200804822 九、發明說明： 【發明所屬之技術領域】 本發明係與探針卡有關，特別是指一種以低空間密度 傳輸線分佈的探針卡。 5【先前技術】 。楝針卡駐要目的是將探針卡上的探針與積體電路晶 - 圓上的晶片測試銲墊直接接觸，配合電測設備與軟體控制 • 將測試訊號透過探針卡上電路板傳輸至探針以^晶片Γ達 到自動化的晶圓級測試目的，其中探針的排列密則 10微到可對應於晶片上相鄰測試銲墊之間隙，且單一探針卡 為了可廣泛應用於不同製程技術的積體電路晶圓，探針卡 之電路板設計往往不會以特定走線佈設的方式作為電路傳 輸的結構，而為在電測機台用以探點的導線與探針間設置 傳輸線的跳線結構，藉此將電測訊號送至探針。 15 然而將傳輸線與細微尺寸的探針結構相較之下，傳輸 • 線的線徑約略大了兩個級數以上，若要將各傳輸線對應連 ， 接至一探針，越接近探針處則傳輸線的設置越密集，^其 」 在晶圓電路越趨複雜及多元化的設計下，為能快速量测多 種電路元件特性，以符合晶圓級測試的要求，探針卡上則 2〇 =須設有更多的探針與各電路元件對應，使傳輸線的設置 密度要求越高甚至需以交錯重疊的方式才能確切連接至探 針’如第十二圖所示習用懸臂式探針之探針卡結構，故往 往造成傳輸線模組工程的繁雜及困難度；以作為高頻訊號 傳輸的同軸傳輸線結構而言，軸芯的金屬訊號導線需配^ 4 200804822200804822 IX. Description of the Invention: [Technical Field] The present invention relates to a probe card, and more particularly to a probe card distributed with a low spatial density transmission line. 5 [prior art]. The purpose of the 楝 pin card is to directly contact the probe on the probe card with the wafer test pad on the integrated circuit crystal-circle, in conjunction with the electrical test equipment and software control. • Transfer the test signal through the circuit board on the probe card. To the probe to achieve automated wafer level testing purposes, the probe arrangement is 10 micron to correspond to the gap between adjacent test pads on the wafer, and a single probe card can be widely used in different The circuit board design of the process technology, the circuit board design of the probe card is often not used as a circuit transmission structure in a specific routing manner, but is set between the wire and the probe used for the probe point in the electric measuring machine. The jumper structure of the transmission line, thereby sending the electrical signal to the probe. 15 However, when the transmission line is compared with the fine-sized probe structure, the transmission line has a wire diameter of about two orders or more. To connect each transmission line to a probe, the closer to the probe. The denser the transmission line is, the more complex and diversified the design of the wafer circuit, in order to quickly measure the characteristics of various circuit components to meet the requirements of wafer level testing, the probe card is 2〇 = More probes must be provided to correspond to the various circuit components, so that the higher the set density of the transmission line is required, or even the interleaved overlap can be used to connect to the probe exactly as in the conventional cantilever probe shown in Fig. 12. The probe card structure often causes the complexity and difficulty of the transmission line module engineering; in terms of the coaxial transmission line structure for high-frequency signal transmission, the metal signal conductor of the shaft core needs to be equipped with ^ 4 200804822
10 1510 15
環繞有特定厚度的絕緣材質，以控制維持訊號傳輪的特性 阻抗，但又需顧及與外圍接地金屬間的寄生電容效應造成 的介電損耗，避免產生訊號阻抗不匹配的情形，故絕緣材 質需有相當的厚度且依照介電常數不同而有所差異，但不 論選用何種絕緣材質，傳輸線本身的線徑皆較軸芯的金屬 訊號導線大了許多，如此更增加了傳輸線的空間分佈密 度，故往往用以傳輸高頻訊號的探針卡無法設置較多的訊 號探針以點測需做高頻測試的電子元件。 習用上縱使可於探針卡上設置有所謂空間轉換器的多 層電路結構’如第十三圖所示之制垂直式探針卡5，包括 有由上而下相疊置之—電路板5a、—空間轉換器％及多數 健針5c，電路板5a上佈設有特定線路以作為訊號傳輸的 導線路控’自電路板5a上表面延伸至下表面，上表面的線 路供電測機台的探測針頭6探點，下表面的線路供空間轉 性連接，空哺換器％ —般為以多層陶竟板 (u. ? Ceramic，MLC)或有機多層板(臟 Or，，ML〇)結構所製成，在空間轉換器5b的上、下 兩側並财㈣尺賴賴導點 =r針5c，空間轉換…二 小衣二路佈設結構’越接近探針5c則線路間距越 將電路板5a的導線與較密集佈設 =密達度I電電路 間轉換器不但須以 5 20 200804822 料與製程成二使得光空間轉換器的材 的對高密隼的雷；-从w 岭得輸結構，快速並全面 號傳輪的特性二同時兼顧維持高頻訊 今探針卡製造者所面1的-有大t驗的尚頻電測品質，實為現 【發明内容】 卡，可以低主要目的乃在於提供一種高頻探針 訊號質的傳輸線結構傳送高頻電測 高頻電^ί。’有效簡化傳輸線模組工程並提升探針卡的 15 20 具有揭目的’本發明所提供一種高頻探針卡，係 in/ ^*數條傳輸線、複數個纖探針及至少一接 二、广電路板上設有多數個訊號線路及接地線路，與 =Μ線路相鄰特定之間距上設有至少—該接地線路， ^喊線路供以傳輸該測試機台之測試訊號，該些接地 ==¾性導通至該測試機台之電位零點，有防止外部雜訊 :擾該訊號線路之電性防護作用，並作為各該訊號線路之 ’昧抗參考基準；該些傳輸線設於該電路板上，各該傳輸 線具有-第-及一第二導線，各該第一及一第二導線為具 的金屬材料所製成的金屬線且相鄰特定之間距，該 f —導線之㈣相電性連減訊號線路及該訊號探針， «亥第一導線為電性連接該接地線路；該些訊號探針及接地 6 200804822 探針皆為具有適當硬度及導電性的金屬材料所製成，且一 端皆用以設於電路板上，另一端用以接觸待測電子元件之 導電凸塊。 