JPH09320720A - Connection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure proper electric connection, even of a bare chip with its bump density. SOLUTION: A connection device 10 for connecting a bare chip 7 having a bump 8 is provided with a chip carrier 20 and a socket 11 to be having a group of contact members 14 and removable mounting the chip carrier. The chip carrier is provided with a guide ring 21 to be removably positioned at a socket unit, a base 3 as a wiring board 25 having a terminal bump 4 electrically connected to each pad 5 contacted with each bump and each pad into contact with each contact member 14, a positioning sheet 27 in which the bump- positioning pore 29 is opened opposite to each pad, a positioning plate 31 in which a chip-positioning pore 32 is opened, and a stop cap having a pressurization member 37 for energizing the bare chip inserted into the chip- positioning pore each pad 5 and press-contacting each bump to each pad, and these are tightened with a bolt 24.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an electrical connection technique,
In particular, it relates to a technique for electrically connecting a semiconductor chip (hereinafter referred to as a chip) that is flip-chip connected to a tester or the like of an inspection apparatus, and includes, for example, a ball grid array package (hereinafter referred to as a BGA package). Semiconductor integrated circuit device (hereinafter referred to as IC)
Related to the one effectively used to electrically connect the chip to the tester for inspecting the chip.

[0002]

2. Description of the Related Art A BGA package is a surface mount type package that realizes a large number of pins without increasing the size of the package. As an IC using the BGA package, there is an IC in which a chip is flip-chip connected to the base of the BGA package (hereinafter referred to as BGA IC). By the way, since the BGA package is a surface mount type package, the socket used for electrically connecting the BGA IC to the tester has the same structure as the surface mount type socket.

On the other hand, in order to increase the manufacturing yield, BGA
For chips that are flip-chip connected, including ICs, in addition to probe inspection after the semiconductor wafer process, functional inspection and burn-in (bare chip) for unpackaged bare chips (hereinafter referred to as bare chips). burn-in) inspection is performed. When inspecting a bare chip, a bare chip connecting device is used to electrically connect the bare chip to a tester. In the conventional bare chip connection device, the bare chip is dropped into the concave portion opened upward in the main body of the device, and each bump of the bare chip is brought into contact with each contact member arranged on the bottom surface of the concave portion. Is configured.

An example of the bare chip burn-in test technique is Nikkei BP Co., Ltd. 1995.
"Nikkei Electronics 1995" issued on June 19, 2015
6-19 no. 638 ”P159 to P173.

[0005]

However, since the conventional bare chip socket is positioned by the outer shape of the chip, when the bumps have a high density, the electrical connection between each bump and the contact member is properly made. It has been made clear by the present inventor that there is a problem that it cannot be secured.

An object of the present invention is to provide a connecting device capable of properly ensuring electrical connection even for a semiconductor chip having a high bump density.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, a semiconductor chip having bumps protruding from one main surface is positioned by the chip positioning holes of the positioning plate, and each bump of the semiconductor chip is positioned by the bump positioning holes of the positioning sheet. The bumps are accurately aligned and brought into contact with the pads on the wiring board.

According to the above-mentioned connecting device, since it is possible to ensure contact between each bump of the semiconductor chip which is the object to be connected and each pad of the wiring board, even a semiconductor chip having a high bump density can be electrically connected. The connection can be properly secured.

[0011]

1 is an exploded perspective view showing a connecting device according to an embodiment of the present invention. FIG. 2 shows the assembled state, (a) is a longitudinal sectional view, (b) is (b) of (a).
It is an expanded sectional view of a part. FIG. 3 shows a bare chip carrier, (a) is a front sectional view, and (b) is a vertical sectional view taken along a diagonal line. Figure 4 shows a socket,
(A) is a front sectional view, (b) is a partial side sectional view taken along line bb of (a). FIG. 5 shows a BGA / IC, in which (a) is a partially cut front view and (b) is a partially omitted bottom view.

In the present embodiment, the connection device according to the present invention is configured as a connection device for electrically connecting a bare chip used in a BGA IC to a tester of a burn-in inspection device.

