TWI651028B - Pad structure for RF testing - Google Patents

Abstract

The present invention relates to a pad structure for radio frequency testing, comprising a substrate body, wherein the substrate system is an insulating material, and an inner conductor bonding region and a first connection region are disposed on a front surface thereof, and the inner conductor bonding region and the A first insulating layer is disposed between the two regions to avoid short circuit. The back surface of the substrate body is provided with a thimble abutting area and a second connecting area, and the second connecting area and the thimble abutting area are formed. a gap to avoid short circuit, and the inner conductor soldering area and the thimble abutting area are provided with through holes which are electrically connected and can be electrically connected, so that only the inner conductor of the radio frequency coaxial cable needs to be measured when measuring the signal The outer conductor is sequentially welded to the inner conductor welding zone and the first connection area, and the thimble and the grounding portion of the signal test end are sequentially abutted to the thimble abutment area and the second connection area, so that the subsequent test procedure can be performed.

Description

Pad structure for RF testing

The invention relates to a pad structure, in particular to a pad structure which is provided with a grounding layer, an insulating layer and a welding zone, and can directly weld the RF coaxial cable and abuts the signal testing end.

According to the fact that most of today's electronic devices use wireless technology as the main way of connection and communication, and as people gradually pay attention to the quality requirements of mobile communication, in order to achieve higher quality mobile communication quality, in addition to good In addition to the design of the communication system, the design circuit of the antenna and the radio frequency (RF) component has become an extremely important part. In addition, the test of the frequency sample is also an important part, because in addition to the bandwidth of the RF component, it is required. Checking whether the radiant energy meets the standard, the quality of the RF components and their circuits is the most important.

In the past, most of the existing RF test equipments need to manually put the object to be tested (such as RF chip) into the RF test. For details, please refer to Figure 1 and test 5GHz~ In a 6 GHz RF circuit, two RF connectors are usually used. When the Equivalent signal is measured, a first RF connector R1 is connected to the coaxial cable of the RF antenna, and at the end of the line. Soldering a second RF connector R2 on the circuit board E, and then the first RF connector R1 can be connected to the second RF connector R2 to enable Continue the test procedure. However, the Applicant has found that the aforementioned RF test equipment requires additional use of two RF connectors R1 and R2, which in turn generates additional parts cost and wear. After all, the RF connectors R1 and R2 are only used for testing. In addition, the RF test equipment must reserve the space occupied by the RF connectors R1 and R2, so that the size of the RF test equipment cannot be reduced, which may cause trouble.

In summary, since RF components and their circuits affect the mobile communication quality of electronic devices, and they must also comply with various wireless technology standards, they are tested to ensure that design and manufacturing do not lead to improper operation. It is inevitable that how to improve the existing RF test equipment is an important issue for the present invention.

In order to stand out in the highly competitive market, the inventors have relied on the rich practical experience of various antenna design, processing and manufacturing for many years, and adhere to the spirit of research excellence, after long-term efforts and research, Finally, a pad structure for radio frequency testing according to the present invention has been developed, and by the advent of the present invention, a better test device for the user is provided.

An object of the present invention is to provide a pad structure for radio frequency testing, comprising a substrate body, an inner conductor bonding region, a thimble abutment region, a first connection region and a second connection region, wherein The substrate is an insulating material, and the inner conductor is welded on the front surface thereof, and the ejector abutting area is disposed on the back surface thereof. Further, the inner conductor welding area is a conductive material and has a continuous perforation, and the through hole can penetrate the The front side and the back side of the substrate body, and the hole wall is made of a conductive material, the inner conductor soldering area can be soldered by the inner conductor of a radio frequency coaxial cable, the thimble abutting area is made of a conductive material, and the through hole is provided The thimble abutting area can be abutted by the ejector pin of the signal test end, and the signal test thimble can extend into the through hole, and the first connection area is a conductive material. And disposed on the front surface of the substrate body, the first connection region and the inner conductor soldering interval are provided with a first insulating layer, so that the first connection region is not electrically connected to the inner conductor soldering region, and the first connection region The second connection area is electrically conductive and disposed on the back surface of the substrate body, and forms a gap with the thimble abutment section, so that the second connection area does not Electrically connecting with the thimble abutting area, the second connecting area can be abutted by the grounding portion of the signal testing end, so that when measuring the signal, the RF coaxial cable is soldered to the front surface of the pad structure. A subsequent test procedure can be performed by abutting the signal test end to the back of the pad structure.

