CN111707850A - Probe device - Google Patents

Abstract

A probe device is suitable for being disposed on a circuit device and includes a probe base, a plurality of signal probes, a plurality of ground probes and a plurality of auxiliary probes. The probe base has a needle body area and a needle tip area. The probe holder has a plurality of auxiliary holes located in the needle tip area. Each signal probe and each ground probe include a needle body and a spring sleeve sleeved on the needle body. The auxiliary probe is configured and electrically connected to the probe base, wherein the distance between the auxiliary through hole and the signal probe is smaller than the distance between the auxiliary probe and the signal probe. The distance between the auxiliary probe and the signal probe is smaller than the distance between the ground probe and the signal probe. The equivalent capacitance value of the signal probe in the needle body area is not equal to the equivalent capacitance value of the signal probe in the needle tip area, and the impedance value of the signal probe in the needle body area matches the impedance value of the signal probe in the needle tip area, improving The electrical effect and measurement speed of the probe device.

Description

Probe device

technical field

The present invention relates to a probe device for a probe card, and more particularly, to a probe device having a spring sleeve type probe.

Background technique

When the integrated circuit is tested, the test machine contacts the integrated circuit through a probe card, and transmits a test signal to test whether its function meets the expectations. A probe card usually contains several precisely dimensioned probes. During integrated circuit testing, the probe contacts the tiny contact points on the device under test (DUT), such as pads or bumps, to transmit test signals from the testing machine. And cooperate with the probe card and the control program of the test machine to achieve the purpose of measuring the integrated circuit.

However, since the pins of the probe card are all designed according to the object to be tested, in high-speed testing, the design of randomly arranged pins will cause impedance mismatch and increase energy loss, thereby affecting the overall test quality. Therefore, how to design a probe device with good impedance matching and electrical effect is the work of those skilled in the art.

SUMMARY OF THE INVENTION

The invention provides a probe device, which can improve the electrical effect and the measurement speed.

An embodiment of the present invention provides a probe device, suitable for being disposed on a circuit device, including a probe holder, a plurality of signal probes, a plurality of ground probes, and a plurality of auxiliary probes. The probe holder has a needle body area and a needle tip area. The needle body area is located between the circuit device and the needle tip area. The probe holder has multiple auxiliary perforations located in the needle tip area. The signal probe is electrically connected to the circuit device and extends through the probe seat, and a first metal layer is disposed in each auxiliary through hole. Each signal probe includes a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body has an upper end and a lower end, and the first spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe located in the needle body area is larger than the needle diameter of the signal probe located in the needle tip area. The ground probe is electrically connected to the circuit device and the first metal layer. The ground probe extends through the probe holder. Each grounding probe includes a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body has an upper end and a lower end, and the second spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end of the second needle body protrudes from the lower non-spring segment of the second spring sleeve. The upper end of the second needle body is located in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe located in the needle body area is larger than that of the grounding probe located in the needle tip area. The auxiliary probe is configured and electrically connected to the ground probe, wherein the distance between the auxiliary through hole and the signal probe is smaller than the distance between the auxiliary probe and the signal probe. The distance between the auxiliary probe and the signal probe is smaller than the distance between the ground probe and the signal probe.

In an embodiment of the present invention, each of the above-mentioned auxiliary probes includes a third needle body and a third spring sleeve sleeved on the third needle body. The third needle body has an upper end and a lower end, and the third spring sleeve has an upper non-spring segment, a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the third spring sleeve is fixedly connected with the third needle body. The lower end of the third needle body protrudes from the lower non-spring section of the third spring sleeve. The upper end of the third needle body is located in the upper non-spring section of the third spring sleeve. The third spring sleeve is only located in the needle body area.

In an embodiment of the present invention, each of the above-mentioned auxiliary probes is a solid cylinder.

In an embodiment of the present invention, the above-mentioned probe seat includes an upper guide plate, a middle guide plate and a lower guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device, and the upper guide plate and the middle guide plate are located on the needle body. area, the lower guide is located in the needle tip area.

In an embodiment of the present invention, one end of the above-mentioned plurality of auxiliary probes that is far away from the circuit device does not protrude from the side of the lower guide plate that is far away from the circuit device.

In an embodiment of the present invention, the above-mentioned probe base further includes a second metal layer distributed on the upper guide plate and the middle guide plate, and the first metal layer is extended and distributed on the surface of the lower guide plate that is not adjacent to the signal probes.

In an embodiment of the present invention, the above-mentioned probe device further includes at least one electronic element, which is disposed on the probe base and is electrically connected to the signal probe.

Another embodiment of the present invention provides a probe device, suitable for being disposed on a circuit device, including a probe holder, a plurality of signal probes, a plurality of ground probes, and a plurality of auxiliary probes. The probe holder has a needle body area and a needle tip area. The needle body area is located between the circuit device and the needle tip area. The signal probe is electrically connected to the circuit device and extends through the probe seat. Each signal probe includes a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body has an upper end and a lower end, and the first spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe located in the needle body area is larger than the needle diameter of the signal probe located in the needle tip area. The grounding probe is electrically connected to the circuit device and the probe base. The ground probe extends through the probe holder. Each grounding probe includes a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body has an upper end and a lower end, and the second spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end of the second needle body protrudes from the lower non-spring segment of the second spring sleeve. The upper end of the second needle body is located in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe located in the needle body area is larger than that of the grounding probe located in the needle tip area. The auxiliary probe is configured and electrically connected to the probe base, wherein the distance between the auxiliary probe and the signal probe is smaller than the distance between the ground probe and the signal probe.

