JP2004047336A - Contact sheet, and socket for semiconductor device equipped with the sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure electrical connection between an electrode of a printed wiring board and a fixed-side terminal of a connection terminal group even if the printed wiring board or an inspection object housing member is bent, and to surely fix the inspection object housing member to the printed wiring board. <P>SOLUTION: The connection terminal groups 48A, 48B, 48C and 48D in the contact sheet 42 are stuck to a base material 46 by interlaying elastic sheet members 50. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a contact sheet for making an electrical connection between a terminal of a semiconductor device and an electrode of a test substrate, and a semiconductor device socket including the same.
[0002]
[Prior art]
Various tests are performed on a semiconductor device mounted on an electronic device or the like before mounting to remove potential defects. The test is performed non-destructively by applying a voltage corresponding to a thermal and mechanical environment test, operating at high or low temperature, storing at high or low temperature, and the like. As a final stage of the various tests, a final test for detecting a malfunctioning integrated circuit under a high or low temperature condition is performed. In the final test, an automatic inspection device called a test system is generally used. An inspection jig called an IC socket is mounted on a test system to obtain an electrical connection between a semiconductor device (IC) to be tested and a test board.
[0003]
As shown in FIG. 13, for example, the IC socket is a printed wiring having an input / output unit for supplying a predetermined test voltage and transmitting an abnormality detection signal indicating a short circuit or the like from a semiconductor device as an object to be inspected. A substrate 2 (printed circuit board), an object-to-be-inspected housing member 4 (socket main body) having a housing portion in which the semiconductor device is mounted, and a pressing portion (pressure plate) that contacts the upper surface of the semiconductor device and presses with a predetermined pressure And a cover member (cover) 6 for covering an upper portion of the inspection object housing member, and a contact sheet 8 for electrically connecting each terminal of the semiconductor device and each electrode of the printed wiring board 2. I have.
[0004]
The inspection object housing member 4 has a housing portion for housing the semiconductor device by positioning the semiconductor device with respect to the terminals of the contact sheet 8. Holes through which the screws 10 penetrate are formed at four locations around the accommodation portion so as to correspond to the mounting holes of the printed wiring board 2. As a result, the inspection object housing member 4 is fixed to the printed wiring board 2 by fastening the screw 10 with the nut 12 through the mounting hole of the printed wiring board 2.
[0005]
In addition, a pair of hook members 20 that hold the cover member 6 with respect to the inspection object housing member 4 after the semiconductor device is mounted in the housing portion are rotatable on opposite sides of the inspection object housing member 4. It is supported by.
[0006]
The contact sheet 8 includes, for example, as shown in FIG. 12, a base 14 made of a resin film, and connection terminal groups 16A, 16B, 16C joined to the periphery of the opening 14d of the base 14, and 16D.
[0007]
The base material 14 has through holes 14b at four corners through which the screws 10 pass. A positioning hole 14a through which a positioning pin (not shown) is inserted is formed around a pair of obliquely opposed through holes 14b among the four through holes 14b.
[0008]
Each connection terminal in each of the connection terminal groups 16A to 16D is a curved movable terminal portion electrically connected to a terminal of the semiconductor device, and a fixed side terminal electrically connected to an electrode of the printed wiring board 2, respectively. Part. The connection terminals are arranged at predetermined intervals corresponding to the terminals of the semiconductor device so as to be parallel to each other.
[0009]
When the connection terminal groups 16A to 16D are joined to and integrated with the lower surface of the peripheral edge of the opening 14d of the base material 14, the connection terminal groups 16A to 16D are previously connected to each side as shown in FIG. A lead frame 16F formed in a frame shape is prepared. Next, after the thermosetting adhesive 18 is applied near the ends of the fixed terminals of the connection terminal groups 16A to 16D, the lead frame 16F is thermocompression-bonded to the periphery of the opening 14d of the base material 14. Then, by cutting off portions other than the connection terminal groups 16A to 16D in the lead frame 16F, the contact sheet 8 is obtained.
[0010]
[Problems to be solved by the invention]
As shown in FIG. 13, the IC socket having the above-described configuration is mounted in a state where the cover member 6 is held by the pair of hook members 20 with respect to the inspection object housing member 4 after the semiconductor device is mounted. When the test is performed, for example, when the test is performed in an atmosphere at a temperature of 125 ° C., the thermal expansion of the printed wiring board 2 in addition to the bending of the printed wiring board 2 at normal temperature causes As indicated by the dashed line, there is a possibility that the printed wiring board 2 is bent in a convex shape toward the lower side. In such a case, the electrical connection between the electrodes of the printed wiring board 2 and the fixed terminals of the connection terminal groups 16A to 16D may be incomplete as shown in an enlarged manner in FIG.
