JPS56135938A - Fixed probe board - Google Patents
Fixed probe boardInfo
- Publication number
- JPS56135938A JPS56135938A JP3988580A JP3988580A JPS56135938A JP S56135938 A JPS56135938 A JP S56135938A JP 3988580 A JP3988580 A JP 3988580A JP 3988580 A JP3988580 A JP 3988580A JP S56135938 A JPS56135938 A JP S56135938A
- Authority
- JP
- Japan
- Prior art keywords
- probe needles
- electrodes
- tips
- measuring electrodes
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To improve the precision of measurement by arranging probe needles from the fixed parts to the tip parts thereof on the same plane, bending the tip parts vertically at prescribed positions corresponding to measuring electrodes and positioning the tips thereof facing to the measuring electrodes. CONSTITUTION:A number of probe needles 2 are arranged in the part of a square opening 9 provided in the central part of a print substrate 1 in such a manner that the points 3 thereof are matched respectively in position with the electrodes of semiconductor chips which are objects to be measured and that they form a plane parallel to the surface of the print substrate 1. Moreover, the arrangement of the probe needles 2 is made so that the length thereof from the fixed parts 4 to the tips is all the same. The tips of the probe needles 2 are bent vertically in the positions corresponding to the measuring electrodes and the points 3 thereof are opposed to the surfaces of the electrodes. Since the needle pressure applied on the surface of the electrode turns equal with respect to all of the probe needles by this constitution, unevenness in measurement can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55039885A JPS5833700B2 (en) | 1980-03-28 | 1980-03-28 | Fixed probe board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55039885A JPS5833700B2 (en) | 1980-03-28 | 1980-03-28 | Fixed probe board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56135938A true JPS56135938A (en) | 1981-10-23 |
JPS5833700B2 JPS5833700B2 (en) | 1983-07-21 |
Family
ID=12565422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55039885A Expired JPS5833700B2 (en) | 1980-03-28 | 1980-03-28 | Fixed probe board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5833700B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58142938U (en) * | 1982-03-18 | 1983-09-27 | 富士通株式会社 | probe card |
JPS58190061A (en) * | 1982-04-28 | 1983-11-05 | Toshiba Corp | Amorphous silicon semiconductor device and manufacture thereof |
JPS5972148A (en) * | 1982-09-14 | 1984-04-24 | アキユテスト・コ−ポレ−シヨン | Electronic circuit wafer insepecting device |
JPS6082866A (en) * | 1983-10-13 | 1985-05-11 | Hiyuuguru Electron Kk | Fixed probe card |
WO1986001133A1 (en) * | 1984-08-17 | 1986-02-27 | Motorola, Inc. | Pass-through test socket for semiconductor devices |
JP2004047336A (en) * | 2002-07-12 | 2004-02-12 | Advantest Corp | Contact sheet, and socket for semiconductor device equipped with the sheet |
JP2015025813A (en) * | 2012-07-13 | 2015-02-05 | 旺▲夕▼科技股▲分▼有限公司 | Probe fixing structure and optical measuring device thereof |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6050252U (en) * | 1983-09-09 | 1985-04-09 | 株式会社 土井製作所 | underground hole ladder |
JPS60162156U (en) * | 1984-04-04 | 1985-10-28 | 株式会社 土井製作所 | underground hole ladder |
JPH0489133U (en) * | 1990-11-30 | 1992-08-04 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5486962U (en) * | 1977-11-29 | 1979-06-20 |
-
1980
- 1980-03-28 JP JP55039885A patent/JPS5833700B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5486962U (en) * | 1977-11-29 | 1979-06-20 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58142938U (en) * | 1982-03-18 | 1983-09-27 | 富士通株式会社 | probe card |
JPS6210998Y2 (en) * | 1982-03-18 | 1987-03-16 | ||
JPS58190061A (en) * | 1982-04-28 | 1983-11-05 | Toshiba Corp | Amorphous silicon semiconductor device and manufacture thereof |
JPH0546106B2 (en) * | 1982-04-28 | 1993-07-13 | Tokyo Shibaura Electric Co | |
JPS5972148A (en) * | 1982-09-14 | 1984-04-24 | アキユテスト・コ−ポレ−シヨン | Electronic circuit wafer insepecting device |
JPS6082866A (en) * | 1983-10-13 | 1985-05-11 | Hiyuuguru Electron Kk | Fixed probe card |
WO1986001133A1 (en) * | 1984-08-17 | 1986-02-27 | Motorola, Inc. | Pass-through test socket for semiconductor devices |
JP2004047336A (en) * | 2002-07-12 | 2004-02-12 | Advantest Corp | Contact sheet, and socket for semiconductor device equipped with the sheet |
JP2015025813A (en) * | 2012-07-13 | 2015-02-05 | 旺▲夕▼科技股▲分▼有限公司 | Probe fixing structure and optical measuring device thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS5833700B2 (en) | 1983-07-21 |
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