1301543 九、發明說明： 【發明所屬之技術領域] 本發明係與垂直式探針卡有關，特別是指一種用以傳 遞高頻訊號的垂直式探針卡。 【先前技術】 15 20 由於半導體技術的快速發展，得以實現積體電路 (Integrated Circuit，1C)體積微型化、功能多元化以及處理 速度、頻率增加的要求，為達此要求，必須增加1C的輸入、 輸出（I/O)接點以滿足多功訊號處理需求，使得1/〇接點 配置朝向成高密度矩陣分布，因此晶圓電測用測試探針卡 中，適用於高密度矩陣分布之垂直式探針卡則變得更為重 要，尤其隨著電子元件愈趨高速、高頻的運作條件下，電 子元件在往有咼標準的電性規格，如元件運作條件、操作 頻率與訊號傳輸特性等，故電麻針卡在設計上同樣需著 重測試條件、測試頻寬與測試訊號傳輸的完整性。 以第；圖所示習用之垂直式探針卡i而言，探針卡電 路板10藉由同軸傳輸線n傳遞測試機台所送出的高頻= 觀號2G錢針組12，以對晶㈣上的频電路細作 =測試’其中，同軸傳輸線11是以金屬導線為轴芯，並 ^周圍包覆—層介電材料’再於介電材料之外層包覆 至屬所形成結構（未顯示於圖中）’探針組I]耳有一上 =板121下導板122及複數個垂直式探針，上 導板12卜122用以插設各探針12〇使接設 川 亚與同軸傳輪線Η或其他訊號線電性連接；因此藉由同轴 4 1301543 傳輸線11外層包覆的導電金屬與電路板ίο接地電位電性 連接，目的為維持高頻訊號傳輸的特性阻抗，然而，:於 同軸傳輸線11末端至晶圓30之間尚有探針組12的結構: 探針組12中上、下導板121、122皆以非導電性材❸斤製 5成，用以防止訊號間產生漏電流現象，且各探針12〇僅^ 一導電金屬，其外層並無類似同軸傳輸線11之結構處理， 故同軸傳輸線11的高頻訊號傳輸至探針120時，探針12〇 周圍介電環境的寄生電容效應會造成高頻訊號傳輸的介電 損耗，因此，如第二圖所示為垂直式探針卡丨之訊號頻率 10特性曲線圖，圖中之反射耗損（returnl〇ss)曲線S22顯示 其高頻訊號阻抗不匹配的情形，圖中之插入耗損（insertion loss)曲線S21更顯示訊號傳輸於_3dB增益之通帶 (passband)限制頻率低於200MHz，遠低於GHz頻段的高 頻測試條件。 15 習知上縱使有如第三圖所示為歐洲專利公告第 『0180013』號所提供之探針組14,為以多層穿孔導板疊置 出基座100後再穿設探針102、104、1〇6的組合結構，雖 然可於訊號探針102周邊佈設高頻傳輸所需搭配的接地金 屬，以達成維持高頻電測訊號傳輸的特性阻抗，然各探針 2〇 102、104、106為嵌設於基座100 ’不具有任何的彈性空間， 故若欲藉該探針組Η做晶圓測試工程，各探針1〇2、1〇4、 106之金屬結構容易造成晶圓上測試接點的損毀，更甚者傷 及晶圓内部之電路結構，使該探針組14實不適宜用做晶圓 測試。 5 1301543 因此 破p 纟轉高賴麟輸的紐阻抗，同時避免 面臨的一 破體電路，實域今探針卡製造者所 大考驗。 1 【發明内容】 探針卡，可以t θ之主要目的乃在於提供—種垂直式高頻 並有效應用^^^^輸結構傳送高頻電測訊號， 卡及本發明所提供-種垂直式高頻探針 上、下相對之其:該電路板可區分為 數個訊號線路及接二泣I:面’该電路板上設置有多 距上設有至少號線路相鄰特定之間 接也線路，該些接地綠帝 15 20 接地面，該接地面為具導電性之金、^生—通至一 組設於該電路板之下表面上，具有_、t:衣成；該探針 探針、複數個補償探針、至少一/接v電層、複數個訊號 之-上導板與一下導板，兮二要地探針及上、下分別設置 針及該導電層皆為具導電性^^木針、補償探針、接地探 設於該電路板上’各該訊號探Π ^所製成，該上導板 正向穿設該上、下導板，使該二:相及接地探針為 地探針可豎立於該二導彳;°犰彳木針、補償探針及接 樣，該上、下路板相互垂直之態 補償探針及接地探針可於該容t置空間，各該訊號探針、 設於該下導板上使該些補償令作位移’該導電層 枝針及接地探針皆與該導電層 6 1301543 、但於各该訊號探針穿設處留置有適當的空間避 2¾層與各该訊號探針電性接觸，各該訊號探針電性 連，各該訊號線路，與各該訊號探針相鄰特定之間距上旅 歹k置有至^ 4補償探針，各該補償探針電性連接該接地 5 面。 …因此’當該探針卡電氣連接至測試機台 ，則藉由各該 路傳遞電測簡錢訊舰針，由於喊傳輸過程 ▲种（配^有各该接地線路及補償探針的設置，可因此有 效維持訊號阻抗特性以傳遞高頻訊號。 10 【實施方式】 以下，茲配合圖示列舉若干較佳實施例，用以對本 二月之、、、Q構與功效作詳細說明，其中所用圖示要說 明如下： 2四圖本發明所提供第—較佳實施例之上視圖； ，五圖係上述第一較佳實施例之結構示意圖； 第六11係Ji述第—紐實關所提縣探雌及探針組 之結構示意圖； 2〇夕4帛七圖係上述第一較佳實施例所提供該探針卡訊號傳遞 之頻寬特性曲線圖； f八圖係本發明所提供第二較佳實施例之結構示意圖； ^九圖係上述第二較佳實施例所提供聰針卡訊號傳遞 I頻寬特性曲線圖。 請參閱如第四及第五圖所示本發明所提供之第一較佳 7 1301543 2例’為用以量測晶圓電子元件之—垂直式探針卡2，包 栝有—電路板40、一探針座5〇及一探針組6〇，並中. 該電路板40可定義出相對之一上表面彻及一下表面 及自外圍至中心分佈之一測試區彻、—跳線區綱 —挺針區405,該上表自4()1之測試區彻電氣連接至一 ' ^台（圖中未示），該測試機台可輸出-般電測訊號甚 .^頻訊號至該探針卡2，該電路板4G上設置有多數個訊 k線路41及接地線路42，與各該訊躲路41彳目鄰特定之 間距上設有至少-該接地線路4 2，訊號線路4 i包括有佈設 1〇於電路板表面的訊號走線川及自測試區4〇3跳線至探針 以05之訊號傳輸線412，同理，接地線路42包括有接地 走線421及接地傳輸線422。 . 该抵針座50為設於該電路板40中央環形缺口之一槽 體其槽口 5〇ι向上可供該些訊號傳輸線412及接地傳輸線 丨5 422延伸進入，第五圖參照，其槽底5〇2疊設有一底板51 及-接地面52，該底板51 ^具良好絕緣特性的材料所製 、 成，該接地面52為具導電性的金屬材質所製成，該底板51 • 上設有多數個通孔510,各通孔510大小為相當於各該訊號 傳輸線412之線徑，各該訊號傳輸線412穿過該接地面52 2〇延伸至底板51内且穿過通孔5ι〇後於該槽底5〇2露出，該 些接地傳輸線422為電性連接該接地面52並延伸至底板51 内且穿過通孔510後使末端設於該槽底5〇2露出。 請芩閱如第六圖所示，該探針組60設於該探針座50 之槽底502上，具有一導電層61、一上導板62、一下導板 8 1301543 黪 10 151301543 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a vertical probe card, and more particularly to a vertical probe card for transmitting high frequency signals. [Prior Art] 15 20 Due to the rapid development of semiconductor technology, it is possible to realize the miniaturization, functional diversification, and processing speed and frequency increase of Integrated Circuit (1C). In order to meet this requirement, it is necessary to increase the input of 1C. And output (I/O) contacts to meet the multi-signal processing requirements, so that the 1/〇 contact configuration is oriented toward a high-density matrix, so