201118381 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種高頻垂直式探針卡測試裝置，尤其是 具有導電布而使探針電氣連接至電路板且利用導電材料與 空氣（或真空）包圍探針本體並以絕緣材料支撐的結構。 【先前技術】 φ 為確保晶片的電氣特性，必須在不同階段進行測試， ' 比如在晶片被封裝前先進行晶片級量測，以避免浪費封裝 貝源，而一般晶片級量測係利用探針卡(Probe card)的探 針接觸晶片的測試點’比如焊墊，再經探針卡的電路板將 電氣is號連接到測試機(Tester)，使測試機傳送測試信號 到晶片或接收晶片的輸出信號，藉以量測晶片的電氣特 性，同時剔除不良晶片而篩選出合格的晶片，進行後續的 封裝處理。 、 成熟的商品化探針卡有懸臂式探針卡（canti lever piObe Card)與垂直式探針卡(Vertical Pr〇be以付）。上 述習用技街的探針卡通常包括電路板、固定模組以及探 針，其中探針具有探針尖端，用以接觸晶片的測試點，探 針係電氣連接至電路板，料路板進—步連接至外部測試 機，所以外部測試機可藉由探針傳導電氣信號而對晶片進 行電氣量測。固定模組提供固定探針的功能，以加強探針 的機械強度與操作穩定性，避免探針接觸到晶片的測試點 時發生損壞。 習用技術的缺點是’探針中除探針尖端外的其餘部分 201118381 具有相當大比例是裸露於空氣中，造成 巧輸時易受外在雜訊干擾且會改變探針 號摻有外在雜訊，且使得阻 因而影響量測的精確度。此外，探針一般 ，連，路板，會產生額外的電氣雜 不利於電氣量測的精確度。201118381 VI. Description of the Invention: [Technical Field] The present invention relates to a high frequency vertical probe card testing device, in particular having a conductive cloth for electrically connecting a probe to a circuit board and utilizing a conductive material and air (or Vacuum) A structure that surrounds the probe body and is supported by an insulating material. [Prior Art] φ In order to ensure the electrical characteristics of the wafer, it must be tested at different stages, 'for example, wafer level measurement is performed before the wafer is packaged to avoid wasting the package source, and the general wafer level measurement system utilizes the probe. The probe of the probe card contacts the test point of the wafer, such as a solder pad, and then connects the electrical is number to the tester via the circuit board of the probe card, so that the test machine transmits the test signal to the wafer or receives the wafer. The output signal is used to measure the electrical characteristics of the wafer, and at the same time, the defective wafer is removed and the qualified wafer is screened for subsequent packaging processing. The mature commercial probe card has a cantilever probe card (Canti lever piObe Card) and a vertical probe card (Vertical Pr〇be for payment). The probe card of the above-mentioned conventional technology street generally comprises a circuit board, a fixed module and a probe, wherein the probe has a probe tip for contacting the test point of the wafer, the probe is electrically connected to the circuit board, and the material path plate is inserted into the The step is connected to an external test machine, so the external tester can electrically measure the wafer by conducting electrical signals through the probe. The fixed module provides the function of a fixed probe to enhance the mechanical strength and operational stability of the probe and to prevent damage when the probe touches the test point of the wafer. The disadvantage of the conventional technique is that the rest of the probe except the tip of the probe 201118381 has a considerable proportion exposed to the air, which is susceptible to external noise interference during the accidental transmission and will change the probe number with external impurities. The signal, and the resistance thus affects the accuracy of the measurement. In addition, the probes are generally connected to the road board, which creates additional electrical impurities that are not conducive to the accuracy of electrical measurements.
