JP2009276097A - Substrate inspection jig - Google Patents

Substrate inspection jig Download PDF

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JP2009276097A
JP2009276097A JP2008125289A JP2008125289A JP2009276097A JP 2009276097 A JP2009276097 A JP 2009276097A JP 2008125289 A JP2008125289 A JP 2008125289A JP 2008125289 A JP2008125289 A JP 2008125289A JP 2009276097 A JP2009276097 A JP 2009276097A
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guide hole
contact
plate
electrode
guide
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Makoto Fujino
真 藤野
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Nidec-Read Corp
日本電産リード株式会社
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<P>PROBLEM TO BE SOLVED: To provide a substrate inspection jig which enables easy insertion of a contact, even when the tip of a probe is formed in the shape of a plane, and enables attainment of stable connection. <P>SOLUTION: A support 3 has an inspection point guide part 31, which has a guide hole for guiding one end portion of the contact 2 (probe) to an inspection point and an electrode part guide part 32, which has a third guide hole 321 for guiding the other end portion of the contact to an electrode part 41. The inspection point guide part 31 includes a first plate-shaped member 33, which is disposed on the inspection point side and has a first guide hole 331 for guiding the contact 2, and a second plate-shaped member 34 which has a second guide hole 341. The first guide hole 331 is formed in the first plate-shaped member 33, located within a neighborhood held between a straight line connecting the third guide hole 321 and the second guide hole 341 and a normal line of the second plate-shaped member 34 that extends from the second guide hole 341. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、基板検査治具に関し、より詳しくは、検査用接触子同士の配置ピッチを短くし、微細な検査点に対応することができる基板検査用治具に関する。
尚、本発明は、プリント配線基板に限らず、例えば、フレキシブル基板、多層配線基板、液晶ディスプレイやプラズマディスプレイ用の電極板、及び半導体パッケージ用のパッケージ基板やフィルムキャリアなど種々の基板や半導体ウェハなどに形成される電気的配線の検査に適用でき、本明細書では、それら種々の検査基板を総称して「基板」という。
The present invention relates to a substrate inspection jig, and more particularly to a substrate inspection jig that can reduce the arrangement pitch between inspection contacts and cope with fine inspection points.
The present invention is not limited to a printed wiring board, but includes, for example, various substrates and semiconductor wafers such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In the present specification, these various test substrates are collectively referred to as “substrates”.
基板検査用治具は、検査対象となる基板と、この基板の電気的特性を算出するための基板検査用装置とを電気的に接続するために利用されている。この基板検査用治具を用いることにより、基板検査装置は、被検査基板上に設定される検査点へ、検査を実施するための電力を供給したり、検査点から電気的信号を取り出したりすることになる。
基板検査用治具は、一端がこの検査点に導通接触し、他端が基板検査用装置の電極部に導通接触する接触子を複数備えている。
この接触子が基板と電極部に圧接されることにより、基板と基板検査用装置が電気的に接続されることになる。
The substrate inspection jig is used to electrically connect a substrate to be inspected and a substrate inspection apparatus for calculating the electrical characteristics of the substrate. By using this substrate inspection jig, the substrate inspection apparatus supplies power for performing inspection to an inspection point set on the substrate to be inspected, or extracts an electrical signal from the inspection point. It will be.
The substrate inspection jig includes a plurality of contacts whose one end is in conductive contact with the inspection point and whose other end is in conductive contact with the electrode portion of the substrate inspection apparatus.
When the contact is pressed against the substrate and the electrode portion, the substrate and the substrate inspection apparatus are electrically connected.
このような基板検査用治具として、特許文献1に開示されるような基板検査用治具の発明が提案されている。
この特許文献1に開示される基板検査用治具では、複数の接触子(プローブ)を、プローブ案内孔を有する先端側支持体と後端側支持体に保持させて使用する技術が開示されている。この特許文献1の基板検査用治具では、先端側支持体のプローブ挿入孔が、後端側支持体のプローブ挿入孔が傾斜した側にずれた位置に配置される技術が開示される。この特許文献1の基板検査用治具では、このようにプローブ挿入孔がずれた位置に配置されることにより、先端側支持体と後端側支持体の間においてプローブの中間部分を傾斜させることができ、プローブの先端が検査対象に当接したときにスムーズにプローブを撓ませることができる。また、この基板検査用治具は、このように形成することによって、プローブを装着する場合に、先端部支持体と後端部支持体をシフトさせる必要がなくなり、容易にプローブの交換を行うことができる。
As such a substrate inspection jig, an invention of a substrate inspection jig as disclosed in Patent Document 1 has been proposed.
In the substrate inspection jig disclosed in Patent Document 1, a technique is disclosed in which a plurality of contacts (probes) are used while being held by a front end side support body and a rear end side support body having probe guide holes. Yes. In the substrate inspection jig disclosed in Patent Document 1, a technique is disclosed in which the probe insertion hole of the front end side support is arranged at a position shifted to the inclined side of the probe insertion hole of the rear end side support. In the substrate inspection jig of Patent Document 1, the probe insertion hole is arranged at a position shifted in this way, so that the intermediate portion of the probe is inclined between the front end side support body and the rear end side support body. The probe can be smoothly bent when the tip of the probe comes into contact with the inspection object. Further, by forming the substrate inspection jig in this way, it is not necessary to shift the front end support and the rear end support when mounting the probe, and the probe can be easily replaced. Can do.