For your convenience, the review committee can make a further understanding and understanding of the purpose, technical features and effects of the present invention. The embodiments are combined with the drawings, and the details are as follows:

[study]

R1‧‧‧First RF connector

R2‧‧‧second RF connector

E‧‧‧PCB

〔this invention〕

1‧‧‧Substrate body

11A‧‧‧Inner conductor welding zone

11B‧‧‧ thimble abutment area

111‧‧‧through holes

13‧‧‧First junction area

14, 14A, 14B‧‧‧ first insulation layer

15‧‧‧Second area

16‧‧‧Second insulation

17‧‧‧ Grounding Hole

2‧‧‧RF coaxial cable

21‧‧‧ Inner conductor

22‧‧‧Insulated inner layer

23‧‧‧Outer conductor

24‧‧‧Insulating outer layer

3‧‧‧ Signal test end

31‧‧‧ thimble

33‧‧‧ Grounding Department

G‧‧‧ gap

1 is a schematic view of a conventional RF test apparatus; FIG. 2A is a front view of the pad structure of the present invention; FIG. 2B is a rear view of the pad structure of the present invention; and FIG. 3 is a pad structure of the present invention; Schematic diagram of the test terminal with the signal; and Fig. 4 is a schematic view of the pad structure and the RF coaxial cable of the present invention.

The present invention is a pad structure for radio frequency testing. In practical use, the pad structure can be completed by a printed circuit board, which not only improves manufacturing convenience, but also can effectively reduce cost. Referring to FIGS. 2A and 2B , in an embodiment, the pad structure includes a substrate body 1 , and the substrate body 1 is made of an insulating material, wherein the substrate body 1 is positive. The inner surface of the surface of the substrate body 1 (ie, FIG. Correspondingly, and having a uniform through hole 111, the through hole 111 can penetrate the front and back surfaces of the substrate body 1 (as shown in FIG. 3), and the inner conductor bonding portion 11A and the thimble abutting region 11B are The wall of the through hole 111 is made of a conductive material (such as copper), so that the inner conductor bonding portion 11A and the thimble abutting portion 11B can form an electrical connection as a conduction path for the test signal or electric power.

Referring to FIGS. 2A and 3, a first connection region 13 is disposed on the front surface of the substrate body 1. The first connection region 13 is also made of a conductive material (eg, copper), and is soldered to the inner conductor. At least one first insulating layer 14 is disposed between the regions 11A to prevent the first connection region 13 from being electrically connected to the inner conductor bonding region 11A by the isolation of the first insulating layer 14. In this embodiment, the substrate body 1 is provided with two first insulating layers 14A, 14B to completely separate the first connection region 13 and the inner conductor bonding region 11A, thereby avoiding the occurrence of a short circuit and affecting subsequent tests. As a result, the first insulating layers 14A, 14B can be solder resist inks, so that the first one can be directly applied to the substrate body 1 (such as the first insulating layer 14A in FIG. 3), or partially covered in the first layer. In the other area of the present invention, the number of the first insulating layer 14 and the position of the first insulating layer 14 can be adjusted according to actual needs. With material. In addition, as shown in FIG. 2B , a second connection region 15 is disposed on the back surface of the substrate body 1 , and the second connection region 15 is also a conductive material (eg, copper), and the ejector pin abuts the region. A gap G is formed between the 11Bs, and the bottom surface of the gap G is the substrate body 1 (as shown in FIG. 3), so that the second connection region 15 is not electrically connected to the thimble abutment region 11B to avoid occurrence. Short circuit.

Referring to FIG. 4, a front surface of the pad structure can be soldered with a coaxial cable (coaxial cable) 2. Generally speaking, the basic structure of the RF coaxial cable 2 is sequentially from the inside to the outside. An inner conductor 21, an insulating inner layer 22, a outer conductor (Copper Braid Shield) 23 and an outer insulating layer (Jacket) 24, wherein the inner conductor 21 of the radio frequency coaxial cable 2 can be soldered to the inner conductor The outer conductor 23 of the radio frequency coaxial cable 2 can be soldered to the first connection region 13 on the soldering region 11A, and the first contact region 13 and the inner conductor bonding region 11A are disposed between the first conductor region 13 and the inner conductor bonding region 11A. The first insulating layer 14 and the insulating inner layer 22 are also disposed between the inner conductor 21 and the outer conductor 23 of the radio frequency coaxial cable 2, so that when the radio frequency coaxial cable 2 is fixed to the pad structure When the inner conductor 21 has a long length beyond the inner conductor land 11A, it can only contact the first insulating layer 14, or when the inner conductor 21 has a shorter length than the inner conductor land 11A, The inner conductive layer 11A is contacted by the inner insulating layer 22, and similarly, when the outer conductor 23 has a long length and extends beyond the first contact region 13, it can only contact the first insulating layer 14, or The outer conductor 23 has a short length, and is smaller than the first connection region 13 when it is connected by the insulating inner layer 22. The first contact region 13 is touched. Therefore, by the insulation design of the first insulating layer 14 and the insulating inner layer 22, short-circuiting between the inner conductor 21 and the outer conductor 23 can be effectively avoided to prevent abnormal test results.

As shown in FIGS. 3 and 4, when the signal is measured, the ejector pin 31 of the signal test end 3 can be abutted against the thimble abutment region 11B, and the ejector pin 31 can extend into the through hole. The hole 111 is such that the pedestal 31 and the inner conductor 21 can form an electrical connection, and the grounding portion 33 of the signal test end 3 can abut against the second connection region 15 such that the ground portion 33 and the outer conductor 23 The two can form an electrical connection. Since the gap G is provided between the second contact region 15 and the thimble abutment region 11B, short-circuiting between the thimble 31 and the ground portion 33 can be avoided. In addition, as shown in FIG. 2B and FIG. 3, in this embodiment, the area of the second connection region 15 disposed on the back surface of the substrate body 1 is large, so that the signal test terminal 3 or other devices are accidentally touched. The second connection region 15 further affects the test result, and the partial surface of the second connection region 15 can still cover a second insulation layer 16 so that the second connection region 15 The exposed area can be controlled to a predetermined size (as shown in FIG. 2B). However, in other embodiments of the present invention, the structure of the second insulating layer 16 can also be designed as the first insulating layer 14. Generally, it is directly coated on the substrate body 1; in particular, since the front surface of the substrate body 1 needs to be soldered to the RF coaxial cable 2, if the gap is adopted, the first insulation is not provided. The layers 14A and 14B are liable to be short-circuited between the inner conductor bonding region 11A and the first connection region 13 due to foreign matter or solder, so that the melted solder or foreign matter is likely to accumulate in the gap. Conversely, the back surface of the substrate body 1 is only The signal test terminal 3 is abutted, and the foregoing does not occur. However, in other embodiments of the present invention, the second insulating layer 16 (equivalent to the first insulating layer 14A) can also be disposed in each of the gaps G to enable The second connection area 15 and the thimble abutment area 11B are isolated, and the first is Chen Ming.

In summary, as shown in Figures 2A to 4, by the overall technical features of the present invention, the following effects can be achieved: (1) The manufacturer does not need to use a RF connector for testing, as long as the RF is used. The coaxial cable 2 is soldered to the pad structure, and the signal test end 3 is abutted to the pad structure, so that the test can be performed, thereby effectively reducing the component cost (ie, the two RF connectors) and the parts; (2) The manufacturer can directly apply the pad structure of the present invention to the printed circuit board, so that the RF coaxial cable 2 can be directly soldered to the front surface of the printed circuit board, and the signal test end 3 can abut against the back surface of the printed circuit board, thereby improving The convenience of use, and can reduce the space occupied by the test equipment (the conventional method needs to add the volume and height of two RF connectors); and (3) due to the inner conductor weld zone 11A and the thimble abutment zone Both of the 11B are connected by the through hole 111, so that the signal loss during the test can be minimized.

In this embodiment, as shown in FIG. 3, at least one grounding hole 17 is disposed between the first grounding region 13 and the second grounding region 15, and each of the grounding holes 17 can be respectively connected. The first connection region 13 and the second connection region 15 , and the hole walls of each of the ground holes 17 are electrically conductive materials, so that the first connection region 13 and the second connection region 15 can form an electrical connection to conduct electricity to each other. Thus, by designing the grounding hole 17, the grounding of the first connection region 13 and the second connection region 15 can be more complete and consistent, and the signal loss during testing can be minimized.

The above is only the preferred embodiment of the present invention, but the scope of the claims of the present invention is not limited thereto, and according to those skilled in the art, according to the technical content disclosed in the present invention, Equivalent changes that are easily considered are within the scope of protection of the invention.

Claims (5)

A solder pad structure for RF testing, comprising: a substrate body, which is an insulating material; an inner conductor soldering region, which is made of a conductive material, and is disposed to a front surface of the substrate body, and is provided with a permanent through hole, the through hole The inner wall and the back surface of the substrate body can be penetrated, and the hole wall is made of a conductive material, and the inner conductor soldering area can be welded by the inner conductor of the radio frequency coaxial cable; the thimble abutting area is made of a conductive material, and Disposed to the back surface of the substrate body, the through hole is provided, the thimble abutting area can be abutted by the ejector pin of the signal test end, and the ejector pin of the signal test end can extend into the through hole; a conductive material disposed on the front surface of the substrate body, the first connection region and the inner conductor soldering portion are provided with at least one first insulating layer, such that the first connection region does not intersect with the inner conductor soldering region Electrically connected, the first connection area can be soldered by the outer conductor of the RF coaxial cable; and a second connection area is made of a conductive material and disposed on the back surface of the substrate body, and the ejector pin abuts Into a gap, such that the second ground region do not abut against the connection region with the electrically thimble, the second portion of the grounding regions can be grounded signal against which the test terminal. The pad structure of claim 1, wherein at least one grounding hole is disposed between the first connection area and the second connection area, and each of the grounding holes can respectively connect the first connection area and the second Connected to the area, and the wall of each of the grounding holes is made of a conductive material. The pad structure of claim 1 or 2, wherein a partial surface of the second region is covered with a second insulating layer. The pad structure of claim 1 or 2, wherein the back surface of the substrate body is covered with a second insulating layer. The pad structure of claim 1 or 2, wherein the back side of the substrate body corresponds to each of the pads The position of the gap is covered by a second insulating layer.