CN116223866A

CN116223866A - Modularized probe card and manufacturing method thereof

Info

Publication number: CN116223866A
Application number: CN202310517880.9A
Authority: CN
Inventors: 梁建; 罗雄科
Original assignee: Shanghai Zenfocus Semi Tech Co ltd
Current assignee: Shanghai Zenfocus Semi Tech Co ltd
Priority date: 2023-05-10
Filing date: 2023-05-10
Publication date: 2023-06-06
Anticipated expiration: 2043-05-10
Also published as: CN116223866B

Abstract

The application provides a probe card and a manufacturing method thereof, which are applied to the technical field of semiconductor test, wherein the probe card comprises: the device comprises a printed circuit board, a substrate, a socket, a probe and a reinforcement; the base plate includes a plurality of base plate modules, and the socket includes a plurality of socket modules, and the reinforcement is provided with socket module's mounting groove and base plate module's mounting hole respectively, and base plate module and socket module set up on the reinforcement in one-to-one correspondence, and the probe is installed on base plate module, and the reinforcement is installed on the printed circuit board. The substrate and the socket of the probe card are arranged in a modularized manner, the assembly is completed through the reinforcing member, the position degree and the flatness of the probe card are better controlled, the probe welding difficulty is reduced, the probe welding efficiency and the yield are improved, the probe card production efficiency can be improved, the production yield of the probe card can be improved, the maintenance difficulty and the cost of the probe card are reduced, and the substrate module and the socket module can be replaced singly.

Description

Modularized probe card and manufacturing method thereof

Technical Field

The application relates to the technical field of semiconductor testing, in particular to a modularized probe card and a manufacturing method of the probe card.

Background

In wafer testing, a wafer to be tested is placed on a wafer carrying table, and a tester is in contact with the wafer through probes of a probe card to realize electrical connection, wherein the probe card for wafer testing mainly comprises a printed circuit board (Printed Circuit Boards, a PCB), a socket, a substrate, probes and the like, the probes are welded on the substrate, and tips of the probes face downwards vertically and are in contact with corresponding test pads on the wafer to realize electrical performance testing.

In the current 12-inch wafer, there are usually hundreds to thousands or even thousands of chips to be tested, and the test pad of each chip is very many, so the number of probes in one probe card is tens of thousands or hundreds of thousands; and, the pitch of adjacent test pads on the chip is extremely small (for example, generally less than 60 μm), and correspondingly, the pitch of adjacent probes in the probe card is also extremely small, at this time, the difficulty of soldering the probes onto the substrate is extremely high, the soldering speed is low, and the yield cannot be ensured.

Disclosure of Invention

In view of this, the embodiments of the present disclosure provide a modularized probe card and a method for manufacturing the probe card, which can reduce the probe soldering difficulty in the probe card, improve the probe soldering efficiency and yield, and improve the production efficiency and yield of the probe card, and are also beneficial to the maintenance of the probe card.

The embodiment of the specification provides the following technical scheme:

the embodiment of the specification provides a modularized probe card, which comprises a printed circuit board, a socket, a substrate and probes, wherein the substrate comprises a plurality of substrate modules, the socket comprises a plurality of socket modules, the substrate modules are in one-to-one correspondence with the socket modules, and each substrate module corresponds to a plurality of chips on a wafer to be tested respectively so that the chips on the wafer to be tested have the corresponding substrate modules;

the modularized probe card further comprises a reinforcement, wherein the reinforcement is respectively provided with a plurality of mounting holes for mounting the substrate module and a plurality of mounting grooves for mounting the socket module, and the plurality of mounting holes for mounting the substrate module are distributed on the periphery of the mounting grooves of the socket module corresponding to the substrate module;

the first side substrate bonding pad of the substrate module is welded with a plurality of probes, and respective needle tips of the probes welded on the first side substrate bonding pad of the substrate module correspond to test bonding pads of a plurality of chips on a wafer to be tested; the socket module corresponding to the substrate module is provided with a plurality of spring pins, the first ends of the spring pins correspond to the second side substrate pads of the substrate module, and the second ends of the spring pins correspond to the PCB pads of the printed circuit board.

The embodiment of the specification provides a probe card manufacturing method, which comprises the following steps:

correspondingly welding first welding parts of a plurality of probes on a first side substrate bonding pad of a substrate module, and installing a plurality of spring pins in a socket module, wherein the substrate module corresponds to the socket module one by one, and the number of the plurality of probes corresponds to the number of the plurality of spring pins;

mounting the substrate module which belongs to the same group and is welded with the probes and the socket module which is provided with the spring pins at corresponding mounting positions on the reinforcement;

mounting the stiffener on the printed circuit board;

the probe card comprises a printed circuit board, a socket, a substrate, probes and a reinforcement; the substrate comprises a plurality of substrate modules; the socket comprises a plurality of socket modules; the substrate modules and the socket modules are in one-to-one correspondence; each substrate module corresponds to a plurality of chips on the wafer to be tested so that the chips on the wafer to be tested have the corresponding substrate modules; the reinforcement is provided with a plurality of mounting holes for mounting the substrate module and a plurality of mounting grooves for mounting the socket module, and the plurality of mounting holes for mounting the substrate module are distributed on the periphery of the mounting grooves of the socket module corresponding to the substrate module.

Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least: the substrate of the probe card is arranged in a modularization way, and the probe welding is also processed in a modularization way, so that the welding of a plurality of probes can be finished in batches; the socket of the probe card is arranged in a modularized mode, so that the socket is convenient to correspond to the substrate module, and the spring needle force can be dispersed; the reinforcement is adopted to support the substrate module and the socket module, so that the substrate module and the socket module belonging to the same group can be independently installed while the precision is improved, and can be independently replaced in subsequent use and maintenance, thereby being beneficial to repairing. Therefore, the probe card is based on a new structure, the assembly precision of the probe card cannot be guaranteed, the production efficiency of the probe card can be improved, the production yield of the probe card can be improved, and the maintenance difficulty and cost of the probe card are reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a conventional probe card and a wafer test structure;

FIG. 2a is a schematic view of the structure of an active area and a partial chip of a wafer;

FIG. 2b is a schematic view of the structure of the active area and the partial upper and lower surfaces of the substrate;

FIG. 2c is a schematic view of the structure of the active area and the partial lower surface of the socket;

FIG. 2d is a schematic view of the structure of the active area and the partial lower surface of the printed circuit board;

FIG. 3 is a schematic view of a probe card according to the present application;

FIG. 4 is a schematic view of a partial perspective view of a probe card of the present application;

FIG. 5 is a partially perspective partially enlarged schematic view of a probe card of the present application;

FIG. 6 is a schematic view of the structure of a reinforcement active area and set module hole sites in the present application;

FIG. 7 is a schematic diagram of a hole site structure of a module with a locating pin for a fastener of the present application;

FIG. 8 is a schematic diagram of a hole site structure of a module without locating pins in the fastener of the present application;

FIG. 9 is a schematic structural view of a segmented probe of the present application;

FIG. 10 is a schematic view of the structure of the probe welded to the substrate module after being fixed by the fixture;

FIG. 11 is a schematic diagram of the front and rear structure of a substrate module bonding probe of the present application;

FIG. 12 is a flow chart of a method of manufacturing a probe card of the present application;

FIG. 13 is a schematic flow chart of the method for soldering a plurality of probes onto a substrate module after the probes are fixed by a fixing jig;

FIG. 14 is a schematic view of the alignment of a substrate module fixed to a table and a probe fixed to a fixture;

FIG. 15 is a schematic flow chart of the sectional needle segment welded to the substrate module in the present application;

FIG. 16 is a schematic view of the structure of the lower needle after being soldered to the substrate module in the present application;

FIG. 17 is a schematic view of the alignment of a substrate module with a lower needle soldered thereto and an upper needle in the present application;

FIG. 18 is a schematic view of the structure of the upper needle after being welded to the substrate module in the present application;

FIG. 19 is a schematic view showing the alignment of the substrate module welded with the lower needle and the upper needle with the needle tip in the present application;

fig. 20 is a schematic view of a structure of a substrate module to which a lower needle, an upper needle, and a needle tip are welded in the present application.

Detailed Description

Embodiments of the present application are described in detail below with reference to the accompanying drawings.

Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.

It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.

In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details.

As shown in fig. 1, in wafer testing, a tester 1 tests a wafer 4 on a wafer carrier 3 through a probe card 2, wherein the probe card 2 generally includes a printed circuit board 21 (PCB), a socket 22, a substrate 23, a plurality of probes 24, and the like.

To complete a 12 inch wafer one-time test, i.e., the probe card contacts the wafer once to complete testing of all chips on the wafer, the substrate 23, socket 21, printed circuit board 21, etc. all need to be manufactured with reference to the dimensions of the wafer 4.

Fig. 2a is a schematic illustration of a wafer 4, the area within a solid circle is an active area of the wafer 4, each square in the active area is illustrated as a chip 401, and the solid square is a partially enlarged view within a dotted circle, in which a plurality of test pads 402 of the chip are illustrated as being arranged in a single column.

Fig. 2b is a schematic view of the substrate 23, the area in the solid circle is the effective area of the substrate 23, accordingly the size of the effective area of the substrate 23 is the same as the size of the wafer 4, the solid square from top to bottom in the drawing is the upper surface and the lower surface of the substrate part 2301 corresponding to the locally enlarged portion of the dotted circle in the substrate, respectively, wherein the lower surface of the substrate part 2301 is provided with the first substrate pad 2302, and the upper surface of the substrate part 2301 is provided with the second substrate pad 2303.

Specifically, the arrangement of the first substrate pads 2302 corresponds to the arrangement of the test pads of the wafer chips, and the arrangement of the second substrate pads 2303 corresponds to the pin header arrangement on the socket 22. Note that, the substrate portion 2301 in fig. 2b also illustrates a pad corresponding position (i.e., a position indicated by a small box, which is used to reflect a spatial position indication corresponding to a tip after the probe is soldered) of the wafer.

Fig. 2c is a schematic diagram of the socket 22, the area within the solid circle is the effective area of the socket 22, the size of the socket 22 is the same as the size of the wafer 4, the solid square frame is a schematic diagram of the socket part 2201, wherein the socket part 2201 corresponds to a grid part enlarged schematic diagram indicated by a dotted circle in the socket 22, the socket part 2201 indicates the mounting hole position 2202 of the spring pin on the socket, the spring pin is correspondingly mounted at the mounting hole position 2202, and the mounting hole positions 2202 of the upper surface and the lower surface of the socket part 2201 are the same, so that the distinction between the upper surface and the lower surface is not made.

Fig. 2d is a schematic view of a printed circuit board 21, the area within the solid circle is the active area of the printed circuit board 21, the size of the printed circuit board 21 is the same as the size of the wafer 4, the solid square is a schematic view of a PCB section 2101, wherein the PCB section 2101 corresponds to a partially enlarged schematic view of a grid indicated by the dotted circle in the printed circuit board 21, and the PCB pads 2102 on the lower surface of the PCB section 2101 are arranged corresponding to the pads of the socket (i.e. the aforementioned mounting hole positions 2202). Here, a schematic representation of the lower surface (i.e., the side facing the socket, the probe, etc.) of the printed circuit board 21 is shown.

Aiming at the requirement that the wafer is subjected to integral test at one time, in the deep research and improvement exploration of the technical schemes such as a probe card, probe welding and the like, the following is found:

because the bonding pads on the substrate are in one-to-one correspondence with the bonding pads of the wafer, after the probes are welded on the substrate, the tips of the probes can be in the same one-to-one correspondence with the bonding pads of the wafer. Specifically, the probes are welded on the bonding pads of the substrate in sequence, and in the welding process of the probes, the moment in welding is necessarily required to ensure that the coordinates of the tip of the probe can be consistent with the coordinates of the central point of the corresponding bonding pad on the wafer, or the deviation errors of the coordinates of the tip and the central point meet the precision requirement.