[0011]
Further, when the test is performed in the same state as described above, the object-to-be-inspected housing member 4 may be bent upward in a convex manner with respect to the printed wiring board 2 as shown by a two-dot chain line in FIG. Even in such a case, as shown in an enlarged manner in FIG. 14, the electrical connection between the electrodes of the printed wiring board 2 and the fixed terminals of the connection terminal groups 16A to 16D may be incomplete.
[0012]
Further, as described above, when the printed wiring board 2 or the inspection object housing member 4 is repeatedly bent, the screws 10 may be loosened.
[0013]
In view of the above problems, the present invention is a contact sheet for making an electrical connection between a terminal of a semiconductor device and an electrode of a test substrate, and a socket for a semiconductor device including the same, and a printed wiring board or Even when the test object storage member is bent, the electrical connection between the electrodes of the printed wiring board and the fixed terminals of the connection terminal group is ensured, and the test object storage member is moved relative to the printed wiring board. It is an object of the present invention to provide a contact sheet which can be fixed securely and securely, and a semiconductor device socket including the same.
[0014]
[Means for Solving the Problems]
In order to achieve the above object, a contact sheet according to the present invention has a movable side terminal electrically connected to a terminal of a semiconductor device, and a fixed side connected to the movable side terminal and electrically connected to an electrode of a substrate. A connection terminal group having a terminal and electrically connecting the terminal of the semiconductor device and the electrode of the substrate; and a thin plate member joined to the fixed terminal of the connection terminal group via an elastic body to support the connection terminal group; It comprises.
[0015]
The elastic body may be formed by laminating an adhesive layer and an elastic member, or the elastic body may be made of an elastic adhesive.
[0016]
The semiconductor device socket including the contact sheet according to the present invention includes the above-described contact sheet, a semiconductor device housing portion that houses the semiconductor device disposed on the contact sheet, and a terminal of the semiconductor device that is a connection terminal group of the contact sheet. And a pressing member for selectively pressing the movable terminal.
[0017]
The semiconductor device socket including the contact sheet according to the present invention includes a movable terminal electrically connected to a terminal of the semiconductor device, and a fixed terminal connected to the movable terminal and electrically connected to an electrode of the substrate. A contact sheet comprising: a connection terminal group that electrically connects a terminal of a semiconductor device and an electrode of a substrate; and a thin plate member that is joined to a fixed terminal of the connection terminal group and supports the connection terminal group. A semiconductor device accommodating portion for accommodating a semiconductor device provided on the contact sheet; and an elastic member mounted between a peripheral portion of the fixed-side terminal in the thin plate member of the contact sheet and a peripheral edge of the semiconductor device accommodating portion. And a pressing member provided in the semiconductor device accommodating portion and selectively pressing the terminals of the semiconductor device against the movable terminals of the connection terminal group of the contact sheet.
[0018]
The semiconductor device accommodated in the semiconductor device accommodating portion may be held by a carrier detachable from the semiconductor device accommodating portion.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 3 shows an example of a semiconductor device socket including a contact sheet according to the present invention, together with a semiconductor device to be mounted.
[0020]
In FIG. 3, the semiconductor device socket is provided with a printed circuit board 30 having an input / output unit for supplying a predetermined test voltage and transmitting an abnormality detection signal indicating a short circuit or the like from the semiconductor device as an object to be inspected, and a semiconductor device socket. A socket body 32 having an accommodating portion in which the semiconductor device 36 is mounted, a lid 38 having a pressing portion that comes into contact with the upper surface of the semiconductor device 36 and presses with a predetermined pressure, and covers an upper portion of the socket body 32; It is configured to include a contact sheet 42 for electrically connecting the terminal and each electrode of the printed circuit board 30.
[0021]
The semiconductor device 36 is formed of, for example, a QFP (Quad Flat Package) type package, and a plurality of terminals 36ai (i = 1 to n, n is an integer) are arranged on each side of the square. The total number of terminals is, for example, about 300 pins at maximum.