Here, the BGA IC shown in FIG.
1 will be briefly described. The BGA package 2 of the BGA / IC 1 includes a base 3 formed in a substantially square flat plate shape using an insulating substrate, and one main surface of the base 3 (a mounting surface of the BGA / IC on a printed wiring board. Less than,
The bottom surface. ), A large number of bumps (hereinafter, referred to as terminal bumps) 4 as outer leads are arranged and projected in a substantially square frame shape at the outer peripheral portion. The terminal bumps 4 are formed in a substantially hemispherical shape by using a solder material, and are soldered by being subjected to a reflow soldering process while being adhered to a land of a printed wiring board (not shown) with a solder paste. It is like this.
A plurality of pads 5 as inner leads are formed in the central portion of the upper surface of the base 3 and are arranged in a substantially square frame shape corresponding to the group of terminal bumps 4. Each pad 5 is formed on each terminal bump 4 individually. Each is electrically connected by an electric wiring 6. A bare chip 7 is flip-chip connected onto the base 3 by mechanically and electrically connecting each of the connection conductors 9 formed from electrode bumps 8 described later to each pad 5.

The connection conductors 9 are bumps (hereinafter referred to as electrode bumps) protrudingly provided on the electrode pads (not shown) of the bare chip 7 shown in FIGS. 1, 2 and 3. Reference numeral 8 is a substantially columnar connection conductor formed by flip-chip connection. The electrode bumps 8 are formed into a substantially hemispherical shape by wire-bonding a gold wire to the electrode pads of the bare chip 7, and the pad 5 of the base 3 is reflow-soldered to form the connection conductor 9. It has become. Then, the bare chip 7 in the state of the electrode bump 8 before becoming the connection conductor 9 is electrically connected to the tester (not shown) by the connection device 10 according to the present embodiment.

The connection device 10 according to this embodiment comprises a socket 11 and a bare chip carrier (hereinafter referred to as carrier) 20. Socket 11 is BG
The A / IC socket is diverted, and the main body 12 is formed in a square flat plate shape by using an insulating material such as resin.
It has. The main body 12 has a square storage hole 13 formed concentrically in the central portion, and the storage hole 13 is formed in a size capable of storing the carrier 20 as a whole. The same number of contact members 14 as the terminal bumps 4 of the BGA / IC 1 are mounted on the bottom wall of the storage hole 13 so as to correspond to the arrangement of the terminal bumps 4. The contact member 14 is configured by using a so-called pogo pin, and absorbs an error in height between the terminal bumps 4 and 4 by the elastic force of the spring. Each contact member 14 is electrically connected to a connector (not shown) on the testing board of the burn-in inspection device. A lid 15 for opening and closing the opening of the housing hole 13 is rotatably attached to one side of the upper surface of the main body 12 by a hinge portion 16, and the lid 15 is closed by a stopper (not shown) such as a buckle. The condition is maintained.

The carrier 20 includes a guide ring, a wiring board,
A positioning sheet, a positioning plate, and a pressing lid are provided, and these are assembled and integrated by bolts. The guide ring 21 is made of resin or the like and formed in a square frame shape. The outer diameter of the guide ring 21 is set to be substantially equal to the inner diameter of the housing hole 13 of the socket 11, and the inner diameter of the guide ring 21 is set to be substantially the same as the outer diameter of the group row of the contact members 14 of the socket 11. A pair of through holes 22 and 22 are formed as guide recesses at one diagonal position of the guide ring 21, and each through hole 22 is a guide projection that is provided on the bottom surface of the storage hole 13 of the socket 11. It is adapted to be fitted with the parts 17, respectively. A pair of female screw holes 23, 23 into which bolts 24 for integrating the carrier 20 are screwed are formed at the other diagonal positions of the guide ring 21.

