CN101236215A - High-frequency cantilevered detecting probe - Google Patents
High-frequency cantilevered detecting probe Download PDFInfo
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- CN101236215A CN101236215A CNA2007100024792A CN200710002479A CN101236215A CN 101236215 A CN101236215 A CN 101236215A CN A2007100024792 A CNA2007100024792 A CN A2007100024792A CN 200710002479 A CN200710002479 A CN 200710002479A CN 101236215 A CN101236215 A CN 101236215A
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Abstract
A high frequency cantilever type probe has a needle carrier, a transmission line, and at least one signal needle and a grounding needle. Both the signal needle and the grounding needle have a fixed part, a needle tip and a forearm extending from the fixed part to the needle tip, wherein the fixed part is arranged on the needle carrier, the needle tip is used for a point contact integrated circuit wafer, the fixed part of the signal needle is connected with the wire lead of the transmission line, and the fixed part of the grounding needle is electrically connected with the coaxial metal of the transmission line. Thus, the signal needle can transmit a high frequency test signal corresponding to the transmission line to the corresponding point contact electronic component, and the forearm of the grounding needle is a certain distance away from the forearm of the adjacent signal needle to keep characteristic impedance when the signal needle transmits the high frequency test signal.
Description
Technical field
The present invention is relevant with cantalever type probe, is meant a kind of being used on the probe to transmit the cantalever type probe of high-frequency signals especially.
Background technology
See also known cantalever type probe card 1 shown in Figure 1, include a circuit board 10, a plurality of coaxial transmission line 11, a probe base 12 and a plurality of cantalever type probe 13, be provided with a plurality of board solder joints 101 in order to receiving the test signal that the electrical measurement board is sent near peripheral place on the circuit board 10, by each coaxial transmission line 11 transmit test signals to the corresponding probe 13 that electrically connects of institute with to IC wafers execution wafer-level test engineering; Wherein probe base 12 has a ground plane 121, one pedestal 122 and most fixtures 123, ground plane 121 earthing potential to this probe 1 that electrically conducts, those probes 13 are located on the probe base 12, fix the body portion of each probe 13 respectively by each fixture 123,131 positions of the front end between 123 are suspended from probe base 12 belows in needle point 130 to fixture to make each probe 13, therefore when being provided as 13 of each probes and touching electronic package to be measured, bear the elastic buffer arm of force from needle point 130 reacting forces, 132 of the ends of each probe 13 are located at circuit board 10 belows near on each probe solder joint 102 of center.
Because having a conducting metal 111, each coaxial transmission line 11 outer ring electrically connects with ground plane 121, can keep the characteristic impedance of each coaxial transmission line 11 high-frequency signals transmission, but in fact each coaxial transmission line 11 is to each probe 13 structure is still arranged between the IC wafers, and each probe 13 only is a conducting metal, its skin there is no the structure treatment of similar coaxial transmission line 11, when so the high-frequency signals of coaxial transmission line 11 transfers to probe 13, the parasitic capacitance effect of dielectric environment then can cause the dielectric loss of high-frequency signals transmission around the probe 13, therefore loses the reliability of high frequency electrical measurement.
Even if a cantalever type probe card 2 that is illustrated in figure 2 as through improvement is arranged, replace the single conductive metal structure of above-mentioned probe 13 with each coaxial probe 20 structure with coaxial transmission line characteristic, and the pedestal 122 of probe base 12 is made with the metal material with electric conductivity; Wherein, each coaxial probe 20 serves as the axle core with a metal needle 21, and before dividing into, rear end 201,202 positions, front end 201 at fixture 123 between the needle point, rear end 202 at fixture 123 between the circuit board 10, coat one deck dielectric material 22 around the rear end 202 of metal needle 21, the skin of dielectric material 22 coats a conducting metal 23, conducting metal 23 also joins with the pedestal 122 of metal material and is electrically connected to earthing potential on this probe 2, make each coaxial probe 20 can keep the characteristic impedance that high-frequency signals transmits in 202 positions in the rear end, but because front end 201 positions of each coaxial probe 20 are in order to bear the elastic buffer arm of force from the needle point reacting force, need keep the specified weight of metal needle 21 bodies and required buffering activity space thereof on every side, can't increase the structure that is provided with of coaxial transmission line as its rear end 202, be coated with the outer conducting metal that connects with pedestal 122 equally on every side, can't reach in front end 201 so the high-frequency transmission characteristic only limits to 202 positions, rear end of each coaxial probe 20, make the parasitic capacitance effect of dielectric environment around the probe 20 cause the dielectric loss of high-frequency signals transmission equally easily.