【實施方式】 以下，茲配合圖示:列舉若干較佳實施例，用以對本 發明之結構與功效作詳細說明，其中所用圖示之簡要說 明如下： 第一圖係本發明所提供第一較佳實施例之頂視圖； 第二圖係上述第一較佳實施例之底視圖； 第二圖係上述第一較佳實施例之結構示意圖； 第四圖係上述第-難實施例所提供傳輸線之結構示意 圖； 15 20 響貞2 = Μ ^ 所提供傳輸線之訊號頻率 意圖； 第"圖係本發明所提供第二較佳實施例之傳輸線結構示 第七 意圖 意圖 圖係本^ B撕提供第三較佳實施例之傳輸線結構示 第圖係本心明所提供第四較佳實施例之傳輸線結構示 所提供第五較佳實施例之結構示意圖; 第例之結構示意圖·， 提仏弟七較佳實施例之結構示意 7 200804822 清參閱如第一至第三圖所示本發明所提供之第一較佳 實施例，為一用以高頻量測之探針卡1，包括有一電路^ =、一探針座20、複數個傳輸線30、複數個高頻探針4〇及 5複數個接地探針50,該電路板1〇可定義出相對之一上表面 ιοί及一下表面102，以及外圈之一測試區1〇3及内圈^一 跳線區104’該電路板10上佈設有電子電路，該跳線區1〇4 之上、下表面101、102上分別設有多數個金屬銲點1〇5、 1〇2’電子電路於該上表面101之測試區103電氣連接至一 10，式機台（圖中未示）’該測試機台可輸出高頻量測信號至 該探針卡卜該上表面101之銲點1〇5與該些傳輸線3〇電 性連接，並與下表面101之銲點106直接電性導通，該下 表面102的銲點106用以電性連接該些探針40、50,其中： "月配合第一圖參照，該電路板之電子電係 個訊號線路11及接地線路12，於該上表 中各該接地線路12為環繞於該訊號線路u而相鄰特定之 間距，該些訊號線路U供以傳輸該測試機台之測試訊號， 該些接地線路12電性導通至該測試機台之電位零點，有防 止外部雜訊干擾該訊號線路U之電性防護作用，並作為各 2〇該訊號線路11之特性阻抗參考基準，另請配合第三圖來 照，該接地線路12於該電路板1〇内測試區1〇3中具有共 平面之導線佈設，並設於該訊號線路u下方與之相鄰特^ 之間距’該電路板1〇内跳線區1〇4中該訊號線路u及接 地線路12即用以將上表面101之銲點1〇5直接正向電性導 8 200804822 通至下表面102之銲點l〇6。 清參閱如第二及第三圖所示之該探針座2〇，係設置於 該電路板10下表面102之跳線區1〇4内侧，具有一接地面 =及-固定環22,該接地面21為具導電性之金屬材料所 ^成，設於該電路板10上形成為環狀之金屬平面，該固定 % 22 „又於該接地面21上’用以,固設各該探針4〇、之身 部’並使探針40、50的針尖部位露出制定環22之環形 ^口 23中’ 定環22為具有絕緣及抗震特性的材料所 ‘成，如本實施例所提供之環氧樹脂材料。 1〇請參閱如第三圖所示之各該傳輸線30，係於該測試區 103内緣與電子電路電性連接’並延伸佈設至該跳線區 ”該些銲點1G5對應電性連接，具有—第—及—第二導線 為具導電性的金屬材料所製成的金屬線，各該導 秦3卜32上沿軸向之外圈具有一包覆體3n、321 ,為具有 15 — 良好絕緣特性之材質所製成的絕緣套管，最外層並有一套 s 33用以固定各該導線3卜％，各該導線M、％之兩端 可^^定出一第一端312、322及一第二端313、323,各 吞第導線31之一端312、313分別電性連接該測試區1〇3 2〇 t訊號線路U及一訊號銲點1〇5a，各該第二導線32之二 77別電性連接該跳線區104之接地線路12及 接地銲點l〇5b ;另請配合第四圖參照，各該包覆體31卜 321不但可分別用以保護各該導線3卜3 毁，且藉由各該包覆體311、321存在之特定厚;: "^ 33包圍二該導線31、32時可維持相互緊鄰且平 9 200804822 订各該‘線31 32之相鄰間距即為二該包覆體扣、321 之厚度。 请參=如第一及第三圖所示之各該高頻探針仙，具有 5 15 套管43，各該訊號探針41 為具有射硬度及導電性之金屬導體，—端用以電性連接 至電路板上之-訊號鲜點1〇6a，另一端 +几场日(圖中未示）可傳遞訊號之導 ^凸塊’且石軸向之外圈包覆有一包覆體4ιι，與上述 = 具有綱之魏娜，各該訊號探針 M H〜疋環20與銲點106間為與該地線42並 套管43緊密包覆，該地線42兩端分別 电性連接至-接地銲點脈b及該接地面21，由於該訊號 鲜點 3及接地銲點嶋分別與上表面HH之訊號銲點° ^及^地銲點_直接電性導通，因此該訊號探針41 測訊號至待測t子元件，該地線42則為電性接地 雜針41雜訊號之雜阻抗；錢接地探針 同為，、有射硬度及導電性之金屬導體，以電性 立接至電路板H)上之接地薛點106b，另一端為其針尖獨 =用以接觸上述電子元件之接地導電凸塊，其身部則盘 =接地面21電性連接，因此使該探針卡i之所有接地電ς 白於^接地面21上形成有共接平面。 當該探針卡i測試區103之電子電路電氣連接至上述測 碑機台，則藉由各該訊號線路u傳遞電測訊號至該第一導 線31然後至該訊號探針41，由於訊號傳輸過程中鄰近依序 20 200804822 配合有該些接地線路12、第二導線32及地線42的設置， 可因此有效傳遞高頻訊號使維持阻抗匹配的特性，並防止 不必要的電性麵合效應，使該探針卡i具有極佳的高頻電 測可靠性J由於各該傳輸線3〇為平行雙導_結構，訊 5號特性阻抗主要取決H線3卜32之相_離，以本實 施例所提供之即為二該包覆體311、321:之厚度，可維持二 該導線31、32之間小於1毫米之間隙，卻能使該第一導線 31之特性阻抗控制於如傳統同軸傳輸線所需5〇至乃歐姆 之標準規格，而不必如傳統同軸傳輸線般受限於内部同軸 1〇導線周圍絕緣材質的介電特性，使用有數毫米厚度之絕緣 材質，請配合第五圖參照，為本實施例所提供該傳輸線3〇 之頻率特性曲線圖，圖中該傳輸線3〇之反射耗損（retum •loss)曲線S11自100MHz至高頻GHz頻段皆有極低的反 射耗損，顯示其於南頻段有極佳的阻抗匹配特性，圖中該 I5傳輸線30之插入耗損（insertion loss)曲線S21更顯示該 傳輸線30於-3dB增益之通帶（passband)限制頻率可高至 1.2GHz’具有良好的的高頻訊號傳輸品質，如此使該探針 卡1在傳輸高頻電測訊號不但具有低損耗、匹配佳的特性， 且各該傳輸線30為小於一毫米之線徑，在該跳線區ι〇4上 2〇可δ又置多數但低空間密度的傳輸線3〇以供傳遞高頻訊號作 大量電子元件的探測，更能有效避免跳線模組工程的困難 度以致降低探針卡1的電路品質。 由於本發明所提供之傳輸線主要為以雙導線的結構使提 升訊號傳輸的品質及降低傳輸線的空間設置密度，因此雙 11 200804822 導線的結構型態亦可如第六至第八圖所示，分別為本發明 第二、第三及第四較佳實施例所提供之傳輸線34、36、38， 其中： 第六圖參照，該傳輪線34具有該第一及一第二導線 5 31、32以及包覆該第一導線31之包覆體311，最外層為由 一套管35包圍’同樣可維持二該導線31、32相互緊鄰且Surrounding a certain thickness of insulating material to control the characteristic impedance of the signal transmission wheel, but also taking into account the dielectric loss caused by the parasitic capacitance effect between the external grounding metal, to avoid the signal impedance mismatch, so the insulation material needs There is a considerable thickness and varies according to the dielectric constant. However, no matter what kind of insulating material is used, the wire diameter of the transmission line itself is much larger than that of the metal signal wire of the core, which increases the spatial distribution density of the transmission line. Therefore, the probe card that is used to transmit high-frequency signals cannot set more signal probes to point out the electronic components that need to be tested for high-frequency. Conventionally, a multi-layer circuit structure in which a so-called space converter can be disposed on a probe card, such as the vertical probe card 5 shown in Fig. 13, includes a circuit board 5a stacked from top to bottom. , the space converter % and the majority of the needle 5c, the circuit board 5a is provided with a specific line for the signal transmission of the line control 'from the upper surface of the circuit board 5a to the lower surface, the upper surface of the line-powered test machine detection The needle 6 is probed, the line on the lower surface is connected to