In the present embodiment, the wiring board 25 is diverted from the base 3 of the BGA / IC1 described above, and by this diverting, the adverse effect of exclusively manufacturing the wiring board 25 is avoided. A large number of terminal bumps 4 are arranged on the lower surface of the base 3 and are arranged in a projecting manner in a substantially square frame shape in the outer peripheral portion.
It constitutes the terminal of. At the center of the upper surface of the base 3, the same number of pads 5 as the group of terminal bumps 4 are arranged in a substantially square frame shape, and these pads 5 form the pads of the wiring board 25. Each pad 5 is electrically connected to each terminal bump 4 by each electric wiring 6. A pair of insertion holes 26 for inserting the bolts 24 are formed at one diagonal position of the base 3 as the wiring board 25.
26 are opened, and the insertion holes 26 correspond to the female screw holes 23 of the guide ring 21, respectively.

The positioning sheet 27 is provided with a sheet main body 28 formed in a square sheet shape by using a flexible resin film. The outer diameter of the sheet body 28 is set to be substantially the same as the outer diameter of the wiring board 25, and the thickness thereof is set to be thinner than the height dimension of the electrode bump 8 of the bare chip 7 described above. The sheet main body 28 is provided with electrode bump positioning holes 29 arranged in the same number as the group of electrode bumps 8 so as to correspond to the group of electrode bumps 8. The inner diameter of the electrode bump positioning holes 29 is equal to that of the electrode bumps 8.
It is set to be slightly larger than the outer diameter of. When the electrode bumps 8 are fitted into the electrode bump positioning holes 29, the electrode bumps 8 are attached to the pads 5 of the wiring board 25.
It becomes the state matched to each. A pair of insertion holes 30, 30 for inserting the bolts 24 are formed at one diagonal position of the seat body 28, and each insertion hole 3
0 corresponds to each female screw hole 23 of the guide ring 21.

The positioning plate 31 is made of resin or the like and formed into a square flat plate shape, and its outer diameter is set to be substantially equal to the outer diameter of the wiring board 25. A bare chip positioning hole 32 is formed in a square shape in the center of the positioning plate 31, and the inner diameter thereof is set to be slightly larger than the outer diameter of the bare chip 7. Therefore, the bare chip 7 is placed in the bare chip positioning hole 32.
When each of the electrode bumps 8 is inserted into the positioning sheet 27,
The respective electrode bump positioning holes 29 are put into the respective states. On the upper edge of the bare chip positioning hole 32, a taper 33 forming an angle of attack is formed so as to spread upward. A pair of insertion holes 34, 34 for inserting the bolts 24 are formed at one diagonal position of the positioning plate 31, and each insertion hole 34 is formed in the guide ring 21.
Of the female screw holes 23.

The pressing lid 35 has a lid body 36 made of resin and formed in a square flat plate shape, and the outer diameter of the lid body 36 is set to be substantially equal to the outer diameter of the wiring board 25. A pressure member 37 made of an elastic material such as rubber or resin is attached to the lower surface of the lid main body 36, and the pressure member 37 is formed in a square shape having a diameter smaller than the outer diameter of the bare chip 7. There is. A pair of insertion holes 38, 38 for inserting the bolts 24 are formed in one diagonal position of the lid main body 36, and each insertion hole 38 corresponds to each female screw hole 23 of the guide ring 21. There is.

Next, the operation will be described. When the bare chip 7 as the inspection object to be subjected to the burn-in inspection is loaded on the carrier 20, first, the base 3 of the BGA IC1 is
Is brought into contact with the upper surface of the guide ring 21 as the wiring board 25, and the positioning sheet 27 and the positioning plate 31 are sequentially stacked from the bottom on the base 3 serving as the wiring board 25. At this time, the insertion hole 26 of the wiring board 25, the insertion hole 30 of the positioning sheet 27, and the insertion hole 34 of the positioning plate 31 are aligned with the female screw hole 23 of the guide ring 21.

Then, a bare chip 7 as an object to be inspected
With the main surface on the electrode bump 8 side facing downward, and taper 33 to the bare chip positioning hole 32 of the positioning plate 31.
Is dropped as a guide. Bare chip 7 is bare
When positioned by the chip positioning holes 32, the electrode bumps 8 of the bare chip 7 are fitted and positioned in the electrode bump positioning holes 29 of the positioning sheet 27, respectively. The respective pads 5 are aligned with each other.