Therefore probe how can be with the most effective signal transmission structure, keeps the real test that is faced for probe manufacturing person now of the characteristic impedance of high-frequency signals transmission.
Summary of the invention
The object of the present invention is to provide a kind of high-frequency cantilevered detecting probe.
Another purpose of the present invention is to provide a kind of method of making above-mentioned high-frequency cantilevered detecting probe.
For achieving the above object, a kind of cantalever type probe card in high frequency provided by the present invention has a circuit board, a needle stand, most transmission lines and most metal needles, this circuit board is laid with electronic circuit, include most signal line and ground wire and electrically connect those transmission lines, therefore can electrically contact for an electrical measurement board, to transmit the high-frequency test signal to those transmission lines down to those metal needles; Respectively this metal needle has a fixed part, one needle point and a forearm that extends to needle point from fixed part, respectively this fixed part is located at this needle stand, respectively this needle point touches IC wafers in order to point, those metal needles are more distinguished adjacent a signal pin and a grounding pin, the fixed part of this signal pin is arranged in the respectively plain conductor of this transmission line, the fixed part of this grounding pin electrically connects the coaxial metal of this transmission line, therefore those metal needles can transmit the electronic package that above-mentioned high-frequency test signal touches to corresponding point, and kept specific distance between the forearm of the forearm of this grounding pin and adjacent this signal pin, can keep the characteristic impedance that this signal pin respectively transmits the high-frequency test signal.
In detail, the high-frequency cantilevered detecting probe that provides provided by the invention includes:
One needle stand;
One transmission line has an at least one plain conductor and a coaxial metal, and this coaxial metal coats this plain conductor and electrically conducts to earthing potential; And,
An at least one signal pin and a grounding pin, the metal material that is all tool electric conductivity is made, respectively this signal pin and grounding pin have a fixed part, a needle point reaches a forearm that extends to needle point from fixed part, respectively this needle point is in order to an electric shock sub-component, respectively this fixed part is located at this needle stand, the fixed part of this signal pin is arranged in this plain conductor, and the fixed part of this grounding pin electrically connects this coaxial metal, has kept specific distance between the forearm of this signal pin and the forearm of grounding pin.
Described high-frequency cantilevered detecting probe wherein, has been kept specific distance between the plain conductor of this transmission line and the coaxial metal, can keep its characteristic impedance when electrical signal is transmitted on this plain conductor.
Described high-frequency cantilevered detecting probe, wherein, electrically signal is suitable with the characteristic impedance of transmitting on this signal pin in the characteristic impedance of transmitting on this plain conductor.
Described high-frequency cantilevered detecting probe, wherein, this needle stand is that the material of tool good insulation characteristic is made, respectively the fixed part of this signal pin and grounding pin is arranged in this plain conductor and this coaxial metal respectively.
Described high-frequency cantilevered detecting probe, wherein, this needle stand is provided with a ground plane, and made for the metal material of tool electric conductivity, this coaxial metal and this grounding pin electrically connect by this ground plane.
Described high-frequency cantilevered detecting probe, wherein, the axial length of this transmission line is equivalent to the length of this signal pin respectively or grounding pin.
Described high-frequency cantilevered detecting probe wherein, has two signal pins, and this transmission line has two plain conductors arranged side by side mutually, and this coaxial metal coats this two plain conductor, and respectively this plain conductor is connected with this signal pin.
