CN116699368B - Vertical probe card and manufacturing process thereof - Google Patents
Vertical probe card and manufacturing process thereof Download PDFInfo
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- CN116699368B CN116699368B CN202310919148.4A CN202310919148A CN116699368B CN 116699368 B CN116699368 B CN 116699368B CN 202310919148 A CN202310919148 A CN 202310919148A CN 116699368 B CN116699368 B CN 116699368B
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- 239000000523 sample Substances 0.000 title claims abstract description 356
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000012360 testing method Methods 0.000 claims abstract description 53
- 238000003466 welding Methods 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 51
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 230000009194 climbing Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000013461 design Methods 0.000 description 12
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
- Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The application provides a vertical probe card and a manufacturing process thereof, and relates to the technical field of semiconductor testing.
Description
Technical Field
The application relates to the technical field of semiconductor testing, in particular to a vertical probe card and a manufacturing process thereof.
Background
In the fabrication of integrated circuits and semiconductor devices, semiconductor wafers are tested for electrical performance and other system functions. The probe card is an indispensable component in the semiconductor test link, and functions to connect a wafer bump (bump) and a test apparatus during a wafer test. The contact stability of the probe on the probe card can directly influence the yield of wafer test, and the problem of poor control of the contact stability of the probe card exists in the conventional vertical probe card design nowadays.
Disclosure of Invention
In view of this, the embodiments of the present disclosure provide a vertical probe card and a manufacturing process thereof, which can improve the contact stability of the vertical probe on the vertical probe card and optimize the testing performance of the vertical probe card.
The embodiment of the specification provides the following technical scheme:
in one aspect, a vertical probe card is provided, including a PCBA board, a probe head fixing board, a chip test substrate, a probe guide fixing board, a probe guide board and a vertical probe having a deformation feeding portion, the number of the vertical probes is one or more, wherein, the PCBA board is located at the bottom, the probe head fixing board is fixed on the PCBA board, the probe head fixing board has a first through hole, the chip test substrate is fixed on the PCBA board and located in the first through hole, a mounting groove is provided on the upper portion of the probe head fixing board along the upper outer circumferential direction of the first through hole, the probe guide fixing board is fixed on the bottom surface of the mounting groove, the probe guide fixing board has a second through hole, the lower end of the vertical probe is welded to the chip test substrate, the upper end of the vertical probe passes through the probe guide board and is clamped and positioned by the probe guide board, and the two ends of the probe guide board are fixedly connected with the probe guide board.
In some embodiments, the bottom surface of the chip test substrate is mounted on the PCBA board in a ball-plating manner, and the lower end of the vertical probe is soldered on the top surface of the chip test substrate in a ball-plating manner, a soldering manner at the tail of the probe, or a soldering manner at the substrate.
In some embodiments, the probe head fixing plate is fixed to the upper surface of the PCBA plate through screws at two ends; the probe guide plate is fixed on the upper surface of the probe guide plate fixing plate through screws at two ends.
In some embodiments, the probe guide includes an upper portion having an upper layer via through which the vertical probe passes and a lower portion having a lower layer via through which the vertical probe passes, the lower layer via having a size greater than the upper layer via.
In some embodiments, the probe guide fixing plate is provided with a positioning pin hole, the lower layer part of the probe guide is provided with a lower layer alignment hole, the upper layer part of the probe guide is provided with an upper layer alignment hole, and alignment between the positioning pin hole and the lower layer alignment hole or between the positioning pin hole and the upper layer alignment hole is realized through a positioning pin.
In some embodiments, the vertical probe has a plurality of deformed feedback portions formed in a wave shape, and the tip of the vertical probe is a flat tip or a pointed tip.
In another aspect, a process for manufacturing a vertical probe card is provided, comprising:
s1: the method comprises the steps of planting balls on the top surface of a chip test substrate, and tin printing or tin dipping on the tail part of a vertical probe of the chip test substrate, so as to prepare for subsequent welding of the vertical probe;
s2: the bottom surface of the chip test substrate is arranged on a PCBA board in a ball-planting welding mode;
s3: fixing a probe head fixing plate with a first through hole on the PCBA board, and enabling the chip testing substrate to be located in the first through hole;
s4: soldering the lower ends of one or more vertical probes on the top surface of the chip test substrate;
s5: a probe guide plate fixing plate is fixedly arranged on the upper part of the probe head fixing plate and the bottom surface of a mounting groove extending along the outer circumferential direction of the upper part of the first through hole;
s6: and fixing two ends of a probe guide plate on the probe guide plate fixing plate, and enabling the upper end of the vertical probe to penetrate through the probe guide plate and be clamped and positioned through the probe guide plate.
