CN100535668C

CN100535668C - High frequency probe card

Info

Publication number: CN100535668C
Application number: CNB200610099301XA
Authority: CN
Inventors: 顾伟正; 林信宏; 何志浩; 冯得诚
Original assignee: MPI Corp
Current assignee: MPI Corp
Priority date: 2006-07-13
Filing date: 2006-07-13
Publication date: 2009-09-02
Anticipated expiration: 2026-07-13
Also published as: CN101105506A

Abstract

The utility model relates to a high frequency probe card, which comprises a circuit board, a plurality of transmission lines and a plurality of signal probes; wherein the circuit board is provided with a plurality of signal circuits and a plurality of ground circuits; the transmission line is a structure with double guide lines; one of the two guide lines is used to transmit high frequency signals, and the other one of the two guide lines is electrically connected with the ground circuit; an electrometric platform provides high frequency signals to all the signal circuits and transmits high frequency signals to the signal probes through one guide line; the electrometric platform is adjacently and coordinately connected with the ground circuits and the other guide line during the signals are transmitted; therefore, the high frequency signals can effectively transmitted and the characteristic of impedance matching can be maintained; furthermore, the transmission lines can be maintained the diameter of lines only in about 1mm or less 1mm; therefore, the circuit board can be provided with a plurality of the transmission lines distributed in low space density which is provided as high frequency electronic measurement of electronic components in quantity.

Description

High frequency probe card

Technical field

The present invention is relevant with probe, is meant a kind of probe that distributes with low spatial density transmission line especially.

Background technology

The fundamental purpose of probe is that the probe on the probe is directly contacted with chip testing weld pad on the integrated circuit (IC) wafer, cooperate electric logging equipment and software control that test signal is transferred to probe so that chip through circuit board on the probe, reach the wafer level test purpose of robotization, the arranging density of its middle probe then needs trickle in can be corresponding to crack between the adjacent detection welding pad on the chip, and single probe is in order to be widely used in the integrated circuit (IC) wafer of different technologies of preparing, the mode that the board design of probe often can not laid with specific cabling is as the structure of circuit transmission, and be the jumper wire construction that transmission line is set between the electrical measurement board is in order to the lead of visiting point and probe, by this electromotive signal is delivered to probe.

Yet in comparison with the probe structure of transmission line and fine dimension, the line of transmission line is directly bigger approximately two more than the progression, if each transmission line correspondence will be connected to a probe, then the setting of transmission line is intensive more near the probe place more, especially get under the design of complexity and diversification in wafer circuit, be the multiple circuit component characteristic of energy rapid measuring, to meet the requirement of wafer level test, it is corresponding with each circuit component then must to be provided with more probe on the probe, make transmission line that density requirements is set is high more even need could definitely to be connected to probe in the staggered mode that overlaps, have the probe card configuration of cantalever type probe as shown in figure 12 now, often cause the numerous and diverse and degree of difficulty of transmission line modular engineering; With coaxial transmission line structure as high-frequency signal transmission, the metal signal lead of axle core need cooperate the insulation material that is surrounded with specific thicknesses, keep the characteristic impedance of signal transmission with control, but need take into account and peripheral grounded metal between the dielectric loss that causes of parasitic capacitance effect, avoid producing the unmatched situation of signal impedance, so the insulation material need have suitable thickness and according to the different and difference to some extent of specific inductive capacity, no matter but select which kind of insulation material for use, the line footpath of the transmission line all metal signal lead than the axle core itself is big many, so more increased the space distribution density of transmission line, so often more signal probe need be done high-frequency test with a survey electronic component can't be set in order to the probe of transmitting high-frequency signal.

