TWI416121B - Probe card - Google Patents

Abstract

The present invention provides a probe card, comprising a printed circuit board, which has a first contact and a second contact; a space transformer, which has a hole plate and a first wire, a second wire, a third wire and a fourth wire with compliance, the hole plate has multiple holes, on the downward surface of the hole plate includes a first conducting layer, a second conducting layer, a first contact point and a second contact point, both ends of the first wire are electrically connected with the first contact and the first conducting layer respectively, both ends of the second wire are electrically connected with the second contact and the second conducting layer respectively, the third wire is respectively connected with the first conducting layer and the first contact point, the fourth wire is respectively connected with the second conducting layer and the second contact point, and the third wire and the fourth wire are respectively connected with the first contact point and the second contact point by configured through the holes; and a electrical component, which is configured on the downward surface of the hole plate and is electrically connected with the first conducting layer and the second conducting layer.

Description

Probe card

The present invention relates to a probe card, and more particularly to a vertical probe card.

In the semiconductor industry, wafer packaging testing is a very important part. Before the wafer packaging process, functional testing of these wafers is required to eliminate defective products and avoid unnecessary waste of cost and loss of processing the defective wafers. The probe card is used as an interface between the test machine and the wafer to provide a signal transmission path from the test machine to the wafer for use in wafer level test engineering.

Therefore, how to improve the test quality and efficiency of the probe card as much as possible is the goal pursued in the field. After all, for semiconductor manufacturers whose product cost is millions to tens of millions, no matter how much the improvement of the yield, the impact will not be ignored.

At present, the vertical probe card structure basically includes three parts: a printed circuit board (PCB), a space converter, and a probe. The printed circuit board is covered with a number of electronic components. The power and signals are transmitted by the lines on the printed circuit board to the space converter below it, and then passed to the probe below the space converter, and the probe and the underside Test the wafer for contact. Such a long signal transmission path causes interference to the signal, increases signal noise, voltage instability, and the like. As a result, the test quality of the probe card will be greatly affected, and the integrity of the overall test signal transmission will be destroyed.

The type of vertical probe card can be divided into manual wire (Hand Wire, HW), Multi-Layer Ceramic/Multi-Layer Organic (MLC/MLO) and integrated circuit board (Integrated PCB, INT PCB).

Under the structure of the manual cable, the space converter is a function of a space conversion by a substrate having a plurality of through holes, or an orifice plate. The wires connecting the compliant printed circuit board through the through holes penetrate the upper and lower surfaces of the orifice plate and are connected to the probes under the orifice plate; and in the multilayer ceramic/multilayer organic structure, the multilayer ceramic substrate or the multilayer The organic substrate is used as a space converter. The multilayer ceramic substrate or the multilayer organic substrate has a complicated wiring layout and routing inside the substrate, so that the contacts on the upper and lower surfaces of the substrate are electrically connected.

In terms of the structure of the manual cable, the orifice plate has no internal layout, and a plurality of through holes on the orifice plate penetrate the upper and lower surfaces of the orifice plate, and the spacing between the orifice plates is smaller than that of the circuit board on the printed circuit board. The spacing between the contacts is such that the one end of the compliant wire is connected to the contact on the printed circuit board, and the other end is passed through the through hole on the hole plate to fix and concentrate the wire, thereby achieving the purpose of space conversion. The multilayer ceramic/multi-layer organic structure is formed by the wiring layout inside the multilayer ceramic substrate or the multilayer organic substrate, and the circuit structure in which the upper surface of the substrate is connected to the printed circuit board at a large pitch is converted into a small pitch of the lower surface. However, the multi-layer ceramic/multi-layer organic architecture requires a large cost and time in design and fabrication, while the manual cable structure is a method of externally compliant wires, and then a simple orifice plate is used to fix the wires, so the design and design Production costs are lower.

The architecture of the integrated circuit board integrates the concept of multi-layer ceramic/multi-layer organic directly onto the printed circuit board, that is, integrates the printed circuit board and the space converter to form an integrated circuit board, so integrated The board itself has space The function of the conversion. Traditional printed circuit boards cannot directly convert large pitches into small pitches at the wafer level, but integrated circuit boards can do this.

In summary, these technologies are currently used to place a large number of electronic components on a printed circuit board, and the signal transmission path is too long, which easily brings many disadvantages.

In the U.S. Patent Publication No. 2009/0085593, a probe structure is disclosed in which a plurality of spring probes 1SIG, 1POW, 1GND are disposed in the respective guide holes 5 of the probe holder 3, and the inner walls of the guide holes 5 are provided. The conductive layer 10 is coated, and the probe holder 3 has a capacitor 9 so that the spring probes are covered by the conductive layer 10 and thus electrically connected to the capacitor 9. However, the above structure is only applicable to the spring probe structure, and is not applicable to the vertical probe of the present case, or is distinguished from the spring probe structure. The vertical probe of the present invention may be referred to as a Buckling Beam probe. If the above structure replaces the spring probe with a frustum-column probe structure, the probe needs to be in contact with the object to be tested during the test, and the force acting on the probe on the probe will cause the probe to frustrate. Lateral deformation causes friction between the probe and the inner wall of the guide hole 5. Therefore, the conductive layer 10 is gradually damaged and peeled off after long-term use, so that the contact resistance is improved. Therefore, such a result may result in poor probe card electrical characteristics and is not conducive to industrial use.

For the sake of this, the Applicant has carefully developed the "probe structure of the probe card" to overcome the above drawbacks in view of the lack of the prior art. The following is a brief description of the case.

The main object of the present invention is to provide a structure suitable for a vertical probe card, which can save cost, reduce the defect rate, and improve the application field by improving the defects and deficiencies caused by the conventional methods.

According to the concept of the present invention, a probe card is provided, comprising a printed circuit board having a first contact and a second contact; a space converter having an aperture plate and a first conductor of compliance a second wire, a third wire and a fourth wire, the hole plate having a plurality of holes, and a first conductive layer, a second conductive layer and a first contact pad on the lower surface of the hole plate And a second contact pad, the two ends of the first wire are respectively electrically connected to the first contact and the first conductive layer, and the two ends of the second wire are electrically connected to the second contact and the second a conductive layer, the third wire is respectively connected to the first conductive layer and the first contact pad, the fourth wire is respectively connected to the second conductive layer and the second contact pad, and the third wire and the fourth wire are respectively The first contact pad and the second contact pad are respectively connected by the holes; and an electronic component is disposed on the lower surface of the hole plate and electrically connected to the first conductive layer and the second conductive layer.

Preferably, the probe card of the present invention further includes a probe holder disposed under the space transformer and including a first probe and a second probe, wherein the first probe The second probe is electrically connected to the first contact pad and the second contact pad respectively.

