TWI385392B - High-frequency vertical probe device and its application of high-speed test card - Google Patents

Description

High-frequency vertical probe device and high-speed test card for its application

The invention relates to a vertical probe card, in particular to a vertical probe device for transmitting high frequency signals and a high speed test card for the same.

During the wafer level test of the integrated circuit, the circuit design of the probe card has a very important influence on the test results of the electronic components. Especially with the higher speed operation of the electronic technology, the test process needs to be operated in the actual corresponding high-speed operation. Conditions, therefore, the electrical probe card is also designed to focus on high-frequency test conditions to achieve the integrity of the test signal transmission.

For a vertical probe card for high-density component testing, the transmission structure must also have a high-density signal transmission line before the high-frequency test signal is transmitted to the probe for touching the electronic component, if the signal transmission process In order to pass through the multi-layer printed circuit board, the circuit layout is to extend the probe from the outside to the inside and from the top to the bottom, and then electrically connect the probes, so that the circuit board material between the adjacent lines is extremely likely to cause leakage. The main cause of the current; plus the conduction hole structure of each layer of the circuit board for longitudinally translating, the energy loss of the interface reflection on the interlayer circuit board when the signal is transmitted longitudinally, which also seriously affects the transmission characteristics of the high frequency signal, and cannot conform to the electronic circuit. High-speed testing requirements for components. Furthermore, when the high frequency signal is transmitted to the probe, the parasitic capacitance effect of the dielectric environment around the probe or the crosstalk between the adjacent probes during the test signal round trip often causes a high frequency signal transmission impedance mismatch. As a result, the signal loss actually received by the test component is too high, that is, the effective gain bandwidth cannot reach the required high frequency test condition.

The first picture shows a vertical probe card 1 proposed by the inventor of the present case on August 18, 1995. It was published as the No. 200811444 patent on March 1, 1997. The structure of the transmission line 100 disposed in the space above the circuit board 10 is matched with the structure of the conductive layer 13 in the probe 11 and the probe holder 12 to meet the high frequency transmission requirement; since the probes 11 are used for spotting the wafer The probe tip 111 of the device to be tested and the tip of the ground probe 113 need to have an optimal electrical contact effect with the device to be tested. Therefore, the probes 11 have elastic bending and expansion inside the probe holder 12. The structure is adapted to conform to the change of the plane height between all the components to be tested, so that the probes 11 are not completely fastened to the probe holder 12 when they are worn, but can be used when the components to be tested are touched. The perforation of the lower guiding plate 122 generates a longitudinal displacement; thus, after long-term testing, it is inevitable to cause unnecessary wear between the conductive layer 13 and the grounding probe 113 to reduce the electrical conduction between the grounding probe 113 and the conductive layer 13. Effect, even electrical disconnection, resulting in high frequency When the signal is transmitted to the device under test by the probe 111, to maintain the impedance of the high frequency ground current signal disruption due to the transfer process, thereby changing the electrical characteristics of the DUT frequency of the received test signal.

Furthermore, since the high-frequency transmission line structure assembled in a jumper manner over the space above the circuit board 10 is a high-density arrangement, other electronic components on the circuit board 10 are required to assist in the use or manufacturing process. The test conditions of the card, the space occupied by the transmission line 100 increases the complexity of the probe card assembly process and the reliability of the process reliability. Even if there is a "semiconductor probe card for low current measurement" as provided in U.S. Patent No. 5,808,475, the transmission line can be placed in the space below the probe card circuit board, and the probe connected to the transmission line is a cantilever type probe. The needle structure cannot be applied to the high-density electronic component test on the wafer plane with a large assembly distribution; and when the test machine is pressed down to the entire probe card, the board directly in contact with the test machine is The support structure below is limited and prone to deformation. Similarly, when the probe touches the plane of the wafer, it must constantly withstand the reaction force generated from the wafer plane. Under such a long time of stress, it is used to set up the probe. The planar structure of the needle is also prone to deformation.

Therefore, the main object of the present invention is to provide a high-frequency vertical probe device and a high-speed test card thereof, and provide a high-intensity and high-quality high-frequency test structure, which can make a wafer-level electrical test project stable. The test environment can meet the transmission conditions of high frequency electrical measurement signals.

Another object of the present invention is to provide a high-speed test card, which can effectively utilize the layout space of the high-frequency test signal transmission structure, avoid unnecessary interference between high-frequency signals, and can be used for high-density high-frequency test requirements. .

In order to achieve the foregoing objective, the present invention provides a high-speed test card that utilizes a rigid structure of a support frame to support one or more layers of a circuit layer above the support frame to receive a test machine when the circuit layer is received. When the test signal sent by the station is provided, the circuit layer is provided to withstand the compressive stress from the test machine; and one or less of the single layer thickness of the adapter plate is supported under the support frame, and the inside of the adapter plate is provided for the majority The signal lines are electrically connected to the circuit layer by the signal lines, and the bottom surface of the adapter board is configured to provide a vertical probe device, so that the test signals received by the circuit layer can be transmitted to the test board via the adapter board. a probe provided by the probe device, when the probe of the probe device contacts the wafer to be tested, the support frame can provide the probe device and the adapter plate receives the reaction force from the plane of the wafer, thereby providing High-strength test structure. Moreover, by using the circuit layer and the interposer with a small layer or even a single layer thickness, the signal can pass through the circuit layer and the interposer, thereby effectively maintaining a high-frequency signal transmission environment with low leakage and low energy loss.