the space, and the empty feeder is generally a multi-layer ceramic board (u. ? Ceramic, MLC) or organic multi-layer board (dirty Or, ML〇) structure. Made up, on the upper and lower sides of the space converter 5b and the four (four) feet rely on the guide point = r pin 5c, space conversion ... two small clothes two-way layout structure 'the closer to the probe 5c, the line spacing will be the circuit board 5a wire and denser layout = density I electrical circuit converter not only must be 5 20 200804822 material and process two to make the light space converter material of the high-density mine; - from W Ling to the structure, The characteristics of the fast and comprehensive transmission wheel are both for maintaining the high frequency signal probe The card manufacturer's face--there is a large-scale test of the frequency of the electrical measurement, which is actually [invention] card, can be low to provide a high-frequency probe signal transmission line structure to transmit high-frequency electrical measurements High frequency electricity ^ί. 'Efficiently simplifying the transmission line module engineering and upgrading the probe card 15 20 has been highlighted. The present invention provides a high frequency probe card, which is an in / ^ * number of transmission lines, a plurality of fiber probes and at least one after two, There are a plurality of signal lines and grounding lines on the wide circuit board, and at least a certain grounding line is disposed adjacent to the adjacent line of the Μ line, and the line is provided for transmitting the test signal of the testing machine, and the grounding is =3⁄4 is turned on to the potential zero of the test machine, which prevents external noise: disturbs the electrical protection of the signal line, and serves as a reference reference for each of the signal lines; the transmission lines are disposed on the circuit board Each of the transmission lines has a first-and a second wire, and each of the first and second wires is a metal wire made of a metal material and adjacent to a specific distance, and the f-wire (four) phase is electrically The continuation signal line and the signal probe, «Hai first wire is electrically connected to the ground line; the signal probe and grounding 6 200804822 probe are made of metal material with appropriate hardness and conductivity, And one end is used for design A circuit board, and the other end to contact with the conductive bumps of the electronic component under test. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, a number of preferred embodiments are provided to illustrate the structure and function of the present invention. The brief description of the drawings is as follows: The first figure is the first comparison provided by the present invention. The top view of the first preferred embodiment; the second figure is a schematic view of the first preferred embodiment; the fourth figure is the transmission line provided by the above-mentioned first-difficult embodiment FIG. 2 is a schematic diagram of the signal frequency of the transmission line provided; The transmission line structure of the third preferred embodiment is shown in the drawings. The structure of the transmission line structure of the fourth preferred embodiment is provided. The structure of the fifth preferred embodiment is provided. Structure of the seventh preferred embodiment 7 200804822 Referring to the first preferred embodiment of the present invention as shown in the first to third figures, a probe card 1 for high frequency measurement includes an electric ^ =, a probe holder 20, a plurality of transmission lines 30, a plurality of high frequency probes 4A, and a plurality of grounding probes 50, the circuit board 1 defines a top surface ιοί and a lower surface 102, And one of the outer ring test area 1〇3 and the inner ring ^1 jumper area 104', the circuit board 10 is provided with an electronic circuit, and the jumper area 1〇4 and the lower surface 101, 102 respectively have a majority A metal solder joint 1〇5, 1〇2' electronic circuit is electrically connected to a