TWI397695B - Probing apparatus for integrated circuit testing - Google Patents

Description

Detection device for integrated circuit test

The invention relates to a detecting device for integrated circuit testing which can effectively filter out AC noise of a power source or a grounding point.

In the field of integrated circuit testing, the probe portion is the interface between the signal transmission line of the probe head and the object to be tested. The integrated circuit test object can be one of the semiconductor wafers, and a solder pad for probe detection is formed on the surface of the crystal grain.

In general, a probe set has a plurality of probes. When the pads on the semiconductor die to be tested are electrically contacted, the electrical characteristics of the integrated circuit can be tested to determine whether the semiconductor die is good. A good semiconductor die will continue with subsequent packaging or assembly processes. Poor semiconductor dies will be discarded or repaired to avoid additional packaging costs. However, in the signal transmission process of the integrated circuit test, in addition to the connection of the high frequency signal, an additional DC bias power supply is often required. The DC bias power supply is coupled with the inductance of the high frequency switching current combined with the inductance of the probe itself. (L.di/dt) generates and couples noise interference at the power supply or ground point, causing signal distortion and incapability of accurately measuring the electrical characteristics of the semiconductor die.

Therefore, referring to FIG. 3, U.S. Patent No. 4,764,723 discloses a low-impedance transmission line probe using an alumina substrate to supply a DC bias power supply with a stable integrated circuit, which is provided with a capacitor c. The front end of the substrate on which the capacitor c is built needs to be reduced to the wafer level, which results in a complicated manufacturing process and high cost, which is not practical and currently not commercially available.

In addition, referring to FIG. 4, a detecting device having a built-in bypass capacitor is disclosed in US Pat. No. 5,373,231. The detecting device includes a radio frequency probe a (RF probe) and a line probe b ( a wire probe) and a capacitor c disposed between the RF probe and the line probe, the RF probe a and the line probe b are directly mounted on a probe card, and the capacitor c is mechanically connected to the cable The RF probe a and the line probe b are used to effectively reduce the AC noise and ensure the accuracy of the test result. Since the external capacitor must be installed between every two probes, the cost is high and the production is time consuming, although It is suitable for the connection of the cantilever probe. However, when the solder pads of the component to be tested have high and low drop, the two probes form mutual interference and restraint, which is not ideal. And the line probe b is not effectively shielded, and the coupling noise cannot be isolated.

In view of this, the present inventors have continuously developed and improved the present invention.

The main object of the present invention is to provide a detecting device for integrated circuit testing which can effectively filter out AC noise of a power source or a grounding point.

In order to achieve the above object, the present invention is a detecting device for integrated circuit testing, comprising at least a substrate, a detecting pin body and a bypass capacitor, wherein the substrate is filled with an inner conductor via an insulating material. The inner end of the substrate is provided with an inner surface, and the inner conductor and the insulating material are exposed on the cut surface, and one end of the probe body is electrically connected to the inner conductor exposed on the cut surface, and the probe is detected. The end of the needle body is provided for contacting the pad of the component to be tested, and the bypass capacitor has a first electrode end and a second electrode end, wherein the first electrode end is electrically connected to the detecting pin body, and the second electrode end is electrically connected The conductors are joined outside the end of the substrate.

When implemented, the substrate is a coaxial transmission line structure.

When implemented, the insulating material is composed of polyimide.

In practice, the bypass capacitor is bonded to the insulating material exposed above the cut surface.

In practice, the insulating material exposed on the end surface of the substrate protrudes from the end surface of the substrate, and the bypass capacitor can be bonded and fixed to the insulating material protruding from the end surface of the substrate.

In order to facilitate a more in-depth understanding of the present invention, an embodiment is described in detail below:

1‧‧‧Substrate

10‧‧‧faced

11‧‧‧ Inner conductor

12‧‧‧Insulation materials

13‧‧‧Outer conductor

2‧‧‧Detecting needle body

3‧‧‧ Bypass capacitor

31‧‧‧First electrode end

32‧‧‧Second electrode end

4‧‧‧ probe card

a‧‧‧RF probe

B‧‧‧ line probe

c‧‧‧Capacitors

FIG. 1 is a schematic perspective view showing the assembly of the detecting device and the probe card according to the embodiment of the present invention.

2a is a schematic view showing the appearance of a bypass capacitor combined with an insulating material in the embodiment of the present invention.

Figure 2b is a schematic view showing the appearance of a bypass capacitor bonded to an insulating material in the embodiment of the present invention.

2c is a schematic view showing the appearance of a bypass capacitor combined with an insulating material protruding from a substrate surface in the embodiment of the present invention.

Fig. 3 is a schematic view showing the structure of a conventional US patent number.

Figure 4 is a schematic view of the structure of another US patent number in the prior art.