また、このような基板検査用治具として、特許文献2に開示されるような基板検査用治具の発明も提案されている。
この特許文献2に開示される基板検査用治具は、接触子を被覆する絶縁被覆部の端部を長手方向の中心部に向けて径が徐々に大きくなるテーパ状をなす技術が開示され、接触子を孔に対して挿抜を容易に且つ円滑に行うことができることを目的として提案されている。
As such a substrate inspection jig, an invention of a substrate inspection jig as disclosed in Patent Document 2 has also been proposed.
The jig for substrate inspection disclosed in Patent Document 2 discloses a technique of forming a taper shape in which the diameter gradually increases toward the center portion in the longitudinal direction of the insulating coating portion covering the contact, It has been proposed for the purpose of easily and smoothly inserting and removing the contact with respect to the hole.
特開2005−338065号公報JP 2005-338065 A 特開2007−333542号公報JP 2007-333542 A
しかしながら、特許文献1や2に開示されるような基板検査用治具では、先端側支持体は複数の支持板にプローブ挿入孔が2つ設けられて、接触子を検査点に案内する構成を有しているが、このような構成では、接触子を挿入する際に先端側支持体からプローブ挿入孔を貫通して突出しない場合があった。これは先端側支持体と後端側支持体が横方向に位置ずれして配置されているため、その分接触子が傾斜しており、先端側支持体の先端側プローブ挿入孔に接触子を挿通させることは同軸に配置されているので難しい問題があった。特にプローブの先端が平面形状の接触子において、顕著であった。   However, in the substrate inspection jig as disclosed in Patent Documents 1 and 2, the tip side support body has a configuration in which two probe insertion holes are provided in a plurality of support plates to guide the contact to the inspection point. However, in such a configuration, when the contact is inserted, there is a case where the probe does not protrude from the distal end support through the probe insertion hole. This is because the front end support and the rear end support are arranged laterally displaced from each other, so the contact is inclined accordingly, and the contact is inserted into the front probe insertion hole of the front support. It was difficult to insert them because they were arranged coaxially. This was particularly noticeable in a contact having a flat probe tip.
本発明は、このような実情に鑑みてなされたもので、プローブの先端が平面形状でも容易に接触子を挿入できて、安定した接続をえられる基板検査用治具を提供する。
特に、近年CPUボンディング用の微細半田バンプに四端子測定法で一つの検査点に対して二つの接触子を当接させる必要があり、使用するプローブの先端が平面形状のものの適用が多くなり、接触子の挿入性の重要度が増している。
The present invention has been made in view of such circumstances, and provides a substrate inspection jig in which a contact can be easily inserted even when the tip of a probe is planar, and a stable connection can be obtained.
In particular, in recent years, it is necessary to bring two contacts into contact with one inspection point by a four-terminal measurement method on a fine solder bump for CPU bonding, and the use of a probe with a flat tip has been applied, The importance of contactability is increasing.
請求項1記載の発明は、被検査基板の電気的特性を検査するために、基板検査用装置本体と該被検査基板の配線パターンに設けられている複数の検査点との間の電気的導通を得るための基板検査用治具であって、両端に電気的導通を図る端部を有し、一方の端部が前記検査点に圧接される導電性及び可撓性を有する棒状の複数の接触子群と、前記接触子群を保持する保持体と、前記接触子群の夫々の接触子の他方の端部と対向して配置されるとともに前記基板検査装置本体と電気的に接続される電極部を備えるとともに前記保持体を支持する電極体を有し、前記保持体は、前記接触子の一方の端部を前記検査点に案内する案内孔を有する検査点案内部と、前記接触子の他方の端部を前記電極部に案内する第三案内孔を有する電極部案内部を有し、前記検査点案内部は、前記検査点側に配置されるとともに前記接触子を案内する第一案内孔を有する第一板状部材と、前記第一板状部材と対向して前記電極体側に配置されるとともに前記接触子を案内する第二案内孔を有する第二板状部材とを有し、前記第一案内孔は、前記第三案内孔と前記第二案内孔を結ぶ直線と、前記第二案内孔から延びる前記第二板状部材の法線で挟まれる近傍内の前記第一板状部材上に形成されていることを特徴とする基板検査用治具を提供する。
請求項2記載の発明は、前記第一案内孔は、第三案内孔と第二案内孔に接触子が挿通されて保持された場合の接触子と第一板状部材との交点の近傍内に形成されていることを特徴とする請求項1記載の基板検査用治具を提供する。
請求項3記載の発明は、前記接触子は、前記棒状の両端部を除く部分に絶縁素材からなる絶縁被覆部が形成されてなり、第二案内孔が有するピッチは、前記絶縁被膜部の径より大きく形成されていることを特徴とする請求項2記載の基板検査用治具を提供する。
According to the first aspect of the present invention, in order to inspect the electrical characteristics of the substrate to be inspected, electrical continuity between the substrate inspection apparatus main body and a plurality of inspection points provided in the wiring pattern of the substrate to be inspected. A substrate inspection jig for obtaining a plurality of rod-shaped, electrically conductive and flexible rods having ends that are electrically conductive at both ends and one end pressed against the inspection point A contact group, a holding body that holds the contact group, and the other end of each contact of the contact group are disposed opposite to each other and are electrically connected to the substrate inspection apparatus main body. An inspection point guide having an electrode body and an electrode body supporting the holding body, the holding body having a guide hole for guiding one end of the contact to the inspection point; and the contact An electrode portion guide portion having a third guide hole for guiding the other end portion of the electrode to the electrode portion. The inspection point guide portion is disposed on the inspection point side and has a first plate-like member having a first guide hole for guiding the contact, and on the electrode body side facing the first plate-like member. A second plate-like member that is disposed and has a second guide hole for guiding the contact, wherein the first guide hole includes a straight line connecting the third guide hole and the second guide hole, and Provided is a board inspection jig formed on the first plate member in the vicinity sandwiched by the normal line of the second plate member extending from the second guide hole.
