spring 17 are electrically insulated (may be subjected to insulation treatment by coating with an insulator or the like). The elements (the first elastic biasing member 16 and the base portion 28) that are electrically connected to the first source terminal 10a are the current-carrying wires 21.
It becomes an element that constitutes a part of.

Then, the first measurement probe 10 is attached to the substrate 14
When contacting the first terminal portion (land 9 in FIG. 5 (b)) of the above, the tip of the first sense terminal 10b and the tip of the first source terminal 10a are both contacted and connected to both probes. Elastic biasing member (first and second coil springs 1
6 and 17) are independently pressed by a predetermined distance against the urging force. Then, when the resistance value is measured, both the probes are provided with the first terminal portion (for example, as shown in FIG.
In the state of being in contact with the land 9) in (b), they are independently biased in the contact direction. Further, the first source terminal 10a and the second sense terminal 10b form a probe main body at the tip end portion (the tip end of the needle-like portion in the first sense terminal 10b, the open end in the first source terminal 10a) that abuts the first terminal portion. The conductive substance (for example, copper) that is exposed is exposed, and the first terminal portion and both terminals can be electrically connected to each other at the time of contact. In addition, in both terminals, it is possible to conduct electricity independently from the contact portion with the first terminal portion to each wiring, but during this period, both terminals and the elements (coil spring Etc.) are electrically isolated.

As shown in FIG. 2, the plurality of first measurement probes 10 abutting on the respective first terminal portions of the substrate 14 are connected to each probe by the voltage measurement wiring 22 which is electrically connected to the first sense terminal 10b. It The conductive base portion 28 that is electrically connected to the first source terminal 10a of each probe is a common connection that is electrically connected to all the first source terminals 10a, and the current supply wiring 21 is connected to the common connection. It will be. In addition, the voltage measuring wiring 22 connected to each terminal 18 is connected to a plurality of lower auxiliary terminals 33 provided on the lower surface side of the auxiliary terminal holding plate 25 provided at another position of the substrate 14 as shown in FIG. It is connected. The position where the voltage measurement wiring 22 is connected to the lower auxiliary terminal 33 is provided in correspondence with the conductive position on the substrate 14. That is, the same arrangement as the arrangement configuration of the first terminal portion of the substrate 14,
Alternatively, it is developed on the auxiliary terminal holding plate 25 in an arrangement that can be related to the arrangement. In this example,
The same array configuration is used.

In FIG. 3, a method of attaching the substrate 14 as the resistance measurement object will be described. The substrate 14 is positioned on the work setting table 34 by being placed in a recess formed in the work setting table 34 so as to fit the substrate 14 by a work attaching mechanism (not shown). Then, in the jig 36 in which the recess is formed so that the work setting table 34 can be fitted, the work setting table 34 is placed by the work attaching mechanism mechanism. The work setting table 34 has holes 41 formed at positions corresponding to the respective probe positions of the first measurement probe group 13 fixed on the jig 36. When the work setting table 34 is placed on the jig 36, the holes 41 are formed. The first measurement probes 10 corresponding to 41 are inserted.

Since the protruding length of each inserted probe from the base portion 28 to the tip of each probe is formed longer than the length of the hole, the first measuring probe is attached when it is attached to the jig 36 of the work setting table 34. The group 13 penetrates the hole 41, and its tip (the tip of the needle-shaped portion of the first sense terminal 10b in FIG. 4) contacts the first terminal portion (land 9) formed on the substrate 14. The work attaching mechanism is provided with an urging means for urging the work setting table 34 and the substrate 14 toward the jig 36. As an example of the urging means, in the present embodiment, the lower portion of the jig 36 is in a depressurized state, The air between the work setting table 34 and the jig 36 is used to draw the air intake holes 3 formed in the jig 36.
8 and a vacuuming device for sucking through the air intake hole 40 formed in the base portion 28. The work setting table 34 and the substrate 14 are sucked by this vacuuming device, and a biasing force is applied in the direction of the jig 36 and the first measurement probe group 13. In this way, the work setting table 34 is biased toward the jig 36, so that the first terminal portion (land 9) abuts on the tip of the first measuring probe 10, and then the first measuring probe 10 continues. By pressing the tip end, as shown in FIG. 5B, the first sense terminal 10 is pressed.
Both b and the first source terminal 10a are urged by the elastic urging member in the direction of the first terminal portion (land 9) and brought into contact with the first terminal portion (land 9).

The shape of the first measurement probe may be as shown in FIG. The substrate 1 is shown in FIG.
4 shows a pin grid array (hereinafter, also simply referred to as PGA) in which the pins 12 project on the lower surface, and the first measurement probe 10 has a configuration in which the pins 12 are inserted into the recesses in the tip portion and positioned. As shown in FIG.
The first sense terminal 10b is slidably fitted to the first source terminal 10a, and both terminals 10a and 10b are independently movable up and down in the holder 11. First source terminal 1
0a is formed in a tubular shape and has a tapered surface that is retracted toward the center of the axial cross section at the tip end surface. The first sense terminal 10b has a sharp tip, and the tip is located near the open end of the first source terminal 10a.

As shown in FIG. 9, the first sense terminal 1
The upper ends of both probes may be aligned such that the tip of 0b is located at the upper end of the first source terminal 10a, but the tip of the first source terminal 10a is slightly closer to the device under test than the tip of the first sense terminal 10b. The positions may be close to each other. That is, the tip edge position of the sense terminal 10b as the pin-shaped probe element can be set to be more recessed in the axial direction than the outer edge position of the tapered surface of the first source terminal as the cylindrical probe element. In this way, the pin 12 as the first terminal portion is inserted into the concave portion of the first source terminal 10a to restrain the lateral shift, and then the first sense terminal 10b.
Since the taper surface of (1) comes into contact with the outer edge of the tip end surface of the pin 12, the contact area can be increased, and the displacement of the pin is prevented, and the positioning accuracy of the first measurement probe 10 with respect to the pin is improved. Further, the tip end portion of the first sense terminal 10b serving as the pin-shaped probe element may be arranged so as to protrude by a predetermined amount from the tip edge of the first source terminal 10a serving as the tubular probe element. By doing so, the load can be concentrated on the pin tip when the pin-shaped probe element is in contact, and the contact state of the pin-shaped probe element can be ensured.

