JP3905850B2 - Substrate inspection probe and substrate inspection apparatus using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate inspection apparatus for inspecting a wiring pattern on a substrate, and a substrate inspection probe used therefor.
[0002]
[Prior art]
Conventionally, a wiring pattern on a circuit board has a low resistance in order to transmit an electric signal to an IC or other semiconductor or electric component mounted on the circuit board, or to give an electric signal to liquid crystal or plasma. Printed circuit board before placing semiconductors and electrical components, circuit wiring board with wiring pattern formed on liquid crystal panel or plasma display panel, or wiring pattern formed on a substrate such as semiconductor wafer The resistance value is measured to check its quality. The resistance value of the wiring pattern is determined by bringing a measuring terminal into contact with each of the inspection points provided at two locations of the wiring pattern to be inspected and passing a predetermined level of measuring current between the measuring terminals. It is measured using Ohm's law by measuring the voltage generated between the measuring terminals.
[0003]
However, as described above, when a measurement terminal brought into contact with each of the two inspection points of the wiring pattern is commonly used for supplying the measurement current and measuring the voltage, the contact resistance between the measurement terminal and the inspection point Affects the measurement voltage, and the measurement accuracy of the resistance value is lowered. Therefore, the current supply terminal and the voltage measurement terminal are brought into contact with each inspection point, the measurement current is supplied between the current supply terminals brought into contact with the respective inspection points, and the respective inspection points are contacted. By measuring the voltage generated between the measured voltage measuring terminals, the method of measuring the resistance value with high accuracy by suppressing the influence of the contact resistance between the measuring terminal and the inspection point is a four-terminal measuring method or Known as the Kelvin method or the like (hereinafter referred to as the four-terminal method or the like), and a substrate inspection apparatus for inspecting a wiring pattern using the four-terminal measurement method is known (see, for example, Patent Document 1). ).
[0004]
[Patent Document 1]
JP-A-6-66832
[0005]
[Problems to be solved by the invention]
As described above, when the wiring pattern is inspected by using the four-terminal method or the like, it is necessary to bring the two terminals of the current supply terminal and the voltage measurement terminal into contact for each inspection point. On the other hand, in recent years, the miniaturization of circuit boards has progressed and the lands that serve as inspection points have become smaller. As a result, it has become difficult to bring two terminals into contact with one land.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate inspection probe in which two terminals can be easily brought into contact with a minute inspection point and a substrate inspection apparatus using the probe.
[0007]
[Means for Solving the Problems]
The substrate inspection probe according to the present invention is: A substrate inspection probe comprising a current supply needle pin and a voltage measurement needle pin for contacting an inspection point on a wiring pattern provided on a substrate, wherein the current supply needle pin and the voltage measurement needle pin The current supply needle pin and the voltage measurement needle pin are provided with a holding member that is integrally held, and a tip surface that is inclined and intersects with an axis of each needle pin is formed at a tip portion that contacts the inspection point. The holding member holds the current supply needle pin and the voltage measurement needle pin in parallel with a minute interval, and the tops of the distal end surfaces of the current supply needle pin and the voltage measurement needle pin are To hold adjacent to each other. In addition, the current supply needle pin and the voltage measurement needle pin further have a base end surface inclined and intersecting with an axis thereof in a direction opposite to the front end surface at a base end portion opposite to the front end portion, respectively. It is formed It is characterized by that.
[0008]
According to the first aspect of the present invention, each of the tip portions for contacting the inspection points on the wiring pattern provided on the substrate is formed with the tip surfaces inclined and intersecting with the axis of each needle pin. The supply needle pin and the voltage measuring needle pin are integrally held by the holding member in parallel with a minute interval. The tops of the tip surfaces of the current supply needle pin and the voltage measurement needle pin are oriented adjacent to each other. Thereby, it becomes possible to make the space | interval of the top part of the front end surface of the needle pin for electric current supply and the needle pin for voltage measurement which are in contact with an inspection point minute.
