JP5130782B2 - Inspection jig and inspection device - Google Patents

Description

  The present invention relates to an inspection jig and an inspection apparatus used for inspecting electrical characteristics of a wiring pattern provided on an inspection object through a plurality of inspection points provided on the inspection object.

  The present invention relates to a semiconductor wafer and a semiconductor device (semiconductor device), such as a printed wiring board, a flexible board, a multilayer wiring board, an electrode plate for a liquid crystal display and a plasma display, a package board for a semiconductor package, and a film carrier. The present invention can be applied to inspection of electrical wiring, and in this specification, these various inspection objects are collectively referred to as “inspection objects”.

As an inspection method related to the electrical characteristics of the wiring pattern provided on the inspection object, two contacts, a current supply contact and a voltage measurement contact, are provided, and the two contacts are simultaneously brought into contact with the inspection point. There is a technique (so-called four-contact method) for inspecting a wiring pattern (for example, Patent Document 1). In this four-contact method, since the current supply contact and the voltage measurement contact are separated, the current flowing between the voltage measurement contact and the inspection point can be suppressed to a level that can be substantially ignored. By substantially excluding the influence of the contact resistance between the voltage measuring contact and the inspection point, it is possible to accurately measure the voltage between the two inspection points where the voltage measuring contact contacts.
JP 2004-184374 A

  In the four-contact method as described above, when a contactor is brought into electrical contact with a land portion or the like provided on an inspection object, a two-contact type probe is easily brought into contact with the land portion or the like to establish conduction. Is possible. However, in the case where the contact is brought into electrical contact with a pin provided on the inspection target, how to obtain conduction at two contacts between the pin and the probe is a problem.

  For example, as shown in FIG. 6, there has been proposed one in which two probes 2 and 3 are brought into contact with the tip of a pin 1 so as to be conductive. However, in this proposed technique, the tip 1 has a small contactable area, and the vertical degree of the pin 1 and the blurring of the probes 2 and 3 cause the probe 2 and the pin 1 to move. A positional deviation or the like occurs between them, and it is difficult to reliably bring the probes 2 and 3 into contact with the tip of the pin 1.

  Therefore, the problem to be solved by the present invention is to provide an inspection jig and an inspection apparatus capable of reliably bringing a plurality of probes into electrical contact with an inspection point even if the inspection point provided on the inspection object is a pin. Is to provide.

In order to solve the above problems, in the invention of claim 1, it is used for inspecting the electrical characteristics of the wiring pattern provided on the inspection object through the tip surfaces of a plurality of pins erected from the inspection object. a test jig is provided corresponding to the arrangement positions of the plurality of pins, the holding of holding a plurality of probe groups to be conducted to the front end surface of the corresponding pin, a plurality of probe groups And a guide member having a plurality of guide holes for receiving the probe group that is in electrical contact with each other and the tip of the pin from both sides, and the probe group includes the tip surface of the corresponding pin. A plurality of second probes arranged in an insulated state from the first probe, and arranged in a distributed manner around the first probe; Wherein the plurality of second probes in each probe group of the pin all the second probe corresponding to when the first probe is centered in electrical contact with the front end surface of the corresponding pin The first probe and the plurality of second probes in the probe group are arranged point-symmetrically around the first probe so as to be in electrical contact with the tip surface. Each of them is independently arranged so as to bend independently according to the applied load .

According to a second aspect of the invention, in the inspection jig according to the first aspect of the invention, one of the first probe and the plurality of second probes of the probe group is for supplying a current to the pin . The other is used as a probe for measuring a potential for measuring the potential of the pin .

According to a third aspect of the invention, the inspection jig according to the first or second aspect of the invention and the first probe group included in any two of the plurality of probe groups of the inspection jig. An inspection processing unit for supplying a current to the pin via one of the probe and the plurality of second probes and measuring the potential of the pin via the other.

According to the first aspect of the present invention, the probe group provided corresponding to each inspection point to be inspected includes the first probe disposed in alignment with the center of the tip surface of the corresponding pin , And a plurality of second probes arranged in a distributed manner around one probe. Therefore, even when a positional deviation or the like occurs between the pin and the probe group, the first probe arranged at the center of the probe group and a plurality of second probes arranged dispersed around the first probe. Any one of the probes can be reliably brought into contact with the tip surface of the pin . This ensures, for example, can be reliably performed via the pin inspection by the so-called four-contact method for the wiring pattern provided on the test object.