10 and 11 show the internal structure of the first measuring probe 10 having the shape shown in FIG. Similar to the internal configuration shown in FIGS. 4 and 5, the first source terminal 10a is connected to one end of a first coil spring 16 having conductivity as a first elastic biasing member so as to be able to conduct electricity. A base portion 28 having a common conductive connection is connected to the other end of the coil spring 16.
Further, as shown in FIG. 11, the first source terminal 10a
A second coil spring 1 having conductivity as a second elastic biasing member also in a first sense terminal 10b slidably fitted with
7 is connected, and the other end of the second coil spring 17 is connected to a terminal 18 which is electrically connected to the voltage measurement wiring 22. Therefore, the first sense terminal 10b can be electrically connected to the voltage measurement wiring 22. Then, as shown in FIG. 11, when the pin 12 comes into contact with the first measurement probe 10 and the first source terminal 10a and the first sense terminal 10b are pressed by a predetermined amount, the first and second coil springs 16 are provided. , 17 biases the terminals 10a, 10b toward the pin 12, and the contact state between the pin 12 and the first measurement probe 10 is maintained in the biased state. Such abutting allows good conduction between the pin 12 as the first terminal portion and the first measuring probe 10, and the contact resistance is stable at a low value.

FIG. 8 shows an example of how to attach the substrate 14 (see FIG. 6) having such pins 12. As in the case of FIG. 3, the work mounting mechanism (not shown) causes the substrate 14 to be mounted in a recess formed in the work mounting base 34 at a predetermined position so that the substrate 14 fits on the work mounting base 34. In the jig 36 in which the concave portion is formed so that the work setting table 34 can be fitted with the work setting table 34, the work setting table 34 is placed by the work attaching mechanism mechanism. The work placement table 34 includes the pins 1 protruding from the respective probe positions of the first measurement probe group 13 fixed on the jig 36 and the substrate 14.
Holes 41 are formed corresponding to the positions of 2, and the pins 12 are installed in the corresponding holes 41 before installation of the jig 36, as shown in FIG. When the work placement table 34 is placed on the jig 36, the holes 4
The first measurement probe 10 corresponding to each No. 1 is inserted, and the first measurement probe 10 and the pin 12 come into contact with each other as described above (see FIGS. 10 and 11). Further, the work setting table 34 and the substrate 14 are set on the jig 36 by
Similar to the installation in FIG. 3, an urging means such as a vacuuming device applies an urging force toward the jig 36 to the work setting table 34 and the substrate 14.

Further, by arranging the first measurement probe group in a matrix form, the versatility can be shared by a substrate having a fixed external terminal matrix (pin spacing in FIG. 6). The term "substrate having a fixed external terminal matrix" as used herein means a substrate in which the external terminals provided on the substrate are present only on the lattice points of a predetermined matrix. It should be noted that the predetermined matrix is a matrix in which the existing positions of the probes formed by the probe group (inspection positions by the probes) are grid points. In the case of a plurality of types of substrates in which the external terminals are located at the lattice points in the same matrix but the positions where the external terminals are present are slightly different, for example, for the substrate 14 having the pin arrangement shown in FIG. Although the reference pin arrangement is the same as shown in a), it can be shared by the boards 14 having different pin existing positions in some parts.

As described above, since the first probe group 13 is constituted by the reference matrix, the first terminal portions arranged on the lattice points of the matrix can be covered,
Even when the first terminal portion is not arranged at a part of the grid point, if the arranged first terminal portion is on the matrix, the first measurement probe group 13 is provided at the first terminal portion.
Can be shared. As another example, as long as they have the same matrix configuration, even if the arrangement positions of the pins 12 are different from those in FIG. 6 or FIG. 7A as shown in FIG. The group 13 can be shared. Therefore, the versatility is high, which helps to reduce the inspection cost and the manufacturing cost. The matrix referred to here may be a rectangular or square array having a predetermined number of rows and columns, but is not limited to this. By configuring a first measurement probe group that covers the first terminal portion on various substrates with different first terminal positions, it becomes a first measurement probe group that can be shared by those substrates, and it has versatility. You can

Next, the second measuring probe 4 in the inspection device
2 and an example of a method of adjusting the position of the auxiliary measurement probe 27 will be described. FIG. 12 shows a block diagram of the device configuration. The inspection device includes a CPU 101 that controls input / output signals, a ROM 102 that stores an inspection program and the like, and a RAM 103 that stores inspection data and the like.
Further, it has an input device 104 such as a mouse for inputting settings and the like, a keyboard, a display for outputting inspection results and the like, an output device 105 such as a printer, and an external storage device 106 for storing inspection results and the like. .. Further, the measuring device 26 that enables resistance measurement in the inspection device 1, the A / D converter 111 that digitizes the measurement data from the measuring device 26, and the position adjusting means 112 that enables position adjustment of the second measuring probe 42. A work mounting mechanism 115 for mounting a substrate as a work on a jig is provided.

When the inspection is started, an instruction is issued according to the inspection program stored in the ROM 102, and the CPU 1
01 sends a signal for setting the work to the work attaching mechanism 115, the work is placed on the work holding plate 34, and the work holding plate 34 is urged by the urging means such as the vacuuming device described above.
Is urged toward the jig 36. Then, the position adjusting means 112 is driven in response to the signal from the CPU 101. At this time, X, Y, through the servo drive unit
The drive motors 44, 45, and 46, which are movable in the positive and negative directions of Z, are driven to predetermined positions. At this time, an image of the work set on the jig 36 before starting the inspection is captured by an image pickup device such as a CCD camera, and an acquired image and a registered image (preliminarily registered by CAD data or the like, the reference shape of the substrate, the substrate The position is corrected by comparing with an image having information such as reference center coordinates. The X drive motor 44 and the Y drive motor 45 are moved in a predetermined direction with reference to the center position coordinate in consideration of the position correction.