Next, the pressing lid 35 is put on the upper surface of the positioning plate 31 so that the insertion holes 38 are aligned with the insertion holes 34 and the bolts 24 are inserted into the insertion holes 38 so that the female screw holes of the guide ring 21. Screwed into 23. When the pressing lid 35 is assembled on the positioning plate 31, the pressing member 37 of the pressing lid 35 presses the bare chip 7 from top to bottom.
The electrode bumps 8 are pressed against the aligned pads 5 to be electrically connected.

The carrier 20 in which the bare chip 7 is hermetically held by being integrated as described above is mounted in the socket 11 electrically connected to the tester of the burn-in inspection apparatus. That is, the carrier 20 is the storage hole 1 of the socket 11.
3 with the guide ring 21 side facing downward, each through hole 2
2 and each guide convex part 17 are fitted and stored. When the through holes 22 and the guide protrusions 17 are fitted together, the carrier 20 and the socket 11 are aligned with each other, so that the terminal bumps 4 as the terminals of the wiring board 25 of the carrier 20.
Are aligned with the contact members 14 of the socket 11, respectively. Subsequently, when the lid body 15 of the socket 11 is closed and fixed so as to cover the opening of the storage hole 13, each terminal bump 4 is pressed against each aligned contact member 14 and electrically connected. become.

When the carrier 20 is mounted in the socket 11, a test signal is exchanged between the tester of the burn-in inspection device and the bare chip 7 as the object to be inspected through the connection device 10, and the bare chip 7 is tested. Burn-in inspection is performed. At this time, the test signal is transmitted between the bare chip 7 and the tester through the electrode bumps 8 of the bare chip 7, the pads 5 of the base 3 as the wiring board 25, the electrical wiring 6, the terminal bumps 4, and the contact members 14 of the socket 11. Exchanged between.

When the desired inspection is completed, the lid 15 of the socket 11 is opened, the carrier 20 is removed from the storage hole 13 of the socket 11, and is transferred to the next step. After that, by repeating the above-described operation, the burn-in inspection is sequentially executed by the tester for the bare chip 7 of the BGA IC 1 via the connection device 10.

According to the above-described embodiment, the following effects can be obtained. (1) By positioning the bare chip 7 by the bare chip positioning hole 32 of the positioning plate 31 and by positioning each electrode bump 8 of the bare chip 7 by the electrode bump positioning hole 29 of the positioning sheet 27, Since each electrode bump 8 can be accurately aligned and brought into contact with each pad 5 of the base 3 as the wiring board 25, a bare bump having a high bump density can be obtained.
It is possible to properly secure the electrical connection of the chip 7 to the tester.

(2) By aligning the guide ring 21 incorporated in the carrier 20 with the socket 11, the terminal bumps 4 of the base 3 as the wiring board 25 of the carrier 20 accommodating the bare chip 7 are inserted into the socket 11.
Therefore, the bare chip 7 housed in the carrier 20 can be properly electrically connected to the tester through the socket 11 because the respective contact members 14 can be properly brought into contact with each other.

(3) Bare chip 7 as the inspection object
By using the base 3 of the BGA package 2 of the BGA / IC1 which is the product (semiconductor device) of FIG. 1 as the wiring board 25, it is not necessary to manufacture a dedicated wiring board 25, and the cost of the entire inspection process is reduced. Moreover, the wear of the pad 5 caused by the contact with the electrode bump 8 can be swiftly dealt with by exchanging the base 3, and the development of a new product of BGA / IC1 and the specification change can be swiftly dealt with. can do.

(4) By diverting the BGA / IC socket as the socket 11 for electrically connecting the carrier 20 to the tester, it is not necessary to manufacture a dedicated socket 11, so the cost of the entire inspection process is increased. Can be reduced.

(5) Since the bare chip 7 is sealed by the carrier 20 to prevent dust, it is possible to prevent the bare chip 7 from being contaminated.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, the carrier 20 is not limited to be fastened by the bolt 24, but it is desirable that the carrier 20 be fastened by one-touch operation.

In the above description, the BGA, which is the field of application of the invention mainly made by the present inventor, was the background.
-The case where the technology is applied to the bare chip connection technology of the IC has been described, but the invention is not limited to this.
(Tape carrier package) -It can be applied to general connection technology of chips having electrode bumps protruding from one main surface such as IC bare chips. For example, TCP
When applied to the bare chip of IC, the TCP
-The TAB tape used for IC can be used as a wiring board. Also, as the socket, TCP / I
The C socket can be used.