In addition, the probe structure of the vertical probe device provided by the high-speed test card includes a plurality of signal pins, a ground pin, and a compensation pin disposed adjacent to each of the signal pins, and the compensation pins are not used. Touching the electronic component of the wafer to be tested, and electrically connecting the grounding pin by at least one grounding layer; therefore, the probe device can electrically connect the high frequency test signal and the high frequency to each of the signal pin and the compensation pin respectively The ground signal accompanied by the signal, and the high-frequency test signal and the ground signal are electrically connected to the electronic components of the wafer to be tested by the signal pin and the grounding pin respectively, so as to maintain the signal characteristic impedance during the high-frequency signal transmission process. The accompanying ground signal keeps the current loop conducting, so that the high frequency signal received by the electronic components touched by the signal pin maintains its characteristic impedance.

In addition, the high-speed test card provides the support frame structure, so that there is enough space between the circuit layer and the adapter plate to accommodate the signal lines, so that the surface space of the circuit layer can be effectively applied and can be set. A variety of electronic components that aid or adjust test conditions to meet more sophisticated test specifications. Furthermore, since the adapter board has a signal switching function for transferring the test signal received by the circuit layer to the probe device, when there are only a few electronic components required for high frequency testing on the wafer to be tested, The signal line of the high-frequency signal can be disposed in the peripheral space of the adapter board, and does not have to be densely distributed together with the signal transmission structures of the remaining lower-band test conditions, which can effectively utilize the circuit space and reduce the probability of interference of the high-frequency test signal. What's more, the adapter board can be designed to have a space conversion function. When applied to high-density high-frequency test requirements, the layout of the top surface of the adapter board receives the high-frequency test signal. When the distance between the bottom surfaces of the boards is large, the signal lines can be electrically connected to the top surface of the converter board with a wider spacing, and then the space of the adapter board is electrically connected to the probe device. The probe of the structure, so the high-speed test card can set more signal lines for transmitting high-frequency signals to meet more high-frequency test requirements.

In the following, a number of preferred embodiments are illustrated in the accompanying drawings to illustrate the structure and function of the present invention. The following is a brief description of the drawings. The second figure is the structure of the first preferred embodiment provided by the present invention. 3 is a schematic view showing the structure of the first preferred embodiment; the fourth drawing is a perspective view of the support frame provided by the first preferred embodiment; and the fifth figure is provided by the first preferred embodiment. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6 is a schematic structural view of a second preferred embodiment of the present invention; FIG. 7 is an exploded perspective view of a third preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 9 is a schematic structural view of a fourth preferred embodiment of the present invention; FIG. 10 is a schematic structural view of a fifth preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 12 is a schematic structural view of a seventh preferred embodiment of the present invention; FIG. 13 is a schematic view of a seventh preferred embodiment of the present invention. A schematic view; FIG architecture fourteenth embodiment of a schematic diagram of the ninth preferred embodiment of the present invention is provided; the fifteenth embodiment schematic view showing the structure of a tenth preferred embodiment of the present invention is provided.

Referring to the second and third figures, the high-speed test card 2 of the first preferred embodiment of the present invention can be connected to a test machine to transmit or receive a high-frequency test signal and a ground signal to form an integrated circuit crystal. The high-frequency test card 2 includes a support frame 20, a circuit layer 30, a plurality of signal lines 40, an adapter 50 and a vertical probe device 60, wherein: Please refer to the third and fourth figures. The support frame 20 is an annular rigid body of considerable strength. It is integrally formed of a material such as metal or stainless steel. The size is equivalent to the size of a general semiconductor wafer, and the thickness is equivalent. The structure of the conventional multilayer printed circuit board can withstand the stress applied by the high-speed test card 2 during the test operation without changing the flatness of the rigid body so as not to cause deformation. The support frame 20 has a first upper and lower sides 201, 202 and a first ring portion 21, a plurality of first diameter portions 22, a second ring portion 23, and a plurality of second portions sequentially distributed from the periphery toward the center. The first ring portion 21, the second ring portion 23 and the first diameter portion 22 form a first support portion 26 of the support frame 20 for providing the diameter portion 24 and the third ring portion 25 The circuit layer 30 supports the stress received from the upper side 201 of the support frame 20; and the second diameter portion 24 and the third ring portion 25 form a second support portion 27 of the support frame 20, wherein the third ring The portion 25 is provided with the adapter 50, and the second support portion 27 assists the adapter 50 to support the stress applied by the probe device 60.