In the invention according to claim 2, the first guide hole is located in the vicinity of the intersection of the contact and the first plate member when the contact is inserted and held in the third guide hole and the second guide hole. 2. The substrate inspection jig according to claim 1, wherein the substrate inspection jig is formed.
According to a third aspect of the present invention, in the contact, the insulating coating portion made of an insulating material is formed in a portion excluding the rod-shaped both ends, and the pitch of the second guide hole is the diameter of the insulating coating portion. 3. The substrate inspection jig according to claim 2, wherein the jig is formed larger.
請求項1記載の発明によれば、接触子を保持する第一板状部材の第一案内孔が、第三板状部材の第三案内孔と第二板状部材の第二案内孔を結ぶ直線と、第二案内孔から延びる第二板状部材の法線とで挟まれる近傍内(付近)の第一板状部材上に形成されているので、特に先端が平面形状の接触子を保持体に挿入して各案内孔に貫通させる場合に、第一案内孔に容易に挿通させることができる。
請求項2記載の発明によれば、第三案内孔と第二案内孔に接触子が挿通されて保持された場合の接触子と第一板状部材との交点の付近に形成されているので、より容易に第一案内孔に挿通させることができる。
請求項3記載の発明によれば、第二案内孔のピッチが接触子の絶縁被覆部の径よりも大きく形成されているので、接触子を第三案内孔から第2案内孔に容易に挿入することが容易に出来き、接触子が撓んだ場合も相互干渉が少なく安定した接続を得られる。
According to the first aspect of the present invention, the first guide hole of the first plate member holding the contact connects the third guide hole of the third plate member and the second guide hole of the second plate member. Since it is formed on the first plate-like member in the vicinity (near) sandwiched between the straight line and the normal line of the second plate-like member extending from the second guide hole, the tip has a flat-shaped contact in particular. When it is inserted into the body and penetrates through each guide hole, it can be easily inserted through the first guide hole.
According to the second aspect of the present invention, since the contact is inserted and held in the third guide hole and the second guide hole, it is formed in the vicinity of the intersection of the contact and the first plate member. Thus, it can be more easily inserted into the first guide hole.
According to the invention of claim 3, since the pitch of the second guide hole is formed larger than the diameter of the insulating coating portion of the contact, the contact can be easily inserted into the second guide hole from the third guide hole. This makes it easy to achieve a stable connection with little mutual interference even when the contact is bent.
本発明を実施するための最良の形態を説明する。
図1は、本発明に係る基板検査用治具1を使用する場合の全体の概略構成を示している。この図1では、基板検査用治具1は、複数の接触子2、これら接触子2を多針状に保持する保持体3、この保持体3を支持するとともに接触子2と接触して導通となる電極部(図示せず)を有する電極体4、検出される電気信号を処理する検査信号処理部5、及び電極部と検査信号処理部5を接続する導線44を示している。
接触子2は、電極部と検査点を電気的に接続する。
保持体3は、接触子2を多針状に保持するとともに、接触子2の一方端を検査点へ、他方端を電極部へ夫々案内する。
本発明は、この基板検査用治具1に関する発明であり、特に先端が平面形状の接触子2を容易に保持体3に挿入することを目的としている。
尚、図1は概略を示す図であり、接触子2の本数やワイヤーケーブルの本数は特に限定されるものではない。また、図面中で示される接触子2や電極部41は、説明の都合上一本分又は一対分の構造しか開示しておらず、実際の基板検査用治具1では複数の接触子やその接触子2に対応する複数の電極部を有している。
The best mode for carrying out the present invention will be described.
FIG. 1 shows an overall schematic configuration when a substrate inspection jig 1 according to the present invention is used. In FIG. 1, a substrate inspection jig 1 includes a plurality of contacts 2, a holding body 3 that holds the contacts 2 in a multi-needle shape, supports the holding body 3, and comes into contact with the contact 2 to be conductive. 2 shows an electrode body 4 having an electrode portion (not shown), an inspection signal processing portion 5 that processes an electric signal to be detected, and a lead wire 44 that connects the electrode portion and the inspection signal processing portion 5.
The contact 2 electrically connects the electrode part and the inspection point.
The holding body 3 holds the contact 2 in a multi-needle shape, and guides one end of the contact 2 to the inspection point and the other end to the electrode portion.
The present invention is an invention relating to the substrate inspection jig 1, and in particular, an object of the present invention is to easily insert a contact 2 having a flat tip at a holder 3.
FIG. 1 is a schematic view, and the number of contacts 2 and the number of wire cables are not particularly limited. Further, the contactor 2 and the electrode part 41 shown in the drawings are disclosed only for one or a pair of structures for convenience of explanation, and the actual substrate inspection jig 1 has a plurality of contacts and their contacts. A plurality of electrode portions corresponding to the contact 2 are provided.
