CN117572045A - Test seat of radio frequency chip - Google Patents
Test seat of radio frequency chip Download PDFInfo
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- CN117572045A CN117572045A CN202410050664.2A CN202410050664A CN117572045A CN 117572045 A CN117572045 A CN 117572045A CN 202410050664 A CN202410050664 A CN 202410050664A CN 117572045 A CN117572045 A CN 117572045A
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Abstract
The invention relates to a test seat of a radio frequency chip, which comprises a circuit board; a receiving location; a conductor mount disposed between the circuit board and the accommodation site; a first shielding probe located in the conductor hub; the material and shape of the circuit board and the material and shape of the conductor needle seat meet the conditions: and the oscillation frequency of the resonant cavity in the test seat is not in a preset frequency band during the test.
Description
Technical Field
The invention relates to the technical field of testing devices, in particular to a testing seat of a radio frequency chip.
Background
The radio frequency chip is an important branch of an integrated circuit, and is widely applied to the fields of consumer electronics, digital communication, transportation, national defense, aerospace and the like. Along with the improvement of the semiconductor technology, the package of the radio frequency chip is gradually miniaturized, and the cost of each chip is reduced. The smaller the package of the radio frequency chip, the more the output of unit area, the cost of sharing each chip can be obviously reduced, the profit of the radio frequency chip is improved, and the competitiveness of the market is enhanced. However, miniaturization of the rf chip package may reduce the space between adjacent rf signal pins, and the stability of the semiconductor process and the packaging material process may affect the performance of the rf chip. Thus, there is a need for screening tests on the production line after the radio frequency chip package is completed. The screening of the radio frequency chip is a key ring in the production quality inspection, and the reliability of the test equipment directly influences the yield and efficiency of the radio frequency chip.
The rf chip screening tool typically employs a non-soldered rf test socket. The cavity of the test socket is typically slightly larger than the rf chip. The control line and the specification line are arranged on the screening upper computer. The process of screening the radio frequency chip by using the radio frequency test seat comprises eight steps of loading, powering up, controlling, collecting, judging, powering down, taking out and classifying. The isolation between the radio frequency pins is proportional to the distance between the pins and inversely proportional to the frequency of the radio frequency chip. If the isolation between the radio frequency probes of the radio frequency chip test seat is lower than the isolation between the pins of the radio frequency chip, whether the problem of the radio frequency chip in the test is caused by the self reason or the reason of the test environment cannot be judged, and the control line and the specification line for clamping the performance of the radio frequency chip are invalid. Therefore, how to design and manufacture a high-isolation radio frequency chip test socket is a problem to be solved.
Disclosure of Invention
The invention aims to provide a test seat of a radio frequency chip and solve the problem of low isolation of the test seat of the radio frequency chip.
The embodiment of the invention discloses a test seat of a radio frequency chip, which comprises:
a circuit board;
a receiving location;
a conductor mount disposed between the circuit board and the receiving location;
a first shielding probe located in the conductor hub;
the material and the shape of the circuit board and the material and the shape of the conductor hub meet the conditions: and the oscillation frequency of the resonant cavity in the test seat is not in a preset frequency band during the test.
Optionally, the test socket further comprises:
and the signal probe is positioned at the periphery of the conductor hub.
Optionally, the side edge of the conductor hub has a plurality of protrusions, each of which accommodates at least one second shielding probe therein; each of the projections separates adjacent ones of the signaling probes.
Optionally, a plurality of the first shielding probes form a plurality of rows along a first direction, and the rows are staggered in a second direction perpendicular to the first direction.
Optionally, the spacing between adjacent first shielding probes in the row is between 1/20 and 1/10 of a predetermined wavelength, and the staggered distance between the rows is between 1/20 and 1/10 of the predetermined wavelength.
Optionally, a gap is formed between the conductor hub and the accommodation site, and a gap is formed between the conductor hub and the circuit board.
Optionally, the material of the conductor hub is brass.
Optionally, the signal probe comprises a radio frequency probe, a power supply probe and a control probe.
Optionally, the signal probe further comprises an insulating needle seat positioned at the periphery of the conductor needle seat, and the signal probe is installed in the insulating needle seat.
Optionally, the first shielding probe, the second shielding probe and the signal probe are pogo pins.
Optionally, a height of a gap between the accommodation site and the circuit board is smaller than a predetermined wavelength.