In some embodiments, in the step S4, a welding process of the lower end of the vertical probe is completed using a laser welding apparatus, which specifically includes:
placing the vertical probes in a balance needle box according to the fixed interval requirement;
placing the balance needle box on a displacement platform of welding equipment, sucking the vertical probe out of the balance needle box through a needle taking suction nozzle, and reaching the position of a probe inspection camera;
checking whether the vertical probe is qualified or not by using a vision system, and throwing materials to a waste box if the vertical probe is unqualified;
moving the probe suction nozzle to a vertical probe connection position, clamping the qualified vertical probe by using a probe clamping jaw, and loosening the probe suction nozzle;
performing secondary inspection on the qualified vertical probes in the clamping state to determine the vertical probes to be welded;
adjusting a vertical probe to be welded to a preset welding angle;
confirming the position of the bonding pad through the vision system again according to the compensated coordinate information of the bonding pad of the substrate, and then moving the vertical probe to be welded to the position of the bonding pad of the needle to be welded;
moving the laser head to a welding area through a motion mechanism, starting the laser to melt the solder balls, and simultaneously moving down the probe clamping jaw to ensure the height of the welding needle;
and checking the tin climbing height of the welding point by the vision system to confirm whether the welding is good, and loosening the probe clamping jaw after confirming that the welding is good so as to finish the welding.
In some embodiments, in the step S6, alignment operation of the alignment pin hole on the probe guide fixing plate with the lower alignment hole of the lower portion of the probe guide or the upper alignment hole of the upper portion of the probe guide is performed by a positioning pin.
In some embodiments, the vertical probe has a plurality of deformed feedback portions formed in a wave shape, and the tip of the vertical probe is a flat tip or a pointed tip.
Compared with the prior art, the beneficial effects that above-mentioned technical scheme that this description embodiment adopted can reach include at least:
firstly, the lower ends of the vertical probes and the chip test substrate are fixed in a welding mode, so that the problem of unstable contact caused by direct hard contact of a traditional probe card can be effectively solved, the problem of deviation of the position degree caused by integral alignment of the probe card can be effectively solved after the lower ends are restrained by welding, the accurate alignment of the probe welding equipment is relied on, more accurate position degree can be provided for the vertical probes, and meanwhile, the probe welding equipment can adjust the welding height of the vertical probes according to the flatness of the chip test substrate so as to optimize the flatness of the installed probe card;
secondly, compared with the traditional vertical probe card design which needs 2-3 layers of guide plates to ensure the probe positions, the vertical probe adopted by the application has the deformation feeding design with a plurality of wavy structures, so that the probe position degree can be restrained by only providing one layer of guide plate for the needle point part, and the manufacturing cost is greatly saved; and the arrangement of the vertical probe can provide a vertical downward deformation direction and enough deformation feeding space, so that the problem of short circuit or unstable contact caused by inconsistent deformation directions of the traditional linear probe is avoided, and the force applied by the needle point is ensured to be effectively transferred to the needle tail to achieve better contact stability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an exploded structure of a vertical probe card according to an embodiment of the present application;
FIG. 2 is a side view of a vertical probe card provided by an embodiment of the application;
FIG. 3 is a schematic view of a vertical probe structure according to an embodiment of the present application;
fig. 4 is a schematic diagram of a vertical probe card manufacturing process according to an embodiment of the application.
Detailed Description
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present application may be practiced without these specific details.
The following describes the technical scheme provided by each embodiment of the present application with reference to the accompanying drawings.
