TWI705255B - Testing device for testing chip - Google Patents

Abstract

The invention discloses a testing device for testing chip comprising: a circuit board and a carrier. The board is fixed on a test equipment. The carrier includes a base, a cover and a wireless signal receiver. The base has a slot for accommodating the IC to be tested. The cover is movably disposed on one side of the base. A closed space can be form by the cover and the base, when the cover is covered on the top of the slot. The wireless signal receiver is disposed on the cover. When the IC to be tested is arrange on the slot, the test equipment can supply power to the IC to be tested, and the test equipment can transmit the test signal to the IC to be tested, and the wireless signal receiver can receive a wireless signal from the IC to be tested. The test device of the present invention is capable of detecting a wireless signal of the IC to be tested.

Description

Testing device for testing wafer

The invention relates to a testing device, in particular to a testing device suitable for testing high-frequency signals of integrated circuits.

Existing integrated circuit testing devices mostly use automatic test equipment (ATE), with components such as load board, chip carrier (socket), high-frequency cable connector, and coaxial cable. , To carry and test the integrated circuit (Device) under test. However, this type of integrated circuit testing device cannot perform wireless signal testing on integrated circuits.

The invention discloses a testing device for detecting a chip, which is used to improve the problem that the existing common integrated circuit testing device cannot perform wireless signal testing on the integrated circuit.

One of the embodiments of the present invention discloses a testing device, which includes: a circuit board and a chip carrier. The circuit board is fixedly arranged on a testing machine. The chip carrier is connected with at least one electrical connection line, which is used to electrically connect with an external wireless signal measurement device. The chip carrier includes: a base, a cover, a wireless signal receiver, and high-frequency signal transmission Pieces and high-frequency signal connectors. The base is fixedly arranged on the circuit board, the base has a wafer accommodating groove, and the pedestal has a plurality of probes. One end of each probe is exposed in the wafer accommodating groove. The wafer accommodating groove is used for accommodating a wafer to be tested. When the wafer is set in the wafer accommodating groove, the wafer to be tested can be in contact with multiple probes; the base includes a probe holder and a limit frame, the probe holder is fixedly arranged on the circuit board, and the probe holder is provided with a plurality of probe holders. The probe, the limit frame body is fixedly arranged on the circuit board, and the limit frame body is fixedly arranged around the probe holder, and the limit frame body and the probe holder together form the wafer accommodating groove; part of the probe is defined as the first One probe, each The first probe is used to transmit low-frequency signals with a frequency lower than 10kHz; some probes are defined as second probes, and each second probe is used to transmit high-frequency signals with a frequency higher than 1MHz. The cover is movably arranged on one side of the base. The wireless signal receiver is arranged on the cover. A high-frequency signal transmission element is connected to a plurality of the second probes, and a part of the high-frequency signal transmission element is exposed outside the chip carrier. The high-frequency signal connector is electrically connected with the high-frequency signal transmission member arranged outside the chip carrier, and the high-frequency signal connector is used for electrically connecting with a measuring device. Wherein, when the cover body is arranged on one side of the base, the cover body and the chip accommodating groove jointly form a closed space, and the chip under test arranged in the chip accommodating groove will correspondingly be located in the enclosed space, and the wireless signal is received The device will be correspondingly located above the chip accommodating slot, and the wireless signal receiver can accordingly receive the wireless signal sent by the chip to be tested arranged in the chip accommodating slot. Among them, when the chip accommodating slot is provided with the chip to be tested, the test machine can provide power to the chip to be tested, and the test machine can transmit the test signal to the chip to be tested, and the wireless signal receiver can receive the chip to be tested and receive the test. The wireless signal sent out after the signal is transmitted to the external wireless signal measuring device through the electrical connection line.

To sum up, the testing device for testing chips of the present invention can be used to test the wireless signal of the chip under test by arranging a wireless signal receiver on the cover.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

100: Test device for testing wafers

10: Circuit board

20: chip carrier

21: Probe holder

211: Probe Hole

22: limit frame

221: Frame perforation

23: The first probe

24: second probe

20A: Lid

20B: Base

20C: pivot structure

20D: Sliding rod

20E: The first electrical connection structure

20F: Second electrical connection structure

30: High frequency signal transmission parts

301: Outer side

302: inside

31: The first connection part

32: The second connecting part

33: The third connecting part

34: Metal wire

40: high frequency signal connector

50: Test machine

60: wireless signal receiver

61: Electrical connection line

70: electrical connector

200: measuring equipment

C: chip to be tested

C1: Contact part

SP: closed space

P: Wafer holding tank

H1: vertical distance

H2: vertical distance

H3: height

H4: height

FIG. 1 is a schematic cross-sectional view of a testing device for inspecting wafers of the present invention.