Optionally, a wave absorbing material is further surrounding the side edge of the gap between the accommodating position and the circuit board, the thickness of the wave absorbing material is 2-3 times that of the chip to be tested, and the size of a space enclosed by the wave absorbing material is 1/4 of the preset wavelength larger than the preset wavelength.
Compared with the prior art, the embodiment of the invention has the main differences and effects that:
in the invention, the material and shape of the circuit board and the material and shape of the needle seat meet the conditions: the vibration frequency of the resonant cavity in the test seat is not in a preset frequency band during testing, so that the problem that the screening result of the radio frequency chip is difficult to judge due to the self-excitation phenomenon is avoided.
In the invention, the needle seat of the shielding probe is a conductor needle seat, and shielding materials (conductors) are used for improving the isolation between the radio frequency chip test seats and avoiding the crosstalk between the radio frequency chip test seats.
In the invention, the side edge of the conductor hub is provided with a plurality of bulges, and each bulge accommodates at least one second shielding probe; each bump separates adjacent signaling probes. Isolation between signal probes is increased by the conductor hub protrusions accommodating the second shielding probes, and isolation reduction caused by spring pins is improved.
In the present invention, the plurality of first shielding probes form a plurality of rows along the first direction, and the rows are staggered in a second direction perpendicular to the first direction. The heat dissipation performance is improved, the isolation between the radio frequency signal pins is improved, and the problem that screening results are large in fluctuation due to the fact that the isolation of the radio frequency signal test seat is lower than that of the radio frequency chip is solved.
In the present invention, the pitch between adjacent first shielding probes in a row is between 1/20 and 1/10 of the predetermined wavelength, and the distance of staggering between rows is between 1/20 and 1/10 of the predetermined wavelength. The shielding effect on electromagnetic waves which are far smaller than the working frequency of the radio frequency chip to be tested is good.
In the invention, the gap is arranged between the conductor needle seat and the accommodating position, and the gap is arranged between the conductor needle seat and the circuit board, so that the heat dissipation performance is improved, and the problem of large screening result deviation caused by poor heat dissipation is solved.
In the invention, the material of the conductor needle seat is brass, and the good conductivity of the brass increases the isolation between probes and enhances the wear resistance, strength, hardness and chemical resistance of the conductor needle seat. And brass has outstanding cutting mechanical properties, and is convenient to process.
In the present invention, the height of the gap between the accommodation site and the wiring board is smaller than a predetermined wavelength. The reflected signal of the circuit board is in constant amplitude inversion with the signal of the transmitting end of the chip pin, so that the amplitude of the signal received by the radio frequency chip pin is minimum.
In the invention, the side edge of the gap between the holding position and the circuit board is also surrounded by the wave absorbing material, the thickness of the wave absorbing material is 2-3 times of that of the chip to be detected, and the size of the space enclosed by the wave absorbing material is 1/4 of the predetermined wavelength larger than that of the chip to be detected. The isolation between the radio frequency chip test seats is improved by using the wave absorbing material, so that the crosstalk between the radio frequency chip test seats is avoided.
Drawings
Fig. 1A shows a side view of a test socket of a radio frequency chip according to the prior art.
Fig. 1B shows a side view of a test socket of a radio frequency chip according to the prior art.
Fig. 2 shows a schematic structural plan view of a test device for a radio frequency chip according to an embodiment of the present application.
Fig. 3 illustrates a side view of a test socket of a radio frequency chip according to an embodiment of the present application.
Fig. 4 shows a top view of a test socket of a radio frequency chip according to an embodiment of the present application.
FIG. 5 illustrates a side view of another embodiment of a test seat according to the present application.
FIG. 6 illustrates a top view of another embodiment of a test socket according to the present application.
Fig. 7 shows a top view of a conductor hub and probe according to an embodiment of the present application.
Fig. 8 shows a top view of a conductor hub and probe according to another embodiment of the present application.