[0009]
Also, Each of the current supply needle pin and the voltage measurement needle pin further has a base end surface that is inclined and intersects with the axis in the direction opposite to the front end surface, at the base end portion opposite to the front end portion. As a result, the top of the base end face is provided on the extension line of the line connecting the axis lines of the current supply needle pin and the voltage measurement needle pin so as to be spaced outward from the axis line.
[0010]
Also, At least one of the current supply needle pin and the voltage measurement needle pin is characterized in that a surface at a predetermined position is coated with an insulating material. This configuration According to the above, since the surface of at least one predetermined position of the current supply needle pin and the voltage measurement needle pin is coated with the insulating material, the current supply needle pin and the voltage measurement needle pin have the thickness of the insulation material. It is held with a very small interval.
[0011]
Also, A restraining member having an insertion hole through which the current supply needle pin and the voltage measurement needle pin are inserted, and the insertion hole rotates the inserted current supply needle pin and the voltage measurement needle pin in a rotation direction; It is characterized by a shape that is constrained to. According to this configuration The current supply needle pin and the voltage measurement needle pin inserted through the insertion hole are constrained in the rotation direction.
[0012]
The substrate inspection apparatus according to the present invention is the above-mentioned. In a substrate inspection apparatus using the substrate inspection probe according to any one of the above, Above 1st probe and 2nd probe which consist of a board | substrate inspection probe in any one, and the said current supply with which the 1st probe and 2nd probe each contact | abutted to the 2 test | inspection points of the said wiring pattern, respectively A current generator for passing a measurement current between the needle pins for voltage measurement, and a voltage measurement for measuring the voltage between the needle pins for voltage measurement provided in each of the first probe and the second probe at the predetermined level of measurement current And a test processing unit that determines whether the conduction state between the two test points is good or bad using the current value at the predetermined level and the voltage value measured by the voltage measurement unit. This configuration According to Above The first probe and the second probe comprising the board inspection probe according to any one of the above are brought into contact with the two inspection points of the wiring pattern, respectively, and the current probe needle pin of the first probe and the second probe A measurement current of a predetermined level is caused to flow between the current supply needle pin and a voltage generated between the voltage measurement needle pin of the first probe and the voltage measurement needle pin of the second probe is measured. Using the current value and the voltage value measured by the voltage measurement unit, the quality of the conduction state between the two inspection points is determined.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, and FIG. 2 is a plan view of the substrate inspection apparatus of FIG. In order to clarify the directional relationship with each drawing described later, XYZ rectangular coordinate axes are shown.
[0014]
As shown in these drawings, in this board inspection apparatus, an opening / closing door 11 is attached to the apparatus main body 1 so as to be openable / closable on the front side (−Y side) of the apparatus, and the opening / closing door 11 is opened to be inspected. A board 2 such as a printed board on which a wiring pattern is formed can be carried into a carry-in / out section 3 provided at the central portion on the front side of the apparatus. Further, an inspection unit 4 for inspecting the substrate 2 is provided on the rear side (+ Y side) of the loading / unloading unit 3, and the substrate is inspected by a scanner 74 electrically connected to the inspection unit 4. After the pass / fail judgment is made, the inspected substrate 2 is returned to the carry-in / out section 3 again, and can be carried out by the operator via the open / close door 11.
[0015]
In this substrate inspection apparatus, in order to transport the substrate 2 between the loading / unloading unit 3 and the inspection unit 4, the transport table 5 is provided movably in the Y direction and is moved in the Y direction by the transport table driving mechanism 6. It is comprised so that it may be positioned. In other words, in the transport table drive mechanism 6, two guide rails 61, 61 extending in the Y direction are arranged apart from each other in the X direction by a predetermined interval, and the transport table 5 is slidable along these guide rails 61, 61. It has become. In addition, a ball screw 62 is arranged in parallel with the guide rails 61, 61. One end side (−Y side) of the ball screw 62 is pivotally supported by the apparatus main body 1 and the other end side (+ Y side) is conveyed. The rotary shaft 64 of the table driving motor 63 is connected. Further, a bracket 65 to which the transport table 5 is fixed is screwed onto the ball screw 62, and when the motor 63 is rotationally driven in accordance with a command from a control unit described later, the transport table 5 is moved in the Y direction according to the rotation amount. It moves to reciprocate between the loading / unloading unit 3 and the inspection unit 4.