the test probe card for wafer electrical test is suitable for high-density matrix distribution. Vertical probe cards have become more important, especially with the increasing speed and high-frequency operation of electronic components. Electronic components are subject to standard electrical specifications, such as component operating conditions, operating frequency and signal transmission. Characteristics, etc., so the design of the electric needle card also needs to focus on the test conditions, test bandwidth and the integrity of the test signal transmission. In the case of the conventional vertical probe card i shown in the figure, the probe card circuit board 10 transmits the high frequency = 2G money needle set 12 sent by the test machine through the coaxial transmission line n to the crystal (four) The frequency circuit is finely tested = where 'the coaxial transmission line 11 is a metal wire as the core, and the surrounding layer is covered with a layer of dielectric material' and then coated on the outer layer of the dielectric material to form a structure (not shown) Medium) 'probe group I> has an upper = plate 121 lower guide plate 122 and a plurality of vertical probes, and the upper guide plate 12 122 is used to insert each probe 12 to connect the Chuanya and the coaxial transfer wheel The wire or other signal line is electrically connected; therefore, the conductive metal covered by the outer layer of the coaxial 4 1301543 transmission line 11 is electrically connected to the ground potential of the circuit board for the purpose of maintaining the characteristic impedance of the high-frequency signal transmission, however: There is a structure of the probe set 12 between the end of the coaxial transmission line 11 and the wafer 30: The upper and lower guide plates 121 and 122 of the probe set 12 are made of non-conductive materials, and are used to prevent signal generation. Leakage current phenomenon, and each probe 12 〇 only a conductive metal, the outer layer has no similar coaxial transmission The structure of the transmission line 11 is processed. Therefore, when the high-frequency signal of the coaxial transmission line 11 is transmitted to the probe 120, the parasitic capacitance effect of the dielectric environment around the probe 12 会 causes the dielectric loss of the high-frequency signal transmission, and therefore, as the second The figure shows the signal frequency 10 characteristic curve of the vertical probe cassette. The reflection loss (return 〇ss) curve S22 shows the high frequency signal impedance mismatch, and the insertion loss in the figure. Curve S21 further shows that the passband of the signal transmitted at _3dB gain is limited to a frequency lower than 200MHz, which is much lower than the high frequency test condition of the GHz band. 15 It is known that the probe set 14 provided in the European Patent Publication No. "0180013" is shown in the third figure, and the probes 102, 104 are disposed after the pedestal 100 is stacked with the multi-layer perforated guides. The combination structure of 1〇6 can be used to arrange the grounding metal required for high-frequency transmission around the signal probe 102 to achieve the characteristic impedance for maintaining the transmission of the high-frequency electrical measurement signal, and the probes 2〇102, 104, 106 In order to be embedded in the pedestal 100', there is no elastic space, so if the probe set is to be used for wafer testing, the metal structures of the probes 1, 2, 4, 4, 106 are easily caused on the wafer. The damage of the test contacts, and even the internal circuit structure of the wafer, makes the probe set 14 unsuitable for wafer testing. 