200940996 九、發明說明： 【發明所屬之技術領域】 本發明與探針卡有關’特別是有關於一種探針卡之製 造方法及其裝置。 5【先前技術】 積體電路晶圓測試中’用以傳輸測試訊號之探針卡電 路板係供測試機台的測試頭點觸，以接收測試機台的測試 訊號並傳送至電路板下方近中心處所密集設置之探針。當 各探針對應點觸的晶圓電子元件接收測試訊號後，則透過 10探針卡回傳所對應的電氣特性至測試機台以供分析，如此 在整個晶圓級測試過程中，探針卡電路板的電路傳輪設計 對電子元件的測試結果佔有很重要的影響，尤其隨著電子 科技越趨高速之運作，測試過程需操作於實際對應的高速 運作條件，故傳輸線路之製作更需符合高速訊號的操作條 15 件。 、 以第一圖所示為美國專利第58〇8475號所提供之『低 電流量測用之半導體探針卡』，該探針卡丨結構區分為上方 的接觸電路板10、下方的探針板12及巾_數個間隔材 14其中接觸電路板上設置有如同轴傳輸線結構之測 2〇試接點11’可避免接觸電路板1〇本身的介質環境所產生的 寄生電阻導致漏電流問題。然由於接觸電路板1〇為直接供 測試機台Γ的測試頭點觸’探針板12為供以設置探針13， 若接觸電路板1G或探針板n本身沒有足_支撐強度與 疋的剛體厚度’ g,貞㈣機台丨，下壓且施以應力欲於整個 200940996 探針卡1結構時，接觸電路板10與探針板12的受力平面 則容易因局料力不平均岐接觸電路板1G或探針板12 產生形變的問題，況且當各探針13點觸晶圓平面時，單獨 探針板12前端則需不斷的承受來自晶圓平面產生的反作用 5力’如此長時間的應力作用下，探針板12前端用以設置探 針13的平面結構亦容易產生形變。 縱使可如第一圖所示為習用之另一探針卡2結構，其 ❹ 訊號傳輸過程為經由多層印刷電路板20上所佈設之線路 21由外至内且由上至下的延伸穿設層疊之電路板2〇，然後 1〇由探針22送出，故電路板20之整體結構強度與其單一受 力平面可於承受應力時平均分散此作用力，而不致發生局 部受力不平均所產生形變的問題。然多層印刷電路板2 〇係 以多層玻璃纖維材質或陶瓷材質所壓合而成，各層結構上 佈設有金屬線材以形成線路21結構，故製作上不但需耗費 U相當的成本與工時，且將傳輸線路21佈設於電路板内部 © 時，相鄰線路21佈設之間的電路板20材質極容易造成漏 電流的主因，加上因電路板10各層結構所穿設的導通孔線 路210易使訊號縱向傳遞時發生介面反射的能量耗損’如 此皆嚴重影響南頻訊號的傳輸特性，而無法符合電子電路 2〇 元件的南速測試需求。 【發明内容】 本發明之主要目的在於提供一種探針卡之製造方法， 依照本發明所製成的探針卡可維持有高頻訊號傳輸的阻抗 200940996 匹配特性’並具有最佳的電性測試品質。 為達成如揭目的，本發明所提供之探針卡之製造方法 係先備製一具有多數個電路層之電路板接著於該等電路 層凹陷形成出一位於該電路板外圍之凹室，再分別設置多 5 銲墊與多數個探針於該電路板之上、下表面，接著備 製多數條傳輸線，將各該傳輸線的一端伸入該凹室中與其 ❹ 該#塾電性連接，而將另一端穿出該凹室而斑其中一 該探針電性連接。 〃、 因此，當高頻訊號穿入電路板後，可藉該傳輸線跳到 預疋的位置而將高頻訊號維持特性阻抗所需之特定間距， 用以維持高頻訊號於電路板的傳輸過程中具有阻抗匹配的 特性。 【實施方式】 ❹ 以下’餘配合圖示列舉若干較佳實施例，用以對本發 明之結構與功效作詳細說明，其中所用圖示之簡要說明如 下： 第三圖為本發明第一較佳實施例之底視圖； 第四圖為本發明第一較佳實施例之結構示意圖； 20 第五圖為本發明第二較佳實施例之結構示意圖；以及 第六圖為本發明第三較佳實施例之結構示意圖。 請參閱如第三至第四圖所示，為本發明所提供第一較 佳實施例之探針卡3，其製造方法為： a.備製一具有多數個相互疊置之電路層302的電路板 200940996 30 ° b. 於電路板30外圍以蝕刻方式（亦可採用機械加工方 式)將該些電路層302凹陷形成出一向下開放之凹室3〇4 ’ 使凹室304的厚度相當於該些電路層3〇2的總厚度減去一 5層电路層302的厚度’亦即電路板3〇於凹室3〇4上方僅留 有-層電路層302’’並於電路層3〇2，蚀刻出一連通凹室3〇4 〇 之開槽307。接著於凹室3〇4之周壁設置-補強件306，用 以增加凹至304上方之電路層3〇2，的結構強度，並於補強 件306開叹出一連通開槽3〇7之開孔3〇8。接著再灌注一膠 體309 ’以強化凹室3〇4周壁的電路層結構。其中，補強件 306與膠體309不-定要同時設置，可直接灌注膠體3〇9 於凹室304之周壁而不需設置補強件3〇6。 c. 刀別》又置多數個銲墊31、32於電路板如外圍之上 表面與内圍之上、下表面，並於電路板3()内圍之上、下表 ❹b Φ之間佈設多數訊號電路33與多數接地電路34，使該些鲜 整31用以供-測試機台（圖中未示)之一測試頭(圖中未示） 點觸’而使該些銲墊32電性連接訊號電路33與接地電路 又置多數個探針35於電路板3G内圍下表面之銲塾 32而與訊號電路33愈接‘ ± 銪接電路34電性連接，用以電性接 觸一積體電路晶圓（圖中未示）。 —e.備製多數條傳輸線％，將各傳輸線％❺―端伸入 凹室304中，用以電性土車接贫 的黑-―f i連減松墊，轉各傳輸線36 的另一祕』由開槽307穿出凹室304後，連接至電路板 20 200940996 内上表面的鲜塾32 ’用以電性連接其中一探針35。 31 ^ 議台之職頭魏接觸電紐3G上表面之辉塾 Μ後，各銲I Ή ^ 所接收之高頻測試訊號即透過傳輸線36 5 =至電路板3〇下表面之探針％，除了可避免高頻測試訊 於^向傳遞轉至橫向傳遞之轉折介面時，因不連續的傳 發生"面反射現象而造成訊號耗損，亦可讓高頻測 © §號自電略板30之上表面傳輸至電路板30之下表面的 之路3中’可維持所需之特性阻抗。 虽然’依照本實施例之方法所製成的探針卡3主要是 用傳輸線36分別電性連接電路板30上表面之銲墊31與 電路板30下表面之探針35。如第五圖所示，為本發明第二 較佳實施例所提供之方法所製成之探針卡4,其製造方法與 上述實施例的主要差異在於： 、在步驟b中’於電路板4〇内圍以蝕刻方式（亦可採用機 ❹15 ，加工方式)將該些電路層402凹陷形成出一向上開放之凹 至405 ’凹室405的厚度與電路板40外圍之凹室404厚度 相當。接著於凹室405周壁再設置一補強件406，用以增加 凹室405下方之電路層4〇2,的結構強度，並於補強件406 開設一開孔407。同樣地，可於設置補強件之後灌注一膠體 2〇於凹室405中’或者直接灌注膠體於凹室405中而不設置 補強件406，以增加凹室405周壁之電路層強度。 在步驟e中’將各傳輸線46的一端伸入凹室404中， 用以電性連接其中一輝塾4卜而將各傳輪線46的另一端經 由補強件406之開孔407而伸入電路板40内圍之凹室405 200940996 而電性連接探針45。 更可讓古疋利用傳輸線46與探針45電性連接， 又』梁鬲頻測試訊號自雷 文妖 4〇之下表_之路徑中 之上表面傳輸至電路板 AM— 轉所需之特性阻抗。 法所製成施例嫩^ 是： 本實鈿例與弟二較佳實施例不同的 5〇4 5二中’係於補強件5〇6下方開設出-連通凹室 lo 之開槽508。而於步驟e中，將 四室504中與銲墊51電 -知伸入 趣由補強件506之門播二 傳輸線56的另-端 電性= 穿出凹室504而直接與探針55 15 樣J二提供不同的電性連接方式’而同 ==ί別電性連接銲塾與探針，使應用本發明 到本==能有效解決習用探針卡的缺失而達 故集唯所述者，僅為本㈣之触可行實施例而已， 凡應用本發明朗書及申請專利範圍所為之等效結構 變化’理應包含在本發明之專利範圍内。 9 200940996 【圖式簡單說明】 第一圖為美國專利第5808475號所提供探針卡之結構 示意圖。 第二圖為另一習用懸臂式探針卡之結構示意圖。 5 第三圖為本發明第一較佳實施例之底視圖。 