Described high-frequency cantilevered detecting probe, wherein, this transmission line is in order to transmission differential signal (differential signal).
Described high-frequency cantilevered detecting probe wherein, also has a grounding pin, and two these grounding pins are located at the both sides of this two signals pin respectively.
The method of the above-mentioned cantalever type probe card in high frequency of manufacturing provided by the invention includes following steps:
A, prepare a circuit board, this circuit board is distinguished upper and lower relative a upper surface and a lower surface, and an inside and outside probe region of enclosing and a test section, the test section of this upper surface can power survey board electrically contact with transmit the test signal in the probe region of enclosing;
B, ring is established a needle stand on the probe region of this lower surface;
C, a plurality of transmission lines are set in this needle stand periphery, respectively this transmission line has an at least one plain conductor and a coaxial metal, this coaxial metal coats this plain conductor and electrically conducts to the earthing potential of this circuit board, and those plain conductors are in order to transmit above-mentioned test signal;
D, prepare a plurality of metal needles, respectively the length of this metal needle is equivalent to the distance of the center of this circuit board to this needle stand, respectively an end of this metal needle is bent with predetermined angle to form a needle point, and respectively the other end of this metal needle is fixed on this needle stand to form a fixed part;
E, will be respectively the plain conductor of this transmission line be arranged in the fixed part of this metal needle, so this plain conductor institute correspondence connects the metal needle of establishing and forms a signal pin;
F, keep on the specific spacing with this signal pin and to be provided with another this metal needle side by side, forming a grounding pin, the fixed part of this grounding pin is respectively electrically connected this coaxial metal.
The manufacture method of described cantalever type probe card in high frequency wherein, also is provided with a ground plane on this needle stand among the step b, made for the metal material of tool electric conductivity, respectively the coaxial metal of this transmission line and this grounding pin electrically connect by this ground plane among the step f.
The manufacture method of described cantalever type probe card in high frequency wherein, is provided with this grounding pin between adjacent two these signal pins among the step f.
The manufacture method of described cantalever type probe card in high frequency, wherein, this transmission line has mutually two these plain conductors arranged side by side, among the step e respectively this transmission line correspondence be equipped with two these signal pins.
By cantalever type probe card in high frequency provided by the invention, be applied to test probe card, to keep the characteristic impedance of high frequency electrical measurement signal.To reduce the mode of probe manufacturing cost, promote the delivery quality of high frequency electrical measurement signal simultaneously, effectively be applied to wafer scale electrical measurement engineering.
Description of drawings
Fig. 1 is the structural representation of known cantalever type probe card;
Fig. 2 is the partial structurtes synoptic diagram of another known cantalever type probe card;
Fig. 3 is the top view of first preferred embodiment provided by the present invention;
The structural representation that Fig. 4 is provided for above-mentioned first preferred embodiment;
Fig. 5 is the probe region backplan of above-mentioned first probe that preferred embodiment provides;
Fig. 6 is the partial structurtes enlarged drawing of above-mentioned Fig. 5;
Fig. 7 is the structural representation of second preferred embodiment provided by the present invention;
Fig. 8 is the probe region backplan of above-mentioned second probe that preferred embodiment provides;
Fig. 9 is the partial structurtes enlarged drawing of above-mentioned Fig. 8;
Figure 10 is the probe region backplan of the probe of the 3rd preferred embodiment provided by the present invention;
Figure 11 is the partial structurtes enlarged drawing of above-mentioned Figure 10.
Embodiment
Below, conjunction with figs. is enumerated some preferred embodiments, in order to structure of the present invention and effect are elaborated.
