CN111707850A

CN111707850A - Probe apparatus

Info

Publication number: CN111707850A
Application number: CN202010024976.8A
Authority: CN
Inventors: 郑仰宏; 周嘉南; 魏豪; 邓洁如; 谢尚融
Original assignee: MJC Probe Inc
Current assignee: MJC Probe Inc
Priority date: 2019-03-18
Filing date: 2020-01-10
Publication date: 2020-09-25
Also published as: TW202035995A

Abstract

A probe device is suitable for being configured on a circuit device and comprises a probe seat, a plurality of signal probes, a plurality of grounding probes and a plurality of auxiliary probes. The probe seat has a needle body area and a needle tip area. The probe seat is provided with a plurality of auxiliary through holes positioned in the tip area. Each signal probe and each grounding probe comprise a needle body and a spring sleeve sleeved on the needle body. The auxiliary probe is configured and electrically connected to the probe seat, wherein the distance between the auxiliary through hole and the signal probe is smaller than the distance between the auxiliary probe and the signal probe. The distance between the auxiliary probe and the signal probe is smaller than that between the grounding probe and the signal probe. The equivalent capacitance value of the signal probe in the needle body area is not equal to the equivalent capacitance value of the signal probe in the needle tip area, and the impedance value of the signal probe in the needle body area is matched with the impedance value of the signal probe in the needle tip area, so that the electrical effect and the measuring speed of the probe device are improved.

Description

Probe apparatus

Technical Field

The present invention relates to a probe apparatus for a probe card, and more particularly, to a probe apparatus having a spring sleeve type probe.

Background

When testing the integrated circuit, the tester contacts the integrated circuit through the probe card (probe card) and transmits the test signal to test whether the function of the integrated circuit is expected. A probe card typically includes a number of fine-sized probes. In integrated circuit testing, a probe is used to contact a contact point with a small size on a Device Under Test (DUT), such as: the pads (pads) or bumps (bumps) transmit the test signals from the tester, and cooperate with the probe card and the control program of the tester to achieve the purpose of testing the integrated circuit.

However, since the pins of the probe card are designed according to the object to be tested, the randomly arranged pins will cause impedance mismatch and increase energy loss during high-speed testing, thereby affecting the overall testing quality. Therefore, the skilled person needs to work on how to design a probe device with good impedance matching and electrical performance.

Disclosure of Invention

The invention provides a probe device which can improve the electrical effect and the measurement speed.

An embodiment of the present invention provides a probe apparatus, which is suitable for being disposed on a circuit apparatus, and includes a probe holder, a plurality of signal probes, a plurality of ground probes, and a plurality of auxiliary probes. The probe seat has a needle body area and a needle tip area. The needle body region is located between the circuit device and the needle tip region. The probe seat is provided with a plurality of auxiliary through holes which are positioned in the tip area. The signal probe is electrically connected with the circuit device and extends through the probe seat, and a first metal layer is arranged in each auxiliary through hole. Each signal probe comprises a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body is provided with an upper end part and a lower end part, and the first spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end part of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is positioned in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe positioned in the needle body area is larger than that of the signal probe positioned in the needle tip area. The grounding probe is electrically connected with the circuit device and the first metal layer. The ground probe extends through the probe mount. Each grounding probe comprises a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body is provided with an upper end part and a lower end part, and the second spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end part of the second needle body protrudes out of the lower non-spring section of the second spring sleeve. The upper end part of the second needle body is positioned in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe positioned in the needle body area is larger than that of the grounding probe positioned in the needle tip area. The auxiliary probe is disposed on and electrically connected to the ground probe, wherein a distance between the auxiliary through hole and the signal probe is smaller than a distance between the auxiliary probe and the signal probe. The distance between the auxiliary probe and the signal probe is smaller than that between the grounding probe and the signal probe.

In an embodiment of the invention, each of the auxiliary probes includes a third probe body and a third spring sleeve sleeved on the third probe body. The third needle body is provided with an upper end part and a lower end part, and the third spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the third spring sleeve is fixedly connected with the third needle body. The lower end part of the third needle body protrudes from the lower non-spring section of the third spring sleeve. The upper end part of the third needle body is positioned in the upper non-spring section of the third spring sleeve. The third spring sleeve is located only in the needle body region.

In an embodiment of the invention, each of the auxiliary probes is a solid cylinder.

In an embodiment of the invention, the probe base includes an upper guide plate, a middle guide plate and a lower guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device, the upper guide plate and the middle guide plate are located in the body region, and the lower guide plate is located in the tip region.

In an embodiment of the invention, one end of the auxiliary probes away from the circuit device does not protrude from a surface of the lower guide plate away from the circuit device.

In an embodiment of the invention, the probe socket further includes a second metal layer distributed on the upper guide plate and the middle guide plate, and the first metal layer extends and distributes on a surface of the lower guide plate not adjacent to the signal probe.

In an embodiment of the invention, the probe apparatus further includes at least one electronic component disposed on the probe base and electrically connected to the signal probe.