本発明の基板検査用治具の説明を行う。
図2は本発明にかかる基板検査用治具の一実施形態を示す断面図である。
本発明にかかる基板検査用治具1は、接触子2、保持体3と電極体4を有してなる。
接触子2は、検査点と電極体4の電極部41を電気的に接続する。この接触子2は、両端に電気的導通を図る端部を有し、一方の端部が検査点に圧接され、他方の端部が電極部41に圧接される。
この接触子2は、導電性と可塑性を有する棒状部材21と、この棒状部材21の周縁に被覆される絶縁被覆部22を有してなる。
棒状部材21は、導電性の素材から形成される円柱形状の部材である。この棒状部材の一方の端部の先端形状は、当接する検査点に応じて変更されるが、はんだバンプのような湾曲形状(半球状形状)に形成される場合には平面形状に形成され、めっきランドのような平面形状の検査点の場合には半球状又は先鋭形状に形成される。棒状部材の他方の端部の先端形状は、電極部41の形状に応じて変更されるが、電極部41は電極体4の表面と面一に形成される場合には棒状部材21の他方の端部は湾曲形状に形成される。
棒状部材21は、例えば、タングステン(W)やベリリウム銅(BeCu)を用いることができる。
The substrate inspection jig of the present invention will be described.
FIG. 2 is a cross-sectional view showing an embodiment of a substrate inspection jig according to the present invention.
A substrate inspection jig 1 according to the present invention includes a contact 2, a holding body 3, and an electrode body 4.
The contact 2 electrically connects the inspection point and the electrode part 41 of the electrode body 4. The contact 2 has ends that are electrically connected to both ends, one end is pressed against the inspection point, and the other end is pressed against the electrode portion 41.
The contact 2 includes a rod-shaped member 21 having conductivity and plasticity, and an insulating coating portion 22 that covers the periphery of the rod-shaped member 21.
The rod-shaped member 21 is a columnar member formed from a conductive material. The tip shape of one end of this rod-like member is changed according to the inspection point that comes into contact, but when it is formed into a curved shape (semispherical shape) such as a solder bump, it is formed into a planar shape, In the case of a planar inspection point such as a plating land, it is formed in a hemispherical shape or a sharp shape. The tip shape of the other end portion of the rod-shaped member is changed according to the shape of the electrode portion 41, but when the electrode portion 41 is formed flush with the surface of the electrode body 4, the other end shape of the rod-shaped member 21 is changed. The end is formed in a curved shape.
For example, tungsten (W) or beryllium copper (BeCu) can be used for the rod-shaped member 21.
絶縁被覆部22は、棒状部材21の周縁で、且つ、棒状部材21の両端を除く部分に被覆される。この絶縁被覆部22は、非導電素材で形成されており、例えば、ポリテトラフルオロエチレン(テフロン(登録商標))やポリウレタンを用いることができる。
この絶縁被覆部22が設けられる部位は棒状部材21の両端部を除く部分であるが、棒状部材21の一方の端部側は、第一板状部材33の第一案内孔331a、331bが棒状部材21の径w1よりも大きく且つ絶縁被覆部22の径w2よりも小さく形成されているので、第一板状部材32の厚みよりも長く形成される必要がある。なお、図2で示される実施形態では、第二板状部材34の第二案内孔341a,341b内部に挿入されない程度に形成されている。
The insulating covering portion 22 is covered on the periphery of the rod-shaped member 21 and on a portion excluding both ends of the rod-shaped member 21. The insulating coating 22 is made of a non-conductive material, and for example, polytetrafluoroethylene (Teflon (registered trademark)) or polyurethane can be used.
The portion where the insulating covering portion 22 is provided is a portion excluding both ends of the rod-shaped member 21, but the first guide holes 331 a and 331 b of the first plate-shaped member 33 are rod-shaped on one end side of the rod-shaped member 21. Since it is formed to be larger than the diameter w1 of the member 21 and smaller than the diameter w2 of the insulating coating portion 22, it is necessary to form it longer than the thickness of the first plate member 32. In the embodiment shown in FIG. 2, the second plate-shaped member 34 is formed so as not to be inserted into the second guide holes 341 a and 341 b.
この接触子2の長さは、特に限定されないが、2〜5cmに設定することができる。棒状部材21の径w1は、特に限定されないが、四端子測定法を実施するためにより細い形状が好ましく、例えば、40〜100μmに設定される(図3参照)。
また、絶縁被覆部22の厚みは、例えば、約10〜20μmであり、絶縁被覆部22の径w2は、例えば、60〜140μmに設定される(図3参照)。
尚、これらの寸法は、限定されるものではなく適宜に変更される。
The length of the contact 2 is not particularly limited, but can be set to 2 to 5 cm. Although the diameter w1 of the rod-shaped member 21 is not particularly limited, a narrower shape is preferable for performing the four-terminal measurement method, and is set to 40 to 100 μm, for example (see FIG. 3).
Moreover, the thickness of the insulation coating part 22 is about 10-20 micrometers, for example, and the diameter w2 of the insulation coating part 22 is set to 60-140 micrometers, for example (refer FIG. 3).
In addition, these dimensions are not limited and are changed appropriately.
本発明の基板検査用治具1は、四端子測定法を実施するために、一つの検査点に二本の接触子2を当接させるため、二本の接触子2を一対の接触子として取り扱う。
このため、一対の接触子2をより効果的に保持させることにより、一対の接触子2の検査点で当接する位置のピッチを狭めることができる。
The substrate inspection jig 1 according to the present invention uses the two contacts 2 as a pair of contacts in order to bring the two contacts 2 into contact with one inspection point in order to perform the four-terminal measurement method. handle.
For this reason, by holding the pair of contacts 2 more effectively, it is possible to narrow the pitch of the positions where the contact points of the pair of contacts 2 abut.
