TWI652482B - Probe module and probe card - Google Patents

Abstract

A probe card for detecting an object to be tested includes: a circuit board provided with a plurality of lines; a probe module including at least one probe, a cantilever beam, a needle arm seat, A needle base and a needle point, the cantilever beam has a first surface and a second surface facing away from each other, and the second surface faces the object to be measured; the needle arm base is arranged on the first surface for connecting with a The line is electrically connected; the needle tip seat is disposed on the second surface; the needle tip is disposed on a surface of the needle tip seat facing away from the second surface, the needle tip is used to contact the object to be measured; and a conductive frame is made of conductive material The conductive frame is made and electrically connected to another line. The conductive frame is arranged around the at least one probe, and the conductive frame and the at least one probe are kept at a distance.

Description

Probe module and probe card

The invention relates to a detection device; in particular, it relates to a probe module and a probe card for electrically detecting an object to be measured.

It is used to test whether the electrical connection between various electronic components in electronic products is correct. Usually, a probe module is used as a test interface between a detection device and the electronic device to be tested. To obtain the test results of the electronic device under test.

As the size of electronic components is gradually shrinking, the specifications of the probes used by the probe module for measurement have also been refined, and the spacing between the probes and the probes has been reduced. The accuracy of the test; in particular, when conducting high-frequency signal testing, the interference and loss suffered by the signal transmission are high, and the impedance matching characteristics are also poor, so that the integrity of the signal transmission is not good. Therefore, how to obtain better transmission signal and impedance matching characteristics is one of the directions that various industries are eager to improve.

In view of this, an object of the present invention is to provide a probe module and a probe card, which can obtain better transmission signals and better impedance matching characteristics.

In order to achieve the above object, the present invention provides a probe module including: at least one probe having a cantilever beam, a needle arm seat, a needle tip seat and a needle tip, the cantilever beam has two phases facing away A first surface and a second surface; the needle arm seat is disposed on the first surface; the needle tip seat is disposed on the second face; the needle tip is disposed on a surface of the needle tip seat facing away from the second surface; and a conduction The frame is made of a conductive material, and the conductive frame is ringed around the at least one probe, and the conductive frame and the at least one probe are kept at a distance.

In order to achieve the above object, the present invention provides a probe card for electrically detecting an object to be tested, which includes: a circuit board provided with a plurality of lines; and a probe module, the probe The module includes at least one probe, which has a cantilever beam, a needle arm seat, a needle tip seat and a needle tip. The cantilever beam has a first side and a second side facing away from each other; the needle arm seat is arranged On the first surface; the needle tip seat is disposed on the second face; the needle tip is disposed on a surface of the needle tip seat facing away from the second face; and a conductive frame is made of conductive material, and the conductive frame ring is disposed on the at least Around a probe, the conductive frame is spaced from the at least one probe.

The effect of the present invention is that through the above-mentioned probe structure and probe module, when performing a high-frequency signal test, a better transmission signal and better impedance matching characteristics can be obtained.