test area 103 of the upper surface 101 to a 10, a type machine (not shown) 'the test machine can output a high frequency measurement signal The solder joints 1〇5 of the upper surface 101 of the probe card are electrically connected to the transmission lines 3〇, and are directly electrically connected to the solder joints 106 of the lower surface 101. The solder joints 106 of the lower surface 102 are used for Electrically connecting the probes 40 and 50, wherein: "monthly with reference to the first figure, the electronic circuit of the circuit board has a signal line 11 and a ground line 12, and the ground lines 12 are surrounded by the ground table 12 in the upper table. The signal lines U are adjacent to a specific distance, and the signal lines U are provided for transmitting test signals of the test machine, and the grounding The line 12 is electrically connected to the potential zero point of the test machine, and has an electrical protection function for preventing external noise from interfering with the signal line U, and serves as a reference reference for the characteristic impedance of each of the signal lines 11, and please cooperate with the third. As shown in the figure, the grounding line 12 has a coplanar wire disposed in the test area 1〇3 of the circuit board 1 and is disposed under the signal line u and adjacent to the circuit board. The signal line u and the ground line 12 in the inner jumper area 1〇4 are used to directly connect the solder joint 1〇5 of the upper surface 101 to the solder joint l〇6 of the lower surface 102 directly to the electrical conductor 8 200804822. Referring to the second and third figures, the probe holder 2 is disposed on the inner side of the jumper area 1〇4 of the lower surface 102 of the circuit board 10, and has a ground plane=and-fixing ring 22, which The grounding surface 21 is made of a conductive metal material, and is formed on the circuit board 10 to form a ring-shaped metal plane. The fixing % 22 is used on the grounding surface 21 to fix the probes. The needle 4', the body portion' and the tip end portion of the probes 40, 50 are exposed in the annular opening 23 of the ring 22, and the ring 22 is made of a material having insulation and shock resistance characteristics, as provided in the present embodiment. The epoxy resin material. 1 〇 Please refer to each of the transmission lines 30 as shown in the third figure, which is electrically connected to the electronic circuit at the inner edge of the test area 103 and extends to the jumper area. 1G5 corresponds to an electrical connection, and the first and second wires are metal wires made of a conductive metal material, and each of the guide wires 3b has a covering body 3n along the axial outer ring. 321 , an insulating sleeve made of a material having 15 - good insulating properties, the outermost layer and a set of s 33 for fixing each of the guides 3b%, each of the wires M, % can be fixed to a first end 312, 322 and a second end 313, 323, one end 312, 313 of each of the swallowing wires 31 are electrically connected to the test Zone 1〇3 2〇t signal line U and a signal solder joint 1〇5a, each of the second wires 32 of the second wire 77 is electrically connected to the grounding line 12 of the jumper zone 104 and the grounding pad l〇5b; Please refer to the fourth figure for reference, each of the covering bodies 31 321 can be used not only to protect each of the wires 3, but also by the thickness of each of the covering bodies 311, 321;: "^ 33 When the two wires 31 and 32 are surrounded, the two adjacent wires 31 and 32 can be maintained adjacent to each other and the adjacent spacing of the wires 31 and 32 can be two thicknesses of the covering buckles and 321 . Please refer to the high frequency probes as shown in the first and third figures, which have 5 15 sleeves 43. Each of the signal probes 41 is a metal conductor having an impact hardness and conductivity, and the end is used for electricity. Connected to the signal board - signal fresh point 1〇6a, the other end + a few days (not shown) can transmit the signal guide ^ bump 'and