保持体3は、接触子2の一方の端部を検査点へ案内し、他方の端部を電極部41へ案内する。
この保持体3は、接触子2の一方の端部を検査点に案内する検査点案内部31と、接触子2の他方の端部を電極部41へ案内する電極部案内部32を有してなる。
この検査点案内部31は、板状部材で形成されてなり、第一板状部材33と第二板状部材34を有してなる。
この第一板状部材33は、接触子2の一方の端部を案内する第一案内孔331を有するとともに、検査点に最も近い位置(検査点側)に配置される。
この第二板状部材34は、第一板状部材33と対向して配置されるとともに、接触子2の一方の端部を案内する第二案内孔341を有する。この第二板状部材34は、第一板状部材33の電極部案内部32側に配置される。
The holding body 3 guides one end of the contact 2 to the inspection point and guides the other end to the electrode portion 41.
The holding body 3 has an inspection point guide portion 31 that guides one end portion of the contact 2 to the inspection point, and an electrode portion guide portion 32 that guides the other end portion of the contact 2 to the electrode portion 41. It becomes.
The inspection point guide portion 31 is formed of a plate member, and includes a first plate member 33 and a second plate member 34.
The first plate-like member 33 has a first guide hole 331 for guiding one end of the contact 2 and is disposed at a position (inspection point side) closest to the inspection point.
The second plate-like member 34 is disposed opposite to the first plate-like member 33 and has a second guide hole 341 that guides one end of the contact 2. The second plate member 34 is disposed on the electrode portion guide portion 32 side of the first plate member 33.
図2では、一対の接触子2a、2bを保持する場合が記載されている。
第一案内孔331a、331bは、夫々接触子2a、2bを保持する。第一案内孔331aは、接触子2aの一方の端部を保持し、第一案内孔331bは、接触子2bの一方の端部を保持する。この第一案内孔331aと第一案内孔331bの径は、棒状部材21の径w1よりも大きく形成され、好ましくは、僅かに大ききことが好ましい。
第二案内孔341a、341bは、夫々接触子2a,2bを保持する。第二案内孔341aは、接触子2aの一方の端部を保持し、第二案内孔341bは、接触子2bの一方の端部を保持する。
第二案内孔341a,341bの径は、棒状部材21の径w1より大きく、好ましくは僅かに大きく絶縁被覆部22の径w2よりも小さく形成され、第一案内孔331a,331bと同様に板部材の厚さに応じて、径の相違する大小二つの同軸の孔部で形成することができる。
In FIG. 2, the case where a pair of contacts 2a and 2b are held is described.
The first guide holes 331a and 331b hold the contacts 2a and 2b, respectively. The first guide hole 331a holds one end of the contact 2a, and the first guide hole 331b holds one end of the contact 2b. The diameters of the first guide hole 331a and the first guide hole 331b are formed larger than the diameter w1 of the rod-shaped member 21, and are preferably slightly larger.
The second guide holes 341a and 341b hold the contacts 2a and 2b, respectively. The second guide hole 341a holds one end of the contact 2a, and the second guide hole 341b holds one end of the contact 2b.
The diameters of the second guide holes 341a and 341b are larger than the diameter w1 of the rod-like member 21, preferably slightly larger than the diameter w2 of the insulating coating portion 22, and are plate members like the first guide holes 331a and 331b. Depending on the thickness, it can be formed with two large and small coaxial holes having different diameters.
図4は、検査点案内部31の一実施形態である第一板状部材と第二板状部材の構成を示す断面図である。
第一板状部材33には、第一案内孔331aと第一案内孔331bが第一ピッチ(距離)p1で形成される。第二板状部材34には、第二案内孔341aと第二案内孔341bの第二ピッチp2で形成される。
第一ピッチp1は、第二ピッチp2よりも短く形成される。この第一ピッチp1が、第二ピッチp2よりも短く形成されることにより、一対の接触子2a、2bがより狭いピッチで検査点に当接することができる。
このピッチ短縮の量と方向は、絶縁被膜の厚さ相当量と後述の接触子2の撓み方向と直交する検査点の中心方向にすることが望ましい。
FIG. 4 is a cross-sectional view showing configurations of a first plate member and a second plate member that are one embodiment of the inspection point guide 31.
A first guide hole 331a and a first guide hole 331b are formed in the first plate member 33 at a first pitch (distance) p1. The second plate-like member 34 is formed with a second pitch p2 between the second guide hole 341a and the second guide hole 341b.
The first pitch p1 is formed shorter than the second pitch p2. By forming the first pitch p1 shorter than the second pitch p2, the pair of contacts 2a and 2b can contact the inspection points at a narrower pitch.
The amount and direction of the pitch shortening are desirably set in the center direction of the inspection point orthogonal to the thickness equivalent of the insulating coating and the bending direction of the contact 2 described later.
この第一ピッチp1は、接触子2の絶縁被覆部22の径w2よりも小さく形成されることが好ましい。第一ピッチp1が絶縁被覆部22の径w2よりも小さく形成されることにより、接触子2の絶縁被膜部22の径よりも小さいピッチで検査点に当接させることができ、より一対の接触子2を狭い間隔で当接させることができる。
可撓性を有する素材の接触子2において、良好な動作特性が得られる。
This first pitch p <b> 1 is preferably formed smaller than the diameter w <b> 2 of the insulating coating portion 22 of the contact 2. By forming the first pitch p <b> 1 smaller than the diameter w <b> 2 of the insulating coating part 22, the first pitch p <b> 1 can be brought into contact with the inspection point at a pitch smaller than the diameter of the insulating coating part 22 of the contact 2. The child 2 can be contacted at a narrow interval.