Fig. 9 shows a top view of a conductor hub and probe according to yet another embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
The design of the radio frequency chip test seat in the prior art only considers the structure and the electrical design, and lacks comprehensive consideration on radio frequency performance. Fig. 1A and 1B show side views of a test socket of a radio frequency chip according to the prior art. The test socket 10 includes a circuit board 11, a needle holder 12, a probe 13 installed in the needle holder 12, and engineering plastics 14. The probes 13 are used for connecting pins of the radio frequency chip 15 to be tested and bonding pads of the circuit board 11. The internal structure of the test socket 10 greatly affects the test of the radio frequency chip 15 to be tested, the radio frequency chip 15 to be tested is loaded into the test socket 10, and is compressed by a material taking device (not shown), and a space between the radio frequency chip 15 to be tested and the inner cavity of the test socket 10 forms an approximately closed resonant cavity. The electromagnetic field is completely concentrated in the cavity, so that no radiation loss exists, and the high-quality-factor electromagnetic wave resonator has a high quality factor. The resonator forms are many, most commonly rectangular and cylindrical, like the test socket 10. Within the cavity, the electromagnetic field may oscillate at a range of frequencies, the magnitude of which is related to the shape, geometry and mode of resonance of the cavity. The radio frequency chip 15 to be tested is usually in the form of a rectangular or square package. The higher the working frequency of the radio frequency chip 15 to be tested is, the shorter the corresponding wavelength is, and when the size of the resonant cavity formed by the inner cavity of the test seat 10 of the radio frequency chip and the radio frequency chip 15 to be tested is close to the working wavelength of the radio frequency chip to be tested, the self-excitation phenomenon can occur.
In the case where the rf chip 15 to be tested is a low frequency chip with a low frequency, referring to the flow direction of the rf signals of the test socket 10 shown in fig. 1A when the low frequency chip is screened, the rf signals mainly flow along the direction of the probe 13, and these rf signals are indicated by straight arrows, and the general rf test socket design cannot reflect the problem. With increasing frequency, referring to the flow direction of the rf signal when the test socket 10 is used for screening the rf chip as shown in fig. 1B, in the case that the rf chip 15 to be tested is the rf chip, the rf signal not only flows along the direction of the probe 13, but also propagates inside and outside the rf test socket in the manner of electromagnetic field due to the semi-open structure of the test socket 10, and these rf signals propagating outside the probe 13 are indicated by arc arrows. Thus, pins of the RF chip 15 under test within the RF chip's socket 10 may receive RF signals from multiple paths, e.g., RF pins may receive RF signals from adjacent or nearby RF pins, or even other functional pins, in multiple paths. Especially, in the case that the high gain pin of the receiving link of the rf chip 15 to be tested receives the rf signals transmitted from multiple paths at the same time, if the amplitude and phase of the synthesized signals reach the oscillation condition, the rf chip 15 to be tested in the test socket 10 will generate a self-excitation phenomenon, and the electrical performance index will be strongly interfered. In the link of screening the radio frequency chips in the production line, analysis and judgment can only be carried out according to the acquired signal data, so that the problem that the self-excited signal is the radio frequency chip to be tested or the problem of the test seat can not be identified, and misjudgment can be brought to the screening of the radio frequency chips. If the self-excitation signal power is too high, the radio frequency chip 15 to be tested is broken down or burnt through and permanently fails, so that difficulty is brought to the fault analysis of the radio frequency chip.
Therefore, when designing the radio frequency chip test seat, the size of the resonant cavity formed after the radio frequency chip test seat is installed into the chip must be designed according to the size, the travel, the frequency band and the mode of the radio frequency chip, so as to avoid the frequency band which is easy to generate the self-excitation phenomenon. In general, when a radio frequency chip is screened, in order to improve the screening efficiency, a plurality of radio frequency chip test seats are used for simultaneously carrying out screening work. Under the condition that one or more radio frequency chips form a resonant cavity in a non-radio frequency chip test seat to generate self-excitation phenomenon, but the defects of the radio frequency chips generate self-excitation phenomenon, if measures such as shielding materials or absorbing materials are not adopted, the radio frequency chips can interfere other radio frequency chip test seats to normally screen the chips. Therefore, shielding and absorption must be used to avoid the self-interference and interference when designing and manufacturing the radio frequency chip test socket. For example, using electromagnetic simulation software, modeling electromagnetic field distribution of a simulated radio frequency chip inside and outside a radio frequency test seat; the size of the radio frequency chip test seat is adjusted, the electromagnetic field distribution of the radio frequency test seat is improved, and the resonant cavity mode of exciting signals is eliminated. And proper shielding materials, proper absorption materials and proper material sizes are selected, so that a plurality of radio frequency chip test seats are not interfered with each other, and the radio frequency chips are stably screened.