[0022]
The printed circuit board 30 has an electrode group formed corresponding to each fixed-side terminal of a contact sheet 42 described later. The electrode group is electrically connected to the input / output unit via a predetermined conductor layer. Through holes into which screws 44 described later are inserted are formed at four locations around the electrode group.
[0023]
The socket body 32 having a flat upper surface and a lower surface parallel to each other has a housing portion 32A in which the semiconductor device 36 is positioned and housed in the center thereof. Escape portions 32p for avoiding interference at each corner of the outer peripheral portion of the semiconductor device 36 to be accommodated are formed at four places corresponding to each corner of the semiconductor device 36 on the wall forming the cross-shaped accommodation portion 32A. Have been.
[0024]
Through holes 32b into which mounting screws 44 are inserted are formed at four locations on the outer periphery of the housing portion 32A. The screw portion of each screw 44 inserted into the through hole 32b is fitted to the nut 46n through the through hole of the printed circuit board 30, as shown in FIG. Thus, the socket main body 32 is fixed to the printed circuit board 30 via the contact sheet 42 described later.
[0025]
Projections 32RA and 32RB for regulating the position of the lid 38 are integrally formed on the upper surface of the socket body 32 made of a resin material. The projections 32RA provided on one of the opposing sides are formed at a predetermined interval. The projections 32RB provided on the other opposing sides are formed at predetermined intervals and separation, respectively. Hook members 34A and 34B are rotatably provided between the pair of projections 32RB on each side. The base ends of the hook members 34A and 34B are supported by inserting the support shaft 40 into the through holes. Both ends of the support shaft 40 are fitted into and supported by the through holes of each projection 32RB. Engaging claws are provided on one surface of the distal ends of the hook members 34A and 34B so as to face each other. Each engagement claw is engaged with a groove of the lid 38.
[0026]
As a result, the hook members 34A and 34B are substantially parallel to the flat surface of the printed circuit board 30, and become substantially perpendicular to the flat surface of the printed circuit board 30, as shown in FIG. A position for holding the lid 38 will be taken.
[0027]
As described above, the lid 38 made of a resin material has an upper surface on which two grooves 38g spaced apart from each other by a predetermined distance so as to be substantially parallel to the respective engaging claws of the inverted hook members 34A and 34B. have. Further, the lid 38 integrally has pressing portions 38p for pressing the terminals 36ai of the semiconductor device 36 at four locations around the concave portion in the protrusion on the lower surface.
[0028]
For example, as shown in FIG. 2, the contact sheet 42 includes a base material 46 made of a resin film, for example, a polyimide resin film, and connection terminal groups 48 </ b> A joined to the periphery of the opening 46 d of the base material 46. 48B, 48C, and 48D, and an elastic sheet member 50 as an elastic body disposed between the connection terminal groups 48A to 48D and the base member 46 as main elements.
[0029]
The base material 46 has through holes 46b at four corners through which the screws 44 pass. A positioning hole 46a through which a positioning pin (not shown) is inserted is formed around a pair of obliquely opposed through holes 46b among the four through holes 46b.
[0030]
Each of the connection terminals of each of the connection terminal groups 48A to 48D is electrically connected to a curved and elastic movable terminal portion 48MC electrically connected to the terminal 36ai of the semiconductor device 36, and electrically connected to the electrode group of the printed board 30. And a fixed-side terminal portion 48FC connected thereto. The connection terminal groups 48A to 48D are formed by arranging the connection terminals at predetermined intervals corresponding to the terminals 36ai of the semiconductor device 36 such that the connection terminals are parallel to each other.
[0031]
As shown in FIG. 1, the thin elastic sheet member 50 is made of, for example, a silicon-based rubber material having heat resistance and elasticity. The elastic sheet members 50 are provided corresponding to the respective connection terminal groups 48A to 48D. Each elastic sheet member 50 is sandwiched between epoxy-based adhesives 52 and 54 and adhered between the lower surface of the base material 46 and the fixed-side terminals of the connection terminal groups 48A to 48D.
[0032]
When the socket main body 32 is fixed to the printed circuit board 30 via the contact sheet 42 as described above, the screws 44 are kept in a state where the elasticity of the elastic sheet member 50 disposed on the lower surface of the socket main body 32 is not lost. The nut 46n is fitted.
[0033]
When the connection terminal groups 48A to 48D are joined to and integrated with the lower surface of the peripheral edge of the opening 46d of the base material 46, as shown in FIG. A lead frame 48 formed in a frame shape and a base material 46 having an opening 46d at the center are prepared. The through holes 46b and the holes 46a may be formed in advance.