FIG. 2 is a three-dimensional schematic diagram of the testing device for inspecting wafers of the present invention.

3 is a schematic diagram of the outer side surface of the high-frequency signal transmission member of the test device for inspecting wafers of the present invention.

4 is a schematic diagram of the inner side of the high-frequency signal transmission member of the testing device for inspecting wafers of the present invention.

FIG. 5 is a schematic diagram of the test device for inspecting wafers provided with a wafer to be tested according to the present invention.

FIG. 6 is a schematic diagram of one embodiment of the testing device for inspecting wafers of the present invention.

7 and 8 are schematic diagrams of one embodiment of the testing device for inspecting wafers of the present invention.

FIG. 9 is a schematic diagram of one embodiment of the testing device for inspecting wafers of the present invention.

FIG. 10 is a schematic diagram of one embodiment of the testing device for inspecting wafers of the present invention.

In the following description, if it is pointed out, please refer to the specific drawing or as shown in the specific drawing, it is only used to emphasize in the subsequent description, and most of the related content appears in the specific drawing. However, it is not limited that only the specific drawings can be referred to in the subsequent description.

Please refer to FIGS. 1 to 5 together. FIG. 1 is a partial cross-sectional side view of the testing device for inspecting wafers of the present invention, and FIG. 2 is a perspective view of the testing device for inspecting wafers of the present invention, and FIG. 3 Shown is a schematic diagram of the outer side of the high-frequency signal transmission member of the test device for inspecting wafers of the present invention, and FIG. 4 is a schematic diagram of the inner side of the high-frequency signal transmission member of the test device for inspecting wafers of the present invention, FIG. 5 shows a cross-sectional side view of the test device for inspecting wafers provided with a wafer to be tested according to the present invention.

As shown in FIGS. 1 and 2, the testing device 100 for testing chips includes a circuit board 10, a chip carrier 20, a high-frequency signal transmission member 30 and a high-frequency signal connector 40. The circuit board 10 is fixedly arranged on a testing machine 50. The testing machine 50 referred to here can be based on different types of chips actually to be tested, and corresponding different types of automated testing equipment can be selected. (Automatic Test Equipment, ATE). The related circuit layout on the circuit board 10 can be correspondingly changed according to the form and type of the testing machine 50.

The chip carrier 20 is disposed on the side of the circuit board 10 opposite to the testing machine 50. The chip carrier 20 is used to carry a chip C to be tested (as shown in FIG. 5). The chip C to be tested may be, for example, It is a variety of integrated circuits (IC). In particular, the testing device 100 for inspecting wafers of the present invention is particularly suitable for testing wafers that require high-frequency testing. For example, the testing device 100 for inspecting wafers of the present invention is particularly suitable for testing 5G. Communication chip.

Regarding the appearance and size of the chip carrier 20, it can be designed according to the appearance and size of the chip C to be tested, and is not limited here. The chip carrier 20 is mainly used as a connection bridge between the chip C under test and the circuit board 10, so that the test machine 50 can enter the chip C under test through the relevant power and test signals transmitted by the circuit board 10, and The chip carrier 20 is also used to fix the chip C to be tested on the circuit board 10.

In practical applications, the wafer carrier 20 may include, for example, a probe holder 21 and a limit frame 22. The probe holder 21 is fixedly arranged on the circuit board 10, and the limit frame 22 is fixedly arranged around the probe holder 21. The limit frame 22 is opposite to the vertical distance H1 between the end surface of the circuit board 10 and the circuit board 10, which is greater than the probe The seat 21 is opposite to the vertical distance H2 between the end face of the circuit board 10 and the circuit board 10, and the limit frame 22 and the probe seat 21 together form a chip accommodating groove P on the side opposite to the circuit board 10, and the chip is accommodated The groove P is used to accommodate the wafer C to be tested. When the wafer C to be tested is fixedly arranged in the wafer accommodating groove P, the wafer C to be tested will be restricted by the limiting frame 22 and will not easily leave the wafer accommodating groove P. The limit frame 22 is mainly used to assist the wafer C to be tested to be fixed in the wafer accommodating groove P. Therefore, in practical applications, the appearance and size of the limit frame 22 may be based on the outside of the chip C to be tested. Type and size changes are not restricted here.