第四圖為本發明第一較佳實施例之結構示意圖。 第五圖為本發明第二較佳實施例之結構示意圖。 〇 第六圖為本發明第三較佳實施例之結構示意圖。 200940996 【主要元件符號說明】 探針卡3 電路板30 電路層302、302’ 凹室304 補強件306 5 開槽307 開孔308 膠體309 銲墊31、32 訊號電路33 接地電路34 探針35 傳輸線36 10 探針卡4 電路板40 電路層402、402’ 凹室 404、405 補強件406 開孔407 銲墊41 探針45 傳輸線46 15 探針卡5 凹室504 補強件506 〇 開槽508 銲墊51 探針55 傳輸線56 11200940996 IX. Description of the Invention: [Technical Field] The present invention relates to a probe card, and particularly relates to a method and apparatus for manufacturing a probe card. 5 [Prior Art] In the integrated circuit wafer test, the probe card circuit board for transmitting the test signal is touched by the test head of the test machine to receive the test signal of the test machine and transmitted to the bottom of the circuit board. A densely packed probe at the center. After the probe electronic components corresponding to the probes receive the test signal, the corresponding electrical characteristics are transmitted back to the test machine through the 10 probe card for analysis, so that the probe is used throughout the wafer level test. The circuit design of the circuit board of the card board has a very important influence on the test results of the electronic components. Especially with the higher speed operation of the electronic technology, the test process needs to operate in the actual corresponding high-speed operating conditions, so the production of the transmission line is more necessary. 15 operating strips that meet high-speed signals. In the first figure, the "semiconductor probe card for low current measurement" provided by U.S. Patent No. 5,847,475, the probe cassette structure is divided into an upper contact circuit board 10 and a probe underneath. The board 12 and the towel_the plurality of spacers 14 are provided with a measuring circuit 11 of the coaxial transmission line structure on the contact circuit board to avoid the leakage current caused by the parasitic resistance generated by the medium environment contacting the circuit board 1 itself. . However, since the contact circuit board 1 is directly used by the test head of the test machine, the probe card 12 is provided with the probe 13, and if the contact circuit board 1G or the probe board n itself has no foot support strength and 疋The thickness of the rigid body 'g, 贞(4) machine 丨, under pressure and stress applied to the entire 200940996 probe card 1 structure, the force plane contacting the circuit board 10 and the probe card 12 is easy to be uneven due to the material force The contact between the contact circuit board 1G or the probe card 12 causes a problem of deformation, and when the probes 13 touch the wafer plane, the front end of the individual probe card 12 is constantly subjected to the reaction force generated from the wafer plane. Under the action of long time stress, the planar structure of the probe plate 12 at the front end of the probe plate 13 is also prone to deformation. Even though the other probe card 2 structure can be used as shown in the first figure, the signal transmission process is performed from the outside to the inside and from the top to the bottom through the line 21 disposed on the multilayer printed circuit board 20. The stacked circuit board 2〇 is then sent out by the probe 22, so that the overall structural strength of the circuit board 20 and its single force plane can disperse the