TWI564568B - Use a coaxial pin with a cantilever probe card - Google Patents

Description

Cantilever probe card using coaxial pin

The present invention relates to probe cards, and more particularly to a cantilever probe card using a coaxial needle.

Please refer to the patent of the Japanese Patent No. I279548. The cantilever probe card provided by the patent mainly comprises a circuit board, a fixing base fixed to the bottom surface of the circuit board, and a plurality of probes fixed to the fixing base. The cantilever probe card uses coaxial pins, that is, each of the probes includes an electrically conductive core, an insulator disposed on the periphery of the core, and an electrical conductor disposed on the periphery of the insulator. Each of the probes extends obliquely from the fixing base to the bottom surface of the circuit board, and one end of the core and one end of the conductor are respectively soldered to a signal contact and a ground contact on the bottom surface of the circuit board; The needle core can protrude from the other end of the fixing base to touch the object to be tested to transmit the detection signal to the object to be tested, and further, the conductor can generate impedance matching and shielding interference to the needle core. The effect, so the probe card can be applied to high frequency testing.

However, in the aforementioned patent, the insulator and the conductor of each of the probes do not cover the portion of the core that is connected to the circuit board to expose the portion, so that the core and the conductor are respectively soldered to The signal contact and the ground contact on the bottom of the board, but the effect of the probe impedance matching is discontinuous and the interference is also affected. Due to the increasing frequency performance of the probe card, the aforementioned probe card can meet the needs of the industry at this stage, but there is still room for improvement.

Please refer to the patent of US Pat. No. 8,115,107, which provides a connection structure of a coaxial signal line and a circuit board, comprising a circuit board, a fixing base fixed to the grounding contact of the circuit board, and one end located at the same. a coaxial signal line in the fixed seat and connected to the signal contact of the circuit board, so as to shield the portion of the coaxial signal line connected to the signal contact of the circuit board by using the fixed seat. However, the technology provided by the patent is directed to a coaxial signal line and is disposed on a surface of the circuit board facing the test machine, and is difficult to be applied to a probe structure disposed on a surface of the circuit board to be tested as described above. In particular, the fixed seat is in a non-complete sleeve shape, so In order to solder the core of the coaxial signal line to the signal contact of the circuit board, after the wire core is soldered, the other fixed seat and the original fixed seat need to be spliced together to completely shield the coaxial signal line and The signal is connected to the portion of the board, but the probe on the probe card is set in a relatively dense manner. Therefore, the connection structure of the aforementioned patent is applied to the connection structure between the probe of the probe card and the circuit board. Row.

In view of the above-mentioned deficiencies, the main object of the present invention is to provide a cantilever probe card using a coaxial pin, which is capable of providing good impedance matching and shielding in a portion where the pin of the coaxial pin is connected to the circuit board in a relatively simple and effective manner. The effect of interference.

In order to achieve the above object, a cantilever probe card using a coaxial pin provided by the present invention comprises a circuit board, a fixing base and a probe, the circuit board having a lower surface and a signal contact on the lower surface and a grounding contact, the fixing seat is located below the lower surface of the circuit board, the probe comprises a core, and an impedance matching structure disposed on the periphery of the core, the impedance matching structure comprises a core disposed on the core a peripheral insulator, and an electrical conductor disposed on a periphery of the insulator, the probe is fixed to the fixing base, the core has a connecting end contacting the signal contact, and the core has a relative to the The inclined surface of the lower surface of the circuit board is inclined, and the impedance matching structure extends from the fixing base to the signal contact and the ground contact, and the connection end of the core is subjected to the impedance matching structure and the circuit board The coating is not exposed, and the conductive system is electrically connected to the ground contact. Thereby, since the impedance matching structure extends to the signal contact, a good impedance matching and shielding interference effect can be produced for the portion of the core that is in contact with the signal contact.

In an embodiment of the present invention, the impedance matching structure of the probe includes a main section fixed to the core, and a compensation cover, the inclined section of the core has the connection end, and the connection end Projecting the main section and extending to and soldering to the signal contact, the compensation cover is fixed to one end of the main section and covers the connection end. Thereby, the connecting end of the core can be welded or fixed to the signal contact by the silver glue when the compensation cover is not set, and then the compensation cover is fixed to the main section and covers the connection end. Therefore, the compensation cover is used to produce a good impedance matching and shielding interference effect on the connection end portion of the core.