In an embodiment of the present invention, each of the above-mentioned auxiliary probes includes a third needle body and a third spring sleeve sleeved on the third needle body. The third needle body has an upper end and a lower end, and the third spring sleeve has an upper non-spring segment, a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the third spring sleeve is fixedly connected with the third needle body. The lower end of the third needle body protrudes from the lower non-spring section of the third spring sleeve. The upper end of the third needle body is located in the upper non-spring section of the third spring sleeve. The third spring sleeve is only located in the needle body area.

In an embodiment of the present invention, the above-mentioned probe seat includes an upper guide plate, a middle guide plate and a lower guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device, and the upper guide plate and the middle guide plate are located on the needle body. area, the lower guide is located in the needle tip area.

In an embodiment of the present invention, one end of the above-mentioned plurality of auxiliary probes that is far away from the circuit device does not protrude from the side of the lower guide plate that is far away from the circuit device.

Another embodiment of the present invention provides a probe device, suitable for being disposed on a circuit device, including a probe holder, a plurality of signal probes and a plurality of ground probes. The probe holder has a needle body area and a needle tip area. The needle body area is located between the circuit device and the needle tip area. The probe holder has multiple auxiliary perforations located in the needle tip area. The signal probe is electrically connected to the circuit device and extends through the probe seat. Each signal probe includes a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body has an upper end and a lower end, and the first spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe located in the needle body area is larger than the needle diameter of the signal probe located in the needle tip area. The ground probe extends through the probe holder. Each grounding probe includes a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body has an upper end and a lower end, and the second spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end of the second needle body protrudes from the lower non-spring segment of the second spring sleeve. The upper end of the second needle body is located in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe located in the needle body area is larger than that of the grounding probe located in the needle tip area. The distance between the auxiliary through hole and the signal probe is smaller than the distance between the ground probe and the signal probe.

In an embodiment of the present invention, the above-mentioned probe seat includes an upper guide plate, a middle guide plate and a lower guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device, and the upper guide plate and the middle guide plate are located on the needle body. area, the lower guide is located in the needle tip area.

In an embodiment of the present invention, the above-mentioned auxiliary through holes are distributed in the upper guide plate, the middle guide plate and the lower guide plate.

In an embodiment of the present invention, the above-mentioned probe seat further includes a metal layer, which is distributed on the surfaces of the upper guide plate, the middle guide plate and the lower guide plate that are not adjacent to the signal probes, and each auxiliary through hole is provided with a metal layer. , the metal layer is electrically connected to at least one grounding probe.

Another embodiment of the present invention provides a probe device suitable for disposing on a circuit device, including a probe holder, a plurality of signal probes, a plurality of ground probes, and an insulating layer. The probe holder has a needle body area and a needle tip area. The needle body area is located between the circuit device and the needle tip area. The signal probe is electrically connected to the circuit device and extends through the probe seat. Each signal probe includes a first needle body and a first spring sleeve sleeved on the first needle body, the first needle body has an upper end and a lower end, and the first spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the first spring sleeve is fixedly connected with the first needle body. The lower end of the first needle body protrudes from the lower non-spring section of the first spring sleeve. The upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and the needle diameter of the signal probe located in the needle body area is larger than the needle diameter of the signal probe located in the needle tip area. The grounding probe is electrically connected to the circuit device and the probe base. The ground probe extends through the probe holder. Each grounding probe includes a second needle body and a second spring sleeve sleeved on the second needle body, the second needle body has an upper end and a lower end, and the second spring sleeve has an upper non-spring section , a lower non-spring segment, and at least one spring segment located between the upper non-spring segment and the lower non-spring segment. The lower non-spring section of the second spring sleeve is fixedly connected with the second needle body. The lower end of the second needle body protrudes from the lower non-spring segment of the second spring sleeve. The upper end of the second needle body is located in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe located in the needle body area is larger than that of the grounding probe located in the needle tip area. The insulating layer is disposed on the needle tip area of the probe base. The probe seat includes an upper guide plate, a middle guide plate and a lower guide plate in sequence from the side adjacent to the circuit device to the side away from the circuit device. Made of exothermic and conductive composite materials. The insulating layer is connected between the lower guide plate and the signal probe.

Based on the above, in the probe device of the present invention, through the design of the auxiliary probe or the probe base, the signal probe and the ground probe can be well matched in the needle body area and the needle tip area in the probe base, respectively. Thus, the electrical effect and measurement speed of the probe device are improved.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

Description of drawings

FIG. 1 is a schematic diagram of a probe card according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a probe device in the probe card of FIG. 1 .

FIG. 3 is a partial enlarged schematic view of FIG. 2 .

FIG. 4 is a schematic perspective view of a probe device in the probe card of FIG. 1 .

FIG. 5 is a schematic bottom view of the middle guide plate of the probe device of FIG. 4 .

FIG. 6 is a schematic view of the bottom surface of the lower guide plate of the probe device of FIG. 4 .

7 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

8 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

9 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

10 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

11 is a partial cross-sectional view of a probe device according to another embodiment of the present invention.