As shown in fig. 1 and 2, the vertical Probe card provided in the embodiment of the present application includes a PCBA board 1, a Probe head fixing board (fixing) 2, a chip test substrate (MLO/MLC) 3, a Probe Guide fixing board (Spacer) 4, a Probe Guide plate (Guide plate) 5, and vertical probes (probes) 6 having a deformation feeder 61, and the number of the vertical probes 6 may be one or more. Wherein, PCBA board 1 is located the bottom, probe head fixed plate 2 is fixed in on PCBA board 1, probe head fixed plate 2 has first through-hole 21, chip test base plate 3 is fixed in on PCBA board 1 and is located first through-hole 21, in the upper portion of probe head fixed plate 2, upper portion external circumference direction along first through-hole 21 extends and is equipped with mounting groove 22, probe baffle fixed plate 4 is fixed in on the bottom surface of mounting groove 22, probe baffle fixed plate 4 has second through-hole 41, the lower extreme welding of vertical probe 6 is in chip test base plate 3, the upper end of vertical probe 6 passes the probe baffle and through probe baffle 5 centre gripping location, probe baffle 5's both ends and probe baffle fixed plate 4 and probe head fixed plate 2 fixed connection.
Specifically, the PCBA board 1 is used to transmit the test substrate signal to the tester end, and plays a bearing role on other components. Because the wafer is usually produced by adopting a photolithography process, the corresponding Bump or Pad size is usually less than 100um, the space is mostly 40-200 um, the array arrangement is realized, the probe arrangement of the vertical probes 6 is completely consistent with the wafer contact arrangement, and meanwhile, the processing process of the PCBA board 1 cannot meet the requirements, and at the moment, a chip test substrate 3 is required to be additionally arranged between the vertical probes 6 and the PCBA board 1 for space conversion.
In some embodiments, the chip test substrate 3 may employ MLO (Multi-Layer Organic) or MLC (Multi-Layer Ceramic) as a medium for signal transmission between the vertical probe 6 and the PCBA board 1, and the MLO/MLC is preferably soldered on the PCBA board by reflow soldering.
In addition, preferably, the bottom surface of the chip test substrate 3 may be mounted on the PCBA board 1 in a ball-plating manner, and the lower end of the vertical probe 6 may be soldered on the top surface of the chip test substrate 3 in a ball-plating manner, a probe tail soldering manner, or a substrate soldering manner.
The lower end of the vertical probe 6 and the chip test substrate 3 are welded by laser, so that the problem of unstable contact caused by direct hard contact of a traditional probe card can be effectively solved, the problem of deviation of the position degree caused by integral alignment of the probe card can be effectively solved after the lower end is welded and restrained, the accurate alignment of the probe welding equipment is relied on, more accurate position degree can be provided for the vertical probe 6, and meanwhile, the probe welding equipment can adjust the welding height of the vertical probe 6 according to the flatness of the chip test substrate 3 so as to optimize the flatness of the installed probe card.
The probe head fixing plate (fixing) 2 is used for fixing the probe guide plate 5 through the probe guide plate fixing plate 4, so that the upper end of the vertical probe 6 is fixed, and meanwhile, the relative position between the probe head fixing plate 2 and the PCBA board 1 can be adjusted by means of a vision system (such as an image measuring device), so that the positions of the through holes (such as an upper layer through hole and a lower layer through hole which are described below) formed in the probe guide plate 5 are in one-to-one correspondence with the positions of the bonding pads of the substrate. Preferably, the probe head fixing plate 2 is fixed to the upper surface of the PCBA board 1 by two end screws 71, 72; the probe guide 5 and the probe guide fixing plate 4 are fixed to the upper surface of the probe head fixing plate 2 by screws 81 and 82 at both ends. It is also preferable that one or more positioning pin holes (not shown in the figure) are provided on the probe guide plate fixing plate 4, and one or more alignment holes corresponding to the positioning pin holes are provided on the probe guide plate 5, so that the probe guide plate fixing plate 4 and the probe guide plate 5 can be accurately and rapidly positioned by the corresponding positioning pins.
A vertical probe (probe) 6 is used to interface the chip test substrate 3 with the contacts of the chip to be tested. Preferably, the vertical probe 6 has a plurality of deformed feedback portions 61 formed in a wave shape, and the tip 62 of the vertical probe 6 may be either a flat tip or a pointed tip, as shown in fig. 3, which illustrates three alternative exemplary embodiments. It is also preferable that the probe shaft of the vertical probe 6 is provided with a plurality of wavy flat structures to further optimize the deformation feeding space. Compared with the traditional linear probe design, the vertical probe with the structure can effectively reduce friction between the vertical probe 6 and a ceramic guide plate (chip test substrate 3) in the pressing force application process, and can provide a vertical downward deformation direction and enough deformation feeding space for the vertical probe 6 so as to ensure that the force applied by a needle point can be effectively transferred to a needle tail to achieve better contact stability. Different from traditional probe design mainly relies on bending deformation (and deformation is very limited and deformation direction is unstable and unpredictable) after the probe atress to realize, traditional probe needle body easily appears the short circuit or touch unstable problem that deformation direction is inconsistent and leads to, and the wave design of needle body can be through calculation and accurate control single needle elasticity of emulation to do not need to increase extra displacement and be used for fixed probe, restraint probe deformation direction, the elasticity that the main bending design of probe produced of probe spring source simultaneously. In addition, the conventional probe generally needs to be lengthened to reduce the probe elasticity, and the probe elasticity is solved at the moment, but the long probe can introduce extra parasitic inductance and the like, so that the high-speed performance of the probe is reduced, and the parasitic inductance introduced by the shorter probe length of the design is small, so that the high-speed test scene requirement is easier to realize.