force evenly when subjected to stress, without local uneven force generation. The problem of deformation. However, the multilayer printed circuit board 2 is made of a plurality of layers of glass fiber material or ceramic material, and each layer structure is provided with a metal wire to form the structure of the line 21, so that the cost and the man-hour are not only required to be manufactured, but also When the transmission line 21 is disposed inside the circuit board ©, the material of the circuit board 20 disposed between the adjacent lines 21 is extremely likely to cause a main cause of leakage current, and the via hole line 210 which is formed by the structure of each layer of the circuit board 10 is easy to be used. The energy loss of the interface reflection occurs when the signal is transmitted longitudinally. This seriously affects the transmission characteristics of the south frequency signal, and cannot meet the south speed test requirements of the electronic circuit 2 component. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for manufacturing a probe card. The probe card manufactured according to the present invention can maintain the impedance of the high-frequency signal transmission 200940996 matching characteristic and has the best electrical test. quality. To achieve the above, the method for manufacturing the probe card provided by the present invention is to prepare a circuit board having a plurality of circuit layers, and then recessing the circuit layers to form an alcove at the periphery of the circuit board. A plurality of 5 pads and a plurality of probes are respectively disposed on the upper surface and the lower surface of the circuit board, and then a plurality of transmission lines are prepared, and one end of each of the transmission lines is inserted into the concave chamber to be electrically connected thereto. The other end is passed out of the cavity and one of the probes is electrically connected. 〃 Therefore, when the high-frequency signal penetrates into the circuit board, the transmission line can jump to the pre-clamped position to maintain the high-frequency signal at a specific spacing required for the characteristic impedance to maintain the transmission process of the high-frequency signal on the circuit board. It has the characteristics of impedance matching. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following is a detailed description of the structure and function of the present invention. The following is a brief description of the drawings: 4 is a schematic structural view of a first preferred embodiment of the present invention; 20 is a schematic structural view of a second preferred embodiment of the present invention; and a sixth preferred embodiment of the present invention is a third preferred embodiment of the present invention. A schematic diagram of the structure of the example. Referring to the third to fourth figures, the probe card 3 of the first preferred embodiment of the present invention is manufactured by: a. preparing a plurality of circuit layers 302 stacked on each other. The circuit board 200940996 30 ° b. The circuit layer 302 is recessed on the periphery of the circuit board 30 by etching (may also be mechanically processed) to form a downwardly open recess 3 〇 4 ′ so that the thickness of the recess 304 is equivalent The total thickness of the circuit layers 3〇2 is subtracted from the thickness of a 5-layer circuit layer 302. That is, the circuit board 3 has only a layer circuit layer 302'' disposed above the recess 3〇4 and is disposed on the circuit layer 3. 