Reference number:

10: Probe card

20: Circuit device

22: circuit substrate

24: Space Transformer

100, 100A, 100B, 100C, 100D, 100E: Probe Units

110: Probe holder

112, 112A: upper guide plate

114, 114A: Middle guide plate

114_2, 116_2: Bottom surface

116: Lower guide plate

120: Signal probe

122: The first needle body

122_1, 132_1, 142_1: upper end

122_2, 132_2, 142_2: lower end

124: First spring sleeve

124_1, 134_1, 144_1: Upper non-spring segment

124_2, 134_2, 144_2: Lower non-spring segment

124_3, 134_3, 144_3: Spring segment

130: Ground Probe

132: Second needle body

134: Second spring sleeve

140, 140A: Auxiliary probe

142: The third needle body

144: Third spring sleeve

150: Metal Layer

160: Insulation layer

170: Electronic Components

d1, d2: needle diameter

E1: Needle body area

E2: Needle tip area

L1, L2, L3: distance

V: auxiliary perforation

Detailed ways

FIG. 1 is a schematic diagram of a probe card according to an embodiment of the present invention. Please refer to Figure 1. In this embodiment, the probe card 10 includes a circuit device 20 and a probe device 100 , and the circuit device 20 includes a circuit substrate 22 and a space conversion device 24 . The circuit board 22 is electrically connected to the space transformation device 24 , and the space transformation device 24 is electrically connected to the probe device 100 . The probe card 10 can be electrically connected to the circuit substrate 22 through the space conversion device 24, and the surface (top surface) of the side (hereinafter referred to as the tester side) of the circuit substrate 22 away from the object to be tested 30 is electrically connected to the tester. A surface (bottom surface) of the probe device 100 facing an object to be tested 30 (hereinafter referred to as the object to be tested) contacts the object to be tested 30 for testing. Specifically, the test machine provides electrical signals to test an object 30 under test through the probe card 10 . The object to be tested 30 is, for example, an integrated circuit or a chip on a semiconductor wafer. The space conversion device 24 has a plurality of first contacts on the top surface, a first distance between two adjacent first contacts, a plurality of second contacts on the bottom surface, and a second distance between two adjacent second contacts , the first distance is greater than the second distance. The space transformation device 24 can be one of a multi-layer ceramic substrate, a multi-layer organic substrate, a combination of a multi-layer ceramic substrate and a multi-layer organic substrate, or a combination of two multi-layer organic substrates.

FIG. 2 is a partial cross-sectional view of a probe device in the probe card of FIG. 1 . FIG. 3 is a partial enlarged schematic view of FIG. 2 . FIG. 4 is a schematic perspective view of a probe device in the probe card of FIG. 1 . FIG. 5 is a schematic bottom view of the middle guide plate of the probe device of FIG. 4 . FIG. 6 is a schematic view of the bottom surface of the lower guide plate of the probe device of FIG. 4 . For the convenience of description, FIG. 2 and FIG. 3 only show the schematic structure of the probe, but the shape or length of the probe is not identical to the shape or length of the actual structure. Please refer to Figure 1 to Figure 6. Specifically, the probe device 100 includes a probe base 110 , a plurality of signal probes 120 and a plurality of ground probes 130 . In this embodiment, the probe device 100 further includes a plurality of auxiliary probes 140 . However, in other embodiments, it may not be included, and the present invention is not limited to this. The structural sizes and positions of the probes and the guide plates shown in FIG. 2 are for illustration only, and do not represent the actual specific structural sizes and positions.

The probe holder 110 has a needle body area E1 and a needle tip area E2, and the needle body area E1 is located between the circuit device 20 and the needle tip area E2. The probe holder 110 has a plurality of auxiliary perforations V located in the needle tip region E2. Specifically, in this embodiment, the probe holder 110 includes an upper guide plate 112 , a middle guide plate 114 and a lower guide plate 116 in sequence from a side adjacent to the circuit device 20 to a side away from the circuit device 20 . The upper guide plate 112 and the middle guide plate 114 are located in the needle body area E1, and the lower guide plate 116 is located in the needle tip area E2, and has a plurality of auxiliary through holes V. Specifically, the auxiliary through hole V extends from the lower guide plate 116 from the side adjacent to the circuit device 20 to the side away from the circuit device 20 , as shown in FIG. 4 . In some embodiments, the probe holder 110 may not be configured with the middle guide plate 114 but only have the upper guide plate 112 and the lower guide plate 116 , but the invention is not limited thereto.

In this embodiment, the upper guide plate 112 , the middle guide plate 114 and the lower guide plate 116 each have a plurality of through holes, which are suitable for allowing the signal probes 120 , the ground probes 130 and the auxiliary probes 140 to pass through the upper guide plate 112 and the middle guide plate 114 And the multi-layer structure of the lower guide plate 116 is fixed. In addition, in this embodiment, the probe base 110 further includes a metal layer 150 distributed on the surfaces of the upper guide plate 112 , the middle guide plate 114 and the lower guide plate 116 that are not adjacent to the signal probes 120 . Specifically, the top and bottom surfaces of the upper guide plate 112 , the middle guide plate 114 , and the top surface of the lower guide plate 116 are provided with the metal layer 150 , and are not adjacent to the multiple side surfaces of the signal probes 120 , that is, the above-mentioned places where the ground probes 130 are placed. The through hole and the auxiliary through hole V are configured with a metal layer 150 , wherein the through hole of the ground probe 130 and the auxiliary through hole V can be configured with a metal layer 150 on the inner wall. The metal layer 150 is formed on the surface by, for example, sputtering. Therefore, the grounding probe 130 and the auxiliary probe 140 can be electrically connected, but the present invention is not limited thereto. In some embodiments, the metal layer 150 may fill the auxiliary via V, so that the auxiliary via V is formed as a metal channel, but the present invention is not limited thereto.