因此，需要-種能降低外在雜訊干擾及具有高頻阻抗 配的探針卡測試裝置，藉以解決上述習用技術的缺點。 【發明内容】 主要咐提供—種高_鱗針卡測試裝 號，，勺括^至二一待測試晶片的測試點的高頻電氣信 二/括至乂-探針以及由上而下堆疊的電路板、導 I、第-絕緣材料、導電材料本體以及第二絕緣材料，复 一絕緣材料、導電材料本體以及第二絕緣村 探針尖端，用以接觸待職晶片的測試點，Therefore, there is a need for a probe card test apparatus capable of reducing external noise interference and having high frequency impedance matching, thereby solving the disadvantages of the above conventional techniques. SUMMARY OF THE INVENTION The main 咐 — 种 种 种 种 种 , , , , , , , , , , , , , , , , , , , , , , , 高频 高频 高频 高频 高频 高频 高频 高频 高频 高频 高频 高频 高频 高频 高频 高频a circuit board, a lead I, a first insulating material, a conductive material body and a second insulating material, a further insulating material, a conductive material body and a second insulating village probe tip for contacting the test points of the standby wafer,
==觸導電布:便利用導電布中垂直的導電體 ==信號’探針本體被導電材料本體=: ==之間具有以空氣作為介質的間隙，使探針 質並提高對铜測=㈣氣錄的傳輸品 【實施方式】 以下配合圖式及元件符號對本發明之實施方式做更詳 細的說明’俾使熟f該項技藝者在研讀本書後能據以實 201118381 施。 >閱第圖，本發明高頻垂直式探針卡測試裝置的示意 圖唭中本發明的高頻垂直式探針卡測試裝置係用以傳導至少 一待測試晶片的測試點的高頻電氣信號。如第—圖所示，本 發明的高頻垂直式探針卡測試裝置包括至少一探針1〇、電路 ，20”、導電布25、第一絕緣材料3〇、導電材料本體4〇以及 弟一，緣材料70，用以將待測試晶Μ 90中須_點⑽的高 ，電氣j。麟導至電路板’或將電路板2()的電氣信號傳 达至測試點100，藉以進行電氣信號量測，其中職點議 :為焊塾。要注意的是，為方便說明本發明的特點，第一圖 只顯示出單-探針，不過本發明的範圍係包括—個或多個探 針。 探針10具有探針尖端12、探針本體14與探 16,探針尖端12連接至探針本體14的—端，比如圖中釘 端，且探針連接部16連接至探針本體14的另-端，比如圖 中的上端。探針本體14的橫向尺寸大於探針尖端12的橫向 尺寸，比如探針本體14的寬度或直徑大於探針尖端ι2的寬 度或直徑。 導电布25包括絶緣物（圖中未顯示）及複數個導電體（圖 中未顯示），其中絶緣物係由電氣絕緣的材料所構成，導^ 體可為銅或其他導電金屬，而該等導電體為縱向分佈於絶緣 物中，且相鄰的導電體相互不接觸，所以該等導電體提供複 數個縱向垂直的電氣傳導路徑。探針連接部16接觸導電布 25，因此探針連接部16經導電布25的導電體而電氣連接至 導電布25上方的電路板10，且導電體的斷面尺寸小於探 連接部1 6的斷面尺寸小。 201118381 第一絕緣材料30位於導電布25底下，且具具有第一涌 孔，探針連接部16貫穿第-通孔而接觸導電布⑵ = 料本體40位於第一絕緣材料30底下，且具有一腔體训。= 體50位於第-絕緣材料30的第一通孔底下，而探針 = 係配置於腔體50内，且腔體50之側壁與探針本體14之 具有間隙，而該赚為真空或包含空氣。為進—步 二 該特點’請配合參閱第二圖，為第一圖中割線A〜、—==Contact conductive cloth: Convenient to use the vertical conductor in the conductive cloth == signal 'The probe body is made of conductive material body =: == There is a gap between air and medium to make the probe quality and improve the measurement of copper = (4) Transmission of the air recording system [Embodiment] The following describes the embodiment of the present invention in more detail with reference to the drawings and the components and symbols, and the skilled person can perform the 201118381 application after studying the book. The high frequency vertical probe card testing device of the present invention is a high frequency electrical signal for conducting at least one test point of a wafer to be tested. . As shown in the first figure, the high frequency vertical probe card testing device of the present invention comprises at least one probe 1 电路, circuit, 20", conductive cloth 25, first insulating material 3 〇, conductive material body 4 〇 and brother First, the edge material 70 is used to transfer the electrical signal of the whisker 90 to be tested to the circuit board or to transmit the electrical signal of the circuit board 2 to the test point 100 for electrical purposes. Signal measurement, wherein the job is: soldering. It should be noted that, for convenience of description of the features of the present invention, the first figure only shows a single-probe, but the scope of the present invention includes one or more probes. The probe 10 has a probe tip 12, a probe body 14 and a probe 16, the probe tip 12 is connected to the end of the probe body 14, such as the staple end in the figure, and the probe connection 16 is connected to the probe body. The other end of the 14 is, for example, the upper end of the figure. The lateral dimension of the probe body 14 is larger than the lateral dimension of the probe tip 12, such as the width or diameter of the probe body 14 being greater than the width or diameter of the probe tip ι2. 25 includes insulation (not shown) and a plurality of electrical conductors (not shown) Wherein the insulator is composed of an electrically insulating material, and the conductor may be copper or other conductive metal, and the conductors are longitudinally distributed in the insulator, and adjacent conductors are not in contact with each other, so The electrical conductors provide a plurality of longitudinally perpendicular electrical conduction paths. The probe connecting portion 16 contacts the conductive cloth 25, so that the probe connecting portion 16 is electrically connected to the circuit board 10 above the conductive cloth 25 via the electrical conductor of the conductive cloth 25, and is electrically conductive. The cross-sectional dimension of the body is smaller than the cross-sectional dimension of the probe connecting portion 16. The first insulating material 30 is located under the conductive cloth 25 and has a first surge hole, and the probe connecting portion 16 penetrates the first through hole to contact the conductive Cloth (2) = the material body 40 is located under the first insulating material 30 and has a cavity. The body 50 is located under the first through hole of the first insulating material 30, and the probe = is disposed in the cavity 50, and The side wall of the cavity 50 has a gap with the probe body 14, and the profit is vacuum or contains air. For the second step, please refer to the second figure, which is the secant line A~, in the first figure.