The probe Guide plate (Guide plate) 5 is used for fixing the upper end (probe needle or needle tip position) of the vertical probe 6, so as to increase the constraint of the vertical probe 6, prevent the vertical probe 6 from lodging, deviation and other problems, and ensure that the relative position of the needle tip meets the specification requirement of the probe card. Preferably, the probe guide 5 may be a one-layer guide formed by stacking upper and lower layer portions, and includes an upper layer portion 51 and a lower layer portion 52, wherein the upper layer portion 51 has an upper layer through hole (not shown) through which the vertical probe 6 passes, the lower layer portion has a lower layer through hole (not shown) through which the vertical probe 6 passes, and the size of the lower layer through hole is larger than that of the upper layer through hole, so that the probe guide 5 is mounted with the upper end of the vertical probe 6 in an alignment process. Compared with the traditional vertical probe card design which needs 2-3 layers of guide plates to ensure the probe positions, the vertical probe 6 adopted by the application has the deformation feeding design with a plurality of wavy structures, so that the probe position degree can be restrained by only providing one layer of guide plate for the needle point part, and the manufacturing cost is greatly reduced (about 10% -20%).
Preferably, in order to achieve good alignment between the probe guide fixing plate 4 and the lower portion 52 or the upper portion 51 of the probe guide 5 during installation, the probe guide fixing plate 4 is provided with a positioning pin hole (not shown in the figure), the lower portion 52 of the probe guide 5 is provided with a lower alignment hole (not shown in the figure), the upper portion 51 of the probe guide 5 is provided with an upper alignment hole (not shown in the figure), and alignment between the positioning hole and the lower alignment hole or the upper alignment hole is achieved through a positioning pin.
Referring to fig. 4 together with fig. 1 to 3, a process for manufacturing a vertical probe card according to an embodiment of the present application includes:
s1: the vertical probe 6 is prepared for subsequent welding by the ball-planting on the top surface of the chip test substrate, the tin printing of the chip test substrate or the tin dipping of the tail part of the vertical probe. Illustratively, the top surface (C4 pad side) of the chip test substrate 3 is ball-mounted by a dedicated ball-mounting device and a steel mesh, ready for subsequent soldering of the vertical probes 6.
S2: the bottom surface of the chip test substrate 3 is mounted on the PCBA board 1 by ball-bonding. The bottom surface of the chip test substrate 3 is mounted on the PCBA board 1 in a ball-implanting Reflow manner, and the measurement ensures that the welded flatness open-short circuit test meets the index requirements.
S3: the probe head fixing plate 2 having the first through holes 21 is fixed to the PCBA board 1, and the chip test substrate 3 is positioned in the first through holes 21. Illustratively, the probe head fixing plate 2 is mounted on the PCBA board 1 through two end screws 71, 72, and the two end screws 71, 72 are fastened after the position between the probe head fixing plate 2 and the substrate bonding pad is determined through the image measuring device and the special alignment template, so as to ensure that the position deviation of the probe guide plate 5 after being mounted is as small as possible.
S4: the lower ends of one or more vertical probes 6 are soldered to the top surface of the chip test substrate 3.
Preferably, in step S4, the welding process of the lower end of the vertical probe 6 may be completed using a laser welding apparatus, specifically including the following sub-steps (not shown in the drawings):
s41: the vertical probes 6 are placed in the balance needle box according to the fixed interval requirement. Illustratively, the assembled PCBA board 1, chip test substrate 3 and probe head fixture board 2 are mounted on the fixture of an automated laser bonding needle apparatus, and then the probe alignment and bonding operation is started using the laser bonding apparatus: firstly, the vertical probes 6 which are subjected to production and processing are placed in a balance needle box according to the requirement of fixed spacing.