5 1301543 Therefore, breaking the high impedance of Gao Lailin's loss, while avoiding a broken circuit, the real probe card makers have been tested. 1 [Summary of the Invention] The main purpose of the probe card, t θ is to provide a vertical high frequency and effectively use the ^^^^ transmission structure to transmit high frequency electrical signals, the card and the vertical type provided by the present invention The high-frequency probe is opposite to the upper and lower sides: the circuit board can be divided into a plurality of signal lines and the second weeping I: the surface of the circuit board is provided with a plurality of lines adjacent to each other and a specific line between the adjacent lines. The grounded green emperor 15 20 ground plane, the ground plane is a conductive gold, the raw - pass to a group on the lower surface of the circuit board, having _, t: clothing; the probe probe a plurality of compensation probes, at least one/v electrical layer, a plurality of signals, an upper guide plate and a lower guide plate, and the probes and the upper and lower probes are respectively provided with the conductive layer ^^木针,compensation probe, grounding probe are formed on the circuit board 'each signal probe ^, the upper guide plate is forwarded through the upper and lower guide plates, so that the two: phase and ground The probe is a ground probe which can be erected on the two guides; a eucalyptus needle, a compensating probe and a sample, and the upper and lower plates are perpendicular to each other The compensation probe and the grounding probe can be placed in the space, and the signal probes are disposed on the lower guide plate to displace the compensation commands. The conductive layer pins and the grounding probe are all connected to the conductive layer. 6 1301543, but each of the signal probes is placed with a suitable space to avoid electrical contact with each of the signal probes, each of the signal probes is electrically connected, each of the signal lines, and each of the signal probes The auxiliary probes are disposed adjacent to the upper row of the needles to the compensation probes, and the compensation probes are electrically connected to the ground 5 faces. ...so 'when the probe card is electrically connected to the test machine, the electric signal is transmitted by each of the roads, and the transmission process is ▲ because of the setting of the grounding line and the compensation probe. Therefore, the signal impedance characteristic can be effectively maintained to transmit the high frequency signal. [Embodiment] Hereinafter, several preferred embodiments are listed with reference to the drawings for explaining the structure and function of the second month, Q, and the function. The diagrams used are as follows: 2 is a top view of the first preferred embodiment provided by the present invention; 5 is a schematic structural view of the first preferred embodiment; the sixth 11th series is the first description of Niu Shiguan A schematic diagram of the structure of the probe and the probe set of the county; 2 〇 帛 帛 帛 图 系 系 图 图 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 频 频 频 频 频 频 频 频 频 频 频 频A schematic diagram of the structure of the second preferred