The circuit layer 30 is a single-layer printed circuit board having insulating properties, and has a plurality of test contacts 31 and correspondingly disposed via holes 32. The test contacts 31 are separated by a signal contact 311 and a ground contact 312. The grounding contact 312 is disposed at a specific distance from each of the signal contacts 311, so that the circuit layer 30 receives the high frequency test signal electrically connected to the test machine by the signal contact 311, adjacent to the The grounding contact 312 receives the grounding signal to maintain the characteristic impedance of the received high frequency test signal. Therefore, the test contacts 31 and the corresponding through holes 32 may be conductive circuits arranged in parallel with each other as shown in the figure, or may be The coaxial transmission wire is used to transmit the high frequency test signal in the form of a coaxial transmission line corresponding to the bottom of the circuit layer 30, which can achieve the structural and functional characteristics required by the invention; corresponding to each of the signal contacts 311 and the ground contact The guiding holes 32 of the 312 are respectively a signal guiding hole 321 and a grounding guiding hole 322, so that the test signal and the grounding signal received by the circuit layer 30 can be respectively connected to the circuit layer through the signal guiding hole 321 and the grounding guiding hole 322. 30 internal longitudinal guide through.

The signal lines 40 are different from the signal wires 41 for transmitting the high frequency test signals and the ground wires 42 for transmitting the ground signals, and the signal wires 41 and the ground wires 42 are adjacent to each other to form a high frequency. The transmission line 43 can effectively maintain the characteristic impedance of the signal conductor 41 for transmitting the high frequency test signal.

As shown in the third and fifth figures, the adapter 50 is supported by the third ring portion 25 of the support frame 20, and has an adapter plate 500 at the bottom, and the adapter plate 500 has insulation properties. The material has a top surface 501, a bottom surface 502, a plurality of through holes 510, and a plurality of solder pads 520. The through holes 510 are respectively formed from the top surface 501 to the bottom surface 502 and are respectively corresponding to the bottom surface 502. The soldering pads 520 are electrically connected to the soldering pads 520 on the bottom surface 502 and are formed as a signal solder pads 521, and the grounding wires 42 pass through the through holes. After 510, the pad 520 is electrically connected to form a ground pad 522.

The probe device 60 is disposed on the bottom surface 502 of the adapter plate 500, and has a probe holder 63 formed by an upper guide plate 61 and a lower guide plate 62. The probe holder 63 is provided with a plurality of probes 64. An upper grounding layer 65 and a lower grounding layer 66, wherein: each of the guiding plates 61, 62 is respectively provided with the upper and lower grounding layers 65, 66, and the two grounding layers 65, 66 are correspondingly required to touch The test conditions of the wafer electronic component have a specific layout pattern. In this embodiment, the metal film is attached to the two conductive plates 61 and 62 by a copper foil attaching method or a thin film process, and The local metal film should be removed from the position of each of the signal pads 521 of the adapter plate 500 to form an opening 651, 661, respectively, so that the openings 651, 661 can pass through the portion of the probe 64 without being connected to the two The formations 65, 66 are electrically connected.

The probes 64 are inserted through the probe holder 63 to maintain the needle-holding state, and are distinguished by a signal pin 641, a grounding pin 642, a first compensating pin 643, and a second compensating pin 644. Each of the signal pins 641 and the grounding pins 642 are respectively electrically connected to the test signal and the ground signal, and the tip end portion of each end protrudes from the lower guide plate 62 to touch the electronic component to be tested, and the other end is electrically connected to the other end. The signal pad 521 and the ground pad 522 are disposed on the adapter board 500. The signal pin 41 passes through the openings 651 and 661 of the two ground layers 65 and 66 when the probe holder 30 is inserted. The two grounding layers 65 and 66 are electrically isolated, and can effectively transmit the high frequency test signal from the signal conductor 41. The grounding pin 642 provided by the present invention is mainly a functional structure electrically connected to the upper grounding layer 65. Therefore, this embodiment The structure in which the grounding pin 642 is connected to the grounding pad 522 is only necessary for the assembly and fixing of the grounding pin 642, and is not necessary, even if the needle tail portion directly abuts against the upper grounding layer 65. The effect of the grounding pin 642 is fixed. Each of the first compensation pins 643 is arranged side by side with the signal pin 641. The tip end portion of the first compensation pin 643 is in electrical contact with the lower ground layer 66 disposed on the lower guide plate 62, and the needle end portion at the other end is The grounding pad 522 is electrically connected to the adapter plate 500. The second compensation pin 644 and the first compensation pin 643 are connected to the lower grounding layer 66, and are fixed to the upper guiding plate 61 and electrically connected. The grounding layer 65 is connected to the grounding layer 642. The grounding pin 642 is electrically connected to the grounding pin 642. Therefore, the grounding signal required to maintain the signal characteristic impedance during the transmission of the high frequency signal is provided by the signal pin 641. The path is electrically conductive. The first path is via the grounding pin 642, the upper grounding layer 65, the second compensation pin 644, the lower grounding layer 66, and the first compensation pin 643. The second path is via the grounding pin 642 and the lower grounding layer. 66 and the first compensation pin 643, when the grounding pin 642 and the lower grounding layer 66 are worn against each other in the second path to cause an electrical disconnection phenomenon, between the testing machine and the electronic component to be tested, The first path keeps the current loop of the ground signal conductive.