Another embodiment of the present invention provides a probe apparatus, adapted to be disposed on a circuit apparatus, including a probe base, a plurality of signal probes, a plurality of ground probes, and a plurality of auxiliary probes. The probe seat has a needle body area and a needle tip area. The needle body region is located between the circuit device and the needle tip region. The signal probe is electrically connected with the circuit device and extends through the probe seat. Each signal probe comprises a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body is provided with an upper end part and a lower end part, and the first spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end part of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is positioned in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe positioned in the needle body area is larger than that of the signal probe positioned in the needle tip area. The grounding probe is electrically connected with the circuit device and the probe seat. The ground probe extends through the probe mount. Each grounding probe comprises a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body is provided with an upper end part and a lower end part, and the second spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end part of the second needle body protrudes out of the lower non-spring section of the second spring sleeve. The upper end part of the second needle body is positioned in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe positioned in the needle body area is larger than that of the grounding probe positioned in the needle tip area. The auxiliary probe is configured and electrically connected to the probe seat, wherein the distance between the auxiliary probe and the signal probe is smaller than the distance between the grounding probe and the signal probe.

Another embodiment of the present invention provides a probe apparatus, adapted to be disposed on a circuit apparatus, including a probe base, a plurality of signal probes, and a plurality of ground probes. The probe seat has a needle body area and a needle tip area. The needle body region is located between the circuit device and the needle tip region. The probe seat is provided with a plurality of auxiliary through holes which are positioned in the tip area. The signal probe is electrically connected with the circuit device and extends through the probe seat. Each signal probe comprises a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body is provided with an upper end part and a lower end part, and the first spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end part of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is positioned in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe positioned in the needle body area is larger than that of the signal probe positioned in the needle tip area. The ground probe extends through the probe mount. Each grounding probe comprises a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body is provided with an upper end part and a lower end part, and the second spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end part of the second needle body protrudes out of the lower non-spring section of the second spring sleeve. The upper end part of the second needle body is positioned in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe positioned in the needle body area is larger than that of the grounding probe positioned in the needle tip area. The auxiliary through hole is spaced from the signal probe by a distance smaller than the distance between the ground probe and the signal probe.

In an embodiment of the invention, the auxiliary through holes are distributed in the upper guide plate, the middle guide plate and the lower guide plate.

In an embodiment of the invention, the probe seat further includes a metal layer distributed on a surface of the upper guide plate, the middle guide plate and the lower guide plate not adjacent to the signal probe, and the metal layer is disposed in each of the auxiliary through holes and electrically connected to at least one ground probe.

Another embodiment of the present invention provides a probe apparatus, adapted to be disposed on a circuit apparatus, including a probe base, a plurality of signal probes, a plurality of ground probes, and an insulating layer. The probe seat has a needle body area and a needle tip area. The needle body region is located between the circuit device and the needle tip region. The signal probe is electrically connected with the circuit device and extends through the probe seat. Each signal probe comprises a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body is provided with an upper end part and a lower end part, and the first spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end part of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is positioned in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe positioned in the needle body area is larger than that of the signal probe positioned in the needle tip area. The grounding probe is electrically connected with the circuit device and the probe seat. The ground probe extends through the probe mount. Each grounding probe comprises a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body is provided with an upper end part and a lower end part, and the second spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end part of the second needle body protrudes out of the lower non-spring section of the second spring sleeve. The upper end part of the second needle body is positioned in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe positioned in the needle body area is larger than that of the grounding probe positioned in the needle tip area. The insulating layer is configured in the needle tip area of the probe seat. The probe seat sequentially comprises an upper guide plate, a middle guide plate and a lower guide plate from one side close to the circuit device to one side far away from the circuit device, wherein the upper guide plate and the middle guide plate are positioned in the needle body area, and the lower guide plate is positioned in the needle tip area and is made of composite materials with heat release performance and electric conductivity. The insulating layer is connected between the lower guide plate and the signal probe.

Based on the above, in the probe apparatus of the present invention, the auxiliary probe or the probe base can be designed to make the body area and the tip area of the signal probe and the ground probe in the probe base have good matching respectively, so as to improve the electrical performance and the measurement speed of the probe apparatus.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

FIG. 1 is a diagram illustrating a probe card according to an embodiment of the invention.

Fig. 2 is a partial sectional view of a probe device in the probe card of fig. 1.

Fig. 3 is a partially enlarged schematic view of fig. 2.

Fig. 4 is a perspective view of a probe apparatus in the probe card of fig. 1.

Fig. 5 is a bottom view of a middle guide plate of the probe apparatus of fig. 4.

Fig. 6 is a bottom view of the lower guide plate of the probe apparatus of fig. 4.

Fig. 7 is a partial sectional view of a probe apparatus according to another embodiment of the present invention.

Fig. 8 is a partial sectional view of a probe device according to another embodiment of the present invention.