embodiment is provided; ^9 is a graph showing the signal transmission I bandwidth characteristic of the smart pin card provided in the second preferred embodiment. Please refer to the present invention as shown in the fourth and fifth figures. Provided the first preferred 7 1301543 2 cases 'for The vertical probe card 2 for measuring the electronic components of the wafer includes a circuit board 40, a probe holder 5〇 and a probe set 6〇, and the circuit board 40 can define a relative A top surface and a surface and a test area from the periphery to the center are distributed, the jumper area is a needle-up area 405, and the test table is electrically connected to a 'Taiwan' from the test area of 4()1. The test machine can output a general electrical signal to the probe card 2, and the circuit board 4G is provided with a plurality of signal lines 41 and ground lines 42. At least one of the grounding lines 4 2 is disposed between the target areas and the signal line 4 i, and the signal line 4 i includes a signal line that is disposed on the surface of the circuit board and a jumper from the test area 4〇3 to the probe. Similarly, the grounding line 42 includes a grounding conductor 421 and a grounding transmission line 422. The needle holder 50 is a slot provided in one of the central annular notches of the circuit board 40. The ι can be extended to enter the signal transmission line 412 and the ground transmission line 丨5 422. Referring to the fifth figure, a bottom plate is stacked on the bottom of the slot 5〇2. 51 and a grounding surface 52, the bottom plate 51 is made of a material having good insulating properties, and the grounding surface 52 is made of a conductive metal material, and the bottom plate 51 is provided with a plurality of through holes 510. Each of the through holes 510 is sized to correspond to a wire diameter of each of the signal transmission lines 412. Each of the signal transmission lines 412 extends through the ground plane 52 2〇 into the bottom plate 51 and passes through the through hole 5 〇 and is then at the bottom of the groove 5〇2 The grounding transmission line 422 is electrically connected to the grounding surface 52 and extends into the bottom plate 51 and passes through the through hole 510 to expose the end to the groove bottom 5〇2. Please refer to FIG. The probe set 60 is disposed on the bottom 502 of the probe base 50, and has a conductive layer 61, an upper guide 62, and a lower guide 8 1301543 黪 10 15
20 =複數個訊號探針64、補償探針65及接地探針66，該此 才朱針64、65、66為具有適去石吞危 Λ二 ^ ，週田硬度及導電性之金屬材質所萝 亥二魏62、63為具㈣絕緣特㈣㈣所製成，係 =周&相疊置而兩者之間形財—容置空間_，該板 2、63上縱向穿設各該探針64、65、66，使該些探針64板 5^66可，立於，亥二導板62、63上形成與該電路板仙相 垂直之態樣，各該探針64、65、66之身部64〇、65〇、_ 位於該容置空間_，各該探針^的之末端⑷、 651、661凸出該上導板Q，各該探針64、65、66之針尖 642、652、662凸出該下導板Ο，各該訊號探針64之末端 641於通孔510中與各該訊號傳輸線似電性連接，各該補 償探針65及接地探針的之末端65卜661則自通孔51〇延 伸至該接地面52與之電性接觸；該導電層&設於該下導 板63上使该些補償探針65及接地探針从皆與該導電層q 电性接觸’但該導電層61於各該訊號探針64穿設處留置 有適當的空間以分別對應形成一孔穴610,因此避免該導電 層61與各該訊號探針64電性接觸；與各該訊號探針64相 鄰特定之間距上並列設置有各該補償探針65，用以使高頻 讯5虎於各該訊號探針64上傳輸時維持訊號特性阻抗，故各 該補償探針65僅需維持與各該訊號探針 64相互並列平行 以微小之針尖651部分凸出該下導板63，各該訊號探針 64及接地探針66凸出該下導板63之針尖64卜661部位則 長於各該補償探針65之針尖651，因此各該訊號探針64及 接地探針66為用以點觸待測電子元件，由於該些探針64、 9 1301543 65、66之身部640、650、660位於該二導板62、63之間的 容置空間600而不受其他介質之限制，故當各該訊號探針 64及接地探針66之針尖Μ卜⑹受到正向應力時則可獲20 = a plurality of signal probes 64, compensation probes 65 and grounding probes 66, which are the metal materials of the hardness, conductivity and electrical conductivity of the stone needles 64, 65, and 66. Luohai Weiwei 