〔this invention〕

100‧‧‧ Probe Module

110‧‧‧ Probe

112‧‧‧ cantilever

112a‧‧‧First side

112b‧‧‧Second Side

114‧‧‧ Needle Arm Seat

116‧‧‧ Needle Tip Seat

118‧‧‧ Needle tip

120‧‧‧Conducting frame

200‧‧‧ Probe Module

210‧‧‧ Probe

220‧‧‧Conducting frame

230‧‧‧ Probe

300‧‧‧ Probe Module

310‧‧‧ Probe

312‧‧‧ Needle Tip Seat

320‧‧‧conducting frame

330‧‧‧ gap

400‧‧‧ Probe Module

410‧‧‧ Probe

412‧‧‧Front

414‧‧‧Back

416‧‧‧tip

420‧‧‧Conducting frame

422‧‧‧ open end

424‧‧‧ cantilever

426‧‧‧Base

428‧‧‧Connection Department

429‧‧‧tip

500‧‧‧ Probe Module

510‧‧‧ Probe

520‧‧‧conducting frame

600‧‧‧ Probe Module

610‧‧‧ Probe

611‧‧‧ cantilever

611a‧‧‧first paragraph

611b‧‧‧paragraph 2

612‧‧‧Needle Arm Seat

613‧‧‧needle tip seat

614‧‧‧ Needlepoint

620‧‧‧Conducting frame

622‧‧‧Part I

624‧‧‧Part Two

626‧‧‧ floor

600a‧‧‧ Probe Module

611a‧‧‧Cantilever

626a‧‧‧ floor

627‧‧‧hollow area

600b‧‧‧ Probe Module

628‧‧‧hollow area

700a‧‧‧ Probe Module

711‧‧‧ cantilever

720‧‧‧conducting frame

722‧‧‧Air permeability department

700b‧‧‧probe module

724‧‧‧ floor

726‧‧‧ hollowed out area

800‧‧‧Circuit Board

802‧‧‧ the first side

804‧‧‧Second Side

806‧‧‧ opening

810‧‧‧First Signal Pad

820‧‧‧First ground pad

830‧‧‧Second signal pad

840‧‧‧Second ground pad

900‧‧‧ Probe Module

912‧‧‧Probe

913‧‧‧Second Side

915‧‧‧ surface

920‧‧‧Conducting frame

922‧‧‧ Ground

924‧‧‧First-order surface

926‧‧‧second-order surface

928‧‧‧third-order surface

929‧‧‧tip

900’‧‧‧ Probe Module

914‧‧‧Probe

1‧‧‧ Probe Card

10‧‧‧ support

10a‧‧‧ opening

12‧‧‧ link

12a‧‧‧ opening

20‧‧‧Circuit Board

22,24‧‧‧pad

26‧‧‧ opening

30,30’‧‧‧ coaxial line

30a‧‧‧ cut surface

30b‧‧‧ cut noodles

30c‧‧‧ cut noodles

31‧‧‧ connector

32‧‧‧Signal Transmission Department

33‧‧‧ Seat

34‧‧‧ Ground Transmission Department

40‧‧‧solder

50‧‧‧Fixed parts

52‧‧‧The first fixed part

54‧‧‧Second fixing section

60‧‧‧ Probe Module

62‧‧‧ Probe

63‧‧‧ Needle tip

64‧‧‧conducting frame

65‧‧‧ Ground

66‧‧‧ Needle tip

60’‧‧‧ Probe Module

62’‧‧‧ Probe

S‧‧‧ Needle tip

64’‧‧‧ conducting frame

G‧‧‧ Needle tip

s1‧‧‧bolt

s2‧‧‧bolt

FIG. 1 is a perspective view of a probe module according to a preferred embodiment of the present invention.

Figure 2 is a side view of the probe of the preferred embodiment.

FIG. 3 is a perspective view of a probe module according to another preferred embodiment of the present invention.

FIG. 4 is a perspective view of a probe module according to another preferred embodiment of the present invention.

FIG. 5 is a partial top view of the probe module.

FIG. 6 is a perspective view of a probe module according to another preferred embodiment of the present invention.

FIG. 7 is a perspective view of a probe module according to another preferred embodiment of the present invention.

FIG. 8 is a perspective view of a probe module according to another preferred embodiment of the present invention, in which a point indicated by a dot chain line is a transparent display.

FIG. 9A is a partial top view of FIG. 8

Fig. 9B is a cross-sectional view taken along the line A-A of Fig. 9A.

FIG. 10A is a partial top view of a probe module according to another embodiment.

Fig. 10B is a sectional view taken along the line B-B in Fig. 10A.

FIG. 11A is a partial top view of a probe module according to another embodiment.

Fig. 11B is a sectional view taken along the line C-C in Fig. 11A.

FIG. 12A is a partial top view of a probe module according to another embodiment.

Fig. 12B is a sectional view taken along the D-D direction in Fig. 12A.

FIG. 13A is a partial top view of a probe module according to another embodiment.

Fig. 13B is a sectional view taken along the line E-E in Fig. 13A.

FIG. 14 is a top view of a circuit board according to a preferred embodiment of the present invention.

FIG. 15 is a bottom view of the circuit board of the above preferred embodiment.

FIG. 16 is a perspective view of the probe module of the above preferred embodiment.

FIG. 17 is a bottom view of the circuit board of the above preferred embodiment, revealing that the probe module is combined with the circuit board.

FIG. 18 is a perspective view of a probe module according to another preferred embodiment of the present invention.

FIG. 19 is a schematic diagram of combining a probe module with a circuit board in the above preferred embodiment of the present invention.

FIG. 20A is a perspective view of a probe card according to another preferred embodiment of the present invention.

Fig. 20B is a perspective cross-sectional view taken along the A-A direction of Fig. 20A.

FIG. 20C is a schematic side view of the probe card.

Fig. 21A is a bottom view of the coaxial line of the embodiment.

FIG. 21B is a side view of a coaxial line according to another embodiment.

FIG. 22 is a bottom view of the probe card of the above-mentioned preferred embodiment, and discloses the implementation mode of single-side needle ejection.

FIG. 23 is a bottom view of the probe card of the above-mentioned preferred embodiment, and discloses the implementation of bilateral needle ejection.