However, there are hundreds to thousands of chips on a wafer, and the number of test pads of each chip is very large, and the pitch between adjacent test pads on the chip is very small (for example, generally less than 60 μm), so the number of probes in a probe card can reach tens of thousands or even hundreds of thousands, and the pitch between adjacent probes in the probe card and the pitch between test pads remain the same, at this time, the difficulty of soldering the probes to the substrate is very large, the soldering speed is slow, the overall soldering precision of all the probes is difficult to improve, and the yield of the probe card cannot be guaranteed.

In addition, the current probe soldering method generally adopts a serial soldering method, for example, a probe card has 20000 probes, a first probe needs to be soldered, a second probe needs to be soldered, and so on until the last 20000 probes finish soldering, once most probes, even all probes finish soldering, the soldering of individual probes is found to be not up to standard, and then tens of other probes or hundreds of other probes need to be firstly desoldered to repair the defective probes.

Therefore, the current probe card is produced and assembled by adopting a serial welding mode, the probe welding efficiency is low, and once individual probes need to be repaired, more probes need to be firstly unwelded, and operations such as unwelded other probes need to be subjected to unwelding and the like, so that the repair difficulty is high and the cost is high.

In the search for further improvements, it was also found that: in order to complete the large-size test of the 12-inch wafer, the ceramic substrate (i.e. the substrate 23) with the same area as the 12-inch wafer must be manufactured at the same time, and the 12-inch large-size ceramic substrate has the disadvantages of complex process, low yield and high requirements on production equipment and conditions. For example, the large-sized substrate is required to have a flatness of less than 30 μm and a pad position accuracy of within + -5 μm. Therefore, a large-sized ceramic substrate with such high precision requirements is difficult to manufacture, and the overall yield is not high.

Further, in manufacturing a large-sized ceramic substrate, it has been found that: the spring pins in the socket are used for completing signal connection between the ceramic substrate and the printed circuit board (also called a PCB motherboard), but due to the fact that the probe density on the substrate is very high, the number of the spring pins is correspondingly very large, for example 20000 in the previous example, under the action of the huge number of spring pins, the ceramic substrate and the PCB motherboard are subjected to extremely high force stress, for example, the current spring pin elasticity is generally 20 g/g, and the force of all spring pins can reach 400kg. Under the force of the spring needle, the alignment capability and precision between the probe tip under the large-size ceramic substrate and the test pad of the wafer are greatly affected.

Also, the quality of the probe card can only be that without any defects, under the requirement that all chip tests can be completed by one contact with a wafer (e.g., a 12 inch wafer). Therefore, the yield of the probe card formed by a large number of small probes is only 100%, and even if the individual probes have defects, the probe card cannot contact the wafer at one time to complete the test of all chips.

Based on this, the embodiment of the present specification proposes a new probe card technical solution:

on one hand, the substrate of the probe card is divided into a plurality of substrate modules, so that each substrate module only needs to test part of chips on a wafer, the number of probes which need to be welded on each substrate module is greatly reduced, the difficulty of welding the probes on the substrate is small, the yield of probe welding is guaranteed, and even if individual probes do not reach standards, only the substrate module where the substandard probes are located needs to be repaired, and the repair difficulty and cost are very low;

the socket modules are arranged corresponding to the substrate modules, namely, the socket modules are arranged in one-to-one correspondence with the substrate modules, so that spring needle force in each socket module only acts on the corresponding substrate module, the spring needle force of the socket module is effectively dispersed, the substrate is reduced under the action of the spring needle force, and the assembly precision, the actual use precision and the reliability are improved;

in three aspects, an integrated reinforcing assembly is used in the probe card, the size of the reinforcing assembly is the same as the size of the wafer, the mounting positions corresponding to the substrate modules are arranged on the reinforcing assembly, and the mounting grooves of the socket modules are arranged, so that each substrate module can be fixed on the reinforcing assembly, and each socket module can be arranged in the mounting groove of the reinforcing assembly. Therefore, by controlling the design precision of the reinforcement assembly, such as controlling the flatness of the mounting position corresponding to the substrate module, the precision of the mounting hole, etc., the precision of the substrate module when mounted on the probe card can be improved, such as controlling the flatness and precision of the mounting groove of the socket module to one, the precision of the socket module when mounted on the probe card can be improved, and the overall precision of the probe card is ensured, for example, the socket module and the substrate module are mounted on the reinforcement, and the mounting precision is required to meet the wafer test requirement (such as within + -5 μm).

It should be noted that, similar to the illustrations in fig. 2a to 2d, the effective area of the wafer, the effective area of the substrate including all the substrate modules, the effective area of the socket including all the socket modules, the effective area of the stiffener, and the effective area of the printed circuit board are consistent.

The base plate is arranged in a modularized mode to form a plurality of base plate modules, the socket is arranged in a modularized mode to form a plurality of socket modules, and corresponding installation module positions are arranged on the reinforcing component according to the installation and use precision requirements of the base plate modules and the socket modules, so that the welding difficulty of the probe welded to the base plate is reduced, the overall yield of the probe card is improved, the spring needle force in the socket is effectively dispersed, the reliability of the base plate, the socket and the PCB motherboard is guaranteed, and the installation positions corresponding to the base plate modules and the socket modules are arranged on the reinforcing component, so that the assembly precision of the base plate modules and the socket modules can be controlled by controlling the machining precision of the reinforcing component. Therefore, the novel probe card structure is beneficial to improving the overall yield of the probe card, is also convenient for maintaining or even directly replacing the substrate module and/or the socket module, can reduce the difficulty of the production process and the control of the probe card, and is beneficial to improving the production and assembly efficiency of the probe card.

The following describes the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.

As shown in fig. 3 to 5, a modular probe card 2 provided in an embodiment of the present application includes: a printed circuit board 21, a socket 22, a substrate 23, probes 24, and a stiffener 500; the socket 22 includes a plurality of socket modules 200, the substrate 23 includes a plurality of substrate modules 300, and the substrate modules 300 and the socket modules 200 are in one-to-one correspondence, and each substrate module 300 corresponds to a plurality of chips on a wafer to be tested, so that the chips on the wafer to be tested have corresponding substrate modules, that is, each chip on the wafer has its corresponding substrate module 300, so that the test of all the chips on the wafer can be completed by performing one-time contact between the probe and a large-sized wafer (such as a 12-inch wafer).