According to the above thought, the embodiment of the application provides a testing device of a radio frequency chip with high isolation.
Fig. 2 shows a schematic structural diagram of a test device for a radio frequency chip according to an embodiment of the present application. As shown in fig. 2, the test apparatus includes a test socket 20 and an upper cover 30, and the test socket 20 is fixed to a stage or device by a screw 40. The upper cover 30 further includes a pressing block 31 and a fan 32, wherein the pressing block 31 is used for pressing the upper cover 30 onto the test seat 20, and the fan 32 is used for heat dissipation.
Fig. 3 illustrates a side view of a test socket of a radio frequency chip according to an embodiment of the present application. Fig. 4 shows a top view of a test socket of a radio frequency chip according to an embodiment of the present application. As seen in fig. 2, 3 and 4, the test socket 20 of the rf chip includes: a circuit board 21, a conductor hub 22, a receiving location 23 and a frame 24. The conductor hub 22 is disposed between the wiring board 21 and the accommodation site 23. The accommodating position 23 is a reserved position for accommodating the radio frequency chip 25 to be tested, and may be a semi-open space defined by and positioned by a limiting frame, or an open space at a joint of the probe and the radio frequency chip 25 to be tested. The frame 24 may be made of engineering plastic.
Fig. 5 shows a side view of another embodiment of a test seat 20. Referring to fig. 5 in combination, in the embodiment, after the radio frequency chip 25 to be tested is placed in the accommodating position 23 of the test socket 20, the upper cover 30 is screwed to press the radio frequency chip 25 to be tested downward. When the radio frequency chip 25 to be tested is pressed down, the probes 26 (not shown in fig. 2, 3 and 4) in the conductor pin seat 22, which are in contact with the chip pins, are pushed down to the corresponding bonding pads (not shown in the drawings) of the circuit board 21, so that the electrical connection between the radio frequency chip 25 to be tested and the circuit board 21 is realized.
In this application, after the accommodation site 23 is loaded into the radio frequency chip 25 to be tested, a resonant cavity is formed between the circuit board 21 and the radio frequency chip 25 to be tested. The material and shape of the wiring board 21, the material and shape of the conductor hub 22 satisfy the conditions: and the oscillation frequency of the resonant cavity in the test seat is not in a preset frequency band during the test. In this application, the predetermined frequency band refers to an operating frequency band of the radio frequency chip 25 to be measured.
Those skilled in the art will appreciate that a resonant cavity refers to a cavity. Thus, in this application, the resonant cavity is: the space between the circuit board 21 and the radio frequency chip 25 to be tested is a cavity left after the space occupied by the conductor hub 22, the probe and other elements is subtracted. For example, a cuboid space is enclosed between the circuit board 21, the frame 24 and the radio frequency chip 25 to be tested, wherein the cuboid space is closed or nearly closed (a gap may exist between the frame 24 and the radio frequency chip 25 to be tested). This cuboid space minus a portion of the space occupied by the conductor mount 22, the probe, leaves a cavity which is the resonant cavity. It can be seen that the cavity is a cavity bounded by the circuit board 21, the frame 24, the radio frequency chip 25 to be tested, the conductor hub 22 and the probe, and possibly having a slit. The frequency of oscillation of a resonant cavity is related to its shape, size, and the material of the boundary, and the shape of the cavity is generally irregular. The test seat 20 and the radio frequency chip 25 to be tested can be subjected to joint simulation, and the materials and the shape structures of the circuit board 21, the frame 24, the conductor needle seat 22 and the probes are adjusted, so that the shape, the size and the boundary materials of the resonant cavity are adjusted, and the oscillation frequency of the resonant cavity is adjusted, so that the oscillation frequency of the resonant cavity is not in the working frequency band of the radio frequency chip to be tested, or the oscillation frequency of the resonant cavity is far away from the working frequency band of the radio frequency chip to be tested according to requirements. Thereby avoiding the problem that the screening result of the radio frequency chip is difficult to judge caused by the self-excitation phenomenon.