[0034]
Next, after the adhesives 52 and 54 are applied to the lower surface of the periphery of the opening 46d of the base material 46 and the vicinity of the ends of the fixed terminals of the connection terminal groups 48A to 48D, respectively, the elastic sheet member 50 Are arranged and bonded between the adhesive 52 and the adhesive 54. Then, by cutting off portions other than the connection terminal groups 48A to 48D in the lead frame 48, the contact sheet 42 as shown in FIG. 2 is obtained.
[0035]
In such a configuration, when a test is performed in a state where the lid 38 is held by the pair of hook members 34A and 34B with respect to the socket body 32 after the semiconductor device 36 is mounted in the housing portion 32A of the socket body 32, for example, When the test is performed in an atmosphere at a temperature of 125 ° C., as shown by a two-dot chain line in FIG. There is a possibility that the substrate 30 is bent in a convex shape toward the lower side. Even in such a case, as shown in an enlarged manner in FIG. 7, the adhesive 54 and the fixed side terminals of the connection terminal groups 48A to 48D are restored by the restoring force of the elastic sheet member 50 in accordance with the bending of the printed circuit board 30. Follow the electrodes of the printed circuit board 30 in a state where they are in contact with each other, so that a good state of electrical connection between the fixed-side terminals of the connection terminal groups 48A to 48D and the electrodes of the printed circuit board 30 is maintained.
[0036]
When the test is performed in the same state as described above, the socket body 32 may be bent upward with respect to the printed circuit board 30 as shown by a two-dot chain line in FIG. Also in such a case, as shown in an enlarged manner in FIG. 6, the base material 46 and the adhesive 52 follow the socket body 32 by the restoring force of the elastic sheet member 50 in accordance with the bending of the socket body 32. The adhesive 54 and the fixed terminals of the connection terminal groups 48A to 48D are pressed against the electrodes of the printed circuit board 30 by the restoring force of the elastic sheet member 50. Therefore, a favorable state of electrical connection between the fixed-side terminals of the connection terminal groups 48A to 48D and the electrodes of the printed circuit board 30 is maintained.
[0037]
Further, even if the printed board 30 or the socket main body 32 is bent as described above, the looseness of each screw 44 is avoided by the restoring force of each elastic sheet member 50.
[0038]
FIG. 8 shows another example of a contact sheet used as an example of a semiconductor device socket including the contact sheet according to the present invention.
[0039]
In the example shown in FIG. 8 and other examples described later, the same components as those in the examples shown in FIGS. 1 and 3 are denoted by the same reference numerals, and redundant description will be omitted.
[0040]
In the example shown in FIG. 1, the elastic sheet member 50 is joined between the lower surface of the base material 46 and the fixed-side terminals of the connection terminal groups 48A to 48D via the adhesives 52 and 54. The lower surface of the base material 46 and the fixed terminals of the connection terminal groups 48A to 48D are adhered by an adhesive 60 having elasticity.
[0041]
The adhesive 60 is an adhesive having heat resistance and elasticity, for example, a silicone rubber-based adhesive.
[0042]
When the connection terminal groups 48A to 48D are joined to and integrated with the lower surface of the periphery of the opening 46d of the base material 46, as shown in FIG. A lead frame 48 formed in a frame shape and a base material 46 having an opening 46d at the center are prepared. The through holes 46b and the holes 46a may be formed in advance.
[0043]
Next, after the adhesive 60 is applied to the lower surface of the periphery of the opening 46d of the base material 46 or the four locations near the ends of the fixed terminals of the connection terminal groups 48A to 48D, respectively, Glued. Then, by cutting off portions other than the connection terminal groups 48A to 48D in the lead frame 48, a contact sheet 42 'as shown in FIG. 8 is obtained.
[0044]
In such a configuration, the contact sheet 42 'can be obtained by a simpler process than the process of the above-described example, and the same operation and effect as those of the above-described example can be obtained.
[0045]
FIG. 9 shows another example of the semiconductor device socket including the contact sheet according to the present invention, together with the semiconductor device to be mounted.
[0046]
In the example shown in FIG. 3 described above, the elastic sheet member 50 is arranged between the lower surface of the base material 46 and the fixed-side terminals of the connection terminal groups 48A to 48D, but instead shown in FIG. In the example, the elastic sheet member 72 made of a silicon-based rubber material has upper surfaces corresponding to the fixed-side terminals of the connection terminal groups 48A to 48D on the base material 46 of the contact sheet 70 and a lower end surface of the socket body 32, respectively. It is assumed to be arranged between.
