CN219201727U - Packaging substrate vertical probe card for chip test - Google Patents
Packaging substrate vertical probe card for chip test Download PDFInfo
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- CN219201727U CN219201727U CN202223166050.6U CN202223166050U CN219201727U CN 219201727 U CN219201727 U CN 219201727U CN 202223166050 U CN202223166050 U CN 202223166050U CN 219201727 U CN219201727 U CN 219201727U
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- cover plate
- holes
- probe card
- upper cover
- vertical probe
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- Measuring Leads Or Probes (AREA)
Abstract
The utility model relates to the technical field of vertical probe cards and discloses a packaging substrate vertical probe card for chip testing, which comprises a substrate main body, an upper cover plate and a lower cover plate, wherein a welding layer is fixedly connected to the middle of the lower end face of the substrate main body, a daughter board is fixedly connected to the lower end face of the welding layer, a plurality of second screw holes are formed in the lower end face of the substrate main body, a circular groove is formed in the middle of the lower end face of the upper cover plate, a packaging substrate body is arranged on the inner top surface of the circular groove, a plurality of second through holes are formed in the upper cover plate and the inner part of the packaging substrate body, and probe bodies are arranged in the second through holes. According to the utility model, the number of single tests can be increased, and the test efficiency is improved; the packaging substrate replaces the traditional signal transmission mode of using the superfine metal wire, so that the signal transmission stability is improved, and meanwhile, the problem of short circuit caused by poor contact between the probe and the superfine metal wire is avoided.
Description
Technical Field
The utility model relates to the technical field of vertical probe cards, in particular to a package substrate vertical probe card for chip test.
Background
The probe card is a test interface, and the vertical probe card refers to a probe card suitable for multi-die testing of conventional logic products, and is called a "vertical" probe card because probes are perpendicular to a substrate, and because of their short needle-like structures and vertical contact with devices, the vertical type is most suitable for measuring small pads, high frequency devices.
At present, the conventional vertical probe card transmits signals to a tester by connecting the signals to a Printed Circuit Board (PCB) through an extremely fine metal wire, so that the test efficiency is low, the signal transmission is unstable in the test process due to poor contact stability, and the requirements cannot be met.
Disclosure of Invention
The utility model aims to solve the defects in the prior art, and provides a packaging substrate vertical probe card for chip test, which can improve the number of single tests and the test efficiency; the packaging substrate replaces the traditional signal transmission mode of using the superfine metal wire, so that the signal transmission stability is improved, and meanwhile, the problem of short circuit caused by poor contact between the probe and the superfine metal wire is avoided.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a vertical probe card of encapsulation base plate for chip test, includes base plate main part, upper cover plate and lower apron, the middle part fixedly connected with welding layer of base plate main part lower terminal surface, the lower terminal surface fixedly connected with daughter board of welding layer, a plurality of second screw holes have been seted up to the lower terminal surface of base plate main part, the circular slot has been seted up at the middle part of upper cover plate lower terminal surface, the interior top surface of circular slot is provided with encapsulation base plate body, a plurality of second through-holes have all been seted up to the inside of upper cover plate and encapsulation base plate body, the inside of second through-hole all is provided with the probe body, the junction of upper cover plate and second screw hole has all been seted up the third screw hole, a plurality of second mounting holes have all been seted up to the inside nearly middle part of upper cover plate;
a plurality of first through holes are formed in the center of the inner part of the lower cover plate, first screw holes are formed in the joints of the lower cover plate and the third screw holes, and first mounting holes are formed in the joints of the lower cover plate and the second screw holes;
through the technical scheme, the number of single tests can be increased, and the test efficiency is improved; the packaging substrate body replaces a traditional signal transmission mode of using an ultrafine metal wire, so that the signal transmission stability is improved, and meanwhile, the problem of short circuit caused by poor contact between the probe body and the ultrafine metal wire is avoided.
Further, the inner walls of the first screw hole, the second screw hole and the third screw hole are respectively connected with a second fixing screw in a threaded manner;
through above-mentioned technical scheme, make upper cover plate, lower apron and base plate main part installation fixed.
Further, the inner walls of the first mounting hole and the second mounting hole are respectively connected with a first fixing screw in a threaded manner;
through above-mentioned technical scheme, make upper cover plate and lower apron installation fixed.