Please refer to FIG. 1 and FIG. 2a. The figure is an embodiment of the detecting device for the integrated circuit test of the present invention, which is composed of at least a substrate 1, a detecting needle 2 and a bypass capacitor 3. .

The substrate 1 can be a coaxial cable or other transmission line structure. The substrate 1 is filled in an outer conductor 13 by an inner conductor 11 filled with an insulating material 12. The insulating material 12 is a polyimide. Composition. The end surface of the substrate 1 is provided with a surface 10 such that the inner conductor 11 and the insulating material 12 are exposed on the cutting surface 10. The probe body 2 is electrically connected to the inner conductor 11 exposed to the cutting surface 10 at the end. The end of the needle 2 is provided for contacting the pad of the device to be tested, and the bypass capacitor 3 has a first electrode end 31 and a second electrode end 32, wherein the first electrode end 31 is electrically connected to the probe body 2, The second electrode end 32 is connected to the outer conductor 13 at the end of the substrate 1. Thereby, the detecting device for the integrated circuit test of the present invention is installed on a probe card 4, and when the measurement is performed, the probe body is detected. The end of the 2 contact pad of the device to be tested, because the bypass capacitor 3 is directly connected between the probe body 2 and the conductor 13 outside the substrate 1, so that the outer conductor 13 forms a ground terminal for direct filtering through the bypass capacitor 3. In addition to guide The high frequency switching current produces AC noise at the power or ground point. In addition, the outer conductor 13 of the substrate 1 can also form an effective shielding. By controlling the thickness of the insulating material 12, the impedance of the detecting needle 2 can be lowered to achieve the purpose of decoupling.

In practice, the bypass capacitor 3 provided in the present invention may be bonded to the insulating material 12 exposed on the cut surface 10 (as shown in FIG. 2b), or the insulating material exposed on the end surface 10 of the substrate 1 The 12 series protrudes from the end surface 10 of the substrate 1, and the bypass capacitor 3 can be bonded and fixed to the insulating material 12 protruding from the end surface 10 of the substrate 1 (as shown in Fig. 2c).

Therefore, the present invention has the following advantages:

1. The invention is characterized in that a bypass capacitor is directly connected between the detecting needle body and the outer conductor of the substrate (grounding end), that is, each detecting needle body is independently provided with a bypass capacitor, so that when measuring, it is no longer subject to Limit the influence of the unevenness of the solder pads of the device to be tested or the restraint of other cantilever probes.

2. The bypass capacitor provided by the present invention is directly connected between the detecting pin body and the outer conductor of the substrate end, so that the bypass capacitor is closer to the component to be tested, thereby effectively improving the effectiveness of the bypass capacitor, and thus further Effectively filter out AC noise from power or ground.

3. The outer conductor of the substrate provided by the invention can form an effective shielding. By controlling the thickness of the insulating material, the impedance of the detecting needle body is reduced, and the purpose of decoupling is achieved.

The above is a specific embodiment of the present invention and the technical means employed, and many variations and modifications can be derived therefrom based on the disclosure or teachings herein. The function shall not be considered to be within the technical scope of the present invention, and it shall be considered in the technical scope of the present invention.

According to the above disclosure, the present invention can achieve the intended purpose of the invention, and provide a detecting device for integrated circuit testing which can effectively eliminate high frequency reflected waves or filter AC noise of a power source or a ground point. The value of industrial utilization and practicality is undoubtedly, and the invention patent application is filed according to law.

1‧‧‧Substrate

10‧‧‧faced

11‧‧‧ Inner conductor

12‧‧‧Insulation materials

13‧‧‧Outer conductor

2‧‧‧Detecting needle body

3‧‧‧ Bypass capacitor

31‧‧‧First electrode end

32‧‧‧Second electrode end

Claims (5)

A detecting device for testing an integrated circuit includes at least: a substrate which is fixed by an inner conductor through an insulating material and fixed in an outer conductor, and the inner end of the substrate is provided with an inner surface, so that the inner conductor, The insulating material is exposed on the cutting surface; a detecting needle body, one end of the detecting needle body is electrically connected to the inner conductor exposed to the cutting surface, and the detecting needle end is provided for contacting the soldering pad of the component to be tested; The circuit capacitor has a first electrode end and a second electrode end, wherein the first electrode end is electrically connected to the detecting pin body, and the second electrode end is connected to the outer conductor end of the substrate end. The detecting device for integrated circuit testing as described in claim 1, wherein the substrate is a coaxial transmission line structure. The detecting device for integrated circuit testing according to claim 1, wherein the insulating material is made of polyimide. The detecting device for integrated circuit testing according to claim 1, wherein the bypass capacitor is coupled to the insulating material exposed on the cut surface. The detecting device for the integrated circuit test according to the fourth aspect of the invention, wherein the insulating material exposed on the end surface of the substrate protrudes from the end surface of the substrate, and the bypass capacitor can be combined and fixed to the protruding portion. On the insulating material of the cut end of the substrate.