Even if prior art can probe be provided with the multilayer circuit structure of so-called space convertor, existing vertical probe carb 5 as shown in figure 13, include a circuit board 5a who from top to bottom repeatedly puts mutually, one space convertor 5b and most probe 5c, be laid with specific circuit on the circuit board 5a with thread guide path as the signal transmission, extend to lower surface from circuit board 5a upper surface, the line powering of upper surface is surveyed the probe head 6 of board and is visited point, the circuit of lower surface electrically connects for space convertor 5b, space convertor 5b is generally with multi-layer ceramics plate (Multi-Layer Ceramic, MLC) or organic multilayer plate (Multi-Layer Organic, MLO) structure is made, on space convertor 5b, following both sides also are provided with the conductive junction point of different size spacing, be connected in circuit board 5a and probe 5c for correspondence respectively, the inside of space convertor 5b is then just like the multilayer line laying structure of semiconductor fabrication, then line pitch is more little near probe 5c more, to electrically connect between the probe 5c that lead and the comparatively dense of circuit board 5a are laid, reach the effect of circuit space conversion, therefore can correspondingly visit highdensity electronic component on the some wafer 7, yet the space convertor of this kind vertical probe structure not only must be made with micro electronmechanical or film preparation mode, even need utilize specific insulating medium as base material, make the material and the preparation cost of light space convertor expend much larger than the manufacturing cost of probe circuit board, therefore how probe can be with the circuit transmission structure of most economical material benefit, also comprehensively highly dense electronic component is done the high frequency electrical measurement fast, take into account the characteristic impedance of keeping high-frequency signal transmission simultaneously, make to have best high frequency electrical measurement quality a real test that is faced for probe manufacturing person now.

Summary of the invention

Fundamental purpose of the present invention is to be to provide a kind of high frequency probe card, can low spatial density and high-quality transmission line structure transmit the high frequency electromotive signal to probe, effectively simplify the transmission line modular engineering and promote the high frequency electrical measurement quality of probe.

Take off purpose for before reaching, a kind of high frequency probe card provided by the present invention, be to have a circuit board, most transmission lines, a most signal probe and at least one grounded probe, this circuit board is provided with most signal lines and ground path, be provided with at least one this ground path with the adjacent specific spacing of this signal line respectively, those signal lines are provided with transmitting the test signal of this tester table, those ground paths electrically conduct to the zero potential point of this tester table, have to prevent that external noise from disturbing the electrical protective action of this signal line, and as the characteristic impedance reference data of this signal line respectively; Those transmission lines are located on this circuit board, respectively this transmission line has one first and one second lead, this first and 1 second lead made metal wire and adjacent specific spacing of metal material that be tool electric conductivity respectively, the two ends of this first lead electrically connect this signal line and this signal probe respectively, and this second lead is for electrically connecting this ground path; It is made that those signal probes and grounded probe are all the metal material with suitable hardness and electric conductivity, and an end is all in order to be located on the circuit board, and the other end is in order to the conductive projection of contact measured electronic component.

Description of drawings

Below, cooperate diagram to enumerate some preferred embodiments now, in order to structure of the present invention and effect are elaborated, wherein used illustrated brief description is as follows:

Fig. 1 is the top view of first preferred embodiment provided by the present invention;

Fig. 2 is the backplan of above-mentioned first preferred embodiment;

Fig. 3 is the structural representation of above-mentioned first preferred embodiment;

Fig. 4 is the structural representation of above-mentioned first transmission line that preferred embodiment provides;

Fig. 5 is the signal frequency response measurement figure of above-mentioned first transmission line that preferred embodiment provides;

Fig. 6 is the transmission line structure synoptic diagram of second preferred embodiment provided by the present invention;

Fig. 7 is the transmission line structure synoptic diagram of the 3rd preferred embodiment provided by the present invention;

Fig. 8 is the transmission line structure synoptic diagram of the 4th preferred embodiment provided by the present invention;

Fig. 9 is the structural representation of the 5th preferred embodiment provided by the present invention;

Figure 10 is the structural representation of the 6th preferred embodiment provided by the present invention;

Figure 11 is the structural representation of the 7th preferred embodiment provided by the present invention;

Figure 12 is the probe top view of existing cantalever type probe;

Figure 13 is the probe card configuration synoptic diagram of existing vertical probe.