S42: and placing the balance needle box on a displacement platform of the welding equipment, sucking the vertical probe out of the balance needle box through a needle taking suction nozzle, and reaching the position of a probe inspection camera.
S43: and (4) checking whether the vertical probe 6 is qualified or not by using a vision system, and if the vertical probe 6 is qualified, handing over to the step (S44), and if the vertical probe is unqualified, throwing the vertical probe to a waste box. Illustratively, the vertical probe 6 may be photographed by a camera, and parameters such as the size, appearance, straightness, etc. of the vertical probe 6 will be measured in combination with a visual algorithm of the apparatus to determine whether the probe is qualified.
S44: the probe nozzle is moved to the vertical probe 6 delivery position, and the qualified vertical probe 6 is gripped by the probe gripper and released.
S45: and (5) carrying out secondary inspection on the qualified vertical probes 6 in the clamping state, and determining the vertical probes 6 to be welded, so as to ensure that the probes remain intact after being connected.
S46: the vertical probe 6 to be soldered is adjusted to a preset soldering angle, which can preferably be calculated after the inspection is completed.
S47: and confirming the position of the bonding pad through a vision system again according to the compensated coordinate information of the bonding pad of the substrate, and then moving the vertical probe to be welded to the position of the bonding pad of the needle to be welded. Illustratively, according to the compensated substrate bonding pad coordinate information in the device, the camera is used again for bonding pad position confirmation, and then the probe is moved to the position of the bonding pad of the to-be-bonded needle.
S48: and moving the laser head to a welding area through a moving mechanism, starting the laser to melt the solder balls, simultaneously moving down a probe clamping jaw to ensure the height of a welding needle, closing the laser, and cooling a welding spot to finish welding.
S49: and checking the tin climbing height of the welding point by a vision system to confirm whether the welding is good, and loosening the probe clamping jaw after confirming that the welding is good to finish the welding. Illustratively, the soldering is confirmed to be good by checking the solder climbing height of the soldering point by the camera, repeating the above steps S41 to S49 again without meeting the requirements, and after completion, releasing the probe jaws, thereby completing the single-needle soldering operation, and by repeating the probe soldering actions of steps S41 to S49 for each other vertical probe 6 until all the probe soldering is completed.
S5: the probe guide plate fixing plate 4 is fixedly mounted on the bottom surface of a mounting groove 22 provided on the upper portion of the probe head fixing plate 2 so as to extend in the upper outer circumferential direction of the first through hole 21.
S6: both ends of the probe guide 5 are fixed to the probe guide fixing plate 4, and the upper end of the vertical probe card 6 is passed through the probe guide 5 and held in place via the probe guide 5.
Preferably, in step S6, alignment operation of the positioning hole (not shown) on the probe guide fixing plate 4 with the lower alignment hole (not shown) of the lower portion 52 of the probe guide 5 or the upper alignment hole (not shown) of the upper portion 51 of the probe guide 5 is performed by a positioning pin (not shown). It is also preferred that the vertical probe 6 has a wavy deformation feeder 61, and that the tip 62 of the vertical probe 6 is a flat tip or a pointed tip.