面的斷面示賴，其中探針本體14是位於由導電材料:體 4〇所形成之腔體5〇 Η ’且探針本體M與導電材料 係分離開而不相互接觸。 — 假设探針本體14的直徑為d及腔體5〇的内徑， 真空或空氣的介電常數為，則探針的阻抗2 · 7 60 πThe cross-section of the face is shown in which the probe body 14 is located in a cavity 5〇 ’ ' formed by a conductive material: body 4 and the probe body M is separated from the conductive material without contacting each other. — Assuming that the diameter of the probe body 14 is d and the inner diameter of the cavity 5〇, the dielectric constant of vacuum or air is, the impedance of the probe is 2 · 7 60 π
\/— J v sr d 其中Ln為自然對數(Natural L〇g)。因此，被直 即間隙為真空）包圍或被作為介質的空 ^% 填滿则時’探針本龍具有低介電細^破4 第二絕緣材料70位於導電材料本體40底下，且且右第 貫穿第二通孔，用以接觸或接 二支撐探 =°。第二絕緣材料―^ >3參=二1本發明高頻垂直式探針卡測試裝置的詳細示 區域β的放大圖。如第三圖所示，本 卿#丨_物12具有逐步縮小 的寸因此，弟二絕緣材料70的第二通孔之孔徑為逐步" 201118381 縮小，藉以配合並容置探針尖端丄2。 參閱第四圖，本發明第二實施例高頻垂直式探針卡測試裝 置的詳細示意圖’係、第―圖中局部區域B的放大圖。如第四 圖所示，本發明第二實施例高頻垂直式探針卡測試裝置中探針 10的才木針穴端12具有單一尺寸大小，且比探針本體還 小’因此’第二絕緣材料7〇的第二通孔之孔徑具有單一尺 寸大小，藉以配合並容置探針尖端12。\/- J v sr d where Ln is the natural logarithm (Natural L〇g). Therefore, when the gap is filled with vacuum or filled with the space as a medium, the probe has a low dielectric fine. The second insulating material 70 is located under the conductive material body 40, and is right. The first through hole is for accessing or connecting to the support. The second insulating material - ^ > 3 refers to the enlarged view of the detailed region β of the high-frequency vertical probe card testing device of the present invention. As shown in the third figure, Ben Qing #丨_物12 has a gradually reduced inch. Therefore, the aperture of the second through hole of the second insulating material 70 is stepwise "201118381 is reduced, thereby cooperating and accommodating the probe tip 丄2 . Referring to Fig. 4, there is shown a detailed schematic view of a high frequency vertical probe card test apparatus according to a second embodiment of the present invention, and an enlarged view of a partial area B in the first embodiment. As shown in the fourth figure, in the high-frequency vertical probe card testing device of the second embodiment of the present invention, the wood pinhole end 12 of the probe 10 has a single size and is smaller than the probe body. The aperture of the second through hole of the insulating material 7 has a single size to fit and accommodate the probe tip 12.