In summary, the high-speed test card 2 provided by the present invention supports the circuit layer 30 and the adapter 50 of a single layer thickness by using the rigid structure of the support frame 20, so that the adapter 50 has a prior art US5808475. The structure of the probe is mentioned to have a higher strength to support the probe device 60, and can provide a high-strength test structure; and the circuit layer 30 and the adapter plate 500 with a single layer thickness can effectively maintain low leakage. And a high-frequency signal transmission environment with low energy loss. Of course, within the scope of the energy loss problem, the structure of the circuit layer 30 and the adapter plate 500 is not limited to a single layer thickness, and a thickness of two layers may be formed to increase the circuit. The structural strength of layer 30 and adapter plate 500. Furthermore, since the signal lines 40 are disposed under the circuit layer 30 to transmit test signals from the circuit layer 30 to the probe device 60, the surface space of the circuit layer 30 can be effectively applied, and various auxiliary devices can be provided. Or adjust the electronic parts of the test conditions to meet the more precise test specifications. Moreover, after the high frequency test signal is received by the signal contact 311 of the circuit layer 30, the ground via 322 and the ground lead are respectively disposed along the path through the signal guiding hole 321, the signal wire 41 and the signal pin 641. 42 and the first compensation pin 643 are arranged side by side adjacent to each other to maintain the characteristic impedance of the high frequency signal transmission; further, the lower ground layer 66, the second compensation pin 655, the upper ground layer 65, and the ground pin 642 are disposed. After the current signal of the ground signal is looped to the first compensation pin 643, the contact pad provided by the high-frequency electronic component touched by the grounding pin 642 can be effectively turned on, and the high frequency of the signal pin 641 can be ensured. The high frequency signal received by the electronic component maintains its characteristic impedance.

In addition, please refer to FIG. 6 , which shows a high-speed test card 3 according to a second preferred embodiment of the present invention. The difference between the above embodiments is that the circuit layer 30 and the adapter board are connected to the circuit board 30 and the adapter board. A colloid 28 is disposed between the 500, and the colloid 28 not only has good insulation properties, but also has a suitable strength structure in conformity with the structural shape of the support frame 20 to strengthen the support strength of the support frame 20, and at the same time, The signal line 40 is enclosed therein for blocking the external moisture from contacting the signal line 40. For example, the epoxy material provided in this embodiment is first filled between the circuit layer 30 and the interposer 500. The solid-bake molding can achieve a good adhesion effect with the circuit layer 30 and the adapter plate 500, and further strengthen the support strength of the support frame 20, so that the material of the support frame 20 can be selected with a large selection space. The structural material with lower cost and relative strength can achieve the equivalent function.

Referring to FIG. 7 and FIG. 8 , a high-speed test card 4 according to a third preferred embodiment of the present invention includes a support frame 20 ′, a circuit layer 30 ′, and a plurality of signal lines 40 ′. An adapter 50' and a probe device 60' differ from the first preferred embodiment in that the support frame 20' is a two-piece rigid body structure having inner and outer rings, that is, an outer ring. a first support portion 21' and a second support portion 22' of the inner ring are respectively provided with the circuit layer 30' and the adapter seat 50'; the first support portion 21' is provided with a plurality of perforations 211' An inner ring portion 212' and a plurality of locking portions 213' located in the inner ring portion 212'. The second support portion 22' has an inner ring portion 221', an outer ring portion 222', and the outer ring. a plurality of locking portions 223' of the portion 222'; the through holes 211' of the first supporting portion 21' are for the corresponding signal lines 40' to pass through the lower portion of the first supporting portion 21' and the circuit layer 30' The inner ring portion 212' of the first supporting portion 21' is connected to the outer ring portion 222' of the second supporting portion 22' by the locking portions 213', 223' The plurality of gaps are formed between the two supporting portions 21', 22' adjacent to the locking portions 213', 223'. The signal lines 40' are located below the first supporting portion 21'. Extending through the inner ring portion 221' of the second support portion 22', the inner ring portion 221' of the second support portion 22' is used to set the adapter seat 50'; the support frame 20', the circuit layer After the assembly of the 30', the adapter 50' and the probe device 60', an upper and lower cover 201', 202' are respectively locked on the upper and lower sides of the support frame 20', and the upper cover 201' covers the first The second supporting portion 22 ′ is interlocked with the first supporting portion 21 ′, and the lower cover 202 is opposite to the circuit layer 30 ′ and the second supporting portion 22 ′ is disposed, so that the circuit layer 30 ′ and the The electrical connection portion of the signal line 40' is exposed to prevent foreign matter contamination and affect the electrical quality of the high-speed test card 4.