In the contact 2 made of a flexible material, good operating characteristics can be obtained.
保持体3は、接触子2の他方の端部を電極部41へ案内するための第三案内孔321a、321bを有する第三板状部材32を有する。
図2では、この第三板状部材32が一枚の板部材により形成される実施形態が示されているが、特に限定されるものではなく、複数の板部材により形成されることもできる。
この第三案内孔321a、321bは、図2で示される如く、接触子2a,2bの絶縁被覆部22よりも大きい径を有するように形成される。尚、この第三案内孔321a,321bも、第一案内孔331、第二案内孔341と同様に板部材の厚さに応じて、径の相違する大小二つの同軸の孔部で形成することもできる。
この第三案内孔321a、321bは、保持体3に接触子2が保持される場合の挿入口となる。
The holding body 3 includes a third plate-like member 32 having third guide holes 321 a and 321 b for guiding the other end of the contact 2 to the electrode part 41.
Although FIG. 2 shows an embodiment in which the third plate-like member 32 is formed by a single plate member, the embodiment is not particularly limited, and the third plate-like member 32 may be formed by a plurality of plate members.
As shown in FIG. 2, the third guide holes 321a and 321b are formed so as to have a diameter larger than that of the insulating cover portion 22 of the contacts 2a and 2b. The third guide holes 321a and 321b are also formed by two large and small coaxial holes having different diameters according to the thickness of the plate member, similarly to the first guide hole 331 and the second guide hole 341. You can also.
The third guide holes 321 a and 321 b serve as insertion ports when the contact 2 is held by the holding body 3.
図5は、本発明にかかる基板検査用治具の各案内孔の配置位置を示す概略断面図である。
保持体3の形成される第一乃至第三案内孔は、夫々各板状部材に形成されているが、図5で示される如く、これらの案内孔は一直線上に配置されていない。なお、図5では、第一案内孔の位置を符号H1、第二案内孔の位置を符号H2、第三案内孔の位置を符号H3で示しており、各案内孔の中心位置を示している。
第三案内孔H3と第二案内孔H2を結ぶ直線Aは、第三板状部材32の板面の法線Bに対して傾斜して形成されて接触子2の撓み方向を定めている。
第一案内孔H1は、この直線A上の第一板状部材33の位置H4に形成されず、第二案内孔H2から延びる第二板状部材34の法線Cと直線Aとで挟まれる第一板状部材33の位置の近傍内(付近)に形成されることが好ましい。
また、この第一案内孔H1と第二案内孔H2を結ぶ直線Dは、この法線Cと重なることがないように、第一案内孔H1と第二案内孔H2は配置される。
第一案内孔H1と第二案内孔H2を結ぶ直線Dと法線Cの角度と、第二案内孔H2と第三案内孔H3を結ぶ直線Aと法線Cの角度を比べた場合、直線Dと法線Cの角度のほうがより小さい角度を形成していることになる。
このように形成することによって、接触子2を第三案内孔H3から挿入する場合に、第三案内孔H3を介して第二案内孔H2に接触子2を挿入した際に、接触子2は可撓性に応じて湾曲し、接触子2が第一案内孔H1へ挿入されることになる。つまり、第一案内孔H1が、第三案内孔H3と第二案内孔H2を通過して湾曲形状となる接触子2の先端(一方の端部)の位置付近に配置されている。このため、容易に接触子2を挿入することができる。特に先端が平面形状の場合に効果がある。
FIG. 5 is a schematic cross-sectional view showing the arrangement position of each guide hole of the substrate inspection jig according to the present invention.
The first to third guide holes in which the holding body 3 is formed are formed in each plate-like member, but these guide holes are not arranged in a straight line as shown in FIG. In FIG. 5, the position of the first guide hole is indicated by reference numeral H1, the position of the second guide hole is indicated by reference numeral H2, the position of the third guide hole is indicated by reference numeral H3, and the center position of each guide hole is indicated. .
A straight line A connecting the third guide hole H3 and the second guide hole H2 is formed so as to be inclined with respect to the normal B of the plate surface of the third plate-like member 32, and determines the bending direction of the contact 2.
The first guide hole H1 is not formed at the position H4 of the first plate-like member 33 on the straight line A, but is sandwiched between the normal line C and the straight line A of the second plate-like member 34 extending from the second guide hole H2. It is preferable that the first plate member 33 is formed in the vicinity (near) of the position.
Further, the first guide hole H1 and the second guide hole H2 are arranged so that the straight line D connecting the first guide hole H1 and the second guide hole H2 does not overlap the normal line C.
When the angle between the straight line D and the normal C connecting the first guide hole H1 and the second guide hole H2 and the angle between the straight line A connecting the second guide hole H2 and the third guide hole H3 and the normal C are straight lines, The angle between D and normal C forms a smaller angle.
By forming in this way, when the contact 2 is inserted from the third guide hole H3, the contact 2 is inserted into the second guide hole H2 via the third guide hole H3. It curves according to flexibility, and the contact 2 is inserted into the first guide hole H1. That is, the 1st guide hole H1 is arrange | positioned in the position vicinity of the front-end | tip (one edge part) of the contact 2 which passes the 3rd guide hole H3 and the 2nd guide hole H2, and becomes a curved shape. For this reason, the contact 2 can be easily inserted. This is particularly effective when the tip has a planar shape.