62, 63 is made of (4) insulation special (four) (four), system = week & overlap, and between the two - shaped space _, the board 2, 63 longitudinally through each of the probe The pins 64, 65, 66 enable the probes 64, 5, 66, and the second guide plates 62, 63 to form a state perpendicular to the circuit board, each of the probes 64, 65, The body of the 66 is 64 〇, 65 〇, _ is located in the accommodating space _, and the ends (4), 651, and 661 of the probes protrude from the upper guide plate Q, and the tips of the probes 64, 65, and 66 are respectively 642, 652, 662 protrude from the lower guide plate Ο, and the end 641 of each of the signal probes 64 is electrically connected to each of the signal transmission lines in the through hole 510, and the ends of the compensation probes 65 and the grounding probes are respectively 65 661 extends from the through hole 51 至 to the ground surface 52 to be in electrical contact with the grounding surface 52; the conductive layer & is disposed on the lower guiding plate 63 to make the compensation probe 65 and the grounding probe and the conductive Layer q electrical contact 'but this conductive 61, a suitable space is left in each of the signal probes 64 to form a hole 610 respectively, thereby preventing the conductive layer 61 from electrically contacting each of the signal probes 64; adjacent to each of the signal probes 64 Each of the compensation probes 65 is disposed in parallel with each other to maintain the signal characteristic impedance when the high frequency signal is transmitted on each of the signal probes 64. Therefore, each of the compensation probes 65 only needs to be maintained and The signal probes 64 are juxtaposed in parallel with each other to partially protrude the lower guide plate 63. The signal probe 64 and the grounding probe 66 protrude from the needle tip 64 of the lower guide 63 to be longer than the compensation. The tip 651 of the probe 65 is such that each of the signal probe 64 and the grounding probe 66 is used to touch the electronic component to be tested, since the bodies 640, 650, and 660 of the probes 64, 9 1301543 65, 66 are located. The accommodating space 600 between the two guiding plates 62 and 63 is not restricted by other media, so when the needle tip (6) of each of the signal probe 64 and the grounding probe 66 is subjected to forward stress,
得有橫向彈性緩衝的空間。 X 5There is room for lateral elastic cushioning. X 5
10 1510 15
當該探針卡2測試區彻之電子電路電氣連接至上述測 試機台’職由各該瓣u線路41傳遞電測減至該訊號探 針64’由於訊號傳輸過程中鄰近配合有各該接地線路μ 及補償探針65的設置’可因此有效傳遞高頻訊號使維持阻 抗匹配的特性，並防止不必要的雜訊干擾或電性轉合效 應，使該探針卡2具有極佳的高頻電測可靠性，請配入第 七圖參照’圖巾之反餘損轉防，顯示娜針卡2 ^遞 高頻訊號具有極佳的阻抗隨’圖巾之插人減曲線防， 更顯不在傳輸高頻職之.增益通帶限制解可高至將 近GHz頻段，具紐、匹配㈣細訊賴輸品質； 且由於各該訊舰針64及接輯針66 _制電子元 時了位於該二導板62、63之間獲得有緩_空間，不 2=電子元件之間產生過大的衝力而對晶圓上的元件 2〇 。值得-提的是’本發明所提供之高頻探針卡主要以改 號於揼針上傳遞的品質，並不限定帝 π古斗 儿个|艮疋私路板上訊號傳輸線路的佈 ^%=3八騎轉本發明所提料二触實施例之一垂 直式铋針卡3，係於一電路板70下方 * 8〇，再將該探針、组60設於該空間轉換器8〇上^中.、為 該電路板70内佈設有多數個訊號線路71及接地線路 10 1301543 恭从自^路板70上表面延伸至下表面與該空間轉換器80 :連接各邊喊線路71相鄰特定之間距上設有至少一 B二j線路A用以使高頻訊號於各該訊號線路71上傳輸 T、，隹持訊號特性阻抗。 ^該空間轉換器80為以有機多層板（Multi-Layer rgamc ’ MLQ )或多層陶究板（M滿切 er Ceramic，MLC) 、、=所製成’㈣設有多數個訊號走線 81及接地走線82， 15 口二fl#u走線81相_定之間距上設有至少—該接地走線 ’技接近採針組60則各該訊號走線81線路間距越小， =bi!走線82共同電性導通至-接地面，作為該空 …8〇内的接地共平面，該空間轉換器肋的上、下 兩側於各該走線8卜82上設有不關距的上、下銲點謝、 搬，刀別為了對應連接於電路板70與該探針組⑹，使各 f訊號走線81電性連接電路板7G上的各該訊號線路71鱼 棟針組6G上的各軌號探針64，各該接地祕82電性連 射路板70上的各該接地線路72與 償=65娜_66，細_自該電路“傳= 至探針組60之電路空間轉換的作用。 