the stone axial outer ring is covered with a covering body 4 ι And the above-mentioned = Wei Na, the signal probe MH ~ 疋 ring 20 and the solder joint 106 are tightly wrapped with the ground wire 42 and the sleeve 43, the two ends of the ground wire 42 are electrically connected to - the grounding soldering pulse b and the grounding surface 21, since the signal fresh spot 3 and the grounding pad 嶋 are directly electrically connected to the signal soldering point of the upper surface HH, respectively, the signal probe 41 test signal to the t sub-component to be tested, the ground wire 42 is the impurity impedance of the electrical grounding pin 41 noise signal; the money grounding probe is the same, the metal conductor with the hardness and conductivity, electrically Connected to the grounding point 106b on the circuit board H), the other end is the tip of the needle = the grounding conductive bump for contacting the above electronic component, and the body is the disk = ground 21 is electrically connected to the ground electrode so that all of the probe card of ς i ^ whiter connected with a common ground plane is formed on 21. When the electronic circuit of the probe card i test area 103 is electrically connected to the above-mentioned tablet machine, the electrical signal is transmitted to the first wire 31 and then to the signal probe 41 by each of the signal lines u, due to signal transmission. In the process, the adjacent sequence 20 200804822 cooperates with the grounding circuit 12, the second wire 32 and the ground wire 42 to effectively transmit high frequency signals to maintain impedance matching characteristics and prevent unnecessary electrical surface matching effects. Therefore, the probe card i has excellent high-frequency electrical reliability J. Since each of the transmission lines 3 is a parallel double-conducting structure, the characteristic impedance of the signal No. 5 mainly depends on the phase of the H-line 3 and 32. The embodiment provides that the thickness of the covering bodies 311, 321 can maintain a gap of less than 1 mm between the wires 31, 32, but can control the characteristic impedance of the first wire 31 to be as conventional. The coaxial transmission line requires a standard specification of 5 〇 to ohm, instead of being limited by the dielectric properties of the insulating material around the inner coaxial 1 〇 wire as in the case of a conventional coaxial transmission line, and using an insulating material having a thickness of several millimeters, please refer to the fifth figure. For this implementation For example, the frequency characteristic curve of the transmission line 3〇 is provided. In the figure, the reflection loss (loss) curve S11 of the transmission line has extremely low reflection loss from the 100 MHz to the high frequency GHz band, indicating that it has a south frequency band. Excellent impedance matching characteristic, the insertion loss curve S21 of the I5 transmission line 30 in the figure further shows that the passband limit frequency of the transmission line 30 at -3dB gain can be as high as 1.2GHz' with good high. The transmission quality of the frequency signal, so that the probe card 1 has low loss and good matching characteristics in transmitting the high frequency electrical measurement signal, and each of the transmission lines 30 has a wire diameter of less than one millimeter, in the jumper area ι 4 The upper 2 〇 δ and the majority of the low-density transmission line 3 〇 for transmitting high-frequency signals for the detection of a large number of electronic components, can effectively avoid the difficulty of the jumper module engineering and thus reduce the circuit quality of the probe card 1 . Since the transmission line provided by the present invention mainly uses the structure of the two wires to improve the quality of the signal transmission and reduce the spatial density of the transmission line, the structure of the double 11 200804822 wire can also be as shown in the sixth to eighth figures, respectively. The transmission lines 34, 36, 38 provided in the second, third and fourth preferred embodiments of the present invention, wherein: the sixth figure refers to the first and second conductors 5 31, 32 And the covering body 311 covering the first wire 31, the outermost layer being surrounded by a sleeve 35. The same can be maintained, the wires 31, 32 are adjacent to each other and