If the shape of the resonant cavity is a regular geometric shape, each geometric dimension of the resonant cavity can be directly adjusted based on theoretical calculation, so that the oscillation frequency of the resonant cavity is far away from the working frequency band of the radio frequency chip to be tested. For example, the oscillation frequency of a resonant cavity of some shape is mainly determined by the dimension of the resonant cavity in a specific direction, for example, in the case where the resonant cavity is a rectangular parallelepiped, if the length of the longest edge of the rectangular parallelepiped is much longer than the lengths of the other edges, the oscillation frequency of the resonant cavity is mainly determined by the length of the longest edge. The length of the longest edge may be made smaller than half of the predetermined wavelength so that the oscillation frequency of the resonant cavity is far from the operating frequency of the radio frequency chip. In this application, the predetermined wavelength is the highest frequency operating wavelength of the radio frequency chip 25 under test. For example, when the wavelength is 10mm, the length of the longest edge of the rectangular cavity is less than 5mm.
Fig. 5 shows a side view of an embodiment of the test socket 20, and fig. 6 shows a top view of the embodiment. As seen in connection with fig. 5 and 6, the probe 26 of the test socket 20 is also shown, the test socket 20 further comprising a wave absorbing material 27, the probe 26 connecting pins of the radio frequency chip 25 to be tested and pads of the circuit board 21. The probe 26 may be a spring needle.
The wave-absorbing material 27 surrounds the side of the gap between the accommodating position 23 (or the radio frequency chip 25 to be tested) and the circuit board 21, and the wave-absorbing material can be in contact with the frame 24 or can be in gap with the frame 24. The thickness of the wave-absorbing material 27 is 2-3 times the thickness of the chip to be measured or the thickness of the radio frequency chip to be measured 25, and the size of the space enclosed by the wave-absorbing material 27 is 1/4 of the predetermined wavelength larger than the size of the chip to be measured.
In this application, the size of the chip to be tested refers to the geometric size of the radio frequency chip to be tested. The wave-absorbing material encloses a space, and the size of the space refers to the size of a section of the space parallel to the radio frequency chip to be tested.
As shown in fig. 6, if the radio frequency chip 25 to be tested is rectangular, the wave absorbing material 27 is a hollow rectangular cylinder, as an example. And the size of the inner periphery of the cross section of the wave-absorbing material 27 is larger than the size of the radio frequency chip 25 to be measured, namely, the length of the inner periphery of the cross section of the wave-absorbing material 27 is 1/4 of the medium wavelength of the long radio frequency chip 25 to be measured of the radio frequency chip 25 to be measured, and the width of the inner periphery of the cross section of the wave-absorbing material 27 is 1/4 of the medium wavelength of the wide radio frequency chip 25 to be measured of the radio frequency chip 25 to be measured. The wave-absorbing material can be ferrite wave-absorbing material, metal micropowder wave-absorbing material, polycrystalline iron fiber wave-absorbing material, nanometer wave-absorbing material and the like.
In the application, the wave-absorbing material is used, so that the isolation between the radio frequency chip test seats is improved, and crosstalk between the radio frequency chip test seats is avoided.
Fig. 7 shows a top view of the conductor hub 22 and the probe 26, wherein the probe 26 includes a shielding probe 26a (first shielding probe) mounted in the conductor hub 22, and a signal probe 26b located at the outer periphery of the conductor hub 22. The shielding probe 26a connects the shielding pin of the radio frequency chip 25 to be tested and the bonding pad of the circuit board 21; the signal probe 26b connects the signal pin of the radio frequency chip 25 to be tested and the pad of the wiring board 21. With the reduction of the package size of the radio frequency chip, the size of pins of the radio frequency chip is reduced, and the density of the pins is increased. And for complex radio frequency chips with multiple radio frequency ports, there can be only one shielding pin between adjacent radio frequency pins. In order to avoid short circuit, the probes of the pins around the radio frequency chip are in a semi-open state, i.e. the pins are not in direct contact with the circuit board. A part of radio frequency signals with short wavelength can be coupled to other probes through or around the shielding probes, so that the radio frequency signals are transmitted to corresponding radio frequency chip pins, and the power of the radio frequency signals of the corresponding ports of the pins is abnormal. The material of the hub used to secure the probes within the rf chip test socket is typically an insulating plastic article that is transparent to electromagnetic waves with a small path loss, resulting in poor isolation between adjacent probes. Conductor mount 22 is thus employed in test socket 20 to secure shielding probes 26a of all shielding pins for port isolation on the radio frequency chip, and conductor mount 22 may be a brass block made of brass material. The good conductivity of brass increases the isolation between the probes and enhances the wear resistance, strength, hardness and chemical resistance of the conductor hub. And brass has outstanding cutting mechanical properties, and is convenient to process. And the shielding probe 26a is mounted on the brass block to be connected with the ground pad of the circuit board 21, thereby improving the poor isolation of the probe.