[main element symbol description]

1,2,3,4 probe

10,60 circuit boards, 101 upper surfaces

102 lower surfaces, 103,601 test sections

104,602 jumper zones, 105,106 solder joints

105a, 106a

signal solder joint

105b, 106b ground connection solder joint

11 signal lines, 12 ground paths

20,23,70 probe bases, 21,231,74 ground planes

22,230 set collars, 23 breach

30,34,36,38 transmission lines, 31 first leads

311,321,411 claddings, 312,322 first ends

313,323 second ends, 32 second leads

33,35,43 sleeve pipes, 37 adhesions

40 high frequency probes, 41,81 signal probes

410,500,811,821 needle points

42,13 ground wires, 50,82 grounded probes

S11 reflection consume curve

S21 inserts the consume curve

603 probe region, 701 notches

702 bottom lands, 71 walls

72 bases, 720 through holes

73 insulation courses, 80 probe groups

810,820 terminal 83 stators

5 vertical probe carb 5a circuit boards

5b space convertor 5c probe

6 probe heads, 7 wafers

Embodiment

See also Fig. 1 to first preferred embodiment provided by the present invention shown in Figure 3, it is a probe 1 in order to the high frequency measurement, include a circuit board 10, one probe base 20, a most transmission line 30, a most high frequency probe 40 and most grounded probes 50, these circuit board 10 definables go out relative a upper surface 101 and a lower surface 102, an and jumper zone 104 of a test section 103 of outer ring and inner ring, be laid with electronic circuit on this circuit board 10, on this jumper zone 104, lower surface 101, be respectively equipped with most metal solder joints 105 on 102,106, electronic circuit is electrically connected to a tester table (not shown) in the test section 103 of this upper surface 101, the exportable high frequency measurement signal of this tester table is to this probe 1, the solder joint 105 of this upper surface 101 electrically connects with those transmission lines 30, and directly electrically conduct with the solder joint 106 of lower surface 102, the solder joint 106 of this lower surface 102 is in order to electrically connect those

probes

40,50, wherein:

Please cooperate Fig. 1 reference, the electronic circuit of this circuit board 10 is that most signal lines 11 and ground path 12 are arranged, in these upper surface 101 test sections 103 respectively this ground path 12 for being surrounded on this signal line 11 adjacent specific spacings, those signal lines 11 are provided with transmitting the test signal of this tester table, those ground paths 12 electrically conduct to the zero potential point of this tester table, have and prevent that external noise from disturbing the electrical protective action of this signal line 11, and as the characteristic impedance reference data of this signal line 11 respectively, please cooperate Fig. 3 reference in addition, this ground path 12 has coplanar lead and lays in these circuit board 10 build-in test districts 103, and be located at this adjacent with it specific spacing in signal line 11 belows, this signal line 11 and ground path 12 promptly electrically conduct to the solder joint 106 of lower surface 102 in order to the solder joint 105 direct forwards with upper surface 101 in these circuit board 10 interior jumper zones 104.

See also this probe base 20 as shown in Figures 2 and 3, be jumper zone 104 inboards that are arranged at these circuit board 10 lower surfaces 102, have a ground plane 21 and a set collar 22, the metal material that this ground plane 21 is a tool electric conductivity is made, be located at the metal flat that forms ring-type on this circuit board 10, this set collar 22 is located on this ground plane 21, in order to set firmly respectively this

probe

40,50 body portion, and make probe 40, expose in the annular breach 23 of this set collar 22 at 50 needle point position, this set collar 22 is made for the material with insulation and shock-resistance features, as the epoxide resin material that present embodiment provided.

See also respectively this transmission line 30 as shown in Figure 3, be to electrically connect in these test section 103 inner edges and electronic circuit, and extend and lay to this jumper zone 104 and those solder joint 105 corresponding electric connections, has one first and one

second lead

31,32, be the made metal wire of the metal material of tool electric conductivity, this lead 31 respectively, vertically outer ring has a cladding 311 on 32,321, be the made insulating sleeve of the material with good insulation characteristic, outermost layer also has a sleeve pipe 33 in order to fixing respectively this

lead

31,32, this lead 31 respectively, 32 two ends can define one first end 312 respectively, 322 and 1 second end 313,323, two ends 312 of this first lead 31 respectively, 313 electrically connect the signal line 11 and a signal solder joint 105a of this test section 103, respectively two ends 322 of this second lead 32 respectively, 323 electrically connect the ground path 12 and a ground connection solder joint 105b of this jumper zone 104 respectively; Please cooperate Fig. 4 reference in addition; respectively this cladding 311,321 not only can be respectively in order to protection respectively this

lead

31,32 avoid oxidation, pollute or damaged; and by the specific thicknesses that exists by this cladding 311,321 respectively; make this sleeve pipe 33 surround two these leads and can keep mutual next-door neighbour and parallel at 31,32 o'clock, respectively the adjacent spacing of this

lead

31,32 is the thickness of two these claddings 311,321.