The signal probes 120 are electrically connected to the circuit device 20 and extend through the probe base 110 . In this embodiment, each signal probe 120 includes a first needle body 122 and a first spring sleeve 124 sleeved on the first needle body 122, wherein the needle diameter of the signal probe 120 in the needle body area E1 d1 is greater than the needle diameter d2 of the signal probe 120 in the needle tip region E2, as shown in FIG. 5 and FIG. 6 . In detail, the first needle body 122 has an upper end 122_1 and a lower end 122_2, the first spring sleeve 124 has an upper non-spring section 124_1, a lower non-spring section 124_2, and the upper non-spring section 124_1 and the lower non-spring section 124_1 At least one spring segment 124_3 between segments 124_2. The lower non-spring segment 124_2 of the first spring sleeve 124 is fixedly connected with the first needle body 122 (so the lower non-spring segment 124_2 can also be regarded as a joint). The lower end 122_2 of the first needle body 122 protrudes from the lower non-spring section 124_2 of the first spring sleeve 124 . The upper end 122_1 of the first needle body 122 is located in the upper non-spring section 124_1 of the first spring sleeve 124 , as shown in FIGS. 3 and 4 . In addition, the lower non-spring segment 124_2 abuts on the top surface of the lower guide plate 116 , so it can serve as a stop for the signal probe 120 to prevent the first needle body 122 from slipping out of the probe seat 110 . In other words, the signal probe 120 is a spring sleeve type probe, so the needle diameter d1 of the signal probe 120 in the needle body area E1 is larger than the needle diameter d2 of the signal probe 120 in the needle tip area E2. In this embodiment, the first needle body 122 extends from the upper guide plate 112 and passes through the lower guide plate 116 to the side of the lower guide plate 116 opposite to the circuit device 20 , that is, distributed in the needle body area E1 and the needle tip area E2 . The first spring sleeve 124 extends from the circuit device 20 to the side of the lower guide plate 116 adjacent to the middle guide plate 114, that is, only distributed in the needle body area E1, as shown in FIG. 5 and FIG. The bottom surface 116_2 of the lower guide plate 116 . In addition, the first needle body 122 is electrically isolated from the probe base 110 , as shown in FIG. 2 . Since the lower non-spring section 124_2 of the first spring sleeve 124 is fixedly connected with the first needle body 122, the length of the first needle body 122 in the needle tip region E2 will not change. When the object to be measured is measured, the lower end 122_2 of the first needle body 122 will contact the contact point of the object to be measured, and then the first needle body 122 will be displaced toward the upper end 122_1 of the first needle body 122 , and the lower end 122_1 of the first needle body 122 will be displaced. The spring segment 124_2 is displaced toward the upper end 122_1 of the first needle body 122 and drives the spring segment 124_3 to compress to ensure that the signal probe 120 contacts the circuit device 20 . , the first needle body 122 will be displaced toward the lower end portion 122_2 of the first needle body 122 .

The ground probe 130 is electrically connected to the circuit device 20 and the probe base 110 and extends through the probe base 110 . Further, the ground probe 130 is electrically connected to the metal layer 150 on the probe base 110 . In this embodiment, each grounding probe 130 includes a second needle body 132 and a second spring sleeve 134 sleeved on the second needle body 132 , wherein the structure of the second needle body 132 is the same as that of the first needle body 122 The structure is similar, that is, the needle diameter of the grounding probe 130 in the needle body area E1 is larger than the needle diameter of the grounding probe 130 in the needle tip area E2. In detail, the second needle body 132 has an upper end 132_1 and a lower end 132_2, the second spring sleeve 134 has an upper non-spring section 134_1, a lower non-spring section 134_2, and the upper non-spring section 134_1 and the lower non-spring section 134_1 At least one spring segment 134_3 between segments 134_2. The lower non-spring segment 134_2 of the second spring sleeve 134 is fixedly connected with the second needle body 132 . The lower end 132_2 of the second needle body 132 protrudes from the lower non-spring section 134_2 of the second spring sleeve 134 . The upper end 132_1 of the second needle body 132 is located in the upper non-spring section 134_1 of the second spring sleeve 134 , as shown in FIG. 3 and FIG. 4 . In addition, the lower non-spring section 134_2 abuts on the top surface of the lower guide plate 116 , and thus can serve as a stop for the grounding probe 130 to prevent the second needle body 132 from slipping out of the probe seat 110 . In other words, the grounding probe 130 is a spring sleeve type probe, so the needle diameter of the grounding probe 130 in the needle body area E1 is larger than the needle diameter of the grounding probe 130 in the needle tip area E2. In this embodiment, the second needle body 132 extends from the upper guide plate 112 and passes through the lower guide plate 116 to the side of the lower guide plate 116 opposite to the circuit device 20 , that is, distributed in the needle body area E1 and the needle tip area E2 . The second spring sleeve 134 extends from the circuit device 20 to the side of the lower guide plate 116 adjacent to the middle guide plate 114 , that is, only distributed in the needle body area E1 , as shown in FIG. 5 and FIG. 6 , the bottom surface 114_2 and The bottom surface 116_2 of the lower guide plate 116 . In addition, the second needle body 132 is electrically connected to the probe base 110 , as shown in FIG. 2 . Since the lower non-spring section 134_2 of the second spring sleeve 134 is fixedly connected with the second needle body 132, the length of the second needle body 132 in the needle tip region E2 will not change. When the object to be measured is measured, the lower end portion 132_2 of the second needle body 132 will contact the contact point of the object to be measured, and then the second needle body 132 will be displaced toward the upper end portion 132_1 of the second needle body 132 . The spring segment 134_2 is displaced toward the upper end 132_1 of the second needle body 132 and drives the spring segment 134_3 to compress to ensure that the grounding probe 130 contacts the circuit device 20 . , the second needle body 132 will be displaced in the direction of the lower end portion 132_2 of the second needle body 132 .