Further, the plurality of second probes in each probe group, when all of the second probe to the distal end surface and electrically corresponding pins of the first probe are in electrical contact with the center of the front end surface of the corresponding pin In order to be able to come into contact with each other, they are arranged point-symmetrically around the first probe around the first probe. Therefore, even when a positional deviation or the like occurs between the pin and the probe group, among the first probe arranged at the center of the probe group and the plurality of second probes arranged around the first probe. Any of the above can be brought into contact with the tip surface of the pin more reliably.

Also , the first probe disposed in the center of the probe group and any one of the plurality of second probes distributed around the first probe are surely brought into electrical contact with the tip of the pin. Can do.

Further , by guiding the tip of the pin and the probe group by the guide hole of the guide member, the pin and the probe group can be easily and reliably brought into electrical contact.

According to the second aspect of the present invention, even when a positional deviation or the like occurs between the pin and the probe group, the first probe disposed in the center of the probe group and the periphery of the first probe are dispersed. Any of the plurality of second probes arranged in this manner can be reliably brought into contact with the tip surface of the pin, and the wiring pattern provided on the inspection object can be reliably inspected by the so-called four-contact method.

According to the third aspect of the present invention, even when a positional deviation or the like occurs between the pin and the probe group, the first probe disposed in the center of the probe group and the periphery of the first probe are dispersed. Any of the plurality of second probes arranged in this manner can be reliably brought into contact with the tip surface of the pin, and the wiring pattern provided on the inspection object can be reliably inspected by the so-called four-contact method.

  FIG. 1 is a diagram illustrating the overall configuration of an inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a side view illustrating the configuration of a probe group provided in an inspection jig of the inspection apparatus. FIG. 3 is a diagram showing a planar arrangement of first and second probes constituting the probe group of FIG. 2. 1 and 4, only the guide member 31 is shown in a sectional view for convenience.

  A semiconductor device 11 (for example, a VGA (Video Graphics Array)) to be inspected includes a main body 12 and a plurality of pins 13 erected from the main body 12 as shown in FIG. An inspection (for example, continuity inspection) regarding the electrical characteristics of the wiring pattern in the semiconductor device 11 is performed via the pin 13. In this embodiment, the case where the inspection apparatus 21 is applied to the inspection of the semiconductor device 11 as an inspection object will be described. However, the inspection apparatus 21 is also applied to inspection of other inspection objects such as the above-described printed wiring board. Can do. In the present embodiment, the case where the tip 13a of the pin 13 of the semiconductor device 11 is an inspection point will be described. However, a land portion of the wiring pattern or a solder bump provided on the land portion is an inspection point. Even in such a case, the inspection apparatus 21 according to the present embodiment may be applied. In this case, a guide member 31 described later may be omitted.

  As shown in FIG. 1, the inspection apparatus 21 according to the present embodiment includes an inspection jig 22, a connection switching unit 23, and an inspection processing unit 24.

  The inspection jig 22 includes a guide member 31, a probe holder 33 that holds a plurality of probe groups 32, and an electrode holder 34.

  The probe holding unit 33 includes a plurality of probe groups 32 and at least two holding plates 35 and 36 that hold the probe groups 32. The holding members 35 and 36 correspond to the holding member according to the present invention.

  The holding plate 35 and the holding plate 36 are fixed to each other by a connecting member 37 at a predetermined interval. The holding plates 35 and 36 are provided with through holes (not shown) through which the front end side portions and the rear end side portions of a plurality of probes 41 and 42 to be described later constituting the probe group 32 are inserted and held. .

  The plurality of probe groups 32 are provided corresponding to the arrangement positions of the plurality of pins 13 of the semiconductor device 11, respectively, and are brought into electrical contact with the corresponding pins 13 to be conducted. One end of each of the probes 41 and 42 forming the probe group 32 is electrically connected to an inspection point (pin 13), and the other end is electrically connected to an electrode portion (not shown) of the semiconductor device 11.

  As shown in FIGS. 2 and 3, each probe group 32 has one first probe 41 arranged in alignment with the center of the corresponding pin 13 and distributed around the first probe 41. A plurality of (preferably three or more) second probes 42 are provided.

  The first probe 41 and the plurality of second probes 42 forming the probe group 32 are independently arranged. For this reason, when pressed between the inspection point and the electrode part, each of them is uniquely provided. It will bend according to the load applied to.