Fig. 9 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

Fig. 10 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

Fig. 11 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

Reference numerals:

10: probe card

20: circuit arrangement

22: circuit board

24: space conversion device

100. 100A, 100B, 100C, 100D, 100E: probe apparatus

110: probe base

112. 112A: upper guide plate

114. 114A: middle guide plate

114_2, 116_ 2: bottom surface

116: lower guide plate

120: signal probe

122: first needle body

122_1, 132_1, 142_ 1: upper end part

122_2, 132_2, 142_ 2: lower end part

124: first spring sleeve

124_1, 134_1, 144_ 1: upper non-spring section

124_2, 134_2, 144_ 2: lower non-spring section

124_3, 134_3, 144_ 3: spring section

130: grounding probe

132: second needle body

134: second spring sleeve

140. 140A: auxiliary probe

142: third needle body

144: third spring sleeve

150: metal layer

160: insulating layer

170: electronic component

d1, d 2: needle diameter

E1: region of needle body

E2: region of the needle point

L1, L2, L3: distance between two adjacent plates

V: auxiliary perforation

Detailed Description

FIG. 1 is a diagram illustrating a probe card according to an embodiment of the invention. Please refer to fig. 1. In the present embodiment, the probe card 10 includes a circuit device 20 and a probe device 100, and the circuit device 20 includes a circuit substrate 22 and a space transformer 24. The circuit board 22 is electrically connected to the space transformer 24, and the space transformer 24 is electrically connected to the probe device 100. The probe card 10 can be electrically connected to the circuit substrate 22 through the space transformer 24, and electrically connected to the tester through a surface (top surface) of one side (hereinafter referred to as tester side) of the circuit substrate 22 away from the object 30 to be tested, and contacts the object 30 through a surface (bottom surface) of one side (hereinafter referred to as object side) of the probe apparatus 100 facing the object 30 to be tested for testing. In detail, the electrical signal is provided by the tester to test an object 30 to be tested through the probe card 10. The object 30 to be measured is, for example, an integrated circuit or a chip on a semiconductor wafer. The space transformer 24 has a plurality of first contacts on the top surface, a first spacing between two adjacent first contacts, and a plurality of second contacts on the bottom surface, a second spacing between two adjacent second contacts, the first spacing being greater than the second spacing. The space transformer 24 may be a multilayer ceramic substrate, a multilayer organic substrate, a combination of a multilayer ceramic substrate and a multilayer organic substrate, a combination of two multilayer organic substrates, or the like.

Fig. 2 is a partial sectional view of a probe device in the probe card of fig. 1. Fig. 3 is a partially enlarged schematic view of fig. 2. Fig. 4 is a perspective view of a probe apparatus in the probe card of fig. 1. Fig. 5 is a bottom view of a middle guide plate of the probe apparatus of fig. 4. Fig. 6 is a bottom view of the lower guide plate of the probe apparatus of fig. 4. For convenience of description, fig. 2 and 3 only illustrate the schematic structure of the probe, but the shape or length illustrated in the diagram is not equal to that in the actual structure. Please refer to fig. 1 to fig. 6. Specifically, the probe apparatus 100 includes a probe base 110, a plurality of signal probes 120, and a plurality of ground probes 130. In the present embodiment, the probe apparatus 100 further includes a plurality of auxiliary probes 140. However, in other embodiments, the invention is not limited thereto. The sizes and positions of the probe and the guide plate shown in fig. 2 are only schematic and do not represent actual specific sizes and positions.

The probe base 110 has a body section E1 and a tip section E2, the body section E1 is located between the circuit device 20 and the tip section E2. The probe base 110 has a plurality of auxiliary through holes V located at the tip region E2. Specifically, in the present embodiment, the probe socket 110 includes an upper guide plate 112, a middle guide plate 114 and a lower guide plate 116 in sequence from a side adjacent to the circuit device 20 to a side away from the circuit device 20. The upper guide plate 112 and the middle guide plate 114 are located in the needle body section E1, and the lower guide plate 116 is located in the needle tip section E2 and has a plurality of auxiliary through holes V. Specifically, the auxiliary via V extends from the side adjacent to the circuit device 20 to the side away from the circuit device 20 through the lower guide plate 116, as shown in fig. 4. In some embodiments, the probe socket 110 may be configured without the middle guide plate 114 and only the upper guide plate 112 and the lower guide plate 116, and the present invention is not limited thereto.

