JP2851778B2 - Socket device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket device used in a high-temperature operation test (hereinafter, referred to as a burn-in test) or a function test of a semiconductor device (hereinafter, referred to as a bare chip).

[0002]

2. Description of the Related Art Conventionally, in the test of a bare chip, first, in a wafer state, a probe of a test device (tester) is brought into contact with an electrode formed on the bare chip to perform a characteristic test, and then only a good bare chip in the wafer is assembled. In the process, a final functional test is performed after assembling into a package state and conducting an initial failure screening by a burn-in test.

[0003] Originally, if burn-in or functional inspection can be performed in a wafer state or a bare chip state before assembly, the assembly process will not proceed with latent defects included, which is advantageous in terms of resource saving and cost. Conceivable. However, in the wafer state or bare chip state, it is difficult to stably maintain the connection with the electrodes formed on the bare chip under the high temperature environment of burn-in. I have no choice.

On the other hand, recently, for the purpose of high integration and high functionality, a multi-chip module in which a plurality of bare chips are mounted on one substrate to form one module has been receiving attention. In a multichip module, if there is at least one defective chip among chips to be mounted, the entire module will be defective. For this reason, in the development of multi-chip modules, the quality of bare chips, so-called KGD
(Known Good Die) is required.

Conventionally, as a method of performing burn-in screening in a bare chip state, a protruding electrode is formed on the bare chip side with gold, solder, or the like, and this is once soldered to a test substrate or connected with a conductive adhesive. A burn-in and a function test were performed for each test substrate, and after judging the quality of the bare chip, the bare chip was removed, and only the bare chip whose quality was guaranteed was subjected to the assembling process.

[0006]

However, according to the conventional method, first, a bare chip is soldered to a test board.
Alternatively, a step of bonding with a conductive adhesive, a second step of removing the bare chip from the test substrate after the test, and a third step of washing the bare chip after the test in some cases are required.
As described above, conventionally, not only the process becomes complicated, but also the chance of damaging the bare chip increases.

The present invention is to provide a simple and efficient test socket device for supplying a bare chip with a guaranteed quality which is indispensable for the development of a multi-chip module required in the future. To provide a test socket device that can handle, test, and inspect bare chips as easily as packaged products without mounting and bonding bare chips to test substrates for testing and functional inspection And

[0008]

In order to solve the above-mentioned problems, a test socket according to the present invention is a circuit board on which a semiconductor chip to be inspected is mounted with the protruding electrode surface on the semiconductor chip facing down. A socket housing portion provided with a recess for housing the circuit board, a socket lid portion for covering the housing portion when the circuit board on which the semiconductor chip is mounted is housed in the recess of the socket housing portion, and the socket A socket device comprising a clip for sandwiching an end of a housing part and an end of the socket lid part,
The circuit board includes a positioning portion that performs positioning when the semiconductor chip is mounted, and an electrode provided at a position corresponding to the protruding electrode on the semiconductor chip when the semiconductor chip is positioned and mounted. A circuit board provided on the front surface and having an external extraction electrode joined via a through hole to the electrode provided on the rear surface at a position corresponding to the protruding electrode on the semiconductor chip, wherein the recess of the socket housing portion is provided. An electrode having elasticity is provided at a position corresponding to an external extraction electrode provided on the back surface of the circuit board when the circuit board is stored, and the socket housing portion has the elasticity of the recess on the back surface. A metal pin connected to the electrode is provided.

[0009]

In the above-mentioned structure, in the burn-in test and the function test, the bare chip is pressed into contact with the bare chip electrode by a mechanism for clamping the circuit board on which the bare chip is mounted between the lid and the housing using a clamp. And the electrodes of the motherboard of the test apparatus can be connected via a circuit board, so that a burn-in test and a function test in a bare chip state, which were conventionally difficult, can be easily performed.

Further, if the external shape of the circuit board and the external lead-out electrode are made common, the housing portion can be used in common by exchanging only the circuit board according to a plurality of types of bare chips.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a perspective view showing the structure of a test socket device for bare chip testing according to the present invention. FIG. 2 is a cross-sectional view illustrating a configuration of a circuit board of the test socket device, and is a cross-sectional view illustrating a state where a bare chip is pressed against the circuit board.

1 and 2, reference numeral 1 denotes a bare chip to be tested. Numeral 2 is a protruding electrode formed on the electrode on the bare chip 1 in advance. The thickness of the protruding electrode 2 is 50 μm, and is made of gold (Au).
In FIG. 1, since the bare chip 1 is illustrated with its back surface facing upward, the bump electrodes 2 are not illustrated. Reference numeral 3 denotes a circuit board on which the bare chip 1 is mounted. The circuit board 3 is made of ceramic, and the flatness of the ceramic surface of the bare chip 1 to which the protruding electrode 2 is pressed is kept to 20 μm or less by polishing. The thickness of the bare chip 1 is 4 at present.
By setting the flatness to 5% or less of the thickness of the bare chip 1 in consideration of the thickness of the projecting electrode 2 on the bare chip 1 side, the bare chip 1 does not rattle in the pressed state, and 1 can be accurately pressed without giving an inclination, and stable contact can be achieved. Note that the thickness of the circuit board 3 is 1000 μm. Numeral 4 denotes a positioning part installed on the surface of the circuit board 3,
The bare chip 1 can be positioned by aligning the outer edge of the bare chip 1 with the positioning portion. In the present embodiment, the positioning portion 4 is formed in a continuous L-shape connected vertically and horizontally, but the positioning portion 4 may be formed in a discontinuous L-shape that is not connected vertically and horizontally. Reference numeral 5 denotes a cover of the socket device. Reference numeral 6 denotes a housing of the socket device. The housing portion 6 is provided with a concave portion 6a in which the circuit board 3 can be installed. Both the lid 5 and the housing 6 are made of heat-resistant plastics, and will not be deformed even in a long-term use under a high temperature environment of burn-in. Further, by making the lid 5 and the housing 6 made of plastic, the weight of the socket device can be reduced. Reference numeral 7 denotes an electrode, which is provided on the surface of the recess 6 a of the housing 6. The electrode 7 has elasticity, and adjusts the pressure when the bare chip 1 placed on the circuit board 3 is pressed. Reference numeral 8 denotes a metal pin, which is provided on the bottom surface of the housing 6. The electrode 7 provided on the surface of the concave portion 6a of the housing portion 6 and the metal pin 8 are connected. And at the time of burn-in test or functional test,
It is connected to the motherboard of the test device via the metal pins 8.