  The probes 41 and 42 are configured to include a needle-like member having conductivity and flexibility. An insulating coating that covers the outer peripheral portions of the probes 41 and 42 may be provided.

  In the example shown in FIG. 3, four second probes 42 are provided. More specifically, when the plurality of second probes 42 in each probe group are in electrical contact with the center of the tip (more specifically, the tip surface) 13a of the corresponding pin 13 of the first probe 41. (When the pin 13 is located at the position indicated by the broken line in FIG. 3 with respect to the probe group 32), all the second probes 42 are in electrical contact with the tip (more specifically, the tip surface) 13a of the corresponding pin 13. As possible, the first probe 41 is arranged around the first probe 41 around the first probe 41. For example, the plurality of second probes 42 are arranged at equal intervals in the circumferential direction of the first probe 41.

  The arrangement of the first probe 41 and the second probe 42 is exemplified by a method in which a plurality of second probes 42 are arranged in a point-symmetric position with the first probe 41 as the center as shown in FIG. can do.

  In the example shown in FIG. 3, the outer diameter of the first probe 41 and the outer diameter of the second probe 42 are the same, but the outer diameter of the first probe 41 is made larger than the outer diameter of the second probe 42. Alternatively, the outer diameter of the second probe 42 may be made larger than the outer diameter of the first probe 41.

  The probes 41 and 42 of each probe group 32 are inserted into through holes provided individually in the holding plates 35 and 36, and are held by the holding plates 35 and 36 in an electrically independent state. Further, the probes 41 and 42 are held in a state in which their tips protrude from the front surface of the holding plate 35 on the front surface side so as to protrude and retract. Therefore, as will be described later, when the tip 13a of the pin 13 is pressed against the tips of the probes 41 and 42, the tip portions of the protruding probes 41 and 42 are pushed to the rear end side by the pressing force. At the same time, the probes 41 and 42 are elastically buckled. When the contact state with the pin 13 is released, the probes 41 and 42 autonomously return to the original state.

  One of the first probe 41 and the plurality of second probes 42 of each probe group 32 is used as a current supply probe that supplies current to the pin 13, and the first probe 41 and the plurality of second probes 42 are used. The other of these is used as a potential measuring probe for measuring the potential of the pin 13.

  With such a configuration of the probe group 32, when the probe group 32 is brought into electrical contact with the pin 13, a positional deviation or the like occurs between the pin 13 and the probe group 32 (for example, with respect to the probe group 32). Even when the pin 13 is at the position indicated by the two-dot chain line in FIG. 3), the first probe 41 disposed in the center of the probe group 32 and the plurality of second probes 42 disposed around the first probe 41. At least one of them can be reliably brought into contact with the tip 13 a of the pin 13. As a result, the continuity test by the so-called four-contact method for the wiring pattern in the semiconductor device 11 can be reliably performed via the pin 13.

The guide member 31 has a plurality of guide holes 46 that receive the distal end portion of the probe group 32 and the distal end 13a of the pin 13 that are in electrical contact with each other from both sides. This guide member 31 is attached to the front surface (opposite surface to be inspected) of the probe holding portion 33 in a state in which the distal end portion of the probe group 32 protruding to the front surface side of the holding plate 35 is inserted into the guide hole 46. ing.

  When the probe group 32 is brought into electrical contact with the pin 13 of the semiconductor device 11, the pin 13, the guide hole 46, and the probe group 32 are aligned with each other as shown in FIG. The semiconductor device 11 and the inspection jig 22 are pressed against each other so that the tip 13a and the tip of the probe group 32 are pressed against each other. At this time, the pins 13 push the tip portions of the probes 41 and 42 protruding to the front surface side of the holding plate 35 to the rear end side, and the probes 41 and 42 are elastically buckled. When the contact state with the pin 13 is released, the probes 41 and 42 autonomously return to the original state.

  Further, when the pins 13 and the probe group 32 are brought into electrical contact, the pins 13 are guided to the corresponding probe groups 32 by the guide holes 46 of the guide member 31, so that the pins 13 and the probe groups 32 can be easily and easily connected. The electrical contact can be ensured.

  The electrode holding unit 34 holds a plurality of electrodes (not shown) that are electrically connected to and electrically connected to the rear ends of the plurality of probes 41 and 42 held by the probe holding unit 33. Each electrode is electrically connected to a wiring for electrically connecting the probes 41 and 42 to the inspection processing unit 24.