[0016]
With reference to FIG. 2, the transfer table 5 includes a substrate platform 51 for placing the substrate 2 thereon. The substrate placement portion 51 engages the substrate 2 with a biasing means (not shown) from the direction facing the engagement pins 53 while the placed substrate 2 engages with the three engagement pins 53. The substrate 2 can be held on the substrate platform 51 by being biased toward the mating pin 53 side. Further, in order to bring the needle pin pair 44 of the lower inspection unit 4D into contact with the wiring pattern formed on the lower surface of the substrate 2 held in this way, a through opening (not shown) is formed in the substrate mounting portion 51. ing.
[0017]
In the inspection unit 4, an upper inspection unit 4 </ b> U for inspecting a wiring pattern formed on the upper surface side of the substrate 2 is disposed on the upper side (+ Z side) across the moving path of the transport table 5, while the lower side ( The lower inspection unit 4D for inspecting the wiring pattern formed on the lower surface side of the substrate 2 is disposed on the −Z side).
[0018]
The inspection units 4U and 4D have the same configuration, and are arranged symmetrically with the movement path of the transport table 5 in between. The inspection units 4U and 4D include an inspection jig 41 and an inspection jig driving mechanism 43.
[0019]
As shown in FIG. 3, the inspection jig driving mechanism 43 is connected to the X jig driving unit 43 </ b> X for moving the inspection jig 41 in the X direction with respect to the apparatus main body 1 and the X jig driving unit 43 </ b> X for inspection. Y jig driving unit 43Y for moving the jig 41 in the Y direction, θ jig driving unit 43θ connected to the Y jig driving unit 43Y for rotating the inspection jig 41 around the Z axis, and θ jig driving The Z jig driving unit 43Z is connected to the portion 43θ and moves the inspection jig 41 in the Z direction. The control unit 71 positions the inspection jig 41 relative to the transport table 5 or the like. The inspection jig 41 is moved up and down (Z direction) so that the needle pin pair 44 can be brought into contact with or separated from the wiring pattern formed on the substrate 2.
[0020]
The inspection jig 41 (see FIG. 4) is for inspecting a substrate in which lands of wiring patterns serving as inspection points are relatively regularly arranged in a lattice pattern, and inspects the probe 42 and the multipolar connector 41C. A probe base 41 </ b> F for attaching to the jig driving mechanism 43.
[0021]
The probe 42 includes a plurality of needle pin pairs 44 arranged in a lattice pattern at a predetermined pitch. FIG. 5 is a partial perspective view for explaining the structure of the probe 42. The probe 42 shown in FIG. 5 includes a head portion 45 for holding the needle pin pair 44 and a base portion 46 for inputting and outputting a resistance measurement signal between the needle pin pair 44 and the scanner 74. The
[0022]
The head unit 45 includes a needle pin pair 44 and plate-shaped guide plates 101, 102, 103 that restrain and hold the needle pin pair 44. The guide plates 101 and 102 are respectively formed with oval insertion holes 104 and 105, and the guide plate 103 is formed with a substantially circular insertion hole 106. Then, when the needle pin pair 44 is inserted into the insertion holes 104, 105, 106, the needle pin pair 44 is restrained in the rotational direction by the oval insertion holes 104, 105.
[0023]
The tip portion of the needle pin pair 44 protrudes from the insertion hole 104 of the guide plate 101 so that the top of the tip portion can contact the land 21 (inspection point) formed on the substrate 2. Further, the proximal end portion of the needle pin pair 44 is made contactable with electrodes 113a and 113b described later.
[0024]
The insertion holes 104 and 105 are not limited to an oval shape, but may be any shape that restricts the rotation of the needle pin pair 44, such as a rectangle or an ellipse.
[0025]
The needle pin pair 44 is formed by, for example, bonding the substantially cylindrical current supply needle pin 107a and the voltage measurement needle pin 107b, and holding the current supply needle pin 107a and the voltage measurement needle pin 107b in parallel in the axial direction. Holding member 108 made of an agent or the like.
