201126168 六、發明說明： 【發明所屬之技術領域】 本發明有關一種探針卡，尤指一種電源完整性佳的 探針卡；本發明另有關一種用於該探針卡的印刷電路板 【先前技術】201126168 VI. Description of the Invention: [Technical Field] The present invention relates to a probe card, and more particularly to a probe card with good power integrity; the present invention further relates to a printed circuit board for the probe card [previously technology】
在晶圓或電子元件進行測試時，測試機可藉由一探 針卡（probe card)作為媒介，將測試訊號自該探針卡輪 入至一待測物（device under test’簡稱dut)，並經 由該探針卡將測試結果回傳至測試機以進行後續的檢測 、分析。 以晶圓測試為例，受限於測試機的體積; '價格等因 素，半導體廠對待測物進行測試時，通常只能利用數量 、型號有限的測試機台予以測試。由於待測物的測試規 格、種類、數量彼此相異，'在測試機受限的情況下，測 試機無法滿足各式不同製程或是不同種類待測物的測試 * ’ = · 條件。因此，習知技It係透過測試機内部的程式變化， 或是針對探針卡進行改造，藉以獲取、擴充更多的測試 相容性。 習知探針卡的印刷電路板如「圖1」所示，該印刷電 路板1部分主要可區分為輸入區2、走線區3與銲點區4三 大區域’其中探針卡之複數探針（圖中未示）可固設於銲 點區4的對應銲點或接點。輸入區2包含複數個陣列排列 的錄塾5 ’該些銲墊5包含電源銲墊（power pad)，藉以 讓測試機提供電源輸入。該些電源銲墊經由走線區3内的 099101583 表單編號A0101 第3頁/共29頁 0992003085-0 201126168 金 電 對應的 斜電源 屬佈線進行空間轉換，並電性連接至銲點區4相 源銲塾或電源環（power ring)，以供應該些探 。其中，走線區3内不同區域或分層的電源金屬佈線定義 為不同的電源平面（power plane)，且由於印刷電路板1 包含複數組電源銲墊，因此亦相對應包含複數個電源 面。 [0005] [0006] 099101583 η 探針卡的印刷電路板係為一多層結構，包含上述複 數個電源平面的分層，以及接地層與訊號層等。由於每 —電源平面在走線區須利用—層或多層進行佈線 (1 ay ou t)，使得電藏平..!&容易因為穿層而產生結構上的 缺陷，亦或是金屬導線為了柯避密佈於印刷電路板上且 貫穿印刷電路板的訊號銲點，而使金屬導線的佈線路徑 過於複雜。所以，自電源銲墊輸入的電源傳經走線區的 電源平面時’常常發生電壓下降(^〇118.§6(11"0口）或產生 雜訊干擾’如此將影響電源傳抵探針的完整性，導致測 試誤差進而影響測試結果。另一方面，食源平面受限其 佈線於印刷電路板中，因此線路固定而擴充性不佳，無 法滿足客戶端多元的測試需求；若欲增加電源平面的數 目，則須知:升印刷電路板的佈線層數，不僅實作上有難 度，更將提升整體成本支出而有待解決。 【發明内容】 爰上發明的目的在於解決上述問題，進而提出一 種電源仏佳的探針卡，以避免來自測試機的電源 供應發生過度的電源下降或雜訊干擾； 本發明之另— '-目的在於提出一種電源平面可客製化 表單編號Α0101 第4頁/共29頁 0992003085-0 [0007] 201126168 [0008] ❹ [0009] [0010] Ο [0011] 、可隨需求更替使用的探針卡。 為了達成前述目的，本發明將探針卡的電源平面獨 立於印刷電路板外，並利用外接導線或外接電源平面的 方式，致使直流電源供應（power supply)自輸入區傳抵 銲點區。本發明提出一種用於探針卡的印刷電路板，該 印刷電路板定義一銲點區、一走線區以及一輸入區；該 銲點區包含複數個第一電源銲墊組，該輸入區包含對應 該些第一電源銲墊組的複數個第二電源銲墊組，且該些 第一電源銲墊組絕緣於該些第二電源銲墊組。 在上述一實施例中，本發明提出一種應用上述印刷 電路板的探針卡，該探針卡包含至少一外接導線，該外 接導線可電性連接第一電源銲墊組與第二電源銲墊組以 供應電源。 在上述之另一實施例中，本發明提出一種應用上述 印刷電路板的探針卡，該探針卡包含至少一外接電源平 面，該外接電源平面可電性連接第一電源銲塾組與第二 電源銲墊組以供應電源。 由於以外接導線或外接電源平面可避免電源因印刷 電路板内的分層或佈線而衰減，因此可以保留較佳的電 源完整性，並進而增進測試的準確度。另一方面，由於 外接電源平面可客製化，可依需求更換，因此其相容性 高，可節省測試廠商的成本支出。有關本發明的詳細技 術内容及較佳實施例，配合圖式說明如後。 【實施方式】 099101583 表單編號A0101 第5頁/共29頁 0992003085-0 201126168 剛 本發明在探針卡m财，將電料面獨立於 印刷電路板，並利科接式電源平面或直接打線連接等 方式，致使探針獲得《供應。有關本發明之詳細說明 及技術内谷，現配合圖式說明如下： [0013] 請參閱「圖2-1」及「圖2 —2」所示，其為本發明之 探針卡10中，一印刷電路板Π實施例之結構示意圖及剖 面示意圖，如圖所示：本實施例的印刷電路板11包含銲 點區12、走線區13以及輸入區14。其中，銲點區^定義 為印刷電路板11靠近内圈包含測試、電源（電源環）等不 同銲墊、接點的設置區域；輸入區14定義為印刷電路板 11靠近外圈包含電性接點丨7、電源銲备16〇等的設置區域 ，藉以讓測試機輸入各式電氣訊號；走線區13則定義為 銲點區I2與輸入區14之間的區域。 ：；；).When the wafer or electronic component is tested, the test machine can use a probe card as a medium to rotate the test signal from the probe card to a device under test (dut). The test result is returned to the testing machine via the probe card for subsequent detection and analysis. In the case of wafer testing, for example, the size of the test machine is limited; 'prices and other factors, when the semiconductor factory is testing the object, it can usually only be tested with a limited number of test machines. Since the test specifications, types, and quantities of the test objects are different from each other, 'the test machine cannot meet the test of various processes or different types of test objects when the test machine is limited. *' = · Conditions. Therefore, it is possible to acquire and expand more test compatibility by modifying the program inside the test machine or by modifying the probe card. The printed circuit board of the conventional probe card is as shown in FIG. 1 , and the printed circuit board 1 can be mainly divided into three areas: the input area 2, the wiring area 3 and the solder joint area 4, wherein the plurality of probe cards are plural. A probe (not shown) may be fixed to a corresponding solder joint or joint of the solder joint area 4. The input area 2 includes a plurality of arrays of recordings 5'. The pads 5 include power pads to provide power input to the tester. The power pads are spatially converted via the 099101583 form number A0101 page 3/29 pages 0992003085-0 201126168 in the routing area 3, and electrically connected to the solder joint area 4 phase source. Solder or power ring to supply the probes. Among them, the power metal wiring of different regions or layers in the routing area 3 is defined as a different power plane, and since the printed circuit board 1 includes a plurality of power supply pads, a plurality of power planes are correspondingly included. [0006] The printed circuit board of the 099101583 η probe card is a multi-layer structure comprising layers of the above plurality of power planes, and a ground layer and a signal layer. Since each of the power planes must be routed in layers or layers in the routing area, the electrical connections are easy to make structural defects due to the layers, or metal conductors. Ke avoids the signal soldering on the printed circuit board and penetrates the printed circuit board, making the routing path of the metal wires too complicated. Therefore, when the power input from the power pad passes through the power plane of the trace area, 'the voltage drop often occurs (^〇118.§6(11"0 port) or noise interference is generated. This will affect the power supply to the probe. Integrity, which leads to test error and thus affects the test results. On the other hand, the food source plane is limited to the wiring in the printed circuit board, so the line is fixed and the expansion is not good enough to meet the diversified testing requirements of the client; The number of planes, it should be noted that the number of wiring layers of the printed circuit board is not only difficult to implement, but also will increase the overall cost and need to be solved. [Summary of the Invention] The purpose of the invention is to solve the above problems, and to propose a Power supply probe card to avoid excessive power supply drop or noise interference from the power supply of the test machine; Another purpose of the present invention is to provide a power plane customizable form number Α0101 Page 4 / 29 pages 0992003085-0 [0007] 201126168 [0008] [0009] [0010] [0011], the probe card can be used as needed. To achieve the foregoing objectives, The invention discloses that the power plane of the probe card is independent of the printed circuit board, and the external power supply or the external power plane is utilized, so that the DC power supply is transmitted from the input area to the solder joint area. The invention provides a method for exploring a printed circuit board of a pin card, the printed circuit board defining a solder joint area, a trace area, and an input area; the solder joint area includes a plurality of first power pad groups, the input area includes corresponding first power sources a plurality of second power pad groups of the pad set, and the first power pad groups are insulated from the second power pad groups. In the above embodiment, the present invention provides an application of the above printed circuit board. a probe card, the probe card comprising at least one external wire electrically connected to the first power pad group and the second power pad group to supply power. In another embodiment described above, the present invention provides A probe card for applying the above printed circuit board, the probe card comprising at least one external power plane, the external power plane being electrically connected to the first power soldering group and the second power pad group for supplying Since external leads or external power planes prevent the power supply from attenuating due to delamination or routing within the printed circuit board, better power integrity can be preserved and test accuracy can be improved. The power plane can be customized and can be replaced according to requirements, so that the compatibility is high, and the cost of the tester can be saved. The detailed technical content and the preferred embodiment of the present invention are described in conjunction with the following description. 】 099101583 Form No. A0101 Page 5 / Total 29 Pages 0992003085-0 201126168 Just the invention is in the probe card, the electric material surface is independent of the printed circuit board, and the Lecco connection power plane or direct wire connection, etc. Causes the probe to be supplied. The detailed description and the technical description of the present invention will now be described with reference to the following drawings: [0013] Please refer to FIG. 2-1 and FIG. 2-2, which are the probe card 10 of the present invention. A schematic diagram and a cross-sectional view of a printed circuit board embodiment, as shown, the printed circuit board 11 of the present embodiment includes a solder joint area 12, a trace area 13 and an input area 14. Wherein, the solder joint area is defined as a setting area of the printed circuit board 11 near the inner ring including different solder pads and contacts such as a test, a power source (power supply ring), and the input area 14 is defined as a printed circuit board 11 including an electrical connection close to the outer ring. The setting area of the power supply soldering station 16 〇, etc., so that the test machine inputs various types of electrical signals; the wiring area 13 is defined as the area between the solder joint area I2 and the input area 14. :;;).
[0014] 須再加以定義、說明的是，實務上，上述的輸入區 14可再區分為測試區141與轉接區142。其中，測試區 141泛指輸入區14的外圈部分，包含複數個電性接點17可 供測試機的彈簧針點觸，該些電性接點17包含測試接點 和電源接點171 (請見「圖2-2」），因此測試機可將電氣 訊號及電源輸入該探針卡1〇 ;轉接區142則包含複數個電 源銲墊16 0，該些電源銲墊16 0電性連接測試區141内對 應的電源接點171 ’如「圖2-2」所示。因此，在以下的 說明中，輸入區14的電源銲墊（組）16，160實質上指轉 099101583 表單編號A0101 第6頁/共29頁 0992003085-0 201126168 接區142内的電源銲墊16〇而言β [0015] 在本發明之印㈣路板11-實施财，該印刷電路 板11之銲點區12包含複數個第一電源銲塾組15，如「圖 2-1」顯示數量為兩組，分別為ρ]與~ ;每—第—電源辉 塾組15包含複數個電源銲墊15〇，且同一第一電源鲜塾組 15的電源銲墊15G彼此電性連接，如「圖2-1」顯示的 ΡΓ Ρ2兩個不同之第一電源銲墊組15，分別包含四個匕 〇 電源銲墊150與四個p2t源銲塾150，其中四個同一組^ 電源銲墊15G彼此電性連接，四個另—組的^電源辉塾 150彼此電性連接；該些第一電源銲墊組15可設置於該銲 ‘點區12的預設位置，例如「圖2-1」顯示其沿著圓形印刷 電路板11的圓心呈環狀排列。 [0016] 該印刷電路板11的輸今區丨4則包含對應該些第一電 源銲塾組15的第二電源銲墊組16，如「圖2]」顯示數量 D 為兩組，分別為p’】，p’2;每一第二電源銲墊組16包含 複數個電源銲塾160，且同-第二電源鲜塾組16的電源鲜 墊160彼此電性獨立，如「圖2_丨」顯示之ρ，ι，p，2兩第 二電源銲墊組16分別包含四個p，1電源銲墊16〇與四個p， 電源銲墊160，且四個|>’丨電源銲墊16〇彼此電性獨立，四2 個P 2電源銲墊160彼此電性獨立；並且，銲點區12的每 一第一電源銲墊組15(電源銲墊150)與輸入區14的每一 第二電源銲墊組16(電源銲墊160)彼此電性絕緣。第二電 源銲墊組16係傳輸直流電流，當然直流電流係由測試機 099101583 表單編號A0101 第7頁/共29頁 0992003085-0 201126168 提供。 [0017] 承前所述’由於本發明的探針卡10於測試時，傳送 抵達銲點區12的電源供應係來自外接式的電源平面或線 ^因此尚未外接電源平面或線路前，第1源輝塾組 5與第二電源銲塾組16彼此電性絕緣。然而，須說明的 第-«、銲倾15與第二„料組16之間彼此絕 緣，不表神較、㈣13内所㈣金祕線；實務上， 走線區13仍可設置其他測試銲墊須使用到的測試線盘接 地線。更進—步地’走線區13亦可依践留預備使用的 電源平面，只是在正常情況下，該些預備使用的電源平 面與第-電祕墊組15、第二電源銲胁16相互絕緣。 [0018] 請參閱「圖3-1」和「圖3_2」的上視圖和戴面示音 圖，在-實關中，本發明之探針卡跡走線區13範圍 内，以外接導線21電性連接第一電源銲墊組15與第二電 源銲墊組16而供應電源。請參見「圖3_2」並配合「圖 3-1」，該探針卡20包含：一印刷電路板u、至少一待測 物針組22以及至少-外接導線21 ;每—待测物針組_ 含至少一電源探針220，該電源探針22〇_端電性連接其 中一第一電源銲墊組15之一電源銲墊15〇，另—端用以點 觸待測物；該外接導線21兩端則分別電性連 針22〇連接的同-該第-電源鲜墊組15之電源鲜 及對應第二電源銲墊組16之電源銲墊160(如「圖 顯示連接Ρ#Ρ’2);藉此’來自測試機的電源供應可自 099101583 表單編號Α0101 第8頁/共29頁 0992003085-0 201126168 第二電源銲塾組16之電源銲·塾⑽輸入並藉該外接導線 21傳遞至該電源探針220。其中，_導線心利用同 軸導線或者其他導線，以跳線的方式分別連接於輸入區 14與銲點區12。每_第二電源鮮墊組16藉由外接導線21 傳輸直流電流到其對應的第一電源銲墊組1 5 ^ [0019] 請再參閱「圖4-!」和「圖4_2j的上視圖和截面示 意圖，在另一實施例中，本發明之探針卡30以外接電源 〇 平面31連接第一電源銲墊組15與第二電源銲墊組16而供 應電源。該探針卡30包含：一印刷電路板u、至少一待 測物針組32以及至少一外接電源平面31 ;每一待測物針 組32包含至少一電源探針320 ’該電源探針32〇 —端電性 連接其中一第一電源銲墊組15之一電源銲墊15〇，該外接 電源平面31 —端電性連接該電源探針32〇連接的同一該第 一電源銲墊組15之電源銲墊150，另一端則電性連接至對 應的第二電源銲墊組16之電源銲墊16〇 ;藉此，來自測試 〇 機的電源供應可自第二電源銲墊組16之電源銲墊160輸入 ’並藉該外接電源平面31傳遞至該電源探針320。每一第 二電源鲜塾組16藉由外接電源平面31傳輸直流電流到其 對應的第一電源銲墊組15。 [0020] 上述的外接電源平面31可替代習用技藝中印刷電路 板内部的電源鋪設’以降低印刷電路板丨丨内多層佈線的 複雜度與成本；同時，由於外接電源平面31的電源舖設 變化性大’且可依客戶訂製，因此本發明無須重製探針 099101583 表單編號A0101 第9頁/共29頁 0992003085-0 201126168 卡30的印刷電路板η，便可滿足客戶使用的彈性與需求 ’亦能提供異常處理時的測試運用。此外，由於外接電 源平面31只有電源的佈線，不需要考慮習用技藝中印刷 電路板走線區的電源鋪設問題，因此，佈線路徑的複雜 度低，自電源婷塾1 6 〇輸入的電源傳經外接電源平面31時 ，可以避免電壓下降或雜訊干擾，電源完整性較習用技 藝中印刷電路板佳。 [0021] 明進一步參閱「圖5」所示:’:在實施例中，該外接 電源平面31包含一接地層311、一絕緣層312與-電源平 面層313，其中，該絕緣層312位於該接地層311與該電 源平面層313之間，該接地層311接到一低準位電壓。因 此，當該外接電源平面21以該接地層311面對該探針卡如 而外接時（請參考「圖4-2」），鄰近探針卡3〇之接地層 311與絕緣層312可保護該電源平面層313不受來自印刷 電路板11的電氣干擾。 [0022] 另一方面，該外接電源平面31可以軟性電路板 (flexible printed circuit，FPC)，或是以子卡的 型式外接於該印刷電路板U。「圖6_丨」和「圖6_2」顯 示一子卡形式的外接電源平面31a示意圖，該子卡形式的 外接電源平面31a可以插接喪合的方式，組裝於印刷電路 板11上，形成電性連接。該外接電源平面31a包含一第一 連接部314與-第二連接部315，該印刷電路板"對應該 第一連接部314及第二連接部315開設第一卡槽lu與第 099101583 表單編號A0101 第10頁/共29頁 0992003085-0 201126168 二卡槽112，致使該第—連接邱 之第 連接。卩314可播設於該輝點區12 31__二::=== =15可插設於該輸入區14之第二卡槽ιΐ2，且位於 =-連接抑5的複數電性接點317與該輸人區Η對應的 Γ鲜塾⑽電性連接，藉此插嵌固定於印刷電路板η上 並形成電性相連。 [0023] 〇 此外，如「圖7」所示，本發明可藉由短路（Short) 複數個外接電源平面3卜以實質上擴大電源平面，提升 電源70整性。舉例來說，—應用上述印刷電路板^的探 針卡40包含powerl、p〇wer2兩外接電源平面31，每一 外接電源平面31連接第“電源銲墊組_—侧定義為探 針侧’該外接電源平面31對應於測試區141的電源接點 171 (”青參閲圖2-2」）則定義為輸入接點，例如： P〇Wer2外接電源平面31連接於轉接區ί42的P，2電源銲墊 ❹ 160，4Ρ 2電源碑备電性連接於測試區“I的對應電 源接點171即為所定義的輸入接點171a。 [0024] 測試時，若只使用探針卡4〇的p〇wer丨外接電源平面 31 ’而未使用power2外接電源平面31，則可將兩外接電 源平面31的探針側（或第一電源銲墊組15中的~％電源 it墊）藉一連結結構41使其彼此短路（sh〇rt)而電性連通 ’俾使電源可自p0werl、p〇wer2的外接電源平面31供應 而傳抵銲點區12。同時，該未使用p0wer2外接電源平面 099101583 表單編號A0101 第11頁/共29頁 0992003085-0 201126168 31所對應的輸入接點171a以一絕緣結構42覆蓋，使該輸 入接點171a絕緣於測試機的彈簣針，以避免測試機判讀 時發生錯誤。如此可增大power 1使用的外接電源平面31 ，以提升電源的完整性；其中，該連結結構41可為一金 屬導線、或一金屬片或直接以銲錫方式導通；而該絕緣 結構42可為一絕緣膠帶或一塑膠片。 [0025] 惟以上所述者，僅為本發明之較佳實施例，非欲侷 限本發明專利之專利保護範圍，故舉凡運用本發明說明 書及圖式内容所為之等效變化與修飾，均同理包含於本 發明之權利保護範圍，合予陳明。 【圖式簡單說明】 [0026] 本發明的實施方式係結合圖式予以描述： [0027] 「圖1」為習知探針卡的一印刷電路板示意圖； [0028] 「圖2-1」為本發明一印刷電路板一實施例之結構示意圖 9 [0029] 「圖2-2」為本發明一印刷電路板一實施例之剖面示意圖 [0030] [0031] [0032] [0033] [0034] 099101583 「圖3-1」為本發明一探針卡實施例之上視示意圖； 「圖3-2」為本發明一探針卡實施例之截面示意圖； 「圖4_1」為本發明另一探針卡實施例之上視示意圖； 「圖4-2」為本發明另一探針卡實施例之截面示意圖； 「圖5」為本發明一外接電源平面實施例之結構示意圖； 表單編號A0101 第12頁/共29頁 0992003085-0 201126168 [0035] 「圖6-1」為本發明一外接電源平面用於一探針卡之截面 示意圖； [0036] 「圖6-2」為本發明另一夕卜接電源平面實施例之立體示意 圖；以及 [0037] 「圖7」為本發明另一外接電源平面實施例之立體示意圖[0014] It should be further defined and explained that, in practice, the above-mentioned input area 14 can be further divided into a test area 141 and a transition area 142. The test area 141 generally refers to the outer ring portion of the input area 14, and includes a plurality of electrical contacts 17 for the spring needles of the test machine. The electrical contacts 17 include test contacts and power contacts 171 ( Please refer to "Figure 2-2"), so the test machine can input the electrical signal and power into the probe card 1; the transfer area 142 includes a plurality of power pads 16 0, the power pads 16 0 electrical The corresponding power contact 171' in the connection test area 141 is as shown in "Fig. 2-2". Therefore, in the following description, the power pads (groups) 16, 160 of the input region 14 are substantially referred to as 099101583. Form No. A0101 Page 6/29 pages 0992003085-0 201126168 Power pads 16 in the junction 142 [0015] In the printing (four) circuit board 11 of the present invention, the solder joint area 12 of the printed circuit board 11 includes a plurality of first power supply solder group 15, as shown in "Figure 2-1". The two groups are respectively ρ] and ~; each - the first power supply illuminating group 15 includes a plurality of power pads 15 〇, and the power pads 15G of the same first power fresh simmer group 15 are electrically connected to each other, such as 2-1" shows ΡΓ 两个 2 two different first power pad groups 15 respectively comprising four 匕〇 power pads 150 and four p2t source pads 150, four of which are the same group ^ power pads 15G Electrically connected, four other sets of power supply 塾 150 are electrically connected to each other; the first power pad group 15 can be disposed at a preset position of the soldering point area 12, for example, "Figure 2-1" It is shown that it is arranged in a ring shape along the center of the circular printed circuit board 11. [0016] The input area 4 of the printed circuit board 11 includes a second power pad group 16 corresponding to the first power supply group 15, as shown in FIG. 2, the number D is two groups, respectively p'], p'2; each of the second power pad groups 16 includes a plurality of power pads 160, and the power pad 160 of the same-second power group 16 is electrically independent of each other, such as "FIG. 2_ ρ"Display ρ, ι, p, 2 two second power pad groups 16 respectively contain four p, 1 power pad 16 〇 and four p, power pad 160, and four |> '丨 power supply The pads 16 are electrically independent of each other, and the four P 2 power pads 160 are electrically independent of each other; and each of the first power pad groups 15 (power pads 150) of the pad region 12 and the input region 14 Each of the second power pad groups 16 (power pads 160) is electrically insulated from each other. The second power pad group 16 transmits DC current. Of course, the DC current is provided by the test machine 099101583 Form No. A0101 Page 7 of 29 0992003085-0 201126168. [0017] As described above, because the probe card 10 of the present invention is tested, the power supply that reaches the solder joint area 12 is from an external power plane or line. Therefore, the first source is not yet connected to the power plane or line. The illuminating group 5 and the second power soldering group 16 are electrically insulated from each other. However, the -«, the welding tip 15 and the second group 16 to be insulated from each other are not insulated from each other, and (4) 13 (4) gold secret line; in practice, the test area 13 can still be set with other test welding. The test lead wire grounding wire to be used for the pad. Further step-by-stepping area 13 can also be used to maintain the power plane to be used, but under normal circumstances, the power plane and the first-precision The pad group 15 and the second power source soldering ring 16 are insulated from each other. [0018] Please refer to the top view and the surface sounding diagram of "Fig. 3-1" and "Fig. 3_2", in the actual closing, the probe card of the present invention In the range of the trace area 13 , the external lead 21 is electrically connected to the first power pad group 15 and the second power pad group 16 to supply power. Referring to FIG. 3_2 and FIG. 3-1, the probe card 20 includes: a printed circuit board u, at least one object group 22 to be tested, and at least an external lead 21; each of the objects to be tested _ containing at least one power supply probe 220, the power supply probe 22 〇 _ end is electrically connected to one of the first power pad group 15 of the power pad 15 〇, the other end is used to touch the object to be tested; The two ends of the wire 21 are respectively electrically connected with the pin 22〇, the power supply of the first-power fresh pad group 15 and the power pad 160 corresponding to the second power pad group 16 (for example, “the figure shows the connection Ρ#Ρ” '2); by this 'power supply from the test machine can be from 099101583 Form No. 1010101 Page 8 / Total 29 Page 0992003085-0 201126168 The second power supply welding group 16 power welding · 塾 (10) input and borrow the external wire 21 The power supply probe 220 is transmitted to the power supply probe 220. The _ wire core is connected to the input area 14 and the solder joint area 12 by a jumper wire by using a coaxial wire or other wires. Each _ second power fresh pad group 16 is connected by an external wire. 21 Transfer DC current to its corresponding first power pad group 1 5 ^ [0019] Please refer to Figure 4! and Figure 4-2j is a top view and a cross-sectional view. In another embodiment, the probe card 30 of the present invention is connected to the first power pad group 15 and the second power pad group 16 to supply power. The needle card 30 includes: a printed circuit board u, at least one object group 32 to be tested, and at least one external power plane 31; each of the object group 32 includes at least one power probe 320 'the power probe 32 〇 - The power supply is electrically connected to one of the first power pad groups 15 and the power supply pad 15 is electrically connected to the power supply of the same power pad group 15 connected to the power probe 32 The pad 150 is electrically connected to the power pad 16 of the corresponding second power pad group 16; thereby, the power supply from the test device can be supplied from the power pad of the second power pad group 16. The 160 input ' is transferred to the power supply probe 320 by the external power plane 31. Each of the second power freshener groups 16 transmits a direct current to the corresponding first power pad group 15 by the external power plane 31. [0020 The above external power plane 31 can replace the traditional Chinese art The power supply inside the brush circuit board is used to reduce the complexity and cost of the multilayer wiring in the printed circuit board. At the same time, since the power supply of the external power supply plane 31 is highly variable and can be customized, the present invention does not need to be heavy. Probe 099101583 Form No. A0101 Page 9 / Total 29 Page 0992003085-0 201126168 The printed circuit board η of the card 30 can meet the flexibility and demand of the customer's use. It can also provide test applications for abnormal handling. In addition, due to external connection The power plane 31 has only the wiring of the power supply, and does not need to consider the power supply problem of the printed circuit board cabling area in the conventional technology. Therefore, the complexity of the wiring path is low, and the power input from the power supply is transmitted through the external power plane 31. It can avoid voltage drop or noise interference, and the power integrity is better than the printed circuit board in the conventional technology. [0021] Further, refer to FIG. 5: ': In the embodiment, the external power plane 31 includes a ground layer 311, an insulating layer 312 and a power plane layer 313, wherein the insulating layer 312 is located Between the ground layer 311 and the power plane layer 313, the ground layer 311 is connected to a low level voltage. Therefore, when the external power plane 21 is externally connected to the probe card by the ground layer 311 (refer to FIG. 4-2), the ground layer 311 and the insulating layer 312 adjacent to the probe card 3 can be protected. The power plane layer 313 is not subject to electrical interference from the printed circuit board 11. [0022] On the other hand, the external power supply plane 31 may be a flexible printed circuit (FPC) or externally connected to the printed circuit board U in the form of a daughter card. Figure 6_丨 and Figure 6_2 show a schematic diagram of an external power plane 31a in the form of a daughter card. The external power plane 31a in the form of a daughter card can be inserted into the printed circuit board 11 to form a battery. Sexual connection. The external power plane 31a includes a first connecting portion 314 and a second connecting portion 315. The printed circuit board has a first card slot lu and a 099101583 form number corresponding to the first connecting portion 314 and the second connecting portion 315. A0101 Page 10 of 29 0992003085-0 201126168 Two card slots 112, causing the first connection to connect Qiu.卩 314 can be broadcasted in the highlight area 12 31__ 2::====15 can be inserted in the second card slot ι 2 of the input area 14, and the plurality of electrical contacts 317 located at =- connection 5 The Γ fresh 塾 (10) corresponding to the input area 电 is electrically connected, thereby being inserted and fixed on the printed circuit board η and electrically connected. [0023] Further, as shown in FIG. 7, the present invention can substantially increase the power plane by shorting a plurality of external power planes 3 to improve the integrity of the power source 70. For example, the probe card 40 of the above printed circuit board includes power1 and p〇wer2 two external power planes 31, and each external power plane 31 is connected to the “power pad group—the side is defined as the probe side”. The external power plane 31 corresponds to the power contact 171 of the test area 141 ("see FIG. 2-2"), and is defined as an input contact. For example, the P〇Wer2 external power plane 31 is connected to the P of the transfer area ί42. , 2 power pad ❹ 160, 4 Ρ 2 power supply is electrically connected to the test area "I corresponding power contact 171 is the defined input contact 171a. [0024] When testing, only use the probe card 4 If the external power plane 31' is not used, and the power supply plane 31 of the power supply plane 31 is not used, the probe side of the two external power planes 31 (or the ~% power supply pad in the first power pad group 15) can be borrowed. A connection structure 41 is short-circuited and electrically connected to each other so that the power supply can be supplied from the external power supply plane 31 of the p0werl, p〇wer2 to the solder joint area 12. At the same time, the external power supply of the p0wer2 is not used. Plane 099101583 Form No. A0101 Page 11 / Total 29 Pages 0992003085-0 201126168 The corresponding input contact 171a of 31 is covered by an insulating structure 42 to insulate the input contact 171a from the tester's magazine pin to avoid an error when the tester interprets. This can increase the external power plane used by the power 1. 31. The connection structure 41 can be a metal wire, or a metal piece or directly soldered; and the insulation structure 42 can be an insulating tape or a plastic sheet. [0025] The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the patent protection of the present invention. Therefore, the equivalent changes and modifications of the present invention and the contents of the drawings are equally included in The scope of the present invention is defined by the accompanying drawings. [0026] The embodiments of the present invention are described in conjunction with the drawings: [0027] "FIG. 1" is a printed circuit of a conventional probe card. FIG. 2 is a schematic structural view of an embodiment of a printed circuit board according to the present invention. [0029] FIG. 2-2 is a cross-sectional view showing an embodiment of a printed circuit board according to the present invention [0030] ] [0031 [0033] [0034] FIG. 3-1 is a top view of a probe card embodiment of the present invention; FIG. 3-2 is a schematic cross-sectional view of a probe card embodiment of the present invention; FIG. 4 is a top plan view of another probe card embodiment of the present invention; FIG. 4-2 is a schematic cross-sectional view of another probe card embodiment of the present invention; FIG. 5 is an external power plane of the present invention. FIG. 6-1 is a schematic cross-sectional view of an external power supply plane for a probe card according to the present invention; FIG. 6-1 is a cross-sectional view of an external power supply plane of the present invention; [0036] Figure 6-2 is a perspective view of another embodiment of the power supply plane according to the present invention; and [0037] FIG. 7 is a perspective view of another external power plane embodiment of the present invention
【主要元件符號說明】 [0038] 10， 20，30，40 ·..探針卡 [0039] 11 .......印刷電路板 [0040] 111 ......第一卡槽 [0041] 112 ......第二卡槽 [0042] 12 .......銲點區 [0043] 13 .......走線區， [0044] 14 .......輪入IS 一—> > ' [0045] 141 ......測試區 [0046] 142 ......轉接區 [0047] 15 .......第一電源銲墊組 [0048] 150, 160 . · . ·電源銲墊 [0049] 16 .......第二電源銲墊組 [0050] 17.......電性接點 [0051] 171......電源接點 0992003085-0 099101583 表單編號A0101 第13頁/共29頁 201126168 輸入接點 [0052] 171a [0053] 21.......外接導線 [0054] 22，32......電源探針組 [0055] 220, 320 .....電源探針 [0056] 31, 31a......外接電源平面 [0057] 311.......接地層 [0058] 312.......絕緣層 [0059] 313.......電源平面層 [0060] 314.......第一連接部 [0061] 315.......第二連接部 [0062] 316, 317.....電性接點 [0063] 41......•連接結構 [0064] 42.......絕緣結構 099101583 表單編號 A0101 第 14 頁/共 29 頁 0992003085-0[Description of main component symbols] [0038] 10, 20, 30, 40 ·.. probe card [0039] 11 .......printed circuit board [0040] 111 ... first card slot [0041] 112 ... second card slot [0042] 12 .... solder joint area [0043] 13 .... trace area, [0044] 14 ... ....round IS ->> ' [0045] 141 ... test area [0046] 142 ... transfer area [0047] 15 ....... First power pad set [0048] 150, 160 . . . · Power pad [0049] 16 .... Second power pad set [0050] 17....... Electrical connection Point [0051] 171... Power contact 0992003085-0 099101583 Form number A0101 Page 13 of 29 201126168 Input contact [0052] 171a [0053] 21.......External wire [ 0054] 22,32...power probe set [0055] 220, 320 ..... power probe [0056] 31, 31a... external power plane [0057] 311.. ..... Ground layer [0058] 312.. Insulation layer [0059] 313....... Power plane layer [0060] 314....... First connection portion [ 0061] 315.......Second connection [0062] 316, 317.....Electrical contact [0063] 41...•Connection structure [0064] 42.... ...insulation structure 09910 1583 Form Number A0101 Page 14 of 29 0992003085-0