Generally speaking, the lengths of the first needle body 122 and the second needle body 132 in the needle tip region E2 do not change, and the lengths are about 1500um˜1650um.

The auxiliary probes 140 are disposed on the probe base 110 and are electrically connected to the grounding probes 130 . In detail, the auxiliary probes 140 can be regarded as being electrically connected to the metal layer 150 of the probe base 110 and further electrically connected to the grounding probes 130 . . In this embodiment, each auxiliary probe 140 includes a third needle body 142 and a third spring sleeve 144 sleeved on the third needle body 142. The third spring sleeve 144 is only located in the needle body area E1, wherein The structure of the third needle body 142 is similar to that of the first needle body 122. The only difference between the two is that the needle tip end of the third needle body 142 does not protrude from the lower guide plate 116, and the third needle body 142 is not connected to the circuit device. 20 Electrical connections. In detail, the third needle body 142 has an upper end 142_1 and a lower end 142_2, the third spring sleeve 144 has an upper non-spring segment 144_1, a lower non-spring segment 144_2, and the upper non-spring segment 144_1 and the lower non-spring segment 144_1 At least one spring segment 144_3 between segments 144_2. The lower non-spring segment 144_2 of the third spring sleeve 144 is fixedly connected with the third needle body 142 . The lower end 142_2 of the third needle body 142 protrudes from the lower non-spring section 144_2 of the third spring sleeve 144 . The upper end 142_1 of the third needle body 142 is located in the upper non-spring section 144_1 of the third spring sleeve 144 . The third needle body 142 extends from the upper guide plate 112 to the side of the lower guide plate 116 opposite to the circuit device 20 , that is, distributed in the Needle body area E1 and needle tip area E2. The third spring sleeve 144 extends from the upper guide plate 112 to the side of the lower guide plate 116 opposite to the circuit device 20 , that is, the distribution is the same as that of the third needle body 142 . The third needle body 142 is electrically connected to the probe base 110 . In other words, the end of the auxiliary probe 140 away from the circuit device 20 does not protrude from the side of the lower guide plate 116 away from the circuit device 20 , as shown in FIG. 2 .

Please continue to refer to Figure 2. In this embodiment, the distance L3 between the auxiliary via V and the signal probe 120 is smaller than the distance L2 between the auxiliary probe 140 and the signal probe 120 . The distance L2 between the auxiliary probe 140 and the signal probe 120 is smaller than the distance L1 between the ground probe 130 and the signal probe 120 , as shown in FIGS. 2 , 5 and 6 . For example, the distance L1 between the ground probes 130 and the signal probes 120 in this embodiment is 220 μm. In this embodiment, the equivalent capacitance value of the signal probe 120 in the needle body area E1 is not equal to the equivalent capacitance value of the signal probe 120 in the needle tip area E2, wherein the ground probe 130 and the signal probe 120 are in the needle body area The impedance values of E1 and tip region E2 can be defined by the following equations (1) and (2):

in:

Z: the impedance value of the grounded object and the signal probe;

L: the equivalent inductance value of the grounded object and the signal probe;

C: the equivalent capacitance value of the grounded object and the signal probe;

ε: The permittivity parameter of the equivalent capacitance of the grounded object and the signal probe;

Ф: the needle diameter of the signal probe;

d: The distance between the ground probe and the signal probe.

Wherein, in the needle body area E1, the grounding object is the auxiliary probe 140 . In the needle tip area E2, the grounding object is the auxiliary through hole V. As shown in FIG. In other words, in the needle body region E1 , the signal probe 120 performs impedance matching through the auxiliary probe 140 . In the needle tip area E2, the signal probe 120 performs impedance matching through the auxiliary through hole V, so that the impedance values of the signal probe 120 in the needle body area E1 and the needle tip area E2 match each other, that is, have approximately the same impedance value. However, in other embodiments, the grounding object may also be other structures, and the present invention is not limited thereto.

Therefore, in this embodiment, the relative distance between the auxiliary probe 140 and the auxiliary through hole V and the signal probe 120 can be designed to adjust the equivalent capacitance between the signal probe 120 and the grounded object, and then the signal probe 120 and the ground can be adjusted. Impedance value of probe 130 . In this way, the electrical effect and measurement speed of the probe device 100 can be improved. In some embodiments with different distances between the signal probes 120 and the ground probes 130 , the signal probes 120 and the ground probes 130 may be selectively disposed only in the probe base 110 without the auxiliary vias V being disposed in the probe base 110 .

In a known probe device with a cobra probe, since the cobra probe will retract and undergo buckling deformation, when the probe contacts the object to be tested for testing, the part of the probe buckling and deforming Its impedance cannot be controlled due to its deformation. In other words, if both the signal probe and the ground probe are made of curved probes, it is impossible to determine whether the impedance value in the buckling deformation section meets the requirements, so it is impossible to further perform impedance matching through the design and configuration of the structure, so as to achieve high the need for frequent testing. In other words, the probe device 100 with the spring sleeve type signal probe 120 of the present embodiment can also perform impedance matching between the needle body area E1 and the needle tip area E2, compared with the known probe device with curved probes, so as to Meet the needs of high frequency testing.