[0026]
FIG. 6 is a view showing the structure of the current supply needle pin 107a. A substantially elliptical tip surface 109a that is inclined and intersects with the axis of the current supply needle pin 107a is formed at the tip portion of the current supply needle pin 107a shown in FIG. In addition, a substantially elliptical base end surface 110a that is inclined in the direction opposite to the front end surface 109a and intersects the axis of the current supply needle pin 107a is formed at the base end portion of the current supply needle pin 107a. Thereby, since the top part of the front end surface 109a which contacts the land 21 is curved, it is suppressed that the land 21 is damaged by contacting with the top part of the front end surface 109a.
[0027]
In this case, the inclination angle A, which is the narrow angle of the intersection angle between the distal end surface 109a and the axis, and the inclination angle B, which is the narrow angle of the intersection angle between the proximal end surface 110a and the axis, exceed 90 degrees and are 90 degrees. However, it is desirable that the angle be 45 degrees or more and 60 degrees or less.
[0028]
Further, a coating layer 111a covered with an insulating material such as Teflon (registered trademark) is formed on the surface of the current supply needle pin 107a at a predetermined position. The current supply needle pin 107a is preferably made of an elastic material such as tungsten steel, beryllium steel, SKH (JIS G4403), or SK (JIS G4401). As a result, when the current supply needle pin 107a is brought into contact with the land 21 and a load is applied in the axial direction of the current supply needle pin 107a, the current supply needle pin 107a is elastically brought into contact with the land 21, The current supply needle pin 107a and the land 21 are in better contact with each other.
[0029]
Further, it is desirable that the distal end portion of the current supply needle pin 107a in contact with the land 21 and the proximal end portion of the current supply needle pin 107a in contact with the electrode 113a are surface-treated with gold, nickel or the like. Thereby, the contact state between the current supply needle pin 107a, the land 21 and the electrode 113a is improved.
[0030]
The voltage measuring needle pin 107b has the same structure as the current supply needle pin 107a, and includes a distal end surface 109b, a proximal end surface 110b, and a coating layer 111b.
[0031]
The current supply needle pin 107a and the voltage measurement needle pin 107b are not limited to a cylindrical shape, and may have a columnar shape such as an ellipse or a polygon. Further, the distal end surfaces 109a and 109b and the proximal end surfaces 110a and 110b are not limited to an ellipse, and may be a shape such as a circle or a polygon.
[0032]
FIG. 7 is a side view for explaining the structure of the needle pin pair 44 in detail. 8 is a cross-sectional view showing an XX cross section of the needle pin pair 44 shown in FIG. The current supply needle pin 107a and the voltage measurement needle pin 107b shown in FIG. 7 are bundled by the holding member 108 so that the top of the front end surface 109a and the top of the front end surface 109b are adjacent to each other, and the base end surfaces 110a and 110b are It is made to face each other.
[0033]
Further, since the coating layers 111a and 111b are respectively formed on the surfaces of the current supply needle pin 107a and the voltage measurement needle pin 107b, the top of the tip surface 109a and the top of the tip surface 109b are The coating layer 111a and the coating layer 111b are separated from each other by a very small distance C. In this case, for example, when the thickness of the coating layer 111a and the thickness of the coating layer 111b are each 0.015 mm, the minute interval C is 0.03 mm.
[0034]
As a result, the current supply needle pin 107a and the voltage measurement needle pin 107b are integrated together with the top of the tip surface 109a contacting the land 21 and the top of the tip surface 109b spaced apart by a small distance C. 21, it becomes easy to bring the top of the tip surface 109a and the top of the tip surface 109b into contact with the miniaturized land 21 having a diameter of, for example, 100 μm.
[0035]
Note that only one of the coating layer 111a and the coating layer 111b may be formed.
[0036]
Moreover, the broken line part of FIG. 8 has shown the insertion holes 104,105,106. As shown in FIG. 8, since the insertion hole 106 is made larger than the outer periphery of the holding member 108, the needle pin pair 44 can be inserted from the guide plate 103 side of the head portion 45. Moreover, since the inner dimension of the short method of the insertion holes 104 and 105 is made smaller than the diameter of the holding member 108, the needle pin pair 44 is prevented from falling off the head portion 45.