FIG. 24 is a bottom view of the probe card of the above-mentioned preferred embodiment, revealing an implementation aspect of a bilateral needle-out and multiple pairs of needle groups.

FIG. 25 is a bottom view of the probe card of the above-mentioned preferred embodiment, revealing an implementation state in which the needle is bilaterally ejected and the conductive frame is connected.

Fig. 26 is a schematic cross-sectional view taken along the F-F direction in Fig. 25.

In order to explain the present invention more clearly, preferred embodiments are described in detail below with reference to the drawings. The probe module of the present invention is provided on a circuit board for contact with the object to be tested for electrical detection. The probe module includes at least one probe and a conductive frame. Please refer to FIG. 1, which shows a probe module 100 according to a preferred embodiment of the present invention. The probe module 100 includes a probe 110 and a conductive frame 120.

As shown in FIG. 2 together, the probe 110 includes a cantilever beam 112, a needle arm base 114, a needle tip base 116, and a needle tip 118. The cantilever beam 112 has a first surface 112a and a second surface 112b facing away from each other. The second surface 112b faces the object to be measured. A surface of the needle arm base 114 is connected to the first surface 112a. Connection, the other surface of the needle arm base 114 is used to be disposed on a circuit board, for example, formed on the circuit board by electroplating and connected to the circuit board A circuit is electrically connected, wherein, preferably, the circuit board uses, for example, a multilayer organic board (MLO) or a multilayer ceramic board (MLC), but in other embodiments, it is not limited to this; One surface of the base 116 is connected to the second surface 112b, and the top surface of the needlepoint base 116 is used for setting the needlepoint 118; the needlepoint 118 is connected to the surface of the needlepoint base 116 facing away from the second surface 112b, and the needlepoint 118 is used for In order to make contact with the test object, the test object is electrically tested. Wherein, in one embodiment, the cantilever beam 112, the needle arm base 114, and the needle tip base 116 of the probe 110 are a structure formed by stacking the same material by a micro-electromechanical process, but this is not the case in other practical implementations. Limited.

The conductive frame 120 is made of a conductive material and is looped around the probe 110 and is spaced apart from the probe 110 and is not in electrical contact with the probe 110. The conductive frame 120 is provided for Another circuit on the circuit board is electrically connected to perform impedance matching with the probe 110.

For example, in an embodiment, when the aforementioned probe 110 is electrically connected to a signal circuit, the conductive frame 120 may be electrically connected to a ground line for impedance matching with the probe 110. . In addition, in an embodiment, a pinpoint may be provided on the conductive frame 120, whereby the conductive frame 120 may also touch the corresponding pad of the object to be tested through the pinpoint point to transmit the ground signal.

Please refer to FIG. 3, which shows a probe module 200 according to another embodiment of the present invention. The structure is substantially the same as the probe module 100 of the foregoing embodiment. The difference is that the probe module 200 further includes Another probe 230 is disposed on one side of the probe 210 and the conductive frame 220. The structure of the probe 230 and the probe 210 is substantially the same, but is not limited thereto. Among them, according to the form of the pad to be tested, it can be divided into two types: signal wiring and ground wiring. With this architecture, the signal traces are probes 210 and the ground traces are probes 230. In one case, due to the signal trace distance It is far from the ground trace. Therefore, considering impedance matching, the conductive frame 220 is designed to perform impedance matching with the signal trace.

Please refer to FIG. 4, which shows a probe module 300 according to another embodiment of the present invention. The structure of the probe module 300 is substantially the same as that of the probe module 100 or the probe module 200 described above. The difference is that: A notch 330 is formed inwardly of the inner edge of the conductive frame 320. The notch 330 is mainly designed for impedance matching of the probe 310. The needle tip seat 312 of the probe 310 is located in the gap 330. In addition, as shown in FIG. 5, in an embodiment, the distance between the needle tip seat 312 and the conductive frame 320 located in the notch 330 is relatively small, that is, the interval is smaller than a portion of the probe 310 not in the notch 330. And the conductive frame 320.