Preferably, the probe card of the present invention, wherein the first probe is one of a power probe and a signal probe, and the second probe is a ground probe.

Preferably, the probe card of the present invention, wherein the first probe and the second probe are frustum probes.

Preferably, the probe card of the present invention, wherein the electronic component is at least one of an active component, a passive component, and a wireless radio frequency component.

According to another aspect of the present invention, a probe card is provided, comprising a printed circuit board having a contact; a space converter having an aperture plate and a first conductor and a second conductor compliant, The hole plate has a plurality of holes, and a first conductive layer, a second conductive layer and a contact pad are disposed on the lower surface of the hole plate, and the two ends of the first wire are electrically connected to the contact and the first a conductive layer, the two ends of the second wire are divided The second conductive layer and the contact pad are electrically connected, the second wire is connected to the contact pad by being disposed in the hole; and an electronic component is disposed on the lower surface of the hole plate and electrically connected to the contact pad a first conductive layer and the second conductive layer.

Preferably, the probe card of the present invention further includes a probe holder disposed under the space transformer and including a probe, wherein the probe is electrically connected to the second conductive layer.

Preferably, the probe card of the present invention, wherein the probe is one of a power probe, a signal probe and a ground probe.

Preferably, the probe card of the present invention, wherein the two probes are frustum probes.

Preferably, the probe card of the present invention, wherein the electronic component is at least one of an active component, a passive component, and a wireless radio frequency component.

According to still another aspect of the present invention, a probe card is provided, including a printed circuit board having a first contact and a second contact; a probe holder having a first conductive layer and a first disposed therein The second conductive layer is electrically connected to the first contact and the second contact respectively; a first probe and a second probe are inserted through the probe holder, and electrically connected to the first a conductive layer and the second conductive layer; and an electronic component located inside the probe holder.

Preferably, the probe card of the present invention further includes a space converter located between the printed circuit board and the probe holder.

Preferably, the probe card of the present invention, wherein the space converter is an aperture plate, and has a plurality of holes for allowing a plurality of wires to pass through, wherein the first contacts are electrically connected by the plurality of wires The first probe is connected to the second probe, and the second contact is electrically connected to the second probe.

Preferably, the probe card of the present invention is a multi-layer ceramic structure substrate or a multi-layer organic structure substrate, and has a circuit junction inside. The first contact is electrically connected to the first probe, and the second contact is electrically connected to the second probe.

Preferably, the probe card of the present invention, wherein the printed circuit board is an integrated circuit board.

Preferably, the probe card of the present invention further includes a lower guide plate and an upper guide plate, and the electronic component is located at least on one of the lower guide plate and the upper guide plate.

Preferably, the probe card of the present invention further includes a plurality of dummy probes and a plurality of contact pads, wherein the first conductive layer and the second conductive layer are respectively disposed on the lower guide And the first probe is electrically connected to the first conductive layer by the plurality of dummy probes, and the second probe is electrically connected to the second electrode by the plurality of contact pads Conductive layer.

Preferably, the probe card of the present invention further includes a plurality of dummy probes, wherein the first probe and the second conductive layer are located on the lower guide, the first probe The pin and the second probe are electrically connected to the corresponding dummy probes respectively, so that the first probe is electrically connected to the first conductive layer, and the second probe is electrically connected to the second conductive layer.

Preferably, the probe card of the present invention further includes a plurality of contact pads, wherein the first probe is located when the first conductive layer and the second conductive layer are located on the upper guide The first probe is electrically connected to the first conductive layer and the second conductive layer through the plurality of contact pads on the upper conductive plate, so that the first probe is electrically connected to the first conductive layer. The second probe is electrically connected to the second conductive layer.

Preferably, the probe card of the present invention, wherein the first probe and the second probe are frustum probes.

Preferably, the probe card of the present invention, wherein the first probe or the second probe The pin is at least one of a power probe, a signal probe, and a ground probe.

Preferably, the probe card of the present invention, wherein the electronic component is at least one of an active component, a passive component, and a wireless radio frequency component.

According to still another aspect of the present invention, a probe card includes a printed circuit board having a contact; a probe holder having a first conductive layer and a second conductive layer, the first conductive layer Electrically connecting the contact; a probe penetrating the probe holder and electrically connecting the second conductive layer; and an electronic component located inside the probe holder.

Preferably, the probe card of the present invention further includes a space converter located between the printed circuit board and the probe holder.

Preferably, the probe card of the present invention, wherein the space converter is an orifice plate, and has a plurality of holes for allowing a plurality of wires to pass through, the plurality of wires electrically connecting the contacts and the probe needle.

Preferably, the probe card of the present invention, wherein the space converter is a multi-layer ceramic structure substrate or a multi-layer organic structure substrate, and has a circuit structure inside, so that the contact is electrically connected to the Probe.

Preferably, the probe card of the present invention, wherein the printed circuit board is an integrated circuit board.

Preferably, the probe card of the present invention further includes a lower guide plate and an upper guide plate, and the electronic component is located at least on one of the lower guide plate and the upper guide plate.

Preferably, the probe card of the present invention further includes a dummy probe and a contact pad, wherein the first conductive layer and the second conductive layer are respectively disposed on the lower guide plate and When the upper guide is used, the probe is electrically connected to the first conductive layer by the dummy probe, and the contact is electrically connected to the second conductive layer by the contact pad.

Preferably, the probe card of the present invention further includes a plurality of dummy probes, wherein when the first conductive layer and the second conductive layer are located on the lower guide, the probe is electrically One of the plurality of dummy probes is sexually coupled to electrically connect the probe to the second conductive layer.

Preferably, the probe card of the present invention further includes a plurality of contact pads, wherein when the first conductive layer and the second conductive layer are located on the upper conductive plate, the probe is transmitted through One of the plurality of contact pads on the guide is electrically connected to the second conductive layer.

Preferably, the probe card of the present invention, wherein the first probe and the second probe are frustum probes.

Preferably, the probe card of the present invention, wherein the probe is one of a power probe, a signal probe and a ground probe.

Preferably, the probe card of the present invention, wherein the electronic component is at least one of an active component, a passive component, and a wireless radio frequency component.

The present invention will be fully understood by the following examples, which can be accomplished by those skilled in the art, and the implementation of the present invention is not limited by the following examples.