[0037]
FIG. 9 is a partial cross-sectional view for explaining an example of a schematic configuration of the head unit 45. In the needle pin pair 44 shown in FIG. 9, the current supply needle pin 107a side is arranged in front. The head portion 45 shown in FIG. 9 includes plate-like plates 114, 115, 116, 117 having guide holes 101 through which the needle pin pairs 44 are inserted, and guide plates 101, 102, 103. The plates 114, 115, 116 are integrally laminated in the order of the plates 114, 115, 116 from the distal end direction of the needle pin pair 44, and the guide plate 103 is laminated next to the plate 116. The plates 114, 115, 116 and the guide plate 103 are integrally fixed by a fixing member 118. Further, the guide plate 103, the plate 117, and the guide plate 102 are stacked in this order from the base end direction of the needle pin pair 44, and are fixed integrally by a fixing member 119.
[0038]
As the guide plate 103 and the plates 114 and 117, for example, a resin material having a thickness of about 1.5 mm may be used. Further, as the plates 115 and 116, for example, a resin material having a thickness of about 0.8 mm may be used. Further, as the guide plates 101 and 102, for example, SUS (JIS G4303 or the like) stainless steel having a thickness of about 0.1 mm or the like formed with the insertion holes 104 and 105 using photolithography may be used.
[0039]
As a result, the plates 114, 115, 116, and 117 maintain the strength of the head portion 45 and the guide plates 101, 102, and 103. Further, the tip portion of the needle pin pair 44 inserted through the insertion holes of the plates 114, 115, 116, 117 and the guide plates 101, 102, 103 is only 0.5 mm from the surface of the plate 114. The top of the tip portion can be brought into contact with a land 21 (inspection point) that protrudes and is formed on the substrate 2.
[0040]
Further, since the current supply needle pin 107 a and the voltage measurement needle pin 107 b are bundled by the holding member 108, the current supply needle pin 107 a and the voltage measurement needle pin 107 b bend up and down the holding member 108. And the elastic contact when contacting the land 21 is maintained. Further, due to the bending between the holding member 108 and the distal end portions of the current supply needle pin 107a and the voltage measuring needle pin 107b, either the distal end portion or the proximal end portion of these needle pins is worn and shortened. Even if it is a time, it is suppressed that it is not elastically contacted when contacting the land 21.
[0041]
Returning to FIG. 5, the base portion 46 includes a plate-like base plate 112 made of an insulating material such as glass epoxy, bake, or other resin material, and substantially cylindrical electrodes 113 a and 113 b embedded through the base plate 112. With. The electrode 113a is connected to the scanner 74 via the cable 124a and the multipolar connector 41C, and the electrode 113b is connected to the scanner 74 via the cable 124b and the multipolar connector 41C.
[0042]
FIG. 10 is a diagram illustrating an example of the structure of the base portion 46. The base portion 46 shown in FIG. 10 is configured by stacking and integrating a base plate 112 and plate-like plates 120, 121, and 122. For example, the base plate 112 and the plate 120 are made of a resin material, the plate 121 is made of glass epoxy, and the plate 122 is made of black bake. Then, an electrode 113 made of, for example, an enamel wire is inserted through an insertion hole penetrating the base plate 112 and the plate-like plates 120, 121, 122, and the electrode 113 is fixed by an ultraviolet curing agent 123. The surface of the base plate 112 that faces the head portion 45 is polished and flattened.
[0043]
FIG. 11 is a cross-sectional view for explaining the structure of the joint portion between the head portion 45 and the base portion 46. When the guide plate 103 of the head portion 45 and the base plate 112 of the base portion 46 are brought into close contact with each other at the joint portion between the head portion 45 and the base portion 46, the top portion of the proximal end portion of the current supply needle pin 107a becomes the electrode 113a. The top of the proximal end portion of the voltage measuring needle pin 107b comes into contact with the electrode 113b. As a result, the scanner 74 can input / output a resistance measurement signal to / from the needle pin pair 44 via the cables 124 a and 124 b and the head portion 45.