In the present embodiment, the upper, middle and

lower plates

112, 114 and 116 each have a plurality of through holes adapted to allow the signal probes 120, the ground probes 130 and the auxiliary probes 140 to pass through and be fixed by the multi-layered structure of the upper, middle and

lower plates

112, 114 and 116. In addition, in the present embodiment, the probe socket 110 further includes a metal layer 150 distributed on the surface of the upper guide plate 112, the middle guide plate 114, and the lower guide plate 116 not adjacent to the signal probes 120. Specifically, the metal layer 150 is disposed on the top and bottom surfaces of the upper and

middle plates

112 and 114, respectively, and the top surface of the lower plate 116, and the metal layer 150 is disposed on the side surfaces not adjacent to the signal probes 120, i.e., the through holes for placing the ground probes 130 and the auxiliary through holes V, wherein the metal layer 150 may be disposed on the inner wall of the through holes and the auxiliary through holes V of the ground probes 130. The metal layer 150 is formed on the surface by sputtering, for example. Therefore, the ground probe 130 and the auxiliary probe 140 can be electrically connected, but the invention is not limited thereto. In some embodiments, the metal layer 150 may fill the auxiliary via V to form the auxiliary via V as a metal channel, but the invention is not limited thereto.

The signal probes 120 are electrically connected to the circuit device 20 and extend through the probe base 110. In the present embodiment, each signal probe 120 includes a first needle 122 and a first spring sleeve 124 sleeved on the first needle 122, wherein a needle diameter d1 of the signal probe 120 in the needle body region E1 is larger than a needle diameter d2 of the signal probe 120 in the needle tip region E2, as shown in fig. 5 and 6. In detail, the first pin 122 has an upper end 122_1 and a lower end 122_2, and the first spring sleeve 124 has an upper non-spring section 124_1, a lower non-spring section 124_2 and at least one spring section 124_3 located between the upper non-spring section 124_1 and the lower non-spring section 124_ 2. The lower non-spring section 124_2 of the first spring sleeve 124 is fixedly connected to the first needle 122 (so the lower non-spring section 124_2 can also be regarded as a joint portion). The lower end portion 122_2 of the first needle body 122 protrudes from the lower non-spring section 124_2 of the first spring sleeve 124. The upper end 122_1 of the first needle body 122 is located in the upper non-spring section 124_1 of the first spring sleeve 124, as shown in fig. 3 and 4. In addition, the lower non-spring segment 124_2 abuts against the top surface of the lower guide plate 116, and thus can be used as a stop portion for the signal probe 120 to prevent the first probe body 122 from sliding off the probe base 110. In other words, the signal probe 120 is a spring-based probe, so the diameter d1 of the signal probe 120 in the body region E1 is larger than the diameter d2 of the signal probe 120 in the tip region E2. In the present embodiment, the first needle 122 extends from the inside of the upper guide plate 112 and passes through the lower guide plate 116 to the side of the lower guide plate 116 opposite to the circuit device 20, i.e. is distributed in the needle body section E1 and the needle tip section E2. The first spring sleeve 124 extends from the circuit device 20 to a surface of the lower guide plate 116 adjacent to the middle guide plate 114, i.e. only distributed in the needle body area E1, such as the bottom surface 114_2 of the middle guide plate 114 and the bottom surface 116_2 of the lower guide plate 116 shown in fig. 5 and 6. In addition, the first needle 122 is electrically isolated from the probe seat 110, as shown in fig. 2. Since the lower non-spring segment 124_2 of the first spring sleeve 124 is fixedly connected to the first pin 122, the length of the first pin 122 in the tip region E2 does not change, when a probe card assembled by using the signal probe 120 is used to perform a point measurement on an object to be measured, the lower end 122_2 of the first pin 122 contacts a contact point of the object to be measured, and then the first pin 122 displaces toward the upper end 122_1 of the first pin 122, so that the lower non-spring segment 124_2 displaces toward the upper end 122_1 of the first pin 122 and drives the spring segment 124_3 to compress, thereby ensuring that the signal probe 120 contacts the circuit device 20, and after the point measurement of the object to be measured is completed, the first pin 122 displaces toward the lower end 122_2 of the first pin 122 by the spring restoring force of the spring segment 124_ 3.