See also respectively this high frequency probe 40 as shown in Figures 2 and 3, has a signal probe 41, one ground wire 42 and a sleeve pipe 43, respectively this signal probe 41 is the metallic conductor with suitable hardness and electric conductivity, one end is in order to be electrically connected to the signal solder joint 106a on the circuit board 10, the other end can transmit the conductive projection of signal in order to contact measured electronic component (not shown) for its needle point 410 positions, and outer ring vertically is coated with a cladding 411, has the identical functions characteristic with the cladding 311 of above-mentioned this transmission line 30, respectively the leading portion of this signal probe 41 between 106 of this set collar 20 and solder joints for to be arranged side by side and closely to coat by this sleeve pipe 43 jointly with this ground wire 42, these ground wire 42 two ends are electrically connected to a ground connection solder joint 106b and this ground plane 21 respectively, because this signal solder joint 106a and ground connection solder joint 106b directly electrically conduct with the signal solder joint 105a and the ground connection solder joint 105b of upper surface 101 respectively, therefore this signal probe 41 can transmit electromotive signal to measured electronic elements, and 42 of this ground wires are electrical ground connection and the characteristic impedance of keeping these signal probe 41 transmission signals; Respectively this grounded probe 50 is all the metallic conductor with suitable hardness and electric conductivity, one end is in order to be electrically connected to the ground connection solder joint 106b on the circuit board 10, the other end is that its needle point 500 positions are in order to contact the ground connection conductive projection of above-mentioned electronic component, its body portion then electrically connects with this ground plane 21, all earthing potentials of this probe 1 all is formed with on this ground plane 21 connects the plane altogether.

Electronic circuit when this probe 1 test section 103 is electrically connected to above-mentioned tester table, then by transmit by this signal line 11 respectively electromotive signals to this first lead 31 then to this signal probe 41, because the contiguous setting that is combined with those ground paths 12, second lead 32 and ground wire 42 in regular turn in the signals transmission, can so effectively transmit high-frequency signal and make the characteristic of keeping impedance matching, and prevent unnecessary electrical couplings effect, make this probe 1 have splendid high frequency electrical measurement reliability; In addition since respectively this transmission line 30 be the structure of parallel double conducting wire, the characteristics of signals impedance depends primarily on two

leads

31,32 neighbor distance, with two these claddings 311 that are that present embodiment was provided, 321 thickness, can keep two these leads 31, between 32 less than 1 mm clearance, but can make the characteristic impedance of this first lead 31 be controlled in standard specification as required 50 to 75 nurses difficult to understand of conventional coaxial transmission, and needn't be as being subject to the dielectric property of the material that insulate around the inner concentric conductor as the conventional coaxial transmission, use has the insulation material of several millimeters thickness, please cooperate Fig. 5 reference, the frequency characteristic curve diagram of this transmission line 30 is provided for present embodiment, the reflection of this transmission line 30 consume (return loss) curve S 11 all has extremely low reflection consume from 100MHz tremendously high frequency ghz band among the figure, show that it has splendid impedance matching property in high band, the insertion of this transmission line 30 consume (insertionloss) curve S 21 shows that more this transmission line 30 may be up to 1.2GHz in passband (passband) limit frequency of-3dB gain among the figure, has good high-frequency signal transmission quality, so make this probe 1 not only have low-loss at the carry high frequency electromotive signal, mate good characteristic, and respectively this transmission line 30 is the line footpath less than a millimeter, on this jumper zone 104, majority can be set but the transmission line 30 of low spatial density is done the detection of a large amount of electronic components for transmitting high-frequency signal, more can effectively avoid the degree of difficulty of wire jumper modular engineering so that reduce the circuit quality of probe 1.