The probe holder 21 is provided with a plurality of first probes 23 and a plurality of second probes 24. Each first probe 23 is electrically connected to the circuit board 10, and each second probe 24 is electrically connected to the circuit board 10. . First probe The needle 23 and the second probe 24 are used to contact a plurality of pins of the chip C to be tested, so that the chip C to be tested and the circuit board 10 are electrically connected. Each first probe 23 and each second probe 24 is, for example, a Pogo pin, but not limited to this. The plurality of first probes 23 are used for transmitting low frequency signals, and the plurality of second probes 24 are used for transmitting high frequency signals. The low-frequency signal referred to here refers to a signal with a frequency lower than 10kHz, and a high-frequency signal refers to a signal with a frequency higher than 1MHz. In FIG. 1, the second probe 24 is only provided at the leftmost position of the probe holder 21, and the first probe 23 is provided at the remaining positions as an example. However, in specific applications, the first probe 23, The number and location of the second probes 24 can be increased or decreased according to the type of the wafer C to be tested, and are not limited to those shown in the figure. The second probe 24 referred to here is a probe used to electrically connect the pins of the chip C under test for transmitting high-frequency signals. Therefore, in practical applications, the second probe 24 is disposed on the probe The position of the seat 21 corresponds to the pin position of the chip C under test for transmitting high frequency signals.

In particular, in this embodiment, only the first probe 23 and the second probe 24 used to transmit low-frequency signals and high-frequency signals in the probe holder 21 are described, but in practical applications, the probe The base 21 also includes probes with different functions, such as probes for inputting power to the chip C under test, and probes for transmitting the test signal from the test machine 50 to the chip under test. The functions of the remaining probes correspond to various pin design of the chip C to be tested, and are not limited here.

As shown in FIG. 5, when the wafer C to be tested is fixedly arranged in the wafer accommodating groove P, the contact portions C1 of the wafer C to be tested are electrically connected to the first probes 23, and the wafer C to be tested After receiving the test signal transmitted by the test machine 50, the returned low-frequency signal can be transmitted to the circuit board 10, the test machine 50 or the related measurement device through the plurality of first probes 23; Where the low-frequency signal transmitted by C is transmitted through the circuit board 10 for relevant analysis can be designed according to actual requirements, and is not limited here.

A part of the high-frequency signal transmission member 30 is fixedly arranged on the side of the circuit board 10 where the chip carrier 20 is provided, and a part of the high-frequency signal transmission member 30 is connected to a plurality of second probes 24. Specifically, the high-frequency signal transmission member 30 may be a flexible printed circuit board (Flexible Print Circuit; FPC), The high-frequency signal transmission member 30 may be rectangular; the two opposite wide sides of the high-frequency signal transmission member 30 are defined as an outer side 301 and an inner side 302 respectively.

As shown in FIGS. 3 and 4, the high-frequency signal transmission member 30 includes a plurality of first connecting portions 31, a plurality of second connecting portions 32 and a plurality of third connecting portions 33. The outer surface 301 of the high-frequency signal transmission member 30 is provided with a plurality of first connecting portions 31 and a plurality of third connecting portions 33. The plurality of third connecting portions 33 are electrically connected to the plurality of first connecting portions 31 through the plurality of metal wires 34. The plurality of second connection portions 32 are disposed on the inner side surface 302 of the high-frequency signal transmission member 30, and the plurality of second connection portions 32 are electrically connected to the plurality of third connection portions 33 through the relevant metal wires in the high-frequency signal transmission member 30. Sexual connection; Among them, the number of the plurality of second connecting portions 32 and the plurality of third connecting portions 33 and their arrangement positions may be substantially the same. The arrangement of the first connecting portion 31, the second connecting portion 32 and the third connecting portion 33 on the inner side or the outer side of the high-frequency signal transmission member 30 is not limited to the above description, and can be changed according to requirements in practical applications. .