In addition, the compensation cover may be fixed to another ground contact of the circuit board in addition to the main section, or the ground contact fixed by the electrical conductor may be annular and surround. The signal receiving contact can also be fixed to the grounding contact with the electrical conductor. Thereby, the compensation cover can be set to be more stable.

In another embodiment of the present invention, the connecting end of the probe core is connected to one end of the inclined section, and the connecting end is in contact with the signal contact on the lower surface of the probe card and substantially The insulator and the conductive system extend integrally from the holder to the signal contact and the ground contact, respectively, perpendicular to the lower surface. In other words, the section where the probe is connected to the circuit board is perpendicular to the lower surface of the circuit board, and the section is also provided with an insulator and a conductor to produce good impedance matching and shielding interference effects. Thereby, the probe core of the probe is not soldered or fixed to the signal contact by silver glue, as long as the conductor is soldered or adhered to the circuit board, so that the core is abutted to the signal contact. Yes, the installation method is quite simple.

Preferably, an insulating film is disposed between the probe and the signal contact, and the connecting end of the core passes through the insulating film to be in contact with the signal contact. Thereby, the insulating film can prevent the solder or silver glue used when the electrical conductor is fixed on the circuit board, and the silver glue flows to the signal contact, so as to prevent the signal contact and the ground contact from contacting the solder or the silver glue at the same time. And short circuit.

Preferably, the signal contact is a signal blind hole having an impedance matching function, and the connection end of the probe core is inserted into the signal blind hole, so that the contact area between the core and the signal contact is made. Larger and more positively electrically conductive to each other.

Preferably, the ground contact is annular and surrounds the signal contact, and the conductive system is fixed to the ground contact, so that the probe is more stably connected to the circuit board.

Preferably, the cantilever probe card using the coaxial pin of the present invention further includes a conductive sleeve fixed to the circuit board and electrically connected to the ground contact, the probe is inserted into the a conductive sleeve, and the conductive system is in contact with the conductive sleeve. Therefore, the plurality of conductive sleeves can be fixed on the circuit board, and then the probes can be inserted one by one, so as to avoid welding or sticking the probes when the probes are densely arranged on the circuit board. Connected to the board, so it is quite convenient to install. More preferably, the grounding contact is annular and surrounds the signal contact, and the conductive sleeve is fixed to the grounding contact, so that the conductive sleeve is set to be more stable, thereby enabling the probe and the probe The board is connected more securely.

In another embodiment of the present invention, the signal contact and the ground contact are respectively an inner hole and a hole surrounding the inner hole, and a conductive layer is respectively disposed in the inner hole and the outer hole. The needle core of the probe is inserted into the inner hole and is in contact with the conductive layer of the inner hole, and the impedance is The matching structure is inserted into the outer hole, and the conductive system is in contact with the conductive layer of the outer hole. This makes the probe setup easier.

The detailed construction, features, assembly or use of the cantilevered probe card using the coaxial needle provided by the present invention will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

11~18‧‧‧Cantilever probe card

182‧‧‧through hole

184‧‧‧ probe

20‧‧‧ boards

21‧‧‧ Lower surface

22‧‧‧Signal contacts

222‧‧‧ Signal blind hole

23, 24‧‧‧ Grounding contacts

26‧‧‧ upper surface

27‧‧‧Signal contacts

28‧‧‧ Grounding contacts

30‧‧‧ Fixed seat

40‧‧‧ probe

41‧‧‧ needle core

412‧‧‧Sloping section

412a‧‧‧Connected end

414‧‧‧ Touch section

416‧‧‧Connected end

42‧‧‧ impedance matching structure

43‧‧‧Insulator

44‧‧‧Electrical conductor

45‧‧‧ gap

46‧‧‧Main section

462‧‧‧Insulation

464‧‧‧Electrical Department

47‧‧‧Compensation cover

472‧‧‧Insulation

474‧‧‧Electrical Department

50‧‧‧Insulation film

60‧‧‧Electrical casing

70‧‧‧ boards

71‧‧‧ lower surface

72‧‧‧ Signal contact (inner hole)

722‧‧‧ Conductive layer

74‧‧‧Grounding joint (outer hole)

742‧‧‧ Conductive layer

81‧‧‧Intermediary board

812‧‧‧through hole

82‧‧‧Substrate

1 is a cross-sectional view of a cantilever probe card using a coaxial needle according to a first preferred embodiment of the present invention; FIG. 2 is an enlarged view of a portion A of FIG. 1; 1 is a view showing the appearance of a probe of a cantilever type probe card using a coaxial needle according to the first preferred embodiment of the present invention; FIG. 4 is a view showing the use of a second preferred embodiment of the present invention; FIG. 5 is a cross-sectional view of a cantilevered probe card using a coaxial needle according to a third preferred embodiment of the present invention; FIG. 6 is a schematic view of the present invention; A cross-sectional view of a cantilever probe card using a coaxial needle according to a fourth preferred embodiment; and FIG. 7 is a cross-sectional view of a cantilever probe card using a coaxial needle according to a fifth preferred embodiment of the present invention; FIG. 8 is a cross-sectional view of a cantilever probe card using a coaxial needle according to a sixth preferred embodiment of the present invention; FIG. 9 is a view of a seventh preferred embodiment of the present invention. Cantilever probe for coaxial needle FIG. 10 is a cross-sectional view showing a cantilever type probe card using a coaxial needle according to the seventh preferred embodiment of the present invention; and FIG. 11 is an eighth preferred embodiment of the present invention. A schematic cross-sectional view of a cantilevered probe card using a coaxial needle is provided; and Fig. 12 is an enlarged view of a portion B of Fig. 11.

The Applicant first describes the same or similar elements or structural features thereof in the embodiments and the drawings which will be described below. In the following, when an element is disposed on another element, it means that the element is directly disposed on the other element, or the element is indirectly disposed on the other element, that is, between the two elements. Set up one or more other components. When a component is referred to as being "directly" on another component, no other component is provided between the two components. In addition, the interrelationship of the various elements is only schematically shown in the accompanying drawings, and does not represent the true dimensions and spatial relationships of the various elements.

Referring to FIG. 1 to FIG. 3, a cantilever probe card 11 using a coaxial pin according to a first preferred embodiment of the present invention includes a circuit board 20 disposed on a lower surface 21 of the circuit board 20. The fixing base 30 and a probe 40 fixed to the circuit board 20 and the fixing base 30. In fact, in the embodiment and the embodiments described below, the circuit board 20 and the fixing base 30 are annular (but not limited thereto), and the probe card has a plurality of probes 40. The probes 40 may be disposed around the center of the circuit board 20, or may be arranged differently according to different usage requirements. The drawings of the present invention only show one part of the circuit board 20 and the fixing base 30, and only A probe 40 is shown for further explanation.

The circuit board 20 is the same as the circuit board of the conventional probe card, and has a plurality of signal contacts and a plurality of ground contacts (not shown) on the upper surface thereof, and the signal contacts are used to receive a test machine. The test signal provided (not shown); the lower surface 21 of the circuit board 20 is also provided with a plurality of signal contacts and a plurality of ground contacts. Only one of the signal contacts 22 and the two ground contacts 23 are shown in the figure. , 24, for explanation. The ground contacts on the upper and lower surfaces of the circuit board 20 are electrically connected to each other. For example, the ground contacts can pass through a ground layer or a ground line in the circuit board 20 (Fig. The signal contacts on the lower surface 21 of the circuit board 20 are respectively connected to the circuit board by internal wiring of the circuit board 20 or external wires (not shown). The signal connection of the upper surface of the 20 is electrically connected to indirectly receive the test signal provided by the test machine, and then the test signal is transmitted to the probe 40.

The probe 40 is a coaxial pin comprising a core 41 made of a conductive material (for example, copper), and an impedance matching structure 42 disposed on the periphery of the core 41. The impedance matching structure 42 includes a An insulator 43 on the periphery of the core 41 and an electric conductor 44 disposed on the periphery of the insulator 43. In this embodiment, the gap between the core 41 and the insulator 43 is a gap 45 (as shown in FIG. 2). The core 41 and the insulator 43 can be provided with at least one support. A collar (not shown) is provided to maintain the gap 45; in addition, the outer surface of the core 41 may be, but not limited to, further provided with an insulating sleeve (not shown). Alternatively, the insulator 43 may be directly disposed on the outer surface of the core 41, that is, the gap between the core 41 and the insulator 43 may be absent. Alternatively, the probe 40 can also be a coaxial needle of other aspects, such as the various coaxial needles provided by the patent of the Japanese Patent No. I279548.

In the present embodiment, the core 41 of the probe 40 includes a non-vertical one inclined section 412 and a point contact 414. The impedance matching structure 42 includes a main section 46 and a compensation cover 47. The segment 46 and the compensation cover 47 respectively have an insulating portion 462, 472 located at the periphery of the core 41 and a conductive portion 464, 474 located at the periphery of the insulating portion 462, 472. The main portion 46 and the compensation cover 47 The insulating portions 462, 472 collectively form the insulator 43 of the impedance matching structure 42, which together with the conductive portions 464, 474 of the compensation cover 47 constitute the electrical conductor 44 of the impedance matching structure 42. In fact, when the probe 40 is not fixed to the circuit board 20, only the main section 46 covers the core 41, and the compensation cover 47 is not yet provided. At this time, the structure and the structure of the probe 40 are conventional. The coaxial pin of the cantilever probe card is the same.

The portion of the probe 40 that is adjacent to the contact portion 414 is fixed to the fixing base 30. The portion of the conductor 44 at one end of the main portion 46 is soldered or fixed to the grounding contact 23 by silver glue and The grounding contact point 412 is electrically connected to the signal contact point 22 and is fixed to the signal contact 22 by a silver glue and electrically connected to the signal contact 22 . The upper surface 21 of the circuit board 20 is inclined, and the inclined section 412 has a connecting end 412a protruding from the main section 46 of the impedance matching structure 42 and extending to the signal contact 22. Then, the compensation cover 47 is soldered or fixed to one end of the main section 46 by silver glue and covered. The connecting end portion 412a is covered, and more specifically, the compensating cover 47 and the conductive portions 474, 464 of the main portion 46 are welded to each other or fixed to each other by silver glue and electrically connected to each other. After the compensation cover 47 is set, the probe 40 does not reveal the connection end portion 412a at all, as shown in FIG. In this way, the impedance matching structure 42 extends from the fixing base 30 to the signal contact 22 and the grounding contact 23, and the connecting end portion 412a of the core 41 is received by the impedance matching structure 42 and the circuit board 20. Covered without being exposed. The impedance matching structure of the conventional coaxial pin extends only to the ground contact 23, so that the connection end portion 412a is exposed to cause impedance matching discontinuity and poor shielding interference effect, and the impedance of the embodiment is compared. The matching structure 42 covers the connecting end portion 412a by the compensation cover 47, so that good impedance matching and shielding interference effects can be produced.

In this embodiment, the two grounding contacts 23 and 24 are respectively disposed on opposite sides of the signal contact 22, and the compensation cover 47 can be simultaneously fixed to the grounding connection when being fixed to the main section 46. Point 23, and may also be fixed to the ground contact 24, so that the compensation cover 47 is set to be relatively stable. Alternatively, the grounding contact 23 to which the conductive portion 464 of the main section 46 is connected may also be annular and surround the signal contact 22, in which case the cross-sectional view is also as shown in Figures 1 and 2, but in the figure The ground contact 24, which appears to be separated from the ground contact 23, is actually a part of the ground contact 23, such that the compensation cover 47 can be more securely fixed to the ground contact 23. The ring-shaped ground contact in the present invention is not limited to a circular ring, as long as it is a closed shape that can surround the signal contact.

Referring to FIG. 4, a cantilever probe card 12 using a coaxial needle according to a second preferred embodiment of the present invention is similar to the cantilever probe card 11 of the first preferred embodiment described above, but only The portion of the probe 40 of the embodiment that is coupled to the circuit board 20 is different from the first preferred embodiment. In detail, the connecting end portion 416 of the core 41 of the probe 40 of the present embodiment is integrally connected to one end of the inclined portion 412, and the insulator 43 and the electric conductor 44 of the impedance matching structure 42 are not respectively The portions are integrally joined, but extend integrally from the inclined portion 412 to the connecting end portion 416 and are flush with the end of the connecting end portion 416, and the inclined portion 412 and the connecting end portion 416 have an angle therebetween, and further In other words, it is an angle greater than 90 degrees. When the probe 40 is fixed to the circuit board 20, the connecting end portion 416 of the core 41 is in contact with the signal contact 22 and substantially perpendicular to the lower surface 21, and the electrical conductor 44 of the impedance matching structure 42 is Soldering or fixing to the ground contacts 23, 24 of the circuit board 20 by silver glue, such that the connecting end portion 416 of the core 41 is covered by the impedance matching structure 42 and the circuit board 20 Exposed. As mentioned earlier, in Figure 4 The two ground contacts 23, 24, which appear to be separated from each other, may also be two portions that are annular and surround the ground contacts of the signal contacts 22, thereby allowing the probe 40 to be more securely attached to the circuit board 20.

In this way, the insulator 43 and the conductor 44 of the impedance matching structure 42 extend integrally from the fixing base 30 to the signal contact 22 and the ground contacts 23 and 24 of the lower surface 21 of the circuit board 20, so the probe The section where the pin 40 is connected to the circuit board 20 can provide good impedance matching and shielding interference by providing the insulator 43 and the conductor 44. Moreover, the core 41 of the probe 40 is not soldered or fixed to the signal contact 22 by silver glue, as long as the conductor 44 is soldered or bonded to the ground contacts 23, 24, and the core is simultaneously made. 41 can be connected to the signal contact 22, and the installation method is quite simple.

Referring to FIG. 5, a cantilever probe card 13 using a coaxial needle according to a third preferred embodiment of the present invention is similar to the cantilever probe card 12 of the second preferred embodiment described above, but only example 40 and signal probe contacts with a further embodiment of the insulating film 50 between 22, such as Mylar film (Mylar ^® film) or polyethylene terephthalate, polyethylene terephthalate film. The end of the connecting end 416 of the core 41 protrudes from the impedance matching structure 42 and passes through the insulating film 50 to be in contact with the signal contact 22. In this way, when the conductor 44 is soldered or bonded to the ground contacts 23, 24 of the circuit board 20, the insulating film 50 can prevent solder or silver glue from flowing to the signal contact 22 to avoid the signal. Contact 22 and ground contacts 23, 24 are shorted by simultaneous contact with solder or silver paste.

Referring to FIG. 6, a cantilever probe card 14 using a coaxial needle according to a fourth preferred embodiment of the present invention is similar to the cantilever probe card 13 of the third preferred embodiment described above, but only The probe card 14 of the embodiment further includes a conductive sleeve 60, and the probe mounting manner of the embodiment is slightly different from that of the third preferred embodiment. In addition, the conductive sleeve 60 and the probe mounting method of the present embodiment can also be applied to the case where the insulating film 50 is not provided as in the second preferred embodiment.

In detail, the conductive sleeve 60 is soldered or fixed to the ground contacts 23, 24 of the circuit board 20 by silver glue and electrically connected to the ground contacts 23, 24; The ground contacts 23, 24 in the figure may be two ground contacts that are separated from each other, or may be two portions that are annular and surround the ground contacts of the signal contacts 22. Then, the probe 40 is inserted into the conductive sleeve 60 to be relatively fixed to the circuit board 20, and the end of the core 41 is electrically connected to the signal contact 22, and the impedance is electrically connected. The conductors 44 of the matching structure 42 are electrically connected to the conductive sleeve 60; in other words, the probe 40 only needs to be inserted into the conductive sleeve. Tube 60, without the need for soldering or fixing with silver glue.

Therefore, before the probe 40 is mounted, the lower surface 21 of the circuit board 20 can be fixed with a plurality of conductive sleeves 60, and then the probes 40 can be installed by inserting the conductive sleeves 60 one by one, thus avoiding the circuit. The problem of difficulty in soldering or fixing the probe 40 by silver glue on the board 20, especially in the case where the probe 40 is placed in a relatively dense manner, is therefore quite convenient in the mounting of the probe. Moreover, in the case where the conductive sleeve 60 is fixed to the ground contact of the ring, the conductive sleeve 60 can be arranged to be more stable, thereby further connecting the probe 40 and the circuit board 20 to be more stable.

Referring to FIG. 7, a cantilever probe card 15 using a coaxial pin according to a fifth preferred embodiment of the present invention is similar to the cantilever probe card 12 of the second preferred embodiment described above, but only The signal contact 22 of the embodiment is a signal blind hole 222 having an impedance matching function, that is, the hole wall of the signal blind hole 222 is provided with a conductive layer for transmitting a detection signal, and the ground contact 23, There is a specific distance between 24 to produce a good impedance matching function. The end of the connecting end 416 of the core 41 protrudes from the impedance matching structure 42 and is inserted into the signal blind hole 222. Thereby, the core 41 and the signal contact 22 can be electrically connected to each other more reliably due to the large contact area.

Referring to FIG. 8, a cantilever probe card 16 using a coaxial needle according to a sixth preferred embodiment of the present invention is similar to the cantilever probe card 15 of the fifth preferred embodiment described above, but only The probe card 16 of the embodiment further includes a conductive sleeve 60 as described in the fourth preferred embodiment, and adopts a probe mounting method as described in the fourth preferred embodiment, that is, the conductive sleeve The tube 60 is first soldered or fixed to the ground contacts 23, 24 of the circuit board 20 by silver glue, and the probe 40 is reinserted into the conductive sleeve 60. In this way, the probe 40 of the embodiment can be electrically connected to the signal contact 22 in addition to the core 41, and has the advantage of convenient installation.

Referring to FIG. 9 and FIG. 10, a cantilever type probe card 17 using a coaxial needle according to a seventh preferred embodiment of the present invention adopts a probe 40 similar to the foregoing fifth preferred embodiment. The end of the connecting end 416 of the core 41 protrudes from the impedance matching structure 42. However, the lower surface 71 of the circuit board 70 of the embodiment is provided with an inner hole 72 and a hole 74 surrounding the inner hole 72, and A conductive layer 722, 742 is disposed in the inner hole 72 and the outer hole 74. The inner hole 72 and the outer hole 74 are respectively a signal contact and a ground contact of the circuit board 70. The core 41 is inserted into the inner hole 72 and is in contact with the conductive layer 722 of the inner hole 72 to be electrically connected to each other. The anti-matching structure 42 is inserted into the outer hole 74, and the electric conductor 44 is in contact with the conductive layer 742 of the outer hole 74 and electrically connected to each other to be grounded. In this way, the probe 40 is fixed to the circuit board 70 without soldering or by silver glue, and the probe 41 and the impedance matching structure 42 can be inserted into the inner and outer holes 72, 74. The pin 40 is fixed to the circuit board 70, and at the same time, the pin 41 and the conductor 44 of the impedance matching structure 42 are electrically connected to the signal contact 72 and the ground contact 74, so that the probe can be arranged more. Simple.

The present invention can also be applied to an image sensing element such as a CIS (CMOS image sensor) or a probe card for testing other optoelectronic components, such as the eighth preferred embodiment of the present invention shown in FIGS. 11 and 12. A cantilevered probe card 18 is provided. The lower surface 21 of the circuit board 20 of the probe card 18 is further provided with an interposer 81 and a substrate 82. The bottom of the substrate 82 is provided with a fixing similar to that described above for fixing the probe 40. The holder 30, in other words, the holder 30 is indirectly disposed on the lower surface 21 of the circuit board 20 via the substrate 82 and the interposer 81. The probe card 18 has a through hole 182 extending through the circuit board 20, the interposer 81 and the substrate 82 for an optical lens (not shown) to be disposed in the through hole 182. Therefore, when the probe card 18 performs spot measurement on the object to be tested, light can be transmitted through the optical lens to the object to be measured to measure whether the signal of the object receiving the light source is problematic.

In the present embodiment, the circuit board 20 and the probe 40 are similar to the fifth preferred embodiment described above, and the probe card 18 is further provided with a conventional high frequency probe 184 for transmitting high frequency. The high-frequency probe of the signal (for details, please refer to the patent of the Japanese Patent Publication No. 201428300), or the probe card 18 can also be provided with a conventional probe for transmitting medium and low frequency signals or for connecting. The power or ground is used, and the probe 40 is also used to transmit high frequency signals. When the probe card 18 is assembled, the conductive sleeve 60 is first soldered or fixed to the ground contacts 23, 24 of the lower surface 21 of the circuit board 20 by silver glue, and the interposer 81 is disposed on the circuit board. The lower surface 21 is 20 and the interposer 81 has a through hole 812 for the conductive sleeve 60 to be disposed therein. In addition, the probes 40 and 184 are first fixed to the fixing base 30, and the fixing base 30 is disposed at the bottom of the substrate 82, and the probes 40 and 184 are passed through the substrate 82 to be convex from the top thereof. The substrate is disposed on the bottom of the interposer 81. The probe 40 is disposed in the through hole 812 and is inserted into the signal blind hole 222 by the core 41 and the impedance matching structure 42 respectively. The conductive sleeve 60 is electrically connected to the circuit board 20 through the interposer 81 and the signal contact 27 and the ground contact 28 of the upper surface 26 of the circuit board 20. The circuit boards and probes of other embodiments described above may also be of a class Similar to the structure and assembly method of the present embodiment, it is applied to such a probe card provided with an optical lens for testing a photovoltaic element.

Finally, it is to be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention, and alternative or variations of other equivalent elements should also be the scope of the patent application of the present application. Covered.

11‧‧‧Cantilever probe card

20‧‧‧ boards

21‧‧‧ Lower surface

22‧‧‧Signal contacts

23, 24‧‧‧ Grounding contacts

30‧‧‧ Fixed seat

40‧‧‧ probe

41‧‧‧ needle core

412‧‧‧Sloping section

412a‧‧‧Connected end

414‧‧‧ Touch section

42‧‧‧ impedance matching structure

43‧‧‧Insulator

44‧‧‧Electrical conductor

46‧‧‧Main section

462‧‧‧Insulation

464‧‧‧Electrical Department

47‧‧‧Compensation cover

472‧‧‧Insulation

474‧‧‧Electrical Department

Claims (12)

A cantilever type probe card using a coaxial pin, comprising: a circuit board having a lower surface and a signal contact and a ground contact on the lower surface; a fixed seat located on a lower surface of the circuit board a probe comprising a core and an impedance matching structure disposed on a periphery of the core, the impedance matching structure comprising an insulator disposed on a periphery of the core, and an electrical conductor disposed on a periphery of the insulator The probe is fixed to the fixing base, the needle core has a connecting end contacting the signal contact, and the magnetic core has an inclined section inclined with respect to a lower surface of the circuit board, the impedance The matching structure extends from the fixing base to the signal contact and the grounding contact, and the connecting end of the core is covered by the impedance matching structure and is not exposed, and the conductive system is connected to the ground Electrical connection. The cantilever type probe card using the coaxial needle according to claim 1, wherein the impedance matching structure of the probe comprises a main section fixed to the core, and a compensation cover, the inclination of the core The segment has the connecting end protruding from the main section and extending to and soldered to the signal contact, the compensating cover being fixed to one end of the main section and covering the connecting end. A cantilever type probe card using a coaxial pin according to claim 2, wherein the compensation cover is fixed to another ground contact of the circuit board. The cantilever probe card using a coaxial pin according to the second aspect of the invention, wherein the ground contact is annular and surrounds the signal contact, and the compensation cover is fixed to the ground contact. The cantilever type probe card using the coaxial needle according to claim 1, wherein the connecting end of the probe core is connected to one end of the inclined section, and the connecting end is in contact with the probe card. The signal contact of the lower surface is substantially perpendicular to the lower surface, and the insulator and the conductive system extend integrally from the fixing seat to the signal contact and the ground contact, respectively. The cantilever type probe card using the coaxial needle according to claim 5, wherein an insulating film is disposed between the probe and the signal contact, and the connecting end of the core passes through the insulating film. Contact the signal contact. The cantilever probe card using the coaxial pin according to claim 5, wherein the signal contact is a signal blind hole, and the connection end of the probe core is inserted into the signal blind hole. The cantilever type probe card using a coaxial pin according to any one of claims 5 to 7, wherein the ground contact is annular and surrounds the signal contact, and the conductive system is fixed to the ground contact . The cantilever type probe card using the coaxial needle according to any one of claims 5 to 7, further comprising a conductive sleeve fixed to the circuit board and electrically connected to the ground contact The probe is inserted into the conductive sleeve, and the conductive system is in contact with the conductive sleeve. The cantilever probe card using a coaxial pin according to claim 9, wherein the ground contact is annular and surrounds the signal contact, and the conductive sleeve is fixed to the ground contact. The cantilever probe card using the coaxial pin according to the first aspect of the invention, wherein the signal contact and the ground contact are respectively an inner hole and a hole surrounding the inner hole, and the inner hole and A conductive layer is respectively disposed in the outer hole. The needle core of the probe is inserted into the inner hole and is in contact with the conductive layer of the inner hole. The impedance matching structure is inserted into the outer hole, and the conductive system is in contact with the conductive layer of the outer hole. The cantilever type probe card using the coaxial needle according to the first aspect of the invention, wherein an interposer is disposed between the lower surface of the circuit board and the fixing base, and the probe is disposed on the interposer. The probe card has a through hole extending through the circuit board and the interposer for providing an optical lens in the through hole.