It is to be noted that the probe devices 60, 60' provided by the above embodiments of the present invention mainly maintain the integrity of the ground current loop, and do not limit the layout of the grounded metal on the two guide plates 61, 62. As shown in the ninth embodiment, the probe device 70 of the fourth preferred embodiment of the present invention is different from the above embodiment in that the two guide plates 61 and 62 are formed on the upper and lower sides. The ground layers 71 and 72 are provided with a specific electrical connection structure for the ground pins 642 and the compensation pins 643 and 644 to be placed at the probe holder 63. Therefore, the upper ground layer 71 can be electrically connected. The wiring structure of the second compensation pin 644 and the grounding pin 642 is electrically connected to the thin film metal piece of the second compensation pin 644 and the grounding pin 642; similarly, the lower grounding layer 72 can be electrically Connecting the wire arrangement of each of the first compensation pin 643 and the second compensation pin 644, or electrically connecting the film metal sheet of the first compensation pin 643 and the second compensation pin 644; The two ground layers 65, 66 of the above embodiment are in the process of being fabricated. The possibility of electrically shorting the ground layers 65, 66 and the signal pins 641 due to a lack of process such as etching.

In order to ensure that the compensation pins 643 and 644 have an optimal fixing effect in the probe holder 63 to ensure that the ground current loop is not interrupted, please refer to the fifth preferred embodiment of the present invention as shown in FIG. Providing one of the probe devices 73 is different from the one provided in the first preferred embodiment in that a plurality of recesses 741 are dug on the lower guide plate 74 corresponding to the positions of the compensation pins 643 and 644. When the metal film is attached to the lower conductive plate 74 to form the grounding layer 75, the recesses 741 form a plurality of recesses 751 corresponding to the lower ground layer 75. Therefore, the probe device 73 can make the compensation pins 643 and 644. Corresponding to the top surface of the lower ground layer 75, the recess 751 has a better electrical contact effect, and the compensation pins 43 and 44 are prevented from being laterally displaced.

Please refer to the probe device 76 of the sixth preferred embodiment of the present invention as shown in FIG. 11 , which differs from the first preferred embodiment in that it has several metal materials. The locking component 77 extends through the edges of the upper and lower guide plates 61, 62, and the two guiding plates 61, 62 can be fixed, and each of the locking components 77 directly serves as a grounding current loop to the upper and lower grounding layers. Between 65 and 66, the second compensation pins 644 as required for the first preferred embodiment described above may be omitted.

Please refer to the probe device 80 of the seventh preferred embodiment of the present invention as shown in FIG. 12, which is different from the above-mentioned first preferred embodiment in that it is made of a metal material. The lower guide plates 81 and 82 are provided for the signal pins 41 to be electrically insulated from the signal pins 641, so that the characteristics of the high-frequency signals transmitted by the signal pins 641 are not affected, and the two guide plates 81 are The technical means for electrically insulating the signal pins 641 are well known to those skilled in the art. The present embodiment provides for the signal pins 41 to be disposed on the guide plates 81 and 82. Each of the through holes 811, 821 has an insulating layer 812, 822, so as to keep the signal pins 641 electrically isolated from the two guiding plates 81, 82, and the upper portion The inner diameter of the through hole 811 of the guide plate 81 is larger than the outer diameter of the signal pad 521 electrically connected to the adapter plate 500, and the upper guide plate 81 is electrically connected to the signal pads 521; Therefore, the two guiding plates 81 and 82 also have the function of a ground layer, and the ground current loop is connected to the first compensation. Between pin 643 and ground pin 642 may be omitted provided the plurality of first ground layer as described in the preferred embodiment provides a needle 65, 66 and 644 of the second compensation. Of course, if it is more convenient to manufacture, it is also possible to sleeve the insulating sleeve around the signal pin 641 and directly pass through the guide plate made of metal as described above, which has the same effect.

Referring to the probe device 90 of the eighth preferred embodiment of the present invention as shown in FIG. 13, the difference from the first preferred embodiment is that the bottom surface of the adapter plate 500 is The 502 is provided with an upper grounding layer 85, which can be formed together when the circuit of the adapter board 500 is disposed, omitting the manufacturing man-hour and cost of the metal film to be disposed on the upper guiding plate 61; The circuit layout structure is also not limited to a comprehensive thin film metal layer or a partial wire, a metal piece, etc., and the grounding signal can be borrowed by the second compensation pin 644 and the grounding pin 642. A complete current loop is maintained by the first compensation pin 643, the lower ground layer 66, the second compensation pin 644, the upper ground layer 85, and the ground pin 642.