[0044]
In this case, since the base end faces 110a and 110b are arranged so as to face each other, the distance between the top of the base end face 110a and the top of the base end face 110b is such that the current supplying needle pin 107a and the voltage measuring needle pin It becomes longer than the distance between the axis lines with 107b. Accordingly, the distance between the electrode 113a and the electrode 113b can be increased, or the diameter of the electrode 113a and the electrode 113b can be increased. It becomes easy to bring the needle pin 107a and the voltage measuring needle pin 107b into contact with each other.
[0045]
Next, returning to FIG. 3, the electrical configuration of the substrate inspection apparatus configured as described above will be described. The board inspection apparatus includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a motor driver, and the like, and a control unit 71 that controls the entire apparatus according to a program stored in the ROM in advance. A tester controller 73, a scanner 74, and an operation panel 75 for receiving instructions from the operator and displaying the inspection result of the wiring pattern.
[0046]
The tester controller 73 receives the inspection start command from the control unit 71, and in accordance with a program stored in advance, the wiring pattern to be inspected from among the plurality of needle pin pairs 44 that are in contact with the land of the wiring pattern on the substrate 2 The two needle pin pairs 44 respectively contacting the two lands located at both ends of the two are sequentially selected. Then, the tester controller 73 transmits a scan command to the scanner 74 so as to perform an inspection between the two selected needle pin pairs 44.
[0047]
FIG. 12 is a conceptual diagram for explaining an example of the configuration of the scanner 74. The scanner 74 shown in FIG. 12 includes a current generation unit 125 that is a constant current source that outputs a predetermined level of measurement current, a voltage measurement unit 126 that measures a voltage at a predetermined level of measurement current, and the probe 42. Between two needle pin pairs 44 selected from the plurality of needle pin pairs 44, a changeover switch 128 including a switch array or the like for connecting the current generating unit 125 and the voltage measuring unit 126 is provided.
[0048]
The inspection processing unit 127 sends a control signal to the changeover switch 128 to connect the current generation unit 125 and the voltage measurement unit 126 between the two needle pin pairs 44 to be inspected in response to the scan command from the tester controller 73. Output. The inspection processing unit 127 compares the voltage value measured by the voltage measuring unit 126 with a predetermined reference voltage to determine whether the wiring pattern to be inspected is good or bad, and uses the determination result as a tester controller. 73.
[0049]
Next, the operation of the substrate inspection apparatus configured as described above will be described. First, the control unit 71 drives and controls the transport table drive mechanism 6 and the inspection jig drive mechanism 43 to bring the probe 42 into contact with the circuit pattern formed on the substrate 2 on the transport table 5. As a result, the plurality of needle pin pairs 44 included in the probe 42 are integrally brought into contact with the land of the wiring pattern of the substrate 2.
[0050]
Next, when the contact of the needle pin pair 44 with the wiring pattern is completed as described above, an inspection start command is transmitted from the control unit 71 to the tester controller 73. Then, the tester controller 73 selects the wiring pattern 23 as an inspection target, for example. Then, the port P1 of the changeover switch 128 to which the needle pin pair 44 that contacts the land 21 at one end position of the wiring pattern 23 is connected and the needle pin pair 44 that contacts the land 22 at the other end position of the wiring pattern 23 connects. A scan command for performing inspection by designating the port P 2 of the changeover switch 128 is transmitted from the tester controller 73 to the scanner 74.
[0051]
Next, a control signal is output from the scanner 74 to the changeover switch 128 in order to connect the current generation unit 125 and the voltage measurement unit 126 between the port P1 and the port P2 in response to a scan command from the tester controller 73. The current generation unit 125 and the voltage measurement unit 126 are connected between the port P1 and the port P2 by the changeover switch 128.
[0052]
Next, a current I for measurement is output by the current generator 125, and the multipolar connector 41C, the cable 124a, the electrode 113a, and the needle pin 107a for current supply are connected from the port P1 of the changeover switch 128 with reference to FIG. A current I is supplied to the land 21 through the via. Further, referring to FIG. 12, current I flows from land 21 to wiring pattern 23 and land 22, and referring to FIG. 5, current supply needle pin 107a, electrode 113a, cable 124a, A current loop reaching the current generator 125 via the pole connector 41C and the port P2 of the changeover switch 128 of FIG. 12 is formed. Thereby, for example, when the resistance value of the wiring pattern 23 is R, the voltage V generated between the land 21 and the land 22 is V = R × I.