As shown in FIGS. 1 to 4, the outer side 301 of the high-frequency signal transmission member 30 is correspondingly located on the side opposite to the probe base 21, while the inner side 302 of the high-frequency signal transmission member 30 faces the probe base. 21 set; relatively, a plurality of first connecting portions 31 and a plurality of third connecting portions 33 will be exposed correspondingly to the side of the circuit board 10 where the chip carrier 20 is provided, and the plurality of second connecting portions 32 face the plurality of The second probe 24 is provided, and the plurality of third connecting portions 33 are correspondingly exposed in the wafer accommodating groove P of the wafer carrier 20. Among them, the plurality of first connecting portions 31 are located outside the chip carrier 20, and the plurality of first connecting portions 31 are used to electrically connect with the high frequency signal connector 40 provided on the side of the circuit board 10. The high-frequency signal connector 40 is used to electrically connect with a measuring device 200. In practical applications, the high-frequency signal connector 40 can be, for example, a high-frequency cable connector (SMPM Connector), and the measuring device 200 can be connected to the high-frequency cable connector through a cable with a corresponding connector.

It should be noted that the high-frequency signal connector 40 can be fixed to one side of the circuit board 10 by means of bonding, locking, etc. according to requirements, but the high-frequency signal connector 40 is basically not connected to the metal of the circuit board 10. The wires are electrically connected, and the high-frequency signal connector 40 only serves as a connection bridge between the high-frequency signal transmission member 30 and the measuring device 200. Similarly, the high-frequency signal transmission member 30 is exposed The part of the circuit board 10, except for the plurality of first connecting portions 31 for electrical connection with the high-frequency signal connector 40, the remaining parts are basically covered with an insulating layer, and are not connected to any metal wires of the circuit board 10 Electrical contact.

As shown in Figure 1, Figure 3, Figure 4 and Figure 5, when the chip C to be tested is placed in the wafer accommodating groove P, a part of the contact portion C1 of the chip C to be tested will correspondingly press against the high frequency signal transmission member 30 The plurality of third connecting portions 33 on the outer side surface 301 of the high-frequency signal transmission member 30 and the plurality of second connecting portions 32 on the inner side surface 302 of the high-frequency signal transmission member 30 are electrically connected to the second probe 24 correspondingly. That is, the wafer C to be tested arranged in the wafer accommodating groove P is electrically connected to the plurality of second probes 24 through the plurality of third connecting portions 33, so that the wafer C to be tested receives the testing machine The high-frequency signal returned after the test signal transmitted by 50 can be transmitted to the plurality of first connecting portions 31 through the plurality of third connecting portions 33 and the plurality of metal wires 34 in the high-frequency signal transmission member 30, and then passing through The high frequency signal connector 40 is transmitted to the external measuring equipment 200.

As described above, by electrically connecting the chip C under test set in the chip accommodating groove P to the plurality of third connecting portions 33 of the high-frequency signal transmission member 30, the chip C under test can be The transmitted high-frequency signal is directly transmitted to the measuring equipment 200 through the high-frequency signal transmission member 30 and the high-frequency signal connector 40, and the high-frequency signal will not pass through the metal wires inside the circuit board or the chip carrier 20. Metal wires are transmitted. In this way, high-frequency signals will not be prone to signal weakness and distortion during the transmission process.

In addition, the relevant personnel can change the impedance of the high-frequency signal transmission member 30 by changing the layout of the metal wire 34 (as shown in FIG. 3) of the high-frequency signal transmission member 30, thereby making the high-frequency signal transmission member 30 It has good impedance matching with the high-frequency signal transmitted by the chip C under test, which can improve the transmission of the conventional high-frequency signal through the metal wires in the chip carrier and the metal wires in the circuit board, and the problem of impedance mismatch is likely to occur . In the conventional integrated circuit test device, since the high-frequency signal returned by the chip under test is transmitted through the metal wire in the chip carrier and the metal wire in the circuit board, even if the relevant personnel find that the high-frequency signal is transmitted, Impedance mismatch The problem is that because the metal wires that transmit high-frequency signals are buried in the chip carrier and the circuit board, the relevant personnel cannot modify the metal wires; that is, the relevant personnel are using the conventional integrated circuit test device to be tested When the chip is tested for high-frequency signals, even if it is known that the high-frequency signal may have signal weakening and distortion due to impedance mismatch, it still cannot be improved.

In specific applications, the high-frequency signal transmission member 30 can be detachably connected to the chip carrier 20, and the high-frequency signal transmission member 30 and the high-frequency signal connector 40 are also detachably provided, and the relevant personnel can According to the difference of the chip C to be tested, the high-frequency signal transmission member 30 with a different metal wire layout is replaced. In this way, a good impedance matching effect can be achieved in the process of high-frequency signal transmission.