[0047]
At this time, the base material 46 of the contact sheet 70 and the fixed terminals of the connection terminal groups 48A to 48D are adhered by a thermosetting adhesive.
[0048]
In such an example, the same operation and effect as those in the above-described example can be obtained.
[0049]
In the example shown in FIGS. 1 and 9, the elastic sheet members 50 and 72 are formed and arranged individually. However, this is not always necessary. May be one elastic sheet integrally formed in a frame shape.
[0050]
FIG. 10 shows still another example of the semiconductor device socket including the contact sheet according to the present invention.
[0051]
The semiconductor device socket shown in FIG. 10 is referred to as, for example, a test handler socket, and a plurality of sockets are attached to predetermined positions of one test system.
[0052]
The socket body 80 having a flat upper surface and a lower surface parallel to each other is made of a material similar to that of the above-described socket body 32, and a semiconductor device holding portion of a detachable carrier 82 described later is positioned at a central portion thereof. It has a housing portion 80M that is housed in the housing. The inner wall forming the housing 80M that opens upward is formed in a substantially square shape. Further, a pair of positioning holes 80p in which two positioning pins 82p of the carrier 82 are engaged with each other are formed at predetermined distances and around the periphery corresponding to the pair of opposing sides of the housing portion 80M. .
[0053]
Through holes 80b into which the mounting screws 44 are inserted are formed at four places on the outer periphery of the housing portion 80M. The screw portion of each screw 44 inserted into the through hole 80b is fitted to the nut 46n through the through hole in the printed circuit board 30, as shown in FIG. As a result, the socket body 80 is fixed to the printed circuit board 30 via the contact sheet 70 and the elastic sheet member 72, as shown in FIG.
[0054]
The configurations of the contact sheet 70 and the elastic sheet member 72 are the same as those in the example shown in FIG.
[0055]
The carrier 82 which can be attached to and detached from the socket body 80 is made of, for example, a resin material, and is selectively held by a hand of a transfer robot (not shown) as shown in FIGS. The semiconductor device includes a flat portion 82F placed on the upper surface of the semiconductor device 80 and a semiconductor device holding portion 82M connected to the flat portion 82F and holding the semiconductor device 36.
[0056]
On one surface of the flat portion 82F, a pair of positioning pins 82p for positioning the carrier 82 relative to the socket body 80 are provided at a predetermined distance. The positioning pin 82p is provided substantially perpendicular to the surface.
[0057]
The semiconductor device holding portion 82M protrudes between the positioning pins 82p.
[0058]
The semiconductor device holding portion 82M has a substantially cross-shaped opening 82A in the flat plate portion 82F. At each of four intersecting corners on the periphery of the opening 82A, a column 82s projects downward. Each support 82s cooperates and supports a receiving table 82D on which the semiconductor device 36 is mounted. Openings 82B are formed between the columns 82s so that the leads on each side of the semiconductor device 36 protrude. Therefore, the relative position of the semiconductor device 36 with respect to the carrier 82 is determined by positioning both ends of the respective lead groups along the arrangement direction by the columns 82s. Become.
[0059]
Therefore, when the carrier 82 is placed on the socket body 80, each of the positioning pins 82 p is engaged with the hole 80 p of the socket body 80, so that each of the held leads of the semiconductor device 36 and the connection terminals on the contact sheet 70 are formed. The groups 48A to 48D will be positioned.
[0060]
In such a configuration, when a test is performed, first, after the semiconductor device 36 is mounted on the receiving table 82D in the semiconductor device holding portion 82M of the carrier 82, the semiconductor device 36 is held by a transfer robot (not shown). The semiconductor device holding portion 82 </ b> M of the carrier 82 is disposed in the housing portion 80 </ b> M of the socket body 80.
[0061]
Next, a pressing portion 84p of the pressing member 84 held by a work robot (not shown) is moved along a direction indicated by an arrow in FIG. 10 with respect to an upper surface of the semiconductor device 36 in the semiconductor device holding portion 82M. Pressed by pressure. Therefore, electrical connection between each lead of the semiconductor device 36 and the connection terminal groups 48A to 48D on the contact sheet 70 is ensured.