In addition, the electrical connection between the circuit layer and the probe device provided by the above embodiments of the present invention is directly connected by using the signal line through the adapter plate to achieve the effect of high-frequency signal transmission, but actually turns The space available for the signal line to be connected is limited, and the difficulty of the insertion of the adapter board and the complexity of the line assembly are affected when the high-density layout is required; please refer to the ninth preferred embodiment of the present invention as shown in FIG. The high speed test card 5 provided in the embodiment has a support frame 20", a circuit layer 30", a plurality of signal lines 40", an adapter 50" and a probe device 60", and the first The difference between the preferred embodiments is that one of the adapter plates 500" disposed at the bottom of the adapter 50" can be a general printed circuit board (PCB), an organic multilayer board (MLO) or multiple layers. A space converter with a circuit space conversion function made by a structure such as a multi-layer ceramic (MLC) has a top surface 501", a bottom surface 502" and a top surface 501" extending from the top surface 502 to the bottom surface 502. "The majority of the signal wires 51" and the connection The wires 52", each of the signal wires 51" are juxtaposed with at least one of the ground wires 52" adjacent to each other, so that the circuit transmission structure can be spatially converted from the top plate 501" of the adapter plate 500 to the turn The bottom surface 502" of the board 500", each of the signal wires 51" and the grounding wire 52" adjacent thereto are electrically connected to the signal pins 641 and the bottom of the adapter plate 500" A compensation pin 643 is effective for transmitting the high frequency test signal and the ground signal by the signal pin 641 and the ground pin 642 to maintain the transmission of the high frequency test signal and the ground signal between the test machine and the electronic component to be tested. Sex.

With the high-speed test card 5 provided in this embodiment, a portion of the signal line 40" can be disposed on the periphery of the probe device 60" and electrically connected to the probe 64 through the adapter plate 500". It is not necessary to be all intensively above the probe device 60"; therefore, when there are only a few electronic components required for high frequency testing on the wafer to be tested, each of the signal wires 51" and adjacent ones of the at least one grounding conductor 52 are juxtaposed. The high-frequency transmission line structure can be disposed in the peripheral space of the adapter board 500, and does not have to be densely distributed together with the signal transmission structures of the remaining lower-band test conditions, which can effectively utilize the circuit space and reduce the high-frequency test signal. Moreover, compared with the first preferred embodiment, not only the top surface 501" of the adapter plate 500" can receive a large amount of the signal line 40" transmitted by the signal line 40". Testing the signal, and for the high frequency transmission line structure formed by each of the signal wires 51" and the adjacent ones of the at least one grounding conductor 52", the wiring distance can be smaller as the probe device 60" is closer to the probe device 60" High frequency transmission The line structure, that is, the space conversion function of the adapter board 500", the distance between the signal wires 51" on the top surface 501" may be far greater than the distance between the signal wires 51" on the bottom surface 502" Therefore, it is possible to set more high-frequency transmission line structures to perform more high-frequency tests; of course, the adapter board 500", the top surface 501" or the bottom surface 502" can have enough circuit space to set up the auxiliary test electronics. The component, when the test signal is transmitted to the adapter plate 500", is processed by the electronic component and then transmitted to the probe device 60" according to the requirements of the test condition.

As a matter of considering the different circuit layouts of the plurality of wafers to be tested, the probes 64 may have different corresponding types of electronic components to be tested, as shown in the fifteenth embodiment of the present invention. A high-speed test card 6, which is different from the one provided in the ninth preferred embodiment, is an adapter 53" having a first adapter plate 531" at the bottom of the adapter 53" and the same circuit space as described above. a second adapter plate 532" of the conversion function, the two sides of the first adapter plate 531" are electrically connected to the signal wires 40" and the second adapter plate 532" respectively; therefore, when the second adapter plate The inner lead of the 532" and the probe 64 of the probe device 60" can be replaced with different positions to conform to the characteristics of the electronic component to be tested at different positions, and only the first interposer 531" and the line need to be re-arranged. The second adapter board is reassembled without separately modifying the soldering assembly of the signal lines 40" and the first interposer board 531", so that the high-speed test card 6 can effectively conform to the testing requirements of a plurality of wafers to be tested.

The above-mentioned embodiments are merely preferred embodiments of the present invention, and equivalent structural changes to the scope of the present invention and the scope of the claims are intended to be included in the scope of the present invention.