The first embodiment of the present invention is described below. Please refer to the first figures (a) and (b), which are schematic diagrams of the probe card structure proposed in the present application. As shown in the first figure (a), the probe card 1 has a printed circuit board 10 having a first contact 101 and a second contact 102 thereon. When the probe card is used to test the object to be tested, A contact 101 and a second contact 102 are electrically connected to the test machine to receive signals transmitted by the test machine. The middle of the printed circuit board 10 There is an opening, below which is a space converter, that is, an orifice plate 11, the orifice plate 11 has an upper surface and a lower surface 111 and a plurality of holes (not shown), each of which penetrates the upper and lower surfaces of the orifice plate 11 to A first conductor 181, a second conductor 182, a third conductor 183, and a fourth conductor 184 are disposed vertically. A recess 12 is formed on the lower surface 111, a first conductive layer 141 and a second conductive layer 142 are disposed on the recess 12, and the lower surface 111 further has a first contact pad 191 and a first surface. Two contact pads 192. The two ends of the first wire 181 are electrically connected to the first contact 101 and the first conductive layer 141, respectively. The two ends of the second wire 182 are electrically connected to the second contact 102 and the second conductive layer 142, respectively. The first conductive layer 141 and the first contact pad 191 are respectively connected to the second conductive layer 142 and the second contact pad 192. The third wire 183 and the fourth wire 184 are respectively disposed through the holes. The first contact pad 191 and the second contact pad 192 are connected. An electronic component 13 , such as a capacitor, is disposed in the recess 12 to electrically connect the two contacts of the electronic component 13 to the first conductive layer 141 and the second conductive layer 142 , respectively. In the embodiment of the first diagram (a), the circuit connection of the probe card 1 is in the form of a parallel connection.

The probe card 1 further includes a probe holder 15 which is located below the orifice plate 11. The probe base 15 includes a first probe 16 and a second probe 17 that are connected to the first contact pad 191 and the second contact pad 192, respectively. Therefore, the complete circuit path is connected from the first contact 101 to the first wire 181, via the first conductive layer 141, the third wire 183 and the first contact pad 191, and finally to the first probe 16; and the other complete The circuit path connects the second wire 182 from the second contact 102 via the second conductive layer 142, the fourth wire 184 and the second contact pad 192, and finally to the second probe 17. At the same time, the first conductive layer 141 and the second conductive layer 142 are electrically connected through the two contacts of the electronic component 13 to arrange the electronic component 13 between the two parallel paths.

In the present embodiment, each of the wires that are passed through the orifice plate 11 belong to an external trace, so that it has a characteristic of so-called compliance. That is to say, compared with the fixed circuit provided inside the conventional printed circuit board, it has greater flexibility and tolerance to deformation. In addition, instead of providing the recess 12, the lower surface 111 of the orifice plate 11 is provided with a hole 151 in the probe holder 15, as shown in the first figure (b), for accommodating the space in which the electronic component 13 protrudes. The first conductive layer 141 and the second conductive layer 142 are still disposed on the lower surface 111.

The first figure (c) shows the bottom views of the first figures (a) and (b) (excluding the probe holder 15), from which the arrangement relationship of the elements in the present embodiment can be more clearly understood. In the present invention, the number of electronic components 13 is not limited, which is clearly explained by the first diagram (c), and the manner of setting thereof can be adjusted according to requirements or circuit design.

Basically, from the perspective of the first figures (a) and (b), when the electronic component 15 is disposed below the orifice plate 11, it is easier to repair or replace the component. After all, there are countless lines above the orifice plate 11, and there are many obstacles to checking or replacing components. However, if the electronic component 13 is positioned below the orifice plate 11, it is only necessary to remove the probe holder 15 to facilitate the work.

In this embodiment, the first probe 16 is one of a power probe and a signal probe, and the second probe 17 is a ground probe. When the first probe 16 is a power probe, the first contact 101 serves as a power contact for receiving power transmitted by the test machine; and when the first probe 16 is a signal probe, the first contact 101 It is used as a signal contact to receive the test signal transmitted by the test machine; the second contact 102 is used as a ground contact.

The first embodiment (a), (b) shows an embodiment in which electronic components are disposed on a parallel path of the probe card structure, but the embodiment thereof is not limited thereto.

As shown in the second figure, which is a second embodiment of the present invention, electronic components are disposed on a series path of the probe card structure. The probe card 2 has a printed circuit board 20 with a contact 201 thereon. The printed circuit board 20 has an opening in the middle, and below it is a space converter, that is, an orifice plate 21. The orifice plate 21 has an upper surface and a lower surface 211 and a plurality of holes (not shown), and the holes are through the orifice plate. A first wire 281 and a second wire 282 of the compliant upper and lower surfaces are vertically penetrated therein. A first conductive layer 241 and a second conductive layer 242 are disposed on the lower surface 211, and a contact pad 29 is further disposed on the lower surface 211. The two ends of the first wire 281 are electrically connected to the contact 201 and the first conductive layer 241, respectively, and the two ends of the second wire 282 are electrically connected to the second conductive layer 242 and the contact pad 29 respectively, and the second wire 282 is worn by The hole is connected to connect the contact pad 29. The lower surface 211 is provided with an electronic component 23, such as a resistor, an integrated circuit (IC) or a diode, such that the two contacts of the electronic component 23 are electrically connected to the first conductive layer 241 and the second conductive layer 242, respectively.

The probe card 2 further includes a probe holder 25 located below the orifice plate 21. The probe holder 25 includes a dummy probe 26 that connects the contact pad 29 and a hole 251 for receiving a space in which the electronic component 23 protrudes. Therefore, the complete circuit path is connected to the first wire 281 from the contact 201, the second conductive layer 242 is connected through the first conductive layer 241 through the electronic component 23, and then the second wire 282 is connected to the contact pad 29, and finally the dummy probe is connected. 26 forms a series path.

In the second embodiment, only a hole 251 is formed in the probe holder 25 to accommodate the type of the electronic component 23. However, the embodiment can be changed as in the first figure (a), that is, a recess (not shown) is provided on the lower surface 211 instead, and the electronic component 23 is disposed in the recess. Of course, it is also possible to have a configuration of a plurality of electronic components and an embodiment including a merged string and a parallel path as described above.

In addition, the dummy probe 26 can be a power probe, a signal probe or a ground probe, and the contact 201 corresponds to the type used by the dummy probe 26 as a corresponding power contact, a signal contact, and Ground contact.

In the first and second embodiments of the present invention, in order to prevent damage of the electronic component due to external force collision, a protective layer such as a protective colloid may be applied outside the electronic component, and the protective layer also has a function of fixing the electronic component.