抓針卡3之電子電路電氣連接至上述測 台，則稭由各該訊號線路71及各該訊號走線81傳 訊號至該訊針64，由魏號傳輸過財㈣配合有各 邊接地線路:2、接地走線82及補償探針&的設置，可因 此有效傳遞局頻峨使維持阻抗匹配的肺，請配合第九 圖參照’圖中之反射_曲線S22”顯示該探針卡3傳遞高 20 1301543 頻訊號具有極佳的阻抗匹配，圖中之插入耗損曲線S21”更 顯示傳輸高頻訊號之-3dB增益通帶限制頻率可高於 1.2GHz頻段，不但與上述實施例具有等同之功效，且有更 低損耗、更高阻抗匹配特性的高頻訊號傳輸品質。 5 唯，以上所述者，僅為本發明之較佳可行實施例而已， 故舉凡應用本發明說明書及申請專利範圍所為之等效結構 變化，理應包含在本發明之專利範圍内。 12 1301543 【圖式簡單說明】 圖係制垂直錢針卡之結構示意圖； 第=圖係上述習用垂直式探針卡之訊號頻率特性曲線圖 第三圖係習用垂直式探針之結構示意圖； f四圖本發赌提供第—難實_之上視圖； ，五圖係上述第—健實施例之結構示意圖； 第六圖係上述第-較佳實施例所提供該探針座及探針組 之結構示意圖； ^七圖係上述第-難實侧所提供聰針卡訊號傳遞 之頻寬特性曲線圖； =八圖係本發騎提供第二較佳實施例之結構示意圖； 之相ί t圖係上逑$二較佳實施例所提供聰針卡訊號傳遞 之頻見特性曲線圖。 13 1301543 5When the probe card 2 test area is completely connected to the test machine by the electronic circuit, the electrical measurement is reduced to the signal probe 64'. Since the signal transmission process is adjacent to each other, the grounding is performed. The line μ and the setting of the compensation probe 65 can effectively transmit the high frequency signal to maintain the impedance matching characteristic and prevent unnecessary noise interference or electrical switching effect, so that the probe card 2 has an excellent height. Frequency and electrical reliability, please refer to the seventh picture with reference to the 'anti-residual loss of the towel, showing that the needle card 2 ^ high-frequency signal has excellent impedance with the insertion of the figure to reduce the curve prevention, more It is obvious that the transmission passband limit solution can be as high as the near GHz band, with the matching and matching (four) fine-grained transmission quality; and because each of the ship's pin 64 and the pin 66 _ system electronic time A slow space is obtained between the two guide plates 62 and 63, and no excessive force is generated between the electronic components to cause an element 2 on the wafer. It is worth mentioning that the 'high-frequency probe card provided by the present invention mainly transmits the quality of the signal transmission on the 揼 pin, and does not limit the cloth of the signal transmission line on the π 古 古 儿 艮疋%=3八骑转 The one of the two-touch embodiment of the present invention, the vertical boring card 3 is attached to a circuit board 70 * 8 〇, and the probe, the group 60 is placed in the space converter 8 A plurality of signal lines 71 and ground lines 10 1301543 are disposed in the circuit board 70. The width of the circuit board 70 extends from the upper surface to the lower surface of the circuit board 80. At least one B and two lines A are disposed adjacent to each other to enable high frequency signals to transmit T on each of the signal lines 71 to maintain signal characteristic impedance. ^ The space converter 80 is provided with a plurality of signal traces 81 and is formed by an organic multilayer board (Multi-Layer rgamc ' MLQ ) or a multi-layer ceramic board (MC). Grounding line 82, 15 port two fl#u line 81 phase _ between the fixed distance at least - the grounding line 'technical approach to the needle group 60, the signal line 81 each line spacing is smaller, = bi! The line 82 is electrically electrically connected to the ground plane, and serves as a grounding coplanar plane in the space. The upper and lower sides of the space converter rib are provided with a non-closed distance on each of the wires 8 and 82. The lower solder joints are moved and moved, and the knives are connected to the circuit board 70 and the probe set (6) correspondingly, so that the f-signal traces 81 are electrically connected to the signal lines 71 on the fish-pin group 6G on the circuit board 7G. Each of