  FIG. 5 is a diagram showing a simplified circuit configuration when an inspection by the inspection device 21 is being performed. As shown in FIG. 5, the inspection processing unit 24 of the inspection apparatus 21 includes a current supply unit 51 that supplies a current for inspection to the pins 13 of the semiconductor device 11 via the probe group 32, and a probe group 32. And a potential difference measuring unit 52 that measures a potential difference between the pins 13. The connection switching unit 23 includes a plurality of switches 53 a, 53 b, 54 a, 54 b for switching the connection relationship between the probes 41, 42 provided on the inspection jig 22 and the current supply unit 51 and the potential difference measurement unit 52. It has been.

  Then, by switching the states of the switches 53a, 53b, 54a, 54b of the connection switching unit 23, the first probes 41 included in any two probe groups 32 of the plurality of probe groups 32 of the inspection jig 22 and A current is supplied from the current supply unit 51 between any two pins 13 via one of the plurality of second probes 42 (for example, the first probe 41). At the same time, the potential difference between any two pins 13 via one of the first probe 41 and the plurality of second probes 42 (for example, the second probe 42) included in any two probe groups 32 is It is measured by the potential difference measuring unit 52. Then, based on the value of the current supplied by the current supply unit 51 at that time and the value of the potential difference measured by the potential difference measurement unit 52, the resistance value of the wiring pattern 55 that connects the two pins 13 is determined. Derived and the quality of the conductive state of the wiring pattern 55 is inspected based on the resistance value. When the inspection for one wiring pattern 55 is completed, the states of the switches 53a, 53b, 54a, 54b of the connection switching unit 23 are switched so as to correspond to the next wiring pattern 55.

It is a figure showing the whole composition of the inspection device concerning one embodiment of the present invention. It is a side view which shows the structure of the probe group provided in the inspection jig of the inspection apparatus of FIG. It is a figure which shows the planar arrangement | positioning of the 1st and 2nd probe which comprises the probe group of FIG. It is a figure which shows the state by which the test | inspection jig and the semiconductor device were contact | abutted. It is a figure which simplifies and shows the circuit structure when the test | inspection by the test | inspection apparatus of FIG. 1 is performed. It is a figure which shows the structure of the conventional probe.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 Semiconductor device, 12 Main body, 13 Pin, 13a Tip, 21 Inspection device, 22 Inspection jig, 23 Connection switching part, 24 Inspection processing part, 31 Guide member, 32 Probe holding part, 33 Probe holding part, 34 Electrode holding part , 35, 36 Holding plate, 41 First probe, 42 Second probe, 46 Guide hole, 51 Current supply unit, 52 Potential difference measurement unit.

Claims (3)

An inspection jig used for inspecting the electrical characteristics of the wiring pattern provided on the inspection object through the tip surfaces of a plurality of pins erected from the inspection object,
A plurality of probe groups provided corresponding to the arrangement positions of the plurality of pins , respectively, and conducted to the tip surface of the corresponding pins ;
A holding member for holding the plurality of probe groups;
A guide member having a plurality of guide holes for receiving the probe group in electrical contact with each other and the tip of the pin from both sides;
With
The probe group includes:
A first probe disposed in alignment with the center of the tip surface of the corresponding pin ;
A plurality of second probes arranged in a distributed manner around the first probe, and arranged in an insulated state from the first probe;
Equipped with a,
The plurality of second probes in each of the probe groups includes the tips of the pins to which all the second probes correspond when the first probes are in electrical contact with the centers of the tips of the pins to which the first probes correspond. A point-symmetrical arrangement around the first probe so as to be in electrical contact with a surface;
The inspection jig according to claim 1, wherein the first probe and the plurality of second probes in the probe group are independently arranged so that each of the first probe and the plurality of second probes bend independently according to a load applied thereto . The inspection jig according to claim 1,
One of the first probe and the plurality of second probes of the probe group is used as a current supply probe that supplies current to the pin, and the other is used for measuring a potential of the pin. Inspection jig characterized by being used as a probe . The inspection jig according to claim 1 or claim 2,
  A current is supplied to the pin through one of the first probe and the plurality of second probes included in any two of the plurality of probe groups of the inspection jig, and the other is An inspection processing unit for measuring the potential of the pin via
An inspection apparatus comprising:

Images