Next, a third embodiment of the present invention will be described. Please refer to the third figure (a), (b), and (c), which is a schematic diagram of the structure of the probe card proposed in the present invention, which is the same as the first embodiment. The electronic component is disposed on the parallel path of the card structure, but differs from the first embodiment in that the first embodiment is to place the electronic component on the lower surface of the orifice plate, and the third embodiment is to place the electronic component on the probe. Inside the seat. The probe card 3 has a printed circuit board 30 having a first contact 301 and a second contact 302 thereon. The probe card 3 further includes a probe holder 32 having a first conductive layer 371 and a second conductive layer 372 disposed therein, and electrically connected to the first contact 301 and the second contact 302, respectively. The probe holder 32 includes a first probe 34 and a second probe 35. The probe holder 32 is disposed through the probe holder 32 and electrically connected to the first conductive layer 371 and the second conductive layer 372, respectively. The inside of the probe holder 32 has an electronic component 33. The two ends of the electronic component 33 are electrically connected to the first conductive layer 371 and the second conductive layer 372, respectively. Therefore, the first probe 34 is electrically connected to the first contact 301 and the first conductive layer 371 by the arrangement of the space converter, that is, the arrangement of the aperture plate 31 and the wires 381, 382, 383 and 384. a circuit path, and the second probe 35 is electrically connected to the second contact 302 and the second conductive layer 372 to form another circuit path, and the first conductive layer 371 and the second conductive layer 372 are connected through the electronic component 33. The electronic component 33 is disposed between two parallel paths. The way in which such circuit connections are performed is not limited, and can be explained by the following descriptions.

As shown in the third (a) to (c), the probe card 3 further has a space converter between the printed circuit board 30 and the probe holder 32. The space converter is an orifice plate 31, and the orifice plate 31 is provided. A plurality of holes (not shown) are formed through the upper and lower surfaces of the orifice plate 31 to ensure compliance with a first wire 381, a second wire 382, a third wire 383 and a fourth wire 384. Wear it. The orifice plate 31 includes a plurality of contact pads 391, 392, 393, 394, 395, 396. The first wire 381 is electrically connected to the first contact 301 and the third contact pad 393, respectively, and the second wire 382 is electrically connected to the second contact 302 and the fourth contact pad 394, respectively, and the third wire 383 is electrically connected. The fifth contact pad 395 and the first contact pad 391, and the fourth wire 384 are electrically connected to the sixth contact pad 396 and the second contact pad 392, respectively. The first contact 301 is electrically connected to a first probe 34 of the probe base 32, and the second contact 302 is electrically connected to the first probe 34 by a plurality of wires 381-384. Two probes 35.

As shown in FIG. 3( a ), the probe holder 32 further includes an upper guiding plate 322 and a lower guiding plate 321 , and a plurality of dummy probes electrically connected to the first conductive layer 371 and the second conductive layer 372 . 361, 362, 363, 364, the electronic component 33 is located on the lower guide 321 . The first conductive layer 371 and the second conductive layer 372 are disposed on the lower conductive plate 321 . The electrical connection between the first probe 34 and the first contact 301 and the second probe 35 and the second contact 302 is achieved by the layout between the aperture plate 31 and the probe holder 32. That is, the circuit path of the first contact 301 to the first probe 34 is from the first contact 301 to the third contact pad 393 via the first wire 381, and then to the first conductive layer via the first dummy probe 361. 371, then via a second dummy probe 362 to the fifth contact pad 395, and then from the third wire 383, the first contact pad 391 to the first probe 34; and the second contact 302 to the second probe 35 The circuit path from the second contact 302 to the second contact pad 394 via the second wire 382 to the second conductive layer 363 via the third dummy probe 363 372, then through a fourth dummy probe 364 to the sixth contact pad 396, and then from the fourth wire 384, the second contact pad 392 to the second probe 35. At the same time, the first conductive layer 371 and the second conductive layer 372 are electrically connected through the two contacts of the electronic component 33 to arrange the electronic component 33 between the two parallel paths. In other words, the first probe 34 and the second probe 35 are electrically connected to the corresponding dummy probes 361-364, respectively, such that the first probe 34 is electrically connected to the first conductive layer 371. The second probe 35 is electrically connected to the second conductive layer 372.

Further, as shown in the third diagram (b), the electronic component 33 may be disposed on the upper conductive plate 322. Of course, the two conductive layers 371, 372 are also disposed on the upper conductive plate 322. Here, the two conductive layers 371, 372 and the plurality of contact pads 393, 394, 395, 396 are not electrically connected through the dummy probe, but a plurality of through holes are designed by the upper guiding plate 322, and are filled in. A conductive metal material or other conductive material capable of transmitting a signal forms a via hole, and at the same time, a plurality of contact pads 397, 398, 399, and 3910 are formed between the plurality of contact pads 393, 394, 395, and 396, respectively. Make an electrical connection. The circuit path of the first contact 301 to the first probe 34 is from the first contact 301 to the third contact pad 393 via the first wire 381, and then to the first conductive layer 371 via the seventh contact pad 397 and the via hole. Then, via the via hole, the ninth contact pad 399 to the fifth contact pad 395, and then from the third wire 383, the first contact pad 391 to the first probe 34; and the circuit of the second contact 302 to the second probe 35 The path is from the second contact 302 via the second wire 382 to the fourth contact pad 394, and then via the eighth contact pad 398, the via hole to the second conductive layer 372, and then via the via hole, the tenth contact pad 3910 to the sixth contact. Pad 396, from fourth wire 384, second contact pad 392 to second probe 35. At the same time, the first conductive layer 371 and the second conductive layer 372 are electrically connected through the two contacts of the electronic component 33 to arrange the electronic component 33 between the two parallel paths. In other words, the first probe 34 and the second probe 35 The first conductive layer 371 and the second conductive layer 372 are electrically connected to the first conductive layer 371 through the plurality of contact pads 397 to 3910 on the upper conductive plate 322, so that the first probe 34 is electrically connected to the first conductive layer 371. The second probe 35 is electrically connected to the second conductive layer 372.

Alternatively, as shown in the third diagram (c), the electronic component 33 may be disposed at two ends across the upper and lower guide plates 322 and 321 , and the two conductive layers 371 and 372 are respectively disposed on the lower upper guide plates 321 and 322 . The circuit path from the first contact 301 to the first probe 34 is from the first contact 301 via the first wire 381 to the third contact pad 393, and then via a fifth dummy probe 365 to the first conductive layer 371, after which Via a sixth dummy probe 366 to the fifth contact pad 395, and then from the third wire 383, the first contact pad 391 to the first probe 34; and the circuit path of the second contact 302 to the second probe 35 is from The second contact 302 passes through the second wire 382 to the fourth contact pad 394, and then through the twelfth contact pad 3912, the via hole to the second conductive layer 372, and then through the via hole, the eleventh contact pad 3911 to the sixth Contact pad 396, and then from fourth wire 384, second contact pad 392 to second probe 35. At the same time, the first conductive layer 371 and the second conductive layer 372 are electrically connected through the two contacts of the electronic component 33 to arrange the electronic component 33 between the two parallel paths. In other words, the first probe 34 is electrically connected to the first conductive layer 371 by a plurality of dummy probes 365, 366, and the second is made by a plurality of contact pads 3911, 3912 and their corresponding via holes. The probe 35 is electrically connected to the second conductive layer 372.

