JP4169841B2 - Socket for electrical parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention has been improved in a socket for an electrical component for detachably holding an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), in particular, an arrangement of contact pins electrically connected to the electrical component. The present invention relates to a socket for electrical parts.
[0002]
[Prior art]
Conventionally, this type of “electrical component socket” is preliminarily disposed on a circuit board and detachably holds the IC package, which is an “electrical component”, so that the IC package and the circuit board are electrically connected. There are IC sockets that are designed to be connected to each other.
[0003]
As the IC package, for example, there is a BGA (Ball Grid Array ) type in which a solder ball as a large number of terminals protrudes from the lower surface of a rectangular plate-shaped package body.
[0004]
Then, with the IC package held in the IC socket, a large number of solder balls of the IC package are brought into contact with the contact portions of the contact pins of the IC socket, so that each solder ball of the IC package and the circuit board Are electrically connected by each contact pin.
[0005]
Specifically, as shown in FIGS. 5 to 7, the socket body 1 is provided with the insertion portion 2a of the contact pin 2 inserted therein, and the contact pin 2 is substantially S-shaped above the insertion portion 2a. The contact portion 2c is formed via the elastically deformable curved portion 2b. The contact portion 2 c has an inverted U shape, is inserted into the slit 3 a of the upper plate 3, and comes into contact with the solder balls 4 a of the IC package 4 placed on the top plate 3.
[0006]
The contact portion 2c is displaced in the vertical direction when the bending portion 2b is elastically deformed, and a predetermined contact pressure is secured to the solder ball 4a.
[0007]
As shown in FIG. 5A, a large number of such contact pins 2 are arranged adjacent to each other in a matrix, and the protruding directions of the curved portions 2b are set to face in the same direction.
[0008]
[Problems to be solved by the invention]
However, in such a conventional device, when the contact pin 2 is inserted into the socket body 1 as shown in FIG. 6, or when it is pulled out as shown in FIG. For example, when inserting, the contact pin 2 must be inserted while being tilted as shown by a two-dot chain line in FIG. There is a problem of being bad.
[0009]
In particular, each terminal (solder ball 4a) of the IC package 4 tends to have a narrow pitch, and correspondingly, there is a demand for a narrow pitch of the contact pins 2 of the IC socket. It has become to.
[0010]
Therefore, the present invention provides an electrical component socket that prevents a curved portion from coming into contact with an adjacent contact pin when inserting and removing a contact pin, thereby preventing deformation and improving assembly workability. provide.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is a socket main body on which an electrical component is placed, and a plurality of contacts arranged in a matrix on the socket main body and capable of contacting terminals of the electric component. The contact pin is formed with an elastically deformable curved portion so that the contact portion that contacts the terminal is displaced in the vertical direction, and the protruding direction of the curved portion is In the electrical component socket in which the plurality of contact pins are arranged such that when the contact pins are arranged in the same direction, the curved portion overlaps the adjacent contact pins in the vertical direction, the adjacent contacts The pin is a socket for an electrical component that is arranged so that the protruding direction of each of the curved portions has a substantially right angle.
[0012]
According to the invention described in claim 2, in addition to the configuration described in claim 1, the curved portion is formed in a substantially S shape .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0014]
1 to 4 show an embodiment of the present invention.
[0015]
First, the configuration will be described. Reference numeral 11 in FIG. 1 denotes an IC socket as an “electrical component socket”. This IC socket 11 is used to perform a performance test of the IC package 12 as an “electrical component”. The solder balls 12b, which are 12 “terminals”, are electrically connected to a circuit board (not shown) on the IC testing apparatus side.
[0016]
In this IC package 12, a large number of solder balls 12b protrude in a matrix form at a predetermined pitch from the lower surface of the rectangular plate-shaped package body 12a downward.