As shown in fig. 8, a test socket 20 according to an embodiment of the present application; the side edge of the conductor hub has a plurality of projections 81 each accommodating at least one shielding probe 26c (second shielding probe); each protrusion 81 separates adjacent signaling probes 26b. Grooves 82 are formed between the protrusions 81; the signal probes 26b are positioned in the recess and staggered with respect to the shielding probes 26 c. For example, as shown in fig. 8, a U-shaped groove 82 is opened at a side edge of the conductor hub 22 so that the shielding probe 26a, the shielding probe 26c, and the signal probe 26b mounted in the conductor hub 22 together form a probe array.
In this application, for the sake of distinction, the shielding probe in the bump on the conductor hub is referred to as a second shielding probe, and the remaining shielding probes are referred to as first shielding probes.
Originally, shielding structures are not arranged between the adjacent signal probes, especially the radio frequency probes. The protrusion of the conductor hub containing the shielding probe separates the signal probes, so that the shielding structure with grounding is changed from the non-shielding structure between the signal probes, especially the radio frequency probes. The coupling degree between the radio frequency signal pin probes is obviously increased, and the problem of uncertain screening results caused by the difference of the isolation degree compared with the isolation degree between the radio frequency chip pins is solved. The spring needle used as the probe has various varieties and various sizes, so that the requirements of transmission loss and reflection and high-strength screening of radio frequency chips are met, and three-dimensional models of various spring needles can be imported into electromagnetic simulation software to screen out the optimal spring needle model.
According to the test socket 20 of the embodiment of the present application, the signal probe 26b includes a radio frequency probe, a power probe, a control probe. For example, as shown in fig. 9, the signal probe 26b includes a plurality of radio frequency probes 91 shown in the same appearance, a plurality of power supply probes 92 shown in the same appearance, and a plurality of control probes 93 shown in the same appearance.
According to the test socket 20 of the embodiment of the present application, the distance between the adjacent shielding probes 26a is 1/20 to 1/10 of the radio frequency wavelength of the radio frequency chip 25 to be tested in the air. For example, the frequency of the RF chip 25 to be tested is 30GHz and the wavelength is 10mm, and the spacing between the shielding probes 26a is 1 mm-0.5 mm.
The order and density of the embedded probes 26 (pogo pins) on the conductor pads 22 (brass blocks) also affects the isolation between the pins of the rf chip 25. To further encrypt the grounded shielding probes, the rows of the first shielding probes may be staggered, with the spacing between the first shielding probes of each row being less than 1/10 of the predetermined wavelength. For example, as shown in fig. 8, according to the test socket 20 of the embodiment of the present application, the plurality of shielding probes 26a constitute a high-density probe array including a plurality of rows, the rows being staggered in a first direction and a second direction perpendicular to the first direction. Also, shielding probes 26a and signal probes 26b together form an array. Specifically, the spacing between adjacent shielding probes 26a in a row is between 1/20 and 1/10 of the predetermined wavelength, and the offset distance between rows is between 1/20 and 1/10 of the predetermined wavelength. For example, the frequency of the RF chip 25 to be tested is 30GHz and the wavelength is 10mm, and then the spacing between adjacent shielding probes 26a in a row may be 0.5mm. By staggered in the second direction between rows is meant that the nth shielding probe 26a of a different row is not aligned in the second direction; the offset distance between rows refers to the linear distance between the nth shielding probes 26a of the different rows. For example, in fig. 8, the 1 st shielding probe 83a of the row 83 and the 1 st shielding probe 84a of the row 84 are not aligned in the second direction. The linear distance between the 1 st shielding probe 83a of the row 83 and the 1 st shielding probe 84a of the row 84 is between 1/20 and 1/10 of the predetermined wavelength. For example, the frequency of the RF chip 25 to be tested is 30GHz and the wavelength is 10mm, and then the rows may be staggered by 0.5mm. Has good shielding effect on electromagnetic waves with the working frequency far smaller than that of the radio frequency chip.