この第一案内孔H1の位置は、上記の如き第一板状部材33上に配置されるが、第一案内孔HIと第二案内孔H2の間d1と、第二案内孔H2と第三案内孔H3の間d2は、1:10〜30の比率で設計されることが好ましい。
また、第一案内孔H1と第二案内孔H2の距離d3と、第二案内孔H2と第三案内孔H3の距離d4は、d3:d4が1:10〜200の比率で設計されることが好ましい。
d4は接触子2の撓みを定めるものであり、d3が接触子2の挿入を容易にするものである。
The position of the first guide hole H1 is arranged on the first plate-like member 33 as described above, but d1 between the first guide hole HI and the second guide hole H2, the second guide hole H2, and the third guide hole H1. The distance d2 between the guide holes H3 is preferably designed at a ratio of 1: 10-30.
The distance d3 between the first guide hole H1 and the second guide hole H2 and the distance d4 between the second guide hole H2 and the third guide hole H3 are designed such that d3: d4 is 1:10 to 200. Is preferred.
d4 determines the deflection of the contact 2, and d3 facilitates the insertion of the contact 2.
電極体4は、各接触子2の他端と導通接続して、基板を検査する基板検査装置(図示せず)に接続される(図2参照)。
この電極体4は、電極部41と電極部保持板42を有してなる。
電極部41は、一方が接触子2の他方の端部と当接して導通接触され、他方が基板検査装置に電気的に接続される。この電極部41は導電性の素材により形成される。
この電極部41は、例えば図2で示される実施形態に示される如く、端面が電極部保持板42の表面と面一となるように配置される導線44を用いて形成することができる。
The electrode body 4 is electrically connected to the other end of each contact 2 and connected to a substrate inspection apparatus (not shown) for inspecting the substrate (see FIG. 2).
The electrode body 4 includes an electrode part 41 and an electrode part holding plate 42.
One of the electrode parts 41 is in contact with the other end of the contact 2 to be in conductive contact, and the other is electrically connected to the substrate inspection apparatus. The electrode part 41 is formed of a conductive material.
For example, as shown in the embodiment shown in FIG. 2, the electrode portion 41 can be formed using a conductive wire 44 that is arranged so that the end face is flush with the surface of the electrode portion holding plate 42.
電極部保持板42は、電極部41を所定の位置に配置されるように保持する。この電極部保持板42の大きさや厚みは、特に限定されず、使用により適宜変更することができる。
以上が、本基板検査用治具の構成の説明である。
The electrode part holding plate 42 holds the electrode part 41 so as to be arranged at a predetermined position. The size and thickness of the electrode portion holding plate 42 are not particularly limited, and can be appropriately changed depending on use.
The above is the description of the configuration of the substrate inspection jig.
本発明の基板検査用治具の組み立て方について説明する。
本基板検査用治具1を組み立てる場合には、第一板状部材33、第二板状部材34と第三板状部材32を対象となる第一案内孔H1、第二案内孔H2と第三案内孔H3が所定の位置に配置されるように積設される(図5参照)。
次に、第三案内孔H3から第二案内孔H2へ接触子2を挿入する。接触子2は、その一方の端部が第三案内孔H3を挿通して、第二案内孔H2に挿入された際には、接触子2がこれら案内孔の配置位置に応じて撓み形状となり、この撓み状態のまま接触子2は挿入方向に進むが、第一案内孔H1が接触子2の進み方向に配置されているので、接触子2は容易に第一案内孔H1に挿入され貫通することになる。
A method of assembling the substrate inspection jig of the present invention will be described.
When assembling the substrate inspection jig 1, the first guide hole H 1, the second guide hole H 2, and the first plate hole 33, the second plate member 34, and the third plate member 32 are the target. The three guide holes H3 are stacked so as to be arranged at predetermined positions (see FIG. 5).
Next, the contact 2 is inserted from the third guide hole H3 into the second guide hole H2. When one end of the contact 2 is inserted through the third guide hole H3 and inserted into the second guide hole H2, the contact 2 is bent according to the position of the guide holes. In this bent state, the contact 2 advances in the insertion direction. However, since the first guide hole H1 is disposed in the advance direction of the contact 2, the contact 2 is easily inserted into the first guide hole H1 and penetrates therethrough. Will do.
また、同じように対となる他方の接触子2を所定の案内孔に挿通させる。
このとき、一対の接触子2は、第二案内孔H2のピッチよりも第一案内孔H1のピッチが短く形成されているので、より狭いピッチで一対の接触子2が配置されることになる。
Similarly, the other pair of contacts 2 is inserted through a predetermined guide hole.
At this time, since the pair of contacts 2 is formed so that the pitch of the first guide holes H1 is shorter than the pitch of the second guide holes H2, the pair of contacts 2 is arranged at a narrower pitch. .
接触子2は2本を一対としたものとして詳細を説明したが他の実施形態として、通常の検査点に1本の基板検査用治具と混在することができる。   Although the contactor 2 has been described in detail as a pair of two, as another embodiment, a single substrate inspection jig can be mixed at a normal inspection point.
本基板検査用治具の概略構成図を示す。The schematic block diagram of this board | substrate test | inspection jig | tool is shown. 本基板検査用治具の一実施形態を示す概略正面図である。It is a schematic front view which shows one Embodiment of this jig | tool for board | substrate inspection. 接触子の先端断面図を示す。The tip sectional drawing of a contact is shown. 第一板状部材と第二板状部材の概略正面図である。It is a schematic front view of a 1st plate-shaped member and a 2nd plate-shaped member. 第一乃至第三板状部材の配置位置を示す概略側面図である。It is a schematic side view which shows the arrangement position of a 1st thru | or 3rd plate-shaped member.