As shown in FIG. 13, the second measuring probe 42 can be moved in the positive and negative directions of XYZ by its drive motor, and the X drive motor 44 and the Y drive motor 45 are provided.
After being moved in a plane corresponding to the inspection position on the plane of the substrate 14 by the Z drive motor 46,
Approach and leave 4.

The inspection position where the second measuring probe 42 moved by the position adjusting means comes into contact is the position where the second terminal portion is present on the upper surface of the substrate and the wiring inside the substrate (wiring) is formed in the substrate 14. The position at which the first measuring probe 10 provided in the lower portion can be electrically connected is designated by a net. The second measuring probe 42 is moved to the designated position by the position adjusting means. The designated inspection position may be randomly selected from a plurality of second terminal portions (for example, a plurality of solder bumps 6) existing on the substrate 14, or a predetermined inspection position (determined). The solder bumps 6) may be measured. Also in the auxiliary measurement probe 27, the auxiliary terminal position corresponding to the measurement wiring net of the auxiliary terminal holding plate 25 is selected by the same position adjustment method, and the auxiliary measurement probe 27 comes into contact with the auxiliary terminal position. In this way, the second measurement probe 42 and the auxiliary measurement probe 27 select terminals corresponding to the measurement wiring net, and the resistance value generated in the wiring net is measured by the measuring device 26 (FIG. 1).

Next, the substrate 14, the second measuring probe 42,
The circuit configuration of the first measurement probe 10, the inspection device 26, the auxiliary terminal holding plate 25, etc. will be described. FIG. 14 simply shows the circuit configuration of the inspection apparatus shown in FIG. In FIG. 14, the land 9 as the first terminal portion is the substrate 14
Are provided in plurality to form a first terminal portion group. And
The first measuring probe 10 is in contact with the first terminal portion so that the first measuring probe 10 can be conducted.
Are connected in common by the current-carrying wiring 21. The current-carrying wiring 21 is connected to one terminal of the measuring constant-current power supply 48, and the other terminal also carries the current-carrying wiring 2.
1 is connected, and the second measurement probe 4 is connected to the wiring.
The second source terminal 42a as a current-carrying probe element in 2 is connected. By being wired in this way, a constant current is passed through the board internal wiring 7 as the resistance measurement target portion.

Then, the voltage can be measured at the position (the rightmost solder bump 8 in FIG. 14) selected by the second measurement probe 42 among the plurality of solder bumps 6 as the second measurement terminals. , Voltage measurement probe elements (first sense terminal 10b, second sense terminal 42
b) is the first and second terminal portions (land 9, solder bump 6)
Abut each. The voltage measurement wiring 22 from the first sense terminal 10b is connected to the voltage measurement device 50 via the auxiliary terminals 32 and 33 and the connection between them, the auxiliary probe 27, and the like, and further from the second sense terminal 42b. The voltage measurement wiring 22 is also connected to the voltage measurement device 50. In this way, the current-carrying circuit including the current-carrying wiring 21 and the voltage-measuring circuit including the voltage-measuring wiring 22 are configured to measure the four terminals of the board internal wiring 7 (wiring net) as the resistance-measured portion. It is possible to measure the resistance by the method.

In this inspection apparatus, the position of the second measuring probe 42 and the auxiliary probe 27 is adjusted by the position adjusting means, and they are brought into contact with the corresponding terminals. However, as shown in FIG. 15, if the wiring is incorrect (in FIG. 15, the auxiliary probe 27 should be correctly connected to the terminal of A1 but is incorrectly connected to B1), the measurement is performed. In addition to the resistance value between the first and second measurement probes 10 and 42 (A1 portion in FIG. 15) to be measured, when a current flows through an unnecessary resistance element (inter-probe wiring of an arrow 60a portion). Segment 43
, The contact resistance between the terminal and the probe when a current flows through the portion indicated by the arrow 60b). In this case, the resistance of the segment 43 and the contact resistance of the land 9 at the B1 position with the probe 10 are unstable, and are values that occupy most of the entire resistance value. In such a case, is it due to a defect in the internal wiring 7 of the board at the resistance measurement position (position A1 in FIG. 15) or is the connection information incorrect (the position where the second measurement probe 42 and the auxiliary probe 27 correspond). It may be difficult to judge from the measured values. Therefore, the problem can be solved by using the circuit configuration as shown in FIG. 16 and using the leakage current suppressing means. The explanation will be given below.

As shown in FIG. 16, in the common wiring connected to the first measurement probe 10, in the segment 43 which becomes the inter-probe wiring, the wiring segment 4
3 is provided with a resistor 46 as a leakage current suppressing means for suppressing the leakage of the measurement current. It is assumed that the resistor 46 has a value sufficiently larger than the reference information of the resistance value of the board internal wiring 7 (made sufficiently larger than the contact resistance generated between the probe and the terminal). Then, as shown in FIG. 16, when the second measurement probe 42 and the auxiliary measurement probe 27 are erroneously connected to different wiring nets, the wiring of the measurement current is performed by the resistor 46 serving as the leakage current suppressing means. Leakage to the segment 46 (current leakage in the direction of arrow 60a) is suppressed, and the measured resistance value is sufficiently larger than the reference information (that is, most of the measured resistance value is due to the resistor 46). Things). Note that an element such as a diode or a diac may be used as the leakage current suppressing means without using the resistor.

FIG. 17 shows the shape of the second measuring probe 42. The second measurement probe 42 has a tip end side in the contact direction with the solder bumps 6 (downward direction in FIG. 17), and the tip end side is sharply formed, and one of them is a second source terminal 42a serving as a current-conducting probe element. , The other is the second sense terminal 42 as a probe element for voltage measurement.
The second measurement probe 42 is a pair of needle-shaped probe elements. Then, the needle-shaped probe elements are arranged close to each other on the tip side (note that the needle-shaped probe elements may be arranged such that the arrangement interval becomes narrower toward the tip side).