As shown in fig. 4 to 8, the reinforcement member 500 is provided with a plurality of mounting holes 5002 for mounting the substrate module 300 and mounting grooves 5001 for mounting the socket module 200, respectively, wherein the plurality of mounting holes 5002 for mounting the substrate module 300 are distributed at the periphery of the mounting grooves 5001 of the socket module corresponding to the substrate module. As schematically shown in fig. 5, each socket module 200 is mounted in a mounting groove 5001 in the stiffener 500, and the substrate module 300 corresponding to the socket module 200 is fixed to the stiffener 500 through a mounting hole 5002 in the stiffener 500.

In practice, the stiffener 500 is used to mount the socket module 200 and the substrate module 200, wherein the stiffener 500 has a plurality of mounting slots 5001 and a plurality of mounting holes 5002, wherein one socket module 200 is mounted in one of the mounting slots 5001, and wherein one substrate module 300 is secured through at least two of the mounting holes 5002.

In one example, when the number of chips on the wafer is very large, a plurality of test traces (such as traces for electrical connection between the substrate surface contacts on the probe side and the substrate surface contacts on the socket side) corresponding to the chips on the wafer may be generally disposed on one substrate module, and the probes 24 soldered on one substrate module 300 may correspond to the plurality of chips on the wafer (such as the chips 401 illustrated in fig. 2 a). Therefore, by arranging one substrate module corresponding to a plurality of chips on the wafer, the overall design complexity of the probe card can be reduced.

For example, 1600 chips can be manufactured on a 12-inch wafer, and 200 substrate modules can be used, and each substrate module is provided with 8 test circuits and probes corresponding to the chips, and correspondingly 200 socket modules are used.

In one example, one substrate module may correspond to only one chip, so that flexibility of the design of the substrate module may be increased, and welding efficiency between the substrate module and the probe may be improved.

Accordingly, in the foregoing examples, a person skilled in the art can set the number of chips of one substrate module corresponding to a wafer according to the actual situation in the setting of the actual substrate module, which is not particularly limited herein.

Referring to fig. 2a to 2d, in the new probe card 2, a plurality of probes 24 are soldered to a first side substrate pad (e.g., a first substrate pad 2302 shown in fig. 2 b) of the substrate module 300, and tips of the probes 24 soldered to the first side substrate pad of the substrate module 300 are in one-to-one correspondence with test pads (e.g., test pads 402 shown in fig. 2 a) of a plurality of chips on a wafer to be tested;

and, the socket module 200 corresponding to the substrate module 300 is mounted with a number of pogo pins (not shown in the drawing), each of which has a first end corresponding to a second side substrate pad (e.g., the second substrate pad 2303 illustrated in fig. 2 b) of the substrate module 300, and each of which has a second end corresponding to a PCB pad (e.g., the PCB pad 2102 illustrated in fig. 2 d) of the printed circuit board.

In the probe card, the large-size substrate and the socket are correspondingly arranged into a plurality of substrate modules and a plurality of socket modules, and the substrate modules and the socket modules are in one-to-one correspondence, and probes welded by the substrate modules are in one-to-one correspondence with test pads of chips on a wafer, so that the test of all the chips can be completed by carrying out some contact on the large-size wafer.

In some embodiments, as illustrated in fig. 6 to 8, a plurality of mounting holes 5002 and a mounting groove 5001 may be marked as a set of module hole sites 5000 in the reinforcement member 500, that is, a plurality of mounting holes and mounting grooves for mounting a set of substrate modules and socket modules are marked as a set of module hole sites, and at this time, the reinforcement member may be a component obtained by integral processing according to a preset precision corresponding to each module hole site 5000.

It should be noted that, after the socket module 200 and the substrate module 300 are mounted on the stiffener 500, the mounting accuracy should meet the predetermined accuracy requirement (such as the alignment requirement between the tip of the probe and the test pad of the chip on the wafer).

For example, because the probe card is required to meet the following requirements in actual use: the bonding pads on the substrate module are in one-to-one correspondence with the testing bonding pads of the chips on the wafer, or after the probes are welded on the substrate module, the needle tips of the probes are in one-to-one correspondence with the testing bonding pads of the chips on the wafer, and the bonding pads on the upper surface of the substrate module are in one-to-one correspondence with the spring pins in the socket module, and the positions of the spring pins in the socket module are in one-to-one correspondence with the positions of the bonding pads on the lower surface of the printed circuit board. Therefore, after the probe card is assembled, the accuracy of the alignment of the probe tips of the probes with the centers of the test pads of the chips on the wafer does not cause an open circuit or a short circuit between the lower surface pads of the printed circuit board and the pogo pins in the socket module, or between the pogo pins in the socket module and the upper surface pads of the substrate module.

Therefore, the high-precision reinforcement can be obtained through integrated processing according to the precision requirements of each substrate module and socket module, the probe card with various precision meeting the requirements can be assembled based on the precision of the reinforcement, the position degree and flatness of the probe card are better controlled, the repair possibility of the probe card is reduced, and the assembly efficiency and the yield of the probe card are improved.

In some embodiments, as illustrated in fig. 7 to 8, the positions and the number of the mounting holes 5002 of the substrate module may be set and adjusted according to the mounting space of the substrate module on the stiffener, for example, the number may be 4, 6, or even 8. The mounting holes 5002 may be uniformly distributed on the outer periphery of the mounting groove 5001, or may be distributed on the outer periphery of the mounting groove 5001 in other specific shapes, and are not limited thereto.

In some embodiments, as illustrated in fig. 6 to 7, the reinforcement member 500 is further provided with pin holes 5003, wherein the pin holes 5003 are disposed around the mounting groove 5001, and these pin holes 5003 may be used to cooperate with positioning portions (not shown in the drawings) disposed on the substrate module for positioning, so that the substrate module and the corresponding socket module are assembled on the reinforcement member to achieve high-precision assembly positioning, which is beneficial for improving assembly precision and may reduce repair risk.