The ground probes 130 are electrically connected to the circuit device 20 and the probe base 110, and extend through the probe base 110, and further, the ground probes 130 are electrically connected to the metal layer 150 on the probe base 110. In the present embodiment, each of the ground probes 130 includes a second pin 132 and a second spring sleeve 134 sleeved on the second pin 132, wherein the second pin 132 has a structure similar to that of the first pin 122, i.e., the diameter of the ground probe 130 in the pin section E1 is larger than that of the ground probe 130 in the pin section E2. In detail, the second pin 132 has an upper end 132_1 and a lower end 132_2, and the second spring sleeve 134 has an upper non-spring section 134_1, a lower non-spring section 134_2 and at least one spring section 134_3 located between the upper non-spring section 134_1 and the lower non-spring section 134_ 2. The lower non-spring section 134_2 of the second spring sleeve 134 is fixedly connected with the second needle body 132. The lower end 132_2 of the second pin 132 protrudes from the lower non-spring section 134_2 of the second spring sleeve 134. The upper end 132_1 of the second pin 132 is located in the upper non-spring section 134_1 of the second spring sleeve 134, as shown in fig. 3 and 4. In addition, the lower non-spring section 134_2 abuts against the top surface of the lower guide plate 116, and thus can be used as a stop portion for the ground probe 130 to prevent the second probe body 132 from sliding off the probe base 110. In other words, the grounding probe 130 is a spring-based probe, so the needle diameter of the grounding probe 130 in the body region E1 is larger than the needle diameter of the grounding probe 130 in the tip region E2. In the present embodiment, the second needle 132 extends from the inside of the upper guide plate 112 and passes through the lower guide plate 116 to the side of the lower guide plate 116 opposite to the circuit device 20, i.e. is distributed in the needle body section E1 and the needle tip section E2. The second spring sleeve 134 extends from the circuit device 20 to a surface of the lower guide plate 116 adjacent to the middle guide plate 114, i.e. only distributed in the needle body area E1, such as the bottom surface 114_2 of the middle guide plate 114 and the bottom surface 116_2 of the lower guide plate 116 shown in fig. 5 and 6. In addition, the second probe 132 is electrically connected to the probe base 110, as shown in fig. 2. Since the lower non-spring section 134_2 of the second spring sleeve 134 is fixedly connected to the second pin 132, the length of the second pin 132 in the tip region E2 does not change, when a probe card assembled by using the grounding probe 130 is used to perform a point measurement on an object to be measured, the lower end 132_2 of the second pin 132 contacts a contact point of the object to be measured, and then the second pin 132 displaces toward the upper end 132_1 of the second pin 132, so that the lower non-spring section 134_2 displaces toward the upper end 132_1 of the second pin 132 and drives the spring section 134_3 to compress, so as to ensure that the grounding probe 130 contacts the circuit device 20, and after the point measurement of the object to be measured is completed, the second pin 132 displaces toward the lower end 132_2 of the second pin 132 by the spring restoring force of the spring section 134_ 3.

Generally, the lengths of the first and

second needles

122 and 132 in the needlepoint region E2 are not changed, and the lengths are about 1500um to 1650 um.

The auxiliary probes 140 are disposed on the probe base 110 and electrically connected to the ground probes 130, and in detail, the auxiliary probes 140 may be regarded as being electrically connected to the metal layer 150 of the probe base 110 and further electrically connected to the ground probes 130. In the present embodiment, each auxiliary probe 140 includes a third needle 142 and a third spring sleeve 144 sleeved on the third needle 142, the third spring sleeve 144 is only located in the needle body region E1, wherein the structure of the third needle 142 is similar to that of the first needle 122, except that one end of the tip of the third needle 142 does not protrude out of the lower guide plate 116, and the third needle 142 is not electrically connected to the circuit device 20. In detail, the third pin 142 has an upper end 142_1 and a lower end 142_2, and the third spring sleeve 144 has an upper non-spring section 144_1, a lower non-spring section 144_2, and at least one spring section 144_3 located between the upper non-spring section 144_1 and the lower non-spring section 144_ 2. The lower non-spring section 144_2 of the third spring sleeve 144 is fixedly connected to the third needle 142. The lower end portion 142_2 of the third needle body 142 protrudes from the lower non-spring section 144_2 of the third spring sleeve 144. The upper end 142_1 of the third pin 142 is located in the upper non-spring section 144_1 of the third spring sleeve 144, and the third pin 142 extends from the upper guide plate 112 to a surface of the lower guide plate 116 opposite to the circuit device 20, i.e. is distributed in the pin body area E1 and the pin tip area E2. The third spring sleeve 144 extends from the inside of the upper plate 112 to a side of the lower plate 116 opposite the circuit device 20, i.e., is distributed the same as the third pin 142. The third probe body 142 is electrically connected to the probe base 110. In other words, the end of the auxiliary probe 140 away from the circuit device 20 does not protrude from the side of the lower guide plate 116 away from the circuit device 20, as shown in fig. 2.

Please continue to refer to fig. 2. In the present embodiment, the distance L3 between the auxiliary penetration hole V and the signal probe 120 is smaller than the distance L2 between the auxiliary probe 140 and the signal probe 120. The distance L2 between the auxiliary probe 140 and the signal probe 120 is smaller than the distance L1 between the ground probe 130 and the signal probe 120, as shown in fig. 2, 5 and 6. For example, the distance L1 between the ground probe 130 and the signal probe 120 of the present embodiment is 220 μm. In the present embodiment, the equivalent capacitance of the signal probe 120 in the body region E1 is not equal to the equivalent capacitance of the signal probe 120 in the tip region E2, wherein the impedance values of the ground probe 130 and the signal probe 120 in the body region E1 and the tip region E2 can be defined by the following equations (1) and (2):

wherein:

z: impedance values of the grounding object and the signal probe;

l: equivalent inductance values of the grounding object and the signal probe;

c: equivalent capacitance values of the grounding object and the signal probe;

: the permittivity parameter of the equivalent capacitance of the grounding object and the signal probe;

Φ: the needle diameter of the signal probe;

d: distance of the ground probe from the signal probe.