In the above description, the case where the invention made by the present inventor is mainly applied to the connection technology to the tester of the burn-in inspection apparatus which is the field of application in the background has been described, but the invention is not limited thereto. The present invention can be applied to all connection devices for making electrical connection to electronic components and electronic devices by contacting the bumps of the bare chip in connection technology for connecting a bare chip function tester to a tester. In particular, the present invention exerts an excellent effect when applied to a connecting device used for connecting an electronic component or an electronic device which requires frequent electrical connection and reliable electrical connection.

[0036]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

The semiconductor chips having bumps protruding from one main surface are positioned by the chip positioning holes of the positioning plate, and the bumps of the semiconductor chips are positioned by the bump positioning holes of the positioning sheet. Since the pads on the wiring board can be accurately aligned and brought into contact with each other, proper electrical connection can be ensured even for a semiconductor chip having a high bump density.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a connection device according to an embodiment of the present invention.

2A and 2B show the assembled state, FIG. 2A is a vertical sectional view, and FIG. 2B is an enlarged sectional view of a portion b of FIG.

FIG. 3 shows a bare chip carrier, (a)
Is a front sectional view, and (b) is a vertical sectional view taken along a diagonal line.

FIG. 4 shows a socket, (a) is a front sectional view,
(B) is a partial side sectional view taken along the line bb of (a).

FIG. 5 shows a BGA / IC, in which (a) is a partially cut front view and (b) is a partially omitted bottom view.

[Explanation of symbols]

1 ... BGA / IC (object to be connected, semiconductor device), 2 ... BG
A package, 3 ... Base (part of the package), 4 ...
Terminal bumps (terminals), 5 ... Pads, 6 ... Electrical wiring, 7 ...
Bare chip (semiconductor chip), 8 ... Electrode bump, 9 ...
Connection conductor, 10 ... Connection device, 11 ... Socket, 12 ... Socket body, 13 ... Storage hole, 14 ... Contact member, 1
5 ... Lid, 16 ... Hinge part, 17 ... Guide convex part, 20 ...
Carrier, 21 ... Guide ring, 22 ... Through hole (guide recess), 23 ... Female screw hole, 24 ... Bolt, 25 ... Wiring board, 26 ... Insertion hole, 27 ... Positioning sheet, 28 ... Sheet body, 29 ... Electrode bump positioning Hole, 30 ... insertion hole,
31 ... Positioning plate, 32 ... Bare chip positioning hole, 33 ... Taper, 34 ... Insertion hole, 35 ... Holding lid, 3
6 ... Lid body, 37 ... Pressure member, 38 ... Insertion hole.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01R 33/94 9462-5B H01R 33/94

Claims (3)

[Claims] 1. A connection device for electrically connecting a semiconductor chip having a plurality of bumps protruding from one main surface to an electric device, the chip carrier accommodating the semiconductor chip, and each of the bumps. And a socket having each contact member electrically connected thereto, in which the chip carrier is detachably mounted, and the chip carrier is removably aligned with the body of the socket. A pad that contacts each bump of the semiconductor chip and a wiring board that is electrically connected to each pad and contacts each contact member and that is detachably assembled to a guide ring; Bump positioning holes, into which bumps can be inserted, are opened facing the respective pads of the wiring board, and are detachably assembled to the wiring board. A positioning sheet to be attached, a positioning plate that is provided with a chip positioning hole into which the semiconductor chip can be inserted and is detachably assembled to the positioning sheet, and the semiconductor chip inserted into the chip positioning hole is urged to each A connecting device comprising: a pressing lid that has a pressing member that presses a bump against each of the pads and is detachably attached to the positioning plate. 2. The connection device according to claim 1, wherein a component of a package of a semiconductor device in which the semiconductor chip is used is diverted as the wiring board. 3. The connection device according to claim 1, wherein a socket for electrical connection to a semiconductor device in which the semiconductor chip is used is diverted as the socket.