The second source terminal 42a and the second sense terminal 42b, which are needle-shaped probe elements, are movable in the approaching / separating direction with respect to the second terminal portion, and a biasing means for biasing in the movable direction. The elastic member 49 (for example, a coil spring) is provided. Then, the second measuring probe 42 which is in contact with the solder bump 6 by the position adjusting means described above.
Each terminal (second source terminal 42a, second sense terminal 42
In b), the contact state is maintained in the state of being urged in the contact direction with the solder bump 6. The second source terminal 42a and the second sense terminal 42b are insulated from each other by an insulating treatment such as coating with an insulator except at the contact position with the solder bump 6 (near the tip of the needle-shaped portion). In this way, by disposing the tip ends close to each other, the source terminal and the sense terminal can both come into contact with each other even if the terminal spacing of the second terminal portion (for example, the solder bump 6) and the terminal area are small. A four-terminal resistance measuring method or the like can be enabled.

Further, the tip of the second source terminal 42a as a current-carrying probe element in the contact direction with the second terminal portion, and the sense terminal 4 as a voltage-measuring probe element.
Let L be the distance in the contact direction of the second terminal portion of 2b,
Ratio L / R to diameter R of solder bump (see FIG. 18 etc.)
Is in the range of 0.2 to 0.85.

By using the above-mentioned second measuring probe 42 and digging these into the solder bumps 6 to perform a resistance value inspection, the axial sectional area at the bottom of the first measuring holes 53, 53 as shown in FIG. Thus, a substantially V-shaped axial cross-sectional shape is formed, which is reduced. Then, at the bottom of the hole, the scratch on the solder bump becomes slight, and the influence of the measurement hole on the substrate wiring can be reduced, which leads to protection of the wiring and the like. Further, the V-shaped bottoms are formed so as to be inclined in the depth direction so as to approach each other, so that the hole interval can be narrowed and kept in an appropriate range. Since the first measurement holes 53, 53 formed in this way prove that a good inspection state has been performed, by forming such a measurement hole in the solder bump 6, the resistance value after the inspection can be improved. Confirmation of inspection becomes easy.

The shape of the solder bumps 6 will be further described with reference to FIG. 53, 5
3 is formed, and the distance between the holes is defined as the distance between the geometric centers of gravity of the hole openings in the plan view (see FIG. 18B) of the pair of first measurement holes 53 (see FIG. 18B). 18), r) is formed in the range of 23 to 96 μm, and the hole depth (d2 in FIG. 18A) is formed in the range of 3 to 30 μm.

The ratio r / R of the measuring holes to the diameter R of the solder bump is 0.2 to, where r is the distance between the holes defined as the geometric distance between the centers of gravity of the hole openings in plan view.
The ratio d2 / h to the height h of the solder bump is 0.1 to 0.9 with 0.85 and the hole depth d2. If the ratio r / R is smaller than this range, complete insulation between the probes (insulation between the second source terminal 42a and the second sense terminal 42b) becomes difficult, and if larger than this range, the second measurement probe 42 There is a high possibility that one of the terminals will come off the solder bump 6. Also,
If the hole depth is smaller than this range, a sufficient contact state may not be maintained, and the contact resistance may increase or become unstable. If the hole depth is larger than this range, the load generated on the solder bump 6 is large. Therefore, the load on the substrate increases (which causes the collapse of the solder bumps 6 and the disconnection of the substrate wiring). Therefore, by making the second inspection information generation step a step of biting the second measurement probe 42 into the solder bump 6 so as to form the pair of first measurement holes 53, 53 in this range, the resistance value inspection can be performed accurately. This is a method of manufacturing a substrate with bumps that can be manufactured at high cost and can provide high-quality products. By forming the substrate with bumps having the first measurement holes 53, 53 having such a range, it becomes easy to determine whether the resistance value inspection is good or not (the first measurement holes 53, 53 are used for the resistance value inspection). Can be used as a mark to prove good or bad).

Further, in the plan view as shown in FIG. 18B, the ratio S2 / S0 to the bottom area S0 of the solder bump 6 is S2, where S2 is the total area of the hole openings of the first measurement holes 53, 53. It can be set to 0.002 to 0.45. (Note that the area of the hole opening can be defined as the area of the hole partitioned by the outer edge of the opening in plan view. In other words, it can be said that the area of the bump surface lost by the measurement hole.) The ratio is smaller than this range. In this case, the second measurement probe 42 and the solder bump 6 are not in good contact with each other, and the contact resistance increases or becomes unstable. Further, if the ratio is larger than this range, not only the appearance is not good, but there is a high possibility that the solder bumps 6 will be crushed, the substrate wiring will be broken, and the like. It is desirable to adopt a manufacturing method in which the second measuring probe 42 is bited into the solder bump 6 to form a substrate with bumps so that the ratio S2 / S0 falls within this range. Further, by forming such first measurement holes 53, 53 in the substrate with bumps, it becomes easy to judge whether the resistance value inspection is good or not even after the inspection (the first measurement holes 53, 53).
53 can be used as a mark to prove the quality of the resistance value test).

FIG. 19 shows another example of the shape of the solder bump 6. On the one plate surface of the substrate 14, a plurality of second terminal portions each composed of the solder bumps 6 are two-dimensionally arranged.
A plurality of first terminal portions (lands, pins, etc.) corresponding to each second terminal portion are two-dimensionally arranged and formed on the other plate surface, and the first terminal portion and the second terminal are formed. The parts corresponding to each other are individually connected by a wiring net including vias. Then, in order to determine whether or not the wiring net formed on the substrate 14 is in conduction, a conduction as a first inspection information generation step is performed in which a predetermined resistance value is used as a threshold and it is determined whether the resistance is higher than the threshold. The inspection is done. In this inspection, it is possible to judge that the wiring net having a resistance value equal to or higher than the threshold value is in the insulated state, and the wiring net having the resistance value equal to or lower than the threshold value is in the conductive state. In such a continuity test, the wiring net is subjected to resistance measurement (two-terminal method or the like) by contacting the first and second terminal portions with the continuity test probes 55a and 55b as shown in FIG. The second measurement hole 54 is formed at the time of contact.