In the body region E1, the grounding object is the auxiliary probe 140. In the tip region E2, the grounding object is an auxiliary through hole V. In other words, in the body section E1, the signal probe 120 is impedance matched by the auxiliary probe 140. In tip region E2, signal probes 120 are impedance-matched through auxiliary perforations V such that the impedance values of signal probes 120 in body region E1 and tip region E2 match, i.e., have substantially the same impedance value. However, in other embodiments, the grounding member may have other structures, and the invention is not limited thereto.

Therefore, in the present embodiment, the equivalent capacitance of the signal probe 120 and the grounding object can be adjusted by designing the relative distances between the auxiliary probe 140 and the auxiliary via V and the signal probe 120, so as to adjust the impedance values of the signal probe 120 and the grounding probe 130. Thus, the electrical effect and the measurement speed of the probe apparatus 100 can be improved. In some embodiments in which the signal probes 120 are spaced apart from the ground probes 130, the signal probes 120 and the ground probes 130 may be selectively disposed only on the probe socket 110 without disposing the auxiliary through holes V in the probe socket 110.

In the known probe apparatus having the bending probe (cobra probe), since the bending probe retracts and deforms in a buckling manner, when the probe contacts the object to be tested to perform the test, the deformed portion of the probe cannot control the impedance due to the deformation. In other words, if both the signal probe and the ground probe use the bending probe, it cannot be determined whether the impedance value of the bending deformation section meets the requirement, so that impedance matching cannot be further performed through the design configuration of the structure, and the requirement of high frequency testing can be further met. In other words, the probe device 100 with the spring-in-sleeve signal probes 120 of the present embodiment can also perform impedance matching between the body region E1 and the tip region E2 to meet the requirement of high frequency testing, compared to the conventional probe device with bending probes.

Fig. 7 is a partial sectional view of a probe apparatus according to another embodiment of the present invention. Please refer to fig. 7. The probe apparatus 100A of the present embodiment is similar to the probe apparatus 100 of fig. 2 of the present disclosure. The difference between the two is that in the present embodiment, each auxiliary probe 140A is a solid cylinder. Specifically, in the present embodiment, the auxiliary probe 140A has the same needle diameter from the end adjacent to the circuit device 20 to the end away from the circuit device 20, as shown in fig. 7. Therefore, the electrical effect of the probe apparatus 100A can be improved, the process thereof can be simplified, and the cost can be reduced.

Fig. 8 is a partial sectional view of a probe device according to another embodiment of the present invention. Please refer to fig. 8. The probe apparatus 100B of the present embodiment is similar to the probe apparatus 100 of fig. 2. The difference is that in the present embodiment, the probe apparatus 100B is not provided with the auxiliary probe 140 as in fig. 2. Therefore, the present invention can be applied to the embodiment where the distance between the signal probe 120 and the ground probe 130 is larger, so as to meet the requirement of the body impedance value of the signal probe 120 and improve the electrical performance of the probe apparatus 100B.

Fig. 9 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to fig. 9. The probe apparatus 100C of the present embodiment is similar to the probe apparatus 100B of fig. 8 of the present embodiment. The difference is that in the present embodiment, the auxiliary through holes V are distributed in the upper guide plate 112A, the middle guide plate 114A, and the lower guide plate 116. Specifically, compared to the aforementioned embodiments, the auxiliary holes V are further distributed in the upper guide plate 112A and the middle guide plate 114A in the present embodiment, in addition to being distributed in the lower guide plate 116. In addition, in the present embodiment, the probe socket 110 does not have a metal layer, and the upper guide plate 112A, the middle guide plate 114A, or the lower guide plate 116 may be further designed to be thin, or made of a material having a dielectric constant of 5. It should be noted that, compared to the aforementioned embodiments, the present embodiment changes the equivalent capacitance value by changing the permittivity parameter (i.e. the coefficient in the above formula (2)). In this way, the embodiment achieves the purpose of adjusting the equivalent capacitance of the signal probe 120 by changing the coefficient, and can be further applied to embodiments in which the distance between the signal probe 120 and the ground probe 130 is less than 100 μm, so as to improve the electrical effect and the measurement speed of the probe apparatus 100C, simplify the process, and reduce the cost. In some embodiments, if the impedance value of the signal probe 120 located in the tip region E2 is not matched with the impedance value of the signal probe 120 located in the body region E1, the impedance value of the signal probe 120 located in the tip region E2 may be further adjusted in the adjusting manner of the foregoing embodiments to achieve impedance matching, but the invention is not limited thereto.

Fig. 10 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to fig. 10. The probe apparatus 100D of the present embodiment is similar to the probe apparatus 100B of fig. 8 of the present embodiment. The difference between the two is that in the present embodiment, the probe apparatus 100D does not have the auxiliary via and the metal layer, and the probe apparatus 100D further includes an insulating layer 160 disposed in the tip region E2 of the probe base 110. In addition, the lower plate 116 is made of a composite material having heat dissipation and electrical conductivity, and the insulating layer 160 is connected between the lower plate 116 and the signal probes 120. Therefore, the distance between the signal probe 120 and the ground object (i.e., the lower plate 116A in communication with the ground probe 130) can be changed by configuring the design of the insulating layer 160, so as to achieve the effect of impedance matching with the signal probe 120 located in the body section E1. In some embodiments, if the impedance value of the signal probe 120 located in the tip region E2 is not matched with the impedance value of the signal probe 120 located in the body region E1, the impedance value of the signal probe 120 located in the body region E1 may be further adjusted in the adjusting manner of the foregoing embodiments to achieve impedance matching, but the invention is not limited thereto.