In short, the above several ways basically consist in that the corresponding circuit path design and component configuration are made as the electronic component 33 is disposed at least on one of the upper and lower guide plates 322, 311. It can also be said that the first conductive layer 371 and the second conductive layer 372 are disposed on one of the upper conductive plate 322 or the lower conductive plate 311 to make a corresponding circuit path design and component configuration.

In this embodiment, the first probe 34 is a power probe or a signal probe. The needle, the second probe 35 is a grounding probe. When the first probe 34 is a power probe, the first contact 301 serves as a power contact for receiving power transmitted by the test machine; and when the first probe 34 is a signal probe, the first contact 301 It is used as a signal contact to receive the test signal transmitted by the test machine; the second contact 302 is used as a ground contact.

As mentioned above, the electronic components of the conventional probe card are arranged on the printed circuit board, which causes the signal transmission path to be too long, which causes interference to the signal, and causes signal noise to increase and voltage instability. Therefore, as shown in the third drawings (a) to (c), the electronic component 33 of the present invention is disposed in the probe holder 32. Since the bottom of the probe holder 32 is the wafer to be tested, the distance between the electronic component and the object to be tested is effectively shortened by this structure, and the integrity of the power source or the signal transmission is also improved.

Since a fixed distance must be maintained between the first probe 34 and the second probe 35, the signal impedance matching characteristics can be effectively maintained, and high-quality high-frequency signals can be transmitted. Therefore, the presence of the dummy probes 361 to 366 allows the first probe 34 and the second probe 35 to be connected to the electronic component 33 when they are kept at a fixed distance from each other, and is further connected to the printed circuit board 30 through a wire.

Furthermore, the probes used in the present invention are all frustum-column probes, and the probes can be combined with the electronic components by the arrangement of the dummy probes or the structures of the third (a) to third (c) structures. 33 is electrically connected, so the inner wall of the guide hole of the probe holder does not need to be coated with a conductive layer. Therefore, the disadvantages produced by the US Patent Publication No. 2009/0085593 can be avoided. For example, the inner wall of each of the guide holes of the probe holder needs to be coated with a conductive layer, and the friction between the probe and the inner wall of the guide hole will be caused by long-term use. The conductive layer on the inner wall of each via hole is gradually damaged and peeled off, so that the contact resistance is improved.

Therefore, the structure proposed by the present invention not only narrows the distance between the electronic component 33 and the object to be tested, but also the pseudo probes 361~366 can protect the impedance matching of the high frequency signal. The characteristics, in this way, greatly improve the quality and stability of the probe card 3.

In the content and the drawings of the foregoing third embodiment, the electronic components are arranged in a parallel circuit path. Similarly, it is also possible to connect electronic components in a series circuit manner, as shown in the fourth figures (a) to (c), which is the fourth embodiment of the present invention. The probe card 4 has a printed circuit board 40 with a contact 401 thereon. The probe card 4 further includes a probe holder 42 having a first conductive layer 471 and a second conductive layer 472. The first conductive layer 471 is electrically connected to the contacts 401. The probe holder 42 includes a probe 44 that passes through the probe holder 42 and is electrically connected to the second conductive layer 472. The inside of the probe holder 42 has an electronic component 43. The two ends of the electronic component 43 are electrically connected to the first conductive layer 471 and the second conductive layer 472, respectively. Therefore, it is understood from the above-described circuit connection relationship that in the fourth embodiment, an embodiment of a series circuit in the probe card 4 is shown.

As shown in the fourth diagram (a), the probe card 4 further has a space converter between the printed circuit board 40 and the probe holder 42, that is, an aperture plate 41 having a plurality of holes (not shown). Each of the holes penetrates the upper and lower surfaces of the orifice plate 41, so that a first wire 481 and a second wire 482 which are compliant are vertically penetrated therein. Therefore, the complete circuit path is connected to the first wire 481 from the contact 401, and then to the first conductive layer 471 via a second contact pad 492 and a first dummy probe 461, and then connected to the second conductive layer through the electronic component 43. 472, further through a second dummy probe 462, a third contact pad 493, a second wire 482 to the first contact pad 491, and finally connected to the probe 44 to form a series path. In other words, the probe holder 42 further includes a plurality of dummy probes 461, 462 electrically connected to one of the plurality of dummy probes, that is, the second dummy probe 462, so that the probe 44 The second conductive layer 472 is electrically connected.

Of course, the way this circuit is connected is also not limited, that is, The arrangement of the electronic component 43 may be provided on the upper guide plate 422 or on the arrangement of the two guide plates 421, 422, in addition to being placed on the lower guide plate 421 as shown in the fourth figure (a). It can also be said that the first conductive layer 471 and the second conductive layer 472 are disposed on one of the upper conductive plate 422 or the lower conductive plate 421 to make a corresponding circuit path design and component configuration. As shown in the fourth diagram (b), it is shown that the electronic component 43 is disposed above the upper guide 422. Here, the two conductive layers 471, 472 and the plurality of contact pads 492, 493 are not electrically connected through the dummy probe, but a plurality of through holes are designed by the upper guiding plate 422 and filled with conductive metal. The material or other conductive material capable of transmitting the signal forms a via hole, and at the same time, a plurality of contact pads 494, 495 are disposed to electrically connect with the plurality of contact pads 492, 493, respectively. Therefore, the complete circuit path is connected from the first 401 to the second contact pad 492 from the contact 401, and then connected to the first conductive layer 471 through the via hole via the fourth contact pad 494, and then connected to the second conductive through the electronic component 43. The layer 472 is connected to the third contact pad 493 via the via hole, the fifth contact pad 495, and is connected to the first contact pad 491 via the second wire 482, and finally connected to the probe 44 to form a series path. In other words, the contact 401 is electrically connected to the first conductive layer 471 through a plurality of contact pads 492, 494. The probe 44 is electrically connected to the second conductive layer 472 through a plurality of contact pads 493, 495, and Electronic component 43 is such that the entire circuit path is connected in series.