7 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to Figure 7. The probe device 100A of this embodiment is similar to the probe device 100 of FIG. 2 of the present embodiment. The difference between the two is that, in this embodiment, each auxiliary probe 140A is a solid cylinder. Specifically, in this embodiment, the auxiliary probe 140A has the same needle diameter from one end adjacent to the circuit device 20 to the end far from the circuit device 20 , as shown in FIG. 7 . Therefore, the electrical effect of the probe device 100A can be improved, the process thereof can be simplified, and the cost can be reduced at the same time.

8 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to Figure 8. The probe device 100B of this embodiment is similar to the probe device 100 of FIG. 2 of the present embodiment. The difference between the two is that, in this embodiment, the probe device 100B is not configured with the auxiliary probe 140 as shown in FIG. 2 . Therefore, it can be applied to the embodiment in which the distance between the signal probe 120 and the ground probe 130 is relatively large, so that the impedance value of the needle body of the signal probe 120 meets the requirements, and the electrical effect of the probe device 100B is improved.

9 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to Figure 9. The probe device 100C of this embodiment is similar to the probe device 100B of FIG. 8 of the present pattern. The difference between the two is that, in this embodiment, the auxiliary through holes V are distributed in the upper guide plate 112A, the middle guide plate 114A and the lower guide plate 116 . Specifically, compared with the aforementioned embodiments, the auxiliary through holes V are not only distributed in the lower guide plate 116 , but also distributed in the upper guide plate 112A and the middle guide plate 114A in this embodiment. In addition, in this embodiment, the probe base 110 does not have a metal layer, and the upper guide plate 112A, the middle guide plate 114A or the lower guide plate 116 can be further designed to be thinner, or the above-mentioned guide plates can be made of a material with a dielectric constant of 5. It is worth mentioning that, compared with the embodiments described above, this embodiment changes the equivalent capacitance value by changing the permittivity parameter (ie, the ε coefficient in the above formula (2)). In this way, the present embodiment achieves the purpose of adjusting the equivalent capacitance of the signal probe 120 by changing the ε coefficient, and can be further applied to the embodiment in which the distance between the signal probe 120 and the ground probe 130 is less than 100 microns, improving the detection efficiency. The electrical effect and measurement speed of the needle device 100C are simplified, and its process and cost are reduced. In some embodiments, if the impedance value of the signal probe 120 located in the needle tip area E2 and the impedance value of the signal probe 120 located in the needle body area E1 have not been matched, the adjustment methods of the foregoing embodiments can be further used. The impedance value of the signal probe 120 located in the needle tip region E2 is adjusted to achieve impedance matching, but the invention is not limited to this.

10 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to Figure 10. The probe device 100D of this embodiment is similar to the probe device 100B of FIG. 8 of the present embodiment. The difference between the two is that, in this embodiment, the probe device 100D does not have auxiliary vias and metal layers, and the probe device 100D further includes an insulating layer 160 disposed in the tip region E2 of the probe base 110 . In addition, the lower guide plate 116 is made of a composite material with heat dissipation and electrical conductivity, and the insulating layer 160 is connected between the lower guide plate 116 and the signal probes 120 . Therefore, by configuring the design of the insulating layer 160, the distance between the signal probe 120 and the ground object (ie, the lower guide plate 116A that is connected to the ground probe 130) can be changed to achieve the impedance with the signal probe 120 located in the needle body area E1 matching effect. In some embodiments, if the impedance value of the signal probe 120 located in the needle tip area E2 and the impedance value of the signal probe 120 located in the needle body area E1 have not been matched, the adjustment methods of the foregoing embodiments can be further used. The impedance value of the signal probe 120 located in the needle body area E1 is adjusted to achieve impedance matching, but the invention is not limited to this.

In addition, the upper guide plate 112 and the middle guide plate 114 can also be made of a composite material with heat dissipation and electrical conductivity, and an insulating layer 160 is used to connect between the upper guide plate 112 (the middle guide plate 114 ) and the signal probes 120 . In this embodiment, the auxiliary probes 140 or 140A of FIG. 2 and FIG. 7 can also be added, and the auxiliary probes can directly conduct the upper guide plate 112 , the middle guide plate 114 and the lower guide plate 116 .

11 is a partial cross-sectional view of a probe device according to another embodiment of the present invention. Please refer to Figure 11. The probe device 100E of the present embodiment is similar to the probe device 100 of FIG. 2 of the present embodiment. The difference between the two is that, in this embodiment, the probe device 100E further includes at least one electronic element 170 , which is disposed on the probe base 110 and is electrically connected to the signal probe 120 . In detail, in this embodiment, lines can be arranged on the guide plate to connect the electronic components 170 , such as capacitors. Therefore, the signal transmission path can be further shortened or the signal can be re-amplified to be applied in some special embodiments, thereby reducing the signal error rate of the probe device 100E and improving its electrical effect.

To sum up, in the probe device of the present invention, through the design of the auxiliary probe or the probe base, the signal probe and the ground probe in the needle body area and the needle tip area of the probe base respectively have good characteristics. Matching, thereby improving the electrical effect and measurement speed of the probe device.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the claims.