The upper plate 112 and the middle plate 114 may be made of a composite material having heat dissipation and electrical conductivity, and connected between the upper plate 112 (middle plate 114) and the signal probes 120 using an insulating layer 160. In this embodiment, the

auxiliary probe

140 or 140A shown in fig. 2 and 7 may be added, and the auxiliary probe may directly conduct the upper guide plate 112, the middle guide plate 114 and the lower guide plate 116.

Fig. 11 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to fig. 11. The probe apparatus 100E of the present embodiment is similar to the probe apparatus 100 of fig. 2. The difference between the two is that in the present embodiment, the probe apparatus 100E further includes at least one electronic component 170 disposed on the probe base 110 and electrically connected to the signal probes 120. In detail, in the present embodiment, a circuit may be disposed on the conductive plate to connect the electronic component 170, such as a capacitor. Therefore, the signal transmission path can be further shortened or the signal can be re-amplified for some more specific embodiments, thereby reducing the signal error rate of the probe apparatus 100E and improving the electrical performance thereof.

In summary, in the probe apparatus of the present invention, the auxiliary probe or the probe base can be designed to make the body area and the tip area of the signal probe and the ground probe in the probe base have good matching respectively, so as to improve the electrical performance and the measurement speed of the probe apparatus.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A probe device adapted to be disposed on a circuit device, comprising:

a probe seat having a needle body region and a needle tip region, the needle body region being located between the circuit device and the needle tip region, the probe seat having a plurality of auxiliary through holes located in the needle tip region, the auxiliary through holes having a first metal layer disposed therein;

a plurality of signal probes electrically connected with the circuit device and extending through the probe seat, each signal probe comprising a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body has an upper end and a lower end, the first spring sleeve has an upper non-spring section, a lower non-spring section and at least one spring section between the upper non-spring section and the lower non-spring section, the lower non-spring section of the first spring sleeve is fixedly connected with the first needle body, the lower end part of the first needle body protrudes out from the lower non-spring section of the first spring sleeve, the upper end of the first needle body is positioned in an upper non-spring section of the first spring sleeve, the needle diameter of the signal probe positioned in the needle body area is larger than that of the signal probe positioned in the needle tip area;

a plurality of grounding probes electrically connected with the circuit device and the first metal layer, wherein the grounding probes extend through the probe seat, each grounding probe comprises a second probe body and a second spring sleeve sleeved on the second probe body, the second needle body is provided with an upper end part and a lower end part, the second spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section, the lower non-spring section of the second spring sleeve is fixedly connected with the second needle body, the lower end part of the second needle body protrudes out from the lower non-spring section of the second spring sleeve, the upper end of the second needle body is positioned in an upper non-spring section of the second spring sleeve, the needle diameter of the grounding probe positioned in the needle body area is larger than that of the grounding probe positioned in the needle tip area; and

a plurality of auxiliary probes configured and electrically connected to the ground probe, wherein a distance between the auxiliary through hole and the signal probe is smaller than a distance between the auxiliary probe and the signal probe, and a distance between the auxiliary probe and the signal probe is smaller than a distance between the ground probe and the signal probe.

2. The probe device of claim 1, wherein each of the auxiliary probes comprises a third needle body and a third spring sleeve sleeved on the third needle body, the third needle body has an upper end and a lower end, the third spring sleeve has an upper non-spring section, a lower non-spring section and at least one spring section located between the upper non-spring section and the lower non-spring section, the lower non-spring section of the third spring sleeve is fixedly connected to the third needle body, the lower end of the third needle body protrudes from the lower non-spring section of the third spring sleeve, the upper end of the third spring sleeve is located in the upper non-spring section of the third spring sleeve, and the third spring sleeve is located only in the needle body region.

3. The probe apparatus of claim 1, wherein each of said accessory probes is a solid cylinder.

4. The probe apparatus according to claim 1, wherein the probe base comprises an upper guide plate, a middle guide plate and a lower guide plate in sequence from a side adjacent to the circuit apparatus to a side away from the circuit apparatus, the upper guide plate and the middle guide plate are located in the needle body region, and the lower guide plate is located in the needle tip region.

5. The probe apparatus according to claim 4, wherein an end of the plurality of auxiliary probes away from the circuit apparatus does not protrude from a surface of the lower guide plate away from the circuit apparatus.

6. The probe apparatus of claim 4, wherein the probe base further comprises a second metal layer disposed on the upper guide plate and the middle guide plate, and the first metal layer extends and is disposed on a surface of the lower guide plate not adjacent to the signal probe.