Further, as shown in FIG. 4(c), the electronic component 43 may be disposed such that both ends thereof straddle the upper and lower guide plates 422 and 421, and the two conductive layers 471 and 472 are respectively disposed on the lower upper guide plates 421 and 422. Therefore, the complete circuit path is connected from the first wire 481 to the second contact pad 492 from the contact 401, and then connected to the second conductive layer 472 through the via hole via the sixth contact pad 496, and then connected to the first conductive through the electronic component 43. Layer 471, and then connected to the third contact pad 493 via the dummy probe 463, and through the second wire 482 to the first Contact pads 491 are finally attached to probe 44 to form a series path. In other words, the probe 44 is electrically connected to the first conductive layer 471 by the dummy probe 463, and the contact 401 is electrically connected to the second conductive layer by the sixth contact pad 496 and its corresponding via hole. 472, and via electronic component 43 to cause the entire circuit path to be connected in series.

The probe 44 can be a power probe, a signal probe or a ground probe, and the contact 401 corresponds to the type of the probe 44 and serves as a corresponding power contact, signal contact and ground contact.

Of course, in the third and fourth embodiments, the arrangement of the electronic components is also not limited to only a single one, and the configuration of the plurality of electronic components and the embodiment including the merged string and the parallel are also possible. Of course, the arrangement of the conductive layer, the various probes, and the wires also needs to be increased, but as long as the design of the circuit has the possibility of being present, it can be applied to the structure of the probe card proposed by the present invention.

Next, a fifth embodiment of the present invention will be described. Please refer to the fifth figure, which is a schematic diagram of the structure of the probe card proposed in the present application. The difference from the third and fourth embodiments is that the portion of the space transformer is replaced by a multi-layer ceramic (MLC) or a multi-layer organic (MLO) substrate 51 instead of the orifice plate and the wire. The form of the artificial pull line architecture. The substrate 51 has a circuit structure 52 inside, so that a first contact 501 on the printed circuit board 50 can be electrically connected to a first probe 55 of the probe holder 53 to make a second contact on the printed circuit board 50. 502 is electrically connected to a second probe 56 of the probe holder 53. The circuit path from the first contact 501 to the first probe 55 is from the first contact 501 via the internal wiring of the printed circuit board 50, through the circuit structure 52 inside the substrate 51 to the first conductive layer 571 in the probe holder 53. The first conductive layer 571 is electrically connected to the first probe 55 by the circuit structure 52 inside the substrate 51; the circuit path of the second contact 502 to the second probe 56 is printed from the second contact 502. Circuit board 50 The internal circuit passes through the circuit structure 52 inside the substrate 51 to the second conductive layer 572 in the probe holder 53 . The second conductive layer 572 is electrically connected to the second probe 56 via the circuit structure 52 inside the substrate 51 . At the same time, the first conductive layer 571 and the second conductive layer 572 are electrically connected through the two contacts of the electronic component 54 to arrange the electronic component 54 between the two parallel paths.

Similarly, in the fifth embodiment, the paths of the circuits may also be parallel, series, or combined in series and parallel. If the path of the series circuit is taken as an example, there will be only one contact on the printed circuit board 50, such as the first contact 501, and only one corresponding probe on the probe base 53, such as the first probe. 55. When the contact of the printed circuit board 50 passes through the circuit structure of the printed circuit board 50, and the circuit 51 has a circuit structure 52 inside, the contact point can be electrically connected to the probe, that is, the path of the series circuit. In addition, the configuration of the plurality of electronic components is also applicable to the embodiment, and the electronic component 54 may be disposed on the upper guiding plate 532 or across the two guiding plates 531 and 532 except for being disposed on the lower guiding plate 531. The way to set it up. Moreover, in the parallel path, the first probe 55 is a power probe or a signal probe, and the second probe 56 is a ground probe. When the first probe 55 is a power probe, the first contact 501 serves as a power contact for receiving power transmitted by the test machine; and when the first probe 55 is a signal probe, the first contact 501 It is used as a signal contact to receive the test signal transmitted by the test machine; the second contact 502 is used as a ground contact. In series, a single probe can be a power probe, a signal probe or a ground probe, and the contacts correspond to the types of probes used as corresponding power contacts, signal contacts, and Ground contact.

Next, a sixth embodiment of the present invention will be described. Please refer to the sixth figure, which is a schematic diagram of the structure of the probe card proposed in the present application. The difference from the third to fifth embodiments is that the portion of the space converter is replaced by an integrated circuit board 60 for the MLC/MLO substrate and the manual Pull the line architecture. Therefore, the path of the parallel circuit is electrically connected to the first probe 64 of the probe holder 62 by the first contact 601 on the integrated circuit board 60, and the second contact 602 of the integrated circuit board 60 is electrically connected. The second probe 65 of the probe holder 62.

The circuit path from the first contact 601 to the first probe 64 is electrically connected from the first contact 601 to the first conductive layer 661 via the circuit structure 61 inside the integrated circuit board 60, and then via the integrated circuit board 60. The circuit structure 61 is electrically connected to the first probe 64; the circuit path of the second contact 602 to the second probe 65 is electrically connected from the second contact 602 to the circuit structure 61 inside the integrated circuit board 60 to The second conductive layer 662 is electrically connected to the second probe 65 via the circuit structure 61 inside the integrated circuit board 60. At the same time, the first conductive layer 661 and the second conductive layer 662 are electrically connected through the two contacts of the electronic component 63 to arrange the electronic component 63 between the two parallel paths.

Similarly, in the sixth embodiment, the paths of the circuits may be parallel, series, or combined in series and parallel. If the path of the series circuit is taken as an example, there will be only one contact on the integrated circuit board 60, such as the first contact 601, and only one corresponding probe on the probe base 62, such as the first probe. 64. When the contact of the integrated circuit board 60 passes through the circuit structure 61 inside the integrated circuit board 60, the contact point can be electrically connected to the probe, that is, the path of the series circuit. Moreover, the configuration of the plurality of electronic components is also applicable to the embodiment, and the electronic component 63 may be disposed on the upper guide 622 or the lower and upper guides in addition to the lower guide 624. 621, 622 settings. Moreover, in the parallel path, the first probe 64 is a power probe or a signal probe, and the second probe 65 is a ground probe. When the first probe 64 is a power probe, the first contact 601 serves as a power contact for receiving power transmitted by the test machine; and when the first probe 64 is a signal probe, the first contact 601 Used as a signal contact to receive the test signal transmitted by the test machine; the second contact 602 Then as a ground contact. In series, a single probe can be a power probe, a signal probe or a ground probe, and the contacts correspond to the types of probes used as corresponding power contacts, signal contacts, and Ground contact.

The main object of the present invention is to improve the problem of interference of signals and increase of noise caused by an excessively long transmission path in the prior art. Therefore, by pulling the distance between the electronic component and the object to be tested, that is, placing the electronic component in the probe holder or the upper surface thereof, or the substrate above the probe holder, the probe card proposed by the present invention The structure has the advantages of current limiting, decoupling, stable voltage, excellent impedance matching characteristics, improved electromagnetic compatibility and reduced electromagnetic interference.