When the depth of the second measurement hole 54 is d1 and the height of the solder bump 6 is H, d1 / H is 0.1 to 0.1.
It is adjusted in the range of 0.9. Further, when the area of the hole opening of the measurement hole in plan view is S1, the ratio S1 / S0 to the bump bottom area S0 is 0.002 to 0.45.
A condition may be added so that If the ratio d1 / H of the depth d1 to the height H of the solder bumps 6 is smaller than this range, a sufficient contact state between the continuity inspection probe 55a and the solder bumps 6 cannot be obtained, resulting in insufficient conduction. It can be a cause of inspection errors. Further, when the ratio S1 / S0 is smaller than this range, the terminals (continuity inspection probes 55a, 55b) for conducting the continuity inspection and the solder bumps 6 are not brought into a good contact state, and the contact resistance increases or becomes unstable. Becomes Further, if the ratio is larger than this range, not only the appearance is not good, but also the collapse of the solder bumps 6, the disconnection of the substrate wiring, and the like are likely to occur. Therefore, the ratio d
By providing in the manufacturing method a step of making the conduction inspection probe 55a bite into the solder bump 6 so as to satisfy either or both of the range of 1 / H and the range of the ratio S1 / S0 in the manufacturing method, With high accuracy, we can provide high quality products. Further, since the second measurement hole 54 is formed on the substrate with bumps, it is easy to judge whether the resistance value inspection is good or not even after the inspection (the second measurement hole 54 is a mark for certifying whether the continuity inspection is good or bad). Can be used as).

The first inspection information generating process for conducting such a continuity inspection can be performed before the second inspection information generating process including the resistance value inspection process shown in FIG. 1 and the like.
Since the continuity test is mainly a method of inspecting whether each wiring net is in a conductive state or an insulating state, it is desirable to remove the substrate from the product line at that time when a defect is found in this inspection process. . However, even if the board is judged to be non-defective in such a continuity test (the board that has passed the continuity test), the resistance value of the wiring net may be outside the allowable range set individually, so the continuity test is performed. In a later separate step, the resistance value inspection as the second inspection information generating step is performed by using the resistance measuring method and apparatus as shown in FIG. In this way, by having the first inspection information generation step and the second inspection information generation step, it is possible to synergistically prevent inspection omission of defective products,
It is possible to remove defective products with extremely high accuracy. In addition, a first inspection information generation step of generating first inspection information relating to the conduction state (for example, a continuity inspection step of inspecting whether or not the wiring net is conducted) and a second inspection information generation step relating to pass / fail of the wiring net (for example, Since the resistance value inspection step of calculating the resistance value of the wiring net) is a separate step, it is possible to remove defective products independently in each step.
It is possible to reduce duplicate inspection of defective products. Then, the defective product detected in the continuity inspection process is removed in the first selection process, and the resistance value inspection process and the second selection process may be performed only on the remaining products, so that the inspection time of the resistance value inspection process is shortened. It will be possible.

In the continuity inspection, all the solder bumps 6 existing on the substrate 14 are inspected (100% inspection is performed), and a part of the solder bumps 6 is randomly or randomly extracted in the subsequent resistance value inspection. You may do it.
This makes it possible to maintain a sufficient inspection accuracy while shortening the inspection time, and to provide a manufacturing method capable of manufacturing a high quality product in a short time.

In FIG. 20, the second measurement hole 5 in the first inspection information generating step (continuity inspection by a two-terminal measuring method or the like) is used.
4 and the solder bump 6 in which the pair of first measurement holes 53, 53 by the second inspection information generation step (resistance value inspection by a four-terminal resistance measurement method or the like) are both formed. The pair of first measurement holes 53, 53 has the above-described range (r / R is 0.2 to
0.85 and d2 / h is in the range of 0.1 to 0.9), and the second measurement hole 54 is also in the above-described range (d1 /
H is in the range of 0.1 to 0.9). Furthermore, the total area S3 of the holes with respect to the bump area S0 (the pair of first measurement holes 53, 53 opening area and second measurement hole 54)
Ratio of the total area of the openings) of S3 / S0 is 0.00
Each hole is formed to have a value of 2 to 0.45.
In this case, the second measurement hole 54 is the first measurement hole 5
The substrate with bumps may be formed so that the area and depth of the hole openings are larger than those of the holes 3, 53. By forming such a difference, the first measurement holes 53, 53 and the second measurement hole 54 can be clearly distinguished after the inspection, and the contact state of each process can be grasped (for example, , First measurement hole 5
If the formation of holes is insufficient in only 3,53, it can be assumed that an abnormality has occurred in the second inspection information generation step).

When the ratio S3 / S0 is smaller than this range, the step of forming the first measurement holes 53, 53 or the second measurement hole 54 (the second inspection information generating step for conducting resistance value inspection, the conduction There is a high possibility that the contact will be insufficient in at least one of the first inspection information generation step of performing inspection and the like, and an abnormality in the inspection can be detected by the measurement hole.
Further, if the ratio is larger than this range, not only the appearance is not good, but there is a high possibility that the solder bump 6 will be crushed or the wiring of the substrate inside the solder bump 6 will be broken due to the measurement hole. Therefore, in the first inspection information generating step and the second inspection information generating step, the continuity inspection probe 55 is formed so as to form the measurement hole having such a range.
a, 55b and the second measurement probe 42 to the solder bump 6
By conducting the conduction test and the resistance value test respectively by digging into the substrate, the inspection can be performed with high accuracy, and a high-quality bumped substrate manufacturing method with less bump damage and the like is provided.
In addition, the first measurement holes 53, 53 and the second measurement hole 54 that fall within this range serve as a proof mark that a good inspection state has been performed, and the solder bumps 6 having such measurement holes can be used for inspection. You can check it.

Further, in the second inspection information generating step,
The second measurement probe 42 (FIG. 17) can be brought into contact with the surface of the solder bump 6 other than the second measurement hole 54. When the second measurement probe 42 is brought into contact with the second measurement hole 54 portion in the first inspection information generation step (for example, one probe element of the second measurement probe 42 is inserted into the second measurement hole 54). In this case, since the contact surface is not flat, the second measurement probe 42 is tilted and contacted, resulting in an unstable contact state. Therefore, when abutting on a flat bump surface where the second measurement hole 54 is not formed, a stable contact is maintained and a good contact state is achieved, and a second inspection information generating step capable of highly accurate resistance value measurement. Become. By providing such steps in the manufacturing method, highly accurate inspection can be performed,
As a result, it contributes to the improvement of quality.