As shown in FIG. 1, in a specific application, the high-frequency signal transmission member 30 may be a flexible printed circuit board, and a part of the high-frequency signal transmission member 30 may be correspondingly disposed on the limit frame 22 and the probe base 21 In between, of course, the arrangement relationship between the high-frequency signal transmission member 30 and the chip carrier 20 is not limited to the aspect shown in FIG. 1. As shown in FIG. 6, in different embodiments, the limit frame 22 may have a frame perforation 221 at a position adjacent to the circuit board 10, and a part of the high-frequency signal transmission member 30 may pass through the frame. The through hole 221 penetrates through the wafer carrier 20.

Please refer to FIG. 1, the probe holder 21 has a plurality of probe holes 211, and a part of each first probe 23 protrudes from the corresponding probe hole 211, and a part of each second probe 24 protrudes To the corresponding probe hole 211. When the wafer carrier 20 is not provided with the wafer C to be tested, the height H3 of each first probe 23 protruding from the corresponding probe hole 211 may be higher than the height H3 of each second probe 24 protruding from the corresponding The height of the probe hole 211 is H4. In the embodiment where each first probe 23 and each second probe 24 are Pogo Pins, the length of each first probe 23 may be greater than the length of each second probe 24, and each first probe 23 and each second probe 24 are connected to the same spring (not shown in the figure).

Since the length of each first probe 23 is greater than the length of each second probe 24, when the wafer C to be tested is set in the wafer accommodating groove P, the plurality of first probes pressed by the contact portion C1 One end of the needle 23 will be approximately flush with the high-frequency signal transmission member 30 pressed by the contact part C1. In this way, it will be ensured that all the contact parts C1 of the chip C to be tested can be connected to a plurality of probe holders 21. The first probe 23 and the plurality of second probes 24 are in contact. In other words, when the wafer carrier 20 is not provided with the wafer C to be tested, the height H3 of each first probe 23 protruding from the corresponding probe hole 211 corresponds to the protrusion of each second probe 24 The height H4 difference of the probe hole 211 may be approximately equal to the thickness of the high-frequency signal transmission member 30 located in the wafer accommodating groove P.

In summary, after the test device 100 for inspecting chips of the present invention receives the test signal transmitted from the test machine 50 to the test chip C, the low-frequency signal returned by the test chip C will pass through a plurality of A probe 23 and the circuit board 10 are transmitted back to the testing machine 50 (or transmitted to related equipment through the circuit board 10), and the high-frequency signal returned by the chip C to be tested will be sent out through the high-frequency signal transmission member 30 The high-frequency signal transmitted by the chip C to be tested does not pass through the metal wires in the circuit board 10 or the metal wires in the chip carrier 20. Thus, the chip C to be tested is transmitted The high-frequency signal will not easily cause signal weakening and distortion due to impedance mismatch. That is to say, compared with the conventional integrated circuit testing device, the testing device 100 for testing chips of the present invention is less prone to high-frequency signal degradation and distortion, and because high-frequency signals are mainly transmitted through high-frequency signals Therefore, the user can design the layout of the relevant metal wires on the high-frequency signal transmission component 30 to achieve a good impedance matching between the high-frequency signal transmission component 30 and the chip C under test.

Please refer to FIG. 7 and FIG. 8 together, which show schematic diagrams of one embodiment of the testing apparatus 100 for inspecting wafers of the present invention. As shown in the figure, the biggest difference between this embodiment and the previous embodiments is that the chip carrier 20 may include a cover 20A and a base 20B, and the cover 20A is movably connected to the base 20B. The base 20B may include the aforementioned probe holder 21 and the aforementioned limit frame 22, and the base 20B correspondingly has the aforementioned wafer accommodating groove P, and the base 20B contains a plurality of probes, some of which are the aforementioned probes The plurality of first probes 23, a part of the probes are the aforementioned plurality of second probes 24.

The cover 20A is provided with a wireless signal receiver 60, and the wireless signal receiver 60 is electrically connected to an external wireless signal measuring device through at least one electrical connection line 61. In practical applications, one end of the electrical connection line 61 can be connected to the wireless signal receiver 60, and the other end of the electrical connection line 61 can be connected to the circuit board through a waveguide, coaxial cable and other components. An electrical connector 70 is electrically connected; an external wireless signal measuring device can be plugged into the electrical connector 70 through a corresponding connector to receive the wireless signal received by the wireless signal receiver 60 accordingly. The type and form of the wireless signal receiver 60 can be determined according to the type and form of the chip C to be tested, and is not limited here. For example, the wireless signal receiver 60 can be used to receive signals such as 4G, 5G, etc.