平行，各該導線31、32之相鄰間距則僅為該包覆體311之 厚度’如此可控制該第一導線31傳遞高頻訊號之特性阻抗 為50歐姆之標準規格，更可縮小各該傳輸線34的線徑使 1〇該些傳輸線34佔有更小的空間密度。 第七圖參照，該傳輸線36具有該第一及一第二導線 31、32以及包覆各該導線31、32之包覆體3U、321，該 -包覆體31卜321之間則有一黏著物37相互固定，以維 15 20 持一該導線3卜32相互緊鄰且平行，如此更可縮小該些傳 輸線36所佔的空間密度。 第八圖參照，該傳輸線38具有該第-及-第二導線 31 32以及包覆各該導線31、32之包覆體、321，該 二導線31、32為相互纏繞的雙絞線結構以維持相互緊鄰， 各該導線3卜32之相鄰間距即為二該包覆體31卜321之 厚度，使該傳輸線38較上述第―、第二及第 供者佔有更小的空間密度。 吓捉 值得-提較，上_探針座2G之設置主要為 探針40、50，並藉由拔^ t 二 繩由接地面21所提供之共接效果使該探針 八同之等電位接地平面，因此並不限定該接地面 12 200804822 21之、、Ό構型態，若如弟九圖所本 供之-探針卡2,則以一探針座23取::= 5In parallel, the adjacent spacing of the wires 31 and 32 is only the thickness of the covering body 311. Thus, the standard impedance of the first wire 31 for transmitting high-frequency signals with a characteristic impedance of 50 ohms can be controlled, and the respective specifications can be reduced. The wire diameter of the transmission line 34 is such that the transmission lines 34 occupy a smaller spatial density. Referring to the seventh figure, the transmission line 36 has the first and second wires 31, 32 and the covering bodies 3U, 321 covering the wires 31, 32. The objects 37 are fixed to each other, and the wires 3 20 are held in close proximity and parallel to each other, so that the spatial density occupied by the transmission lines 36 can be further reduced. Referring to FIG. 8 , the transmission line 38 has the first and second wires 31 32 and an covering body 321 covering the wires 31 and 32. The two wires 31 and 32 are mutually twisted twisted pair structures. In the immediate vicinity of each other, the adjacent spacing of the wires 3 and 32 is the thickness of the covering body 31 321 so that the transmission line 38 occupies a smaller spatial density than the first, second and third donors. Scary worthy of comparison - the upper _ probe holder 2G is mainly set for the probes 40, 50, and the common effect provided by the ground plane 21 by pulling the two ropes makes the probe equipotential The ground plane, therefore, does not limit the ground plane 12 200804822 21, the Ό configuration, if the probe card 2 is provided as the jiu diagram, take a probe holder 23::= 5
1515
=提供者’九中該探針座23具有一固定環23〇及；= ’忒固疋裱230係直接設於該電路板1〇下表面上 並與上述實關所提供者有相同之功能結構 面231為設於該固定環23〇 ^該接地 線42及接_。電性連接:==供= =3:面二且由於該固定環230為固設於該電路板10 ΙΪ;述貫施例之該固定環22為透過該接地面設 =路板10上，因此該固定環23〇與電路板ι〇之間並 =屬構件，可避免金屬隨溫度變化所發生的熱漲冷縮效 應使該固定環230發生位移現象，而導致該些探針4〇、％ 隨之位移無法準確的用以點測電子元件。 另請參閱如第十圖所示本發明第六較佳實施例所提供 之垂直式探針卡3，包括有一電路板6〇、一探針座7〇、 一探針組80及該些傳輸線3〇，其中： 該電路板60可定義出環形外圈之一測試區6〇1及環形 2圈之一跳線區6〇2，該電路板6〇環形缺口中形成一探針 區603 ’用以設置該探針座7〇，該電路板6〇測試區6〇ι係 2〇與上述第一較佳實施例所提供者同樣具有該些訊號線路。 及接地線路12，並分別與各該傳輸線30之第一及一第二導 線31、32電性連接，所相異者為該電路板6〇上更設有多 個地線13電性連接該接地線路12，該些傳輸線30及地線 13為自測試區601向跳線區6〇2延伸設置然後連接至該探 13 200804822 針座70上。 該探針冑70為設於該電路板6〇_央環形缺口之一槽 體，其槽口 701向上可供該些傳輸線3〇及地線13延伸進 入，具有沿該電路板60内環所設置之一壁面71以及構成 5其槽底702之-底座72,該底i 72上依序疊設有一絕緣層 73及一接地面74，該壁面71及接地面74皆為具導電性的 — 金屬材質所製成，該底座72及絕緣層73皆為具良好絕緣 鲁 特性的材料所製成，該底座72上設有多數個通孔720，各 通孔720大小為相當於各該第一導線31與其包覆有該包覆 1〇層311之線徑，各該第一導線31連同其包覆層311穿過該 接地面74延伸至絕緣層73内且各該第一導線31穿過通孔 720後於該槽底702露出，該些第二導線32為電性連接該 接地面74，各該地線13電性連接至該接地面74並穿過至 該絕緣層73後使末端設於該槽底7〇2露出，因此該探針座 is 70之槽底702即有自該些通孔720中外露之第一導線31 參 及地線13。 該探針組80設於該探針座70之槽底702上，具有多 - 數個訊號探針81及接地探針82,為具有適當硬度及導電性 之金屬導體，各該探針81、82係穿設於二固定片幻上妒 20成直立狀，該二固定片83為具良好絕緣特性的材料所製 成，使各該訊號探針81之末端810於該通孔72〇中對應至 一該第一導線31與之電性連接，各該接地探針82之^端 820於該通孔72〇中對應至一該地線13與之電性連接，且 各該探針81、82之針尖81卜821外露可用以點觸待測電 200804822 子元件。 因此該探針卡3係直接以該些傳輸線30傳遞電測訊 號至訊號騎81 _酬電子元件，絲如上餘施例之 電路板ίο於跳線區104所設置之鲜點1〇5、1〇6，使電測訊 號需，向通過該電路板1〇才傳至高頻探針4〇上，因此可 避免高頻喊在板_層傳射能發生的介電耗損或 口阻抗不匹而發生的反射耗損情形，使該探針卡3不但 密度設置空間且高品質傳輸之該些傳輸線30，更 此本持_訊號傳輸的特性阻抗轉得更佳之電測可靠 H舰探針卡3情探針座7G所提供之接地等電 不=該接地面74之連接設置結構，亦可如第 十圖所不，為本發明第讀佳實施例所提供之一 15 20 而上賴探針卡3為直接省去該接地面74之設置 32及^㈣71作轉電位接地共平面，使該些第二導線 32及地線13電性逵技马~ ^ ^ 該接紗接並將該壁面71直接與各 x难木电性連接’同樣具有本發明所欲達成之功效。 