Because the structure that transmission line provided by the present invention is mainly with two-conductor line makes the quality of lifting signal transmission and the space of reduction transmission line that density is set, therefore the structure kenel of two-conductor line also can be as Fig. 6 to shown in Figure 8, be respectively the

transmission line

34,36,38 that the present invention second, third and the 4th preferred embodiment are provided, wherein:

Fig. 6 reference, the cladding 311 that this transmission line 34 has this first and 1

second lead

31,32 and coats this first lead 31, outermost layer is to be surrounded by a sleeve pipe 35, can keep two these

leads

31,32 next-door neighbour and parallel mutually equally, respectively the adjacent spacing of this

lead

31,32 then only is the thickness of this cladding 311, so the characteristic impedance of these first lead, 31 transmission high-frequency signals of may command is the standard specification of 50 nurses difficult to understand, and more can dwindling respectively, the line of this transmission line 34 directly makes those transmission lines 34 occupy littler space density.

Fig. 7 reference, this transmission line 36 has this first and 1

second lead

31,32 and coats the respectively cladding 311,321 of this

lead

31,32, then there is an adhesion 37 to interfix between this two cladding 311,321, to keep two this leads 31,32 next-door neighbour and parallel mutually, so more can dwindle the shared space density of those transmission lines 36.

Fig. 8 reference, this transmission line 38 has this first and 1

second lead

31,32 and coats the respectively cladding 311,321 of this

lead

31,32, the twisted pair construction that this two

lead

31,32 is winding mutually is to keep mutual next-door neighbour, respectively the adjacent spacing of this

lead

31,32 is the thickness of two these claddings 311,321, makes this transmission line 38 more above-mentioned first, second and third embodiment suppliers of institute occupy littler space density.

What deserves to be mentioned is, the setting of above-mentioned this probe base 20 is mainly fixes those

probes

40,50, and make this probe 1 that a common electrical grounding plane be arranged by the effect that connects altogether that is provided by ground plane 21, therefore do not limit the structure kenel of this ground plane 21, if the probe 2 that provides of the present invention's the 5th preferred embodiment as shown in Figure 9, then replacing the above-mentioned first preferable enforcement with a probe base 23 is provided, wherein this probe base 23 has a set collar 230 and a ground plane 231, this set collar 230 is directly to be located on these circuit board 10 lower surfaces 102 and with the supplier of the foregoing description institute the identical functions architectural characteristic is arranged, this ground plane 231 is for being located on the sidewall around these set collar 230 outer shrouds, electrically connect for those ground wires 42 and grounded probe 50, not only can be provided as the copline of electrical grounding equally, and because this set collar 230 is for being fixedly arranged on this circuit board 10 but not be located on this circuit board 10 for seeing through this ground plane 21 as this set collar 22 of the foregoing description, therefore there is no hardware between this set collar 230 and the circuit board 10, can avoid metal to vary with temperature the rising-heat contracting-cold effect that is taken place and make this set collar 230 be subjected to displacement phenomenon, and cause those

probes

40,50 thereupon displacement can't be accurately in order to survey an electronic component.

Other sees also the vertical probe carb 3 that the 6th preferred embodiment of the present invention is as shown in figure 10 provided, and includes a circuit board 60, a probe base 70, a probe groups 80 and those transmission lines 30, wherein:

These circuit board 60 definables go out a test section 601 of annular outer ring and a jumper zone 602 of annular inner ring, form a probe region 603 in these circuit board 60 annular breach, in order to this probe base 70 to be set, these circuit board 60 test sections 601 are to have those signal lines 11 and ground path 12 equally with above-mentioned first preferred embodiment supplier of institute, and respectively with first and 1 second lead 31 of this transmission line 30 respectively, 32 electrically connect, the different person of institute electrically connects this ground path 12 for more being provided with a plurality of ground wires 13 on this circuit board 60, and those transmission lines 30 and ground wire 13 are connected on this probe base 70 to jumper zone 602 extension settings then for self-test district 601.