As shown in FIG. 8, when the wafer accommodating groove P is provided with a wafer C to be tested, and the cover 20A is correspondingly covered above the wafer accommodating groove P, the cover 20A and the base 20B will jointly form a closed space SP. The test chip C is correspondingly located in the enclosed space SP, and the wireless signal receiver 60 is correspondingly located directly above the test chip C, and the wireless signal receiver 60 can receive the wireless signal from the test chip C well. Wherein, the wireless signal receiver 60 may include a receiving antenna, for example. The material of the cover 20A can be, for example, a metal material, but it is not limited to this. In an embodiment where the cover 20A is made of a metal material, the cover 20A can be used to reflect the wireless signal outside the enclosed space SP, thereby greatly reducing The external wireless signal interferes with the wireless signal receiver 60.

In practical applications, the cover 20A and the base 20B can be pivotally connected to each other through a pivoting structure 20C, and the cover 20A can be operated to rotate relative to the base 20B, so that the wireless signal receiver 60 can follow the cover 20A It rotates relative to the base 20B; however, the manner in which the cover 20A and the base 20B are movably connected is not limited to that shown in FIG. 7.

As described above, the testing device 100 for testing chips of this embodiment can not only perform high-frequency signal and low-frequency signal testing on the chip C under test, but also can receive the wireless signal sent by the chip C under test through the wireless signal receiver 60 In this way, the efficiency of detecting the wafer to be tested will be greatly improved.

In the existing integrated circuit testing device, if the user wants to perform high-frequency signal detection and wireless signal detection on chip C under test successively, the user must first set the chip under test in the test device for testing high-frequency signals After the high-frequency signal test of the chip under test is completed, the user must first remove the chip under test from the test device and install the chip under test on another test device for wireless signal testing before proceeding to the chip under test Wireless signal detection. In the existing integrated circuit test equipment, the user cannot perform high-frequency signal test and wireless signal test successively on the chip under test on the same test device, and the user must repeatedly install the chip under test in different tests. The device is able to perform different tests on the chip to be tested. In this way, the pins of the chip to be tested are prone to damage due to repeated disassembly and assembly.

In contrast to the testing device 100 for inspecting chips of the present invention, when the user wants to perform high-frequency signal detection and wireless signal inspection on the chip C to be tested, the user only needs to install the chip C to be tested on the testing device for chip inspection. Once 100 times, high-frequency signal detection and wireless signal detection can be completed successively. In this way, the probability of unexpected damage to the pins of the chip C under test due to repeated installation and removal can be greatly reduced.

Please refer to FIG. 9, which shows a schematic diagram of one embodiment of the testing apparatus 100 for inspecting wafers of the present invention. As shown in the figure, the biggest difference between this embodiment and the embodiment shown in FIG. 8 is that the wafer carrier 20 may include a sliding mechanism. The sliding mechanism may include a plurality of sliding rods 20D, for example, the cover body 20A corresponding to the plurality of sliding rods 20D may have a plurality of perforations, and the plurality of sliding rods 20D can correspondingly penetrate through the plurality of perforations of the cover body 20A. The cover 20A can approach or move away from the base 20B through a plurality of sliding rods 20D.

In practical applications, the user or related machinery may first move the cover 20A along the plurality of sliding rods 20D in a direction away from the base 20B, so that the cover 20A leaves the base 20B and exposes the chip accommodating groove P. At this time, the user or the related machine can set the chip C to be tested in the chip accommodating groove P; when the chip C to be tested is set in the chip accommodating groove P, the user or the related The machine can then move the cover 20A to a direction close to the base 20B, so that the cover 20A is disposed above the base 20B.

The cover 20A can be connected to an electrical connection line 61, and the cover 20A can be electrically connected to an electrical connector 70 provided on the circuit board 10 through the electrical connection line 61, and the electrical connector 70 can be used for Connect to the connector of the related wireless signal measurement equipment, so that the signal received by the wireless signal receiver 60 can be transmitted to the related wireless signal measurement equipment through the electrical connection line 61.

In practical applications, the cover 20A and the base 20B may have structures or components that can be engaged with each other, and when the cover 20A is disposed above the base 20B, the user or related machinery can engage with each other by enabling The structure or the components are locked with each other to limit the range of movement between the cover 20A and the base 20B.