Further, the second through holes are all connected with the upper end of the probe body in a nested manner;
through the technical scheme, the upper cover plate is connected with the probe body in an inserting way.
Further, the first through holes are all connected with the lower end of the probe body in a nested manner;
through the technical scheme, the lower cover plate is connected with the probe body in an inserting way.
Further, the probe body is made of beryllium copper;
through the technical scheme, the beryllium copper material can strongly enhance the conductivity.
Further, the welding layer is made of solder paste;
through the technical scheme, the solder paste welding has good weldability, insulativity and small corrosiveness.
The utility model has the following beneficial effects:
1. according to the vertical probe card of the packaging substrate for chip test, disclosed by the utility model, the traditional signal transmission mode using the superfine metal wires is replaced by the vertical probe card through the packaging substrate, so that the signal transmission stability is improved, and meanwhile, the problem of short circuit caused by poor contact between the probe and the superfine metal wires is avoided.
2. The vertical probe card for the packaging substrate for chip test can improve the number of single tests, improve the test efficiency and solve the problem of lower test efficiency of the traditional vertical probe card.
3. According to the vertical probe card for the packaging substrate for chip testing, provided by the utility model, the upper cover plate and the lower cover plate can be conveniently mounted and fixed with the substrate main body by arranging the first fixing screw and the second fixing screw, so that the assembly mode is simplified, and the vertical probe card is convenient for people to use.
Drawings
FIG. 1 is a side cross-sectional view of a package substrate vertical probe card for chip testing according to the present utility model;
FIG. 2 is a side view of a package substrate vertical probe card for chip testing according to the present utility model;
FIG. 3 is an isometric view of a package substrate vertical probe card for chip testing according to the present utility model;
fig. 4 is an enlarged view at a in fig. 1.
Legend description:
1. a substrate main body; 2. an upper cover plate; 3. a lower cover plate; 4. a first set screw; 5. packaging the substrate body; 6. a probe body; 7. a second set screw; 8. a first mounting hole; 9. a second mounting hole; 10. a circular groove; 11. a first screw hole; 12. a second screw hole; 13. a third screw hole; 14. a welding layer; 15. a sub-board; 16. a first through hole; 17. and a second through hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, one embodiment provided by the present utility model is: the utility model provides a vertical probe card of encapsulation base plate for chip test, including base plate main part 1, upper cover plate 2 and lower apron 3, the middle part fixedly connected with weld layer 14 of the lower terminal surface of base plate main part 1, the lower terminal surface fixedly connected with daughter board 15 of weld layer 14, a plurality of second screw holes 12 have been seted up to the lower terminal surface of base plate main part 1, circular slot 10 has been seted up at the middle part of the lower terminal surface of upper cover plate 2, the interior top surface of circular slot 10 is provided with encapsulation base plate body 5, a plurality of second through-holes 17 have all been seted up to the inside of upper cover plate 2 and encapsulation base plate body 5, the inside of second through-holes 17 all is provided with probe body 6, the junction of upper cover plate 2 and second screw holes 12 has all been seted up third screw holes 13, a plurality of second mounting holes 9 have all been seted up to the inside of upper cover plate 2 near the middle part;
a plurality of first through holes 16 are formed in the center of the inner part of the lower cover plate 3, first screw holes 11 are formed in the connecting parts of the lower cover plate 3 and the third screw holes 13, and first mounting holes 8 are formed in the connecting parts of the lower cover plate 3 and the second screw holes 12;
the number of single tests can be increased, the test efficiency is improved, the traditional signal transmission mode using the ultra-fine metal wires is replaced by the packaging substrate body 5, the signal transmission stability is improved, and meanwhile the short circuit problem caused by poor contact between the probe body 6 and the ultra-fine metal wires is avoided.
The inner walls of the first screw hole 11, the second screw hole 12 and the third screw hole 13 are all in threaded connection with the second fixing screw 7, so that the upper cover plate 2 and the lower cover plate 3 are fixedly installed on the substrate main body 1, the first fixing screw 4 is connected with the inner walls of the first installation hole 8 and the second installation hole 9 in threaded connection, the upper cover plate 2 and the lower cover plate 3 are fixedly installed, the second through hole 17 is all in nested connection with the upper end of the probe body 6, the upper cover plate 2 is in inserted connection with the probe body 6, the first through hole 16 is in nested connection with the lower end of the probe body 6, the lower cover plate 3 is in inserted connection with the probe body 6, the probe body 6 is made of beryllium copper material, the beryllium copper material can strongly enhance the conductivity, the welding layer 14 is made of solder paste, and the solder paste has good weldability and insulativity and is less in corrosiveness.