This probe base 70 is for being located at a cell body of these circuit board 60 central annular breach, its notch 701 upwards can extend into for those transmission lines 30 and ground wire 13, have along encircling a set wall 71 and a base 72 that constitutes its bottom land 702 in this circuit board 60, an insulation course 73 and a ground plane 74 have been stacked on this base 72 in regular turn, it is made that this wall 71 and ground plane 74 are all the metal material of tool electric conductivity, it is made that this base 72 and insulation course 73 are all the material of tool good insulation characteristic, this base 72 is provided with most through holes 720, each through hole 720 sizes for the line that is equivalent to respectively this first lead 31 and is coated with this clad 311 with it directly, respectively this first lead 31 together with its clad 311 pass this ground plane 74 extend in the insulation course 73 and respectively this first lead 31 pass through hole 720 backs and expose in this bottom land 702, those second leads 32 are for electrically connecting this ground plane 74, make end be located at this bottom land 702 after respectively this ground wire 13 is electrically connected to this ground plane 74 and passes through to this insulation course 73 and expose, so the bottom land 702 of this probe base 70 promptly there be first lead 31 and the ground wire 13 that exposes in those through holes 720.

This probe groups 80 is located on the bottom land 702 of this probe base 70, have most signal probes 81 and grounded probe 82, for having the metallic conductor of suitable hardness and electric conductivity, this probe 81 respectively, the 82nd, be arranged on two stators 83 and form vertical, the material that this two stator 83 is a tool good insulation characteristic is made, make the end 810 of this signal probe 81 respectively in this through hole 720, correspond to this first lead 31 and electric connection, respectively the end 820 of this grounded probe 82 in this through hole 720, correspond to this ground wire 13 and electric connection, and this probe 81 respectively, 82 needle point 811,821 expose and can touch measured electronic elements in order to point.

Therefore this probe 3 is directly to transmit electromotive signal to signal probe 81 contact measured electronic components with those transmission lines 30, there is no as the circuit board 10 of above-mentioned embodiment in the set solder joint 105 of jumper zone 104,106, make electromotive signal need vertically just to reach on the high frequency probe 40 by this circuit board 10, therefore the reflection consume situation that can avoid high-frequency signal to transmit contingent dielectric consume or do not match and take place because of impedance at circuit board 60 internal layers, make this probe 3 not only have low-density that those transmission lines 30 of space and high-quality transmission are set equally, the characteristic impedance that more can keep high-frequency signal transmission is to obtain better electrical measurement reliability.

The connection that the ground connection equipotential plane that this probe base 70 is provided in certain above-mentioned this probe 3 is not limited to this ground plane 74 is provided with structure, also can be as shown in figure 11, a probe 4 that is provided for the present invention's the 7th preferred embodiment, utilize this wall 71 as the electrical grounding copline in above-mentioned this probe 3 for the setting of directly saving this ground plane 74, make those second leads 32 and ground wire 13 electrically connect this wall 71, and this wall 71 directly electrically connected the have the present invention equally effect desiring to reach with this grounded probe 82 respectively.

Only, the above only is a preferable possible embodiments of the present invention, changes so use the equivalent structure that instructions of the present invention and claim do such as, ought to be included in the claim of the present invention.

Claims

1. high frequency probe card is characterized in that including:

One circuit board is to be laid with most signal lines and ground path, is provided with at least one this ground path with the spacing that respectively this signal line is adjacent, and those ground paths electrically conduct to zero potential point;

Most transmission lines, be located on this circuit board, respectively this transmission line has one first and one second lead, this first and second lead made metal wire of metal material that is tool electric conductivity respectively, respectively this first and second lead be adjacent specific between apart from and electrically connect this signal line and this ground path respectively; And

A most signal probe and at least one grounded probe, the metal material that is all tool electric conductivity is made, and respectively this signal probe is to electrically connect this first lead, and respectively this grounded probe is to electrically conduct to zero potential point.

2. according to the described high frequency probe card of claim 1, it is characterized in that, described this circuit board defines relative a upper surface and a lower surface, and be surrounded on a test section of outer ring and be surrounded on a jumper zone of inner ring, in the test section of this upper surface respectively this ground path for be surrounded on this signal line adjacent specific between distance.

3. according to the described high frequency probe card of claim 2, it is characterized in that, be respectively equipped with most metal solder joints on the upper and lower surface of described this jumper zone, those solder joints are divided into most signal solder joints and ground connection solder joint, respectively this signal solder joint of this upper surface and ground connection solder joint are respectively by this signal line and this ground path forward conduction this signal solder joint and this ground connection solder joint to lower surface, respectively this signal solder joint of this upper surface and this first lead electrically connect, and respectively this signal solder joint of this lower surface and this signal probe electrically connect.