7. The probe apparatus of claim 1, further comprising:

and the electronic element is arranged on the probe seat and is electrically connected with the signal probe.

8. A probe device adapted to be disposed on a circuit device, comprising:

the probe seat is provided with a needle body area and a needle point area, and the needle body area is positioned between the circuit device and the needle point area;

a plurality of grounding probes electrically connected with the circuit device and the probe seat, wherein the grounding probes extend through the probe seat, each grounding probe comprises a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body is provided with an upper end part and a lower end part, the second spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section, the lower non-spring section of the second spring sleeve is fixedly connected with the second needle body, the lower end part of the second needle body protrudes out from the lower non-spring section of the second spring sleeve, the upper end of the second needle body is positioned in an upper non-spring section of the second spring sleeve, the needle diameter of the grounding probe positioned in the needle body area is larger than that of the grounding probe positioned in the needle tip area; and

and the auxiliary probes are configured and electrically connected to the probe seat, wherein the distance between the auxiliary probes and the signal probes is smaller than that between the grounding probes and the signal probes.

9. The probe device of claim 8, wherein each of the auxiliary probes comprises a third needle and a third spring sleeve sleeved on the third needle, the third needle has an upper end and a lower end, the third spring sleeve has an upper non-spring section, a lower non-spring section and at least one spring section located between the upper non-spring section and the lower non-spring section, the lower non-spring section of the third spring sleeve is fixedly connected to the third needle, the lower end of the third needle protrudes from the lower non-spring section of the third spring sleeve, the upper end of the third spring sleeve is located in the upper non-spring section of the third spring sleeve, and the third spring sleeve is located only in the needle area.

10. The probe apparatus according to claim 8, wherein the probe base comprises an upper guide plate, a middle guide plate and a lower guide plate in sequence from a side adjacent to the circuit apparatus to a side away from the circuit apparatus, the upper guide plate and the middle guide plate are located in the needle body region, and the lower guide plate is located in the needle tip region.

11. The probe apparatus according to claim 10, wherein an end of the plurality of auxiliary probes away from the circuit apparatus does not protrude from a surface of the lower guide plate away from the circuit apparatus.

12. A probe device adapted to be disposed on a circuit device, comprising:

a probe base having a body region and a tip region, said body region being located between said circuit device and said tip region, said probe base having a plurality of auxiliary through holes located in said tip region;

a plurality of signal probes electrically connected with the circuit device and extending through the probe seat, each signal probe comprising a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body has an upper end and a lower end, the first spring sleeve has an upper non-spring section, a lower non-spring section and at least one spring section between the upper non-spring section and the lower non-spring section, the lower non-spring section of the first spring sleeve is fixedly connected with the first needle body, the lower end part of the first needle body protrudes out from the lower non-spring section of the first spring sleeve, the upper end of the first needle body is positioned in an upper non-spring section of the first spring sleeve, the needle diameter of the signal probe positioned in the needle body area is larger than that of the signal probe positioned in the needle tip area; and

a plurality of grounding probes extending through the probe seat, each grounding probe comprising a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body is provided with an upper end part and a lower end part, the second spring sleeve is provided with an upper non-spring section, a lower non-spring section and at least one spring section positioned between the upper non-spring section and the lower non-spring section, the lower non-spring section of the second spring sleeve is fixedly connected with the second needle body, the lower end part of the second needle body protrudes out from the lower non-spring section of the second spring sleeve, the upper end of the second needle body is positioned in an upper non-spring section of the second spring sleeve, the needle diameter of the grounding probe positioned in the needle body area is larger than that of the grounding probe positioned in the needle tip area, wherein the auxiliary via is located a distance from the signal probe that is less than a distance from the ground probe to the signal probe.

13. The probe apparatus according to claim 12, wherein the probe base comprises an upper guide plate, a middle guide plate and a lower guide plate in sequence from a side adjacent to the circuit apparatus to a side away from the circuit apparatus, the upper guide plate and the middle guide plate are located in the needle body region, and the lower guide plate is located in the needle tip region.

14. The probe apparatus of claim 13, wherein the auxiliary perforations are distributed in the upper guide plate, the middle guide plate, and the lower guide plate.

15. The probe apparatus of claim 13, wherein the probe holder further comprises a metal layer disposed on a surface of the upper guide plate, the middle guide plate, and the lower guide plate not adjacent to the signal probe, and the metal layer is disposed in the auxiliary through hole and electrically connected to at least one of the ground probes.

16. A probe device adapted to be disposed on a circuit device, comprising:

the probe seat sequentially comprises an upper guide plate, a middle guide plate and a lower guide plate from one side close to the circuit device to one side far away from the circuit device, the upper guide plate and the middle guide plate are positioned in the needle body area, the lower guide plate is positioned in the needle tip area and is made of composite materials with heat dissipation and conductivity, and the insulating layer is connected between the lower guide plate and the signal probes.