2. Etching a slot 307 that connects the recesses 3〇4〇. Then, a reinforcing member 306 is disposed on the peripheral wall of the recessed chamber 3〇4 for increasing the structural strength of the circuit layer 3〇2 recessed above 304, and opening the connecting slot 3〇7 with the reinforcing member 306. Hole 3〇8. Then, a colloid 309' is refilled to strengthen the circuit layer structure of the peripheral wall of the recessed chamber 3〇4. Wherein, the reinforcing member 306 and the colloid 309 are not necessarily disposed at the same time, and the colloid 3 〇 9 can be directly poured into the peripheral wall of the concave chamber 304 without providing the reinforcing member 3〇6. c. Knife and other sets of a plurality of pads 31, 32 on the circuit board such as the upper surface of the outer surface and the upper and lower surfaces of the inner wall, and placed on the inner circumference of the circuit board 3 (), between the table ❹b Φ The majority of the signal circuit 33 and the plurality of grounding circuits 34 cause the fresh chips 31 to be used by a test head (not shown) of the test machine (not shown) to make the pads 32 electrically The connection signal circuit 33 and the grounding circuit are further provided with a plurality of probes 35 on the lower surface of the soldering pad 32 in the circuit board 3G, and are connected to the signal circuit 33 to be electrically connected to the circuit 34 for electrical contact. Integrated circuit wafer (not shown). - e. Prepare a majority of the transmission line %, and extend the % ❺ end of each transmission line into the recess 304 for the electric locomotive to connect the poor black-fi-reduction pad, and transfer the other secret of each transmission line 36. After passing through the recess 304 by the slot 307, the fresh shovel 32' connected to the upper surface of the circuit board 20200940996 is used to electrically connect one of the probes 35. 31 ^ After the high-level test of the upper surface of the 3G on the top of the Weitai contact, the high-frequency test signal received by each soldering I Ή ^ is transmitted through the transmission line 36 5 = the probe % to the lower surface of the board 3 In addition to avoiding the high-frequency test signal transfer to the lateral transfer of the transition interface, the signal loss caused by the discontinuous transmission "surface reflection phenomenon, can also make the high-frequency test © § No. The path 3 of the upper surface transmitted to the lower surface of the circuit board 30 maintains the required characteristic impedance. The probe card 3 manufactured according to the method of the present embodiment is mainly electrically connected to the pad 31 on the upper surface of the circuit board 30 and the probe 35 on the lower surface of the circuit board 30 by the transmission line 36, respectively. As shown in the fifth figure, the main difference between the manufacturing method of the probe card 4 manufactured by the method provided by the second preferred embodiment of the present invention and the above embodiment is as follows: The inner circumference of the