Claims (16)

1. A probe device adapted to be configured on a circuit device, characterized in that it comprises: a probe seat with a needle body area and a needle tip area, the needle body area is located between the circuit device and the needle tip area, the probe seat has a plurality of auxiliary perforations located in the needle tip area, A first metal layer is disposed in the auxiliary through hole; a plurality of signal probes, electrically connected to the circuit device and extending through the probe seat, each of the signal probes includes a first needle body and a first spring sleeved on the first needle body a sleeve, the first needle body has an upper end and a lower end, the first spring sleeve has an upper non-spring segment, a lower non-spring segment, and the upper non-spring segment and the lower non-spring At least one spring segment between the segments, the lower non-spring segment of the first spring sleeve is fixed with the first needle body, and the lower end of the first needle body is free from the first spring The lower non-spring section of the sleeve protrudes out, the upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and is located in the upper non-spring section of the needle body area The needle diameter of the signal probe is larger than the needle diameter of the signal probe located in the needle tip area; a plurality of grounding probes, electrically connected to the circuit device and the first metal layer, the grounding probes extend through the probe seat, each of the grounding probes includes a second needle body and a sleeve A second spring sleeve on the second needle body, the second needle body has an upper end and a lower end, the second spring sleeve has an upper non-spring segment, a lower non-spring segment and a At least one spring segment between the upper non-spring segment and the lower non-spring segment, the lower non-spring segment of the second spring sleeve is fixedly connected to the second needle body, the second needle The lower end of the body protrudes from the lower non-spring segment of the second spring sleeve, and the upper end of the second needle body is located at the upper non-spring segment of the second spring sleeve and the needle diameter of the grounding probe located in the needle body area is larger than the needle diameter of the grounding probe located in the needle tip area; and A plurality of auxiliary probes are arranged and electrically connected to the grounding probes, wherein the distance between the auxiliary through holes and the signal probes is smaller than the distance between the auxiliary probes and the signal probes, and the auxiliary probes are The distance between the needle and the signal probe is smaller than the distance between the ground probe and the signal probe. 2 . The probe device according to claim 1 , wherein each of the auxiliary probes comprises a third needle body and a third spring sleeve sleeved on the third needle body, and the first The three-pin body has an upper end and a lower end, and the third spring sleeve has an upper non-spring segment, a lower non-spring segment, and at least one between the upper non-spring segment and the lower non-spring segment. A spring segment, the lower non-spring segment of the third spring sleeve is fixedly connected with the third needle body, and the lower end of the third needle body is separated from the lower part of the third spring sleeve The non-spring segment protrudes out, the upper end of the third needle body is located in the upper non-spring segment of the third spring sleeve, and the third spring sleeve is only located in the needle body area. 3 . The probe device according to claim 1 , wherein each of the auxiliary probes is a solid cylinder. 4 . 4 . The probe device according to claim 1 , wherein the probe seat comprises an upper guide plate and a middle guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device. 5 . and a lower guide plate, the upper guide plate and the middle guide plate are located in the needle body area, and the lower guide plate is located in the needle tip area. 5 . The probe device according to claim 4 , wherein one end of the plurality of auxiliary probes away from the circuit device does not protrude from a side of the lower guide plate away from the circuit device. 6 . 6 . The probe device according to claim 4 , wherein the probe base further comprises a second metal layer distributed on the upper guide plate and the middle guide plate, and the first metal layer extends. 7 . distributed on the surface of the lower guide plate that is not adjacent to the signal probe. 7. The probe device of claim 1, further comprising: At least one electronic element is arranged on the probe base and is electrically connected to the signal probe. 8. A probe device adapted to be configured on a circuit device, characterized in that it comprises: a probe holder having a needle body area and a needle tip area, the needle body area is located between the circuit device and the needle tip area; a plurality of signal probes, electrically connected to the circuit device and extending through the probe seat, each of the signal probes includes a first needle body and a first spring sleeved on the first needle body a sleeve, the first needle body has an upper end and a lower end, the first spring sleeve has an upper non-spring segment, a lower non-spring segment, and the upper non-spring segment and the lower non-spring At least one spring segment between the segments, the lower non-spring segment of the first spring sleeve is fixed with the first needle body, and the lower end of the first needle body is free from the first spring The lower non-spring section of the sleeve protrudes out, the upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and is located in the upper non-spring section of the needle body area The needle diameter of the signal probe is larger than the needle diameter of the signal probe located in the needle tip area; A plurality of grounding probes are electrically connected to the circuit device and the probe base, the grounding probes extend through the probe base, and each of the grounding probes includes a second needle body and is sleeved on the probe base. A second spring sleeve of the second needle body, the second needle body has an upper end and a lower end, the second spring sleeve has an upper non-spring segment, a lower non-spring segment and a At least one spring segment between the upper non-spring segment and the lower non-spring segment, the lower non-spring segment of the second spring sleeve is fixedly connected to the second needle body, the second needle body The lower end portion of the second spring sleeve protrudes from the lower non-spring segment of the second spring sleeve, and the upper end portion of the second needle body is located in the upper non-spring segment of the second spring sleeve , and the needle diameter of the grounding probe located in the needle body area is larger than the needle diameter of the grounding probe located in the needle tip area; and A plurality of auxiliary probes are arranged and electrically connected to the probe base, wherein the distance between the auxiliary probe and the signal probe is smaller than the distance between the ground probe and the signal probe. 