4. according to the described high frequency probe card of claim 1, it is characterized in that, described this circuit board is provided with a probe base, be provided with being provided with respectively this signal probe and grounded probe, this probe base has a ground plane, made for the metal material of tool electric conductivity, respectively this grounded probe is to electrically connect this ground plane.

5. according to the described high frequency probe card of claim 4, it is characterized in that described respectively this signal probe has been arranged side by side a ground wire, this ground wire is to electrically connect this ground path and this ground plane.

6. according to the described high frequency probe card of claim 5, it is characterized in that, described respectively this signal probe outer ring vertically is coated with a cladding, and this cladding is that to have the material of good insulation characteristic made, and the adjacent spacing of this signal probe and this ground wire is the thickness of this cladding tube wall.

7. according to the described high frequency probe card of claim 4, it is characterized in that, described this probe base has a set collar, in order to set firmly the respectively body portion of this grounded probe and signal probe, and the needle point position of this grounded probe and signal probe is exposed in the annular breach of this set collar, this set collar is that to have a material of insulation and shock-resistance features made.

8. according to the described high frequency probe card of claim 7, it is characterized in that described this set collar is located on this circuit board, this ground plane is to be located on this set collar outer shroud sidewall on every side.

9. according to the described high frequency probe card of claim 1, it is characterized in that, described this circuit board is a loop configuration, be provided with the cell body that a probe base is constituted in the annular breach, this probe base has a bottom land and a notch, a base that constitutes this bottom land is provided with an insulation course, it is made that this base and insulation course are all the material of tool good insulation characteristic, those transmission lines are arranged in this probe base from extending to this notch on this circuit board, and respectively this first lead passes this insulation course and this base exposes from this bottom land.

10. according to the described high frequency probe card of claim 9, it is characterized in that described respectively this signal probe is located at this bottom land and is joined with this first lead.

11. according to the described high frequency probe card of claim 10, it is characterized in that, more be provided with at least one ground wire on described this circuit board and electrically connect this ground path, this ground wire is the made metal wire of the metal material of tool electric conductivity, this ground wire is arranged in this probe base from extending to this notch on this circuit board, and passes this insulation course and this base exposes from this bottom land.

12., it is characterized in that described this insulation course is provided with a ground plane according to the described high frequency probe card of claim 11, made for the metal material of tool electric conductivity, respectively this second lead and this ground wire are to electrically connect with this ground plane.

13., it is characterized in that described respectively this grounded probe is located at this bottom land and is joined with this ground wire according to the described high frequency probe card of claim 12.

14. according to the described high frequency probe card of claim 10, it is characterized in that, described this probe base has a wall, set on every side along what encircle in this circuit board, this wall is that the metal material of tool electric conductivity is made, respectively this second lead is arranged on this wall and electrically connects with it, and respectively this grounded probe electrically connects this wall.

15., it is characterized in that described transmission line includes according to the described high frequency probe card of claim 1:

At least one cladding, for not having the made tubulose body of insulation material of electric conductivity, this at least one cladding is along this first lead of axial coating of this first lead.

16., it is characterized in that the internal diameter of at least one cladding of described transmission line is the line footpath of this first lead according to the described high frequency probe card of claim 15.

17., it is characterized in that the adjacent spacing of described this first and second lead is the thickness of this at least one cladding tube wall according to the described high frequency probe card of claim 16.

18., it is characterized in that the adjacent spacing of described this first and second lead is less than crack between 1 millimeter according to the described high frequency probe card of claim 15.

19., it is characterized in that described transmission line has two these claddings according to the described high frequency probe card of claim 15, coat this first and second lead respectively, this two cladding is next-door neighbour's contact mutually.

20., it is characterized in that described transmission line has a sleeve pipe according to the described high frequency probe card of claim 15, along it this first and second lead be set axially in this sleeve pipe.

21., it is characterized in that the internal diameter of described this sleeve pipe is the line summation directly of external diameter and this second lead of this at least one cladding according to the described high frequency probe card of claim 20.