[0017]
On the other hand, in the IC socket 11, an upper plate 15 is disposed on the base portion 13 a of the socket body 13, and the IC package 12 is placed on the upper plate 15. A cover 16 for pressing the IC package 12 from above is rotatably attached. A large number of contact pins 17 for electrical connection between the IC package 12 pressed by the cover 16 and the circuit board disposed below the socket body 13 correspond to the large number of solder balls 12b. Arranged in a matrix.
[0018]
Specifically, the contact pins 17 are formed of a material having excellent conductivity and elasticity, and are inserted into the through holes 13b formed in the base portion 13a of the socket body 13 as shown in FIG. An insertion portion 17a, an elastically deformable substantially S-shaped bending portion 17b formed on the upper side of the insertion portion 17a, and a contact portion 17c formed on the upper side of the bending portion 17b and in contact with the solder ball 12b. have. A lead portion 17d protruding downward from the socket body 13 of the insertion portion 17a is connected to the circuit board.
[0019]
The contact portion 17c has an inverted U shape, and is configured to be displaced in the vertical direction when the bending portion 17b is elastically deformed.
[0020]
The upper plate 15 has a plurality of locking pieces 15a projecting downward from the peripheral edge thereof, and the locking pieces 15a are inserted into the guide holes 13c of the socket body 13 so as to be movable up and down. A hook portion 15 b is formed at the lower end portion of the stopper piece 15 a, and the hook portion 15 b is locked to the locked portion 13 d of the socket body 13. The upper plate 15 is biased upward by a coil spring 18. Further, the upper plate 15 is provided with four guide portions 15c for positioning the IC package 12 in the lateral direction on the upper surface portion side so as to correspond to the respective corner portions of the rectangular package body 12a. Yes. Furthermore, the upper plate 15 is formed with a large number of rectangular insertion holes 15d into which the solder balls 12b are inserted, and a contact portion 17c of the contact pin 17 is formed on the bottom surface of the insertion hole 15d. A slit portion 15e to be inserted is formed.
[0021]
The direction of the contact pin 17 is determined by the forming direction of the slit portion 15e, and the adjacent forming directions of the slit portion 15e are perpendicular to each other. By inserting into the slit portion 15e, the adjacent contact pins 17 are arranged such that the protruding direction P of the curved portion 17b is a certain angle, here, substantially perpendicular, as shown in FIG. Is set.
[0022]
Further, the cover 16 is pivotally attached to the socket body 13 by a shaft 20 on the base end side, and is urged in the opening direction (clockwise in FIG. 1) by a spring 21. As shown in FIG. 2, the provided latch member 22 is engaged with the latched portion 13 e of the socket body 13 so that the closed state is maintained.
[0023]
Further, the cover 16 is formed with a pressing portion 16a that presses the package body 12a in a state where the cover 16 is closed.
[0024]
Since the protruding direction P of each curved portion 17b of the adjacent contact pin 17 is arranged at a substantially right angle in this way, the insertion / removal of each contact pin 17 can be performed without contacting the adjacent contact pin 17. It can be done easily.
[0025]
That is, the contact pin 17 is formed with an S-shaped curved portion 17b that can be elastically deformed in order to displace the contact portion 17c up and down. Conventionally, as shown in FIG. The adjacent contact pins 2 have overlapped portions H in the vertical direction, but here, as shown in FIG. 4B, the adjacent contact pins 17 are arranged by the above-described arrangement relationship. There is a gap C between them. Therefore, when the contact pin 17 is inserted or removed, even if the contact pin 17 is not tilted and straightly inserted or removed, the curved portion 17b or the like does not come into contact with the adjacent contact pin 17, and the contact pin 17 Since 17 does not deform and does not need to be tilted, workability is also good.
[0026]
Next, a case where such an IC socket 11 is used will be described.
[0027]
The lead portions 17d of the contact pins 17 of the IC socket 11 are connected to the circuit board in advance, so that the plurality of IC sockets 11 are arranged on the circuit board. From this state, the IC package 12 is housed in each IC socket 11 and the IC package 12 and the circuit board are electrically connected as follows.