If the depth of the concave portion 6a of the housing portion 6 is deeper than the entire thickness of the circuit board 3 on which the bare chip 1 is mounted, the bare chip 1 cannot be pressed and contacted. If the thickness is too shallower than the thickness, the bare chip 1 may be distorted or broken when the bare chip 1 is pressed, so the depth of the concave portion 6a is determined in consideration of the elasticity of the electrode 7 and the thickness of the circuit board 3. Must be set.

In the present embodiment, the depth of the recess 6a is set to 1000 μm, which is the same as the thickness of the circuit board 3, and the elasticity of the electrodes 7 presses the bare chip 1 placed on the circuit board 3 to reduce the pressure applied to the bare chip 1. It is set to 1.6 kg / cm ² .

Next, the circuit board 3 of the socket device of the present embodiment will be described in detail with reference to FIG.

An electrode 9 is formed on the surface of the circuit board 3 by a thick-film method or a thin-film method in accordance with the position of the protruding electrode 2 of the bare chip 1 to be pressed. And coated with gold (Au) as a stable metal. Further, on the back surface, an external extraction electrode 10 is formed at a position corresponding to the electrode 7 connected to the metal pin 8 of the housing portion 6, and the front electrode 9 and the external extraction electrode 10 on the rear surface are formed. They are connected through through holes in the substrate. The electrode 9 and the external extraction electrode 10 are formed of a copper material (BeCu).

The circuit board 3 is set in a predetermined recess 6a of the housing 6. The bare chip 1 is placed on the installed circuit board 3 with the surface of the projecting electrode 2 facing down,
And the outer edge of the bare chip 1 is aligned with the projection electrode 2 and the electrode 9. Further, the lid 5 is overlaid from above the circuit board 3 on which the bare chip 1 is mounted, and the
The bare chip 1 is pressed into contact with the housing part 6 by sandwiching the same. The clamp 11 has a mechanism in which the cover 5 is pressed down by raising itself, and the bare chip 1 is pressed against the cover 5 by sandwiching the cover 5 and the housing 6. When clamped by the clamp 11, the protruding electrode 2 is pressed against the electrode 9 at a constant pressure by pressing the lid 5 from the back surface of the bare chip 1. Further, the external extraction electrode 10 on the back surface of the circuit board 3 is also connected to the metal pin 8 via the elastic electrode 7.
Is pressed against.

In the above-described state, the bare chip 1 is in a socket unit, and can be handled in the same manner as a packaged product. The metal pins 8 can be connected to the motherboard of the test apparatus to exchange electric signals. In addition, a burn-in test and a function test in a chip state instead of a wafer state can be performed without damaging a bare chip.

After the inspection, the clamp 11 is released and the lid 5
Is removed, the press-contacted bare chip 1 can be easily removed from the circuit board 3, and the quality of the bare chip 1 can be assured. Furthermore, since the circuit board 3 can be easily replaced by attaching and detaching it from the housing portion 6, it is possible to deal with a plurality of types of bare chips by replacing the circuit board 3.

[0021]

According to the socket device of the present invention, the quality of bare chips can be easily determined on a chip-by-chip basis during a burn-in test or a function test, which is a problem in bare chip mounting or multichip module development. Thus, it is possible to more easily supply bare chips whose quality is guaranteed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a socket device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a configuration of a circuit board of the socket device according to one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bare chip 2 Protruding electrode 3 Circuit board 4 Positioning part 5 Cover part 6 Housing part 6a Concave part 7 Electrode 8 Metal pin 9 Electrode 10 External extraction electrode 11 Clamp

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Seiichi Kageyama 1-1, Komachi, Takatsuki-shi, Osaka Matsushita Electronics Corporation (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 23 / 32

Claims (1)

(57) [Claims] A circuit board on which a semiconductor chip to be inspected is mounted with the protruding electrode surface on the semiconductor chip facing down; a socket housing section provided with a recess for accommodating the circuit board; A socket cover that covers the housing when the circuit board on which the chip is mounted is housed in the recess of the socket housing, a clip that sandwiches the end of the socket housing and the end of the socket cover; Wherein the circuit board corresponds to a positioning portion for positioning when mounting the semiconductor chip, and a projection electrode on the semiconductor chip when the semiconductor chip is positioned and mounted. An electrode provided at a position on the front surface, and a back surface is in contact with the electrode provided at a position corresponding to the protruding electrode on the semiconductor chip via a through hole. A circuit board provided with a combined external extraction electrode, wherein the recess of the socket housing portion has elasticity at a position corresponding to the external extraction electrode provided on the back surface of the circuit board when the circuit board is stored. The socket device further comprises a metal pin connected to the elastic electrode of the recess on the back surface.