In some embodiments, as illustrated in fig. 4 to 8, a square groove is formed in the reinforcement member 500, that is, the mounting groove 5001 is formed as a square slot hole for placing the socket module 200, when the shape of the socket module 200 is also formed as a square column, the mounting accuracy of the socket module can be improved by matching positive and negative tolerances between the square slot hole and the square column, which is also beneficial to improving the assembly accuracy of the whole probe card.

In some embodiments, in view of the very small probe, the probe may be configured as a segmented probe, which may further enable segmented soldering of the probe segments to the substrate module in turn, in addition to improving the properties of the probe itself (e.g., machining accuracy, ease of machining, etc.). Although the sectional type welding seems to increase the processing flow, based on the sectional type welding, the precision of welding the probe onto the substrate module can be improved, the welding difficulty can be reduced, the whole welding efficiency is improved, and the whole repairing difficulty and cost are reduced.

As shown in fig. 9, the segmented probe may include three needle segments of a lower needle 2401, an upper needle 2402, and a needle tip 2403; wherein, the lower needle 2401 is in a block shape, and a first end portion (such as a lower end portion of the block shape in the schematic diagram of fig. 9) of the lower needle 2401 is provided with a first welding portion, where the first welding portion is used for welding with a first side substrate pad of the substrate module 300; a second end portion (e.g., an upper end portion of a block shape as illustrated in fig. 9) of the lower needle 2401 is provided with a second welding portion for welding with a first end welding surface (e.g., a lower end portion of a block shape as illustrated in fig. 9) of the upper needle 2402, and a second end welding surface (e.g., an upper end portion of a right column of the upper needle 2402 as illustrated in fig. 9) of the upper needle 2402 is for welding with a welding surface (e.g., a lower end portion of a column of the needle 2403 as illustrated in fig. 9) of the needle 2403.

In the implementation, the high-precision segmented needle segment bodies can be manufactured respectively, then in the process of welding the probes on the substrate module, the high-precision fixing jigs are adopted to fix the needle segment bodies to be welded respectively, so that the position distribution arrangement diagram of the welding part of the needle segment bodies to be welded is consistent with the position distribution arrangement diagram of the corresponding welding position, the welding difficulty is reduced sequentially, and the welding precision is improved.

In addition, because the volume of the probe is very small and the production and processing difficulty is very high, the probe can be produced in a sectional processing mode, the production difficulty of the MEMS process can be reduced, the process cost can be reduced, and the production yield of the probe product can be improved.

In addition, the welding difficulty of the tiny probes is very high, the distance between adjacent test pads in the test wafer corresponding to the type of probes is generally smaller than 60 microns, the flatness of the side surfaces of the probes is required to be smaller than 5 microns, otherwise, the adjacent probes can collide to cause short circuit. Therefore, the welding of the probe needs to be ensured to be kept at very high precision, so that the welding of the probe (or the segmented needle segment) can be finished through a high-precision jig, and the problems of high MEMS process cost and low yield can be solved. It should be noted that in the field of manufacturing and soldering technologies of fine probes, the segmented probes are not common, and even if the segmented probes are adopted in the prior art, the soldering scheme is not easy to be implemented, and even the accuracy after soldering cannot reach the use requirement of completing all chip tests by one-time contact of a large-size wafer (such as the current 12-inch application scenario). In the embodiment of the application, the defects of high process cost and low yield of the MEMS integrated probe are overcome through the sectional probe arrangement, and the probe card can meet the wafer test requirement through high-precision welding.

In some embodiments, in view of the position distribution pattern of the plurality of probes (or the corresponding segmented needle segment bodies) after the needle segment bodies to be soldered are fixed with high precision by using the fixing jig, the position distribution pattern corresponds to the position distribution pattern of the bonding pads in the substrate module one by one. Therefore, in the welding, an integral welding method such as laser welding or ultrasonic welding can be adopted, and further, a plurality of small probes can be welded quickly, with high precision and high reliability. Specifically, the welding mode may include at least one of the following welding modes: laser welding and ultrasonic welding.

After the fixing jig fixes the probes (or the segmented needle segment bodies), the fixed probes are distributed to be consistent with the bonding pads of the substrate module, so that the fixing jig can be a jig preset for welding, and the fixing jig is not particularly limited.

As shown in fig. 10, the following welding between the lower pins 2401 and the substrate module 300 is illustrated, first, the plurality of lower pins 2401 are fixed by the fixing jig 6 at the same time, and the position distribution pattern of the plurality of lower pins after the fixing is consistent with the position distribution pattern of the bonding pads 3001 in the substrate module 300 (or, the alignment accuracy of the two meets the preset accuracy requirement). Under the high-precision alignment between the fixed jig and the substrate module, an integral welding mode (such as laser welding, ultrasonic welding or a combined welding mode between the two modes) can be adopted, and simultaneously, a plurality of lower needle bodies are welded on the bonding pads of the substrate module, so that the welding precision is high, the welding efficiency is high, and the yield is high.

As shown in fig. 11, based on the foregoing high-precision soldering, the pad position distribution pattern of the substrate module before soldering is consistent with the probe position distribution pattern of the substrate module after soldering, so that the probe tips of the probes can be effectively guaranteed to be in one-to-one correspondence with the test pads of the chips on the wafer.

And, a plurality of substrate modules may be soldered in parallel,

the process of welding the needle segments in turn may be described in the examples of the method described below.

In summary, according to the technical scheme of each probe card provided in the embodiments of the present disclosure, on one hand, the difficulty of production and assembly of the probe card is obviously reduced, and the assembly efficiency is high; the probe card has very high yield, small repair difficulty and low cost, and the whole production cost of the probe card is low; in the three aspects, each substrate module and each socket module in the probe card can be replaced singly, the repair time of the probe card is negligible, the overall test efficiency of the probe card in the wafer test is improved, and the overall test cost can be reduced.

Based on the same inventive concept, the embodiment of the present disclosure further provides a method for manufacturing a probe card, so as to obtain a probe card with high yield, thereby being beneficial to improving the overall efficiency of the probe card when applied to wafer testing.