Illustratively, in the above steps S5 and S6, the process of fixing the probe guide plate 4 and the probe guide plate 5 on the probe head fixing plate 2 and clamping and positioning the vertical probe card 6 may be implemented as follows:
firstly, aligning the probe guide plate fixing plate 4 with the probe head fixing plate 2 by using a positioning pin, and locking and fixing the probe guide plate fixing plate 4 and the probe head fixing plate 2 by using screws 71 and 72 at two ends;
then, detecting the probe head after the probe welding and the probe guide plate fixing plate 4 assembly are completed by using image measuring equipment and a positioning template, so that the position error of the tip of the vertical probe 6 after the assembly is ensured, and a small amount of displacement exceeding the specification can be corrected by manual adjustment;
then, the lower layer part 52 of the probe guide plate 5 is clamped by using special probe head assembly fixture equipment, the probe guide plate 5 is moved to be above the vertical probe 6 which is welded and assembled, and the alignment between the probe guide plate 5 and the probe guide plate fixing plate 4 is completed by using a special positioning device to match with a positioning pin hole designed on the probe guide plate fixing plate 4 and an alignment hole of the probe guide plate 5 corresponding to the positioning pin hole;
then slowly lowering the lower layer part 52 of the probe guide 5 to the height of the tip of the vertical probe 6, observing the hole position alignment condition between the tip and the probe guide 5 by using a high power microscope, ensuring that all the vertical probes 6 are aligned with the hole positions, continuing to lower the probe guide 5 to enable the probe tip to pass through the probe guide 5, and then fixing the lower layer part 52 of the probe guide 5 and the probe guide fixing plate 4 by using a locating pin, wherein the size of a lower layer through hole for passing through the vertical probe 6 is larger than that of an upper layer through hole for passing through the vertical probe 6 because the probe guide 5 is divided into an upper layer and a lower layer through hole for passing through the vertical probe 6, thereby providing enough position tolerance for initial alignment, and ensuring that the position error of all the vertical probes 6 is controlled within a preset range when the upper layer part 51 is installed;
the probe guide plate 5 and the probe guide plate fixing plate 4 are designed with corresponding positioning pin hole sites, the positioning pins are installed to push the lower layer part 52 of the probe guide plate 5 towards the appointed direction, so that all the vertical probes 6 are ensured to be positioned at one side of the hole sites of the lower layer through holes, and accurate positioning is provided for smooth installation of the upper layer part 51 of the probe guide plate 5.
In summary, the vertical probe card and the manufacturing process thereof provided by the embodiments of the present application have at least the following beneficial effects:
firstly, the lower ends of the vertical probes and the chip test substrate are fixed in a welding mode, so that the problem of unstable contact caused by direct hard contact of a traditional probe card can be effectively solved, the problem of deviation of the position degree caused by integral alignment of the probe card can be effectively solved after the lower ends are restrained by welding, the accurate alignment of the probe welding equipment is relied on, more accurate position degree can be provided for the vertical probes, and meanwhile, the probe welding equipment can adjust the welding height of the vertical probes according to the flatness of the chip test substrate so as to optimize the flatness of the installed probe card;
secondly, compared with the traditional vertical probe card design which needs 2-3 layers of guide plates to ensure the probe positions, the vertical probe adopted by the application has the deformation feeding design with a plurality of wavy structures, so that the probe position degree can be restrained by only providing one layer of guide plate for the needle point part, and the manufacturing cost is greatly saved; and the arrangement of the vertical probe can provide a vertical downward deformation direction and enough deformation feeding space, so that the problem of short circuit or unstable contact caused by inconsistent deformation directions of the traditional linear probe is avoided, and the force applied by the needle point is ensured to be effectively transferred to the needle tail to achieve better contact stability.
In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the description is relatively simple, and reference is made to the description of parts of the system embodiments.
Meanwhile, the specification uses specific words to describe the embodiments of the specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present description. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present description may be combined as suitable.
Furthermore, the order in which the elements and sequences are processed, the use of numerical letters, or other designations in the description are not intended to limit the order in which the processes and methods of the description are performed unless explicitly recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of various examples, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the present disclosure. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing processing device or mobile device.
While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present application.
Claims (7)
1. A vertical probe card is characterized by comprising a PCBA plate, a probe head fixing plate, a chip test substrate, a probe guide plate fixing plate, a probe guide plate and vertical probes with deformation feeding parts, wherein the number of the vertical probes is one or more, the vertical probes are provided with deformation feeding parts formed by a plurality of wavy flat structures, the PCBA plate is positioned at the bottom, the probe head fixing plate is fixed on the PCBA plate and is provided with a first through hole, the chip test substrate is fixed on the PCBA plate and is positioned in the first through hole, a mounting groove is arranged on the upper part of the probe head fixing plate in an extending way along the outer circumferential direction of the upper part of the first through hole,
the probe guide plate fixing plate is fixed on the bottom surface of the mounting groove, the probe guide plate fixing plate is provided with a second through hole, the lower end of the vertical probe is welded on the chip test substrate, the upper end of the vertical probe penetrates through the probe guide plate and is clamped and positioned through the probe guide plate, two ends of the probe guide plate are fixedly connected with the probe guide plate fixing plate and the probe head fixing plate, the probe guide plate comprises an upper layer part and a lower layer part, the upper layer part is provided with an upper layer through hole for the vertical probe to penetrate through, the lower layer part is provided with a lower layer through hole for the vertical probe to penetrate through, and the size of the lower layer through hole is larger than that of the upper layer through hole; the probe guide plate fixing plate is provided with a positioning pin hole, the lower layer part of the probe guide plate is provided with a lower layer alignment hole, the upper layer part of the probe guide plate is provided with an upper layer alignment hole, and alignment between the positioning pin hole and the lower layer alignment hole or between the upper layer alignment holes is realized through a positioning pin.