2, 3, 4, 5, 6. . . High speed test card

20, 20', 20"... support frame

201. . . Upper side

202. . . Lower side

201’. . . Upper cover

202’. . . lower lid

twenty one. . . First ring

twenty two. . . First diameter

twenty three. . . Second ring

twenty four. . . Second diameter

25. . . Third ring

26, 21’. . . First support

211’. . . perforation

212’, 221’. . . Inner ring

213’, 223’. . . Locking department

27, 22’. . . Second support

222’. . . Outer ring

28. . . colloid

30, 30', 30"... circuit layer

31. . . Test contact

311. . . Signal contact

312. . . Ground contact

32. . . Guide hole

321. . . Signal guide hole

322. . . Grounding via

40, 40', 40"... signal line

41, 51"...signal wire

42, 52"... grounding wire

43. . . Transmission line

50, 50', 50", 53". . . Adapter

500, 500"... adapter plate

531"...first adapter plate

532"...second adapter plate

501, 501"... top surface

502, 502"... bottom surface

510. . . Through hole

520. . . Solder pad

521. . . Signal pad

522. . . Grounding pad

60, 60', 60", 73, 76, 80, 90... probe devices

61, 81. . . Upper guide

62, 74, 82. . . Lower guide

63. . . Probe holder

64. . . Probe

641. . . Signal pin

642. . . Grounding pin

643. . . First compensation needle

644. . . Second compensation needle

65, 71, 85. . . Upper ground plane

66, 72, 75. . . Lower ground plane

651, 661. . . Opening

741, 751. . . Concave

77. . . Locking component

811, 821. . . Through hole

812, 822. . . Insulation

The first figure is a schematic structural view of a conventional vertical probe card;

The second drawing is an exploded perspective view of a first preferred embodiment of the present invention;

The third figure is a schematic structural view of the first preferred embodiment;

The fourth figure is a perspective view of the support frame provided by the first preferred embodiment;

The fifth figure is a schematic structural view of the probe device provided by the first preferred embodiment;

Figure 6 is a schematic structural view of a second preferred embodiment of the present invention;

Figure 7 is an exploded perspective view of a third preferred embodiment of the present invention;

Figure 8 is a schematic structural view of the third preferred embodiment;

Figure 9 is a schematic view showing the structure of a fourth preferred embodiment of the present invention;

Figure 11 is a schematic view showing the structure of a fifth preferred embodiment of the present invention;

11 is a schematic structural view of a sixth preferred embodiment of the present invention;

Figure 12 is a schematic structural view of a seventh preferred embodiment of the present invention;

Figure 13 is a schematic structural view of an eighth preferred embodiment of the present invention;

Figure 14 is a schematic view showing the structure of a ninth preferred embodiment of the present invention;

The fifteenth embodiment is a schematic structural view of a tenth preferred embodiment of the present invention.

2. . . High speed test card

20. . . Support frame

201. . . Upper side

202. . . Lower side

twenty one. . . First ring

twenty three. . . Second ring

25. . . Third ring

30. . . Circuit layer

31. . . Test contact

311. . . Signal contact

312. . . Ground contact

32. . . Guide hole

321. . . Signal guide hole

322. . . Grounding via

40. . . Signal line

41. . . Signal wire

42. . . Ground wire

43. . . Transmission line

50. . . Adapter

60. . . Probe device

Claims (28)

