JPS55133550A - Probe needle - Google Patents

Probe needle

Info

Publication number
JPS55133550A
JPS55133550A JP4078179A JP4078179A JPS55133550A JP S55133550 A JPS55133550 A JP S55133550A JP 4078179 A JP4078179 A JP 4078179A JP 4078179 A JP4078179 A JP 4078179A JP S55133550 A JPS55133550 A JP S55133550A
Authority
JP
Japan
Prior art keywords
shape
tip end
probe needle
wavy
approx
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4078179A
Other languages
Japanese (ja)
Inventor
Yoshie Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP4078179A priority Critical patent/JPS55133550A/en
Publication of JPS55133550A publication Critical patent/JPS55133550A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To provide a probe needle having preferable electric contact with any of a number of measuring points of an article to be measured in high density and wide range by providing a wavy stretchable portion between the sationary portion and a tip end formed on the same axis. CONSTITUTION:The stationary portion 1a and a tip end 1c of a probe needle 1 are formed on the same axis, and a stretchable portion 1b of wavy shape or the shape associated with the wavy shape is provided axially between the stationary portion 1a and the tip end 1c. The tip end 1c is tapered to be conical in shape with a vertex formed at the end. The needle 1 employs as its material a flat beryllium copper plate or the like having a thickness of approx. 50mu with appropriate elasticity, and formed in the above shape, for example by a photoetching process, heat treated 315 deg.C for approx. 2hr, quenched thereafter and gold plated.
JP4078179A 1979-04-03 1979-04-03 Probe needle Pending JPS55133550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4078179A JPS55133550A (en) 1979-04-03 1979-04-03 Probe needle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4078179A JPS55133550A (en) 1979-04-03 1979-04-03 Probe needle

Publications (1)

Publication Number Publication Date
JPS55133550A true JPS55133550A (en) 1980-10-17

Family

ID=12590159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4078179A Pending JPS55133550A (en) 1979-04-03 1979-04-03 Probe needle

Country Status (1)

Country Link
JP (1) JPS55133550A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58148935U (en) * 1982-03-31 1983-10-06 日本電子材料株式会社 probe card
JPS63262850A (en) * 1987-04-21 1988-10-31 Tokyo Electron Ltd Probe card
US4967148A (en) * 1987-03-31 1990-10-30 Siemens Aktiengesellschaft Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards
JP2001091537A (en) * 1999-09-24 2001-04-06 Isao Kimoto Contact and contact assembly using it
US6277218B1 (en) * 1999-10-13 2001-08-21 Promos Technologies Inc. Probe card treatment method
JP2002062315A (en) * 2000-06-19 2002-02-28 Advantest Corp Contact structure
JP2002162418A (en) * 2000-09-16 2002-06-07 Advantest Corp Contact structure, its manufacturing method, and probe contact assembly using the same
US6528759B2 (en) 2001-02-13 2003-03-04 Medallion Technology, Llc Pneumatic inductor and method of electrical connector delivery and organization
US6530511B2 (en) 2001-02-13 2003-03-11 Medallion Technology, Llc Wire feed mechanism and method used for fabricating electrical connectors
US6716038B2 (en) 2002-07-31 2004-04-06 Medallion Technology, Llc Z-axis connection of multiple substrates by partial insertion of bulges of a pin
JP2008275488A (en) * 2007-04-28 2008-11-13 Sankei Engineering:Kk Conductive contact pin, pin retainer, electric component inspection apparatus, and method of manufacturing electric component
JP2009002845A (en) * 2007-06-22 2009-01-08 Micronics Japan Co Ltd Contact and connection apparatus
JP2009513986A (en) * 2005-10-31 2009-04-02 カプレス・アクティーゼルスカブ Probe for testing electrical properties of test specimens
US8613622B2 (en) 2011-02-15 2013-12-24 Medallion Technology, Llc Interconnection interface using twist pins for testing and docking
CN116699368A (en) * 2023-07-26 2023-09-05 上海泽丰半导体科技有限公司 Vertical probe card and manufacturing process thereof

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58148935U (en) * 1982-03-31 1983-10-06 日本電子材料株式会社 probe card
US4967148A (en) * 1987-03-31 1990-10-30 Siemens Aktiengesellschaft Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards
JPS63262850A (en) * 1987-04-21 1988-10-31 Tokyo Electron Ltd Probe card
JP4579361B2 (en) * 1999-09-24 2010-11-10 軍生 木本 Contact assembly
JP2001091537A (en) * 1999-09-24 2001-04-06 Isao Kimoto Contact and contact assembly using it
US6277218B1 (en) * 1999-10-13 2001-08-21 Promos Technologies Inc. Probe card treatment method
JP2002062315A (en) * 2000-06-19 2002-02-28 Advantest Corp Contact structure
JP4647139B2 (en) * 2000-06-19 2011-03-09 株式会社アドバンテスト Contact structure
JP2002162418A (en) * 2000-09-16 2002-06-07 Advantest Corp Contact structure, its manufacturing method, and probe contact assembly using the same
US6530511B2 (en) 2001-02-13 2003-03-11 Medallion Technology, Llc Wire feed mechanism and method used for fabricating electrical connectors
US6528759B2 (en) 2001-02-13 2003-03-04 Medallion Technology, Llc Pneumatic inductor and method of electrical connector delivery and organization
US6716038B2 (en) 2002-07-31 2004-04-06 Medallion Technology, Llc Z-axis connection of multiple substrates by partial insertion of bulges of a pin
JP2009513986A (en) * 2005-10-31 2009-04-02 カプレス・アクティーゼルスカブ Probe for testing electrical properties of test specimens
US8310258B2 (en) 2005-10-31 2012-11-13 Capres A/S Probe for testing electrical properties of a test sample
JP2008275488A (en) * 2007-04-28 2008-11-13 Sankei Engineering:Kk Conductive contact pin, pin retainer, electric component inspection apparatus, and method of manufacturing electric component
JP2009002845A (en) * 2007-06-22 2009-01-08 Micronics Japan Co Ltd Contact and connection apparatus
US8613622B2 (en) 2011-02-15 2013-12-24 Medallion Technology, Llc Interconnection interface using twist pins for testing and docking
CN116699368A (en) * 2023-07-26 2023-09-05 上海泽丰半导体科技有限公司 Vertical probe card and manufacturing process thereof
CN116699368B (en) * 2023-07-26 2023-11-10 上海泽丰半导体科技有限公司 Vertical probe card and manufacturing process thereof

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