JP2001143841A - Contact pin group arrangement body, method of manufacturing the same, and socket for electric parts using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact pin group arrangement body for easy assembly using a contact pin with good contact stability, method of manufacturing the same, and socket for electric parts using the same. SOLUTION: The contact pin group arrangement body 14 is formed as a plurality of contact pins 15 which are adjacently disposed at prescribed intervals and fixed with an insulator 17 astride the pins 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an array of contact pins provided in a socket for an electrical component which detachably holds an electrical component such as a semiconductor device (hereinafter referred to as an "IC package"), and an array of the contact pins. And a socket for electrical components using the contact pin group array.

[0002]

2. Description of the Related Art Conventionally, as this kind of "socket for electric parts", there is an IC socket for detachably holding an IC package as an "electric part".

[0003] This IC package includes a BGA (Ball Gr
There is a so-called "id Array" type in which a large number of solder balls are provided as terminals on the lower surface of a rectangular package body.

[0004] A contact pin is provided on the IC socket, and a contact portion which is separated from and connected to a solder ball of the IC package is formed at the tip of an elastic piece formed on the contact pin.

[0005] A cover plate is rotatably arranged with respect to the socket body. After the IC package is accommodated in the socket body, the cover plate is closed. The package is pressed to bring its terminals into contact with the contact pin contact portions. In this state, a performance test such as a burn-in test is performed.

[0006]

However, in such a conventional device, the pitch between the terminals of the IC package becomes extremely short due to the miniaturization of the IC package. The work of assembling the plurality of miniaturized contact pins into a miniaturized IC socket has been very difficult.

[0007] On the other hand, there are sheet-like contacts that can be easily assembled, but they have poor durability and are expensive.

Therefore, the present invention provides a contact pin group array that can be easily assembled using contact pins having good contact stability, a method of manufacturing the contact pin group array, and this contact pin group array. An object of the present invention is to provide a socket for an electric component using a body.

[0009]

According to an aspect of the present invention, there is provided an array of contact pins, wherein a plurality of contact pins are arranged adjacent to each other at a predetermined interval. The plurality of contact pins are formed by being fixed with an insulator straddling the contact pins.

According to a second aspect of the present invention, there is provided a method for manufacturing an array of contact pins, wherein an intermediate product in which a plurality of contact pins are connected by a dam bar is formed by pressing a conductive plate. An insulator is provided so as to straddle the plurality of contact pins of the intermediate product, the plurality of contact pins are fixed, and then the dam bar is cut to form a non-conductive state between the contact pins. And

According to a third aspect of the present invention, in addition to the configuration of the second aspect, the plurality of contact pins are embedded and fixed by an insulator made of synthetic resin by insert molding.

According to a fourth aspect of the present invention, in addition to the configuration of the second aspect, the insulator has two resin plates, and the intermediate product is sandwiched between the two resin plates. It is characterized by being fixed by fixing means.

According to a fifth aspect of the present invention, there is provided a socket for an electrical component, wherein a plurality of the contact pin group arrangements according to the first aspect are fixed to the socket body, and the contact pins of each contact pin group arrangement are arranged. Is characterized in that the contact portion can be separated from and connected to the terminal of the electric component.

[0014]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 6 show a first embodiment of the present invention.

First, the structure will be described.
The IC socket 11 is an “electric component socket”. The IC socket 11 is used for performing a performance test of an IC package 12 (see FIG. 3) that is an “electric component”.
Solder balls 12b which are “terminals” of the package 12,
It is intended to electrically connect a measuring instrument (tester) to a printed wiring board (not shown).

The IC package 12 is a so-called BGA (Ball Grid Array) type as shown in FIG. 3, for example, and has a rectangular package body 12a.
A large number of substantially spherical solder balls 12b protrude from the lower surface of are arranged in a matrix.

On the other hand, as shown in FIG. 1, for example, the IC socket 11 generally has a socket body 13 mounted on a printed wiring board, and the socket body 13 is in contact with the solder balls 12b. A plurality of contact pin group arrangements 14 having contact pins 15 are provided, and a floating plate 16 as a “mounting portion” on which the IC package 12 is mounted is provided.
A pressing member 18 and a cover plate 19 are rotatably provided on the socket body 13.

As shown in FIGS. 5 and 6, the contact pin group array 14 has a plurality of contact pins 15 arranged adjacent to each other at a predetermined interval, and a rectangular parallelepiped made of synthetic resin straddling the plurality of contact pins 15. It is fixed with a shaped insulator 17.