circuit board 402 is recessed to form an upwardly open recess to 405 'the thickness of the recess 405 is equivalent to the thickness of the recess 404 at the periphery of the circuit board 40 by etching (also using the casing 15 and processing). . Then, a reinforcing member 406 is further disposed on the peripheral wall of the recess 405 for increasing the structural strength of the circuit layer 4〇2 under the recess 405, and an opening 407 is formed in the reinforcing member 406. Similarly, a colloid 2 can be poured into the recess 405 after the reinforcing member is disposed or the colloid can be directly poured into the recess 405 without providing the reinforcing member 406 to increase the strength of the circuit layer of the peripheral wall of the recess 405. In step e, 'one end of each transmission line 46 is inserted into the recess 404 for electrically connecting one of the turns 4 and the other end of each of the transfer lines 46 is inserted into the circuit via the opening 407 of the reinforcing member 406. The probe 45 is electrically connected to the recess 405 200940996 enclosed in the board 40. Moreover, the ancient cymbal can be electrically connected to the probe 45 by using the transmission line 46, and the characteristic of the beam 鬲 frequency test signal transmitted from the upper surface of the path of the _ _ _ _ _ _ _ _ _ impedance. The method of making the method is: The actual example is different from the preferred embodiment of the second embodiment, and the opening 508 of the connecting recess lo is opened below the reinforcing member 5〇6. In the step e, the four-chamber 504 and the pad 51 are electrically connected to the other end of the gate transmission line 56 of the reinforcing member 506. J J provides different electrical connection methods' and the same == 别 electrically connected to the soldering raft and the probe, so that the application of the present invention to the == can effectively solve the lack of the conventional probe card For the purpose of the present invention, the equivalent structural changes of the present invention and the scope of the patent application are intended to be included in the scope of the present invention. 9 200940996 [Simple description of the diagram] The first figure is a schematic diagram of the structure of the probe card provided in U.S. Patent No. 5,808,475. The second figure is a schematic structural view of another conventional cantilever probe card. 5 is a bottom view of a first preferred embodiment of the present invention. The fourth figure is a schematic structural view of a first preferred embodiment of the present invention. Figure 5 is a schematic view showing the structure of a second preferred embodiment of the present invention.第六 Figure 6 is a schematic view showing the structure of a third preferred embodiment of the present invention. 200940996 [Description of main component symbols] Probe card 3 Circuit board 30 Circuit layer 302, 302' Alcove 304 Reinforcing member 306 5 Slot 307 Opening 308 Colloid 309 Pad 31, 32 Signal circuit 33 Ground circuit 34 Probe 35 Transmission line 36 10 probe card 4 circuit board 40 circuit layer 402, 402' alcove 404, 405 reinforcement 406 opening 407 pad 41 probe 45 transmission line 46 15 probe card 5 alcove 504 reinforcement 506 〇 slot 508 welding Pad 51 probe 55 transmission line 56 11