Seeing also extremely first preferred embodiment provided by the present invention shown in Figure 5 as Fig. 3, is the cantalever type probe card 3 in order to the measurement IC wafers, includes a circuit board 30, a needle stand 40, most transmission lines 50 and most individual metal needles 60, wherein:
Please cooperate Fig. 3 and Fig. 4 reference, these circuit board 30 definables go out relative a upper surface 301 and a lower surface 302, and in, a peripheral probe 303 and a test 304, the test section 304 of this upper surface 301 can electrically contact for an electrical measurement board (not shown), the exportable electrical measurement signal of this electrical measurement board is to this probe 3, with transmit the high-frequency test signal in the probe region 303 of enclosing, this circuit board 30 is laid with electronic circuit, include most signal line 31 and ground wire 32, be arranged to lower surface 302 to electrically connect those transmission lines 50 from these upper surface 301 extensions, respectively this signal line 31 is in order to transmit above-mentioned high-frequency test signal, and adjacent specific distance is provided with this ground wire 32, respectively this ground wire 32 can be directly or indirectly and the earthing potential of electrical measurement board electrically connect, therefore keep the characteristic impedance that this signal line 31 is respectively transmitted the high-frequency test signals.
Please cooperate Fig. 4 and Fig. 5 reference, this needle stand 40 is located on the probe region 303 of these circuit board 30 lower surfaces 302, for made as the material of tool good insulation characteristics such as epoxy resin, in order to fixing respectively this metal needle 60 and make mutually and do not electrically conduct.
Please cooperate Fig. 4 to Fig. 6 reference; respectively this transmission line 50 is located at the periphery of this needle stand 40; the one termination is located on this circuit board 30; the other end then is arranged in this metal needle 60; respectively this transmission line 50 is a coaxial configuration; outside a plain conductor 51, be coated with a dielectric layer 52, one a coaxial metal 53 and a protective seam 54 in regular turn; this plain conductor 51 electrically connects this signal line 31 to transmit above-mentioned high-frequency test signal; this coaxial metal 53 electrically connects this ground wire 32, therefore keeps the respectively characteristic impedance of these plain conductor 51 transmission high-frequency test signals.
Please cooperate Fig. 4 and Fig. 6 reference, respectively this metal needle 60 has a fixed part 601, one needle point 602 and a forearm 603 that extends to needle point 602 from fixed part 601, respectively this fixed part 601 is located at this needle stand 40, respectively this needle point 602 touches a detection welding pad 71 on the said integrated circuit wafer in order to point, those metal needles 60 are also distinguished an adjacent signal pin 61 and a grounding pin 62, the fixed part 601 of this signal pin 61 is arranged in this plain conductor 51, therefore can transmit the electronic package that above-mentioned high-frequency test signal is connected to corresponding detection welding pad 71, the fixed part 601 of this grounding pin 62 is arranged in this coaxial metal 53, therefore the pairing ground connection weld pad 72 of earthing potential that can 602 at needle point touches this electronic package, the forearm 603 of this grounding pin 62 and and the forearm 603 of adjacent this signal pin 61 between kept specific distance, therefore can keep the characteristic impedance that this signal pin 61 transmits the high-frequency test signals.
Comprehensive above-mentioned structure as can be known, this cantalever type probe card 3 provided by the present invention is for replacing known probe structure with this metal needle 60 respectively and the unitized construction of this transmission line 50 respectively, make on the path of high-frequency test signal transmission and all be provided with contiguous earthing potential, therefore the effect that reaches the optimum impedance coupling effectively remedies the shortcoming of the probe structure of known probe to keep the transmission quality of high-frequency test signal; Moreover, because only having, respectively this metal needle 60 length structurally that this probe 3 is provided is equivalent to the distance of these probe 3 centers to this needle stand 40, therefore effectively save the closely cost of manufacture of half of more known probe structure.
Other sees also the cantalever type probe card 4 that second preferred embodiment of the present invention is as shown in Figures 7 and 8 provided, be with above-mentioned first preferred embodiment supplier of institute difference, also be provided with a ground plane 41 on this needle stand 40, for the metal material of tool electric conductivity made, respectively the coaxial metal 53 of this transmission line 50 and respectively the fixed part 601 of this grounding pin 62 be all and electrically connect this ground plane 41, cooperate Fig. 9 reference, therefore this ground plane 41 not only can be provided as the ground connection equipotential plane of electronic circuit in this probe 4, make and keep stable common ground current potential in the circuit, and this grounding pin 62 only need be set between adjacent two these signal pins 61, can keep the respectively characteristic impedance of these signal pin 61 transmission high-frequency test signals, can reduce the quantity that is provided with of those grounding pins 62, the wafer electric circuit construction of less ground connection weld pad is set in order to measure correspondence.