故崎者，僅林判讀佳可行實關而已， 故舉凡應用本發明說明書及申枝 變化，理應包含在本侧之㈣料之纽結構 15 200804822 【圖式簡單說明】 第一圖係本發明所提供第一較佳實施例之頂視圖； 第二圖係上述第一較佳實施例之底視圖； 第二圖係上述第一較佳實施例之結構示意圖； 5 第四圖係上述第—較佳實施例所提供傳輸線之結構示竟 圖； 第五圖係上述第-較佳實施例所提供傳輸線之訊號頻 響應量測圖；、 立第八圖係本發明所提供第二較佳實施例之傳輸線結構示 10 意圖； 立第七圖係本發明所提供第三較佳實施例之傳輸線結構示 思圖； 立弟八圖係本發明所提供第四較佳實施例之傳輸線結構示 思、圖， 15 料®穌發騎提供帛五齡實施狀結構示音固. 二圖係本發明所提供第六較佳實施例之結構示二 弟十-圖係本發明所提供第七較佳實施例之結構示意 圖， ^十二_ 懸臂式探針之探針卡頂視圖； 20帛十二圖係習用垂直式探針之探針卡結構示意圖。 【主要元件符號說明】 101上表面 卜2、3、4探針卡 10、60電路板 200804822 10 15= Provider's nine probe holders 23 have a retaining ring 23〇; = '忒固疋裱 230 is directly placed on the lower surface of the board 1 and has the same function as the one provided above The structural surface 231 is disposed on the fixing ring 23 and the grounding wire 42 and the connection _. Electrical connection: == for ==3: face 2 and because the fixing ring 230 is fixed to the circuit board 10; the fixing ring 22 of the embodiment is disposed through the grounding surface=the road board 10, Therefore, the fixing ring 23 is connected to the circuit board and is a member, so as to avoid the thermal expansion and contraction caused by the temperature change of the metal, the fixing ring 230 is displaced, and the probes are caused to be % The displacement is then not accurately used to spot electronic components. Please also refer to the vertical probe card 3 provided in the sixth preferred embodiment of the present invention, which includes a circuit board 6〇, a probe holder 7〇, a probe set 80 and the transmission lines. 3〇, wherein: the circuit board 60 defines a test area 6〇1 of the annular outer ring and a jumper area 6〇2 of the annular 2 ring, and the probe plate 603′ is formed in the annular gap of the circuit board 6〇 For providing the probe holder 7 , the circuit board 6 〇 test area 6 〇 系 2 同样 has the same signal lines as those provided by the first preferred embodiment. And the grounding line 12 is electrically connected to the first and second wires 31 and 32 of each of the transmission lines 30, and the plurality of ground wires 13 are electrically connected to the circuit board 6 The grounding line 12, the transmission line 30 and the grounding line 13 are extended from the test area 601 to the jumper area 6〇2 and then connected to the probe 13 200804822 needle holder 70. The probe 胄 70 is a slot body disposed on the circuit board 6 环形 _ central annular gap, and the slot 701 is upwardly accessible for the transmission line 3 〇 and the ground line 13 to extend into the inner ring of the circuit board 60 A wall 71 and a base 72 constituting the bottom 702 of the slot 5 are disposed. The bottom 71 is sequentially provided with an insulating layer 73 and a grounding surface 74. The wall 71 and the grounding surface 74 are electrically conductive— The base 72 and the insulating layer 73 are made of a material having good insulating properties. The base 72 is provided with a plurality of through holes 720, and each through hole 720 is equivalent to each of the first holes. The wire 31 is covered with the wire diameter of the cladding layer 311, and each of the first wire 31 and its cladding layer 311 extends through the ground plane 74 into the insulating layer 73 and each of the first wires 31 passes through. The through holes 720 are exposed at the bottom 702, and the second wires 32 are electrically connected to the ground plane 74. The ground wires 13 are electrically connected to the ground plane 74 and pass through the insulating layer 73 to make the end. The slot bottom 702 of the probe base is 70 has a first lead 31 exposed from the through holes 720. Line 13. The probe set 80 is disposed on the bottom 702 of the probe base 70, and has a plurality of signal probes 81 and a grounding probe 82. The probes 81 are metal conductors having appropriate hardness and conductivity. The 82 series is disposed on the two fixed pieces of the phantom top 20, and the two fixed pieces 83 are made of a material having good insulating properties, so that the end 810 of each of the signal probes 81 corresponds to the through hole 72? The first wire 31 is electrically connected to the first wire 31, and the terminal 820 of the grounding probe 82 is electrically connected to the ground wire 13 in the through hole 72, and each of the probes 81, 82 pin tip 81 821 exposed can be used to tap the power to be tested 200804822 sub-element. Therefore, the probe card 3 directly transmits the electrical measurement signal to the signal riding 81-receiving electronic component by the transmission lines 30, and the circuit board of the remaining embodiment is the fresh spot 1〇5, 1 set by the jumper area 104. 