Please refer to FIG. 10, which shows a schematic diagram of one embodiment of the testing apparatus 100 for inspecting wafers of the present invention. As shown in the figure, the biggest difference between this embodiment and the embodiment shown in FIG. 9 is that the cover 20A may have a first electrical connection structure 20E, and the base 20B may have a second electrical connection structure 20F. . The first electrical connection structure 20E is electrically connected to the wireless signal receiver 60. When the cover 20A abuts on the base 20B, the first electrical connection structure 20E and the second electrical connection structure 20F are electrically connected to each other. An electrical connection line 61 is connected to the base 20B. The electrical connection line 61 may be connected to an electrical connector 70 on the circuit board 10, and the electrical connector 70 is used to electrically connect to related wireless signal measurement equipment.

When the first electrical connection structure 20E of the cover 20A is electrically connected to the second electrical connection structure 20F of the base 20B, the wireless signal receiver 60 will be able to pass through the first electrical connection structure 20E and the second electrical connection structure 20F. The electrical connection cord 61 and the electrical connector 70 transmit the signal to the related wireless signal measurement equipment. Through the design of the first electrical connection structure 20E and the second electrical connection structure 20F, the cover 20A can be operated to be completely separated from the base 20B. In this way, it will be convenient for related personnel or mechanical equipment to install the chip under test于chip carrier 20.

It should be noted that, in FIG. 10, the cover 20A is provided with multiple sliding rods 20D of the sliding mechanism as an example, but in different embodiments, the wafer carrier 20 shown in FIG. 10 may not be provided with Sliding mechanism, and the cover 20A can be operated to completely leave the base 20B.

As described above with respect to the embodiments of FIGS. 7 to 10, in each embodiment of the testing device 100 for inspecting wafers of the present invention that includes a cover 20A and a wireless signal receiver 60 provided on the cover 20A, The chip testing device 100 will be able to simultaneously perform low-frequency signal, high-frequency signal and wireless signal testing on the chip to be tested, and relevant personnel can use a single testing device to complete all signal tests.

To sum up, the test device for inspecting wafers of the present invention is designed for high-frequency signal transmission parts. When the test device for inspecting wafers performs high-frequency signal inspection operations on the wafer to be tested, the high frequency that the wafer to be tested transmits is The high-frequency signal will be directly transmitted to the external measurement equipment through the high-frequency signal transmission component; because the relevant personnel can easily change the impedance of the high-frequency signal transmission component by changing the layout of the metal wire on the high-frequency signal transmission component Therefore, when the high-frequency signal detection of the chip under test is performed on the test device for inspecting a chip of the present invention, the chip under test and the high-frequency transmission board can easily achieve impedance matching, and the high-frequency signal transmitted by the chip under test will not Prone to problems such as weakness and distortion.

The above descriptions are only the preferred and feasible embodiments of the present invention, which do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .

100: Test device for testing wafers

10: Circuit board

20: chip carrier

21: Probe holder

22: limit frame

23: The first probe

24: second probe

20A: Lid

20B: Base

20C: pivot structure

30: High frequency signal transmission parts

40: high frequency signal connector

50: Test machine

60: wireless signal receiver

61: Electrical connection line

70: electrical connector

200: measuring equipment

SP: closed space

P: Wafer holding tank

Claims (9)