A high-speed test card for electrically connecting to a test machine, capable of transmitting or receiving test signals and ground signals for high-frequency electrical testing of electronic components to be tested on an integrated circuit wafer, including: a support The rack has a first and a second supporting portion, the second supporting portion is surrounded by the first supporting portion; a circuit layer is disposed on the first supporting portion of the supporting frame, and the circuit layer is provided with a plurality of tests The test points are electrically connected to the test machine. The test contacts are respectively configured to receive the test signal and the ground signal respectively, and the adjacent signal contacts have at least one ground connection. An adapter plate is disposed on the second support portion of the support frame, and the adapter plate is provided with a plurality of solder pads, wherein the solder pads are separated by a signal pad and a ground pad, respectively electrically connected to the circuit a signal contact and a ground contact of the layer; a vertical probe device disposed on the adapter plate, having a ground layer, a plurality of signal pins, a plurality of first compensation pins, and at least one ground pin, each of the signal pins And the grounding pin is used to touch the above-mentioned electric power to be tested The grounding pin is electrically connected to the grounding layer, and each of the signal pins is electrically connected to the signal soldering pad of the adapter plate, and each of the signal pins is adjacently disposed with the first compensation pin, and each of the first compensation pins has a tip and a tail, the tip is disposed on the ground layer, and the tail is electrically connected to the ground pad of the adapter. According to the high-speed test card of claim 1, the vertical probe device is provided with a probe holder having a pair of upper and lower guides, each of the signal pins and the ground pin The lower guide plate is disposed, and the ground layer is disposed on the lower guide plate. According to the high-speed test card of claim 2, the lower guide plate is recessed with a plurality of recesses of a predetermined depth, and the recesses have the ground layer, and the tip of each of the first compensation needles is placed in the recess . According to the high-speed test card described in claim 2, the grounding layer is made of a metal film material attached to the probe base and is formed by a plurality of openings, and the openings correspond to the signal pins. The signal pins are electrically insulated from the ground plane. According to the high-speed test card described in claim 2, the ground layer is a lower ground layer, and the vertical probe device further includes an upper ground layer electrically connected to the lower ground layer, the upper connection The ground layer is disposed on the upper guiding plate, and the grounding pin is electrically connected to the lower grounding layer through the upper grounding layer. According to the high-speed test card described in claim 5, there are a plurality of locking elements made of metal material, and the upper and lower guiding plates are inserted and electrically connected to the upper ground layer and the lower ground layer. . According to the high-speed test card described in claim 2, the ground layer is a lower ground layer, and the vertical probe device further includes an upper ground layer electrically connected to the lower ground layer, the upper connection The ground layer is disposed on the adapter plate, and the ground pin is electrically connected to the lower ground layer through the upper ground layer. According to the high-speed test card of the fifth or seventh aspect of the invention, the vertical probe device is further provided with at least one second compensation pin, and the at least one second compensation pin is electrically connected to the upper and lower ground layers. According to the high-speed test card of claim 8, the vertical probe device is provided with a plurality of second compensation pins and a plurality of ground pins, and the lower ground layer is electrically connected to each of the first compensation pins and each The wire of the second compensation pin is electrically connected to each of the second compensation pin and the wire of each of the ground pins. According to the high-speed test card of claim 8, the vertical probe device is provided with a plurality of second compensation pins and a plurality of ground pins, and the lower ground layer is electrically connected to the first compensation pins and the The metal plate of the second compensation pin is electrically connected to the second compensation pin and the metal piece of the ground pins. According to the high-speed test card described in claim 1, the vertical probe device is provided with a probe base made of a metal material, and the probe base is opposite to an upper guide plate and a lower guide plate. The grounding layer is formed by the combination, and the signal pins are electrically isolated from the probe holder. According to the high-speed test card described in claim 11, the upper guide plate and the lower guide plate are provided with a plurality of through holes respectively corresponding to the signal pins, and the inner diameter of the through holes provided in the upper guide plate The signal electrode is larger than the outer diameter of the signal pad corresponding to the electrical connection of the signal pin, and each of the signal pin and the through hole is insulated to be spaced apart by a specific distance. According to the high-speed test card of claim 12, the inner wall of each of the through holes is provided with an insulating layer, and the thickness of the insulating layer is the distance between the signal pin and the through hole. According to the high-speed test card of claim 1, the adapter board has a top surface and a bottom surface, and the bottom surface is provided with the solder pads, and the adapter board has a plurality of signal wires and ground wires Correspondingly, the signal soldering pads and the grounding pads are electrically connected to each other, and at least one of the grounding wires is disposed adjacent to each of the signal wires, and each of the signal wires and the adjacent one of the grounding wires constitute a high Frequency transmission line. According to the high-speed test card of claim 14, the high-frequency transmission line is electrically connected to the signal contact and the adjacent one of the ground contacts, and extends through the support frame. The first and second support portions are then electrically connected to the signal pad and the ground pad through the adapter plate. According to the high-speed test card of claim 14, the two ends of the signal wire and the ground wire are respectively located on the top surface and the bottom surface of the adapter plate. According to the high-speed test card described in claim 16 of the patent application, the distance between adjacent signal wires is gradually reduced from the top surface to the bottom surface of the adapter plate. According to the high-speed test card described in claim 16 of the patent application, the adapter plate is made of a printed circuit board, a multilayer organic structure or a multilayer ceramic structure. According to the high-speed test card of claim 1, the first support portion of the support frame has a first ring portion, a plurality of first diameter portions and a second ring portion, and the first diameter portions are connected to the The first and second ring portions are in contact with the first ring portion and the first diameter portions. According to the high-speed test card of claim 19, the second support portion of the support frame has a plurality of second diameter portions and a third ring portion, and the second diameter portions are connected to the second and third rings. The third ring portion surrounds and supports an adapter, and the adapter plate is disposed at the bottom of the adapter. According to the high-speed test card described in claim 20, the support frame is made of an integrally formed rigid structure. According to the high-speed test card of claim 19, the second support portion of the support frame has an inner ring portion and an outer ring portion, and the outer ring portion is opposite to the second ring portion of the first support portion. The inner ring portion surrounds and supports an adapter, and the adapter plate is disposed at the bottom of the adapter. The high-speed test card according to claim 1, further comprising a glue, being poured between the first and second support portions of the support frame, and between the circuit layer and the adapter plate. According to the high speed test card of claim 19 or 23, the circuit layer is made of a single layer printed circuit board structure. According to the high-speed test card described in claim 1 of the patent application, a plurality of signal lines are disposed between the circuit layer and the interposer board, and the signal lines are separated by signal wires and ground wires, and the signal wires are respectively The signal contact of the circuit layer is electrically connected to the signal solder pad of the adapter board, and each of the ground wires electrically connects the ground contact of the circuit layer to the ground pad of the adapter board. According to the high speed test card of claim 25, the adapter plate is made of a single layer printed circuit board structure. According to the high-speed test card of claim 25, each of the signal wires and the adjacent at least one of the ground wires form a high-frequency transmission line, and the adapter plate has a top surface and a bottom surface. The signal pad and the ground pad are disposed on the bottom surface, and each of the high frequency transmission lines is electrically connected to the signal pad and the ground pad on the top surface of the adapter plate. According to the high-speed test card described in claim 27, the adapter board is further provided with a plurality of signal wires and ground wires extending from the top surface to the bottom surface, and the signal wires and grounding of the adapter board The wire is respectively provided with the signal pad and the ground pad on the bottom surface.