It should be noted that, as in the previous example of the probe card, the probe card may include a printed circuit board, a socket, a substrate, a probe, and a stiffener; wherein the substrate comprises a plurality of substrate modules; the socket comprises a plurality of socket modules; the substrate modules and the socket modules are in one-to-one correspondence; each substrate module corresponds to a plurality of chips on the wafer to be tested so that the chips on the wafer to be tested have the corresponding substrate modules; the reinforcement is provided with a plurality of mounting holes for mounting the substrate module and a plurality of mounting grooves for mounting the socket module, and the plurality of mounting holes for mounting the substrate module are distributed on the periphery of the mounting grooves of the socket module corresponding to the substrate module. The description of the specific probe card is schematically presented with reference to the foregoing description and will not be further described.

Next, a process for manufacturing a probe card will be schematically described.

As shown in fig. 12, a probe card manufacturing method may include the steps of:

step S1201, correspondingly welding first welding parts of a plurality of probes to a first side substrate bonding pad of a substrate module, and installing a plurality of spring pins in a socket module, wherein the substrate module corresponds to the socket module one by one, and the number of the plurality of probes corresponds to the number of the plurality of spring pins;

Step S1203, installing the substrate module and the socket module with spring pins on corresponding installation positions on the reinforcement member, wherein the substrate module and the socket module belong to the same group and are welded with probes;

and step S1205, mounting the reinforcement on the printed circuit board.

It should be noted that, the single probe is welded to the single substrate module, which may be a conventional welding manner, or may be a high-efficiency welding manner in which a plurality of probes are fixed simultaneously based on a jig, or even a parallel welding manner in which a plurality of substrate modules are welded simultaneously.

The spring pins to which the socket module is mounted may be through spring pins, or may be other types of spring pins, and are not limited herein.

The mounting positions may be mounting holes (i.e., mounting holes for mounting the substrate module) and mounting grooves (i.e., mounting grooves for mounting the socket module) provided in the fasteners in the probe card example described above. And, reference may be made to the foregoing examples, and the reinforcement will not be described again.

By arranging the substrate in the probe card as a plurality of substrate modules and the socket as a plurality of socket modules and arranging the mounting positions corresponding to the substrate modules and the socket modules on the reinforcement member, the modular design, the modular assembly and the like in the manufacture of the probe card are realized. Therefore, even if the number of probes is huge (such as tens of thousands or even hundreds of thousands) and the size of the probes is small (such as tens of micrometers), the welding difficulty is remarkably reduced, the repairing difficulty and the cost are also remarkably reduced, and even if the probes are used for a substrate (such as a ceramic substrate) tested on a large-size wafer (such as 12 inches), the defects of difficult manufacture, low yield, high cost and the like of the original substrate are also remarkably improved.

Therefore, the probe card manufacturing scheme can ensure the yield of the probe card, improve the production and assembly efficiency of the probe card, reduce the production difficulty of the probe card and also reduce the production cost.

In some embodiments, a plurality of probes may be simultaneously fixed by a fixing jig and then welded.

As illustrated in fig. 13, the first soldering portions of the plurality of probes are correspondingly soldered in the first side substrate pads of the substrate module, and the soldering between the probes and the substrate module can be completed by the following steps:

step S1301, fixing a plurality of probes and fixing the substrate module to the table board by using a fixing jig, and adding solder to the first soldering parts of the plurality of probes, wherein the arrangement distribution diagram formed by the first soldering parts of the plurality of probes is the same as the arrangement distribution diagram formed by the first side substrate pads of the substrate module.

Step S1302, moving the table top to enable each first side substrate bonding pad in the substrate module to correspondingly align with each first welding part of each probe;

step S1303, judging whether the alignment meets the first preset requirement, if yes, executing step S1304, if not, continuing executing step S1302;

step S1304, moving the table so that each first side substrate pad in the substrate module is correspondingly contacted with a first soldering portion of the probe;

Step S1305, judging whether the contact meets the second preset requirement, if yes, executing step S1306, otherwise, continuing executing step S1304;

step S1306, soldering is performed on the first side substrate pad and the first soldering portion after contact.

As shown in fig. 14, the substrate module 300 is fixed on the second table 600 such that the bonding pads of the substrate module 300 face downward, and the plurality of probes 24 are fixed by the fourth fixing jig 700 such that the bonding portions of the probes 24 face upward, and at this time, the bonding pads of the substrate module 300 face opposite to the bonding portions of the probes 24, wherein the bonding pad arrangement pattern of the substrate module 300 is consistent with the bonding portion arrangement pattern of the probes 24 (or the difference between the two arrangement patterns satisfies the accuracy requirement). The fourth fixture 700 may be a fixture that is provided according to the fixing requirement of the probe 24, and the fixture is not particularly limited here.

At this time, the fourth fixture 700 is not moved, and the second table 600 is moved in the horizontal direction, so that the bonding portion of the probe 24 and the bonding pad of the substrate module 300 are aligned, and if the alignment satisfies the requirement, the horizontal position adjustment of the second table 600 is stopped.

After the alignment meets the requirement, the second table top 600 is moved in the vertical direction to realize the contact between the soldering portion of the probe 24 and the bonding pad of the substrate module 300, and if the contact meets the requirement, the vertical position adjustment of the second table top 600 is stopped.

When the contact between the bonding portions of the probes 24 and the bonding pads of the substrate module 300 has satisfied the bonding requirements, the two are bonded (e.g., laser bonding, ultrasonic bonding, etc.).

The accuracy requirement conditions such as the requirement to be met for alignment and the requirement to be met for contact may be preset according to the accuracy requirement of the probe card, and are not limited herein.

Through the high accuracy alignment between mesa and the fixed tool, can realize the high accuracy welding between probe and the base plate module, improve welded yield, avoid the probe to need reprocess because of the welding is not put in place. In addition, the welding can be performed by simultaneously welding a plurality of probes, and the welding efficiency is high.

In some embodiments, for segmented probes, for example, the probes include segmented needle segments such as a lower needle body, an upper needle body, a needle tip portion, and the like, and at this time, after the needle segments are sequentially fixed by corresponding fixing jigs, each needle segment is correspondingly welded to the substrate module through high-precision alignment between the jigs and the table top.