The contact pins 15 have a spring property and are formed of a plate having excellent conductivity by press working, etching working, or the like into a shape as shown in FIG.

More specifically, the contact pins 15
A resilient piece 15a is formed obliquely at a portion extending from the insulator 17 to one side, and a lead portion 15b bent downward is formed at a portion extending to the other side.
Are formed.

At the upper end of the elastic piece 15a, a contact portion 15c is formed along a substantially horizontal direction, and the contact portion 15c is brought into contact with the solder ball 12b of the IC package 12.

The plurality of contact pin group arrangements 14 are arranged on the socket body 13 so as to overlap each other, and each contact pin contact portion 15c of each contact pin group arrangement 14 is connected to the floating plate 16
Is inserted into the opening 16a formed at the bottom. This opening 1
The IC package solder ball 12b is inserted into the contact pin contact portion 15c.

The floating plate 16 is formed with guide portions 16b for guiding each corner of the package main body 12a around the floating plate 16, and the floating plate 16 is urged upward by a spring member (not shown). , And are arranged to be movable up and down.

As shown in FIG. 1, the cover plate 19 is rotatably attached to the socket body 13 via a pivot pin 20, and the pivot pin 20 is inserted into the elliptical hole 18a of the pressing member 18. Has been inserted. The pressing member 18 is urged by a spring 21 provided on the pivot pin 20 in a direction pressed against the cover plate 19, and is urged in a direction to open the cover plate 19.

In FIG. 1, a locking lever 22 is rotatably provided on the left side of the socket body 13 by a pivot pin 23 on the socket body 13, and is urged in a standing direction by a spring 24.

The locking lever 22 has a locking jaw 22a formed thereon.
Is locked in a locking groove 19a formed in the cover plate 19 in the closed state.

Next, a method of manufacturing the contact pin group array 14 will be described.

First, a metal plate having conductivity is processed by, for example, press working to form an intermediate product 27 (a state without the insulator 17 in FIG. 6) in which a plurality of contact pins 15 are connected by a dam bar 26.

Thereafter, as shown in FIG. 6, an insert 17 is used to insert a synthetic resin insulator 17 having an insulating property.
A portion of the intermediate product 27 between the dam bars 26, 26 is embedded so as to straddle the plurality of contact pins 15, and the plurality of contact pins 15 are fixed at predetermined intervals.

Next, a predetermined bending process is performed on the plurality of contact pins 15 to obtain a shape as shown in FIG. 5, and the dam bar 26, that is, a portion between the contact pins 15, 15 is cut. Thus, the contact pin group array 14 is formed with the respective contact pins 15 in a non-conductive state.

The contact pins 15 can be bent before the insert molding.

With such a structure, the plurality of contact pins 15 can be easily and precisely arranged at a fine pitch.

The contact pin group array 1
As shown in FIGS. 1 and 2, a plurality of 4 are superimposed on the socket body 13, and the rectangular parallelepiped insulator 17 is positioned and arranged on the socket body 13. This makes it possible to easily arrange a plurality of contact pins 15 at predetermined positions of the socket body 13 as compared with a case where individual contact pins are arranged at a fine pitch as in the related art.
The assemblability can be improved. Further, it is not necessary to use an expensive sheet-like contact as in the related art.

Next, a case where the IC package 12 is mounted on the IC socket 11 will be described.

First, the cover plate 19 and the pressing member 1
8, the IC package 12 is guided by the guide portion 16b of the floating plate 16 and mounted on the floating plate 16 (FIGS. 1 and 3).
reference). In this state, the solder balls 12b of the IC package 12 are inserted into the floating plate openings 16a.

Next, the package body 12a is pressed by the pressing member 18 by closing the opened pressing member 18 and the cover plate 19 against the urging force of the spring 21. Thereby, the contact pin contact portion 15c
And the IC package solder ball 12b are brought into contact with a predetermined contact pressure.

When the cover plate 19 is completely closed, the locking jaw 22a of the locking lever 22 is moved to the cover plate 1.
Thus, the closed state of the cover plate 19 is maintained by being locked in the locking groove 19a of the ninth embodiment.

[Second Embodiment of the Invention] FIG. 7 shows a second embodiment of the present invention.