Please refer to FIG. 6, which shows a probe module 400 according to another embodiment of the present invention. The probe module 400 includes a probe 410 and a conductive frame 420. The structure of the probe 410 is substantially the same as the structure of the probe 110 described above. This is not repeated here. The cantilever beam of the probe 410 has an opposite front end 412 and a rear end 414. The needle arm seat is disposed near the rear end 414 of the cantilever beam, and the needle tip seat is disposed on the front end of the cantilever beam. 412. An open end 422 is formed at one end of the conductive frame 420, and the open end corresponds to the rear end 414 of the cantilever beam. The conductive frame 420 includes a cantilever portion 424, a base portion 426, and a connecting portion 428. The cantilever portion 424 corresponds to the cantilever beam of the probe 410; the base portion 426 is connected to the bottom surface of the cantilever portion 424 For connecting to a line electrically, and the base portion 426 corresponds to the needle arm seat of the probe 410; the connection portion 428 is connected to the top surface of the cantilever portion 424, and the connection portion 428 is connected to the Corresponding to the needle tip of the probe 410, the connecting portion 428 is disposed on the other end of the conductive frame 420, that is, the other end corresponding to the open end 422. The connecting portion 428 is a closed end, and the closed end is correspondingly disposed on the cantilever. The front end 412 of the beam extends forward. In this embodiment, the cantilever portion 424, the base portion 426, and the connection portion 428 of the conductive frame 420 may be a structure formed by stacking the same material in a micro-electro-mechanical process, but in other embodiments, this is not the case. Limited. Among them The connecting portion 428 of the guide frame 420 can be provided with a needle tip 429, so that the conductive frame 420 can not only perform impedance matching with the probe 410, but also touch the connection of the object to be measured through the needle tip 429. Pads, etc., for electrical transmission or electrical testing. It is worth mentioning that, in this embodiment, the number of the needle tips 429 of the conductive frame 420 is two, and they are located on both sides of the needle tip 416 of the probe 410, wherein the probe 410 can be used as a signal cable. The conductive frame 420 can be used as a grounding trace, whereby a probe structure having a GSG (Ground-Signal-Ground) structure can be formed through the probe 410 and the pinpoint arrangement of the conductive frame 420. In particular, since the conductive frame 420 also adopts a cantilever design similar to the probe 410, when the conductive frame 420 is used as a grounding probe, its cantilever portion 424 can also have different heights according to the pads of the object to be measured. The amount of elastic micro-deformation caused by the condition of the corresponding degree, and the effect of optimizing the flatness of the needle tip can be obtained.

Please refer to FIG. 7, which shows a probe module 500 according to another embodiment of the present invention. The structure is substantially the same as the probe module 400 described above, except that the probe module 500 has two probes. 510, and the two probes 510 are both disposed in the conductive frame 520 and surrounded by the conductive frame 520. Thereby, the conductive frame 520 can achieve a good impedance matching effect on the two probes 510. Among them, according to the form of the pad under test, there are two types of signal traces and ground traces. In application, the probe 510 can be used as a signal trace, and the conductive frame 520 can be used as a ground trace. 520 is provided with two needle tips 522, which are located on both sides of the needle tip 512 of the two probes 510. Through the arrangement of the needle tips of the probe 510 and the conductive frame 520, a GSSG (Ground-Signal-Signal-Ground) can be formed. ) Structured probe module for measuring differential signals.

It can be seen from the embodiments shown in FIG. 6 and FIG. 7 that the number of probes of the probe module provided by the present invention may be one (as shown in FIG. 6) or two (as shown in FIG. 7), but not With this limitation, in other applications, it is also possible to design an implementation where three or more probes are arranged in a conductive frame.

Please refer to FIG. 8 and FIGS. 9A and 9B. A probe module 600 according to another embodiment of the present invention includes a probe 610 and a conductive frame 620. The structure of the probe 610 and the aforementioned probe 110 is as follows. Roughly the same, they all have a cantilever beam 611, a needle arm seat 612, a needle tip seat 613, and a needle tip 614. The cantilever beam 611 has a first section 611a and a second section 611b connected to each other. The first section 611a is provided with The needle arm base 612 and the second segment 611b are provided with the needle tip base 613. The conductive frame 620 has a first portion 622 and a second portion 624 connected to each other. The first portion 622 surrounds the needle arm base 612 and the first section 611a of the cantilever beam 611. The first portion 622 has an open end and The rear end of the probe 610 (same as the rear end 414 of the probe 410 in FIG. 6); the second portion 624 surrounds the second section 611 b of the cantilever beam 611, and the second portion 624 also has a bottom plate 626 The bottom plate 626 faces the first side of the cantilever beam 611, that is, the bottom plate 626 faces the second segment 611b of the cantilever beam 611 away from the surface of the needle base 613 and the needle point 614, so that the cantilever The three surfaces of the second segment 611b of the beam 611 are surrounded by the second portion 624 of the conductive frame 620. As shown in FIG. 8, the three surfaces of the second segment 611b mentioned above are in addition to the surface on which the needle tip 614 is provided. The remaining three surfaces.

Please refer to FIG. 10A and FIG. 10B, which shows a probe module 600a according to another embodiment of the present invention. The structure of the probe module 600a is substantially the same as that of the probe module 600 described above. The bottom plate 626a of the needle module 600a has a hollowed-out area 627, so that a portion of the first surface of the cantilever beam 611a is not covered by the bottom plate 626a.

Please refer to FIG. 11A and FIG. 11B, which shows a probe module 600b according to another embodiment of the present invention. The structure of the probe module 600b is substantially the same as that of the aforementioned probe module 600a. The difference is that the probe The module 600b has a plurality of hollow areas 628, and each of the hollow areas 628 is spaced from each other.

Please refer to FIGS. 12A and 12B, which shows a probe module 700a according to another embodiment of the present invention. The structure of the probe module 700a is substantially the same as the probe module 600 described above, except that the conductive frame 720 A penetrating portion 722 is provided on the left side of the second part. The penetrating portion 722 is the second segment of the cantilever beam 711, so that the left side of the second segment of the cantilever beam 711 is not covered by the conductive frame 720. Open. In an embodiment, the through-hole portion 722 can be formed by removing a portion circled by a dot chain line by the conductive frame 620 shown in FIG. 8, but not limited thereto. In addition, in an embodiment, the left side of the first portion of the conductive frame 720 may be provided with another hollow portion, so that the left side of the first section of the cantilever beam 711 is open without being shielded. In this way, through the above design, the conductive frame 720 can only surround and shield the two surfaces of the cantilever beam 711 (the lower surface and the right surface), while the other two surfaces of the cantilever beam 711 (the upper surface and the left surface) are not Covered and open.

Please refer to FIGS. 13A and 13B, which is a probe module 700b according to another embodiment of the present invention. The structure of the probe module 700b is substantially the same as the structure of the foregoing probe module 700a, except that the probe The bottom plate 724 of the needle module 700b is formed with at least one hollowed-out area 726. For example, one hollowed-out area 726 or a plurality of hollowed-out areas 726 may be formed.

Please refer to FIG. 14 to FIG. 17, which shows a probe card according to a preferred embodiment of the present invention. The probe card includes a circuit board 800 and a probe module 900. In this embodiment, the circuit board 800 The system can adopt a multilayer organic board (MLO) or a multilayer ceramic board (MLC), which is provided with a plurality of lines (for example, including multiple signal lines and multiple ground lines). The circuit board 800 has a first A surface 802 and a second surface 804 and an opening 806 passing through the first surface 802 and the second surface 804. A first signal pad 810 and two first ground pads 820 are provided on the first surface 802, and the first signal pad 810 is located between the two first ground pads 820; There is a second signal pad 830 and two second ground pads 840. The second signal pad 830 is located between the two second ground pads 840. among them, A first signal pad 810 is electrically connected to a second signal pad 830 through a signal line, and two first ground pads 820 are respectively connected to a second ground through a ground line. The pad 840 is electrically connected. Wherein, in this embodiment, the above-mentioned pads can be electrically connected to the coaxial line through welding, but in other implementations, this is not limited.

The probe module 900 includes a probe 912 and a conductive frame 920. The structure of the probe 912 is substantially the same as the structure of the probe 110 in the foregoing embodiment, and details are not described herein again. The conductive frame 920 is made of a conductive material and is looped around the probe 912 and maintains a gap with the probe 912 without contacting each other. One end of the conductive frame 920 forms an open end and is open. Two grounding portions 922 are formed, and the two grounding portions 922 are electrically connected to a second grounding pad 840. In this embodiment, plating is performed by electroplating. The two grounding portions 922 are respectively disposed on the two second grounding pads 840. In addition, the conductive frame 920 has a stepped surface on the same side as the second surface 913 of the probe 912, and has a first step surface 924, a second step surface 926, and a third step surface 928 in this order. The step surface 924 is flush with the second surface 913. The second step surface 926 is higher than the first step surface 924 but lower than the third step surface 928. The third step surface 928 and the needle tip seat of the probe 912. The surface 915 with the needle tip is flush. In addition, the conductive frame 920 is used to match the signal with the probe 912. According to test requirements, in an embodiment, a pinpoint 929 may be provided on the third step surface 928 for feeding the ground signal. use.

With this, the probe card provided by the present invention adopts the cantilever design of the probe and the conductive frame for impedance matching of the probe adopts the cantilever design similar to the probe, and can obtain better flatness of the needle tip. In addition to impedance matching, the conductive frame can also be provided with a needle tip based on other measurement requirements, which can be used for spot measurement of the object to be measured, or other applications such as pin mark testing. . In addition, the probe module used in the above-mentioned probe card is not limited to the probe module 900. In other applications, the probe module (for example, the probe module) provided in the foregoing embodiments can also be used in cooperation. One of the groups 100 to 700b or a combination thereof).