2. The vertical probe card of claim 1, wherein the bottom surface of the chip test substrate is mounted on the PCBA board in a ball-in-socket bonding manner, and the lower end of the vertical probe is soldered on the top surface of the chip test substrate in a ball-in-socket bonding manner, a solder-on-tail soldering manner, or a solder-on-substrate soldering manner.
3. The vertical probe card of claim 1, wherein the probe head fixing plate is fixed to the upper surface of the PCBA board by two-end screws; the probe guide plate is fixed on the upper surface of the probe guide plate fixing plate through screws at two ends.
4. A vertical probe card according to any one of claims 1 to 3, wherein the tip of the vertical probe is a flat tip or a pointed tip.
5. A process for manufacturing a vertical probe card according to any one of claims 1 to 3, comprising:
s1: the method comprises the steps of planting balls on the top surface of a chip test substrate, and tin printing or tin dipping on the tail part of a vertical probe of the chip test substrate, so as to prepare for subsequent welding of the vertical probe;
s2: the bottom surface of the chip test substrate is arranged on a PCBA board in a ball-planting welding mode;
s3: fixing a probe head fixing plate with a first through hole on the PCBA board, and enabling the chip testing substrate to be located in the first through hole;
s4: welding the lower ends of one or more vertical probes on the top surface of the chip test substrate, wherein the vertical probes are provided with deformation feeding parts formed by a plurality of wavy flat structures;
s5: a probe guide plate fixing plate is fixedly arranged on the upper part of the probe head fixing plate and the bottom surface of a mounting groove extending along the outer circumferential direction of the upper part of the first through hole;
s6: and fixing the two ends of the probe guide plate on the probe guide plate fixing plate, enabling the upper end of the vertical probe to penetrate through the probe guide plate and to be clamped and positioned through the probe guide plate, and performing alignment operation of a positioning pin hole on the probe guide plate fixing plate and a lower alignment hole of a lower layer part of the probe guide plate or an upper alignment hole of an upper layer part of the probe guide plate through a positioning pin.
6. The manufacturing process according to claim 5, wherein in the step S4, a welding process of the lower end of the vertical probe is completed using a laser welding apparatus, specifically comprising:
placing the vertical probes in a balance needle box according to the fixed interval requirement;
placing the balance needle box on a displacement platform of welding equipment, sucking the vertical probe out of the balance needle box through a needle taking suction nozzle, and reaching the position of a probe inspection camera;
checking whether the vertical probe is qualified or not by using a vision system, and throwing materials to a waste box if the vertical probe is unqualified;
moving the probe suction nozzle to a vertical probe connection position, clamping the qualified vertical probe by using a probe clamping jaw, and loosening the probe suction nozzle;
performing secondary inspection on the qualified vertical probes in the clamping state to determine the vertical probes to be welded;
adjusting a vertical probe to be welded to a preset welding angle;
confirming the position of the bonding pad through the vision system again according to the compensated coordinate information of the bonding pad of the substrate, and then moving the vertical probe to be welded to the position of the bonding pad of the needle to be welded;
moving the laser head to a welding area through a motion mechanism, starting the laser to melt the solder balls, and simultaneously moving down the probe clamping jaw to ensure the height of the welding needle;
and checking the tin climbing height of the welding point by the vision system to confirm whether the welding is good, and loosening the probe clamping jaw after confirming that the welding is good so as to finish the welding.
7. The process of any one of claims 5 or 6, wherein the tip of the vertical probe is a flat tip or a pointed tip.
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| CN202310919148.4A CN116699368B (en) | 2023-07-26 | 2023-07-26 | Vertical probe card and manufacturing process thereof |
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| CN116953590B (en) * | 2023-09-21 | 2023-12-05 | 上海泽丰半导体科技有限公司 | Omnibearing probe measuring device and method |
| CN117214484B (en) * | 2023-11-09 | 2024-02-02 | 上海泽丰半导体科技有限公司 | Chip test socket |
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