In addition, the electronic component may also include an active component, a passive component, or a radio frequency component. The active component can be an IC chip, a diode, a transistor, etc.; the passive component can include a capacitor, a resistor, an inductor, or a transformer; and the wireless RF component can include a filter, a balun, or a duplexer.

This case is a rare invention that is rare and worthy of cherish, but the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto. That is, the equivalent changes and modifications made by the invention in accordance with the scope of the invention are still within the scope of the invention.

1‧‧‧ probe card

10‧‧‧Printed circuit board

101‧‧‧ first joint

102‧‧‧second junction

11‧‧‧ Orifice

111‧‧‧lower surface

112‧‧‧ upper surface

12‧‧‧ Groove

13‧‧‧Electronic components

141‧‧‧First conductive layer

142‧‧‧Second conductive layer

15‧‧‧ probe holder

151‧‧‧ hole

16‧‧‧First probe

17‧‧‧Second probe

181‧‧‧First wire

182‧‧‧second wire

183‧‧‧ Third wire

184‧‧‧fourth wire

191‧‧‧First contact pad

192‧‧‧second contact pad

2‧‧‧ probe card

20‧‧‧Printed circuit board

201‧‧‧Contacts

21‧‧‧ Orifice

211‧‧‧ lower surface

23‧‧‧Electronic components

241‧‧‧First conductive layer

242‧‧‧Second conductive layer

25‧‧‧ probe holder

251‧‧‧ hole

26‧‧‧false probe

281‧‧‧First wire

282‧‧‧second wire

29‧‧‧Contact pads

3‧‧‧ Probe Card

30‧‧‧Printed circuit board

301‧‧‧ first contact

302‧‧‧second junction

31‧‧‧ Orifice

32‧‧‧ probe holder

321‧‧‧ lower guide

322‧‧‧Upper guide

33‧‧‧Electronic components

34‧‧‧First probe

35‧‧‧Second probe

361‧‧‧First false probe

362‧‧‧Second false probe

363‧‧‧ Third fake probe

364‧‧‧Four false probe

365‧‧‧ fifth fake probe

366‧‧‧ sixth fake probe

371‧‧‧First conductive layer

372‧‧‧Second conductive layer

381‧‧‧First wire

382‧‧‧second wire

383‧‧‧ Third wire

384‧‧‧fourth wire

391‧‧‧First contact pad

392‧‧‧Second contact pad

393‧‧‧ Third contact pad

394‧‧‧fourth contact pad

395‧‧‧ fifth contact pad

396‧‧‧6th contact pad

397‧‧‧ seventh contact pad

398‧‧‧8th contact pad

399‧‧‧Ninth contact pad

3910‧‧‧10th contact pad

3911‧‧‧Eleventh contact pad

3912‧‧‧Twelfth contact pad

4‧‧‧ probe card

40‧‧‧Printed circuit board

401‧‧‧Contacts

41‧‧‧ Orifice

42‧‧‧ probe holder

421‧‧‧ lower guide

422‧‧‧Upper guide

43‧‧‧Electronic components

44‧‧‧ probe

461‧‧‧First false probe

462‧‧‧Second false probe

463‧‧‧false probe

471‧‧‧First conductive layer

472‧‧‧Second conductive layer

481‧‧‧First wire

482‧‧‧second wire

491‧‧‧First contact pad

492‧‧‧Second contact pad

493‧‧‧ Third contact pad

494‧‧‧4th contact pad

495‧‧‧ fifth contact pad

496‧‧‧ sixth contact pad

5‧‧‧ Probe Card

50‧‧‧Printed circuit board

501‧‧‧ first contact

502‧‧‧second junction

51‧‧‧MLO/MLC substrate

52‧‧‧Circuit structure

53‧‧‧ probe holder

531‧‧‧ lower guide

532‧‧‧Upper guide

54‧‧‧Electronic components

55‧‧‧First probe

56‧‧‧Second probe

571‧‧‧First conductive layer

572‧‧‧Second conductive layer

6‧‧‧ Probe Card

60‧‧‧Integrated circuit board

601‧‧‧ first joint

602‧‧‧second junction

61‧‧‧Circuit structure

62‧‧‧ probe holder

621‧‧‧ lower guide

622‧‧‧Upper guide

63‧‧‧Electronic components

64‧‧‧First probe

65‧‧‧Second probe

661‧‧‧First conductive layer

662‧‧‧Second conductive layer

First figure (a): Schematic diagram of the probe card of the first embodiment of the present invention.

First figure (b): Schematic diagram of the probe card of the first embodiment of the present invention.

First figure (c): bottom view of the first figure (a), (b).

Second figure: Schematic diagram of the probe card of the second embodiment of the present invention.

Figure 3 (a) is a schematic view showing the structure of the probe card of the third embodiment of the present invention.

Figure 3 (b) is a schematic view showing the structure of the probe card of the third embodiment of the present invention.

Figure 3 (c) is a schematic view showing the structure of the probe card of the third embodiment of the present invention.

Fourth figure (a): Schematic diagram of the probe card of the fourth embodiment of the present invention.

Figure 4 (b) is a schematic view showing the structure of the probe card of the fourth embodiment of the present invention.

Figure 4 (c) is a schematic view showing the structure of the probe card of the fourth embodiment of the present invention.

Figure 5 is a schematic view showing the structure of the probe card of the fifth embodiment of the present invention.

Figure 6 is a schematic view showing the structure of the probe card of the sixth embodiment of the present invention.

3‧‧‧ Probe Card

30‧‧‧Printed circuit board

301‧‧‧ first contact

302‧‧‧second junction

31‧‧‧ Orifice

32‧‧‧ probe holder

321‧‧‧ lower guide

322‧‧‧Upper guide

33‧‧‧Electronic components

34‧‧‧First probe

35‧‧‧Second probe

361‧‧‧First false probe

362‧‧‧Second false probe

363‧‧‧ Third fake probe

364‧‧‧Four false probe

371‧‧‧First conductive layer

372‧‧‧Second conductive layer

381‧‧‧First wire

382‧‧‧second wire

383‧‧‧ Third wire

384‧‧‧fourth wire

391‧‧‧First contact pad

392‧‧‧Second contact pad

393‧‧‧ Third contact pad

394‧‧‧fourth contact pad

395‧‧‧ fifth contact pad

396‧‧‧6th contact pad

Claims (31)

A probe card comprising: a printed circuit board having a first contact and a second contact; a space converter having an aperture plate and a first conductor and a second conductor a third wire and a fourth wire, the hole plate having a plurality of holes, and a first conductive layer, a second conductive layer, a first contact pad and a second contact pad on the lower surface of the hole plate The two ends of the first wire are electrically connected to the first contact and the first conductive layer, and the two ends of the second wire are electrically connected to the second contact and the second conductive layer, respectively. The wires are respectively connected to the first conductive layer and the first contact pad, and the fourth wires are respectively connected to the second conductive layer and the second contact pad, and the third wire and the fourth wire are formed by the holes Connecting the first contact pad and the second contact pad respectively; an electronic component located on a lower surface of the aperture plate and electrically connecting the first conductive layer and the second conductive layer; and a probe holder Configuring the space converter and including a first probe and a second probe, wherein the A probe connected to the second probe are respectively electrically contacts the first pad and the second contact pad. The probe card of claim 1, wherein the first probe is one of a power probe and a signal probe, and the second probe is a ground probe. The probe card of claim 1, wherein the first probe and the second probe are frustum probes. The probe card of claim 1, wherein the electronic component is at least one of an active component, a passive component, and a radio frequency component. A probe card comprising: a printed circuit board having a contact; a space converter having an aperture plate and a first conductor and a second conductor, the aperture plate having a plurality of holes, and a first conductive layer and a second surface on the lower surface of the aperture plate a conductive layer and a contact pad, the two ends of the first wire are respectively electrically connected to the contact and the first conductive layer, and the two ends of the second wire are electrically connected to the second conductive layer and the contact pad respectively The two wires are connected to the contact pad by being disposed in the hole; an electronic component located on the lower surface of the hole plate and electrically connecting the first conductive layer and the second conductive layer; and a probe holder, It is disposed under the space converter and includes a probe, wherein the probe is electrically connected to the second conductive layer. The probe card of claim 5, wherein the probe is one of a power probe, a signal probe, and a ground probe. The probe card of claim 5, wherein the probe is a frustum probe. The probe card of claim 5, wherein the electronic component is at least one of an active component, a passive component, and a radio frequency component. A probe card comprising: a printed circuit board having a first contact and a second contact; a probe holder having a first conductive layer and a second conductive layer disposed therein and electrically respectively The first contact and the second contact are connected to each other; a first probe and a second probe are inserted through the probe holder, and electrically connected to the first conductive layer and the second conductive layer respectively And an electronic component located inside the probe holder and electrically connected to the first conductive layer and the second conductive layer. For example, the probe card described in claim 9 of the patent scope further includes: A space transformer is located between the printed circuit board and the probe holder. The probe card of claim 10, wherein the space transformer is an orifice plate and has a plurality of holes for the plurality of wires to pass through, wherein the first contact is made by the plurality of wires The first probe is electrically connected, and the second contact is electrically connected to the second probe. The probe card of claim 10, wherein the space converter is a multilayer ceramic structure substrate or a multilayer organic structure substrate, and has a circuit structure inside, wherein the circuit has a circuit The first contact is electrically connected to the first probe, and the second contact is electrically connected to the second probe. The probe card of claim 9, wherein the printed circuit board is an integrated circuit board. The probe card of claim 9, wherein the probe holder further comprises a lower guide plate and an upper guide plate, and the electronic component is located at least on one of the lower guide plate and the upper guide plate. The probe card of claim 14, wherein the probe holder further comprises a plurality of dummy probes and a plurality of contact pads, wherein the first conductive layer and the second conductive layer are respectively disposed under the probe card The first probe is electrically connected to the first conductive layer by the plurality of dummy probes, and the second probe is electrically connected to the first probe by the plurality of contact pads Two conductive layers. The probe card of claim 14, wherein the probe holder further comprises a plurality of dummy probes, wherein when the first conductive layer and the second conductive layer are located on the lower guide, the first The probe and the second probe are electrically connected to the corresponding dummy probes respectively, so that the first probe is electrically connected to the first conductive layer, and the second probe is electrically connected to the second conductive layer. The probe card of claim 14, wherein the probe holder further comprises a plurality of contact pads, wherein when the first conductive layer and the second conductive layer are located on the upper conductive plate, the first probe and the second probe are respectively electrically transmitted through the plurality of contact pads on the upper conductive plate The first conductive layer and the second conductive layer are connected to electrically connect the first probe to the first conductive layer, and the second probe is electrically connected to the second conductive layer. The probe card of claim 9, wherein the first probe and the second probe are frustum probes. The probe card of claim 9, wherein the first probe or the second probe is at least one of a power probe, a signal probe, and a ground probe. The probe card of claim 9, wherein the electronic component is at least one of an active component, a passive component, and a radio frequency component. A probe card comprising: a printed circuit board having a contact; a probe holder having a first conductive layer and a second conductive layer, the first conductive layer electrically connecting the contact; a probe penetrating the probe holder and electrically connecting the second conductive layer; and an electronic component located inside the probe holder and electrically connecting the first conductive layer and the second conductive layer And a space converter between the printed circuit board and the probe holder. The probe card of claim 21, wherein the space converter is an orifice plate and has a plurality of holes for allowing a plurality of wires to pass through, the plurality of wires electrically connecting the contacts and the Probe. The probe card of claim 21, wherein the space converter is a multi-layer ceramic structure substrate or a multi-layer organic structure substrate, and has a circuit structure inside, so that the contacts are electrically connected. The probe. The probe card of claim 21, wherein the printed circuit board is An integrated circuit board. The probe card of claim 21, wherein the probe holder further comprises a lower guide plate and an upper guide plate, and the electronic component is located at least on one of the lower guide plate and the upper guide plate. The probe card of claim 25, wherein the probe holder further comprises a dummy probe and a contact pad, wherein the first conductive layer and the second conductive layer are respectively disposed on the lower guide plate And the first conductive layer is electrically connected to the first conductive layer by the dummy probe, and the contact is electrically connected to the second conductive layer by the contact pad. The probe card of claim 25, wherein the probe holder further comprises a plurality of dummy probes, wherein the probe is when the first conductive layer and the second conductive layer are located on the lower guide One of the plurality of dummy probes is electrically connected to electrically connect the probe to the second conductive layer. The probe card of claim 25, wherein the probe holder further comprises a plurality of contact pads, wherein the probe is transparent when the first conductive layer and the second conductive layer are located on the upper conductive plate One of the plurality of contact pads on the upper conductive board is electrically connected to the second conductive layer. The probe card of claim 21, wherein the probe is a frustum probe. The probe card of claim 21, wherein the probe is one of a power probe, a signal probe, and a ground probe. The probe card of claim 21, wherein the electronic component is at least one of an active component, a passive component, and a radio frequency component.