In addition, the design of the number of probes will be adjusted according to the number of pads that the test object needs to contact for testing, or it will be increased or decreased according to the use requirements. For example, when the position of the needle mark needs to be judged, the number of probes can also be increased. For example, please refer to FIG. 18 and FIG. 19, which are probe cards according to another preferred embodiment of the present invention. The probe card is substantially the same as the probe card of the foregoing embodiment, and the differences are as follows: The probe module 900 'of the probe card further includes two probes 914. The structure of the two probes 914 is the same as that of the probe 912, and can be electrically connected to the second ground pad 840. Electrically connected to the ground line. The added probe 914 can be used for judging the position of the pin mark of the object to be tested, but it is not limited to this, and can also be used for testing the ground signal.

Please refer to FIG. 20A to FIG. 20C, which is a probe card 1 according to another embodiment of the present invention. The probe card 1 is used to electrically test an object to be measured, and includes: a support base 10, a connecting member 12, a The circuit board 20, the electrical transmission member with the axis 30 as an example, a fixing member 50, and a probe module 60.

The support base 10 is hollowed in the center and has an opening 10a. The connecting member 12 is provided on the supporting base 10. For example, the connecting member 12 can be fixed to the supporting base 10 through a fastener such as a bolt s1 at a screw hole, and the connecting member 12 has an opening 12 a and the support. The opening 10a of the seat 10 corresponds.

The circuit board 20 is disposed in the opening 10 a of the support base 10 through the fixing member 50 and the connecting member 12. In this embodiment, the fixing member 50 is disposed in the opening 10 a of the support base 10, and includes a first fixing portion 52 and a second fixing portion 54. The circuit board 20 bears on the first fixing portion. Between the portion 52 and the second fixing portion 54, further, the first fixing portion 52 and the second fixing portion 54 are used to clamp and fix the position of the circuit board 20, and the first fixing portion 52 is transmitted through Fasteners such as bolts s2 are fixed on the connecting member 12, so that the circuit board 20 is firmly positioned in the opening 10 a of the support base 10. The circuit board 20 A plurality of pads are respectively arranged on the lower surface, and the pads are electrically connected to the wires inside the circuit board 20, and constitute multiple signal lines and multiple ground lines, but in other applications, this is not the case. limit. The support base 10 and the fixing member 50 are located on the same surface of the connecting member 12.

One end of the coaxial cable 30 is electrically connected to the circuits on the circuit board 20, and the other end is electrically connected to a testing machine (not shown), for example, connected to the testing machine through a connector 31, thereby transferring the testing machine. The electrical signal of the line between the stage and the circuit board 20, the connector 31 is a connector of a coaxial structure, such as an SMA connector. In addition, in order to locate the joint 31, a socket 33 may be further provided for fixing the joint 31. The socket 33 may be disposed on the first fixing portion 52. The coaxial line 30 has a signal transmission part and a ground transmission part which are electrically isolated from each other. The signal transmission part is used for electrical connection with a circuit (such as a signal line), and the ground transmission part is used for The other line (such as a ground line) is electrically connected. Preferably, please cooperate with FIG. 21A. The coaxial line 30 has two cutting planes 30a and 30b. Among them, the cutting plane 30a is connected to the cutting plane 30b and an angle is interposed. For example, in this embodiment, the angle is generally At 90 degrees, the signal transmission portion 32 and the ground transmission portion 34 are exposed from the cut surface 30a, whereby the coaxial line 30 can abut the cut surface 30a against the surface of the circuit board 20, so that the signal transmission portion 32 and the ground transmission The portion 34 is electrically connected to the signal line and the ground line on the circuit board 20, and then, the coaxial line 30 can be soldered and connected to the circuit board 20 through the solder 40 for positioning; in addition, the coaxial line 30 passes through another cut plane. 30b can be abutted against the edge of the circuit board 20, whereby the two cut surfaces 30a, 30b of the coaxial line 30 can be abutted against the edge of the circuit board 20, so that the coaxial line 30 can be stably fixed on the circuit board 20 Effect of the position.

In addition, in an embodiment, the electrical transmission member is not a coaxial cable as an example, and other types of transmission members such as a flexible circuit board or a multi-core twisted wire can also be used.