Therefore, when the radio frequency chip is screened, the output signal of the radio frequency probe can not be transmitted in gaps between the shielding material (the conductor material of the conductor needle seat) and the chip and between the shielding material and the circuit board, or the signal attenuation is accelerated due to the extension of a path in the transmission process, so that the amplitude of the interference signal to the adjacent radio frequency probe is reduced, and the isolation degree between radio frequency interfaces, especially between the adjacent radio frequency interfaces, is improved.
According to the test socket 20 of the embodiment of the present application, a gap is provided between the conductor hub 22 and the accommodation site 23 or the radio frequency chip 25 to be tested, and a gap is provided between the conductor hub 22 and the circuit board 21.
The miniaturization of the radio frequency chip can reduce the cost of the radio frequency chip and is also beneficial to reducing the transmission loss of radio frequency signals caused by encapsulation. However, miniaturization of the rf chip causes problems of heat dissipation and reduced isolation between rf signal pins. For example, referring to fig. 5, after the test socket 20, and in particular the radio frequency chip 25 is mounted on the test socket 20, if the design of the conductor hub 22 (brass block) and the probe 26 (spring pin) at the bottom of the test socket 20 is not reasonable, heat dissipation and isolation will be degraded, and screening results of the radio frequency chip 25 will be affected. In order to achieve an optimal contact state of the probes 26 (pogo pins) with the pins of the radio frequency chip 25 and the wiring board 21, it is possible to provide the conductor pads 22 (brass blocks) above without contacting the pins of the radio frequency chip 25 and below without contacting the wiring board 21, i.e. to make the conductor pads 22 (brass blocks) normally in a floating state. A certain air gap is arranged between the upper surface of the conductor hub 22 (brass blocks) and the pins of the radio frequency chip 25, and a certain air gap is arranged between the lower surface and the circuit board 21. The air gap size of the two layers has obvious influence on electromagnetic wave transmission, and the air gap size of the two layers can be determined by means of simulation software and the like, so that the radio frequency chip test seat 20 with good isolation is designed.
Like this, through setting up the thickness of conductor needle seat (brass piece) so that all have the space from top to bottom, combine the aforesaid high density array pattern of probe, both be favorable to the heat dissipation of radio frequency chip, also be favorable to improving the isolation between the pin of radio frequency chip, improved the credibility of radio frequency chip screening result.
According to the test socket 20 of the embodiment of the present application, the height of the gap between the radio frequency chip 25 to be tested and the circuit board 21 is smaller than the radio frequency wavelength of the radio frequency chip 25 to be tested in the air. As shown in fig. 5, the rf chip 25 and the circuit board 21 have an air cavity, and when the wavelength of the rf signal is much greater than the height H of the air cavity, the air cavity has a small influence on the rf signal screening test, which is negligible. When the wavelength of the radio frequency signal is close to the height H of the air cavity, the influence of the air cavity on the transmission of the radio frequency signal is obvious. For example, the wavelength λ=10mm of the radio frequency signal, the height h=2.5 mm of the air cavity, so that the reflected signal of the circuit board is in constant amplitude phase opposition with the signal at the emitting end of the chip pin, and the amplitude of the signal received by the radio frequency chip pin is minimum. Thus, the height H may be set to be much smaller than the radio frequency wavelength of the radio frequency chip 25 to be tested in air, for example, the height H may be set to be smaller than one tenth of the radio frequency wavelength of the radio frequency chip 25 to be tested in air.
The test socket 20 according to the embodiment of the present application further includes an insulating socket located at the outer periphery of the conductor socket 22, in which the signal probe 26b is mounted. The insulating needle mount may be a plastic block.
It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. Furthermore, for ease of description, only some, but not all, of the structures or processes associated with the present application are shown in the drawings. It should be noted that in the present specification, like reference numerals and letters denote like items throughout the drawings.
It will be understood that, although the terms "first," "second," etc. may be used herein to describe various features, these features should not be limited by these terms. These terms are used merely for distinguishing and are not to be construed as indicating or implying relative importance. For example, a first feature may be referred to as a second feature, and similarly a second feature may be referred to as a first feature, without departing from the scope of the example embodiments.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present embodiment can be understood in a specific case by those of ordinary skill in the art.
Illustrative embodiments of the present application include, but are not limited to, a test socket for a radio frequency chip.