符号の説明Explanation of symbols
1・・・・・基板検査用治具
2・・・・・接触子
3・・・・・保持体
33・・・・第一板状部材
331・・・第一案内孔
34・・・・第二板状部材
341・・・第二案内孔
4・・・・・電極体
41・・・・電極部
DESCRIPTION OF SYMBOLS 1 ... Board inspection jig 2 ... Contact 3 ... Holding body 33 ... First plate member 331 ... First guide hole 34 ... 2nd plate-shaped member 341 ... 2nd guide hole 4 ... Electrode body 41 ...... Electrode part

Claims (3)

  1. 被検査基板の電気的特性を検査するために、基板検査用装置本体と該被検査基板の配線パターンに設けられている複数の検査点との間の電気的導通を得るための基板検査用治具であって、
    両端に電気的導通を図る端部を有し、一方の端部が前記検査点に圧接される導電性及び可撓性を有する棒状の複数の接触子群と、
    前記接触子群を保持する保持体と、
    前記接触子群の夫々の接触子の他方の端部と対向して配置されるとともに前記基板検査装置本体と電気的に接続される電極部を備えるとともに前記保持体を支持する電極体を有し、
    前記保持体は、
    前記接触子の一方の端部を前記検査点に案内する案内孔を有する検査点案内部と、
    前記接触子の他方の端部を前記電極部に案内する第三案内孔を有する電極部案内部を有し、
    前記検査点案内部は、
    前記検査点側に配置されるとともに前記接触子を案内する第一案内孔を有する第一板状部材と、
    前記第一板状部材と対向して前記電極体側に配置されるとともに前記接触子を案内する第二案内孔を有する第二板状部材とを有し、
    前記第一案内孔は、前記第三案内孔と前記第二案内孔を結ぶ直線と、前記第二案内孔から延びる前記第二板状部材の法線で挟まれる近傍内の前記第一板状部材上に形成されていることを特徴とする基板検査用治具。
    In order to inspect the electrical characteristics of the substrate to be inspected, a substrate inspection treatment for obtaining electrical continuity between the substrate inspection apparatus main body and a plurality of inspection points provided in the wiring pattern of the substrate to be inspected. Tools,
    A plurality of rod-shaped contact groups having electrical conductivity and flexibility, the ends having electrical conduction at both ends, and one end being pressed against the inspection point;
    A holding body for holding the contact group;
    The electrode assembly includes an electrode body that is disposed to face the other end of each contact of the contact group and that is electrically connected to the substrate inspection apparatus main body and supports the holding body. ,
    The holder is
    An inspection point guide having a guide hole for guiding one end of the contact to the inspection point;
    An electrode portion guide portion having a third guide hole for guiding the other end of the contact to the electrode portion;
    The inspection point guide part
    A first plate-like member disposed on the inspection point side and having a first guide hole for guiding the contact;
    A second plate-like member disposed on the electrode body side opposite to the first plate-like member and having a second guide hole for guiding the contact;
    The first guide hole is the first plate shape in the vicinity sandwiched between the straight line connecting the third guide hole and the second guide hole and the normal line of the second plate member extending from the second guide hole. A jig for substrate inspection, characterized in that it is formed on a member.
  2. 前記第一案内孔は、第三案内孔と第二案内孔に接触子が挿通されて保持された場合の接触子と第一板状部材との交点の近傍内に形成されていることを特徴とする請求項1記載の基板検査用治具。   The first guide hole is formed in the vicinity of the intersection of the contact and the first plate member when the contact is inserted and held in the third guide hole and the second guide hole. The substrate inspection jig according to claim 1.
  3. 前記接触子は、前記棒状の両端部を除く部分に絶縁素材からなる絶縁被覆部が形成されてなり、
    第二案内孔が有するピッチは、前記絶縁被膜部の径より大きく形成されていることを特徴とする請求項2記載の基板検査用治具。
    The contact is formed with an insulating covering portion made of an insulating material in a portion excluding the rod-shaped both ends.
    The substrate inspection jig according to claim 2, wherein a pitch of the second guide hole is formed larger than a diameter of the insulating coating portion.
JP2008125289A 2008-05-12 2008-05-12 Substrate inspection jig Pending JP2009276097A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822042B1 (en) * 2015-03-27 2015-11-24 日本電産リード株式会社 Inspection jig, substrate inspection apparatus, and manufacturing method of inspection jig

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005338065A (en) * 2004-04-26 2005-12-08 Koyo Technos:Kk Inspection jig and inspection equipment
WO2009028708A1 (en) * 2007-08-31 2009-03-05 Nhk Spring Co., Ltd. Probe holder, and probe unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005338065A (en) * 2004-04-26 2005-12-08 Koyo Technos:Kk Inspection jig and inspection equipment
WO2009028708A1 (en) * 2007-08-31 2009-03-05 Nhk Spring Co., Ltd. Probe holder, and probe unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822042B1 (en) * 2015-03-27 2015-11-24 日本電産リード株式会社 Inspection jig, substrate inspection apparatus, and manufacturing method of inspection jig
WO2016157964A1 (en) * 2015-03-27 2016-10-06 日本電産リード株式会社 Inspection jig and substrate inspection apparatus
JP2016186471A (en) * 2015-03-27 2016-10-27 日本電産リード株式会社 Inspection jig, substrate inspection device, and manufacturing method for inspection jig

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