[0028]
That is, as shown in FIG. 1, with the cover 16 opened, the IC package 12 is conveyed by an automatic machine or the like, and is guided on the upper plate 15 by the guide portion 15c and placed at a predetermined position.
[0029]
In this state, the solder ball 12b of the IC package 12 is inserted into the insertion hole 15d of the upper plate 15, and the solder ball 12b is brought into contact with the contact portion 17c of the contact pin 17.
[0030]
Thereafter, by closing the cover 16, the IC package 12 is pressed by the pressing portion 16a. As a result, the upper plate 15 is lowered against the urging force of the coil spring 18 and the curved portion 17b of the contact pin 17 is elastically deformed, whereby the contact portion 17c is displaced downward, and this reaction force As a result, the contact portion 17c and the solder ball 12b come into contact with each other at a predetermined contact pressure to ensure contact stability.
[0031]
In this way, the IC package 12 and the circuit board are electrically connected via the IC socket 11, whereby the test of the IC package 12 and the like are performed.
[0032]
In the above-described embodiment, the present invention is applied to the IC socket 11 as the “socket for electrical parts”. However, the present invention is not limited to this and can be applied to other devices. In the above embodiment, the present invention is applied to the IC socket for the BGA type IC package 12. However, the present invention is not limited to this, and the present invention is applied to an IC socket for an IC package of an LGA (Land Grid Array ) type or the like. It can also be applied. Furthermore, in the present embodiment, the present invention is applied to the so-called clamshell type IC socket 11 having the cover 16, but the present invention is not limited to this, and can of course be applied to a so-called open top type IC socket. Furthermore, the shape of the curved portion of the contact pin is not limited to the S shape as in the above-described embodiment, but may be a C shape or the like.
[0033]
【The invention's effect】
As described above, according to the invention described in each claim, the adjacent contact pins are arranged so that the protruding directions of the curved portions have a substantially right angle. When performing the extraction, it is possible to prevent the curved portion from coming into contact with the adjacent contact pin, and the practically beneficial effect that the deformation can be prevented and the assembling workability can be improved is exhibited.
[Brief description of the drawings]
FIG. 1 is a sectional view of an IC socket according to an embodiment of the present invention with a cover opened.
FIG. 2 is a cross-sectional view showing a state where a cover of the IC socket according to the embodiment is closed;
FIG. 3 is a side view showing a state in which the cover of the IC socket according to the embodiment is closed;
4A and 4B are diagrams showing a contact pin arrangement state and the like of the IC socket according to the embodiment, where FIG. 4A is a plan view and FIG. 4B is a cross-sectional view.
FIGS. 5A and 5B are diagrams showing a contact pin arrangement state of an IC socket of a conventional example, where FIG. 5A is a plan view and FIG. 5B is a cross-sectional view.
FIG. 6 is a view showing an inserted state of the contact pin of the conventional example.
FIG. 7 is a view showing a contact pin removal state of the conventional example.
[Explanation of symbols]
11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12b Solder ball (terminal)
13 Socket body
15 Upper plate
17 Contact pin
17b Curved part
17c Contact part

Claims (2)

A socket body on which the electrical component is placed, and a plurality of contact pins arranged in a matrix in the socket body and capable of contacting the terminals of the electrical component;
The contact pin is formed with an elastically deformable curved portion protruding so that the contact portion that contacts the terminal is displaced in the vertical direction,
When the contact pins are arranged so that the protruding directions of the curved portions are the same direction, the plurality of contact pins are arranged so that the curved portions overlap vertically with adjacent contact pins. In the socket
The adjacent contact pin is disposed so that the protruding direction of each of the curved portions has a substantially right angle. The socket for an electrical component according to claim 1 , wherein the curved portion is formed in a substantially S shape .

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