Certain high-frequency test signal transmission structure provided by the present invention also is not defined as the structure that is provided with of above-mentioned coaxial transmission line 50 complexed metal pins 60; if be applied to the measurement that general display driver chip is done the high frequency differential signal; a cantalever type probe card 5 that can provide as Figure 10 and the present invention shown in Figure 11 the 3rd preferred embodiment then; its difference is to have most differential transmission lines 80 and replaces the transmission line 50 of the foregoing description to transmit the high frequency differential signal; respectively this differential transmission line 80 is the adjacent structure that the twin shaft heart lead of specific distance is arranged; have two plain conductors 81; two dielectric layers 82; an one coaxial metal 83 and a protective seam 84; respectively each plain conductor 81 correspondence of this differential transmission line 80 are equipped with this signal pin 61; 83 electric connections of this coaxial metal at least one this grounding pin 62 respectively; therefore by this coaxial metal 83 and institute is corresponding connects this grounding pin 62 of establishing, make the characteristic that to keep impedance matching in these probe 5 transmission high frequency differential signal processes.
The above only is a preferable possible embodiments of the present invention, changes so use the equivalent structure that instructions of the present invention and claim do such as, ought to be included in the claim of the present invention.
Claims (13)
1. high-frequency cantilevered detecting probe includes:
One needle stand;
One transmission line has an at least one plain conductor and a coaxial metal, and this coaxial metal coats this plain conductor and electrically conducts to earthing potential; And,
An at least one signal pin and a grounding pin, the metal material that is all tool electric conductivity is made, respectively this signal pin and grounding pin have a fixed part, a needle point reaches a forearm that extends to needle point from fixed part, respectively this needle point is in order to an electric shock sub-component, respectively this fixed part is located at this needle stand, the fixed part of this signal pin is arranged in this plain conductor, and the fixed part of this grounding pin electrically connects this coaxial metal, has kept specific distance between the forearm of this signal pin and the forearm of grounding pin.
2. according to the described high-frequency cantilevered detecting probe of claim 1, wherein, kept specific distance between the plain conductor of this transmission line and the coaxial metal, can keep its characteristic impedance when electrical signal is transmitted on this plain conductor.
3. according to the described high-frequency cantilevered detecting probe of claim 2, wherein, electrically signal is suitable with the characteristic impedance of transmitting on this signal pin in the characteristic impedance of transmitting on this plain conductor.
4. according to the described high-frequency cantilevered detecting probe of claim 1, wherein, this needle stand is that the material of tool good insulation characteristic is made, and respectively the fixed part of this signal pin and grounding pin is arranged in this plain conductor and this coaxial metal respectively.
5. according to the described high-frequency cantilevered detecting probe of claim 1, wherein, this needle stand is provided with a ground plane, and made for the metal material of tool electric conductivity, this coaxial metal and this grounding pin electrically connect by this ground plane.
6. according to the described high-frequency cantilevered detecting probe of claim 1, wherein, the axial length of this transmission line is equivalent to the length of this signal pin respectively or grounding pin.
7. according to the described high-frequency cantilevered detecting probe of claim 1, wherein, have two signal pins, this transmission line has two plain conductors arranged side by side mutually, and this coaxial metal coats this two plain conductor, and respectively this plain conductor is connected with this signal pin.
8. according to the described high-frequency cantilevered detecting probe of claim 7, wherein, this transmission line is in order to the transmission differential signal.
9. according to the described high-frequency cantilevered detecting probe of claim 7, wherein, have a grounding pin, two these grounding pins are located at the both sides of this two signals pin respectively.