As shown in fig. 15, when the probe is a segmented probe, wherein the segmented probe includes a lower needle body, an upper needle body, a needle tip portion, and other segmented needle segment bodies, the segmented illustration of the probe can be shown in fig. 9, and at this time, the first soldering portions of the plurality of probes are soldered in the first side substrate pad of the substrate module correspondingly, and the sequential soldering of the segmented needle segment bodies on the substrate module can be completed by the following steps:

Step S1501, fixing a plurality of lower needle bodies by using a first fixing jig, fixing the substrate module on a first table, and adding solder to a first welding portion of the lower needle bodies, wherein an arrangement distribution diagram formed by the first welding portion of each lower needle body is the same as an arrangement distribution diagram formed by a first side substrate pad of the substrate module;

in practice, the first fixture is used to fix the plurality of lower needle bodies and the first table board is used to fix the substrate module, which can be seen from the schematic of fig. 14, and will not be further described. The first fixing jig may be a jig that is set according to the fixing requirement of the lower needle body, and the setting of the jig is not particularly limited here. In addition, at this time, the bonding pad of the substrate module faces the first bonding portion of the lower needle body oppositely, for example, the bonding pad of the substrate module faces downwards and the first bonding portion of the lower needle body faces upwards, and the bonding pad arrangement pattern of the substrate module is consistent with the first bonding portion arrangement pattern of the lower needle body (or the difference between the two arrangement patterns meets the precision requirement).

Step S1502, moving the first table surface so that each first side substrate pad in the substrate module is aligned with the first soldering portion of the plurality of lower pins correspondingly.

Step S1503, judging whether the alignment meets the first alignment preset requirement, if so, executing step S1504, otherwise, continuing to execute step S1502.

Step S1504, moving the first table surface so that each first side substrate pad in the substrate module is correspondingly contacted with the first soldering portions of the plurality of lower needle bodies.

Step S1305, determining whether the contact meets the first contact preset requirement, if yes, executing step S1506, and if not, continuing to execute step S1504.

Step S1506, performing a soldering operation on the contacted first side substrate pad and the first soldering portion, and removing the first jig after soldering. The welding may be performed by applying laser, ultrasonic waves, or the like, and is not limited herein.

It should be noted that, the substrate module with the lower needle body welded thereon may refer to the schematic illustration of fig. 16, wherein the substrate module 300 is still fixed on the first table 800, the lower needle body 2401 is welded on the bonding pad of the substrate module 300, and the substrate module 300 is followed to enter the subsequent welding step.

Step S1507, fixing a plurality of upper needle bodies by using a second jig, and adding solder to the first welding surfaces of the upper needle bodies, wherein the number of the upper needle bodies is the same as the number of the lower needle bodies, and the arrangement distribution diagram formed by the second welding parts of the plurality of lower needle bodies is the same as the arrangement distribution diagram formed by the first end welding surfaces of the plurality of upper needle bodies.

Step S1508, moving the first table surface so that the second welding portions of the plurality of lower needle bodies are aligned with the first end welding surfaces of the plurality of upper needle bodies correspondingly.

Step S1509, determining whether the alignment meets the second alignment preset requirement, if yes, executing step S1510, otherwise executing step S1508. Note that, the second fixing jig 900 is used to fix the plurality of upper pins 2402, and the second welded portions of the plurality of lower pins 2401 are correspondingly aligned with the first end welding surfaces of the plurality of upper pins 2402, and the illustration in fig. 17 is not repeated.

Step S1510, moving the first table surface so that the second welding parts of the plurality of lower needle bodies are correspondingly contacted with the first end welding surfaces of the plurality of upper needle bodies.

Step S1511, determining whether the contact meets the second contact preset requirement, if yes, executing step S1512, and if not, executing step S1510.

And S1512, performing welding operation on the second welding parts of the plurality of lower needle bodies and the first end welding surfaces of the plurality of upper needle bodies after contact, and removing the second jig after welding.

It should be noted that, the substrate module welded with the lower needle body and the upper needle body can be seen in the schematic diagram of fig. 18, wherein the substrate module 300 is still fixed on the first table 800, the lower needle body 2401 is welded on the bonding pad of the substrate module 300, and the upper needle body is welded on the lower needle body, and the lower needle body and the upper needle body together follow the substrate module 300 to enter the subsequent welding step.

Step S1513, fixing a plurality of needle points by using a third jig, and adding solder to the welding parts of the needle points, wherein the number of the needle points is the same as that of the upper needle bodies, and the arrangement distribution diagram formed by the welding surfaces of the second ends of the plurality of upper needle bodies is the same as that formed by the welding parts of the plurality of needle points;

step S1514, moving the first table surface so that the second end welding surfaces of the plurality of upper needle bodies are aligned with the welding portions of the plurality of needle tip portions correspondingly. Note that, as a result of fixing the plurality of needle tip portions 2404 by the third fixing jig 1000, the welded portions of the plurality of needle tip portions 2403 are aligned with the second end welded surfaces of the plurality of upper needle bodies 2402, and the description will not be repeated with reference to the diagram of fig. 19.

Step S1515, determining that the alignment meets the third alignment preset requirement, if yes, executing step S1516, otherwise, continuing executing step S1514.

Step S1516, moving the first table surface so that the second end welding surfaces of the plurality of upper needle bodies are correspondingly contacted with the welding parts of the plurality of needle tip parts.

Step S1517, determining whether the contact meets the third contact preset requirement, if yes, executing step S1518, and if not, continuing executing step S1516.

And step S1518, performing welding operation on the welding parts of the second end welding surfaces of the plurality of upper needle bodies and the plurality of needle tips after contact, and removing the third jig after welding.

It should be noted that, the substrate module to which the probe 24 (i.e., the segmented probe including the lower needle, the upper needle, and the needle tip portion) is soldered may be referred to as a schematic diagram of fig. 20, in which the lower needle 2401 is soldered to a pad of the substrate module 300, the upper needle is soldered to the lower needle, and the needle tip portion is soldered to the upper needle.

It should be noted that, those skilled in the art should understand that the fixing operation of each sectional needle segment body by the fixing fixture may be completed by an automation device, and the execution efficiency is high, and the automation device is not limited specifically.