A testing device for detecting wafers, comprising: a circuit board, which is fixedly arranged on a testing machine; and a wafer carrier, which is connected with at least one electrical connection line, and the electrical connection line The wireless signal measuring device is electrically connected. The chip carrier includes a base fixedly arranged on the circuit board, the base has a chip accommodating groove, and the base has a plurality of probes, each One end of the probe is exposed in the wafer accommodating groove, and the wafer accommodating groove is used to accommodate a wafer to be tested. When the wafer to be tested is set in the wafer accommodating groove, the wafer to be tested Can be in contact with a plurality of the probes; the base includes a probe holder and a limit frame, the probe holder is fixedly arranged on the circuit board, and the probe holder is provided with a plurality of the probes Needle, the limit frame body is fixedly arranged on the circuit board, and the limit frame body is fixedly arranged around the probe holder, and the limit frame body and the probe holder jointly form a The wafer accommodating groove; some of the probes are defined as first probes, and each of the first probes is used to transmit low-frequency signals with a frequency lower than 10kHz; some of the probes are defined as second probes, Each of the second probes is used to transmit high-frequency signals with a frequency higher than 1MHz; and a cover, which is movably arranged on one side of the base; and a wireless signal receiver, which is arranged on the base The cover; a high-frequency signal transmission member connected to a plurality of the second probes, and a part of the high-frequency signal transmission member is exposed outside the chip carrier; a high-frequency signal connector, and The high-frequency signal transmission member arranged outside the chip carrier is electrically connected, and the high-frequency signal connector is used for electrically connecting with a measuring device; Wherein, when the cover body is arranged on one side of the base, the cover body and the wafer accommodating groove jointly form a closed space, and the test under test arranged in the wafer accommodating groove The chip will correspondingly be located in the enclosed space, and the wireless signal receiver will correspondingly be located above the chip accommodating groove, and the wireless signal receiver can accordingly receive the chips arranged in the chip accommodating groove The wireless signal emitted by the chip under test; wherein, when the chip under test is provided in the chip accommodating slot, the test machine can provide power to the chip under test, and the test machine The test signal can be transmitted to the chip under test, and the wireless signal receiver can receive the wireless signal sent by the chip under test after receiving the test signal, and transmit it to the external wireless signal measurement through the electrical connection line Device; wherein, after the chip under test receives the test signal transmitted by the testing machine, the low frequency signal returned by the chip under test will be transmitted through a plurality of the first probes, and the chip under test The returned high-frequency signal will be transmitted to the measurement equipment through the plurality of second probes, the high-frequency signal transmission member and the high-frequency signal connector. The testing device for inspecting wafers according to claim 1, wherein the wafer carrier further includes a pivoting structure, and the cover and the base are pivotally connected to each other through the pivoting structure; the cover The body can be rotated relative to the base under the action of an external force, and accordingly the wafer containing groove is selectively communicated with the outside. The test device for inspecting wafers according to claim 1, wherein the wafer carrier further includes a sliding mechanism, the sliding mechanism has a plurality of sliding rods, the cover has a plurality of perforations, and a plurality of The sliding rods are correspondingly pierced through a plurality of the perforations, and the cover body can be moved by an external force along the plurality of sliding rods toward the base or away from the base mobile. The test device for inspecting wafers according to claim 1, wherein the cover has a first electrical connection structure, the base has a corresponding second electrical connection structure, and the cover is disposed on the On one side of the base, the first electrical connection structure can be connected to the second electrical connection structure, and the wireless signal receiver can accordingly pass through the first electrical connection structure, the The second electrical connection structure and the electrical connection line are electrically connected to an external wireless signal measuring device. The test device for inspecting chips according to claim 1, wherein the high-frequency signal transmission member is a flexible board, and the two wide sides of the high-frequency signal transmission member opposite to each other are defined as an outer side and An inner side surface; the high-frequency signal transmission member has a plurality of first connecting portions, a plurality of second connecting portions and a plurality of third connecting portions, the plurality of the first connecting portions and the plurality of third connecting portions are arranged in On the outer side surface of the high-frequency signal transmission member, a plurality of the second connecting portions are provided on the inner side surface of the high-frequency signal transmission member; a plurality of the first connection portions and a plurality of the first The three connecting portions are electrically connected through a plurality of metal wires; the plurality of third connecting portions are electrically connected with the plurality of second connecting portions; the plurality of first connecting portions are used for connecting with the high-frequency signal The plurality of second connecting portions are used for electrically connecting with the plurality of second probes; the plurality of third connecting portions are used for contacting with the contact portions of the chip under test. The testing device for inspecting wafers according to claim 1, wherein the limit frame body is opposite to the vertical distance between the end face of the circuit board and the circuit board, which is higher than the distance between the probe holder and the circuit board. The vertical distance between the end surface of the circuit board and the circuit board; a part of the high-frequency signal transmission member is exposed in the chip accommodating groove, and when the chip under test is set in the chip accommodating groove, The high-frequency signal transmission member located in the chip accommodating groove will be able to be When the chip to be tested is pressed, the plurality of second connecting portions of the high-frequency signal transmission member pressed by the chip to be tested are correspondingly in contact with the plurality of second probes. The testing device for inspecting wafers according to claim 6, wherein the height of each of the first probes protruding from the corresponding probe hole is higher than that of each of the second probes. The height of the corresponding probe hole. The testing device for inspecting wafers according to claim 7, wherein when the wafer to be tested is set in the wafer accommodating groove, a plurality of the first probes pressed by the wafer to be tested One end of is flush with the high-frequency signal transmission member pressed by the chip to be tested. The test device for inspecting wafers according to claim 8, wherein the height of each of the first probes protruding from the corresponding probe hole corresponds to the protruding height of each of the second probes The height difference of the probe hole is equal to the thickness of the portion of the high-frequency signal transmission member exposed in the chip accommodating groove.

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