>閱第五圖本發明弟二實施例高頻垂直式探針卡測試裝 置的詳細示意圖，係第―圖中局部區域B的放大圖，且與第 三圖的實施例相類似’其_差異點是第五圖聰針尖端12 具有中央凹陷的形狀。此外’第六圖’本發明第四實施例高 頻垂直式探針卡_裝置的詳細示意圖，係第-®中局部區 =的放大圖，且與第四_實施例相類似，其間的差異點 是第六圖的探針尖端12具有中央凹陷的形狀。 ⑽材料30包括電氣絕緣性轉材料或陶究材 料，比如商品為密拉(Mylar)的聚醋材料。導電材料本體4〇 包括導電金屬或導電合金，比如銅_合金 ^包括電氣絕緣性塑膠材料或_材料，比如商品為= (Mylar)的聚酯材料。 因此，本發明的特點係利用導電材料本體4〇包圍探針 本體14以提高探針對外界環境與魏錢的預能力 時利用探針本體14的橫向尺杜_針料12的橫向尺寸 而稭第二絕緣材料7G的機械強度切探針本體14， 電氣絕緣以隔絕開導電材料本體4〇與測試點1⑼。 " 門的^發點為，利用導電布當作探針與電路板之 間的電祕¥齡，蹄針係直接_導電布柯需使用焊 201118381 料’=便於將機構拆裝利於維修作举。 圖據以之較佳實施例，並非企 丄 :神下所作有關本發明之 在本發明意圖保護之範#。 【圖式簡單說明】>Reading FIG. 5 is a detailed schematic view of the high-frequency vertical probe card testing device of the second embodiment of the present invention, which is an enlarged view of a partial region B in the first embodiment, and is similar to the embodiment of the third figure. The point of difference is that the fifth figure Cong pin tip 12 has a central concave shape. In addition, the 'sixth diagram' is a detailed diagram of the high-frequency vertical probe card_device of the fourth embodiment of the present invention, which is an enlarged view of the local area= in the first--, and is similar to the fourth-example, and the difference therebetween The point that the probe tip 12 of the sixth figure has a central concave shape. (10) The material 30 includes an electrically insulating transfer material or a ceramic material such as a polyester material which is commercially available as Mylar. The conductive material body 4A includes a conductive metal or a conductive alloy, such as a copper alloy, including an electrically insulating plastic material or a material such as a polyester material having a commercial product of = (Mylar). Therefore, the present invention is characterized in that the probe body 14 is surrounded by the conductive material body 4 to improve the probe's pre-capacity to the external environment and the Wei Qian, and the lateral dimension of the probe body 14 is utilized. The mechanical strength of the second insulating material 7G cuts the probe body 14, electrically insulated to isolate the conductive material body 4〇 from the test point 1 (9). " The door of the door is the use of conductive cloth as the electrical connection between the probe and the circuit board. The hoof needle is directly _ conductive cloth needs to be welded 201118381 material '= easy to disassemble the mechanism for maintenance Lift. The drawings are based on the preferred embodiment and are not intended to be used in the context of the present invention. [Simple description of the map]
第-圖為本發明高頻垂直式探針卡測試裝置的示意圖。 第二圖為本發明高頻垂直式探針卡測試裝置的斷面示意圖。 第二圖為本發明高頻垂直式探針卡測試裝置的詳細示意圖。 第四圖為本發明高頻垂直式第二實施例探針卡測試裝置的 洋細示意圖。 弟五圖為本發明高頻垂直式第三實施例探針卡測試裝置的 詳細示意圖。 第六圖為本發明高頻垂直式第四實施例探針卡測試裝置的 詳細示意圖。 【主要元件符號說明】 1電路板 2固定模組 3探針 4探針尖端 10探針 12探針尖端 14探針本體 16探針連接部 201118381 20電路板 25導電布 30第一絕緣材料 40導電材料本體 50腔體 70第二絕緣材料 9 0待測試晶片 100測試點（焊墊) AA割線 B局部區域The first figure is a schematic view of the high frequency vertical probe card testing device of the present invention. The second figure is a schematic cross-sectional view of the high frequency vertical probe card testing device of the present invention. The second figure is a detailed schematic diagram of the high frequency vertical probe card testing device of the present invention. The fourth figure is a schematic view of the probe card testing device of the high frequency vertical type second embodiment of the present invention. The fifth figure is a detailed schematic diagram of the probe card testing device of the high frequency vertical type third embodiment of the present invention. Fig. 6 is a detailed schematic view showing the probe card testing device of the high frequency vertical type fourth embodiment of the present invention. [Main component symbol description] 1 circuit board 2 fixed module 3 probe 4 probe tip 10 probe 12 probe tip 14 probe body 16 probe connection portion 201118381 20 circuit board 25 conductive cloth 30 first insulating material 40 conductive Material body 50 cavity 70 second insulating material 90 to be tested wafer 100 test point (pad) AA secant B local area