10. the manufacture method of a cantalever type probe card in high frequency includes following steps:
A, prepare a circuit board, this circuit board is distinguished upper and lower relative a upper surface and a lower surface, and an inside and outside probe region of enclosing and a test section, the test section of this upper surface can power survey board electrically contact with transmit the test signal in the probe region of enclosing;
B, ring is established a needle stand on the probe region of this lower surface;
C, a plurality of transmission lines are set in this needle stand periphery, respectively this transmission line has an at least one plain conductor and a coaxial metal, this coaxial metal coats this plain conductor and electrically conducts to the earthing potential of this circuit board, and those plain conductors are in order to transmit above-mentioned test signal;
D, prepare a plurality of metal needles, respectively the length of this metal needle is equivalent to the distance of the center of this circuit board to this needle stand, respectively an end of this metal needle is bent with predetermined angle to form a needle point, and respectively the other end of this metal needle is fixed on this needle stand to form a fixed part;
E, will be respectively the plain conductor of this transmission line be arranged in the fixed part of this metal needle, so this plain conductor institute correspondence connects the metal needle of establishing and forms a signal pin;
F, keep on the specific spacing with this signal pin and to be provided with another this metal needle side by side, forming a grounding pin, the fixed part of this grounding pin is respectively electrically connected this coaxial metal.
11. manufacture method according to the described cantalever type probe card in high frequency of claim 10, wherein, this needle stand is provided with a ground plane among the step b, and made for the metal material of tool electric conductivity, respectively the coaxial metal of this transmission line and this grounding pin electrically connect by this ground plane among the step f.
12., wherein, be provided with this grounding pin between adjacent two these signal pins among the step f according to the manufacture method of the described cantalever type probe card in high frequency of claim 11.
13. according to the manufacture method of the described cantalever type probe card in high frequency of claim 10, wherein, this transmission line has mutually two these plain conductors arranged side by side, among the step e respectively this transmission line correspondence be equipped with two these signal pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100024792A CN101236215A (en) | 2007-01-29 | 2007-01-29 | High-frequency cantilevered detecting probe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100024792A CN101236215A (en) | 2007-01-29 | 2007-01-29 | High-frequency cantilevered detecting probe |
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| CN101236215A true CN101236215A (en) | 2008-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2007100024792A Pending CN101236215A (en) | 2007-01-29 | 2007-01-29 | High-frequency cantilevered detecting probe |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150015291A1 (en) * | 2013-07-15 | 2015-01-15 | Mpi Corporation | Cantilever probe card for high-frequency signal transmission |
| CN105738662A (en) * | 2014-11-14 | 2016-07-06 | 旺矽科技股份有限公司 | Cantilever type high-frequency probe card |
| CN104142413B (en) * | 2013-05-07 | 2017-04-12 | 旺矽科技股份有限公司 | Probe module |
| CN108732393A (en) * | 2017-04-25 | 2018-11-02 | 旺矽科技股份有限公司 | Probe module and probe card |
-
2007
- 2007-01-29 CN CNA2007100024792A patent/CN101236215A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104142413B (en) * | 2013-05-07 | 2017-04-12 | 旺矽科技股份有限公司 | Probe module |
| US20150015291A1 (en) * | 2013-07-15 | 2015-01-15 | Mpi Corporation | Cantilever probe card for high-frequency signal transmission |
| CN104297534A (en) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | Cantilever type high-frequency probe card |
| CN105738662A (en) * | 2014-11-14 | 2016-07-06 | 旺矽科技股份有限公司 | Cantilever type high-frequency probe card |
| TWI564571B (en) * | 2014-11-14 | 2017-01-01 | Mpi Corp | Cantilever high frequency probe card |
| US9835651B2 (en) | 2014-11-14 | 2017-12-05 | Mpi Corporation | Cantilever type probe card for high frequency signal transmission |
| CN108732393A (en) * | 2017-04-25 | 2018-11-02 | 旺矽科技股份有限公司 | Probe module and probe card |
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Open date: 20080806 |