In addition, in an embodiment, the coaxial line is not limited to two cut planes. Please refer to FIG. 21B. The coaxial line 30 'may also be provided with a single oblique cut plane 30c. The signal transmission part and the ground transmission part can be exposed from the chamfered surface 30c, whereby the coaxial cable 30 'can be abutted against the circuit board through the chamfered surface 30c, so that the signal transmission part and the ground transmission part and corresponding The pads are electrically connected.

The probe module 60 is disposed below the circuit board 20 in the figure and is electrically connected to the lines on the circuit board 20. Please cooperate with FIG. 22. The probe module 60 includes a probe 62 and a conductive frame 64. The structure of the probe 62 is substantially the same as the structure of the probe 110 described above. A tapered section is formed in the middle section of the needle 62. The needle arm seat of the probe 62 is disposed on the pad 22 of the circuit board 20 and is electrically connected to the pad 22, and further electrically connected to the signal line on the circuit board 20. . The conductive frame 64 is arranged around the probe 62. The structure of the conductive frame 64 is substantially the same as the structure of the aforementioned conductive frame 420. An open end is formed at one end of the conductive frame 64, and two grounded portions 65 are formed. The portion 65 is electrically connected to another pad 24 and further to the ground line on the circuit board 20. The other end of the conductive frame 64 forms a closed end. The difference is that the conductive frame 64 is in the conductive frame 64. The segment forms a tapered segment so that the pitch between the probe 62 and the closed end of the conductive frame 64 on one side is smaller than the distance between the probe 62 and the open end of the conductive frame 64 on one side. Through the above design, in addition to the impedance matching with the probe, the conductive frame 64 of the present invention can also achieve the effect of a space converter, so that the pitch of the probe is reduced. In addition, the closed end of the conductive frame 64 may also be provided with a needle tip 66 according to the requirements of use, and the electrical test of the object to be tested or the needle mark test of the probe may be performed, but not limited thereto. Wherein, in one embodiment, the circuit board 20 has an opening 26, and the probe 62 and the conductive frame 64 are provided with a tip end extending into the orthographic projection range of the opening 26. The positions of the probe 62 and the conductive frame 64 can be observed through the opening 26. Furthermore, the position of the needle tip and the angle of the lower needle provided on the probe 26 can be observed, so that the user or the testing machine can perform the probe module 60. control.

It is worth mentioning that, in addition to the design of the probe module with a single-side needle as shown in Figure 22 above, in other applications, the design of a probe module with a double-side needle can also be used. For example, please refer to the figure As shown in FIG. 23, in an embodiment, under the framework of the probe card 1 described above, two probe modules 60 may be provided, wherein the two probe modules 60 are oppositely disposed. Wherein, the probe 62 of the two probe module 60 can be used as a signal wiring, and the conductive frame 64 of the two probe module 60 can be used as a ground wiring, thereby passing through the needle tip 63 of the two probe 62 The arrangement with the needle tips 66 of the two conductive frames 64 can constitute a probe structure with a Signal-Ground-Ground-Signal (SGGS) structure. In addition, it is not limited to other applications, and the above-mentioned probe modules 60 may also be staggered.

Please also refer to FIG. 24. In an embodiment, under the structure of the probe card 1 described above, two or more probe modules 60 may be provided, and each of the probe modules 60 may be two by two. Symmetrical setting, but not limited to this. In other applications, it can also be staggered. In this way, the effect of testing multiple pads of a test object or testing multiple test objects at the same time can be achieved.

Please also refer to FIG. 25 and FIG. 26. In one embodiment, under the structure of the probe card 1 described above, two sets of probe modules 60 'may be provided. The probe module 60 is substantially the same. In particular, in this embodiment, between the two probe modules 60 ′ provided in pairs, the conductive frames 64 ′ are connected to each other to form one body. The molded design can improve the effect of signal transmission, thereby reducing the possibility of signal mismatch and reflection. Among them, in application, the probe 62 'of the probe module 60' can be used as a signal trace, the conductive frame 64 'can be used as a ground trace, and the needle tip S of the probe 62' and the conductive frame 64 can be used. The arrangement type of the needle tip G can form a probe structure with an SGS (Signal-Ground-Signal) structure. In addition, in other applications, the needle tip G of the conductive frame 64 'can be removed to form a SS (Signal-Signal) probe structure.

Therefore, through the design of the probe module and the probe card of the present invention, based on the structure design of the probe and the matching conductive frame adopting a cantilever beam, it can have the effect of good flatness of the tip; Conductive components (such as coaxial cables) are connected to pads or lines on the circuit board by soldering, and have the effect of rapid replacement. For example, when you want to change to another circuit board, you only need to conduct electricity The soldering part between the component and the circuit board is desoldered, and you can replace it with a new one or another circuit board and then solder it separately. In addition, the probe module of the present invention can use a micro-electro-mechanical system to make the probe and the conductive frame, so that the structure and the force applied during the test have a better consistency effect.