[0053]
Next, with reference to FIG. 5, the potential of the land 21 is passed through the voltage measuring needle pin 107b, the electrode 113b, the cable 124b, the multipolar connector 41C, and the port P1 of the changeover switch 128 of FIG. To the voltage measuring unit 126. Further, the potential of the land 22 is set via the voltage measuring needle pin 107b, the electrode 113b, the cable 124b, the multipolar connector 41C, and the port P2 of the changeover switch 128 of FIG. It is guided to the voltage measuring unit 126. Then, the voltage measurement unit 126 measures the voltage V between the land 21 and the land 22.
[0054]
Next, as a result of comparing the voltage V measured by the voltage measuring unit 126 with a predetermined reference voltage by the inspection processing unit 127, when the voltage V exceeds the reference voltage, the conductive state of the wiring pattern 23 is defective. On the other hand, when the voltage V is equal to or lower than the reference voltage, it is determined that the conduction of the wiring pattern 23 is good. Then, the inspection processing unit 127 transmits a signal indicating the determination result to the tester controller 73.
[0055]
Thereby, the conduction | electrical_connection state of the wiring pattern 23 is test | inspected using 4 terminal methods. Note that the inspection processing unit 127 calculates the resistance value R of the wiring pattern 23 from the voltage V measured by the voltage measuring unit 126 by executing an arithmetic process of R = V / I, and the resistance value R and a predetermined value The configuration may be such that the quality of the conductive state of the wiring pattern 23 is determined by comparing with a reference resistance value.
[0056]
Next, when the tester controller 73 receives a signal indicating that the continuity of the wiring pattern 23 is good, a scan command is transmitted from the tester controller 73 to the scanner 74 to inspect a new wiring pattern. The On the other hand, when the tester controller 73 receives a signal indicating that the continuity of the wiring pattern 23 is defective, the tester controller 73 transmits a signal indicating that the substrate 2 to be inspected is defective to the control unit 71. The control unit 71 displays on the operation panel 75 that the substrate 2 is defective.
[0057]
Thereby, it is possible to inspect the circuit pattern of the circuit board that is miniaturized and has a small land as an inspection point by a four-terminal method or the like.
[0058]
In addition, although the example of the board | substrate inspection apparatus of the structure with which the several needle pin pair 44 with which the probe 42 is provided is made to contact the land of the wiring pattern of the board | substrate 2 was shown, the board | substrate inspection apparatus is equipped with the needle pin pair 44. The configuration may be such that two probes 42 are provided, and the two probes 42 move to the wiring pattern of the board as programmed in advance and inspect. Further, the probe 42 may be configured not to include the guide plates 101, 102, and 103. Further, the base end portions 110a and 110b may not be formed at the base end portion of the needle pin pair 44.
[0059]
【The invention's effect】
According to the first aspect of the present invention, the distance between the tops of the tip surfaces of the current supply needle pin and the voltage measurement needle pin that are in contact with the inspection point can be made minute. It is possible to easily bring the two terminals with the needle pin into contact with a fine inspection point.
[0060]
Also, The top of the base end face is provided on the extended line connecting the axis of the current supply needle pin and the voltage measurement needle pin, and is provided outside the axis, so that the current supply needle pin and the voltage measurement needle pin are for voltage measurement. The distance for separating the electrode for inputting / outputting a signal from / to the needle pin can be increased, and the top of the base end face can be easily brought into contact with the electrode.
[0061]
Claim 2 According to the present invention, the current supply needle pin and the voltage measurement needle pin are held with a small distance depending on the thickness of the insulating material, and therefore the distance between the current supply needle pin and the voltage measurement needle pin is maintained. Can be easily made minute.
[0062]
Claim 3 Since the current supply needle pin and the voltage measurement needle pin are suppressed from rotating, the present invention can suppress the twisting and the contact with the electrode.