〇6, so that the electrical test signal needs to be transmitted to the high-frequency probe 4〇 through the board, so that the dielectric loss or the impedance of the port can be avoided. In the case of the reflection loss, the probe card 3 not only has a density setting space but also transmits the transmission line 30 with high quality, and the characteristic impedance of the signal transmission is better. The grounding isoelectric power provided by the probe base 7G is not the connection arrangement structure of the grounding surface 74, and may also be one of the 15 20 provided by the first preferred embodiment of the present invention. The card 3 is directly omitted from the grounding surface 74 of the setting 32 and ^ (four) 71 for the potential potential grounding coplanar, so that the second wire 32 and the grounding wire 13 electrically 马 ~ ^ ^ ^ the yarn is connected and the wall 71 directly connected to each x hardwood electrical connection 'has the same effect as the present invention. For the sake of Saki, only the forest is judged to be a good practice. Therefore, the application of the present specification and the change of the application should be included in the four-material structure of this side. The top view of the first preferred embodiment is provided; the second view is a bottom view of the first preferred embodiment; the second view is a schematic view of the first preferred embodiment; The structure of the transmission line provided by the preferred embodiment is shown in FIG. 5; the fifth diagram is the signal frequency response measurement diagram of the transmission line provided by the above-described first preferred embodiment; and the eighth embodiment is a second preferred embodiment of the present invention. The transmission line structure is shown in FIG. 10; the seventh diagram is a transmission line structure diagram of the third preferred embodiment provided by the present invention; and the same is provided for the transmission line structure of the fourth preferred embodiment provided by the present invention. Fig. 15 material 稣 骑 骑 帛 帛 稣 稣 稣 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Schematic diagram of the structure, ^ A top view of the probe card probe of the cantilever two _; 20 silk twelve schematic view showing the structure of the probe card of the conventional vertical probe. [Main component symbol description] 101 upper surface Bu 2, 3, 4 probe card 10, 60 circuit board 200804822 10 15
102下表面 104、602跳線區 105 a、106 a訊號銲點 11訊號線路 20、23、70探針座 22、230固定環 30、34、36、38 傳輸線 311、321、411 包覆體 313、323 第二端 33、35、43 套管 40高頻探針 410、500、811、821 針尖 42、13地線 S11反射耗損曲線 S21插入耗損曲線 603探針區 702槽底 72底座 73絕緣層 810、820 末端 5垂直式探針卡 5b空間轉換器 6探測針頭 103、601測試區 105、106 銲點 105 b、106 b接地銲點 12接地線路 21、231、74接地面 23缺口 31第一導線 312、322 第一端 32第二導線 37黏著物 41、81訊號探針 50、82接地探針 701 槽口 71壁面 720通孔 80探針組 83固定片 5a電路板 5c探針 7晶圓 17 20102 lower surface 104, 602 jumper area 105 a, 106 a signal solder joint 11 signal line 20, 23, 70 probe holder 22, 230 fixing ring 30, 34, 36, 38 transmission line 311, 321, 411 covering body 313 323 second end 33, 35, 43 sleeve 40 high frequency probe 410, 500, 811, 821 tip 42, 13 ground line S11 reflection loss curve S21 insertion loss curve 603 probe area 702 groove bottom 72 base 73 insulation layer 810, 820 end 5 vertical probe card 5b space converter 6 probe needle 103, 601 test area 105, 106 solder joint 105 b, 106 b ground solder joint 12 ground line 21, 231, 74 ground plane 23 gap 31 first Conductor 312, 322 First End 32 Second Lead 37 Adhesive 41, 81 Signal Probe 50, 82 Ground Probe 701 Notch 71 Wall 720 Through Hole 80 Probe Set 83 Fixing Plate 5a Circuit Board 5c Probe 7 Wafer 17 20