The above descriptions are only the preferred and feasible embodiments of the present invention, and any equivalent changes made by applying the description of the present invention and the scope of patent application should be included in the patent scope of the present invention.

Claims (16)

A probe module includes at least one probe having a cantilever beam, a needle arm seat, a needle tip seat and a needle tip. The cantilever beam has a first surface and a second surface facing away from each other. The needle arm seat is disposed on the first surface; the needle tip seat is disposed on the second surface; the needle tip is disposed on a surface of the needle tip seat facing away from the second surface; and a conductive frame made of a conductive material, the conductive A frame ring is provided around the at least one probe, and the conductive frame has a distance from the at least one probe; wherein the conductive frame has a cantilever portion, a base portion and a connection portion, and the cantilever portion is connected to the at least one The cantilever beam of the probe corresponds; the base portion and the connecting portion are respectively connected to two oppositely facing surfaces of the cantilever portion, and the base portion corresponds to the needle arm seat of the at least one probe, the The connecting portion corresponds to the needle point seat of the at least one probe; the connecting portion is provided with another needle point, and the needle point of the connecting portion is used to touch an object to be measured. The probe module according to claim 1, wherein an inner edge of the conductive frame is recessed to form a gap, and the needle tip seat of the probe is located in the gap. The probe module according to claim 1, wherein the cantilever beam has a front end and a rear end opposite to each other, and the cantilever beam has a first section and a second section connected to each other, and the needle arm seat is disposed at The first segment is near the rear end of the cantilever beam, and the needle point seat is disposed at the second segment and near the front end of the cantilever beam; the conductive frame has a first part and a second part connected, and The first part is formed with an open end corresponding to the rear end of the cantilever beam, and the first part surrounds the needle arm seat and the first section of the cantilever beam, and the second part surrounds the second section of the cantilever beam. The probe module according to claim 3, wherein the second portion of the conductive frame has a bottom plate, and the bottom plate faces the first surface of the cantilever beam. The probe module according to claim 4, wherein the base plate has at least one hollowed-out area. The probe module according to claim 4, wherein a side of the second portion of the conductive frame is provided with a through-hole, and the through-hole is directly facing the second section of the cantilever beam. The probe module according to claim 3, wherein the other end of the conductive frame is formed with a closed end, and a distance between two edges of the closed end of the conductive frame is smaller than between two edges of the open end of the conductive frame. distance. A probe card for electrically testing an object to be tested, comprising: a circuit board provided with a plurality of lines; and a probe module according to any one of claims 1 to 7, Wherein, the second surface of the cantilever beam faces the object to be measured, the needle arm seat is used to be electrically connected to a line, the needle tip is used to contact the object to be measured, and the conductive frame is used to contact another object. The line is electrically connected. The probe card according to claim 8, wherein the circuit board has an opening, one end of the probe provided with the needle tip extends into the orthographic projection range of the opening, and one end of the conductive frame extends to the front of the opening. Projection range. The probe card according to claim 8 includes an electric transmission member, one end of the electric transmission member is electrically connected to the lines, and the other end is electrically connected to a testing machine. The probe card according to claim 10, comprising a support base and a fixing member, the support base having an opening; the fixing member is disposed in the opening of the support base, and the fixing member is used for fixing the circuit board. The probe card according to claim 11, wherein the fixing member includes a first fixing portion and a second fixing portion, and the circuit board bears between the first fixing portion and the second fixing portion. The probe card according to claim 12, comprising a connection member provided on the support base, the connection member having an opening corresponding to the opening of the support base; the first fixing portion is provided on the connection member . The probe card according to claim 10, wherein the electrical transmission part is a common axis, and the coaxial line has a signal transmission part and a ground transmission part which are electrically isolated from each other, and the signal transmission part is provided for connection with a circuit board. The circuit is electrically connected, and the ground transmission part is for electrical connection with another circuit of the circuit board; the coaxial line has all sides, and the signal transmission part and the ground transmission part are exposed from the cut surface. The probe card according to claim 14, wherein the coaxial line has another cutting plane, the other cutting plane is connected to the cutting plane and an angle is formed with the cutting plane, and the other cutting plane is used to abut against the circuit board the edge of. The probe card according to claim 8, wherein the number of the probe modules is plural, and the probe modules are arranged in pairs, and between the two probe modules arranged in pairs. , Its conductive frame is connected into one.