[0062]
Then, a predetermined test is executed by supplying a predetermined test signal group to the semiconductor device 36 through the printed circuit board 30.
[0063]
In this case, the same operation and effect as those of the above-described example can be obtained.
[0064]
【The invention's effect】
As is apparent from the above description, according to the contact sheet and the semiconductor device socket including the same according to the present invention, the contact sheet is joined to the fixed-side terminal of the connection terminal group via the elastic body to form the connection terminal group. Since it is configured to include the supporting thin plate-shaped member, the electrical connection state of the connection terminal group is maintained without being affected by the bending of the printed wiring board or the inspection object housing member due to the restoring force of the elastic body, and therefore, Even if the printed wiring board or the test object storage member is bent, the electrical connection between the electrodes of the printed wiring board and the fixed terminals of the connection terminal group is ensured. It can be securely fixed to the printed wiring board.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a configuration of an example of a contact sheet according to the present invention.
FIG. 2 is a perspective view showing a contact sheet in the example shown in FIG.
FIG. 3 is a perspective view showing an example of a semiconductor device socket including a contact sheet according to the present invention, together with a semiconductor device to be mounted.
FIG. 4 is a cross-sectional view for explaining the operation in the example shown in FIG. 3;
FIG. 5 is a cross-sectional view for explaining the operation in the example shown in FIG. 3;
FIG. 6 is a cross-sectional view for explaining the operation in the example shown in FIG. 3;
FIG. 7 is a cross-sectional view used for explaining the operation in the example shown in FIG. 3;
FIG. 8 is an exploded perspective view showing another example of the contact sheet according to the present invention.
FIG. 9 is an exploded perspective view showing another example of the semiconductor device socket including the contact sheet according to the present invention, together with the semiconductor device to be mounted.
FIG. 10 is an exploded perspective view showing still another example of the semiconductor device socket including the contact sheet according to the present invention, together with a detachable carrier.
11 is an exploded perspective view showing a configuration of a semiconductor device socket in the example shown in FIG. 10 together with a carrier and a semiconductor device.
FIG. 12 is a perspective view showing a configuration of a conventional contact sheet.
FIG. 13 is an external view for explaining the operation of the semiconductor device socket including the contact sheet shown in FIG. 12;
FIG. 14 is an external view for explaining the operation of the semiconductor device socket including the contact sheet shown in FIG. 12;
[Explanation of symbols]
32 Socket body 32A Housing 36 Semiconductor device 38 Cover 38p Pressing section 42, 42 'Contact sheet 46 Bases 48A, 48B, 48C, 48D Connection terminal group 50, 72 Elastic sheet members 52, 54, 60 Adhesive

Claims (6)

A movable terminal electrically connected to a terminal of the semiconductor device, and a fixed terminal connected to the movable terminal and electrically connected to an electrode of the substrate; a terminal of the semiconductor device and an electrode of the substrate; A connection terminal group for electrically connecting the
A thin plate-shaped member joined to the fixed terminal of the connection terminal group via an elastic body to support the connection terminal group,
A contact sheet comprising: The contact sheet according to claim 1, wherein the elastic body is formed by laminating an adhesive layer and an elastic member. The contact sheet according to claim 1, wherein the elastic body is made of an elastic adhesive. A contact sheet according to claim 1,
A semiconductor device accommodating portion for accommodating a semiconductor device arranged on the contact sheet;
A pressing member that is provided in the semiconductor device housing portion and selectively presses the terminals of the semiconductor device against the movable-side terminals of the connection terminal group of the contact sheet;
A semiconductor device socket comprising: A movable terminal electrically connected to a terminal of the semiconductor device, and a fixed terminal connected to the movable terminal and electrically connected to an electrode of the substrate; a terminal of the semiconductor device and an electrode of the substrate; A contact sheet comprising: a connection terminal group for electrically connecting the connection terminal group;
A semiconductor device accommodating portion for accommodating a semiconductor device arranged on the contact sheet;
An elastic member mounted between a peripheral portion of the fixed terminal and a peripheral edge of the semiconductor device housing portion in the thin plate member of the contact sheet;
A pressing member that selectively presses the terminal of the semiconductor device against the movable side terminal of the connection terminal group of the contact sheet;
A semiconductor device socket comprising: 5. The semiconductor device socket according to claim 4, wherein the semiconductor device housed in the semiconductor device housing portion is held by a carrier detachable from the semiconductor device housing portion.

Images