In the second embodiment, a plurality of contact pins 15 (only one contact pin 15 is drawn in FIG. 7 for convenience) are sandwiched between two resin plate members 30 having an insulating property. In this state, it is fixed with rivets 31 as “fixing means”.

Of course, other than the rivet 31, the "fixing means" may be a locking structure having locking claws or the like, or a fitting structure.

Other configurations and operations are the same as those of the first embodiment, and therefore the description is omitted.

In the above-described embodiment and the like, the present invention is applied to the IC socket 11 as the "socket for electric parts". However, the present invention is not limited to this and can be applied to other devices. Further, the type of the IC socket is not limited to the so-called clamshell type as in the above embodiment, but may be an open top type. Further, the method of providing the dam bar 26 is not limited to the above-described embodiment, but may be any as long as a plurality of contact pins can be connected at predetermined intervals and can be cut later. Furthermore, the IC package accommodated in the IC socket is not a floating plate, but only contact pins, only the socket body,
Alternatively, a shape supported by two or more of them may be used. Furthermore, the method of arranging the contact pin group array on the socket body is not limited to the case where the contact pin group array is arranged to be stacked as in the above-described embodiment. They can also be arranged side by side.

[0044]

As described above, according to the first aspect of the present invention, a plurality of contact pins are arranged adjacent to each other at a predetermined interval, and the plurality of contact pins straddle these contact pins. By using a contact pin group array fixed with insulators, simply arranging such an array on the socket body, compared to the conventional case where single contact pins are arranged on the socket body at a fine pitch as before. Then, the assembling work can be performed extremely easily, and there is no need to use expensive sheet-like contacts.

According to the second aspect of the present invention, the conductive plate is processed to form an intermediate product in which a plurality of contact pins are connected by a dam bar, and the intermediate product straddles the plurality of contact pins. An insulator is provided to fix the plurality of contact pins, and then, the dam bar is cut to form a non-conductive state between the contact pins, so that the fine pitch contact pins can be formed accurately and easily. A contact pin group array that can be arranged can be formed.

According to the third aspect of the present invention, in addition to the above-described effects, insert molding allows the use of a synthetic resin insulator.
Since the plurality of contact pins are embedded and fixed, formation of the contact pin group array can be performed in a short time.

[Brief description of the drawings]

FIG. 1 is a sectional front view of a part of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged view showing an arrangement state of a contact pin group array in the IC socket according to the first embodiment;

FIG. 3 is an enlarged view of a main part showing a floating plate and an IC package housed in the floating plate in the IC socket according to the first embodiment.

FIG. 4 is an enlarged sectional view showing a contact state between a contact pin contact portion and a solder ball of an IC package according to the first embodiment.

FIG. 5 is a perspective view showing the contact pin group array according to the first embodiment during molding;

FIG. 6 is a plan view showing a state where the contact pin group array according to the first embodiment is being formed;

FIG. 7 is a perspective view showing a part of a contact pin group array according to Embodiment 2 of the present invention;

[Explanation of symbols]

 11 IC socket (socket for electric parts) 12 IC package (electric parts) 12a Package body 12b Solder balls (terminals) 13 Socket body 14 Contact pin group arrangement 15 Contact pins 15c Contact part 16 Floating plate (mounting part) 17 Insulator 26 Dam bar 27 Intermediate product 30 Resin plate 31 Rivets (fixing means)

Claims (5)

[Claims] 1. A contact pin group arrangement, wherein a plurality of contact pins are arranged adjacent to each other at a predetermined interval, and the plurality of contact pins are formed by being fixed with an insulator straddling the contact pins. body. 2. An intermediate product in which a plurality of contact pins are connected by a dam bar by processing a conductive plate material, and an insulator is provided so as to straddle the plurality of contact pins of the intermediate product. A method of manufacturing a contact pin group array, comprising: fixing the contact pins, and then cutting the dam bar to form a non-conductive state between the contact pins. 3. The method according to claim 2, wherein the plurality of contact pins are buried and fixed with a synthetic resin insulator by insert molding. 4. The insulator has two resin plates,
3. The method for manufacturing a contact pin group array according to claim 2, wherein said intermediate product is fixed by fixing means while said intermediate product is sandwiched between said two resin plate members. 5. A plurality of contact pin group arrangements according to claim 1 are fixed to a socket body, and a contact portion of a contact pin of each contact pin group arrangement can be separated from or connected to a terminal of the electric component. A socket for an electrical component, characterized in that: