TWI299113B - - Google Patents

Description

1299113 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a needle card, and more particularly to a probe card that can transmit a pair of differential signals. [Prior Art] The general probe card is designed to facilitate the mass production test of the semiconductor production line. It provides a probe corresponding to the test contact for the circuit design of the electronic component to be tested, and transmits it as an output or receive test signal. The medium, the actual consideration of the electrical operation function of the electronic components, the circuit of the probe card is set 5

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The Metering &amp; 1 measurement feature provides the electrical measurements required for the electronics. Especially for the display panel produced by the optoelectronic industry, the general display panel drives the display screen with the W-frequency sweeping cat signal, and the driving chip used is a differential signal that outputs high speed, low noise and low electromagnetic interference (Differentlal Signaling). Mainly, at the same time, it is more necessary to drive the quality and reliability of the electronic components of the wafer towel. For this reason, the chip supplier needs to ship the quality of the 7L parts of the Sister Electronics, so that the electronic components pass the accurate electric test. Therefore, the test process towel test money f is stable and not distorted, in order to provide the electronic component (4) electrical measurement conditions; the above electronic element = the difference between the use of the pure number, the need to be the same group current, the opposite direction of flow (four), There is a specific ED (anti-impedane) matching effect, so the conventional probe card only considers the circuit design corresponding to the element to be tested, and can not make the anti-matching and electrical coupling effect of the transmission differential signal. Only the test element and H can't judge whether the component can operate within the required electricity 20 1299113 specification, so that the reliability of the electrical measurement is lost. [Inventive content] , Is the primary object of the present invention is to provide a differential signal for transmission of the probe card, so that the electrical system is provided to test the condition of electronic components having the desired characteristics of the test signal, thus maintaining the reliability of measuring. 15 ^ Before the achievement, the present invention provides a probe card capable of transmitting a differential signal pair comprising a circuit board and a plurality of differential probes, the circuit board being provided with an electronic circuit and having an upper surface And a lower surface, the two surface systems are provided with a plurality of f-phase _ read points, the f-sub-circuit has a plurality of m-th lines, and the first-conductor wires are paired adjacent to each other Lang, the adjacent two of the first-wires and maintain each other's impedance matching 'and each of the first __ wire has at least - the coated two wires' of the second wire for electrical grounding = The pins are disposed on the lower surface of the circuit board, and each of the stationary needles has a two-coaxial line, the coaxial cable has a sleeve, two signal lines and at least a body. The sleeve is sleeved with the two signal lines and the insulation performance. Corresponding to the setting of Lin riding head, Wei, Lai 纽 = = and is not conductive insulation material, the casing, the two-needle it η 仏 仏 皆 line are all conductive and connected to the Γ Γ Γ Each of the signal lines is connected to each of the solder joints on the lower surface, so that the sleeve is electrically connected to the -wire 'the two signals The relative electrical impedance electrically connected to the adjacent two-conducting μ 2 signal lines is such that the impedance matching can be maintained and connected to the same - the first conductor is thus matched by the 20 1299113 The solder joint is electrically connected to the tester for measuring the above electronic components. And electrically contacting each of the needles with the electronic component, the probe detects the electronic component. </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; 1 is a top view of the first preferred embodiment; a second view is a bottom view of the first preferred embodiment; and a fourth view is the first preferred The schematic diagram of the electronic circuit of the embodiment is shown in the layout design of the first and second wires on the surface of the circuit board; the fifth figure is a cross-sectional view taken along line 5-5 of the fourth figure; The schematic diagram of the differential probe of the embodiment is shown in the circuit board wiring area and the connection relationship between the probe base and the differential probe; the seventh figure is the sectional view of the 7-7 line of the sixth figure; A schematic diagram of a coaxial probe of a preferred embodiment is shown as a circuit board wiring area and a connection relationship between the probe holder and the coaxial probe; 20 is a cross-sectional view of the line 9-9 of the eighth figure; A side view of a second preferred embodiment of the present invention; A top view of the second preferred embodiment; a twelfth view of the jumper of the second preferred embodiment, showing the arrangement of the jumper in the wiring area and the jumper area of the circuit board, and the differential probe 1299113 pin connection relationship; twelfth figure is a cross-sectional view of the 13th line of the twelfth figure; FIG. 1 is a schematic diagram of the electronic circuit structure of the third preferred embodiment provided by the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10 is a schematic view showing a fifth embodiment of the present invention; FIG. The electronic structure of the seventh preferred embodiment of the present invention is not intended; and the nineteenth embodiment is the probe holder of the eighth preferred embodiment of the present invention.思思,图; 15 _ f 十图 is a schematic diagram of the ninth preferred embodiment of the differential probe provided by the present invention; the tenth aspect of the present invention provides the tenth better practical differential translation Needle structure is not intended; material = twenty-two eyes Schematic diagram of the structure of the differential probe of the recording material; ^13=The differential probe of the twelfth preferred embodiment provided by the present invention, and the mouth structure are not intended; The first preferred embodiment of the present invention is a probe cartridge for transmitting a differential signal pair, including a circuit board 10 and a probe holder 20, a plurality of differential probes 3 And a plurality of coaxial probes 40, the circuit board 10 defines an upper surface 1〇1, a lower surface 1〇2, an outer circumference test area 103, and an inner circumference wiring area 1〇4, the circuit board 1〇5 is provided with an electronic circuit 11, and the second figure is referred to, and in the test area 1〇3: the two surfaces 〇1, 102 are respectively formed with a plurality of metal points 51 in contact with the electronic circuit η. And 52, on the two surfaces 1〇1, 1〇2 of the wiring area 104, a plurality of metal solder joints 53, 54 are formed in contact with the electronic circuit 11, and a part of the solder joints of the upper surface 1〇1 The 51 series is electrically connected to a test machine (not shown), and the test machine outputs a differential signal to the probe card 1, and the lower surface is 1〇2 The sub-soldering point 54 is electrically connected to the probes 30, 40, and the third figure refers to, wherein: the electronic circuit 11 as shown in the fourth figure has a plurality of first and second wires 12, 13, The I5 solder joints 51 and 53 of the test area 1〇3 and the wiring area 1〇4 are distributed, and the first wires 12 are adjacent to each other to transmit the differential • #号, and the adjacent pitch is approximately the respective wires. The line of 12 is wide, and the second wire 13 is disposed along the two sides of the pair of first wires 12 and below, and the distance between each of the second wires and the first wire 12 is greater than the adjacent two. The second wire 13 is used for the electrical grounding 20 (Sround), and the structure includes a grounding wire 130, a grounding through hole 131, and a grounding layer 132. The grounding wire 130 is located thereon. The surface 1〇1 is disposed along the side of each pair of the first wires 12, and the ground vias 131 are vertically penetrated through the circuit board 1〇 to the two surfaces 101 and 102, and the ground layer 132 is disposed in the circuit board 1〇. Formed by the same layer of planar process under each pair of the first wire 12 to be 1299113 and connected to the ground via 131, the ground line 130 The ground layer 132 under the first wire 12 serves as a reference for the electrical impedance of each of the first wires 12, and has an electrical protection function for preventing external noise interference signal transmission. ^ The ground layer 132 is connected to the test machine. The potential of the stage is zero, and when the second wire 12 is in the wiring area 1〇4, it is required to vertically penetrate to the lower surface 102 of the circuit board 1 , and the grounding holes 131 are also provided on both sides as the first The electrical impedance of the wire 12 is referenced and electrically shielded, and the sixth figure is referred to. The probe holder 2, as shown in the third and sixth figures, is disposed on the wiring area 1〇4 of the lower surface 102 of the circuit board 10, and has a fixing ring 21 and an adhesive 22, both of which are The fixing ring 21 is electrically grounded, and the adhesive 22 is used for fixedly connecting the probes 3〇, 4〇 to the fixing ring 21, and the coaxial probes 4 are connected. 〇 and the differential 〇 3 呈 are staggered. Each of the differential probes 30, as shown in the sixth and seventh figures, has a two-pin κ 31 and a coaxial line 32. Each of the coaxial wires 32 is provided with a casing, and an insulator 34 covered by the sleeve 33. And the signal 35 covered by the insulator 34, and the sleeve 33, each of the insulators and each of the signal lines have a corresponding gap. Each of the insulators 34 is an insulating material having no conductivity. 33 and each of the signal lines are electrically conductive metal materials, and the two ends of the 20 忒k line 35 are protruded from the insulator 34 and are not covered by the insulator ,, and one of the exposed ones can be defined. The first end 351 is electrically connected to the solder joint 54 corresponding to the first wire 12, and the second end 352 is provided with each of the needles 31; the needle is 31 a conductor of appropriate hardness and conductivity for contacting a test portion of the electronic component 12299113 (not shown), the soldering point 54 corresponding to the through hole 131 of the sleeve, the sleeve is always connected, the grounding 22 is fixedly connected to the fixing ring 21, and by the adhesive agent, the 兮 势 u ^ two signal lines 35 The relative electrical conductivity of the two signal lines 35 is adjusted to the relative electrical impedance of the two first wires 12 by the change in the size of the conductive power. &amp; the coaxial probe 4 (), 々, line 41 and the needle, as shown in the eighth and ninth figures, the structure of the single-core coaxial line 41 = coaxial line of the needle 3 32, but only a sleeve 42 is covered with the insulation = 34 and the letter of the 35, the sleeve is a conductive metal material and is electrically connected to the ground via m, and by (4) 22 is fixedly connected to the fixing ring 21, and the signal line % of the coaxial probe 40 is electrically connected to the electronic circuit η through the fresh spot 54. Therefore, when the needle 31 of the horizontal axis probe 4G contacts the test signal output of the electronic component to be tested At the location, the test signal can be returned to the test machine, and the sleeve 42 covers the structure of the signal line 35 to maintain the return signal without attenuation and noise interference, and when the electronic component is to receive Other signals from the electronic circuit 11 other than the differential signal can also be used to transmit other signals to the electronic component and maintain the signal without attenuation and noise interference. Therefore, the test area 103 of the probe card 1 is connected to the test machine that outputs the differential signal pair, and the differential signals are transmitted to the signal lines 35 of the differential probes 30 by the first wires 12, Cooperating with the layout design of the second wire 13 around the first wire 12, and the process of transmitting the differential money in the process of transmitting the differential money by the sleeve 33 around the junction of the two signal lines 35, and the differential motion effect, Scale = line 35 can maintain a specific capacitance, zygote - brake. The anti-matching characteristic is that the differential signal of the panel driving chip can be transmitted to meet the measurement specification, and the coaxial detection structure can also maintain the actual measured back-transmission subtraction, thus making the The probe 卞1 has excellent electrical reliability.

Of course, if the electronic component has a design of the contact point, then the position of the needle 31, the number of the needle needs to conform to the actual detection contact point, so the present invention 4 also provides another design which can be matched with the design of the electronic component contact. 10 cases are implemented, such as the probe card 2 shown in the tenth and eleventh figures, having a circuit board 60, the cymbal holder 2 〇, the probes such as 4 〇, and a plurality of jumpers %, wherein: The circuit board 60 can also define the upper surface 101 and the lower surface 1〇2, and the copper test area 103, the wiring area 601 and the jumper area 602 distributed by the opposite direction, and the circuit board 6 is arranged and arranged. There are electronic circuits 61, and as shown in the tenth and twelfth figures of i5, the two tables in the test area 1〇3 are from (9).

The bright spots 51 and φ are respectively formed in contact with the electronic circuit 61, and the solder joints are formed on the two surfaces 1 (H, (10) of the wiring region 6G! 53, 54, on the two surfaces 10 102 of the jumper area 6 〇 2 are respectively formed with the electronic circuit 61 contact point 2 〇 55, 56, the upper surface ΗΠ _ point 51 _ electrically connected to the test a machine (not shown) 'the lower surface 102 of the Xue, the point 56 is electrically connected to the probes 30, 40, the electronic circuit 61 has the first and second wires u, 13, distributed from the The point 51 of the test area 103 to the fresh point 11 of the wiring area 6〇1

(I J299113) The jumpers 7 are provided on the upper surface 1〇1 and are connected from the solder joints 53 of the wiring region 601 to the solder joints of the jumper region 6〇2, and each of the jumpers has - the outermost protective film 71 and the absence of each of the needles 31, the internal structure of which is the same as the coaxial coil structure of the differential probe 3', and will not be described herein, FIG. For reference, the protective film is coated with the coaxial line 32 and is an electrically non-conductive insulating material, which can be used to protect the inside: = the coaxial line 32 is not scratched or damaged, except for the jumper 70; #胄二二的信号线35, the two ends of the sleeve 33 are respectively connected with a metal wire 72 of the same material. The first and second wires 12 and 13 are connected to the wiring area from the test zone 1 (10). After the solder joint 53 of the upper surface 101 of the 602 is not directly penetrated to the lower surface 1〇2', the signal line 35 and the metal line 72 of each end of each of the jumpers 70 are respectively connected to the first one. The wire 12 and the second wire 13 are soldered to each of the solder joints 53, and the jumper 7 and the other end of the second &amp; signal I5 line 35 and the metal wire 72 are soldered. The solder joints of the jumper area 6〇2 are not connected to the solder joints 56 of the differential probes 3 and the solder joints 56 connected to the sleeves &amp; Therefore, according to the test contact design of the component to be tested, for each of the corresponding W positions of the test contacts, the solder joints of the jumper area 6〇2 connected to the jumpers 70 are designed to be 55 bits. The probe card 2 can be used not only to transmit the test signal of the differential signal pair, but also to the electronic components of a plurality of different layout designs. See also the fourth embodiment of the present invention as shown in FIG. The electronic circuit I4 of the preferred embodiment is designed to save space in the circuit layout compared to the first preferred embodiment. The first wire 12 is only disposed under the 12 1299113. The ground layer 132 is provided with other signal lines. The ground layer 132 also serves as an electrical impedance reference for each of the first wires 12 to maintain impedance matching of the differential signal transmission.

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20 Please also refer to the electronic circuit 15 of the fourth preferred embodiment of the present invention as shown in the fifteenth figure. (4) the first wire 12 is not disposed on the upper surface plate, but the first wire 12 is Between the two grounding layers 132, in the test area 103, the towel is only connected to the solder joint 5 connected to the testing machine. In the wiring area, only the light is connected to the probes 3〇, 4〇. The point % (not shown in the figure) not only maintains the impedance matching characteristics of the differential signal transmission, but also has better electrical protection along the electrical ground above and below the differential signal; of course, if the space is saved to save the circuit layout Considering the structural change of the third embodiment, the other signal lines are disposed on both sides of the first wire 12 instead of the second wires 13' as shown in the sixteenth embodiment. The electronic circuit 16 of the fifth preferred embodiment. Please refer to the electronic circuit 17 of the sixth preferred embodiment provided by the present invention as shown in FIG. 17, and the first line 12 of the fourth preferred embodiment has a widened video guide. Path, the electronic circuit 丨=the pair of upper and lower adjacent first-conductors 171 are disposed on the ground layer==, and the adjacent gaps are approximately the same as the thickness of each of the first wires 171, and the impedance matching of the C differential signals The characteristic 'and a wider signal; the low path parasitic resistance effect of the lead circuit increases its conductivity; of course, if the space material of the == is considered, the knot of the third preferred embodiment may be the same as the 'th' Ϊ7 The other signal lines are disposed on both sides of the lead and the line 171 instead of the ~ lead-wire 13'. The electronic circuit 18 of the seventh embodiment of the present invention is provided as shown in Fig. 18. Please also refer to the probe holder 80 of the present invention as shown in the nineteenth figure, which has a fixing ring 8 and a good implementation of the metal film 83'. The functional structure is compared with the above-mentioned '5 probe holder 2 The torn ring ^ ring ^ ^: As for the metal 臈 83 is a conductive metal material;; = 2 】 needle 30, 40 fixedly attached to the fixed ring 81, then: metal 4 film 83 splash The fixed ring 81 and/or the differential probe 3 are plated. The sleeve 33 (or coaxial probe: two outer two = conduction 'so the fixed ring 81 and the adhesive ring 82 are material 丄 = material ') also has the fixed probe 3 〇, and the electrical connection is the same == The differential probe of the present invention can be obtained by the ninth to the better ninth of the differential probes 9(), 9::: one of the signals provided by the present invention. The circumference of the line 35 is set on the inner wall of the sleeve 33, and the twentieth chart is shown. The differential probe 91 is attached to each of the households, the beginning, the mouth, the mouth, the body, the body, the body, the body, the body, the body, the body, the Each of the insulators is directly attached to the outside of the wire 5. Therefore, only the insulator 34 and the sleeve 33 of the sleeve 33 are the above-mentioned difference 34, and the circumference of the second wire 35 is not attached with the insulator. The needle 93 is attached to each of the ^^ inner layers 'the twenty-second figure; the difference between the scales 35 and the sleeve 33 is filled with the insulator 1299113 34, so that there is no gap between the three, twenty-third Referring to the drawings; therefore, the differential probes 90, 91, 92, 93 can also achieve the purpose of the invention, and have the function of adjusting the relative impedance between the two signal lines. hair The possible preferred embodiments only, it covered the 5 patent application specification and the scope of the present invention changes whom equivalent structures, should be included within the scope of the present invention.

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(I J299113) BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a side view of a first preferred embodiment of the present invention; the second drawing is a top view of the first preferred embodiment; The bottom view of the preferred embodiment; 5 is a schematic diagram of the electronic circuit of the first preferred embodiment, showing: layout design of the first and second wires on the surface of the circuit board; Figure 5-5 is a cross-sectional view of the wiring; Figure 6 is a schematic diagram of the differential probe of the first preferred embodiment, which shows the connection relationship between the wiring area of the circuit board and the probe holder and the differential probe; ίο Figure 7 is a cross-sectional view taken along line 7-7 of the sixth figure; • Figure 8 is a schematic view of the coaxial probe of the first preferred embodiment, showing the connection relationship between the wiring area of the board and the probe holder and the coaxial probe The ninth drawing is a sectional view of the second preferred embodiment of the present invention; the tenth drawing is a side view of the second preferred embodiment of the present invention; Figure 12 is a jumper diagram of the above second preferred embodiment, shown as a jumper The arrangement of the wiring area and the jumper area of the circuit board, and the connection relationship with the differential probe; the thirteenth figure is a cross-sectional view of the 13-13 connection of the twelfth figure; 20 the fourteenth figure is provided by the present invention FIG. 15 is a schematic view showing the structure of an electronic circuit according to a fourth preferred embodiment of the present invention; and FIG. 16 is an electronic circuit according to a fifth preferred embodiment of the present invention. Structure of the circuit 1299113; structure = diagram of the electronic structure of the sixth preferred embodiment provided by the present invention = diagram and diagram of the electronic preferred embodiment of the seventh preferred embodiment of the present invention The probe circuit of the preferred embodiment is not round, and the circuit circuit is not broadcast. The differential probe of the ninth preferred embodiment of the present invention is not intended; the dry n-picture is provided by the present invention. The tenth preferred thin differential probe (four)=two 12 is a schematic diagram of the differential probe structure of the eleventh preferred embodiment provided by the present invention; 15 secret ^ two three diagrams are provided by the present invention Schematic diagram of the differential probe is 12 of the preferred embodiment; J 299113 [Main component symbol description] 5

10 15

2 probe card 10, 60 circuit board 101 upper surface 102 lower surface 103 test area 104, 601 wiring area η, 14, 15, 16, 17, 18, 61 electronic circuit 12, 171 first wire 13 second wire 130 Grounding wire 131 Grounding through hole 132 Grounding layer 20, 80 Probe holder 21, 81 Fixing ring 22, 82 Adhesive 30, 90, 9 92, 93 Differential probe 31 Needle 32 Coaxial line 33, 42 Sleeve 34 insulator 35 signal line 351 first end 352 second end 40 coaxial probe 41 single core coaxial line 5 Bu 52, 53, 54, 55, 56 solder joint 602 jumper area 70 jumper 71 protective film 72 metal line 83 metal film 20 18

Claims (1)

, 1299113 X. Patent application scope: 1 · A differential signaling probe card for contacting the detecting electronic component, comprising: a circuit board provided with an electronic circuit, the electronic circuit having a plurality of First and second wires, the first wires are paired adjacent to each other for transmitting the 5 differential signal pairs, and the adjacent two of the first wires maintain a specific impedance match with each other' and each of the first At least one of the second wires is disposed around the wire, the wires are electrically grounded, and a plurality of differential probes are electrically connected to the first wires and are respectively used to contact the electronic wires. The component card can output a differential signal pair to the electronic component through each of the differential probes. 2. The probe card capable of transmitting a differential signal pair according to the scope of the patent application, wherein the circuit board can define a relatively upper surface and a lower surface, and has a test area distributed from the outside to the inside. a wiring area on which the plurality of metal dots in contact with the electronic circuit are 幵/, and the solder joint of the upper surface is electrically connected to the test machine, the test machine: A differential signal is output to the probe card, and a fresh spot on the lower surface of the wiring area is electrically connected to the differential probes. According to the second aspect of the patent, the differential signal pair 20: 'hetero- and second-conducting, the material test zone and the solder joints on the upper surface of the wiring area are transmitted. In the second item of the second section of the Cali range, the differential signal can be transmitted to the ground, the access hole, and the power receiving: the board is on the upper surface, and the grounding through hole is a solder joint vertically penetrating the surface. The ground layer is disposed in the circuit board 192.1299113 in parallel with the two surfaces and connected to the ground via. 5: According to the fourth application of the patent application scope, the 1 pin card of the differential signal pair can be transmitted, and the adjacent two of the first wires are disposed between the ground wires. 5 ^6. According to the fourth aspect of the patent application, the differential pin pair can be transmitted, and the grounding layer is disposed under the adjacent two first wires. 7. The probe card capable of transmitting a differential signal pair according to item 4 of the patent application scope, the adjacent two of the first wires are disposed between the ground layers. 8. According to the scope of the patent application, the differential signal can be transmitted to the ω ^ probe card, and the second wire is connected to the woman and parallel to the ground. 9. According to the scope of claim 7 The differential signal pair = probe card, the second guide line, the distance between the lines is about the same as the thickness of each wire. 20 10 · The differential signal can be transmitted according to item 4 of the patent application scope. The probe card is connected to the surface of the ground via hole and the second differential probe is connected. 11. The probe card capable of transmitting a differential signal according to item 4 of the patent application scope, wherein each of the ground layers is electrically connected to a potential zero of the test machine. ^12. The probe card capable of transmitting the differential signal ignorance according to the scope of claim 2, further comprising a probe holder disposed on the circuit board, the probe holder having a gorge and - Adhesive, the solid is electrically grounded, and the wire agent is used to fix the differential probes to the ★ fixing ring. , &quot; 20 .1299113 (4) According to the scope of application of the patent scope, the transferable differential # 諕 之 板 针 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Above the adhesive ~, electrical (four) shot patent range of the first paragraph of the transferable differential signal system. The card '5 fine (four) and the adhesive are all made of conductive materials. The patent application is applicable. (4) The transferable differential signal width (10) and the second post _ red __ scales are the first full-length of the first pair. The above-mentioned transmittable differential signal 15 is on the opposite side: the transferable differential signal pin card described in Item 1 of the patent application scope, each of the differential probes has a first coaxial line, the first coaxial No: two signal lines and at least one insulator, the insulator is a three-material two-edge body disposed between the sleeve and each of the signal lines. The pair of probe cards \ i7 can transmit the differential signal 20 _ edge _ cladding is not: the needle is the first wire, the second end is set * material. Contacting the electronic component, the needle is a conductive metal material. 19. According to the scope of claim 18, the transferable differential signal 21 1299113 pair of probes 5 = the range of the 19th item can be transmitted poorly Move the letter to the eucalyptus needle card, change the casing: the electric break is in the pair of "2nd pair = needle: According to the 9 items, the differential differential letter can be transmitted with two insulators, each of the insulators Each of the _ miscellaneous _ is provided around each of the signal lines. In the range of the smear of the smear, the second embodiment can transmit a differential signal pair, and each of the insulators is placed on each of the signal lines. According to claim 19, the transferable differential signal has a two-insulator, wherein the differential probe has a second insulator, wherein the first iin the sleeve (four) wall, the second insulator and one of the The signal, and the signal are coaxially arranged around the signal line. 24) The probe card capable of transmitting the differential signal according to the scope of claim 23, the second insulation system is attached to the corresponding signal line 0 w 2 5 according to the scope of claim 19 The probe card of the differential signal 20f is transmitted, and the insulation system of each of the differential probes is in contact with the sleeve and the two signal lines. 〇2 6 · According to the scope of claim 18, the probe card of the differential signal pair can be transmitted, and the circuit board can define a test area corresponding to one upper surface and one lower surface and having an outer side distribution a wiring area and a jump and an area, wherein a plurality of gold 8 22 .1299113 solder joints are formed on the two surfaces, and the solder joints on the upper surface of the test area are electrically connected to a test. The machine platform outputs a differential signal to the probe card, and solder joints on the lower surface of the jumper region are electrically connected to the differential probes. η 2 7 · According to the shot, the probe card of the transferable differential letter No. 5 of the second full-length section is further included with a plurality of jumpers, and the solder joints are provided on the upper surface and connected from the wiring area. The solder joint to the jumper area. . 28. The probe card capable of transmitting a differential signal according to claim 27 of the patent application scope, each of the jumpers having a second wire and a two metal wire, the f two coaxial wire having a sleeve and two a signal line and at least one conductive insulating material, the sleeve, the second and the conductive metal material, the insulator is disposed between the sleeve and each of the signal lines, wherein the two metal lines are respectively disposed on Both ends of the sleeve. (4) 2f. According to the application of patent scope, item 28, transferable training 3 0. According to the probe card of No. 28 of the patent application scope, each jumper has a protective second letter 20 insulation material, which is used for Wrap the second coaxial line. For the non-conducting pair of two cards = there is a single core _ line and - needle, the single core _ line; continuation edge and - signal line, the insulator is not conductive insulation ^ 23 .1299113, the tube, the needle and the signal line are all officially covered with the insulator, the insulator metal material, the sleeve. Covering the 唬4唬 line, the signal line is provided with 3 2 · According to the probe card of the patent application No. 5, the coaxial probe transmits the differential signal probe to contact the electronic component. ‘,,纽纽接地’ each of the same pair of pairs can transmit a differential signal to the electronic circuit. ΰ 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收a probe ίί differential probe is disposed on a lower surface of the circuit board, each of the differential 15 tubes, and a second coaxial line, each of the first coaxial lines having a set of bodies Each of the signal lines is disposed on the two signals, and the signal line is disposed corresponding to each of the needles, and the sleeve is disposed between the sleeve and each of the credits and is not electrically conductive. The two needles and each of the signal lines are electrically conductive metal materials 且' and the sleeves and the signal lines are respectively connected to the lower point '^reading the red (four) electroimpedance (impedanee) surface can be t1; The soldering point of the upper surface is electrically connected to the testing machine for measuring the electronic device 3, and each of the pins is electrically contacted, so that the probe card can contact and detect the electronic component. 3 5. According to the probe card described in item 34 of the patent application, the (ί 24 1299113 storm 5 The road t has a plurality of first and second conductors, and the first conductors are in the order of a green eye, and the second conductor is disposed at least around the first conductor. The second conductor is electrically connected to each of the differential probes. The needle is connected to the sleeve of each of the differential probes. According to the probe card described in Item No. 35 of the patent scope, the circuit board has a distribution zone and a wiring area, and the solder joints on the upper surface of the test area are electrically Connected to the test machine, solder joints on the lower surface of the wiring area are electrically connected to the differential probes. 10 15 々3 7 · According to the probe card of claim 36, the first and second wires are connected to the test area and the solder joint above the wiring area. In accordance with the probe card of claim 35, the first wires include a grounding wire, a grounding through hole, and a grounding layer, and the grounding wire is disposed on the upper surface, and the grounding through hole is The soldering point is perpendicularly penetrated from the circuit board to the two surfaces, and the grounding layer is disposed in the circuit board in parallel with the two surfaces and connected to the ground via. 3 9 · According to the probe card described in claim 3 of the patent application, a wire adjacent to the other is disposed between the ground wires. 4 0. According to the probe card of claim 3, the grounding layer is disposed adjacent to the first wire. 41. The probe card according to item 38 of the patent application, adjacent to the first wire, is disposed between the ground layers. 4 2 · According to the probe card described in claim 41, the phase 25 20 1299113 is adjacent to each other in parallel and parallel to the ground layer. The probe card of the adjacent item 42 is substantially the same as the thickness of each of the first-wires. (4) 11, Γ 1 patent model (4) 38 of the probe card, the welding of the lower surface of the fish and the differential probe ^ 45 · According to the patent application _ 38, the grounding layer is electrically connected to the position The potential of the machine is zero. Each of the probe cards of claim 35, wherein the adjacent spacing of adjacent one of the first conductors is approximately the line width of each of the first conductors. According to the probe card of claim 35, the distance between the second wire and the surface of the first wire is greater than the distance between the adjacent two first wires. Up) 8 · According to the probe card described in item 35 of the patent application, the two ends of each of the 15 wires protrude from the insulator and are not covered by the insulator, and one of the exposed ones can be defined. The first end and the second end are electrically connected to the first wire of the lower surface, and the second end is provided with the needle. ▲ 4 9 · According to the probe card described in item 48 of the patent application, changing the diameter of the casing can adjust the relative electrical impedance of the two signal lines to be the same as the corresponding two The relative electrical impedance of the wire. =5 〇 According to the probe card of claim 4, each of the differential probes has two insulators, and each of the insulators is disposed coaxially with each of the signal lines around each of the signal lines. 26 • 1299113 5 1 • According to the probe card described in Clause 5 of the patent application, the insulation system is attached to each of the signal lines. 2. According to the probe card of claim 4, each of the differential probes has two insulators, wherein the first insulator is disposed on the inner wall of the sleeve 5, and the second insulator and the second insulator One of the signal lines is coaxially disposed around the: line. , μ &quot; know 5 3 · According to the probe card described in claim 5, the second insulation system is attached to the corresponding signal line. According to the probe card of claim 4, the insulation system of the differential probe is in contact with the sleeve and the two signal lines. 5) The probe card according to claim 4, further comprising a probe holder disposed on a lower surface of the circuit board, the probe holder having a fixing ring and an adhesive. The fixing ring is electrically grounded, and the adhesive is used for fixedly connecting the differential probes to the fixing ring and the sleeve is electrically connected to the fixing ring. Lu 5 6 · According to the probe card described in claim 5, the probe holder further has a metal film which is made of a conductive metal material and is sputtered on the fixing ring and the adhesive. 5 7 · According to the probe card described in claim 5, the 20 fixing ring and the adhesive are made of a conductive material. 5 8 · According to the probe card of claim 34, the circuit board has a test area, a wiring area and a jumper area distributed from the outside to the inside, and the solder joints on the upper surface of the test area are electrically Connected to the test machine, solder joints on the lower surface of the jumper area are electrically connected to the differential probes. 27 • 1299113 5 9 · The probe card according to item 5 § of the patent application scope further includes a plurality of jumpers disposed on the upper surface and connected from the solder joints of the wiring area to the soldering area of the jumper area point. 6 0. According to the probe card of claim 59, each of the jumps has a second coaxial line and a two metal line, and the second line has a set of official and two signal lines and at least one An insulator that is electrically non-conductive = an insulating material. The sleeve, the two metal wires, and the two signal wires are electrically conductive metal materials. The insulator is disposed between the sleeve and each of the signal lines. A metal wire is respectively disposed at both ends of the sleeve. • 61. According to the probe card described in item 6 of the patent application scope, the two letters of the jumper are electrically connected to the letters, lines and metal of each of the differential probes. The wire is electrically connected to each of the wire probes. According to the probe card of the sixth aspect of the patent application, each of the wires has a protective film, and the second coaxial cable is included. Conductive insulation material. 28