Various aspects of the illustrative embodiments will be described using terms commonly employed by those skilled in the art to convey the substance of their work to others skilled in the art. However, it will be apparent to those skilled in the art that some alternative embodiments may be practiced using the features described in part. For purposes of explanation, specific numbers and configurations are set forth in order to provide a more thorough understanding of the illustrative embodiments. However, it will be apparent to one skilled in the art that the alternative embodiments may be practiced without the specific details. In some other instances, well-known features are omitted or simplified in order not to obscure the illustrative embodiments of the present application.
References in the specification to "an embodiment," "an implementation," etc., indicate that the embodiment described may include a particular feature, structure, or property, but every embodiment may or may not necessarily include the particular feature, structure, or property. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature is described in connection with a particular embodiment, it is within the knowledge of one skilled in the art to affect such feature in connection with other embodiments, whether or not such embodiment is explicitly described.
The terms "comprising," "having," and "including" are synonymous, unless the context dictates otherwise. The phrase "a and/or B" means "(a), (B) or (a and B)".
In the drawings, some structures may be shown in a particular arrangement and/or order. However, it should be understood that such a particular arrangement and/or ordering is not required. Rather, in some embodiments, these features may be described in a different manner and/or order than shown in the illustrative figures. Additionally, the inclusion of a structure in a particular figure does not imply that all embodiments need include such features, which in some embodiments may not be included or combined with other features.
The embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the application of the technical solution of the present application is not limited to the applications mentioned in the embodiments of the present application, and various structures and modifications can be easily implemented with reference to the technical solution of the present application, so as to achieve the various beneficial effects mentioned herein. Various changes, which may be made by those of ordinary skill in the art without departing from the spirit of the present application, are intended to be covered by the claims herein.
Claims (12)
1. A test socket for a radio frequency chip, comprising:
a circuit board;
a receiving location;
a conductor mount disposed between the circuit board and the receiving location;
a first shielding probe located in the conductor hub;
the material and the shape of the circuit board and the material and the shape of the conductor hub meet the conditions: and the oscillation frequency of the resonant cavity in the test seat is not in a preset frequency band during the test.
2. The test socket of claim 1, wherein the test socket further comprises:
and the signal probe is positioned at the periphery of the conductor hub.
3. The test socket of claim 2, wherein the side edge of the conductor mount has a plurality of projections, each of the projections receiving at least one second shielding probe therein; each of the projections separates adjacent ones of the signaling probes.
4. The test socket of claim 3, wherein a plurality of said first shielding probes form a plurality of rows along a first direction, said rows being offset from one another in a second direction perpendicular to said first direction.
5. The test socket of claim 4, wherein a spacing between adjacent ones of said first shielding probes in said row is between 1/20 and 1/10 of a predetermined wavelength, said rows being staggered by a distance between 1/20 and 1/10 of said predetermined wavelength.
6. The test socket of any one of claims 2-5, wherein there is a gap between the conductor mount and the receiving location and a gap between the conductor mount and the circuit board.
7. The test socket of any one of claims 2-5, wherein the material of the conductor mount is brass.
8. The test socket of any one of claims 2-5, wherein the signaling probe comprises a radio frequency probe, a power probe, a control probe.
9. The test socket of any one of claims 2-5, further comprising an insulating hub located at an outer periphery of the conductor hub, the signal probe being mounted in the insulating hub.
10. The test socket of any one of claims 2-5, wherein the first shielding probe, the second shielding probe, and the signal probe are pogo pins.
11. The test socket of any one of claims 1-5, wherein a height of a gap between the receiving location and the circuit board is less than a predetermined wavelength.
12. The test socket of any one of claims 1-5, wherein a side of the gap between the receiving location and the circuit board is further surrounded by a wave absorbing material, the thickness of the wave absorbing material is 2-3 times that of the chip to be tested, and the size of the space enclosed by the wave absorbing material is 1/4 of the predetermined wavelength larger than the size of the chip to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410050664.2A CN117572045B (en) | 2024-01-12 | Test seat of radio frequency chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410050664.2A CN117572045B (en) | 2024-01-12 | Test seat of radio frequency chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117572045A true CN117572045A (en) | 2024-02-20 |
| CN117572045B CN117572045B (en) | 2024-04-12 |
Family
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