the track number probes 64, each of the grounding lines 82 electrically connected to the ground line 72 on the circuit board 70 and the compensation = 65 _66, fine _ from the circuit "pass = to the circuit space of the probe set 60 The function of the conversion. The electronic circuit of the needle-catching card 3 is electrically connected to the measuring platform, and the straw is transmitted from each of the signal lines 71 and each of the signal lines 81 to the signal pin 64. Transmission over (4) with the grounding line on each side: 2, the grounding line 82 and the compensation probe & setting, can effectively transmit the local frequency to maintain the impedance matching lung, please refer to the figure in the figure The reflection_curve S22" shows that the probe card 3 transmits a high frequency of 20 1301543. The frequency signal has excellent impedance matching, and the insertion loss curve S21" in the figure further shows that the -3dB gain passband limiting frequency for transmitting high frequency signals can be higher than 1.2. The GHz frequency band not only has the same efficiency as the above embodiment, but also has high loss signal transmission quality with lower loss and higher impedance matching characteristics. 5 However, the above description is only a preferred feasible embodiment of the present invention. Therefore, the equivalent structural changes of the present invention and the scope of the patent application are intended to be included in the scope of the patent of the present invention. 12 1301543 [Simple description of the diagram] Schematic diagram of the structure of the vertical money needle card; The signal frequency characteristic curve diagram of the above-mentioned conventional vertical probe card is a schematic diagram of the structure of the conventional vertical probe; f four maps are provided with the first-top view; Figure 5 is a schematic view showing the structure of the first embodiment of the present invention; Figure 6 is a schematic view showing the structure of the probe holder and the probe set provided by the above-described first preferred embodiment; The bandwidth characteristic curve of the signal transmission of the Cong card; the eight figure is a schematic diagram of the structure of the second preferred embodiment; the image of the second embodiment is provided; The frequency of transmission is shown in the characteristic graph. 13 1301543 5
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【主要元件符號說明】 2、3垂直式探針卡 40、 70電路板 402下表面 404跳線區 41、 71訊號線路 412訊號傳輸線 421、82接地走線 50探針座 502槽底 510通孔 60探針組 61導電層 62上導板 64訊號探針 641、651、661 末端 65補償探針 80空間轉換器 802下銲點 401上表面 403測試區 405探針區 411、81訊號走線 42、72接地線路 422接地傳輸線 501 槽口 51底板 52、820接地面 600容置空間 610孔穴 63下導板 640、650、660 身部 642、652、662 針尖 66接地探針 801上銲點 14[Main component symbol description] 2, 3 vertical probe card 40, 70 circuit board 402 lower surface 404 jumper area 41, 71 signal line 412 signal transmission line 421, 82 grounding line 50 probe holder 502 groove bottom 510 through hole 60 probe set 61 conductive layer 62 upper guide 64 signal probe 641, 651, 661 end 65 compensation probe 80 space converter 802 lower solder joint 401 upper surface 403 test area 405 probe area 411, 81 signal trace 42 72 grounding line 422 grounding transmission line 501 notch 51 bottom plate 52, 820 grounding surface 600 accommodating space 610 hole 63 lower guiding plate 640, 650, 660 body 642, 652, 662 needle tip 66 grounding probe 801 solder joint 14