In some embodiments, referring to the foregoing welding process of the single substrate module and the probe, the plurality of substrate modules may be fixed on the table surface, and the clamping and fixing of the probe (or the segmented needle segment body) may be completed by adopting a plurality of corresponding fixing jigs, so that the plurality of substrate modules may be welded at the same time, the number of welding times may be significantly reduced, and the welding efficiency may be higher.

For example, in the above example of using 200 substrate modules for 1600 chips, parallel soldering of a plurality of substrate modules may be performed simultaneously, the number of soldering times of tens of thousands of probes or hundreds of thousands of probes may be drastically reduced to thousands or hundreds of times, and further, parallel soldering of 200 substrate modules may be simultaneously completed, and the number of soldering times may be drastically reduced to 200 times.

In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the description is relatively simple, and reference is made to the description of parts of the system embodiments.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The modularized probe card is characterized by comprising a printed circuit board, a socket, a substrate and probes, wherein the substrate comprises a plurality of substrate modules, the socket comprises a plurality of socket modules, the substrate modules and the socket modules are in one-to-one correspondence, and each substrate module corresponds to a plurality of chips on a wafer to be tested respectively so that the chips on the wafer to be tested have the corresponding substrate modules;

2. The modular probe card of claim 1, wherein the plurality of mounting holes and the mounting slots for mounting a set of the substrate module and the socket module in the stiffener are marked as a set of module hole sites, the stiffener being a component obtained by integral processing according to a preset precision corresponding to each of the module hole sites.

3. The modular probe card of claim 1, wherein the substrate module is provided with a locating portion, the stiffener is further provided with a pin hole, the pin hole is disposed around the mounting slot, the pin hole and the locating portion cooperate to locate the substrate module when the substrate module and the corresponding socket module are assembled to the stiffener.

4. The modular probe card of claim 1, wherein the probe is a segmented probe comprising a lower needle, an upper needle, a tip portion;

the lower needle body is in a block shape, a first welding part is arranged at the first end part of the lower needle body, and the first welding part is used for welding with a first side substrate bonding pad of the substrate module; the second end of the lower needle body is provided with a second welding part, the second welding part is used for being welded with the first end welding surface of the upper needle body, and the second end welding surface of the upper needle body is used for being welded with the welding surface of the needle tip part.

5. The modular probe card of claim 4, wherein the soldering means comprises at least one of the following soldering means: laser welding and ultrasonic welding.

6. The modular probe card of any of claims 1-5, wherein the mounting slot is a square slot and the receptacle module is shaped as a square cylinder, wherein the square slot and the square cylinder are in positive and negative tolerance fit.

7. A method of manufacturing a probe card, the method comprising:

mounting the stiffener on the printed circuit board;

8. The method of manufacturing a probe card of claim 7, wherein the probe is a segmented probe, wherein the segmented probe comprises a lower needle body, an upper needle body, and a needle tip;

correspondingly soldering the first soldering portions of the plurality of probes to the first side substrate pads of the substrate module includes:

fixing the plurality of lower needle bodies by adopting a first fixing jig, and adding solder to the first welding parts of the lower needle bodies, wherein the arrangement distribution diagram formed by the first welding parts of the lower needle bodies is the same as the arrangement distribution diagram formed by the first side substrate bonding pads of the substrate module; fixing the substrate module on a first table top, moving the first table top to enable each first side substrate bonding pad in the substrate module to be in corresponding alignment with a first welding part of the plurality of lower needle bodies, moving the first table top to enable each first side substrate bonding pad in the substrate module to be in corresponding contact with the first welding part of the plurality of lower needle bodies after alignment meets preset requirements, carrying out welding operation on the first side substrate bonding pad and the first welding part after contact, and removing a first jig after welding;

fixing a plurality of upper needle bodies by adopting a second jig, and adding solder to the first welding surfaces of the upper needle bodies, wherein the number of the upper needle bodies is the same as that of the lower needle bodies, and an arrangement distribution diagram formed by the second welding parts of the plurality of lower needle bodies is the same as that formed by the first end welding surfaces of the plurality of upper needle bodies; moving the first table top to enable the second welding parts of the plurality of lower needle bodies to correspondingly finish alignment with the first end welding surfaces of the plurality of upper needle bodies, moving the first table top to enable the second welding parts of the plurality of lower needle bodies to correspondingly contact with the first end welding surfaces of the plurality of upper needle bodies after alignment meets preset requirements, carrying out welding operation on the contacted second welding parts of the plurality of lower needle bodies and the first end welding surfaces of the plurality of upper needle bodies, and removing a second jig after welding;

Fixing a plurality of needle points by adopting a third jig, and adding solder to the welding parts of the needle points, wherein the number of the needle points is the same as that of the upper needle bodies, and the arrangement distribution diagram formed by the welding surfaces of the second ends of the plurality of upper needle bodies is the same as that formed by the welding parts of the plurality of needle points; and moving the first table top to enable the second end welding surfaces of the plurality of upper needle bodies to correspondingly finish alignment with the welding parts of the plurality of needle tips, and after alignment meets preset requirements, moving the first table top to enable the second end welding surfaces of the plurality of upper needle bodies to correspondingly contact with the welding parts of the plurality of needle tips, carrying out welding operation on the contacted second end welding surfaces of the plurality of upper needle bodies and the welding parts of the plurality of needle tips, and removing a third jig after welding.

9. The method of manufacturing a probe card of claim 7, wherein the corresponding soldering of the first solder portions of the plurality of probes to the first side substrate pads of the substrate module comprises:

fixing a plurality of probes by adopting a fourth fixing jig, and adding solder to first welding parts of the plurality of probes, wherein an arrangement distribution diagram formed by the first welding parts of the plurality of probes is the same as an arrangement distribution diagram formed by first side substrate bonding pads of a substrate module;

And after the alignment meets the preset requirement, the second table top is moved to enable each first side substrate pad in the substrate module to correspondingly contact with the first welding part of the probe, and welding is conducted on the contacted first side substrate pad and the first welding part.

10. The method of manufacturing a probe card according to any one of claims 7 to 9, wherein parallel soldering is performed for a plurality of substrate modules.