For the inspection of the measurement holes formed in the solder bumps 6, it is preferable to use the inspection methods shown in Japanese Patent Nos. 2881146, 2881147, and 2881148.

[Brief description of drawings]

FIG. 1 is a perspective explanatory view showing an example of an inspection apparatus of the present invention.

FIG. 2 is an enlarged view of an essential part showing a contact state between a first terminal portion and a first measurement probe group.

FIG. 3 is a cross-sectional view showing an example of a method for mounting the substrate body.

FIG. 4 is a partial cross-sectional view showing an example of the shape of a first measurement probe.

5 is an explanatory view showing a contact state of the terminals of FIG.

FIG. 6 is a diagram using a first measurement probe having a different shape in FIG.

FIG. 7 is a diagram in which the first measurement probe group of FIG. 6 is used for a substrate body having various terminal positions.

FIG. 8 is a diagram showing an example of a method of mounting the substrate body having the shape shown in FIG.

9 is an enlarged perspective view showing the shape of the first measurement probe of FIG.

10 is a partial cross-sectional view showing the internal shape of the first measurement probe of FIG.

11 is a cross-sectional view showing a contact state in FIG.

FIG. 12 is a block diagram showing a device configuration example of the present invention.

FIG. 13 is an explanatory diagram showing an example of position adjustment of the second measurement probe and the auxiliary measurement probe.

FIG. 14 is an explanatory diagram simply showing the wiring state of FIG.

FIG. 15 is an explanatory diagram simply showing the erroneous wiring state of FIG.

16 is an explanatory diagram in which a leakage current suppressing unit is attached to FIG.

17 is an explanatory view showing an example of the terminal shape of the second measurement probe of FIG.

FIG. 18 is an explanatory diagram showing an example of a solder bump shape.

FIG. 19 is an explanatory view showing another example 1 of the solder bump shape.

FIG. 20 is an explanatory view showing another example 2 of the solder bump shape.

FIG. 21 is a diagram conceptually illustrating a continuity inspection example (first inspection information generation process example).

FIG. 22 is a plan view showing an example of a substrate body.

FIG. 23 is a side sectional view showing a main part of FIG. 22.

[Explanation of symbols]

6 Solder Bump (Second Measurement Terminal) 7 Internal Wiring of Board (Wiring Net) 9 Land (First Terminal Part) 10 First Measurement Probe 10a First Source Terminal (First Probe Element, Cylindrical Probe Element, Current Conducting Probe) Element) 10b first sense terminal (second probe element, pin-shaped probe element, probe element for voltage measurement) 12 pins (first terminal portion) 13 first measurement probe group 14 substrate body 16 first coil spring (first elasticity) Biasing member) 17 Second coil spring (second elastic biasing member) 21 Current-carrying wiring 22 Voltage measuring wiring 25 Auxiliary terminal holding plate 27 Auxiliary probe 32 Upper auxiliary terminal (auxiliary terminal portion) 33 Lower auxiliary terminal (auxiliary) Terminal part) 42 second measurement probe 42a second source terminal (first probe element, current-carrying probe element) 42b second sense terminal (second probe) Probe element, probe element for voltage measurement) 43 wiring segment 46 resistor (leakage current suppressing means) 48 constant current power supply for measurement 53 first measurement hole 54 second measurement holes 55a, 55b continuity inspection probe

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/00 H05K 3/00 TF term (reference) 2G011 AA02 AA09 AA13 AA16 AA22 AB01 AB03 AB04 AC06 AC09 AC12 AC14 AE01 AF07 2G014 AA02 AA03 AA07 AA13 AA15 AB59 AC09 AC10 AC15 2G028 AA01 AA02 AA04 BC01 CG02 DH03 FK01 FK07 FK08 GL07 HN11 JP03 JP04 LR02 LR07 MS03

Claims (37)

[Claims] 1. A plurality of first terminal portions are two-dimensionally arranged and formed on one plate surface of a substrate body, and a plurality of second terminal portions corresponding to the first terminal portions on the other plate surface. Is a two-dimensional array and is formed, and the corresponding ones of the first terminal portion and the second terminal portion are individually connected by a wiring net including vias. There, a current measuring probe element and a voltage measuring probe element, the first measuring probe removably abutting the first terminal portion in those probe elements, two-dimensional of the first terminal portion. A plurality of first measurement probe groups arranged corresponding to the arrangement, a current-carrying probe element and a voltage measurement probe element, and in these probe elements, selective to any of the plurality of second terminal portions And detachably abut A measurement probe, the first measurement probe group is brought into contact with the first terminal portion group, and also the second measurement probe is brought into contact with the second terminal portion corresponding to the wiring net to be measured, and its state While applying a measuring current to the wiring net by the current-carrying probe element at, based on the voltage level applied to the wiring net measured by the voltage measuring probe element, the characteristic electricity of the wiring net is determined. By comparing the specific electric resistance value information generating means that generates information reflecting the resistance value and the generated specific electric resistance value information with the reference information that is individually determined for each wiring net, A substrate inspection apparatus, comprising: an inspection information generating unit that generates inspection information regarding pass / fail. 2. The second measuring probe is arranged in the plate surface direction of the substrate body in order to select a second terminal portion corresponding to a wiring net to be measured on the formation side of the second terminal portion. 2. The substrate inspection apparatus according to claim 1, wherein the substrate inspection apparatus is provided so as to be movable in a movable manner and to be able to approach and separate from the second terminal portion in a plate thickness direction. 3. A substrate support part that detachably supports the substrate substantially horizontally so that the first terminal part side is a lower side, and the first measurement probe group has a lower surface side of the supported substrate. 3. The second measuring probe is adapted to be selectively brought into contact with the second terminal portion on the upper surface side of the substrate while being brought into contact with the first terminal portion respectively. Board inspection device. 4. The measurement wiring group, which is led downward from the first measurement probe group, is extended to a position laterally offset from the substrate position, and then the end portion is turned upward. An auxiliary probe corresponding to the wiring net to be measured is brought into contact with the auxiliary terminal portion that is held and formed at the end portion, and the auxiliary probe and the corresponding measurement wiring and the first measurement probe are attached. Through,
The board inspection device according to claim 3, wherein the resistance of the wiring net is measured with the second measurement probe. 5. The board inspection apparatus according to claim 4, further comprising an auxiliary terminal holding plate for holding the auxiliary terminal portion from each measurement wiring in a two-dimensional array corresponding to the first measurement probe group. 6. Each of the measurement wirings from the first measurement probe group is connected to a corresponding current measurement probe element and a voltage measurement probe element of the corresponding first measurement probe. 6. The substrate inspection apparatus according to claim 4, further comprising: a wiring for measurement, one of the wiring for voltage measurement and the wiring for current conduction is connected to the auxiliary terminal portion, and the other is commonly connected. 7. The voltage measuring wiring is connected to the auxiliary terminal portion, while the current conducting wiring is connected to a common measuring constant current power source, and the plurality of first measuring probes are connected to each other. Each end portion of the current-carrying wires that individually extend from the adjacently arranged ones are connected adjacent to each other at different connection points with respect to the common power-supply wiring toward the measurement constant-current power supply, and the common power-supply wiring, In the wiring segment located between the adjacent connection points, when the second measurement probe and the auxiliary probe are erroneously connected to mutually different wiring nets, the leakage of the measurement current to the wiring segment is suppressed. The board inspection apparatus according to claim 6, further comprising a leakage current suppressing unit. 8. The substrate inspection apparatus according to claim 7, wherein the leakage current suppressing unit includes a resistance element having a resistance value at least larger than a reference resistance value set as the reference information. 9. The first measuring probe, wherein one of the current-carrying probe element and the voltage-measuring probe element is a first probe element and the other is a second probe element, and at least the first probe element is the first probe element. The first probe element is elastically deformed as the first probe element retracts due to the contact with the first terminal portion, and the first probe element is moved by the elastic return force. 9. The board inspection device according to claim 1, further comprising a first elastic biasing member that biases toward the first terminal portion. 10. The second probe element is provided so as to be capable of advancing and retracting independently of the first probe element in the contact direction with the first terminal portion, and the first measurement probe and the first terminal portion. With the relative approach in the contact direction, is to form a contact state with the first terminal portion at substantially the same time as or later than the first probe element, the first terminal portion and A second elastic biasing member that elastically deforms as the second probe element retracts due to the contact of the second probe element and that biases the second probe element toward the first terminal portion by the elastic return force thereof. The board inspection apparatus according to claim 9. 11. The first measurement probe includes a tubular probe element and a pin-shaped probe element coaxially arranged inside the tubular probe element, one of the tubular probe elements being the first probe element. The substrate inspection apparatus according to claim 9 or 10, wherein one probe element is used and the other is a second probe element. 12. A second coil spring coaxially arranged in the tubular probe element, biasing the pin-shaped probe element from the rear side, and coaxially arranged outside the second coil spring. And a first coil spring for biasing the tubular probe element from the rear side, one of the first coil spring and the second coil spring functions as the first elastic biasing member, and the other one of the second elastic springs. The board inspection apparatus according to claim 11, which functions as a biasing member. 13. The pin-shaped probe element serves as the first probe element, and a tip portion of the pin-shaped probe element is arranged so as to project from the tip edge of a cylindrical probe element that is the second probe element by a predetermined amount. The board inspection device according to claim 11 or 12. 14. The pin-shaped probe element is the first probe element, and the tip end surface of the cylindrical probe element, which is the second probe element, is a tapered surface that retracts toward the center of the axial cross section, and the pin-shaped probe element is formed. The substrate inspection apparatus according to claim 11 or 12, wherein a tip edge position of the probe element is located so as to project in the axial direction from an inner edge position of the tapered surface. 15. The board inspection apparatus according to claim 14, wherein the tip edge position of the pin-shaped probe element is located more in the axial direction than the outer edge position of the tapered surface. 16. The second measurement probe has a sharp tip end with the contact direction with the second terminal portion as the tip end side, and one of the second measurement probes serves as the current-conducting probe element and the other serves as a voltage probe. The probe probe includes a pair of needle-shaped probe elements that are measurement probe elements, and the needle-shaped probe elements are inclined in directions opposite to each other with respect to the contact direction so that the arrangement interval becomes narrower toward the tip side. The substrate inspection apparatus according to any one of claims 1 to 15, wherein the board inspection apparatus is used in a state of being arranged. 17. A plurality of second terminal portions each formed of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and the second terminal portions are formed on the other plate surface to correspond to the respective second terminal portions. A structure in which a plurality of first terminal portions are two-dimensionally arranged and formed, and those corresponding to each other of the second terminal portion and the first terminal portion are individually connected by a wiring net including a via. A substrate forming step of obtaining a substrate with bumps, comprising: using the substrate inspection apparatus according to any one of claims 1 to 16, for a second terminal portion formed of the solder bump corresponding to a wiring net to be inspected, The tip portion of the second measurement probe is brought into contact with the solder bump so that a measurement hole having a predetermined depth is formed,
The first measurement probe is brought into contact with the first terminal portion corresponding to the wiring net, and in that state, a measurement current is applied to the wiring net through the second measurement probe and the first measurement probe. An electric resistance value information generating step of generating electric resistance value information of the wiring net, and an inspection information generating step of generating inspection information regarding pass / fail of the wiring net based on the generated electric resistance value information, A substrate manufacturing method comprising: a sorting step of sorting only substrates whose generated inspection information satisfies a predetermined condition. 18. When the depth of the measurement hole is d1 and the height of the solder bump is H, d1 / H is 0.1 to 0.
18. The substrate manufacturing method according to claim 17, wherein the second measurement probe is bited into the solder bump so as to be in a range of 9. 19. A ratio S to a bump bottom area S0, where S1 is the area of the hole opening of the measurement hole in plan view.
The board manufacturing method according to claim 17 or 18, wherein the second measurement probe is bited into the solder bump so that 1 / S0 becomes 0.002 to 0.45. 20. The second measurement probe includes a pair of needle-shaped probe elements whose tip ends are sharply formed with the contact direction with the solder bumps as the tip sides, and the needle-shaped probe elements are Those arranged in a state in which they are inclined in mutually opposite directions with respect to the abutting direction are used so that the arrangement interval becomes narrower toward the tip side, and one is the current conducting probe element and the other is A pair of probe elements used as voltage measuring probe elements, wherein the tip of the current-carrying probe element in the abutting direction with the second terminal portion contacts the second terminal portion of the voltage measuring probe element. The distance L in the contact direction is L, and the ratio L / R to the diameter R of the solder bump is 0.2 to
The substrate manufacturing method according to claim 17, wherein the substrate has a thickness of 0.85. 21. When the second measurement probe bites, a pair of the measurement holes respectively opening on the surface of the solder bump are formed in a surface layer portion of at least a part of the solder bump, and the pair of measurement holes are formed. Let r be the distance between the holes, which is defined as the distance between the geometric centers of gravity of the hole openings in plan view,
The ratio r / R to the diameter R of the solder bump is 0.2 to 0.8
21. The substrate manufacturing method according to claim 20, wherein the second measurement probe is bited into the solder bump so that the number of the probe becomes 5. 22. The biting of the second measurement probe forms a pair of the measurement holes respectively opening on the surface of the solder bump in the surface layer portion of at least a part of the solder bump, When the depth of each of the measurement holes is d2 and the height of the solder bump is H, d2 / H is 0.1.
22. The substrate manufacturing method according to claim 20, wherein the second measurement probe is bited into the solder bumps so as to be about 0.9. 23. The pair of measurement holes have a substantially V-shaped vertical cross-sectional shape in which the axial cross-sectional area is reduced toward the bottom, and the pair of measurement holes are arranged in the depth direction so as to approach each other on the V-shaped bottom side. 23. The substrate manufacturing method according to claim 20, wherein the substrate is inclined. 24. Assuming that the total area of the hole openings in the plan view of the pair of measurement holes is S, the ratio S / S0 to the bump bottom area S0 is 0.002 to 0.45.
24. The substrate manufacturing method according to claim 20, wherein the second measurement probe bites into the solder bump. 25. By using the continuity inspection probe as the second measurement probe to bite and abut the solder bump while forming the second measurement hole, based on the electrical resistance information at that time. A first inspection information generating step of generating first inspection information relating to the conduction state of the corresponding wiring net; and a first selecting step of selecting only the boards whose generated first inspection information satisfies a predetermined condition as non-defective products. A pair of needle-shaped probe elements is used as the second measurement probe for the substrate selected as a non-defective product in the first selection step, and a pair of openings are formed on the solder bumps on the surfaces of the solder bumps. While forming the first measurement hole, these probes bite into contact with each other, and in that state, one of the needle-shaped probes is used as a current-carrying probe element to the wiring net. While applying a constant current, the other needle-shaped probe is used as a probe element for voltage measurement to measure the voltage level applied to the wiring net, and information that reflects the specific electrical resistance value of the wiring net is generated. A second inspection information generation step relating to the quality of the wiring net by comparing the specific electric resistance value information generating means and the generated specific electric resistance value information with reference information individually determined for each wiring net. 25. The substrate manufacturing method according to claim 17, further comprising: a second sorting step of sorting only substrates whose generated second inspection information satisfies a predetermined condition. 26. In the second inspection information generating step,
The second measurement probe is brought into contact with the surface of the solder bump other than the second measurement hole.
5. The substrate manufacturing method according to item 5. 27. A plurality of second terminal portions each formed of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and the second terminal portions are formed on the other plate surface to correspond to the respective second terminal portions. A structure in which a plurality of first terminal portions are two-dimensionally arranged and formed, and corresponding ones of the first terminal portions and the second terminal portions are individually connected by a wiring net including vias. A substrate with bumps, characterized in that a measurement hole having a predetermined depth is formed in a surface layer portion of at least a part of the solder bump, the measurement hole being opened on a surface of the solder bump. 28. When the depth of the measurement hole is d1 and the height of the solder bump is H, d1 / H is 0.1 to 0.
The substrate with bumps according to claim 27, which is adjusted in the range of 9. 29. A ratio S to a bump bottom area S0, where S1 is the area of the hole opening of the measurement hole in plan view.
The substrate with bumps according to claim 27 or 28, wherein 1 / S0 is 0.002 to 0.45. 30. The bumped substrate according to claim 27, wherein the measurement holes are formed with a pair of the measurement holes each opening on a surface of the solder bump. 31. When the depth of each of the pair of measurement holes is d2 and the height of the solder bump is H,
The substrate with bumps according to claim 30, wherein d2 / H is adjusted in the range of 0.1 to 0.9. 32. A ratio S2 / S0 to a bump bottom area S0 is 0.002 to 0.4, where S2 is a total area of the hole openings of the pair of measurement holes in a plan view.
The substrate with bumps according to claim 30 or 31, which is 5. 33. The measurement hole includes a first measurement hole as the pair of measurement holes and a second measurement hole different from the first measurement hole. Through 32
A substrate with bumps according to any one of 1. 34. The substrate with bumps according to claim 33, wherein the second measurement hole is a single hole portion having a hole opening area and a depth that are larger than those of the first measurement hole. 35. The ratio S3 / S0 to the bump bottom area S0 is 0.0, where S3 is the total area of the hole openings of the first measurement hole and the second measurement hole in plan view.
The substrate with bumps according to claim 33 or 34, which has a thickness of 02 to 0.45. 36. A ratio r to a diameter R of the solder bump, where r is a distance between holes defined as a distance between geometric centers of gravity of the respective hole openings of the first measurement holes in plan view.
/ R is 0.2-0.85, The board | substrate with a bump in any one of Claims 30 thru | or 35 characterized by the above-mentioned. 37. The pair of measurement holes have a substantially V-shaped vertical cross-sectional shape in which the axial cross-sectional area is reduced toward the bottom, and the pair of measurement holes are arranged in the depth direction so as to approach each other on the V-shaped bottom side. The bumped substrate according to any one of claims 30 to 36, which is formed so as to be inclined.