Working principle: the head of the probe body 6 is inserted into the through hole of the lower cover plate 3, the second through hole 17 of the upper cover plate 2 is covered corresponding to the tail of the probe body 6, the upper cover plate 2 is locked and attached to the lower cover plate 3 through the first fixing screw 4, the sub-board 15 is attached to the substrate main body 1 through the welding layer 14, and the upper cover plate 2 and the lower cover plate 3 are locked and attached to the substrate main body 1 through the second fixing screw 7, so that the tail of the probe body 6 is in direct contact with the sub-board 15.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (7)
1. The utility model provides a package substrate vertical probe card for chip test, includes base plate main part (1), upper cover plate (2) and lower apron (3), its characterized in that: the novel packaging structure comprises a substrate main body (1), wherein a welding layer (14) is fixedly connected to the middle of the lower end face of the substrate main body (1), a daughter board (15) is fixedly connected to the lower end face of the welding layer (14), a plurality of second screw holes (12) are formed in the lower end face of the substrate main body (1), a round groove (10) is formed in the middle of the lower end face of an upper cover plate (2), a packaging substrate body (5) is arranged on the inner top surface of the round groove (10), a plurality of second through holes (17) are formed in the upper cover plate (2) and the packaging substrate body (5), probe bodies (6) are arranged in the second through holes (17), third screw holes (13) are formed in the connecting positions of the upper cover plate (2) and the second screw holes (12), and a plurality of second mounting holes (9) are formed in the middle of the upper cover plate (2).
The center department of apron (3) inside down has offered a plurality of first through-holes (16), first screw hole (11) have all been seted up to the junction of apron (3) and third screw hole (13) down, first mounting hole (8) have all been seted up to the junction of apron (3) and second screw hole (12) down.
2. A package substrate vertical probe card for chip testing according to claim 1, wherein: the inner walls of the first screw hole (11), the second screw hole (12) and the third screw hole (13) are respectively connected with a second fixing screw (7) in a threaded mode.
3. A package substrate vertical probe card for chip testing according to claim 1, wherein: the inner walls of the first mounting hole (8) and the second mounting hole (9) are respectively connected with a first fixing screw (4) in a threaded mode.
4. A package substrate vertical probe card for chip testing according to claim 1, wherein: the second through holes (17) are all connected with the upper end of the probe body (6) in a nested mode.
5. A package substrate vertical probe card for chip testing according to claim 1, wherein: the first through holes (16) are all connected with the lower end of the probe body (6) in a nested mode.
6. A package substrate vertical probe card for chip testing according to claim 1, wherein: the probe body (6) is made of beryllium copper.
7. A package substrate vertical probe card for chip testing according to claim 1, wherein: the welding layer (14) is made of solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223166050.6U CN219201727U (en) | 2022-11-28 | 2022-11-28 | Packaging substrate vertical probe card for chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223166050.6U CN219201727U (en) | 2022-11-28 | 2022-11-28 | Packaging substrate vertical probe card for chip test |
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| Publication Number | Publication Date |
|---|---|
| CN219201727U true CN219201727U (en) | 2023-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223166050.6U Active CN219201727U (en) | 2022-11-28 | 2022-11-28 | Packaging substrate vertical probe card for chip test |
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| CN (1) | CN219201727U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116699368A (en) * | 2023-07-26 | 2023-09-05 | 上海泽丰半导体科技有限公司 | Vertical probe card and manufacturing process thereof |
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2022
- 2022-11-28 CN CN202223166050.6U patent/CN219201727U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116699368A (en) * | 2023-07-26 | 2023-09-05 | 上海泽丰半导体科技有限公司 | Vertical probe card and manufacturing process thereof |
| CN116699368B (en) * | 2023-07-26 | 2023-11-10 | 上海泽丰半导体科技有限公司 | Vertical probe card and manufacturing process thereof |
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