[0063]
Claim 4 According to the invention described in claim 1, 3 Therefore, it is possible to determine whether the conduction state between the two inspection points is good or not using the substrate inspection probe described in any one of the above. Inspection can be facilitated by law or the like.
[Brief description of the drawings]
FIG. 1 is a side sectional view showing an example of a substrate inspection apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view of the substrate inspection apparatus shown in FIG.
3 is a schematic diagram showing a schematic configuration in which an inspection jig is mounted on the substrate inspection apparatus shown in FIG. 1;
4 is a perspective view showing an upper inspection unit and a lower inspection unit of the board inspection apparatus shown in FIG. 1. FIG.
5 is a partial perspective view for explaining the structure of the probe shown in FIG. 4. FIG.
6 is a diagram showing the structure of the current supply needle pin shown in FIG. 5;
7 is a side view for explaining in detail the structure of the needle pin pair shown in FIG. 5. FIG.
8 is a cross-sectional view showing an XX cross section of the needle pin pair shown in FIG. 7. FIG.
9 is a partial cross-sectional view for explaining an example of a schematic configuration of a head unit shown in FIG.
10 is a diagram showing an example of a structure of a base portion shown in FIG.
11 is a cross-sectional view for explaining a structure of a joint portion between a head portion and a base portion shown in FIG.
12 is a conceptual diagram for explaining an example of the configuration of the scanner shown in FIG. 3. FIG.
[Explanation of symbols]
21,22 rand
23 Wiring pattern
42 Probe
44 Needle pin pair
45 Head
46 Base part
71 Control unit
73 Tester controller
74 scanner
75 Operation panel
101,102 Guide plate (restraint member)
103 Guide plate
104, 105, 106 insertion hole
107a Needle pin for current supply
107b Needle pin for voltage measurement
108 Holding member
109a, 109b Tip surface
110a, 110b Base end face
111a, 111b coating layer
112 Base plate
113,113a, 113b electrode
114, 115, 116, 117 plate
125 Current generator
126 Voltage measurement unit
127 Inspection processing unit

Claims (4)

A substrate inspection probe comprising a current supply needle pin and a voltage measurement needle pin for contacting an inspection point on a wiring pattern provided on a substrate, wherein the current supply needle pin and the voltage measurement needle pin The current supply needle pin and the voltage measurement needle pin are provided with a holding member that is integrally held, and a tip surface that is inclined and intersects with an axis of each needle pin is formed at a tip portion that contacts the inspection point. The holding member holds the current supply needle pin and the voltage measurement needle pin in parallel with a minute interval, and the tops of the distal end surfaces of the current supply needle pin and the voltage measurement needle pin are all SANYO holding as mutually adjacent,
Each of the current supply needle pin and the voltage measurement needle pin is further formed with a base end surface that is inclined and intersects with the axis thereof in a direction opposite to the front end surface at a base end portion opposite to the front end portion. A board inspection probe. 2. The substrate inspection probe according to claim 1, wherein at least one of the current supply needle pin and the voltage measurement needle pin has a surface at a predetermined position coated with an insulating material. A restraint member having an insertion hole through which the current supply needle pin and the voltage measurement needle pin are inserted is provided, and the insertion hole rotates the inserted current supply needle pin and the voltage measurement needle pin in a rotation direction. 3. The substrate inspection probe according to claim 1, wherein the substrate inspection probe has a shape constrained by the substrate. The 1st probe and 2nd probe which consist of the board | substrate inspection probe in any one of Claims 1-3, and the 1st probe and 2nd probe each contact | abutted to the 2 test | inspection points of the said wiring pattern Between the current supply needle pins provided to each of the current measurement needle pins, and between the voltage measurement needle pins provided to the first probe and the second probe at the predetermined level of measurement current, respectively. A voltage measuring unit that measures a voltage; and an inspection processing unit that determines the quality of the conduction state between the two inspection points using the current value of the predetermined level and the voltage value measured by the voltage measuring unit. The board | substrate inspection apparatus using the probe for board | substrate inspection in any one of Claims 1-3 characterized by the above-mentioned.

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