9 . The probe device according to claim 8 , wherein each of the auxiliary probes comprises a third needle body and a third spring sleeve sleeved on the third needle body, and the first The three-pin body has an upper end and a lower end, and the third spring sleeve has an upper non-spring segment, a lower non-spring segment, and at least one between the upper non-spring segment and the lower non-spring segment. A spring segment, the lower non-spring segment of the third spring sleeve is fixedly connected with the third needle body, and the lower end of the third needle body is separated from the lower part of the third spring sleeve The non-spring segment protrudes out, the upper end of the third needle body is located in the upper non-spring segment of the third spring sleeve, and the third spring sleeve is only located in the needle body area. 10 . The probe device according to claim 8 , wherein the probe seat comprises an upper guide plate and a middle guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device. 11 . and a lower guide plate, the upper guide plate and the middle guide plate are located in the needle body area, and the lower guide plate is located in the needle tip area. 11 . The probe device according to claim 10 , wherein one end of the plurality of auxiliary probes away from the circuit device does not protrude from a side of the lower guide plate away from the circuit device. 12 . 12. A probe device adapted to be configured on a circuit device, characterized in that it comprises: a probe seat having a needle body area and a needle tip area, the needle body area is located between the circuit device and the needle tip area, the probe seat has a plurality of auxiliary perforations located in the needle tip area; a plurality of signal probes, electrically connected to the circuit device and extending through the probe seat, each of the signal probes includes a first needle body and a first spring sleeved on the first needle body a sleeve, the first needle body has an upper end and a lower end, the first spring sleeve has an upper non-spring segment, a lower non-spring segment, and the upper non-spring segment and the lower non-spring At least one spring segment between the segments, the lower non-spring segment of the first spring sleeve is fixed with the first needle body, and the lower end of the first needle body is free from the first spring The lower non-spring section of the sleeve protrudes out, the upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and is located in the upper non-spring section of the needle body area The needle diameter of the signal probe is larger than the needle diameter of the signal probe located in the needle tip region; and A plurality of grounding probes extend through the probe seat, each of the grounding probes includes a second needle body and a second spring sleeve sleeved on the second needle body, the second needle The body has an upper end and a lower end, the second spring sleeve has an upper non-spring segment, a lower non-spring segment and at least one spring segment located between the upper non-spring segment and the lower non-spring segment , the lower non-spring section of the second spring sleeve is fixedly connected with the second needle body, and the lower end of the second needle body is separated from the lower non-spring section of the second spring sleeve The upper end of the second needle body is located in the upper non-spring section of the second spring sleeve, and the needle diameter of the grounding probe located in the needle body area is larger than that located in the The needle diameter of the ground probe in the needle tip area, wherein the distance between the auxiliary through hole and the signal probe is smaller than the distance between the ground probe and the signal probe. 13 . The probe device according to claim 12 , wherein the probe seat comprises an upper guide plate and a middle guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device. 14 . and a lower guide plate, the upper guide plate and the middle guide plate are located in the needle body area, and the lower guide plate is located in the needle tip area. 14. The probe device according to claim 13, wherein the auxiliary through holes are distributed in the upper guide plate, the middle guide plate and the lower guide plate. 15 . The probe device according to claim 13 , wherein the probe base further comprises a metal layer distributed on the upper guide plate, the middle guide plate and the lower guide plate and not adjacent to the signal. 16 . The metal layer is disposed on the surface of the probe and inside the auxiliary through hole, and the metal layer is electrically connected to at least one of the grounding probes. 16. A probe device adapted to be deployed on a circuit device, characterized in that it comprises: a probe holder with a needle body area and a needle tip area, the needle body area is located between the circuit device and the needle tip area; a plurality of signal probes, electrically connected to the circuit device and extending through the probe seat, each of the signal probes includes a first needle body and a first spring sleeved on the first needle body a sleeve, the first needle body has an upper end and a lower end, the first spring sleeve has an upper non-spring segment, a lower non-spring segment, and the upper non-spring segment and the lower non-spring At least one spring segment between the segments, the lower non-spring segment of the first spring sleeve is fixed with the first needle body, and the lower end of the first needle body is free from the first spring The lower non-spring section of the sleeve protrudes out, the upper end of the first needle body is located in the upper non-spring section of the first spring sleeve, and is located in the upper non-spring section of the needle body area The needle diameter of the signal probe is larger than the needle diameter of the signal probe located in the needle tip area; A plurality of grounding probes are electrically connected to the circuit device and the probe base, the grounding probes extend through the probe base, and each of the grounding probes includes a second needle body and is sleeved on the probe base. A second spring sleeve of the second needle body, the second needle body has an upper end and a lower end, the second spring sleeve has an upper non-spring segment, a lower non-spring segment and a At least one spring segment between the upper non-spring segment and the lower non-spring segment, the lower non-spring segment of the second spring sleeve is fixedly connected to the second needle body, the second needle body The lower end portion of the second spring sleeve protrudes from the lower non-spring segment of the second spring sleeve, and the upper end portion of the second needle body is located in the upper non-spring segment of the second spring sleeve , and the needle diameter of the grounding probe located in the needle body area is larger than the needle diameter of the grounding probe located in the needle tip area; and An insulating layer is disposed on the needle tip area of the probe base, and the probe base includes an upper guide plate and a middle guide plate in sequence from a side adjacent to the circuit device to a side away from the circuit device and a lower guide plate, the upper guide plate and the middle guide plate are located in the needle body area, the lower guide plate is located in the needle tip area, and is made of a composite material with exothermic and electrical conductivity, and the insulating layer is connected to the between the lower guide plate and the signal probe.

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